creating a custom board support package for ssp …...later, and iar ewsyn v8.21.1 or later to...

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Application Note R11AN0071EU0112 Rev.1.12 Page 1 of 16 Jun.18.19 Renesas Synergy™ Platform Creating a Custom Board Support Package for SSP v1.2.0 or Later Introduction This document provides different approaches to create a new custom board support pack (BSP) for Renesas Synergy Software Package (SSP) v1.2.0 and later. A new pack can be created for SSP v1.2.0 or later, either by using a built-in Synergy Pack Exporter, or by directly working on the files of a pack folder. Goals and Objectives The objective of this document is to demonstrate different approaches to creating a custom BSP for the SSP v1.2.0 or later, which is used along with the e 2 studio ISDE (v5.3.1.x or later) or the IAR Embedded Workbench for Renesas Synergy™ (IAR EW for Synergy) (v7.71.1.x or later). Prerequisites As the user of this application note, you are assumed to have some experience with the Synergy SSP v1.2.0 or later, and the supported Renesas e 2 studio ISDE, or the IAR EW for Synergy. Required Resources To perform the procedures described in this application notes, you will need: A PC running Microsoft ® Windows ® 7 or later with the following Renesas software installed: e 2 studio ISDE v5.3.1.002 or later IAR EW for Synergy v7.71.1.x or later Synergy Software Package (SSP) v1.2.0 or later Synergy Standalone Configurator (SSC) 5.3.1.002 or later You can download the required Renesas software and its supported packages from the Renesas Synergy Gallery (https://www.renesas.com/in/en/products/synergy.html). Contents 1. Board Support Packs in SSP ................................................................................................... 2 1.1 Pack File Structures in SSP Releases .................................................................................................... 2 1.2 BSP Contents in SSP v1.2.0 or Later...................................................................................................... 3 1.3 Creating a BSP in SSP v1.2.0 or Later ................................................................................................... 4 2. Custom BSP Files ................................................................................................................... 4 2.1 Creating a BSP using Export Synergy User Pack Provided in e 2 studio v5.3.1or Later, and IAR EWSYN v8.21.1 or Later ......................................................................................................................... 5 2.2 Creating a Pack Based on an Existing Pack in SSP v1.2.0 or Later .................................................... 13 3. Conclusion ............................................................................................................................. 14 4. Known Issues ........................................................................................................................ 14 5. References ............................................................................................................................ 14 Revision History ............................................................................................................................ 16

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Page 1: Creating a Custom Board Support Package for SSP …...Later, and IAR EWSYN v8.21.1 or Later To 2create a custom board pack in e studio environment: 1. Create a new Synergy C Project,

Application Note

R11AN0071EU0112 Rev.1.12 Page 1 of 16 Jun.18.19

Renesas Synergy™ Platform

Creating a Custom Board Support Package for SSP v1.2.0 or Later Introduction This document provides different approaches to create a new custom board support pack (BSP) for Renesas Synergy Software Package (SSP) v1.2.0 and later. A new pack can be created for SSP v1.2.0 or later, either by using a built-in Synergy Pack Exporter, or by directly working on the files of a pack folder.

Goals and Objectives The objective of this document is to demonstrate different approaches to creating a custom BSP for the SSP v1.2.0 or later, which is used along with the e2 studio ISDE (v5.3.1.x or later) or the IAR Embedded Workbench for Renesas Synergy™ (IAR EW for Synergy) (v7.71.1.x or later).

Prerequisites As the user of this application note, you are assumed to have some experience with the Synergy SSP v1.2.0 or later, and the supported Renesas e2 studio ISDE, or the IAR EW for Synergy.

Required Resources To perform the procedures described in this application notes, you will need: A PC running Microsoft® Windows® 7 or later with the following Renesas software installed:

e2 studio ISDE v5.3.1.002 or later IAR EW for Synergy v7.71.1.x or later Synergy Software Package (SSP) v1.2.0 or later Synergy Standalone Configurator (SSC) 5.3.1.002 or later

You can download the required Renesas software and its supported packages from the Renesas Synergy Gallery (https://www.renesas.com/in/en/products/synergy.html).

Contents

1. Board Support Packs in SSP ................................................................................................... 2 1.1 Pack File Structures in SSP Releases .................................................................................................... 2 1.2 BSP Contents in SSP v1.2.0 or Later...................................................................................................... 3 1.3 Creating a BSP in SSP v1.2.0 or Later ................................................................................................... 4

2. Custom BSP Files ................................................................................................................... 4 2.1 Creating a BSP using Export Synergy User Pack Provided in e2 studio v5.3.1or Later, and IAR

EWSYN v8.21.1 or Later ......................................................................................................................... 5 2.2 Creating a Pack Based on an Existing Pack in SSP v1.2.0 or Later .................................................... 13

3. Conclusion ............................................................................................................................. 14

4. Known Issues ........................................................................................................................ 14

5. References ............................................................................................................................ 14

Revision History ............................................................................................................................ 16

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1. Board Support Packs in SSP The Board Support Pack (BSP) is a subset of Synergy Software Package (SSP), and provides an interface for setting up the SSP to work with selected MCUs and specific board HW designs, and so, is both MCU and board specific. The BSPs created are available for the Renesas Synergy™ Starter/Development/Promotion boards, but users eventually must create new BSPs for implementing their final products.

Synergy is CMSIS-compliant and is based on the CMSIS-core. Therefore, the board pack file structure is organized into folders containing the MCU, board specific CMSIS information, and is represented as an XML-based pack description (PDSC) file as defined in the CMSIS standard (Keil, 2016). All these files are packed in a ZIP format (.zip).

1.1 Pack File Structures in SSP Releases In earlier SSP releases (prior to SSP v1.2.0), specifications of MCUs and boards are packed into a single pack file, as shown in Figure 1, which restricted the capability of supporting different MCUs and boards.

Figure 1. Sample Snapshot of Default Packs Provided in SSP v1.1.3 In SSP v1.2.0 and later, the pack files are classified into MCU specific, board specific categories, and even into some default application templates, making future upgrades and custom extensions more convenient.

Figure 2. Sample Snapshot of Default Pack Files Provided in SSP v1.2.0 and Later

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1.2 BSP Contents in SSP v1.2.0 or Later Support information to be specified in a BSP is as follows: • A pin configuration file for the selected device • Two XML specification files for linking the selected device and expected board indicating their file

locations • A set of drivers for the selected peripherals and pins. For example, Renesas.Synergy_board_s7g2_dk.1.2.0.pack has files as shown in Figure 3.

Figure 3. Board Support Information Contained in a BSP Pack (s7g2_dk.pack)

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1.3 Creating a BSP in SSP v1.2.0 or Later Unlike the board pack files provided with the Synergy development or system kits, such as DK-S124 and SK-S7G2, you must create a BSP pack for your custom boards.

While copy/paste of files works to some extent, especially when using the IAR EW for Synergy (v7.71.1.11989), the creation of a custom BSP has been simplified with a built-in CMSIS-pack generator in e2 studio 5.3.1.002 or later, IAR EW for Synergy v8.21.1 or later, and SSP v1.2.0 or later. This document provides suggestions for selecting relevant workflows in creating a custom BSP.

Figure 4. Approaches to Creating a Custom Board Pack in SSP v1.2.0 or Later

2. Custom BSP Files Figure 4 shows two approaches to creating a custom board pack, which can be described as follows: • Create a custom board pack based on an existing BSP by replacing existing files with your new board

specification, and packing them with the built-in Export Synergy User Pack in e2 studio 5.3.1.002 or later and IAR EW for Synergy v8.21.1 or later.

• Work on a selected BSP in the \internal\projectgen\arm\Packs folder of your SSP installation as part of e2 studio or IAR EWSYN, to manually modify or create related files in the custom pack, and generate a .zip format.

Start

End

Configurable in the SSP Configurator?

Visible on the board selection menu?

Utilize the built-in Export Synergy User

Pack (Session 2.1)

Working on pack template with command

line tools (Session 2.2)

Use the e2 studio Export Synergy User Pack tool?

Yes

No

Yes

No

No

Yes

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2.1 Creating a BSP using Export Synergy User Pack Provided in e2 studio v5.3.1or Later, and IAR EWSYN v8.21.1 or Later

To create a custom board pack in e2 studio environment:

1. Create a new Synergy C Project, for example, S5D9_CB.

Figure 5. Creating a Project

2. Click Next to select a board for your new project. 3. Use the default SSP v1.2.0 or later. In the board pulldown menu, select an already created Synergy board

with the same or similar device as your targeted MCU. For example, the S5D9 PK with R7FS5D97E3A01CFC is selected as a pack template.

Figure 6. Select an Existing Board with the Same Device as Your Board

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4. Click Next to select a project template. 5. Select the BSP in the Project Template Selection for this project, S5D9_CB.

Figure 7. Select the BSP As Your Project Template

6. Click Finish. The default BSP files for S5D9-PK are generated automatically. In e2 studio, the project explorer shows all the files generated as shown in Figure 8.

Figure 8. Generated Board Files as Templates for Creating Custom Board Files In IAR EWSYN v8.21.1 or later, once SSC is closed, the project explorer shows the following generated files. It does not contain the pincfg file as shown in Figure 9.

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Figure 9. Generated Board Files as Templates in IAR EWSYN The project in EWSYN workspace should also include the .pincfg file to create the custom bsp pack. To include the .pincfg file in the project, select Add Files option from the project menu and select S5D9-PK.pincfg file.

Figure 10. Adding Files to the Project in the EWSYN Workspace The file is now added to the project.

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Figure 11. Project Files in IAR EWSYN After Adding the pinCfg File

7. Rename the S5D9-PK.pincfg to your custom pin configuration file, S5D9-CB.pincfg. 8. In the Synergy configurator, change the pincfg file in the Pins tab from the pulldown menu. Select pin

configuration, then select the S5D9_CB.pincfg configuration, and select Generate Data as g_bsp_pin_cfg.

Figure 12. Specify the Data Structure to Hold Your Pin Configuration

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9. Based on your board I/O schematics, create a new g_bsp_pin_cfg structure by deselecting the unused peripherals/ports, and select the required components on the custom board in the Synergy Configuration, Pins panel. For example, the custom board S5D9_CB has a high-speed USB host and a full-speed USB device as shown in Figure 13.

Figure 13. Set the Connection Between Pins and Peripherals on Your Board

10. Click the Generate Project Content button to generate new Synergy files based on the configuration on each tab, such as Clocks, Pins, and so forth, and then save these generated configuration files.

11. On the project folder in your workspace, under module_description subfolder, use the default Windows search function to replace the original board name such as S5D9_PK with a new board name, which is S5D9_CB in the current project as shown in Figure 15.

12. From e2 studio v7.3.0 or SSC 7.3.1 or later versions, module_description folder is available only at the application level. It is the modules (module_description in versions prior to e2 studio 7.3.0 ) directory within the SSP installation directory as shown in Figure 14.

Figure 14. Modules Folder in e2 studio v7.3.0 or later

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Make a copy of the original board files of PK-S5D9 and rename them with the new board name as shown in Figure 15.

Figure 15. Replace the Existing BSP Name with Your BSP Name Note: The new board name, S5D9_CB is assigned to the Export Synergy User Pack window as shown in

the step 11 or 12. Specifically, the macro BSP_BOARD_S5D9_PK should be replaced with BSP_BOARD_S5D9_CB in existing board files.

Figure 16. Replacing Template Board Name with Your Board Name in Generated Synergy Files

13. Rename the folder (generic bsp folder to custom bsp folder, for example, S5d9_dk or s5d9_pk to s5d9_cb).

14. Edit bsp_init.c to rename BSP_BOARD_S5D9_PK to BSP_BOARD_S5D9_CB and disable or delete the line bsp_qspi_init() as required by the project based on the drivers needed for the new BSP.

15. Edit bsp.h and remove the line #include "../s5d9_cb/bsp_qspi.h. Rename BSP_BOARD_S5D9_PK to BSP_BOARD_S5D9_CB under macro definitions.

16. Delete driver files for unused peripherals, such as bsp_qspi.h/c, since no QSPI is selected in the pincfg.

Figure 17. Delete Files for Unused Components

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17. Based on your board layout, modify the board files to include GPIO driven components, such as LEDs, which are defined in the bsp_leds.c/h file: /** Array of LED IOPORT pins. */ static const ioport_port_pin_t g_bsp_prv_leds[] = { IOPORT_PORT_04_PIN_08, ///< LED1_R IOPORT_PORT_04_PIN_09, ///< LED2_G };

18. Export the new board files with a build-in CMSIS-Pack generator. There are three ways to access the Export User Packet Wizard in e2 studio: A. Right-click the project, then run the operation B. Select the project, click File -> Export in e2 studio, then select in the Export

window, or C. Right-click on the project, and select the menu item, then select the type of

in the Export window. To access Export Synergy User Pack in IAR EWSYN v8.21.1 or later, select the option

in the Renesas Synergy menu. A dialog window is displayed after one of the above operations, as shown in the following figure.

Figure 18. Specify Vendor Information in the Synergy User Pack Perform the following steps to create a custom board pack:

A. Select Create a board pack. B. Set the location for the new pack, as per your e2 studio installation. In this example project, we have

chosen C:\Renesas\e2_studio_531_120g\internal\projectgen\arm\packs. C. Fill out the Vendor, Name, and Version information, and click Next.

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This brings up the dialog in Figure 19.

Figure 19. Specify the Custom Board Information in the Synergy User Pack

D. Fill out the Group name and Version. E. For Board name, enter S5D9_CB.

Note: The board name must match the board folder name that you used in step 13.

F. Click the Add button on the screen to select the files that you want to include in the pack. Note: Make sure to include your pin configuration file and board source files.

Figure 20. Specify Files Included in the Synergy User Pack

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G. Press OK and Finish to create the custom board pack, ZZ.Synergy_board_s5d9_cb.1.2.0.pack.

Figure 21. Location of a New Board Pack Created Successfully

19. Test this custom BSP pack by creating a new project, selecting S5D9_CB from BSP the in e2 studio, and then making other Synergy configurations.

Figure 22. Select and Test Your Created Custom BSP Pack

2.2 Creating a Pack Based on an Existing Pack in SSP v1.2.0 or Later This example shows how to create a custom board pack in the IAR environment, or directly make a custom board pack from an existing Synergy board pack. IAR for EWSYN v7.71.1 does not have the option to use the built in Synergy export tool. and so use this approach to create the custom board pack.

Follow these steps: 1. Navigate to your SSP v1.2.0 or later; and go to the \internal\projectgen\arm\Packs folder of your

packs installation for the IAR EW for Synergy. 2. As shown in Figure 2, board packs that are already installed are listed there. 3. Find a pack with the same or similar device as your targeted MCU, such as s3a7_dk, to make your

conversion process faster. 4. Pick a board name you want to use, such as s3a7_iot_enabler. Make sure to use that name throughout

this process. 5. Copy the board pack from step 3 and rename it with your board name, such as

“Renesas.Synergy_board_s3a7_iot_enabler.1.2.0.pack” for example. 6. Extract the contents of this new pack file from a file archive utility, such as 7zip. 7. Replace “s3a7dk.pincfg” file with your board name, “s3a7_iot_enabler.pincfg”. 8. Modify the XML file in .module_descriptions. Replace all instances of the old board name “s3a7_dk” with

your new board name “s3a7_iot_enabler”. 9. Choose the part number in Device attribute as your targeted device. 10. Rename the XML file to use your board name. Go to the synergy/board folder and rename the board

folder “s3a7- dk” to be your board name “s3a7_iot_enabler”. 11. To this newly renamed folder, add your BSP files, such as bsp.h, bsp_init.c, and bsp_init.h. You

can make a copy from an existing board, and then manually modify it. 12. Rename the *.pdsc file in the root directory of your new board. 13. Modify the contents of the PDSC file:

• Replace board name with your board name • Make sure there is a <file> element in the <component> for each file you want delivered as part of this

pack. 14. Select all files and folders, then create a zip format of the file as

Renesas.Synergy_board_s3a7_iot_enabler.1.2.0.zip, then change its name to Renesas.Synergy_board_s3a7_iot_enabler.1.2.0.pack.

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3. Conclusion Two different approaches for upgrading or creating a custom board pack for SSP v1.2.0 or later have been presented in this guide. By following the step by step instructions, users can recreate a pack for SSP v1.2.0 or later from an existing custom pack in the SSP v1.2.0 or later, or create a new pack from scratch either by using a built-in Export Synergy User Pack or directly working on the files of a board folder.

4. Known Issues While using e2 studio 5.4.0.23 for creating the Custom BSP from ground up, without using the board BSP and Board pin config supported by SSP, the user may run into issues when Export Synergy User Pack is used. Users need to change the file attribute from none to template. This issue is not seen in other e2 studio released for SSP v1.2.0 onwards.

Note: By using the steps in the section 2.1 to create the Custom BSP, the user will not see the issue mentioned below.

The snapshot of the attribute change required to create a Custom BSP using e2 studio 5.4.0.23 is shown in Figure 23.

Figure 23. Attribute Change Required to Create Custom BSP in e2 studio 5.4.0.23

5. References 1. IAR Systems. IAR Embedded Workbench, Getting Started with IAR Embedded Workbench® for Renesas

Synergy™. 2. Keil. (2016). CMSIS-Pack (v 1.4.1). Retrieved from Usage and Description:

http://www.keil.com/pack/doc/CMSIS/Pack/html/pages.html 3. Renesas Electronics America Inc. (Feb. 2017). Renesas Synergy™ Software Package v1.2.0 or later.

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Website and Support Visit the following vanity URLs to learn about key elements of the Synergy Platform, download components and related documentation, and get support.

Synergy Software www.renesas.com/synergy/software Synergy Software Package www.renesas.com/synergy/ssp Software add-ons www.renesas.com/synergy/addons Software glossary www.renesas.com/synergy/softwareglossary

Development tools www.renesas.com/synergy/tools

Synergy Hardware www.renesas.com/synergy/hardware Microcontrollers www.renesas.com/synergy/mcus MCU glossary www.renesas.com/synergy/mcuglossary Parametric search www.renesas.com/synergy/parametric

Kits www.renesas.com/synergy/kits

Synergy Solutions Gallery www.renesas.com/synergy/solutionsgallery Partner projects www.renesas.com/synergy/partnerprojects

Application projects www.renesas.com/synergy/applicationprojects Self-service support resources:

Documentation www.renesas.com/synergy/docs Knowledgebase www.renesas.com/synergy/knowledgebase Forums www.renesas.com/synergy/forum Training www.renesas.com/synergy/training Videos www.renesas.com/synergy/videos Chat and web ticket www.renesas.com/synergy/resourcelibrary

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Revision History

Rev. Date Description Page Summary

1.00 Dec.14.16 - Initial release 1.01 Jan.20.17 - Incorporated feedback 1.10 Mar.3.17 - Upgrade to SSP v1.2.0.

Added a session to describe the SSP contents. 1.11 Oct.12.18 - Minor update. 1.12 Jun.18.19 - Corrections to Figure 4

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© 2019 Renesas Electronics Corporation. All rights reserved.

Notice 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products

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financial terminal systems; safety control equipment; etc. Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause serious property damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document.

6. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified ranges.

7. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you.

8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefully and sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.

9. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions.

10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document.

11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics. 12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas

Electronics products.

(Note1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries.

(Note2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.

(Rev.4.0-1 November 2017)

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