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ContentContent
Company OverviewCompany Overview
Sales & MarketingSales & Marketing
Products & TechnologyProducts & Technology
Quality AssuranceQuality Assurance
AppendixAppendix
Manufacturing Process GuidelineManufacturing Process GuidelineManufacturing Process Guideline
Quality AssuranceQuality AssuranceQuality Assurance
2
Company OverviewCompany Overview
3
MilestonesMilestones
1983
Established TCXO Production Lines
Established SMD Production Lines
1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 20061984 …
Implemented Oracle ERP
Founded- Capital US$ 95,000 IPO’ed Increased Capital to US$ 34.8M
Listed in Main Board of Taiwan Security Exchange (Code- 3042)
Ranked 6th Largest Crystal/Oscillator Manufacturer in the World
Ranked 8th Largest Crystal/Oscillator Manufacturer in the World
Completed new Ningbo Factory in China
Established SAW Production Lines
Total capacity can up to 112 M /m
2007
Total capacity can up to 174 M /m
2008 2009
Ranked 5th
Production
Business
TS16949- Taiwan and China Factories
ISO 9001:2000 6 Sigma
IECQ QC080000
ISO 14001:1996
ISO 14001:2004
Green Product Policy & QS 9000
2010
Quality
Paid-in Capital: US$90 M
NQA Rewarded
4
OrganizationOrganization
Board of Directors
CTO
Landau Chang
Chairman/Founder
Paul Lin
President
Peter LinNGB President
Levi Chen
CFO
Vivien Hung
VPKevin Guo
VPLandau Chang
Sales/MarketingCaroline Kuo
ProductionKevin Guo
RDLandau Chang
QualityJoe Lo
ProcurementJohnson Tsai
ManagementAdam Lee
SCMLinda Lin
ACAP
Jerome Kuo
AOM
Hanlim Lee • AOM: Advanced oscillators and modules• ACAP: TXC-Automotive Crystal Application Products• SCM: Supply Chain Management
5
Headquarter - Taiwan Taipei
Factories(2)- Taiwan Ping-ChengChina Ningbo
Sales FAEs(10) - Taiwan TaipeiChina Shanghai, Suzhou, Shenzhen, WuhanUSA LAJapan Yokohama, OsakaEuropeSingapore
Distributors(12)- Europe-UK, Germany………
Reps(8)- Korea, India, Mexico…….
6
Sales & MarketingSales & Marketing
7
Caroline KuoAVP
PCAlice Han
NetworkingJean Jen
Global Peggie Hsu
MobileBob Tsai
LA Lou Lee
ShanghaiGilbert Chou
SuzhouJeff Lin
ShenzhenSean Huang
JapanAndy Ishida
Director
USLou LeeDirector
China Alex KuoDirector
YokohamaAndy Ishida
* S/I/D: Storage/Image/Digital Camera
OsakaIchiro Yamanouchi
SingaporeMike ReyesManager
ConsumerRich Cheng
Industry Sales (Market Segment)
Alex KuoDirector
Branch Office
Product MarketingKris Chen
FAEPatrick Lin
Business DevelopmentJacky Chen
Sales OrganizationSales Organization
AOMHanlim Lee
ACAP Jerome Kuo
Projects Wuhan
Sean Huang
EuropeMichele Aquaviva
Director
8
Business ModelBusiness Model
9
Operating Revenue Operating Revenue
(Unit: Millions of Dollars)
31%19% 22%
40%20%
18% 5%
25%
10
Worldwide RankingWorldwide RankingWorldwide Revenue of the Top Crystal and Oscillator Suppliers (Unit: Millions of Dollars)
* Data Courtesy of CS & A
2007 2008 2009 2007 2008 2009 (07-08) (08-09) 2008 2009Change Change Market Market
% % Share Share1 1 1 Epson Toyocom 656 675 641.2 2.90% -5.01% 19.90% 22.1%
2 2 2 NDK 649 571 459.1 -12.02% -19.60% 16.90% 15.8%
3 4 3 Kyocera Kinseki 380 304 292.4 -20.00% -3.82% 9.00% 10.1%
4 3 4 KDS 293 327 271.3 11.60% -17.03% 9.70% 9.4%
6 5 5 TXC 192 222 240.5 15.63% 8.33% 6.60% 8.3%5 6 6 Vectron 206 200 147.9 -2.91% -26.05% 5.90% 5.1%
- 7 7 Hosonic - 119 97.3 - -18.24% 3.50% 3.4%
7 8 8 Rakon 109 96 81.5 -11.93% -15.10% 2.80% 2.8%
8 9 9 TEW 88 75 60.1 -14.77% -19.87% 2.20% 2.1%
11 11 10 Pericom 57 53 47.6 -7.02% -10.19% 1.60% 1.6%
9 10 11 Micro Crystal 62 56 47.5 -9.68% -15.18% 1.70% 1.6%
10 12 12 River 60 51 40.8 -15.00% -20.00% 1.50% 1.4%
13 13 13 Conner-Winfield 46 44 35.1 -4.35% -20.23% 1.30% 1.2%
12 14 14 Fox 51 40 34.4 -21.57% -14.00% 1.20% 1.2%
15 15 15 CTS 35 34 27.2 -2.86% -20.00% 1.00% 0.9%
14 16 16 MtronPTI 35 28 20.9 -20.00% -25.36% 0.80% 0.7%
Total Revenue 3,564 3,388 2,900 -4.94% -14.39%
Rank Rank Rank Revenue Revenue revenueCompany Name
11
Sales Revenue by Marketing FieldSales Revenue by Marketing Field
12
2009 Sales Revenue USD$ 240M
2010(F)Sales Revenue USD$ 300M
ACAP1% NETWORKING
27%
GLOBAL20%
MOBILE24%
PC16%
CONSUMER12% NETWORKING
28%
GLOBAL21%
MOBILE23%
PC16%
CONSUMER11%
ACAP1%
Products and TechnologyProducts and Technology
13
CapacityCapacity
14
Sales by Product CategorySales by Product Category
15
2009 Sales Revenue USD$ 240M
2010(F)Sales Revenue USD$ 300M
SeamSeamCrystalCrystal
51%51%
GlassGlassCrystalCrystal
22%22%
SMD CXOSMD CXO13%13%
DIPDIPCrystalCrystal
12%12%
TFTF2%2%
SeamSeamCrystalCrystal
45%45%
GlassGlassCrystalCrystal
25%25%
SMD CXOSMD CXO21%21%
DIPDIPCrystalCrystal
7%7%
TFTF2%2%
Crystal by Package Size
Seam Type Common Frequency RangeCommon Frequency Range
16
1.6x1.2(8Q)
1.6x1.22.5x2.0
2.0x1.6(8Y)
Glass Type
3.2x2.5(7V)6x3.57x58x4.5(6X) 5x3.2(7A)
Dip Type
2.5x2.0(8Z)3.2x2.5(7M)6x3.5(6V)7x5(6P)8x4.5 5x3.2(7B)
5x3.2(4 pads, 7Y)
2.0x1.6
Oscillator by Package SizeOscillator by Package Size
CXO
7x5(6U)14x9(7H) 5x3.2
VCXO
2.0x1.6(8N)2.5x2.0(8W)3.2x2.5(7X)6x3.57x5(7W)14x9(7J) 5x3.2(7C) 1.6x1.2
2.0x1.6(7Z)3.2x2.5(7Q) 2.5x2.0(7L)6x3.57x514x9 5x3.2
TCXO
1.6x1.2
(Sample Available)
17
Products and Technology StrategiesProducts and Technology Strategies
Automotive Products
Automotive Products
Wireless Communication
Wireless Communication
Mobile
Bluetooth
WLAN
PC / ConsumerPC / Consumer
Multimedia
Desktop/Laptop
Peripherals
Digital Imaging
Others
Compact Low Power
High Frequency
Low Jitter
High Reliability
Quartz SensorQuartz Sensor
Pressure
Gyroscopes
Gases
Non-Safety
TPMS
Matured products:Matured products:
Technology Integration
Safety
PNDPND
GPS
CrystalCXOTuning Fork
High
Stability
Advanced Oscillators and Modules (AOM):Advanced Oscillators and Modules (AOM):
TCXO
Networking INetworking I
WAN (FC/GbE/FCoE)
TelecomDatacom
Networking IINetworking II
MAN
Long Haul
High Frequency
High Stability
HF OscillatorHF VCOTCXO
Stratum 3 TCXOFX/CDROCXO
ZERO Defect AutomotiveProducts
18
2011 2013
19
20122010
SMD VCXO (CMOS) 2520(<55MHz, Fund)
SMD HF VCXO (PECL/LVDS)
SMD Tuning Fork 2012
High Frequency 500MHz SO (PECL/LVDS)622.08 MHz VCXO (PECL/LVDS)
Frequency Synthesizer
Ultra stable 7050(±0.28ppm)
OCXO(±10ppb)
Tuning Fork Oscillators Output Magnitude Adjustable
Miniaturization
Diversification
SMD TCXO 2016 (±0.5 ppm)1612(±0.5 ppm)
SMD HF CXO (CMOS/PECL/LVDS)
TSX
SMD Crystal 1210
5032(<200MHz, 3OT)7050(<700MHz, PLL-Any Rate)
3225(<200MHz, 3OT)
5032(<200MHz, Fund)7050(<700MHz, PLL-Any Rate)
2520(<50MHz)
7050(±0.14ppm)
OCXO(±1ppb)
Product Plan Product Plan
Quality AssuranceQuality Assurance
20
TXC Quality SystemTXC Quality System
TXC Quality System includes:Industry/Regulation Requirements ISO9000 RequirementsTS16949 RequirementsCustomer Specific RequirementsTXC Specific Requirements
Ref. Doc.: QSM-000000 Quality Manual
21
In accordance with the principles of customer orientation, problem prevention, and the pursuit of zero defect, TXC management team commits to deploy thequality policy.
Quality PolicyQuality Policy
22
HSF PolicyHSF Policy
TXC will continue to strive for manufacturing HSF products by using environmental friendly materials and non-contamination processes in order to meet the most rigid worldwide standards and the expectation of our customer.
TXC will continue to strive for manufacturing HSF products by using environmental friendly materials and non-contamination processes in order to meet the most rigid worldwide standards and the expectation of our customer.
23
The top of TaiwanThe top of Taiwan--YushanYushan
System CertificateSystem Certificate
PingPing--Cheng FactoryCheng Factory Ningbo FactoryNingbo Factory
OHSAS 18001:2007
ISO9001: 2008
ISO/TS 16949:2009
IECQ QC080000:2005
ISO14001:2004
EMSHSPMQMS
24
System CertificateSystem Certificate
PingPing--Cheng FactoryCheng Factory Ningbo FactoryNingbo Factory
ISO 9001:ISO 9001:20082008
ISO/TSISO/TS16949:200916949:2009
IECQIECQQC080000:2005QC080000:2005 ISO 14001:ISO 14001:
20042004OHSASOHSAS
18001:200718001:2007
25
Thank You!Thank You!Thank You!
26
AppendixAppendixManufacturing Process GuidelineManufacturing Process Guideline
27
Blank ProcessBlank Process
28
Wire Sawing
Quartz Bar
A1 2 34 5 67 8 90 EN
BCD
22.1372
Wafer Frequency Lapping
SMD Process and structureSMD Process and structure
IC Die Bonding
Wire Bonding
Blank Cleaning
Base Plating
Frequency Adj.
Final Testing
Marking
Taping
Seam Sealing
Mechanical Testing
Blank Auto-Mounting
Cry
stal
Osc
illat
or
Oscillator
40.000
TXC CM211 24.576
TXC CN001
Crystal
Metal Lid
Plated Blank
Ceramic Package
( top )
Ceramic Package
( Bottom )
Oscillation IC
29
AppendixQuality Assurance
AppendixQuality Assurance
30
Quality Assurance ProcessQuality Assurance Process
• New product development follows the development procedure to ensure the product quality level can meet or even exceed the customer requirement from initial design stage to production stage.
Phase 4Pilot Run Validation
Phase 5Mass Product &
Project Assessment
Phase 2Design &
Development
Phase 3Prototype Build
Verification
Initial PhaseApplication
Phase 1 Plan & Define
Voice of Customer
ProductAssurance
Plan
EvaluationTests
ReliabilityAssurance
Tests
On-goingReliability
Tests
ProductAudit
Reference Document : QSM-R&D001
• Extended frequency or specifications follow the PQSO procedure, based on the matured product platform, and to be monitored through the FTT status review to meet customer’s quick samples response and OTD for production.
31
Reliable QualityReliable QualityGPS time-base links to all frequency
measurement equipments.Database is conducted for MSA/GR&R
monitoring.
In house reliability lab provides fully support for reliability evaluation in different product phases.
In-house reliability test capabilities have been implemented both in Ping-Cheng and NingBo factories.
Pre-condiction:Ⅰ.Electrical characteristics test
Ⅱ.IR Reflow ,2XⅢ.Gross & FineLeak test
Ⅳ.Freq. & temperature test by 25
Thermal shock -55~125
Dwell:10 min, 100 cyclesMIL-STD-883E Method 1011
Sample size :20pcs
High temp bias85+-2 128hr
MIL-STD-883 Method 1005Sample size :20pcs
Temperature bias/ Endurance Temperature cycling performance Humidity performance Endurance
Moisturising85 , RH 85% , 168hrs
JEDEC JESD-A112/3Sample size :20pcs
Solder heatResistance,Reflow
2 times at 260IEC 68-2-20
Sample size :20pcs
Pressure Pot96hrs @ 120degC,
100%RH.JEDEC JESD22-A102.
Sample size :20pcs
Mechanical Endurance
Mechanical shock1,000G,0.5mSec.,3 times for
all 3 directionsMIL-STD-202F Method 213B
Sample size :20pcs
NO. TESTING FACILITY NAME SPECIFICATION
1 SOLDER OVEN Temp. Range :0 ~ 400
2 PRESSURE COOKER Storage Temp.:100 ~ 142.9, Humidity Range :75 ~ 100%RH, Pressure : 2.0kg/cG
3 HIGH/LOW TEMP. OPERATION Storage Temp.:-85 ~180
4 VIBRATION Acceleration:100G, Max Speed:110cm/sec,Amplitude:25mmp-p, Frequency Range:5~4000hz
5 HUMIDITY CHAMBER StorageTemp.:10 ~ 100,Humidity Range : 60 ~ 98%RH
6 ACTIVE AGING TEST Frequency : <256Mhz, Temp. : 0 ~ 125
7 HIGH TEMP. OPERATION Storage Temp.:0 ~225
8 DROP TEST Max Height : 200CM
9 PROGRAMING HUMIDITY CHAMBER Storage Temp.: -40~100,Humidity Range :10 ~ 98%RH
10 AGING OVENS Storage Temp.: 0~250
11 VACUUM DRYING OVEN Storage Temp.: 0~260
12 MECHANICAL SHOCK Max Pressure:10000G
13 THERMAL SHOCK CHAMBER (AIR TO AIR) Temperature Range: -90~250
14 THERMAL SHOCK CHAMBER (LIQUID TO LIQUID) Temperature Range:-55~125
15 BENDING TESTER RATED CAPACITY 50KGf
16 CENTRIFUGAL STRENGTH Acceleration:2000G
17 RANDOM VIBRATION Acceleration:44G, Amplitude:30mmp-p, FrequencyRange:2~2000Hz
18 PROGRAMING LOW/HIGH TEMP. CHAMBER Storage Temp.: -60~180,Humidity Range :10 ~ 98%RH
32
Other AppendixOther Appendix
33
Advanced Oscillators & Modules
34
OSC Oscillation Mode Freq. Range (MHz) Features Output Type PKG (mm)
X’tal(3rd Overtone)
40MHz~200MHzStability ±25ppm/±50ppm
Phase Jitter < 0.5pSOTR -40~85C
X’tal(PLL)
60MHz~700MHzStability ±25ppm/±50ppm
Phase Jitter < 0.7pSOTR -40~85C
Oscillator(Differential)
SAW(Fundamental/Divider)
150~700MHzStability ±50ppm/±100ppm
Phase Jitter < 0.5pSOTR -5~85C/0~70C
LVPECLLVDS
14*97*5
5*3.2
X’tal(Fundamental)
32.768KHz~40MHzOscillator(Single-End)
X’tal(3rd Overtone)
40MHz~200MHz
Stability ±25ppm/±50ppm1.8V~3.3V
OTR -40~85CCMOS
14*97*5
5*3.23.2*2.52.5*2.0
VCO Oscillation Mode Freq. Range (MHz) Features Output Type PKG (mm)
X’tal(Fundamental/Mesa)
1~200
X’tal(PLL/Multiplier)
50~700
Voltage Controlled Oscillator(VCXO/VCSO)
Absolute Pull Range ±50ppm3.3V
OTR -40~85C
LVPECLLVDSCMOS
SAW(Fundamental/Divider)
150~700
14*97*5
5*3.2
High Stability, High Accuracy, High Reliability, Low Phase NoiseHigh Stability, High Accuracy, High Reliability, Low Phase Noise, Low Jitter, Low Jitter
Base Station and Wired Network Applications
GSM/CDMA/WCDMA/TD-SCDMAWiMAX/LTE
ADSLFTTx
PicocellFemtocell
Public Switched Telephone NetworkBaseBase
StationStation Wide Area Network
SONET/SDH(Fiber optic)
High Stability, High Accuracy, High ReliabilityHigh Stability, High Accuracy, High Reliability
Oscillators (CMOS/LVPECL/LVDS)
Voltage Control Oscillators (CMOS/LVPECL/LVDS)
61.44MHz 62.5MHz 77.76MHz 10MHz 32.768MHz 38.88MHz
100MHz 106.25MHz 125MHz 52MHz 61.44MHz 77.76MHz
133MHz 150MHz 155.52MHz 122.88MHz 155.52MHz 156.25MHz
156.25MHz 166MHz 187.5MHz 491.52MHz 622.08MHz 669.33MHz
212.25MHz 250MHz 312.5MHz Customized frequency & specification is available
35
Storage, Server and Network Applications
High Frequency Oscillators High Frequency Oscillators Low Phase Noise and Low JitterLow Phase Noise and Low Jitter
CMOS/LVPECL/LVDS
61.44MHz 62.5MHz 77.76MHz
100MHz 106.25MHz 125MHz
133MHz 155.52MHz 156.25MHz
166MHz 187.5MHz 212.25MHz
250MHz 312.5MHz 320MHz
Customized frequency and specification are available
Servers SANSAN
Fiber ChanelGigabit Ethernet
Switch
Storage
Client
Low Frequency OscillatorsLow Frequency Oscillators
CMOS32.768KHz to 150MHz
Customized frequency and specification are available
LANLAN
Ethernet
36
TXC Automotive ProductsTXC Automotive Products
What is ACAP?TXC-Automotive Crystal Application Products
Design Concepts“Zero Defect” requirement.Extremely rigorous reliability requirements.Wide Operating Temperature Range- up to 150 degree Celsius.Environmental Policy - Lead Free/Green Products.Compact size trend for advance Auto-Electronics Applications.
Product Design Validation ManufactureFollow APQP of TS-16949Follow AECQ STD & CSR if neededPPAP report available
37
Direction in Automotive Industry Direction in Automotive Industry
38
Automotive
Safety
Applications
Automotive
Non-Safety
TPMS
AEC-Q004 ZERO DEFECTS GUILDLINEAECAEC--Q004 ZERO DEFECTS GUILDLINEQ004 ZERO DEFECTS GUILDLINE
Customer Special RequirementsCustomer Special RequirementsCustomer Special Requirements
TXC Zero Defect ProgramTXC Zero Defect ProgramTXC Zero Defect Program
Stability
Capability
ZERO Defect
Process
ZERO Defect
Process
Reliability
TECH - InnovationTECH TECH -- InnovationInnovation
39
Products & CapacityProducts & Capacity
40
Manufacture Sites Planned Capacity
ProductsTXC
ProductSeries
QualityLevel
Capability
Size/Package
Sealing/Type
Pins/Pads
PCF NGB ACAP Line
Crystal AS Grade 3 49US DIP 2 X
Crystal AT Grade 3 49US SMD 2 X
5,000K
Crystal AX Grade 2 8045 Glass 2 X
Crystal AA Grade 2 5032 Glass 2 X
Crystal AV Grade 3 3225 Glass 4 X
8,000K
Crystal AB Grade 1 5032 Seam 4 X
Crystal AM Grade 3 3225 Seam 4 X12,000K
Crystal 9H Grade 3 4115 32768K 2 X 2,000K
Oscillator AC Grade 3 5032 SMD 4 X
Oscillator AU Grade 3 3225 SMD 4 X
Oscillator AW Grade 3 2520 SMD 4 X
3,000K
TXC Automotive Products cover 90%+ of various packages in automotive industryTXC Automotive Products cover 90%+ of various packages in automotive industry
SMD Crystal Common Frequency RangeSMD Crystal Common Frequency Range
2.0x1.6
2.5x2.0
3.2x2.5
5.0x3.2
6.0x3.5
7.0x5.0
8.0x4.5
20010080 90706040 5030209 10875 64
For specific frequency and products, please see www.txccorp.com or contact sales
20~54 MHz
1.6x1.2 24~54 MHz
14~54 MHz
12~54 MHz
8~100 MHz
7~100MHz
6~100 MHz
6~80 MHz
41
2.0x1.6 Crystal2.0x1.6 Crystal
42
Electrical Specifications
Frequency Range 20~54MHz
Frequency Tolerance (at 25°C) ±10ppm, ±20ppm, ±30ppm, or Specify
Frequency stability Over Operating Temp. Range ±10ppm, ±20ppm, ±30ppm, or Specify
Operating Temp. Range -20~+70°C, -30~+85°C, or Specify
Shunt Capacitance (C0) 3pF Max
Drive Level 1~200µW (50µW typical)
Load Capacitance 8pF, 10pF, 12pF, or Specify
Aging (at 25°C) ±3ppm / year Max
Storage Temp. Range -40~+85°C
20~30 MHz 100Ω MaxESR
30~54 MHz 80Ω Max
1.6x1.2 Crystal1.6x1.2 Crystal
Electrical Specifications
Frequency Range 24~54MHz
Frequency Tolerance (at 25°C) ±10ppm, ±20ppm, ±30ppm, or Specify
Frequency stability Over Operating Temp. Range ±10ppm, ±20ppm, ±30ppm, or Specify
Operating Temp. Range -20~+70°C, -30~+85°C, or Specify
Shunt Capacitance (C0) 3pF Max
Drive Level 1~100µW (50µW typical)
Load Capacitance 8pF, 10pF, 12pF, or Specify
Aging (at 25°C) ±3ppm / year Max
Storage Temp. Range -40~+85°C
24~30 MHz 150Ω MaxESR
30~54 MHz 80Ω Max
43
3.2x2.5 Glass Crystal3.2x2.5 Glass Crystal
Electrical Specifications
Frequency Range 12~54MHz
Frequency Tolerance (at 25°C) ±30ppm, or Specify
Frequency stability Over Operating Temp. Range ±30ppm, or Specify
Operating Temp. Range -10~+70°C, or Specify
Shunt Capacitance (C0) 3pF Max
Drive Level 1~50µW (10µW typical)
Load Capacitance 8pF, 10pF, or Specify
Aging (at 25°C) ±3ppm / year Max
Storage Temp. Range -40~+85°C
12~13 MHz 150Ω MaxESR
13~54 MHz 60Ω Max
44
2.0x1.6 CXO2.0x1.6 CXO
Electrical SpecificationsOutput Type CMOS
Output Load 15pF, or Specify
Oscillation Mode Fundamental
Supply Voltage 3.3V(1.8V, 2.5V available)
Frequency Range 12~50MHz
Frequency Stability ±25ppm, ±50ppm
Operating Temp. Range -20~+70°C, -40~+85°C, or Specify
Storage Temp. Range -55~+125°C
Voltage Vol(Max) / Voh(Min) 0.1VDD / 0.9VDD
Rise(Tr) / Fall(Tf) Time 8ns Max
Supply Current 15mA Max
Symmetry 45~55%
Start-up Time 5ms Max
Phase Jitter(12KHz~20MHz) 2ps Max
Aging (at 25°C) ±3ppm / year Max
45
3.2x2.5 TCXO for GPS/Wimax Application3.2x2.5 TCXO for GPS/Wimax Application
Electrical SpecificationsOutput Type Clipped Sinewave
Output Load 10KΩ // 10pF
Oscillation Mode Fundamental
Supply Voltage 2.4V~3.5V
Frequency Range 13~40MHz
Clipped Sinewave Output Voltage 0.8 Vp-p Typical
Frequency Stability vs Temp. (-30~+85°C) ±0.5, ±1.0, ±2.0 ppm
vs Load(Load Varies ±10%) ±.0.2ppm Max
vs Supply Voltage(Vcc=Typical±0.1V) ±.0.2ppm Max
Frequency Tolerance at 25°C after 2 Reflows with Typical Applied to Auto Frequency Control Pin ±2.0ppm Max
Slope of Frequency Drift (min. of 1Frequency reading every 2°C) ±.0.1ppm/°C Max
Storage Temp. Range -40~+85°C
Auto Frequency Control(AFC)Range ±8~±16ppm/V (Vcon ±1.0V)
Supply Current 2.0mA Max
Start-up Time 3ms Max
Harmonics -5dBc Max
Phase Noise at 1KHz offset -125dBc/Hz
Aging (at 25°C) ±1ppm / year Max46
2.5x2.0 TCXO for GPS/Wimax Application2.5x2.0 TCXO for GPS/Wimax Application
47
Electrical SpecificationsOutput Type Clipped Sinewave
Output Load 10KΩ // 10pF
Oscillation Mode Fundamental
Supply Voltage 2.4V~3.5V
Frequency Range 13~40MHz
Clipped Sinewave Output Voltage 0.8 Vp-p Typical
Frequency Stability vs Temp. (-30~+85°C) ±0.5, ±1.0, ±2.0 ppm
vs Load(Load Varies ±10%) ±.0.2ppm Max
vs Supply Voltage(Vcc=Typical±0.1V) ±.0.2ppm Max
Frequency Tolerance at 25°C after 2 Reflows with Typical Applied to Auto Frequency Control Pin ±2.0ppm Max
Slope of Frequency Drift (min. of 1Frequency reading every 2°C) ±.0.1ppm/°C Max
Storage Temp. Range -40~+85°C
Auto Frequency Control(AFC)Range ±8~±16ppm/V (Vcon ±1.0V)
Supply Current 2.0mA Max
Start-up Time 3ms Max
Harmonics -5dBc Max
Phase Noise at 1KHz offset -125dBc/Hz
Aging (at 25°C) ±1ppm / year Max