internationalactivities in

microsystemtechnologymst news

VDIIVDE - TECHNOLOGIEZENTRUM INFORMATIONSTECHNIK GmbHNEXUS - NETWORK OF EXCELLENCE IN MULTIFUNCTIONAL MICROSYSTEMS

EUROPRACTICE - MICROSYSTEMS SERVICES FOR EUROPE

ECU 10.- Number 16 / April / May 96A 14303

Current Topic:

Microsystems for Applications

in Space Systems

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Contents

Current Topic:Space Technologies 2R&D in MST 16• A self monitoring Ozone Gas SensorPanorama 18• Demonstration Activity Project

on MST by COTEC • On a Production Line for MST• Microsystems at CEA-Leti: MEMS• Manufacturing Equipment for

an Emerging Industry• Europroject on Optical Microsystems

MST Online 25MST at CEU 26• Micro-Integrated Intelligent

Optical Sensor Systems• Micropump based on LIGA and

Silicon Technology

Technology Transfer 28Europractice 29• News from Manufacturing Cluster 3

EUROPRACTICE news 31NEXUS news 35NEXUS Job Opportunities 39Events 40

• Future Applications ofMicro/Nano-Technologiesin Space Systems 3

• Microsystems Applied to Space Mechanisms 4

• Round Table at ESTEC 5

• Launchers & MST 6

• Development of a MiniatureSpace Bioreactor 8

• ESA Advanced Sensor Technology 9

• Multi Chip Module forSpace Applications 10

• Space Microsystems´ Fabrication: LIGA 12

• MST for Thermal Control & Life Science Experiments 14

Current Topic: Space Technologies

This issue focuses on MSTs for spaceapplication in space systems. We

selected this as an area of special in-terest for two reasons:firstly, space technologies are creatinga growing market for new productsand services. Satellite monitoring ofenvironments, traffic and social systems is also gaining interest amongthe private industrial sector.And secondly, it is still a field of expe-rimentation with high impact on spinoff projects. Obviously MST offersmany new opportunities in both ground-based and orbital systems. The articles presented give a goodoverview of the potential of this appli-cation field.

Since the introduction of "EUROPRACTICE news," changes have been made to provide easier access to the information they containrelated to the progress of the "EURO-PRACTICE." You'll recognize them inthis issue by the coloured pages. Malcolm Wilkinson is responsible fortheir contents and is the contact forcontributions.

As reported in NEXUS news, the ap-plication-oriented MST user clubs arenow established and are starting theirmission. The results of the user clubswill be a major concern of mst newsin the future.

The editorial team apologizes fortheir error within the Spanish contri-bution on ” Demonstration ActivityProject on MST BY COTEC - Spain”from Luis Castaner. Please find the reprinted piece correctly attributed onpage 18.

Meanwhile the core of the EMSTO(Online) service is firmly establishedand has even presented at Cebit andSEMICON Europe. It is already usedby a large community of interestedresearchers and company decisionmakers. The next step will be to develop it to an interactive communi-cation system, gathering worldwideinformation on MST technologies andmarkets. Progress reports will be published in the special EMSTO section of mst news.

Jürgen Gabriel

Editorial

mst news is published by:VDI IVDE TECHNOLOGIEZENTRUM INFORMATIONSTECHNIK GmbHD - 14513 Teltow, Rheinstraße 10 B, Tel: +49/3328/435-0 (-141 Fax)NEXUS FRAUNHOFER-INSTITUT FÜR SILIZIUMTECHNOLOGIE (FhG - ISiT) D - 14199 Berlin, Dillenburger Straße 53, Tel: +49/30/829 98-110 (-199 Fax)EUROPRACTICE c/o TECHNOLOGY FOR INDUSTRY LtdUK - Wilburton Cambridgeshire CB6 3SE, Tel: +44/1353/74-1331 (-0665 Fax)Editors: Prof Dr Jürgen Gabriel; Alfons Botthof

Dr Hans-Christian Petzold (NEXUS news)Dr J Malcolm Wilkinson (EUROPRACTICE news)

Technical Editor: Thomas PätzoldSecretarial Support: Annette Schostake-mail: mstnews@vdivde-it.de

mst news is supported by

the German Federal Ministry for Education, Science, Research and

Technology (BMBF)

and the European Commission, DG III within the ESPRIT

- Network of Excellence in Multifunctional Microsystems NEXUS

and EUROPRACTICE

The photo shows the ESA scientific spacecraft SOHO at Matra-Marconi, UK. SOHO was launched with an American Atlas II launcher on 2 December 1995.

The next issue of mst news will appearin July 1996. The following articles

have already been received:

• University of Linz (At)Participation in the EUROPRACTICE-FUSE Programme

• CP Clare Corp., Tongeren (B)Relay Manufacturing

• University of Bremen (D)The full Services of IMSAS-Bremen

• BTU Cottbus (D)Micro Blasting Production Technologies

• TU Ilmenau (D)Dynamic Micropump - A novelMicroactuator for Liquids & Gases

• GeSiM GmbH, Dresden (D)Complex Fluid Handling Systems

• Forschungszentrum Karlsruhe (D)LEMA: LIGA-Expriment for Multiple Application

• TU München (D)Materials in Microelectronics

• Schlumberger SA, Montrouge (F)The Results of the ESPRIT projectM3-Gas

• TU Budapest (H)MST Activities in Hungary

• TU Delft (Nl)The DIMES Institute

• University Belgrad (Y)MST Activities at IMTM, Belgrad

Further contributions are welcome.Deadline for mst news No 17/July 96is June 5, 1996.

Current Topic: Space Technologies Coming Issues

mst newsspecialUSA &Canada

This 160 page special edition focuses on

MST-related activitiesin the USA and Canada

emphasizing on results of the Nov. 1995 workshop

in this region(Düsseldorf D).

For orders see backpage

The main objective of most space agencies in the mid to

long term is to reduce the costsand delays associated with space-based services. This meansstrongly reducing soacecraft lifecycle costs and lead time,without reducing (and most likelyincreasing) performance. In turn,this would allow the full potentialof space to be exploited and space-based systems to be com-petitive with ground-based systems that provide similar servi-ces. For scientific and experimen-tal missions, more data and dataof a higher quality and interestwould be produced within a shor-ter time from the mission appro-val, and that within the budgetarylimitations, to satisfy the respec-tive communities. In commercialsectors, space-based servicesshould be considerably cheaperfor the operator than the equiva-lent ground services in order tooffset some perceives disadvata-ges of space, such as difficult (ifnot impossible) upgrades andmaintenance or less direct con-trol, and to become competitive.

Spacecraft manufacturing iscurrently a labour-intensive, one-off, artisanal task; few similarunits are ever produced. Due tothis fact, traditional cost reductionapproaches such as new designand production paradigms, mo-dularity, and pre-fabrication, willhelp reduce the costs, but not to

the required level. A sensible wayto significantly decrease costsand enable commercialisationcould be via a technology or en-gineering break-through, orientedtowards mass production of space subsystems, and based ondistributed (instead of the currentcentralised) systems and services.The economies of scale achievesby centralising functions wouldbe exceeded by mass-productionsavings, and a new lifecyclecould be initiated, resulting in more affordable space-based systems and services.

Why micro/nano-technologies?

These advantages are significantfor the space sector, with a stronginfluence on cost. Microminiaturi-sation could play an essential rolein Europe in designing new gene-ration satellites, thus preparingthe European space industry forthe challenges of the global mar-ket. The impact could be similarto that achieved by the integratedcircuit, which has resulted in thehuge consumer electronics market.

Antonio Martínez de Aragón

For further information please contactthe author at ESTEC System Studies DivisionPb 299, NL 2200 AG NoordwijkTel: +31 71 565-3018 (-5429 Fax)

Future Applications ofMicro/Nano-Technolo-gies in Space Systems

Current Topic: Space Technologies

Microsystems in SpaceMechanisms Applications

In space mechanisms applications,microsystems could be used to re-place conventional, large sizespace mechanisms devices. In gen-eral space mechanisms cover thefollowing functions:

• deployment of solar arrays, an-tennae, booms or mirrors

• pointing of antennae, telescopesor mirrors

• focusing of telescopes and came-ras

• release of launch restraints andseparation devices

• closing of doors, apertures: endstop latches

• payload applications e.g. pump-ing of fluids in cooling loops andexperiment solution loops

• momentum storage• sensing of the satellite’s position

angular rates.

Presently, the use of micro-systems is still very much con-strained since overall spacecraftsystems are typically of large scale

and mass. As aresult, the move-ment of largemass and inertiasover significantd i s p l a c e m e n tranges involvesc o n v e n t i o n a lmechanisms inthe centimeter todecimeter size.However, in some applicationswhere the transport of smallamount of media is involved orwhere minute forces have to bemeasured, the advent of micro-systems in mechanisms has al-ready led to specific space applica-tions. Further use is expectedwithin the general trend for down-scaling to small satellites and min-iaturisation of spacecraft and pay-load subsystems.

Two Examples of In-orbit Microsystems

The following two examplesshould illustrate the possibilitiesfor using microsystems on spacemechanisms:

• An ultrasensitive accelerometerpackage (called PAX) has flownon Olympus telecommunica-tions satellite. The purpose ofPAX was to measure the minutedisturbances caused by the oper-ation of onboard equipment. ThePAX contained three accelerome-ters, a calibration thermistor andthe electronics. Figure 1 showsan accelerometer during its fab-rication.

• A bioreactor for the cultivationof cells, which was part of theInternational Microgravity La-boratorium (IML-2) flown on theShuttle in 1994, contained a mi-

cropump, a microvalve andchemical microsensors for tem-perature and pH measurements.The bioreactor was developedby the Gruppe Weltraumbiolo-gie of the ETHZ (CH) and Me-canex (prime contractor, CH).

Potential Future Applications

To stimulate further thoughts formicrosystem applications andbased on a general investigationperformed at the ESTEC Mecha-nisms Section, the following rangeof application of microsystems formechanisms is identified:

• Solid state gyroscopes• Micron sized microswitches to

replace the conventional „micro-switches“ which are still of centi-meter size

• Devices to reduce the microvi-bration environment created bythe disturbing reaction forces<|,“2“>and torques of conven-tional mechanisms

• Miniature force sensors on ro-botic grappling devices

• Health monitoring devices inmechanisms

• Devices in scientific payload ex-periments

• Operation of infrared detectorsat cryogenic temperatures byuse of micropump driven cool-ing loops.

Microsystems Applied to Space MechanismsThe costs of launching a satelliteare directly linked to its mass. Theintensive use of microsystems onsatellites could lead to a signifi-cant mass reduction and thus costsaving. Up to now however, mi-

crosystems have been employed only sparsely in space. Thisarticle presents potential advantages on the use of micro-systems in space and also identifies difficulties on theirbroader use in space applications.

Microsystems are very attractive foruse in space applications because

of their small size and very low mass.Their potential employment for buildinghighly integrated systems of complexelectromechanical devices may lead tovery small integrated units where sub-stantial test simplifications may beachieved. Their use in a wide range ofspace applications is still subject to fur-ther advancement in various micro-system technologies, where open areasidentified need to be addressed.

Conclusion

Figure 1: Accelerometer during Fabrication, Courtesy CSEM

Current Topic: Space Technologies

Issues which need to be ad-dressed for a broader applicationof microsystems in space

The following issues need to beaddressed to implement success-fully microsystems in a widerrange of space applications:

• Identify the design criteria interms of allowable mechanicalloading and contact stresseswhich are applicable to micro-systems in order to survive thehighly dynamic launch environ-ment and to provide operationalfunction throughout in orbit life-times of 5-10 years

• Determine where possible costefficient transfer of existing on-ground applications to space ap-plications without major designmodifications

• Determine whether micro-systems can be made affordablealso for applications requiringonly a few (typically 10-100) de-vices, since space applicationsare typically small in numbers

• Determine what operational life-times of mechanisms are achiev-able in space with current tech-nologies and what improve-ments can be achieved in the fu-ture

• Determine what is the reliabilityof microsystems and what re-dundancy concepts are conceiv-able in order to achieve the highreliability required for space ap-plications (typically 0.999) with-out loosing the benefit of the lowcost mass production of micro-systems.

Udo Kugel & Isabelle Marchon

For further informations please contact the authors at ESTEC, YMM section, ESA/ESTEC MechanismsSection, Postbus 299, 2200 AG NoordwijkTel: +31 71 565 5182 (U.Kugel)+31 71 565 4659 (I.Marchon)E-mail: ukugel@estec.esa.nlimarchon@estec.esa.nl

On 27 and 28 March, a Round Tableon Micro/Nano-Technologies forSpace took place at ESTEC, organizedby the System Studies Division of theTechnical Directorate.

The main objectives of the round table,within the overall goal of reducing thecosts of access to space, were to:• better understand micro/nano-tech-

nologies, and what these technolo-gies may provide for the space sector

• establish working contacts with themicro/nano-technologies community

• generate ideas on potential uses andnew missions which micro/nano-technologies may enable.

During the first day, eight speakersfrom various European research insti-tutions presented the state of the art inmicrosystems technology and whatthey considered could be applicationsto space, while three American speak-ers introduced miniaturization trendsin the USA. Fourteen speakers fromESTEC presented some functional re-quirements, critical analysis and on-going programmes related to the roleof micro/nano-technologies in space.

During the second day, about 80participants from national agenciesand delegations, industry and researchinstitutions of most ESA member statesprovided their views, opinions andsuggestions during the round tableopen deliberations. Four splinter ses-sions were organized:• Microsystems in space: space uses of

the technologies and missions theycould generate

• Microsystems in the spacecraft• Microsystems technology: the future

of microsystems • MST and ESA: programmatics

The general opinion was that micro-technologies (both meant as integra-tion of microelectronics with peripher-als and as micromechanics) could, indue time:• contribute to a significant reduction in

the costs of access to space, via atechnology break-through oriented to-wards mass production, on the basisof distributed systems and services,

• make possible new types of missionsand applications, in virtue of theirvolume/mass/power reduction po-tential.

The following examples of possibleearly applications of microsystems inspace were suggested:• sensor networks (for monitoring, or

as part of the payload)• new functionalities derived from mi-

crosystems capabilities• wireless on-board data and com-

mand distribution• microsystems in the launchers (for

guidance, environmental monitoring).

Actions proposed for future activitiesof micro/nano-technologies for space:• specify space related requirements to

device developers, and assess with themthe feasibility of those requirements

• establish good communication chan-nels between potential space usersand microsystems developers (re-search centres, laboratories, univer-sities, industry)

• initiate small programmes for devel-oping and qualifying integrated de-vices for adverse environments (withutilization in space)

• harmonize ESA initiatives with na-tional and EU activities, includingdemonstrators for the technologies

• introduce microtechnologies as aspecific subject within ESA’s technol-ogy programmes

• initiate a system study covering mis-sion opportunities and implicationsof the cultural change associatedwith microtechnologies.

General recommendations amongst themajor suggestions of the Round-Table:• reconsider product assurance and

the space qualification process• follow standardization efforts in in-

dustry and specialized organiza-tions, within the objective of definingreusable modules.

Antonio Martínez de Aragón

For further information please contact theauthor at ESTEC System Studies DivisionPb 299, NL 2200 AG NoordwijkTel: +31 71 565-3018 (-5429 Fax)

Report on the Round Table onMicro/Nano-Technologies for Space

ESTEC, 27-28. March 1995

Antonio Martínez de Aragón

Application of MST technologyon launch systems

In the short term there are two ap-plications of MST in present daylaunch systems, by improvingguidance systems and by improv-ing monitoring equipment. Theguidance and control system oflarge launch vehicles is situatedjust below the payload, thus everykilogram which can be saved byminiaturisation of the guidanceand control system means that onekilogram extra payload can be ac-commodated. MST guidance com-ponents are in development and inthe foreseeable future they can beintegrated in complete small guid-ance systems. One of the problemsat the moment is the relative inac-curacy of MST guidance compo-nents but they will gradually im-prove. Furthermore GPS could beused to enhance the accuracy ofthese guidance systems. MST com-ponents could start a cascade ofimprovements: smaller compo-nents will lead to lower mass andlower energy consumption whichleads to lower battery and vehicleequipment bay size. This could im-prove the performance of thelauncher significantly.

For smaller launchers MST holdsthe promise of much higher injec-tion accuracy. These launchershave often spin stabilised solidrocket motors which perform theinjection into orbit. These stages donot require a guidance and controlsystem and can therefore carry alarger payload. If the guidance andcontrol system had to be carriedinto orbit, the payload for theselaunchers would be negligible oreven non-existing. The price paidfor this necessary technique is a rel-atively low injection accuracy: afterthe spin-up and ignition of the finalstage, it cannot be steered norstopped. When a small, low massguidance system with a mass in theorder of 20 to 30 kg or lower be-comes available these stages couldbe equipped with a full guidanceand control system which wouldgreatly increase the accuracy of thewhole rocket without degradingthe payload capability too much.

Such a vehiclecould bringcomplex injec-tion scenariosand the highprecision common for large launchsystem within the reach of smalllaunchers.

Another application of MST inlaunchers is instrumentation. Be-fore and during a launch many dif-ferent vehicle parameters have tobe monitored and sent back to theground by telemetry. Normally thisis done via the vehicle equipmentbay where all electronics arehoused. This leads to long cablesand extra equipment in the masscritical vehicle equipment bay. TheAerospace Corporation in the USAis experimenting with ASIM’s (Ap-plication Specific Integrated Micro-instrument) as launcher instrumen-tation. In ASIM’s the measurementinstrumentation, data processingequipment and a telemetry systemare housed in one chip. The ASIM’scould be attached directly to theplace where the measurement hasto be taken without any or very lit-tle additional wiring. Furthermorethey are jettisoned with the stagewhere they are attached, so themass penalty is much lower thanequipment which is situated in thevehicle equipment bay.

These applications are straight-forward examples of applicationsin launchers, but there may bemany others when the possibilitiesof MST are more understood bythe launcher industry.

Launching MST satellites

It is expected that the applicationof MST in space engineering willyield new generations of increas-ingly smaller satellites. Their num-bers will probably be higher togenerate the same capabilities aslarge present day satellites. Thiswill be a gradual process that willtake many years with dedicatedsatellites in the 100 kg range orlarger in the near future and hun-dreds of so called ”nanosats” ofless than one kg in the longer term.If many satellites can be launched

together thepresent daylaunch systemsmay very well dothe job. Further-more, when thetarget orbit is notvery critical “pig-gy backing” withlarger satellites isa cheap alterna-tive. However,the small mass ofcapable MST sat-ellites will onlybe used econom-ically when thereis a launchersuited to their size. These satelliteswill need a dedicated launch (thatis, a launch into a very specific or-bit, suited to the mission of the sat-ellite) and when their mass is be-low 100 kg the present day smalllaunchers are oversized and thusuneconomical. Furthermore whenlarge numbers of satellites have tobe launched other launch systemsthen the present expendablelaunchers may be a more cost-opti-mum way to launch MST-sats.

Current Topic: Space Technologies

Launchers & MST

The high launch costs of spacecraftare one of the main problems of the

present day space industry. The launchof a spacecraft costs averagely 25 to50% of the total mission costs. One ofthe great promises of MST (MicroSystem Technology) satellites are theirsmall size and mass which can lead tosignificant reductions in launch costs.To fully exploit this advantage dedicat-ed launch systems for MST satellitesshould be developed in order to launchMST satellites in the most economicalway. Besides launching MST satellites,Microsystem Technology can also di-rectly be applied to launchers by low-ering their mass and therefore enlarg-ing their payload capability. In this ar-ticle the applications of MST in launch-ers and the potential launch systems forMST satellites are discussed.

Introduction

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Current Topic: Space Technologies

Existing small launchersWhen satellites have masses over100 kg and their numbers are low,in the order of 20 to 30 per year,present day small launchers likethe US Pegasus and smallest Con-estoga version and the RussianStart can be used. The launch costsrangfe usually between 10 and 20million dollars for a dedicatedlaunch. The advantage of theselaunchers is their availability butthey are relatively expensive.

New expendable launchersWhen there are a number of satel-lites below 100 kg which need adedicated launch it might be com-mercially attractive to develop anew launcher suited to this payloadsize. Two possibilities in this direc-tion are an air-launched vehicle likethe Pegasus but about half of itssize. Such a vehicle, weighting nomore than 10 tons can be easilytransported and launched by a rela-

tively small airplane all over theworld. Due to its small size, the de-velopment and manufacturingcosts will be considerably less thanpresent day small launchers. Ap-plying MST technology in the guid-ance and control systems will yieldan accurate launcher with a reason-able payload.

Another idea is to develop an”orbital sounding rocket”. By usingsounding rocket stages which aresimple and do not carry any guid-ance a launcher can be constructedwhich puts the payload and an in-jection stage into a sub-orbital tra-jectory. At the highest point theguidance system will fire the finalstage to put a satellite into orbit.This method is cheap but crude.However, the Japanese have orbitedsatellites this way with their Lamb-da 4S launcher in 1970. It is estimat-ed that such a vehicle could be op-erated for a few million dollars perlaunch.

Small reusable launchersShould the number of small MSTsatellites rise considerably, let’s sayto 100 or more per year, it mightbecome more economical to devel-op small reusable launchers. Thescale effect does not favour the de-velopment of a Single Stage To Or-bit (SSTO) small launcher. Howev-er, the SDI Organisation has stud-ied a ballistic missile target dronecalled ”Mockingbird” which re-portedly has an orbital capability ofabout 10 kg. The Mockingbird hasa launch mass of 1500 kg and thecosts of one launch would be in theorder of $ 100,000. For larger pay-loads a vehicle of the size of the

well known DC-X test vehicle (-launch mass 15 to 20 tons) could beused. This vehicle would fly a sub-orbital trajectory, releasing anupper stage and satellite at its high-est point. The main vehicle wouldland and be reused while the ex-pendable upper stage would bringthe payload into the desired orbit. These kinds of vehicles would re-quire extensive developments butoffer much lower costs per launch.This is however only true when thedevelopment costs can be writtenoff by a large number of launches.

Hypervelocity launchersOne of the advantages of MST isthe high resistance to accelerationsof small integrated devices. There-fore high accelerating launchsystems like railguns, gasguns orscram accelerators might be suit-able when the number of satellitesto be launched is large (many hun-dreds to thousands). In such largesystems the satellite is put inside aprotective shell together with arocket engine. At the end of the ac-celerator it reaches a velocity of sev-eral kilometres per second andstarts a ballistic trajectory. When ar-riving at the highest point of thistrajectory the rocket engine ignitesand puts the satellite into orbit.Typical accelerations in this type oflauncher are a few thousand g’s,but many gun launched militarysystems have been constructedwhich can tolerate these levels. Sev-eral of these accelerators are in useall over the world for hypervelocityimpact research. A new largersystem has to be constructed to at-tempt space launches. Hyperveloc-ity launchers have the potential ofbeing very cheap, as low as 3000 to5000 dollar per kilogram. Theirmain disadvantage however is thefact that the barrel is fixed and thatit is therefore difficult to launch sat-ellites into different orbits. Further-more they require a large numberof satellites to become economical.

B. Sanders

For further information please contactthe author at The International SpaceTransportation Information & Consul-tancy (ISTIC) company, Tingieterpad28, 2613 NC Delft, The Netherlands.Telephone/fax: +31-15-124282, E-mail: B.Sanders@inter.nl.net

The International Space Transporta-tion Information & Consultancy is a

young Dutch company specialised inhigh grade consultancies in the area ofspace transportation. Our specialitiesare technical analysis of launchers,performance computations, systemstudies of launchers and propulsionsystems. ISTIC has constructed an ex-tended launcher database which has avery high accuracy due to in-housetechnical analysis methods. ISTIC is ac-tively involved in identifying applica-tions for MST in launch vehicles and inidentifying launch systems, present orconceptual, for the launch of MST sat-ellites.

ISTIC

Conceptual layout of a hypervelocity launch site

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The Design of the Space Bioreactor includes the Features:

• Supply of fresh medium to cellsin the reactor chamber(working volume 3 ml) over aperiod of 9 days at an adjustablerate ( 0.2 - 1.5 ml/h)

• Measurement of pH, temperature and redox potentialof the culture

• Control of pH of the culture• On-line data transfer to ground

control

In view of the complexity of theinstrument and the limited dimen-sions of the Type II container, theapplication of silicon technologyto provide both the sensors and amicromachined pump and flowsensor are of a distinct advantage.

During its first flight on IML-2in July 1994, the technical feasibil-ity of the bioreactor concept wasdemonstrated. The bioreactor iscurrently being prepared for a re-flight on the STS-76 mission in thespring of 1996. In order to makethe liquid handling more robust, acontrolled flow system will be im-plemented.

Experimental Setup

Figure 1 shows the individual ele-ments of the bioreactor and theirinterconnections. In the followingsection, these elements will be brief-ly described. It is interesting to notethat the reactor chamber, the heartof the instrument, occupies less than1% of the volume available in theexperiment container. The largestvolume is reserved for the nutrientmedium reservoir. Both the freshand used medium reservoir are flex-ible and while the first is emptiedduring the experiment, the secondtakes its place while filling up.

Pumping System

The supply of fresh medium to thereactor chamber is accomplishedwith a microfabricated piezo-electric pump. When used as such,the flow rate of the pump dependson the output pressure that has tobe provided. Unforeseen varia-tions in the bioreactor chamberpressure were the reason that dur-ing the first flight fluid deliverywas not sufficiently controlled. Forthe reflight, a flow sensor is addedso that the pump can operate in a

closed loop control system andsupply the required flow, indepen-dent of output pressure.

Sensors

The sensors for the bioreactor, apH-ISFET, a temperature sensitivediode and a thin film platinum re-dox electrode have all been inte-grated on a single chip that meas-ures 3•53•5 mm. The sensor chip ismounted on a carrier that is insert-ed in the reactor chamber so thatthe sensor surface becomes part ofthe chamber wall without creatingdead angles. The reference elec-trode used in connection with thechemical sensors is a gel-filled Ag/-AgCl electrode.

Ph-Control

For optimal growth conditions forthe cells, the pH in the reactor hasto be maintained at a constant val-ue. During normal growth, yeastcells will acidify the medium forwhich a compensation is required.In view of the risk connected to theuse of concentrated NaOH for thispurpose, an electrochemical pHcontrol is developed. A titanium

Experiments with cellsin space have

shown that importantcellular functions are al-tered in microgravity.These findings are ofgreat interest for funda-

mental research as well as for possible bio-technological applications. For the cultivationof cells aboard Spacelab, a miniature bio-reactor has been developed. The objective isto evaluate in a controlled bioreactor experi-ment (chemostat cultivation) the effects of mix-ing and stirring on the growth characteristicsof yeast cells. The experiment was selected byESA for the IML-2 mission which took place inJuly 1994. It was located in Biorack, a multi-user facility developed by ESA to host biologi-cal experiments in Spacelab. The individualexperiments are mounted in standard contain-ers of various dimensions. The Type II contain-er allocated for this experiment has internaldimensions of 63x63x85mm.

Current Topic: Space Technologies

Development of a Miniature Space Bioreactor

Photograph: Courtesy of Mecanex SA

im t

Current Topic: Space Technologies

electrode in the reactor chamberacts as a cathode for the electrolysisof water to produce hydroxylions.As a counter electrode a silver wireis used, embedded in a KCl loadedgel. The counter electrode compart-ment is separated from the reactorchamber by a Nafion membrane.Electrochemical compensation ofthe pH can be controlled very pre-cisely and avoids the need for anadditional pump for NaOH dosage.

Electronic Circuits

The operation of the bioreactor iscontrolled by an Intel 87C51 mi-crocontroller. The circuitry consistsfurther of amplifiers for the sen-sors, a high voltage driver circuitfor the micropump and a currentsource for pH-control. The pumpoperation is governed by an ana-log control system, the set-point ofwhich is controlled by the micro-

processor. The current source forpH-control is galvanically isolatedfrom the rest of the circuit to avoidinterference with the sensor sig-nals. Relevant data are availableon one multiplexed analog outputchannel. For preparation of the ex-periment before the flight a serialdata connection is provided andthe instrument can be directlyinterfaced to a standard personalcomputer. The circuits are built upwith surface mounted componentson two printed circuit boards.

Acknowledgment

The space bioreactor has been de-veloped in close collaborationbetween the Space Biology Groupat the Federal Institute of Technol-ogy in Zurich as principal investi-gator, Mecanex SA in Nyon andthe Institute of Microtechnologyin Neuchâtel. The author wishesto thank the teams of the PRO-DEX program of ESA and of theSwiss Federal Office of Scienceand Education for their support inthis project.

Bart van der Schoot

For further information please contactthe author at Institute of Microtechnolo-gy, University of Neuchâtel, Rue Jaquet Droz 1, CH-2007 Neuchâtel,SwitzerlandPhone +41 38 205-387, (-711 Fax)E-mail Bart.vanderSchoot@imt.unine.ch

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Figure 1. Principal elements of the miniature bioreactor

The development of a miniaturebioreactor with microfabricated

components for fluid handling andsilicon sensors shows a promisingoutlook for their application in mi-crogravity experiments. In view ofthe special requirements for thiskind of application, the bioreactoris an attractive showcase for micro-system technology.

Conclusion

ESA ADVANCED

SENSORTECHNOLOGY

The European Space Agency (ESA) Advances Sensor Technol-

ogy project has the objective to de-velop a flexible modular integra-tion capability which allows differ-ent prefabricated sensors, to be in-tegrated within a common mothersubstrate. One key objective is toavoid environmental conditionsthat are detrimental to sensitivecomponents such as chemical andbiological sensors. Further exten-sion to include a wide range of dif-ferent microengineered compo-nents is expected. The technologyshould offer a cost-effective capa-bility to address diverse, low-vol-ume niche markets such as in envi-ronmental and biomedical diag-nostics.

The project consortium includesIMEC, IMT-Neuchâtel, MESA Insti-tute, HKI and MSTB Ltd as subcon-tractors to Dornier GmbH. ESA in-tends that the technology devel-oped under the project will beavailable for terrestrial commercialexploitation. A tentative catalogueof companies which have the po-tential to exploit the technology willbe provided to the Agency byMSTB Ltd. Expressions of interest tobe included in the catalogueshould be be sent to MSTB Ltd atthe address below.

David Barrow

For further information please con-tact Dr. David Barrowor Dr. Joseph CefaiMSTB Ltd59 Golden Grove, TreboethSWANSEA Sa5 9DFWales, UKTel. +44-385-26 47 80/1Fax. +44-1222-52 16 89E-mail: Info@MSTB.com

Current Topic: Space Technologies

The circuit complexity and theinterconnection density, even

in space systems, has achievednowadays such ahigh level that theMCM (Multi ChipModule) approach isentering this marketniche to satisfy thesenew needs. Multichippackaging is receiv-ing increasing atten-tion, since it permitssmaller, faster and less expensiveproducts, connecting several chipsin die form together in a singlepackage.

The MCM can be defined as ahigh interconnection hybrid,where the silicon occupation areais around 50 % with respect to thesubstrate area. In fact the use ofbare dice, instead of packagedcomponents, can greatly increasethe interconnection density, sinceit is possible to keep the compo-nents closer than in the case ofother types of hybrids. The finalproduct is a single package, evenhermetically sealed, that includesmore complex functions. An MCMcan be characterized by means ofthe substrate type, the conductorsand dielectric materials, the diceinterconnection methods and thepackage. However the most com-mon MCM classification is usuallybased on the substrate type:

• MCM-C (Ceramic)This module is based on a ce-ramic substrate, usually allumi-na, where the bare dice aremounted and interconnected us-ing screen printed conductormaterials, such as gold.Along with the standard ThickFilm technology there are twonew techniques, such as HTCCand LTCC, whose manufactur-

ing process is performed at highand low temperatures respec-tively.

This is the most suitable technol-ogy for space applications dueto its maturity and high reliabil-ity figures.

• MCM-D (Deposited)This module can be based on aceramic or a silicon substrate,where the bare dice are mountedand interconnected by high con-ductivity conductor materials,such as copper, alluminium orgold. The conductor layers areseparated by deposited dielec-tric layers, usually polymerswith low dielectric constant.

• MCM-L (Laminate)This module is based on a PCB-like substrate, where the baredice are mounted and intercon-nected by conductor materials,such as copper. The conductorlayers are separated by laminatedielectric layers, usually poly-mers with a low dielectric con-stant, such as polymide.

Other peculiar MCM characteris-tics refer to the different diceinterconnection methods:

• Wire BondingThe electrical connectionbetween the bonding pad andthe substrate is achieved bymeans of a wire, usually made

Multi Chip Module for Space Applications

The trend in all main space programs is to keep as low aspossible the mass and the volume of electronics, and to in-

crease on the other hand circuit complexity and interconnectiondensity. This led, in the seventies, to the use of hybrid microcir-cuits for space applications and several manufacturers in Eu-rope being approved by the ESA (European Space Agency).LABEN, a Finmeccanica Company, has been qualified since 1988 to manu-facture thick film hybrids for space application.

The MCM is a quite young technolo-gy, but it is very promising, espe-

cially in the defence and aerospace areas, where the development costscould be overcome by better perfor-mance in terms of speed and volume.

Since the performance of advanceddigital systems, especially in space ap-plications, is severely limited by inter-connections and packaging technolo-gy, the LABEN approach is to over-come the problem using a Multi ChipModule (MCM) approach based on aFine Line Thick Film Technology.

Following this approach more em-phasis is placed on the engineeringphase of the development flow, in or-der to minimize all the potential risksrelated to circuit implementation. This could not be accurately evaluatedduring the design activities and couldprolong the whole development timewith several re-buildings.The table shows the comparisonamong different hybrid technologies,such as Thin Film, standard Thick Filmand Fine Line Thick Film.

As shown in the table, fine line tech-nology can achieve performances quiteclose to thin film.Because the present space applica-tions, implemented as standard thickfilm hybrid, did not overcome 20 MHzusing HCMOS logic for the digitalparts, there were no serious problemsconcerning interconnections.But the introduction of Fine Line Tech-nology in space applications, with itsimproved performance in terms of linewidth, line space and vias density,force us to consider the critical pathsvery carefully in terms of crosstalk andringing. Moreover the use of the AC-MOS logic family with its sharp edges,i.e. fast rise and fall time, and the im-proved operating frequency, in therange of 20 to 50 MHz for standardspace applications, increases the sig-nal bandwidth to be considered.In fact the parasitics of the traces, suchas self-capacitance, self-inductance aswell as mutual capacitance and induc-tance, can influence the system’s func-tionality and the signal’s integrity.

Std Thin Film Fine LineThick Film Thick Film

Line width 125 µm 25 µm 40 mmLine pitch 125 µm 50 µm 60 mmVias Size 200 µm 50 µm 75 mm

A promising technology

Current Topic: Space Technologies

of aluminium or gold. This is themost popular way of dice inter-connection and can be done witha ball bonding or wedge bond-ing technique.

• TAB (Tape Automated Bonding)This is a method of electricallyand mechanically connecting achip to a substrate. The tape isan etched-out piece of metalconsisting of tiny beam leads.This technique allows testing thedice before mounting them ontothe substrate.

• FLIP CHIP This technique offers the bestpossible electrical connectionbetween chip and substrate, be-cause it eliminates leads alto-gether. The chips are mountedface down on the substrate bymeans of solder bumps placedin an array pattern across thechip. This allows the best electri-cal performance, because theinterconnection length is ex-tremely short.

In any case, from a design point ofview the MCM development hasbeen limited by some problems upto now, such as dice component li-brary and dice functional modelavailability, as well as data ex-change among different dice ven-dors.

One of the criticalissues surrounding theadoption of the MCMs isthe availability of accu-rate die information,needed to simulate theunpackaged dice on theMCM substrate, in thesame way in which it ispossible for the packagedcomponents.

In addition, thegoal is to perform a sim-ulation that can also takeinto account the intercon-nection substrate, i.e. apost-layout simulation.In fact the possibility ofsimulating the MCM notonly from a functionalpoint of view — oftenpossible — but also tak-ing into account its im-plementation, i.e. the ef-fects of the interconnec-

tion substrate, is important to re-ducing the gap between the func-tional simulation and the actualMCM behaviour.

Our first step was to identify amethodology for the design andengineering activities, based onone hand on the concurrent engi-neering approach and on the oth-er hand on the introduction ofthe basis for a „Post-Layout sim-ulation“. After the design andthe simulation activities all theinformation is passed by the de-signer to the engineering andpackaging people. They are incharge of generating the modulelayout, taking into account thesystem and the design con-straints stated in the previousphases of the work. Most of theparasitic information can be keptunder control by means of spe-cific software. It also permitssimulating the critical paths afterthe layout generation, by consid-ering the modules physical im-plementation. In this way thesefeed-backs can be used to act onthe layout, in order to minimizepotential problems due to para-sitic capacitance and inductance.Moreover the post-layout simu-lation can also analyse the cross-talk on particular nets, allowingus to reduce risks during normaloperations.

Since our interest was focusedon a high interconnection ceramicsubstrate, the Fine Line Technolo-gy was considered, in order to ex-tend the performance of the stan-dard technology being used inspace applications. Our first goalwas to make an electrical charac-terization of a substrate imple-menting different trace patternswithout considering a particularelectrical function. To do that a teststructure, on a 3“x3“ substrate, hasbeen manufactured with the FineLine Technology to evaluate theinfluence of the interconnectionson the signal integrity. The mainfeatures of the test structure are: 3conductor layers, line width downto 50 µm and line pitch down to125 µm.

The same patterns have beensimulated in order to be comparedwith the test results on the sub-strate itself. This comparison willbe useful on the one hand for re-fining the software models, on theother hand for evaluating theelectrical performance of the sub-strate. In this way some engineer-ing rules will be fixed from thetesting activities.The pattern implemented on thetest structure will give us informa-tion on:• cross-talk among different

traces;• reflections on long lines (> 2“);• vias contribution;• influence of the ground plane on

signal integrity.

The testing activities show thatcrosstalk is very much influencedby the ground plane distance aswell as the line pitch. On the con-trary there is only a slight influ-ence of the dielectric constant val-ue and of the conductor thicknessas well. This means that it is suit-able for CMOS applications.

Ermanno Papa

For further information please contactthe author at Laben S.p.A.Research and Strategic DevelopmentsSS. Padana Superiore 290,20090 Vimodrone (Mi), ItalyTel.: +39-2-250751Fax: +39-2-2505515E-mail: papa.e@laben.it

Phot

o ES

A

´s impression of SOHO, the joint NASA space-based solar-observatory

Current Topic: Space Technologies

At the Research Centre in Karls-ruhe, Germany, the founding

of the microsystem technologiesproject (PMT) has led to a collabo-ration among researchers fromfields such as chemical sensor de-velopment, computer science,electronics and microstructure fab-rication. The development of theLIGA technique (Lithography(mostly x-ray), Galvanoformingand Moulding (Abformung)) hasbeen the focal point of the efforts.The key features are summarisedas follows: • large structural height, typically

0.1 to 1 mm• smallest dimension of a few µm

with structural details down to0.2 µm

• free lateral shape• extremely parallel resist side-

walls• extremely low sidewall rough-

ness• large material variety: electro-

plated metals and/or moldedplastics.

Potential space applications ofthe LIGA technique are in boththe spacecraft’s infrastructure andin the fabrication of key compo-nents for scientific experiments.A few examples follow:

Optical Spectrometers are of inter-est in earth observation as well asin space science to decode colourinformation. The LIGA microspectrometer consists of a 3 layerpolymer structure with the highestindex of refraction in the corelayer to guide the light. The resist

height is adaptedto the height ofcommon opticalfibre in order toinsert the lighteasily into thecore layer. Ablazed reflectiongrating is used tofocus differentwavelengths ontodifferent positionswithin the focalplane where thelight is reflectedout of the deviceby a 45° sidewall.A linear diode ar-ray is used tomeasure the spec-tral intensity dis-tribution (Figure1). Table 1 sum-marises the ex-perimental char-acteristics of thedevice includingelectronics.

Lengthy experience exists withthese devices and we are currentlyworking on near infrared spec-trometers with a wavelengthrange of 2.7 to 3.7µm and on nearUV spectrometers with a wave-length range of 380-780nm.

Further examples of LIGA mi-crooptical applications are a bi-directional switch and a bypassswitch for use in communicationswith minimal coupling losses,due to imaging of the ends ofmonomode fibres with ball lenses

on an anisotropically etched sili-con substrate.

Acceleration sensors are an ex-ample of devices required duringlaunch (high g-values) and fornavigation purposes (low-g val-ues). A triaxial acceleration sen-sor system has been fabricatedfor low-g applications where twoLIGA sensor elements (for accel-erations within the plane of thesubstrate) and a silicon sensorelement (sensitive perpendicularto the plane of the substrate)

Yet Another Technology forSpace Microsystems’ Fabrication: LIGA

Table 1: Characteristic Data of LIGA-Microspectrometer

spectralrange

400-1100nm

25% 7nm 25dB 50/125µmgradient index

HamamatsuS5464-512F

10000 -20000

40ms -2560ms

transmissionat blaze

spectralresolution

attenuation toscattered light

opticalfibre

diodearray

dynamicrange

measuringtime

Figure 1: Principle of the LIGA Microspectrometer. The light is transferred to the core layer of the device by an optical fibre. A slantedsidewall is used to direct the light which is locally separated by thegrating according to wavelength onto a CCD diode array. Thesharp grating teeth are 125µm deep, 3µm high and 0.2µm wide.

Current Topic: Space Technologies

have been combined with highprecision hybrid feed-back read-out circuits. The experimentalperformance of a single sensorelement with the electronics isshown in Table 2.

Further research is currently going on aimed at fabricating aLIGA based gyrometer.

Fluidic devices have a wide rangeof applications in space. Arrays of

fluidic flip-flops fabricated by the LI-GA technique may be used to stir thespacecraft by applying short propul-sion jets. A thermally actuated micro-pump that has been fabricated by op-tical lithography, moulding andaligned adhesive bonding may beused for many microgravity experi-ments and has the following charac-teristics:

It has been demonstrated thatfluids can be pumped as wellwhen a module of 4 pumps iscombined with microvalves. A lastexample is a bistable microvalvefabricated with the same basictechniques, which may beswitched with a pressure of 100 to200hPa. In the open state, the vol-ume flow is proportional to pres-sure and reaches 0.35ml/sec at400hPa. In the closed state, no gasbubbles could be collected over a

weekend in anupside downglass filled withwater. Further ac-tivities of interestat the ResearchCentre with re-spect to space ap-plications includethe developmentof microactuators,where examplesfrom electrostat-ics, electromag-netics and theshape memory al-loy effect have re-ceived wide-spread attention.

Joachim Schulz,Jürgen Mohr,

Holm-Rainer Mache

In case of interest in co-operating,please contact the authors at Forschungszentrum Karlsruhe, Inst. fürMikrostrukturtechnik Postfach 3640D 76021 Karlsruhe Tel. +49 7247 82 4-438 (-331 Fax)E-Mail: Joachim.Schulz@imt.fzk.d400.de

Table 3: Characteristic Data of 2g Acceleration Sensor Element with Feedback

range

2g 1971mV/g 0.8% 90µg/K 28µg 570Hz

sensitivity linearity thermal zero shift resolution 3dB frequency

Table 2: Characteristic Data of the Micropump for Gases

drive voltage

15V 130 hPa 220µl/min 2ms 30Hz 10 • 7 • 1mm3

max. outlet press. max. flow rate pulse length pulse frequency dimensions

2: A Module of 4 Micro-pumps for Gases. The overall dimensionsx14x1.5mm3. The 4 large round areas show the thermally actuat-amber, the smaller round areas are the valves required for direct-he gas flow and the output tubes. In a similar manner, a bi-stable

microvalve has been fabricated with virtually no leakage.

ACTUATOR 964th International

Conferenceon New Actuators

Bremen, June 26 - 28, 1996

Topics: • Piezoelectric actuators • Magnetostrictive actuators• Microactuators • Shape memory actuators• Actuators based on electro-

/magnetorheological fluids• Low power electromagnetic

actuators

Objectives:• to present R&D results in the

field of new actuators• to demonstrate exemplary

applications of new actuatorsin fields such as fluidtechniques, electrical drives, mechanical engineering,automation, robotics, optics, medicine, and automobiles

• to promote internationalcooperation and technology transfer in the field of new actuators

Sponsor:The Senator for Economic Affairsand Technology, Bremen

Contact: Dr. H. Borgmann, AxonD - 28195 Bremen, Hanseatenhof 8 Phone: (+49 421)17 55 50 Facsimile: (+49 421)17 16 86

Current Topic: Space Technologies

Afirst project is being executedin close collaboration with the

Belgian company Verhaert Designand Development. The main goalof this project is the exploration ofthe application of MST in systemsfor the thermal control of satel-lites. The temperature of a satelliteis controlled by regulating theemission of thermal (infrared) ra-diation by the satellite into deepspace. By varying the effectiveemissivity of the radiator or theinternal heat flow to that radiator,the temperature of the satellite iscontrolled. Most systems currentlyin use are based on the control ofthe effective emissivity of the radi-ator by a louver system. These are

mechanical systems which have tobe developed specifically for eachnew type of satellite. The louversystems are rather costly and quiteoften suffer reliability problems.Together with Verhaert Designand Development, IMEC devel-oped a new concept based on theActive Reflective Tile or ART®.The ART system is a modularsystem consisting of radiatingART panels which can be assem-bled into larger structures in orderto obtain the required radiating orcooling power. Each ART panelconsists of a number of Active Re-flective Tiles manufactured by us-ing microsystems technology.

The ART concept, as shown inFigure 1, relies on a variable me-chanical contact to control the heatflow between two surfaces, creat-ing a thermal switch. Desiredproperties of this switch are a highthermal resistance when open anda high thermal conductance whenactivated. A schematic side viewof the Active Radiator Tile is givenin the figure below. The base plateis in contact with the satellite,whereas the radiator plate is di-rected towards the cold space. Thefirst device realised is made of sil-icon and polyimide materials. Theradiator and base plate are manu-factured by anisotropic etching ofsilicon. Both plates are separatedby polyimide thermal insulators ofa height of 10 to 20 µm and highvacuum. The lateral sizes of thebase and radiator plate are 2 cm x2 cm . The interior cavity surfaces

are coated with low-emissivitylayers to minimise the radiativeheat transfer between the two sili-con plates. The thermal switch isactivated by applying a voltage.The applied voltage will bring thetwo plates in mechanical and ther-mal contact, allowing the heattransfer from the satellite to deepspace through the radiator platecovered with the high emissivitylayer. The first prototype realisedhad an actuation voltage of 40 Vand an off to on ratio of 1 to 8. Thisfirst prototype proved the ARTconcept but was not suitable forapplications in space. FurtherR&D work is going on to furtherreduce the actuation voltage byusing corrugated membranes, toincrease the mechanical strengthand reliability and to improve theoptical characteristics of the radia-tor plate.

A second IMEC project usingMST for space application is relat-ed to space life science applica-tions, biotechnology research andlife support systems. In an ESAfunded collaboration with Dorni-er, MESA, IMT, MSTB and HKI, ahybrid integrated sensor array isbeing developed. This array is ademonstrator breadboard to provethe feasibility of the integration ofexisting sensor devices in miniat-urised hybrid modules. The firstarray to be developed will incor-porate sensors for pH, pO2, pCO2,pressure and temperature. Thesensors are arranged in a flow-through configuration. The sen-

Microsystems Technology for Thermal Controland Life Science Experiments in Space

Microsystems technology has a number of featuresthat makes this technology very attractive for space

applications. The space community’s interest in MST ismainly aroused by the potential of MST to reduce thecosts of space access. Cost reduction can be realised byreducing the mass and size of satellites, by producingspace instrumentation and satellites in larger batches orby increasing their reliability by introducing increased redundancy. Thesepotential advantages are not for free and will require a new way of think-ing of the space community and industry in areas such as space systemsdesign, qualification and project management. The process of exploringthe use of MST in space and the identification of the consequences hasjust started. Some of these first steps will be discussed in the following.

IMEC has been involved in MST R&Dfor space applications since 1993. Upto now these projects have had thecharacter of a feasibility study andhave not yet led to the realisation ofreal flight hardware. In the field of AS-IC design and processing IMEC hasdelivered cryogenic read-out circuitryfor the ISOPHOT experiment on theISO satellite which was launched on17 November 1995. ISO is a infraredtelescope for space science. The CMOScircuits fabricated at IMEC are operat-ed at temperatures only a few degreesabove the absolute minimum tempera-ture and are used to read out infrareddetectors. This project has taught usabout the specific requirements ofspace applications.

IMEC´s Experiences

BasePl t

PolymerInsulator

Low EmissivityLayers

RadiatorPl t

Qout

QradQcond

HighE i i itHigh solar

reflectanc

Layer

Tbase

Trad

Tspace

Fig. 1 : Schematic presentation of ART

Qcond

Qout

Qrad

Current Topic: Space Technologies

sors are mounted on a carrier chipand are connected by a liquid flowchannel. Figure 3 is a photographof the sensor array realised. Thetotal size is about 4 cm x 2 cm x 3mm and incorporates, in additionto the sensors mentioned above,the readout circuit for the capaci-tive pressure sensor. IMEC is re-sponsible for the fabrication of thesensor carrier and the integrationof the different sensor chips into ahybrid array. The mounting of thesensors on the carrier substrate isrealised by using a dispensingtechnique. Fully operational andtested sensor arrays will be avail-able by mid 1996.

IMEC is also currently involvedin the development of miniatur-ised smart cameras for space ap-plication. Miniaturised cameraswill be used on future spacecrafts

to monitor the deploymentof antennas and solar panelsor to inspect possible dam-age, for example by meteor-ite impact. The visual infor-mation obtained in this waywill allow the early identifi-cation of the origin of a mal-function and enable appro-priate counter measures tobe taken almost immediately.

Lou Hermans

For further information please contact the author atIMECKapeldreef 75, B-3001 LeuvenTel: +32 16 281-463 (-501 Fax)e-mail: hermans@imec.beBelgium

Fig 2 : Photograph of a 125 mm Si wafer containing several ART radiator plates

Experiments at Institute of Microtechnology Mainz

an opportunity to get acquantaintedwith microfabrication

An excellent opportunity to get started with microfabrication isbeing provided by the "Large Scale Facility" (LSF) scheme of

the "Human Capital and Mobility / Training and Mobility" pro-grammes of the European Commission. European research teams,both from academia and from industry, can perform "guest ex-periments" at the microfabrication LSF - Institute of Microtechnolo-gy Mainz GmbH (IMM) in Germany. They have available all rele-vant methods of microfabrication, including LIGA technology, sili-con and thin film technology, excimer laser micromachining andultra-precision mechanics. Training and assistance for the guestsis provided by IMM´s experienced staff, to allow a thoroughunderstanding of the different methods and to solve specific prob-lems of the user groups. As the programme is aimed to provideaccess to all interested user teams and thus stimulate efficient tech-nology transfer, travel and accomodation expenses for the guestresearchers are being covered by European Commission funding.

Interested teams should direct inquiries toDr. Klaus Hesch, Institute of Microtechnology Mainz GmbH (phone: +49 6131 990-112; fax -395) and ask for further information and the application package.

The deadline for submission of guest experiment proposals (a 4-page effort for peer review) will be mid-May ´96.

EXHIBITION AND WORKSHOP

Results and products of „Microfabrication with Syn-chrotron Radiation,“ a network in the Human Cap-

ital and Mobility (HCM) programme of the EuropeanCommission, will be presented on Thursday, June 20,1996, at the Institute of Microtechnology MainzGmbH, Carl-Zeiss-Straße 18-20, 55129 Mainz.

A number of new interdisciplinary approaches to mi-crotechnology, from the fabrication of fully three-di-mensional LIGA-structures, to the electrodeposition ofnew alloys, as well as new devices like electromag-netic actuators, micropumps, and micro gripping de-vices, will be presented to the public at the final meet-ing of the HCM-network "Microfabrication with Syn-chrotron Radiation". This network was initiated in1994 by Wolfgang Ehrfeld with the goal of improv-ing LIGA and related microfabrication technologiesand to distribute this expertise throughout Europe.Since then, fruitful collaborations have developedbetween the 16 European research institutions in-volved.

For further information please contactDr. Klaus HeschInstitute of Microtechnology Mainz GmbHphone: +49 6131 990-112fax: +49 6131 990-205e-mail: hesch@imm.uni-mainz.de

See: news and announcements on WWW: http://www.vdivde-it.de/it /emsto/

R&D in MST

In 1990 SICAN GmbH wasfounded in Hannover to encour-

age applications of microelectron-ics in Northern Germany. SI-CAN´s areas of emphasis includethe design and simulation of digi-tal and mixed signal ASIC's, thedevelopment of complete electron-ic systems, CAT of componentsand boards, high frequency designand electromagnetic compatibility,multi chip module technologies,assembly and packaging; and thedevelopment of application-spe-cific sensor systems. 150 technicalengineers are provided with anextensive pool of different soft-ware tools and modern measuringinstruments.

SICAN has developed a sensorsystem to control and regulate theozone emission of sterilizers in airconditioning systems. Figure 1presents the principal construction.The system consists of a semicon-ducting gas sensor for the ozonemeasurement, a microcontroller

module and an adjustable powersupply for the sterilizer. In order toachieve more accurate measure-ments it is possible to facilitate agas flow across the sensor betweenOzone-free and Ozone-contaminat-ed air. The Ozone-free gas flow actsas a defined zero point for the sen-sor. Therefore, an ozone filter and apump must be added to the sensorsystem. Other applications can alsobe easily realised, like a monitorsystem for copiers or a device forthe ozone concentration measure-ment in rooms or outside.

The sensor effect of a semicon-ducting element is the change insurface resistance after absorptionof oxidising or reducing gases.This is also one of the biggest dis-advantages of semiconducting gassensors because a group of gasesmay have similar sensor effects.

The organic semiconductorPhthalocyanine is a materialwhich is very sensitive to ozonemeasurements. Its molecularstructure is shown in figure 2.

Phthalocyanine is a large planarmolecule with a delocalised *-elec-

tron system which can easily beionised. A Phthalocyanine mole-cule is a good electron donor. Thering of N-atoms around the centralmetal atom forms a potential wellwhich is responsible for the semi-conducting properties. Chargetransfer between molecules infilms or single crystals is only pos-sible by crossing the potentialwells. Phthalocyanines with a cen-tral copper atom (Cu-Pc) werefound to be very stable even invery aggressive environments. Themajority of carriers in cleaned Cu-Pc are p-carriers. Thus, this materi-al is appropriate for sensing oxid-ising gases like NOx or Ozone.

For sensor applications, mostlyPhthalocyanine thin films are usedwhich could be prepared by subli-mation in vacuum or under inertgas flow. The sensitivity of thesensing element is high when thefilm thickness is between 40 nmand 400 nm. The typical sheet re-sistivity of such film is about RS =8x108 Ω/square. It is useful to re-duce the film resistance for appli-cations even under strong electro-magnetic interference. Using aninterdigital structure (ID structure)is a technically simple way toachieve the reduction. The resis-tance between two electrodes canbe calculated by R = RSx(d/l)where d is the distance and l thelength of the electrodes.

A Self-Monitoring Ozone Gas Sensor Basedon a Microstructured Device

In the last few years the ozone layer has aroused considerable interestespecially in the areas of ozone layer evaporation and photochemical

smog. Because of its oxidising capability, ozone is one of the most toxicgases. In Germany the threshold amount (no mentionable risk) lies at 100ppb (parts per billion). Nevertheless, ozone has a lot of advantages forindustrial processes such as water treatment and the bleaching of paper,porcelain and textiles. Due to its oxidising potential it is also used for ster-ilization and for deodorisation in buildings, hospital operating rooms, in-dustrial plants and in water treatment.

Determining theOzone Layer Evaporation

Due to ozone´s hazardous potentialthe control of ozone generators is

useful. In particular, air conditioners,photocopiers and laser printers are often ozone producing devices. In many cases, the detection of small gas concentrations requires intense use of measurement equip-ment and therefore is very costly. If an accurate knowledge of the ozone concentration is not necessary,semiconducting gas sensors are an inexpensive and robust alternativeto other sensor systems.

Fig. 1: Ozone control and regulation of a sterilizer used in air conditioners

µC powersupply

sterilizer

OzoneSensor

cont

amin

ated

air

clea

ned

air

filte

r

R&D in MST

For this ozone monitoringsystem we designed a sensor sub-strate as shown in figure 2. Thesize of the silicon substrate is 2 x 2mm2. Two ID-structures with dif-ferent geometries lie above thechip. In addition, an integratedheater layer of titanium and a goldmeander enable heating and exacttemperature control of the sensor.Gold is used in ID-structures andthe thermoresistor in order toachieve an ohmic contact with thePc film without forming a Schott-ky barrier and to prevent destruc-tion of the contact material instrong oxidising gases like ozoneor Ethylenoxide. The width of theID fingers is 2 µm in both struc-tures, the distance of two elec-trodes is 2 µm for ID1 and 6 µmfor ID2, respectively. Both IDstructures are partly embedded inthe insulating layer underneath.Thus, the electrode height couldbe fixed to about 150 nm which isnecessary for stable structures.The height of the contact materialabove the insulating layer is only afew nanometers, increasing thestability of the sublimed Pc-film.Both interdigital electrodes havean active area of about 1000 x 600µm2. The ratio of length to widthof the electrodes can be calculatedto d/l = 1:81.500 for ID1 and d/l =1:13.500 for ID2. The ratio of thetotal film resistances yields a theo-retical value of six.

Despite the stability of thephthalocyanines, it can be as-sumed that strong oxidising gaseslike ozone or ethylenoxide willreact with the Pc film. This leadsto reaction products on the semi-conducting film and to a reductionof the film thickness. Both effectschange the properties of the sen-sor and modify the morphology ofthe film structure. By using twoID-structures and checking the ra-tios of their resistances the sensorelement can be self-monitoring.

Semiconducting films, which weuse in our application, have apolycrystalline structure. Thismeans that the gas not only ad-sorbs on the surface but also pene-trates down into the layer. Thus,gas absorption causes not only achange of the surface resistancebut also a change of resistance per-pendicular to the semiconductinglayer in relation to the concentra-tion gradient of the gas. Currentpaths through the film are depen-dent on the morphology of the

Fig. 2: Structure of a Phthalocyanine molecule and the schematic view of the micostructured sensor substrate

heater

heater

6µ

siliconwafer 100 nm AU

15 nm Ti

500 nm Si3N4700 nm Ti500 nm SiO2

thermoresisstance

interdigitalstructure

Phthalocyaninethin film

PhthalocyanineM= Fe, Co, Ni, Pb, Cu, Zn, Pt, H2

Chip 2mm2

50 100 150 200 250 300 350 4000,0

2,0x10 -7

4,0x10-7

6,0x10-7

8,0x10-7

ratio ofthe fields

electrical field ofthe 6µm ID-structure

electrical field ofthe 2µm ID-structure

Fig.3: Plot of the total static electrical fields of the 2 µm and 6 µm ID structures inrelation to the Pc film thickness. The total amount of the field increases with increas-ing film thickness because Phthalocyanine has higher permeability than air. The ratioof the electrical films decreases with increasing film thickness (compare the middlecurve) which means that the electrical field of the 2 µm structure is more dense in in-ner films than of the 6 µm structure.

tota

l sta

tic fi

eld

(arb

. uni

ts)

ratio

of t

he e

lect

ric fi

elds

E(2µ

m) /

E (6

µm)

film thickness (nm)

4.00

4.50

The Institut für Mikrostrukturtechnologieund Optoelektronik (IMO) in Wetzlar,Germany, developed the sensor sub-strate. Bioclimatic GmbH in Bad Nenn-dorf, Germany, worked at realisationof the ozone monitoring and regulationsystem. This work was supported byDeutsche Bundesstiftung Umwelt inOsnabrück and by theNiedersächsisches Ministerium fürWirtschaft, Technologie und Verkehr inHannover.The substrate with two interdigitalstructures, integrated heater and tem-perature control can be used for resis-tive or capacitive gas measurements. Inaddition, it allows self-monitoring ofthe gas sensitive film which is useful ifthe sensor is employed in aggressiveenvironments.

Partners andfurther applications

electrical field of the 2 µm structure

electrical field of the 6 µm structure

ratio of thefields

PanoramaR&D in MST

COTEC is a Foundation created by morethan 50 Spanish companies and institu-tions, whose mission is to foster techno-logical innovation in Spanish society, or-ganisations and business fields. COTECmainly aims at backing the advancement

of technological innovation, not only as acultural value but also as entrepeneurialbehaviour.

COTEC regulary carries out general andsectorial analysis on technology aspectsof the Spanish economy. COTEC acts asan active technology intermediator,channeling the technological needs ofcompanies to the public and private R &D Centres and also assists the necessarytechnology transfer process.

In addition to other programmes, COTECalso manages the microelectronicsGAME Project, a special initiative jointlyfinanced by the EU Commission and theSpanish Administration. This initiativehas up to now supported several SME`sin the development of more than 100specific projects.

COTEC participates in the DemonstrationActivity Project by covering Spain andPortugal in all three phases of its workpackages. COTEC has commited itself toestablishing, within a period of twoyears, 16 contacts with companies whichwill lead to at least 5 actions plans; fromthese at least one project will be enteredin the Demonstration through the clusters.

In the first work package ( Identificationof the cluster capabilities ) COTEC`s taskwill be to translate relevant material,added to disseminating some elaboratedmaterial in the form of tables in order toclearly show the capabilities of everycluster. Attending cluster seminars will inthis respect be very important.

In the second work package ( Selectingpotential applications all over Europe )the activity agenda will consist of devel-oping various tools and using them to se-lect Spanish and Portuguese candidatesfor the target group.

In order to do this the Spanish micro-system newsletter ( Gaceta de Microsiste-mas ) will be intensively used to publicizethe initiative. The current mailing list willnot only be updated, but also specificallytuned to the objetives of the project; theuse of other sources such as MUST andnational databases will be most useful.Contacts and procedures previously de-veloped under the GAME project will beupdated and re-oriented. In this phasenot only will most of the contacts have tobe established, but also visits have to bepaid to selected companies in order toevaluate the MST potential. Requests bythe companies for information on tech-nology supply will be met. Information onrelevant MST and available local exper-tise will be issued and disseminated tothe target group. Material used under theGAME project will be updated, screenedand disseminated.

In the third work package ( Support fordemonstrator development ) an interme-diary role will be played by COTEC. Thismediation between clusters and compa-nies will be in the form of assistance inthe selection of suitable technologies on atask to task basis.

Finally, information required to be for-warded to the Global Management willbe issued.

Luis Castaner

For further information please contact theauthor at E.T.S.I Telecommunicación, c/ GranCapitán s/n, Módulo C-4, 08034 Barcelona,Spain, Tel: +34 3 401-6878 (-6756 Fax)

Demonstration ActivityProject on MST

BY COTEC - SPAIN

layer (intergrain contacts, grainsize, Schottky barriers, etc.) andthe propagation of the electricalfield in the layer only a smallamount of the static electrical fieldruns in the Pc film. Charge carriermovement is in first order depen-dent on the strength and the or-ientation of this field. Thus, thecurrent from one electrode to theother is also dependent on theelectrical field. Taking into ac-count that the propagation in thesemiconducting layer is moredense if the distance between theelectrodes is smaller, the decreaseof the current with decreasingthickness of the layer is differentin two geometries with differentspacing of the electrodes. This isdemonstrated in figure 3, wherethe total electrical fields of the twoID structures and the ratio of thefields in dependence of the filmthickness is plotted.

Due to the high permeability ofPhthalocyanine, higher film thick-ness causes a higher electricalfield. But, as can be seen from theratio of the electrical fields, thedensity of the electrical field of the2 µm structure also decreasesmore than the density of the 6 µmstructure.

This permits a self monitoringsensor element in that it checksthe ratios of the resistances fromthe two ID structures. A change ofthe layer thickness or morphologyof the film will cause a change inthe ratio. This change can only becalculated under well-definedconditions, e.g. in clean air. It canbe seen from figure 2 that an ab-sorption or reaction of ozone alsochanges the ratio of the two resis-tances even if the sensor is in per-fect working order. This may bedue to different diffusion rates ofthe ozone molecules into the Pcfilm.

Peter Kaul

For further information please contactthe author at SICAN (SIBET GmbH), GarbsenerLandstraße 10, D 30419 Hannover, Tel: +49 (511) 277-0 (-2150 Fax)

Panorama

The production plantMore than 500 years ago (exactly inA.D.1457) the University of Freiburgim Breisgau was established - to en-sure and to promote the wealth andprosperity of its founding society byproducing well-educated and well-trained civil servants. In the mean-time these „products“ also foundmarkets in medicine and the naturalsciences. In this century the Albert-Ludwigs-University more than dou-bled its number of faculties for thisreason. And before the millennium isover a first „engineer of the moderntype“ should leave this alma mater of25.000 students. At least this is theidea of politics and economics.

The place of productionIn the last decades technology hasbecome fashionable and presentableeven at such a traditional institutionlike a university. Moreover, high-techis used to again renew the synergybetween the university and its pa-trons. The university of Freiburg,steeped in the tradition of the humansciences, needs this push towards re-newal. The Upper-Rhine area calledthe REGIO is waiting to cope with thetasks on the threshold between indus-trial and information society. Germa-ny is finding its place within the Eu-ropean and the global markets. Andthe graduates of the university oughtto do their work within these markets.

The productThe graduate of the technical

faculty should be a „mod-ern type - engineer“.

The traditional engi-neer already did hisjob within wide geo-graphical areas.Now the limits onhis professionshould be extend-ed: this new engi-neer is a generalistat the last and aspecialist on time:

the university willprovide for the basic

knowledge, as aschool for basic re-

search and a centre of ed-ucation, and will teach how

to learn during the whole life. And inco-operation with its partners (in ec-onomics) the university will also givea short introduction in the actualproblems in technology. The basicswill provide for the long term usabil-ity of the product „engineer“. The or-ientation towards an application inco-operation with the partners in ec-onomics will induce synergy betweenstate universities and the economicmarket, as well as to make the grad-uating engineer fit for the problemsof the day. Both will make this „prod-uct“ fit for the global market, even inthe long run.

And the products of the product?From a systematic point of view onemight look at the above as a systemwithin a system. Education producesgraduates, graduates produce tech-nology, and technology producesduties - for education. The relation-ship between producer and productcan only be characterised in terms ofcomplex systems. „Bottom-Up“ or „Top-Down“ or even both do not ad-equately describe the dependenciesany more. Terms like fuzzy, neuraland chaotic come much more closerto a correct description of these real-ities. And this terminology is alreadystate of the scientific art.

The outlook... Electronic Microsystems have beenon the „market“ for more than twentyyears. Now they are inducing socialupheaval. System technology nowforces all technologies to miniaturisetheir products (micro-, nano-, ...), toimprove the relationship betweenoutput vs. input, between function vs.consumption, between availability vs.inflexibility. One can tell that extend-ing this principle to „all systems“ willinduce further social problems. Thisis again an argument for the „mod-ern type - engineer“, one who musthave both - social and technicalcompetence.

Volker Krieger

For further information please contact theauthor, at the Albert-Ludwigs-University Frei-burg, Heinrich von Stephan Str. 25,D 79100 Freiburg,Tel: +49 761 203-4207

On a Production Line for MSTMICROSYSTEMTechnologies 96

Residence HotelPotsdamm17.-19. September 1996

Organisers:MESAGOMesse & Kongreß GmbH

Co-Organiser:Fraunhofer Institutfür Zuverlässigkeit undMikrointegration (IZM)Berlin

MST

Data Base

Addresses and profiles

of firms,

R&D institutions,

service institutions

& consultants

Who's Who

Microsystem

Technology

Contact: Mr. A. Botthof, VDIIVDE - IT, D-14513 Teltow, Rheinstr. 10b,

Tel: +49/3328/435-195 (-216 Fax)

Please note

change of date

and place

Panorama

APPLICATIONSPHYSICAL MICROSENSORSToday: Pressure and accelerationsensorsNext future: Hydrophone, geophone, microphone, gyrometerACTUATORSToday: Ink jet printing head, micro-motors, optomechanical switchesNext future: Microscanning, microfluidics

MARKETAutomotive, aeronautic and defense,medical, industry (petroleum prospect ...)

TECHNOLOGIESSingle Crystalline Silicon BulkMicromachining• SOI substrate• Double side chemical silicon

etching (KOH or TMAH)• Multiwafer bonding

(Si/Glas, Si/Si)• Dielectrically insulated

piezoresistive gaugesSingle Crystalline Silicon Surface Micromachining• Thick epitaxy single crystalline

silicon layer on SOI substrate• Deep dry anisotropic silicon et-

ching (20-30 µm)• Collective freeing process

(sacrificial layer SOI buried oxyde)• Capacitive detection• On chip packaging dedicated to

surface microstructuresQuartz Bulk Micromachining• Chemical anisotropic etching• Selective metallization by grazing

evaporation

Possible integration of opticalguides into MEMs

Dedicated technologies for dicing, mounting, packaging

Microsystems at CEA-LETI: MEMS

Wide Temperature RangePiezorestive Pressure SensorTechnology: Silicon Bulk Micromachining

Specifications:Sensor size: 6.3 mm by 6.3 mm (170 pcs/4“ wafer)Temperature range: -20°C < Trange < 160°CFull scale: 0 to 2 Bars full scaleSensitivity: 22 mV/vLinearity: 0.01%Offset shift: (after 450h at 160°C) < 0.1% of full scale

Automotive Absolute Pressure SensorTechnology: Silicon Surface Micromachining

Specifications:Sensor size: less than 1 mm(5500pcs/4“ wafer)Temperature range:-40°C < Trange < 125°CFull scale: 0 to 1 BarSensivity: 3 Pf/BarAccuracy < 2%

Automotive AccelerometerTechnology: Silicon Surface Micromachining

Specifications of 50 G type:Sensor size: 2 mm by 2 mm(1700pcs/4“ wafer)Temperature range:-40°C < Trange < 125°CFull scale: 50 GSensitivity: 3 fF/GLinearity < 1%Accuracy < 1%

Specifications of 2 G type:Sensor size: 2 mm by 2 mm(1700pcs/4“ wafer)Temperature range: -40°C < Trange < 125°CFull scale: 2 GSensitivity: 75 fF/GLinearity < 1%Accuracy < 1%

A Series of LETI´s Activities in MST

KEY PRODUCTS

For further information pleasecontact: LETI MEMsStephane RenardLETI-DMITEC Tel.: (33)-76-88-94-47

Panorama

The MEMS industry is still in anembryonic stage. Although

some sectors are already very ad-vanced, others are only just begin-ning to show their future poten-tial. According to VLSI ResearchInc, the semiconductor industrymarket research specialist, suchnewly emerging technologies havehistorically borrowed or adaptedequipment and process technolo-gy from related fields and MEMSis no exception, borrowing heavilyfrom the semiconductor IC indus-try. Because of the easy conversionof semiconductor manufacturingtechniques to Micro-Electro-Me-chanical Systems, a rapidly grow-ing market is emerging in the Eu-rope, USA and Japan.

While integrated sensors arepresently the largest application ofMEMS, new applications are con-stantly being developed. Opticalcomponents such as lenses, grat-ings, waveguides, mirrors, lightsources and detectors can all bemicrofabricated. Other developingapplications include fluid control,valves, electromechanical switchesand relays, gyroscopes, inkjet noz-zles, fuel injectors, micromanipu-lators and connectors.

The MEMS market today, repre-sented primarily by sensors,stands at slightly over $1B accord-ing to VLSI research. Various fore-casts have the market growing toanywhere between $3B and $14Bby the end of the decade. Much ofthis growth will result from ad-vanced sensor applications andfrom new optical switching appli-cations.

While the list of potential appli-cations is impressive, cost-effectivefabrication of these devices will

depend largely on advancementsin microfabrication technology. Anumber of semiconductor equip-ment manufacturers in Europe,USA and Japan already participatein the MEMS equipment marketor are developing equipment andprocesses for that market.

Even though many existingtypes of semiconductor manufac-turing tools have been used in oneway or another to fabricate micro-systems, these tools are not optim-ised for the MEMS process re-quirements. Integrated MEMS fab-rication requires advancements inhigh aspect ratio and „three di-mensional“ capability in lithogra-phy, doping, etching, planarisa-tion, CVD, PVD, inspection andbonding. New packaging and testtechniques will also need to be de-veloped to deal with the combinedmechanical and electrical interfac-es and connections.

It has been estimated that 60 %of the industry’s equipment needsare currently met by semiconduc-tor based systems, but in three tofive years standard semiconductorequipment is likely to satisfy only10 % of the MEMS industry re-quirements. New, advancedequipment capable of meeting thespecialist process needs must bedeveloped.

However, the equipment manu-facturers are not all enthusiasticabout jumping onto the MEMSbandwagon.

Firstly, the semiconductor in-dustry is booming and most arestruggling to meet demands beingplaced on them for equipment de-liveries out through 1996. They mustsatisfy their existing core business

and customers if they are to surviveand are therefore reluctant to diverteffort and attention to a new marketwith a well defined potential some-where out into the future.

Secondly there is the validity ofthe MEMS industry growth pro-jections being made. They knowfrom experience that new technol-ogies do not gain dominance asquickly as enthusiastic punditslike to forecast. An example of thiswas the introduction of surfacemount packages for IntegratedCircuits. In the early 1980’s it wasbeing claimed by some that theChip Carrier package would ac-count for 25 % of all IC packageswithin 3 years. They failed to rec-ognise the momentum of estab-lished technology and the inabilityof the industry to re-tool board as-sembly production, made suchprojections totally unrealistic.

For the smaller equipment com-pany, the costs associated with de-veloping new systems for anemerging industry can be disas-trous. The company invests heavi-ly to meet projected demands thatprove not to materialise and theyeventually go out of businesswhile waiting.

The demand for specialisedequipment is going to come andthe companies that have the rightsolution at the right time will reapthe rewards.

Bob Mariner, Dick Dexter

For further information please contactthe authors: Bob Mariner,Strategic Marketing Services,+44-1234-210215Dick Dexter, VLSI Research Inc.+1-408-453-8844

Manufacturing Equipmentfor an Emerging IndustryThe Micro-Electro-Mechanical Systems (MEMS) Industry needs

specialised manufacturing equipment as it moves into the volume production phase. Will this equipment be availablewhen it is needed, at the right cost and with the right features?Is the manufacturing equipment industry ready to respond tothe new demands?

The MEMS industry and the manufac-turing equipment companies will need

to start working more closely together. Itis not in either sides interest to ignore theopportunities or the difficulties: • What are the critical

technologies? • What are the special process & equip-

ment needs? • How fast will the market evolve?• What are the economics?

Panorama

Technology Backplane

e-beam writing is presently oblig-atory for the definition of the pri-mary mask, or master of a highspatial frequency diffractive ele-ment. This is therefore the cornerstone of the whole project. Centraldevelopment activity has occuredat Friedrich-Schiller-UniversityJena (FSU) on the basis of JenoptikTechnologie machines ZBA23Hand LION LV1. This tandem ofmachines enables practically allthe potential of electron-beamwriting for diffractive optics to befully exploited: high speed multi-level hologram direct writing,smooth curved lines, stitching-free writing, mix-and-match pos-sibility between the two ma-chines, and an increased data stor-age capacity. FSU has been the in-dispensible application laboratoryfor the testing and improvementof these two e-beam writers. Theyhave been the source of most pri-mary masks and masters of theproject and have guided the part-ners to the objectives which canreasonably be expected from themost advanced e-beam writingtechnology. (see figure 1) The re-sults and products of these twopartners are well covered in theMarch issue of Opto & Lasers Eu-rope (OLE).

In addition, Präzisionsoptik Ge-ra has upgraded a ZBA21 and astepper AUR2 with modern com-puter hardware and software inorder to specifically dedicate themto the writing and transfer ofDOEs. The ZBA can now admitCAD softwares DXF, ZIFF andRFT. Binary and multilevel teststructures have been written andevaluated. CSEM Swiss Center forElectronics and Microtechnologyhave also contributed in e-beammask writing of most gratings rel-evant to encoder objectives.

Photolithographic mask transferis one of the approaches to lowcost fabrication of short pitchDOEs (the other one is replicationtechnologies). This is a very chal-lenging step since the feature size

EUROPROJECT for Optical Microsystems

EU-922 FOTA is a 3 yearEUREKA project involving27 partners from 5 coun-tries of which 18 are in-dustrial companies, 4 areR & D institutes of technol-ogy, and 5 are university groups. FOTAwas not originally conceived as a micro-system project. It was rather aimed atdeveloping and gathering the technolo-gies and design tools for the fabricationof the diffractive or refractive opticalchip which is the central core of an mi-crosystem. The miniaturization of an op-tical system requires flat optical elementswhich have high numerical aperture. Fordiffractive optical elements and diffrac-tion gratings, this means short, wave-length scale periods in order to achievelarge angular deviation, clean light dis-tribution and recombination conditionswhich do not resort to expensive andcumbersome spatial filtering. In FOTA,this technological development is drivenahead by applications known to havemarket potential such as displacementencoders, optical backplanes, biochemi-cal sensors and various compact func-tional modules. The Consortium is there-fore composed of tool and process mak-ers, of end-user driving companies, andof interface groups performing the mod-elling, the process development, the opti-cal characterization, and the laboratoryprototyping for the end-users.

Some tools and processes do exist forthe fabrication of short period DOEs. Butthey are generally not specifically forDOE processing, and they are not con-centrated at a single place where end-users could readily subcontract a full jobcomprised of a complete set of process-es. On the other hand, end-users, whichare mostly SMEs (KMU/PME), are notoften aware of the great potential whichhigh spatial frequency diffractive opticsrepresents for new generations of lowcost and high-end products. Thus, theprimary assumption of the present EURE-KA initiative was that only a consistentEuropean effort could link the dispersedand non-adapted fabrication potential ofvarious tool makers together with the notyet fully expressed needs of end-users,and speed up the progress of flat opticaltechnologies towards marketable appli-cations. The FOTA project also serves as

a useful experience re-vealing how high spatialfrequency DOEs shouldbe fabricated and inte-grated into systems.

FOTA is organized to prevent the cen-trifugal logic of a large project based ona national funding scheme (characteris-tic of the EUREKA programme) and inorder to focus an important part of thepartners' efforts onto well-defined prod-uct goals. FOTA is now at the end of itssecond year and the first results are ap-pearing. These were presented at thesemi-public exhibition at partner ENSP-Strasbourg, end of October 95.

FOTA was structured as a TechnologyBackplane with applications subprojects.Some of the main results are reported inthis article.

Fig. 1: 350 nm period grating withsmoothly curved grooves

FOTA (Flat Optical element Technologies and Applications)

Fig. 2: Holographic Cr mask transfer of a0.6 µm thick resist film

Panorama

to be transferred is of the order ofthe transfer wavelength. Two ap-proaches have been undertaken:

• Holographic mask transfer froma conventional chromium maskby Holtronic Technologies (-HOL), Switzerland. This compa-ny has further developed itstransfer installations and pro-cesses. One micron period radialgratings can now be transferredover large size substrates of dif-ferent sorts. The transfer of 0.5micron periods over 6 x 6 inchsubstrates is within reach. (seefigure 2)

• Karl Süss (KS) has designed amodified MA4 mask aligner toallow for the implementation ofshort period grating transfertechnique under oblique inci-dence. With illumination at 313,365 and 435 nm wavelength, awide range of grating periodsbetween 200 and 1000 nm can betransferred. The transfer condi-tions were studied by CSEM,Neuchâtel, and LOE Marseillewithin the companion BRITEproject BE-5720.

With a surface relief profile in anorganic film at the surface of anon-organic substrate it is impor-tant to perform the proportionaltransfer of the profile into the sub-strate with fidelity. This study re-quires a number of callibrationsteps for each interesting "resist-substrate" pair involving all tech-nological parameters. This wasperformed by the Institut fürOber-flächenmodifizierung Leip-zig (IOM). Proportional transferrules have been established for bi-

nary and multilevelDOEs in quartz. Thelimits beyond whicha profile pre-distor-tion is needed havebeen determined.

Replication tech-nologies (i.e. hotembossing, UV cast-ing, and injectionmoulding of organicmaterials using ametal shim) repre-sent the second andmore powerfulmeans of achievinglow cost gratingsand DOEs. Most ofthe applicationgoals of FOTA relyupon the ability ofthese technologies tonot only replicatesurface relief mas-ters with fidelity in the profile butto also preserve the high absoluteaccuracy features of a DOE. PaulScherrer Institute Zürich, 3D Ltd,Switzerland as well as the newpartner Epigem Ltd, UK, are ac-tive in the experimental evalua-tion of the potential of replicationtechnologies for technical applica-tions.

As a conclusion to the progressreport on FOTA's TechnologyBackplane, it can be anticipatedthat all technological processesand tools will be ready at the pro-ject end, towards the end of 1996,and thus constitute a homogene-ous set of tools for the fabricationof high spatial frequency diffrac-tive elements.

Applications of Diffractive Elements

Industrial partners at the end-userside are encouraging the techno-logical developments of neededDOEs and grating chips, and areundertaking the full developmentat the (micro)system side.

Submicron period gratings ofhigh spatial coherence on largeguidance slab waveguides repre-sent a powerful detection meansfor various chemical and biologi-cal species. High spatial coherence

can be obtained by the stitching-free writing of the LION LV1 ma-chine. A collaborative actionbetween FSU and CSEM hassolved the problem of writing,transfer and etching of such wave-guide sensor gratings. The resultsstem partially from the companionBE-5720 project.

The 2nd project year has wit-nessed industrial prototypes ofhigh resolution rotation and trans-lation encoders for the end-usersBaumer Electric and Société Gene-voise des Instruments de Physiqueunder the guidance of CSEM andwith the support of several part-ners from Finland, Germany, UKand Switzerland in an intense col-laborative effort. (see figure 3)

Research and development ef-forts are continuing in the applica-tion field of Optical Interconnectsunder the guidance of ThomsonCSF. Their goals are diffractivedistribution and broadcasting forMulti-Chip Modules and opticalbackplanes. (see figure 4) The de-sign and calculation of the distri-bution patterns and related grat-ings and holograms are the respon-sibilty of Heptagon Oy and Helsin-ki University of Technology (HUT)and ENSPS and D.O.C., Stras-bourg. The related development onthe technology side is by HOL,Switzerland, concerning photolith-

Fig. 4: Grating matrix backplane for signal broadcasting

Fig. 3: Rotation encoders delivering a sinusoidalave output with 120 000 periods per revolution

Panorama

ographic transfer of large sizeplates; and IOM Leipzig performthe RIBE etching into the flat dis-play glass types suggested byCorning Europe, France.

Another field of applications isthat of Fourier-plane and Fresnel-region DOEs for lenses, fan-out ele-ments and various optical mod-ules. Two approaches have beenconsidered: the very fast 16 leveldirect writing by FSU's ZBA23H af-ter D.O.C.'s optimization (3 minwriting for a 3 x 3 mm holo-gramme), the high-frequency-carri-er approach of HUT by the samemachine, and possible HOL's andKS's high spatial frequency photo-lithographic transfer.

A number of applications havebeen developed by some partnerson a more restricted cooperativebasis: Jenoptik Jena on a monolith-ic, multifunction Fresnel lens to be

used in their Laser DopplerAnemometer, Carl Zeiss Jenaon a lens array for their wavefront sensor.

Graded Index Optical Elements

This application subprojectdoes not concern submicronfeatures. Its technology (ionexchange in glass) representsa useful complement to thecorrugation technologies ofthe other SPs in that it pro-duces a perfectly flat surfacetopography and leads to mi-cro-refractive elements ofhigh numerical aperturewhich is an advantage forelements such as laser couplingmodules. Two lines of possibleproducts have been identified anddeveloped under the guidance ofFraunhofer Institut IOF, Jena, withthe modelling support of Optonex,Finland, and fabrication by IOFand HUT:

• Balanced 1 to N (N small) powersplitters using grating phasezones of controlled cylindricalprofile so that the diffraction or-ders have equal power and a de-sired phase relationship whichleads to beam splitters/recom-biners for non-degenerate inter-ferometric signals.

• Aberration-corrected, high nu-merical aperture cylindrical lens-es and lens arrays for lasercoupling modules. IOF are as-sisted in the assembling opera-tions and in the market evalua-tion by a partner of the Germansubconsortium: OECA Berlin.Potential industrial applicationsinclude high-quality beam shap-ing for laser-waveguidecoupling, micro-laser pumping,distance/displacement sensing.

Olivier Parriaux

For further information please contactthe author atFriedrich-Schiller-Universität Jenac/o Dr. Kley,Tel: +49 3641 6576-47 (-80 Fax)

Fig. 5: A series of cylindrical microlenses for highpower diode lasers

As a whole, the R & D work per-formed within FOTA is reaching

the prototyping stage in the majorityof its industrial goals. It has beencharacterized by a wide and fruitfulexchange of ideas and know-how,and by important collaborative effort.

So far, most demonstrations havebeen of direct electron-beam writingand non-organic technologies. A pointof concentration in the future will bethe assessment of the functionality ofthe replicated elements for the techni-cal applications aimed at in FOTA.

Already FOTA industrial partners ofthe technology backplane are offeringtheir machines and related processesfor the necessary fabrications steps ofhigh spatial frequency DOEs, whereasinstitutes and university groups areproposing their expertise for the proto-typing of new elements as well as ofthe microsystems involving them. Themodelling groups and companies arealso ready to design structures andsystems involving short and large fea-ture sizes with their insight into thesystem's functionality and the currentlimits of technological possibilities.

FOTA has now reached the point atwhich the consolidation of its techno-logical potential and its industrial ex-ploitation for microsystems will be de-bated.

Conclusion

• 3D Ltd., Unterärgeri (CH)• Baumer Electric, Frauenfeld (CH)• CSEM, Neuchâtel (CH)• Holtronic Technologies, Marin (CH)• IMT Masken und Teilungen,

Greifensee (CH)• Paul Scherrer Institut, Zürich (CH)• Société Genevoise des Instruments de

Physique, Meyrin (CH)• Carl Zeiss Jena GmbH, Jena (D)• ENSP Strasbourg,

Illkirch-Graffenstaden (D)• Fachhochschule Jena, Jena (D)• Fraunhofer Institut IOF, Jena (D)• Friedrich-Schiller-Universität IAP,

Jena (D)• Institut für Oberflächenmodifizierung,

Leipzig (D)• Jenoptik Jena, Jena (D)• Karl Süss GmbH, Garching (D)• Präzisionsoptik Gera, Gera (D)• Corning-Europe, Avon (F) • Diffractive Optics Consulting (F)• ENSP Marseille, Marseille (F)• Thomson CSF, Orsay (F)• Epigem Ltd, Cleveland (GB)• Fisons Applied Sensor Tech.,

Cambridge (GB)• Oxford Instrument, Bristol (GB)• Helsinki University of Technology,

Espoo (SF)• Heptagon Oy, Helsinki (SF)• Optonex Ltd., Espoo (SF)• Terapixel, Espoo (SF)

Partners of FOTA

MST Online

Microsystems Prototyping Laboratory

The Microsystems Prototyping Laboratory (MPL)at Mississippi State University represents a grow-ing presence in the government, industrial, andacademic research communities. By aligning its ca-pabilities with existing and projected Departmentof Defense projects relating to a variety of micro-system topics, the MPL provides a state-of-the-artresearch environment in the following areas: • VLSI design and test • Microsystem specification, design, and test • VHDL (VHSIC hardware description

language) modeling, simulation, and test • Military microcircuit obsolescence • Multimedia technology development

http://www.erc.msstate.edu/mpl/mpl-home.html

SEMI

Semiconductor Equipment and Materials Interna-tional (SEMI) is an international trade associationthat represents semiconductor and flat panel dis-play equipment and materials suppliers. Foundedin 1970 in the United States, SEMI has evolved intoan international organization committed to freetrade and open markets. SEMI's primary goal is tohelp its members expand their global marketingopportunities and improve access to their custom-ers and industry, government and civil leaders.

SEMI has more than 1,600 member companies lo-cated in North America, Asia and Europe. Theirproducts and services contribute more than $42billion to the world economy. Success in the semi-conductor industry typically requires an interna-tional effort. SEMI members that market productsand serve customers world-wide often rely on thelocal expertise of SEMI employees at these offices.

http://www.semi.org/

FZI MRT Project ELISA

Development Tools for Sensors and Actuators inthe Area of Microsystem Technology

http://www.fzi.de/divisions/mrt/projects/elisa.html

Microsystems GroupDepartment of MicroelectronicsCTU in Prague

Research Activities (Projects)• Semiconductor Microsystem Structures• Sensor Signals Processing• Sensor Signals Wireless Transmission• Sensor Control Systems• Biomedical Sensors• Flowmeters• Temperature Sensors • Pressure Sensors

http://www_micro.feld.cvut.cz/pages/system.htm

INTERNET (WWW)

New MST/MEMS related Web-Sites

ESPRIT • ESPRIT • ESPRIT • ESPRIT • ESPRIT • SYNOPSES OF PROJECTS • January 1995

8520 MUSTMicrosystems: usage, strategies andtechnology

8756 DEMACDesign and Technology Methodologyfor ASIS Cells

8730 AIMFEDActive Interest for Multimedia with Field-Emission Display

8173 BARMINTBasic Research for MicrosystemsIntegration

9011 SLOPSYSIntegrated Smart Low-Power Microsy-stems

8902 MICROMEDESModular Microsystem for Medical DrugRelease

6175 OMI/DISOMI Dissemination Project

8867 VISTAVisual Integrated Smart SensorReal-Time Applications

6874 MASSMicrosystem Analysis and SimulationSystem

6143 EXACTExploitation of Asynchronous CircuitTechnologies

6505 AMISApplication Modular IntegratedSensors

7101 MINOSS

Micro-Integrated Intelligent Optical

Sensor Systems

6416 MAXIMAMulti-Axial Monolithic Integrated Accelerometer

8897 INTERIntelligent Neural Interface

6374 M3-GASMaterials, Methods and Microtechnolo-gies for Selective Gas Sensing

5386 OMI-MAPOpen Microsystems Initiative:Microprocessor Architecture Project

7217 NEXUSNetwork of Excellence in MultifunctionalMicrosystems

7793 NEXUS-PAN

6240 B-ASICSBio-Sensitive ASICS for SmartSensors in Medical and EnvironmentalMonitoring

8122 ULTIMAUltrasound imagingwith an intelligent probe

8736 IMICSIntegration of Microcomponents in anInterventional Cardiac Catheter

Micro-Integrated Intelligent Optical Sensor Systems• develop a unified design methodol-

ogy for micro-integrated opticalsensor systems

• design a corresponding library ofmodules and general buildingblocks

• demonstrate these results.

The design methods and block de-scriptions will be embedded in exist-ing tools to speed up the design pro-cess while reducing the risk of intro-ducing errors, inconsistencies or in-compatibilities. A central goal is todevelop methods and tools that caneasily migrate to the design environ-ments available to SMEs. The targettechnology is conventional analogueCMOS with state-of-the-art transistorline-widths.

The following three demonstratorswill be used to test and validate theresults:

• a single optical element for remoteactive fibre-optic colour measure-ments of physical parameters, suchas measurements of blood oxygen-ation levels

• a linear array of sensors for indus-trial process surveillance and con-trol using a pocket spectrometer

• a bi-dimensional array of sensorsfor use in an „intelligent“ camerafor industrial/environmental controland interactive video applications.

Starting date: 1992-07-01Duration: 36 months

Contact:Istituto Trentino di CulturaVia S. Croce 7738100 TrentoITALY (IT)Maloberti, FrancoTel: +39-461-810105Fax: +39-461-810851

Partners:Mietec (BE)Intracom SA-Hellenic Telecom.& Electr.Industry, Attiki (GR)Univ. degli Studi di Pavia, (IT)Univ. of Kent, Kent CT2 7NZ (GB)Forschungsges. Joanneum Research,Graz (AT)National Technical University ofAthens (GR)Kapsch, Wien(AT)

Sour

ce: C

ordi

s

Micro-Integrated Intelligent Optical Sensor Systems (MINOSS)

MST at CEU

BE 5720 BRE2-0288 (FOA)High efficiency wave front shaping inte-grated optic flat optical antennae

BE 7028 BRE2-0525Sensors and mechatronic devices usingferroelectric thin films(SEMDEFT).

BE 7596 BRE2-0579Shape memory alloy micro actuators for medicalapplications (SAMA).

BE 7250 BRE2-0929Development of new dielectrical and op-tical materials, testing and comparisonwith existing polymers and applicationin multi-chip-modules.

BE 5094 BRE2-0145Design methodology for microenginee-red fluid devices.

BE 8073 BRE2-0615Photo-assisted catalysis of electroless deposition (PACE).

BE 7645 BRE2-0973Design and process technologies for MSTto improve lifetime performance and redu-ce costs.

BE 7838 BRE2-0596

Micropump based on liga & silicon

technology (MICRO-BLAST).

BE 7121 BRE2-0917Basic studies on field emitter arrays,microguns: characterization and appli-cations.

BRITE-EURAM • BRITE-EURAM • BRITE-EURAMDOMAIN: MICRO-ENGINEERING/MICROSYSTEMS • SYNOPSES OF PROJECTS • January 1995

Micropump based on LIGA and Silicon Technology (MICRO-BLAST)

The objectiveof the project

is to perform funda-mental research on the

fabrication and modellingof plastic micropumps manufacturedby LIGA technology. The research ef-fort will be dedicated to the follow-ing aspects:

• design and modelling of micropumps

• characterisation of properties ofthe structural materials

• fabrication of LIGA based workingmodels of a micropump

• analysis of the micropumpcharacteristics

• analysis and comparison of the sili-con micromachining and LIGAtechnology

Recent Advances:

The objective of the modelling is toimprove the functionality by estab-lishing a coupled fluid-mechanicssolver. This can be used for optim-isation of the design, based uponthe empirical results of plastic micro-pumps. Already a coupled fluid-me-chanics solver has been established

within the project, severalplastic micropumps havebeen fabricated and thefirst test results are avail-able. In addition, alterna-tive mould inserts havedemonstrated the utility ofsilicon micromachining(sc. dry etching) as the ba-sis for a further replicationprocess. The coupled fluid-mechanic solver can be usedfor several fluidic devices such aswalls, valves and membranes. Re-sults, i. e. technical data will be for-warded on request.

Starting Date: April 1994Duration: 36 Months

Contract no: BRE2-0596Proposal no: BE-7838

Keywords:MicroengineeringInstruments/Sensors/Precision equip-ment

Design; Dynamics/Fluid dynamicsMultimaterial; Medical/Biomedicalequipment

Prime PartnerMESA Research InstituteUniversity of TwenteP.O. Box 217NL-7500 AE-EnschedeThe Netherlands

Contact:Dr. Job Elderstel: +31/53/4894264fax: +31/53/4358259e-mail: j.elders@eltn.utwente.nl.

Partners:IMM Institute of MicrotechnologyGmbH3T B.V.

ews is pleasedintroducelow projects,rey projectseen introducedts previous issues,black projectsbe introducedthe future.

MST at CEU

Technology Transfer

Advanced Microsystems forAutomotive ApplicationsDecember 2-3, 1996 in Berlin,Germany

Following the successful event "Microsystems - Key to Automo-tive Safety Concepts," we are now happy to announce the Con-ference "Advanced Microsystems for Automotive Applications"to be held in Berlin on December 2-3, 1996.

In order to realise innovative technological solutions and to im-prove existing systems for automotive applications, miniaturisedelectric components are indispensable. Microsystems technolo-gies play the key role for these components. This conferencewill be a platform to discuss microsystems for three main appli-cation areas: Safety; Convenience and Reliability; and Perfor-mance and Economy.

Should you be interested in presenting a paper, please send anabstract in English with no more than 200-300 words no laterthan June 14, 1996 to the conference secretary. The abstractshould clearly describe the scope, keypoints and significance of the paper. Selec-tion of papers will be made by August 30,1996. The final camera ready manuscriptof accepted papers should be submitted byOctober 31, 1996. There will be instruc-tions on text layout and pictures for the fi-nal version of the contribution. Abstractsand all other correspondence should besent to the conference office.

Registration before October 31, 1996: DM 950,- Registration after October 31, 1996: DM 1100,-

This will include documentation, lunch for both days and a conference banquet on December 2,1996.

Call for Papers

Call for Expression of Interest

Microsystems inManufacturing Equipment

and ProcessesEuropean Technology and Partnership Exchange Day

Berlin, Germany, Nov. 21-22, 1996

To aid companies in the innovation process by integrating mi-cro-technologies and microsystems into their products, VDI/VDE-IT and Anvar, the French agency for innovation, are preparinga European Technology and Partnership Exchange Day. Thegoal of the event is to bring together developers and users of in-novative microtechnologies in order to initiate joint industrializa-tion and development efforts for new components and systems.To realize this aim the organizers will select technology offerswhich correspond to a clearly stated demand from industrialcompanies. The event addresses applications in me-chanical engineering, robotics, special machinery,

production technology, etc. Devel-opers of microtechnologies forthese areas, as well as industrialusers, are invited to contact the or-ganizers to present their innovativeideas and their needs, respectively.

The selected technologies will be presentedto interested companies in a catalog of of-fers and proposals before the event. In ad-dition, the suppliers will have the opportu-

nity to present their institution and their know-how in short oralpresentations. Interested companies will then have the opportu-nity to meet confidentially with suitable suppliers to discuss pos-sible cooperations. Offers will include microtechnologies readyfor industrialization as well as proposals for joint developmentprojects. Anvar and VDI/VDE-IT will follow up the event and pro-vide support to the participants in preparing their joint activities.Funding for transnational research projects will be availablethrough the respective national programmes.

VDI/VDE-IT Innovation Relay Centre ANVAR - Dr. Andreas Schütze Nathalie DelormeTel:+49 3328 435-237 (-256 Fax) Tel: +33 1 40 17 83 00e-mail: schuetze@vdivde-it.de Fax: +33 1 49 24 96 31

Organisation

Contact

Services to Make Your Organisation More CompetitiveThe Innovation Relay Centre Northern Germany offers a setof services that are preliminary focused on MicrosystemTechnology products.

The objective is to bring together research and industry in or-der to accelerate the introduction of MST in products andprocesses.

“Innovation is more than a technology exploitation ef-fort. It is about people and how they translate technicalideas into products and services that the marketwants.”The European network of Innovation Relay Centres canhelp your organisation achieve this goal.

Conference Office:VDI/VDE-ITInnovation Relay CentreRheinstraße 10 BD- 14513 Teltow

Christel Thomezcek, Ariane ConradTel: + 49 3328 435-153 (-256 Fax), e-mail: amaa@vdivde-it.de

Conference Organisation:VDI/VDE-ITInnovation Relay Centre Detlef Egbert Ricken

The Innovation Relay Centres

For a Broad Range of Experience in Microsystems

Europractice

News from Manufacturing Cluster 3

Services on Offer

MicromachiningMicromachining of substrateswhich may already contain elec-tronic circuitry, typically siliconwafers but including glass, quartzand sapphire, occurs in a series ofarea selective etching and deposi-tion processes. The available pro-cesses include:

• Deposition of polysilicon• Vacuum deposition of metals• Deposition of insulators • Photolithography • Magneto/electro-active layers • Wet chemical etching • Reactive ion etching

The service provides access to therange of deposition, etching andlithography tools with character-ised, tested and quality controlledprocesses. Amongst the widerange of available techniques, theservice provides particular exper-tise in:

• Formation of oxide and nitridelayers and multilayers

• High purity poly- and amor-phous silicon

• Electrically active crystalline andoriented polycrystalline oxidematerials

• Vacuum deposition of a widerange of metals and magnetic al-loys

ElectroplatingThis technique is used to build upa patterned area, defined usingphotoresist, of electrically con-ducting material onto a suitablesubstrate. This technology, in com-parison to general silicon process-es, has the following advantages:

• Vertical walls with large aspectratios

• Wide choice of plating materials• Multiple level fabrication (3D

structures)• Release to form free standing

structures• Large process volumes and

areas

Resist patterns can be com-plex, forming structures intheir own right. One advan-tage of electroplating is itsability to maintain structureheight for varying aspect ra-tios. Another benefit derivesfrom the ability to plate dif-ferent materials on top ofeach other and the use of dif-ferent patterns in each layer,to form multi level struc-tures. Structures can also bereleased from a substrate byusing a sacrificial layer.

3-D microformingExcimer laser ablation en-ables complex precision

three-dimensional microforms tobe manufactured directly in arange of materials to depths fromhundreds of micrometres to milli-metres or centimetres. Laser abla-tion is a heatless process occurringduring 10 nanosecond pulses froman excimer laser operating at 193or 248 nanometre wavelength. Asingle laser pulse will cut into or-ganic materials to a typical depthof 0.1 - 0.2mm. At a repetition rateof 100Hz the laser will cut downto 100mm in 10 seconds. Laser ab-lation offers:

• Very deep structures• Vertical walls• Wide variety of materials

MaterialsThere are many instances whenmicrosystems require other mate-rials and technologies to be usedeither alone or in conjunction withCMOS in order to provide a man-ufactured product. These includethe use of:

• Photosensitive glass• Anodic and frit bonding• Polymers

Freed from the restrictive rulesand materials imposed by usingCMOS alone, this enables the clus-ter to offer designers a much wid-er range of product possibilities.Photosensitive glass can be pat-terned photolithographically and

This article describes in detail the services on offer from Manufacturing Cluster 3. There is also an overview on page 33 in the ‘EUROPRACTICE news’ section.

Single IR element of their 2D array (onthe back of insert titled IR Detectors) bycourtesy of CRL

uter generated hologram (on the back of insert titledCoating / Micromoulding / Lamination)

by courtesy of Epigem

Europractice

wet etched to produce micro struc-tures. Successive layers can belaminated together to form com-plex structures which are thenheat treated to produce a singlecomponent material with ceramic-like properties.

Synthesis, formulation and pro-cessing of a wide range of specialitymaterials, particularly polymers,for coatings and films are offered bythe cluster. These include photocur-able resins, conducting polymers,fluorinated polymers, filled ther-mosetting resins and functionalpolymers all of which can havetheir properties tailored to suit spe-cific applications. Moulding, inconjunction with electroplating, canalso be carried out as well as em-bossing and coating with both ac-tive and passive polymer films.

Packaging and Joining TechnologyAll microengineered and electron-ic products ultimately requirepackaging and joints for intercon-nection. Such joints are, historical-ly, the most likely to be a product’sweak spot. The cluster has exper-tise that extends to more than 40microjoining technologies includ-ing:

• Anodic bonding• Laser - welding, soldering, adhe-

sive curing and cleaning• Resistance seam sealing• Wire bonding

• Cold pressure welding• Soldering and brazing• Adhesive bonding

This expertise exists acrossMC3 but particularly exists ina dedicated microtechnologycentre specialising in materi-als and joining technology forceramic, glass, polymers andmetal components. This cen-tre can assist in the packagingof components to meet techni-cal requirements in a cost ef-fective manner

Example Application Areas

Optical SystemsMicrosystems may requirecompact micro-optical compo-nents for illumination, sensing orother optical functions. Interfer-rence and diffractive optical com-ponents, such as Fresnel lenses,gratings or computer generatedholographic components, can beused to filter, focus, split, disperseor distribute light. The surface re-lief structures and compositionalgrading required to produce thesecomponents can be manufacturedby using a range of micromachin-ing processes offered by Europrac-tice partners. In addition the clus-ter offers routes to cost-competi-tive manufacture of these compo-nents by use of selected polymermaterials, coating and embossingprocesses.

Microlens arrays, used for bar-code readers, detector arrays and3D imagingsystems, canbe manufac-tured by em-bossing on aglass substrate.Experience in the manufacture ofpolymer waveguide devices usedfor sensing, distribution of opticalsignals and optical signal process-ing also exists within the cluster.These are lightweight, flexible,large area, free from EM interfer-ence and can be manufactured inlarge volumes. Key to many opti-cal microsystems is the ability toprecisely align optical compo-nents. Such structures, manufac-tured as an inexpensive polymerreplica by reactive injectionmoulding, also form essential

interfacing components as locationtools for optical fibres and optoel-ectronic components.

IR DetectorsInfrared detectors of various typeshave been developed within MC3including both pyroelectric, ce-ramic and polymer, 1D and 2D ar-rays. One example is a spectrome-ter based on a linear infrared ar-ray. This array contains 70 detec-tors and utilises in-line thermalisolation with the polymer form-ing a dielectric absorber. The sen-sitivity is 2000V/W which cou-pled with the fast response timeallows collection of information inthe spectral range 4-20mm withina few milliseconds. A second ex-ample is a 100 x 100 pixel 2D arraywhere the outputs of the individu-al detectors are connected directly

to an underly-ing full customCMOS circuit.Unlike otherhigh sensitivityarrays this does

not require cooling and has aN.E.T.D. of 0.05°K when operatedwith f1 optics at 25Hz.

Neil Cade

For further information please contactthe author at: Manufacturing Cluster 3Co-ordinating Office, GEC Marconi Ma-terials Technology - Hirst DivisionElstree Way, BorehamwoodHerts. WD6 1RX UKTel: +44(0)181-732-1383 (-0100 Fax)Email: mc3.europractice@gecm.com

Scanning catheter, an example of biocompatible inteconnection and packaging technology by courtesy of

GMMT, a GEC-Marconi company,have a background of supplying mi-crosystems for a wide range of marketsand activities.CRL, a wholly owned subsidiary ofTHORN EMI, undertakes design, devel-opment prototyping and manufactureof all types of microsystems.Epigem, a management buyout com-pany from ICI, are specialists in poly-meric materials handling and productdevelopment leading to manufacture.TWI is one of Europe’s largest inde-pendent contract R&D organisationsand works with industry to apply join-ing technology effectively.CMF, part of CLRC, is a governmentand industrial R&D laboratory workingin micro and nanoengineering for mi-crosystems.

Member Profiles

EUROPRACTICE news

Talking to Customers

So what should we do to helpthe potential users of our ser-

vice? Well, one answer was sug-gested during the recent Demon-stration Activity (DA) workshop –make sure that the service offeredto the user is clear but hide the un-necessary detail of our internalproject organisation from them.

If an individual ManufacturingCluster is really effective in pro-viding the best service, does itmatter to the customer to knowwhich individual partner/asso-ciate partner in that Cluster is in-volved or how the work was allo-cated between the members ofthat cluster?

Our customers are being drivenby the need to speed up their de-velopment cycle and increase thefunctionality and value of theirproduct. Hopefully EUROPRAC-TICE will help them achieve both– especially if we make our com-plex internal organisation effectiveand provide simple interfaces forusers.

A view of EUROPRACTICE mi-crosystems activity which ignoresthe detailed internal structure isshown in Figure 1.

Users can be small, medium orlarge enterprises and research in-stitutions or Universities. Depen-dent upon their level of technicalknowledge and financial situation,they can choose to access the Eu-ropractice Services through one ofseveral routes.

For users who understand mi-crosystems technology and can

choose the process they needthemselves, then direct access tothe Manufacturing Clusters is pos-sible.

Users who need some level oftechnical assistance can find sup-port from TTN’s or the institutionsparticipating in the DA. DA willoperate in the early phase of EU-ROPRACTICE to assist usersthrough the steps from concept,feasibility study, design prototypemanufacture and transfer to pro-duction. In some cases the DAcentres and TTN’s will work to-gether where the more general

knowledge of technology at theTTN can be complemented by thespecialist knowledge of the DAcentre.

If users qualify for financial sup-port under the FUSE (First UserAction) project, then a TTN will bedesignated to support the user.

With 26 TTN’s and 11 DA cen-tres spread across Europe, mostusers will find a local source ofknowledge and support in theirown region.

Dr. J. Malcolm Wilkinson

Agood maxim for business success is ‘keep close to your customers’. What does thismean in the context of the EUROPRACTICE project? – and what sense is the custom-

er going to make of our project as viewed from the outside?

One of the notable features of our project is its complexity both in terms of the range of technologies onoffer, the various types of customers we hope to serve and the number of partners and associated part-ners involved in providing the services. The large number of partners is at one time both a strength and aweakness. A strength because of the tremendous resources we have to offer, but a weakness because ofthe difficulty the customer might have in finding his way to the right service provider.

Figure 1: Access Routes to Europractice

USERS

RegionalSupport

TTN´sFirst level technical

support at a RegionalLevel

EUROPACTICE BASIC SERVICES

MicrosystemsDemonstration

Activity

Microsystems Clusters & Cluster Networking MCM´s ASIC´s

DirectAccessto Services

TechnicalSupportforMicrosystems

Financialsupport viaFUSE

EUROPRACTICE comment

EUROPRACTICE news

A 3 day event in Lyon launches the EUROPRACTICE Demonstration Activity

Up and Running:In an intensive 3 day seminar

in January, the representa-tives of the 4 ManufacturingClusters presented their serviceofferings and technologies toall the members of the Demon-stration Activity (DA). Nowthe DA members fully under-stand what is on offer fromeach of the ManufacturingClusters and are ready to offercustomers advice and guid-ance.

Colourful and informative bro-chures about each Cluster willbe available by early Marchand will be available from theDA members or the Clustersthemselves. In addition a leaf-let is being produced describ-ing the role of DA within EU-ROPRACTICE and the specifictechnical and commercial skillsavailable to facilitate andspeed up customers’ projects.

Everything is now in placeready for customers to submittheir projects. However DA isnot just going to sit back andwait for customers to call. Adissemination phase has start-ed during which DA memberswill go out to visit the custom-ers at their own premises or ata convenient local exhibition.If you want your local DA tovisit you, give them a call atthe number below or visit themon an exhibition stand nearyou.

Demonstration Activity

BelgiumLou HermansIMECTel : + 32 16 281 463Fax : + 32 16 281 501E-mail:hermans@imec.be

FranceStéphane FontanellCEA-LETI (Demonstration ActivityCoordinator )Tel : + 33 76 88 97 16Fax : + 33 76 88 46 66E-mail:fontanell@chartreuse.cea.fr

GermanyDetlef RickenVDI/VDE-ITTel : + 49 33 28 435 242Fax : + 49 33 28 435 256E-mail:ricken@vdivde-it.deIngo HusslaInnovationszentrum Itzehoe IZETTel : + 49 48 21 73 780Fax : + 49 48 21 73 78 50E-mail:100735.251@compuserve.com

IrelandJohn AldermanNMRCTel : + 353 21 90 43 96Fax : + 353 21 27 02 71E-mail:alderman@nmrc.ucc.ie

ItalyAntonio PaolettiRoma RicercheTel : + 39 6 202 55 35Fax : + 39 6 202 55 38E-mail:paoletti@tovvx1.ccd.utovrm.it

SpainEmilio Lora-Tamayo d'Ocon or Joan BausellsCNMTel : + 34 3 580 26 25Fax : + 34 3 580 14 96E-mail:lora@cnm.es or bausells@cnm.esCarlos DuránUPCTel : + 34 3 401 68 78Fax : + 34 3 401 67 56E-mail:cduran@petrus.upc.es

SwitzerlandHans van den Vlekkert CSEMTel : + 41 38 205 424Fax : + 41 38 205 763E-mail:vlekkert@csemne.ch

The NetherlandsCor Westerbaan van der MeijCMETel : + 31 318 580 200Fax : + 31 318 580 234E-mail:ttn@cme.nl

United KingdomHoward DoreyImperial CollegeTel : + 44 171 594 63 01Fax : + 44 171 823 81 25E-mail:h.dorey@ic.ac.uk

What? Where? When?Round Table on MST packaging Geneva March 96BMBF Hannover April 96Microelettronica Vicenza May 96Intertronic Paris June 96Microsystems Berlin September 96TEC Grenoble October 96BIAS Milano November 96Electronica München November 96Sensor Nürnberg May 97

EUROPRACTICE Calendar

MC1 Brochures available now

Manufacturing Cluster MC1 in Germany has announced that bro-chures giving a detailed survey of the technologies on offer are available from any of the cluster membersand from the VDI/VDE-Technologiezentrum Informationstechnik GmbH, Dr. D. E. Ricken, Rheinstr. 10 B, D-14513 Teltow, Germany, Fax: +49 (0) 3328/435 256, email: ricken@vdivde-it.de.

The members of the cluster are the Robert Bosch GmbH, the Fraunhofer-Institute of Microelectronic Circuitsand Systems (IMS), GMA, HL-Planar, the Fraunhofer-Institute of Silicon Technology (ISIT) and Microparts.These six German companies and institutes offer complementary microsystem technologies covering therange of bulk micromachining, surface micromachining, planar structures, on-chip integration of micro-electronics, packaging, micromolding and design support for microsystems. The service of MC1 offeredto customers opens possibilities for the creation and production of microsystems for new products.Design rules for the technologies on offer will be available soon – watch out in mst news for an update.

MC2 Cluster in France

Watch out for news in future issues. The brochures are in preparation. Your contact point is Mr. Jean-Paul Rouet, Sagem, Tel: +33 1 40 70 62 96, Fax: +33 1 40 70 66 64.

MC3 Services announced: For a broad range of experience in Microsystems

The MC3 cluster specialises in providing a wide range ofservices geared to taking technology ideas through to fullymanufactured products. This service is made availablethrough a single port of call to Microsystems technologistsable to provide both immediate technical feedback andaccess to the MC3 partnership. The services offered in theconcept-to-product life-cycle of a microsystem are shown inthe diagram below and users, both experienced and new,can enter the cycle at any point. The cycle comprises:

MC4 Cluster in Switzerland and Holland

Look out for the detailed article on Diffractive Optical Elements on the following pages. MC4 is offeringthis technology as a Multi-Project Wafer Service.

Microsystems

Consultation

Design

Prototyping

ManufacturingTesting

Integration

Packaging& Assembly

EUROPRACTICE news

News from the Manufacturing Clusters

• Consultation: The MC3 cluster offers advice not on-ly on the most appropriate technology for a newproduct but also will identify potential manufactur-ing routes, either within MC3 or from across the Europractice consortium.

• Design: MC3’s wide range of design tools includeboth device modelling and fabrication processmodelling, lithographic mask and manufacturingtool design.

• Prototyping: The MC3 cluster contains many yearsof experience in microengineering R&D and offersconventional and advanced fabrication techniquesfor prototyping.

• Manufacturing: The MC3 cluster provides a provenroute for taking prototype devices and systems tomanufacture within an adaptable range of facilities.

• Testing: MC3 provides this essential stage wherebynew devices may be tested both for functionality ofcomponent parts and overall performance.

• Integration: The MC3 cluster has access to expertisein ASIC and Multi-chip module design for use in in-tegrating component parts and complete micro-systems.

• Packaging and Assembly: MC3 are experienceddesigners, suppliers and users of a wide range ofcustom and conventional packaging.

• A detailed description of the services appears laterin this issue of mst newsnews.

EUROPRACTICE news

CSEMCentre Suissed’Electronique et

de Microtechnique SA is locatedin the heart of Switzerland'swatch-making region. With amission to provide research, de-velopment and specialized pro-duction services to industry, itrelies on front-edge know-howand expertise in microelectron-ics, micromachining, micro-system fabrication, and bioin-spired techniques. CSEM's ap-proach to microsystems andsubsystems is based on the inte-gration of these techniques todevelop multicomponent elec-tronic, mechanical, magneticand optical devices.

Diffractive optical elements (DOE) are designed and manufac-tured for CSEM's microsystems,and are now also offered as an ex-ternal service. Custom integra-tions are made possible, as well asprototyping at reduced costs usingCSEM's Multi-Project Wafer ser-vice described below.

Innovative product design withDOEs

The technologies required for ma-king Diffractive Optical Elementshave emerged during the last dec-ade. DOEs can be used to increasethe efficiency and usefulness ofconventional refractive and reflec-tive optical systems. The uniqueproperties of DOEs, i.e. theirsmaller size, lighter weight andgreater design flexibility, allow thecreation of new applications andproducts. Diffractive optics can re-place traditional refractive opticsin beam homogenizers, collimatorcorrectors and top-hat profile gen-erators, or can simply replace ordi-nary lenses. However, the realiza-tion cost of diffractive optics re-quire large production runs towhich most industries or institutescannot commit, unless they canexperiment with samples. Sincethe prototypes are produced insmall quantities they are expen-sive, and in most cases this earlyexpense cannot be afforded.

To solve this problem, CSEMnow offers a Multi-Project Wafer (-MPW) service, so that test samplesand prototypes can be realized at acost typically 25% the cost of acustom integration.

Multi-Project Wafer service description

The MPW service includes maskdesign and fabrication, as well asthe processing and dicing of thefused silica wafers. The DOEs maybe designed by the customer or byCSEM's CAD service. In both cas-es, the design must be convertedinto a GDSII file for mask realisa-tion.

Typical specifications for DOEs areas follows:• Number of dies: 10• Die size: 6.9x6.9 mm2

• Standard clear aperture: 6.5 x 6.5 mm2

• Substrate thickness:0.525 ± 0.05 mm

• Smallest feature size: 1 mm• Maximum etching depth: 2 mm• 2, 4, and 8-level structuring is

possible.

Three MPW runs are scheduledeach year; in particular, CSEM willaccept projects with several wave-lengths (different depths) withinthe same run.

For the 1996 production runs theprice is CHF 5'500.- for 2-levelstructures and CHF 7'500.- for 4and 8-level structures.

Patrick Debergh, Hans van den Vlekkert

For further information please contactthe authors:CSEMJaquet-Droz 1CH–2007 Neuchâteltel. +41 38 205 590fax +41 38 205 763e-mail: microsystems@csemne.ch

Fabrication of DOEs using CSEM's Multi-Project Wafer Service

NEXUS news

May 199617 MayNEXUSEAST/NEXUSPAN WorkshopSzczyrk (PL)

18 MayMeeting of NEXUSEAST/NEXUSPANSteering CommitteeSzczyrk (PL)Meeting of User-Supplier Club 3Zürich (CH)

June 199618 June Meeting of Academic Working GroupBarcelona (E)

18 - 19 JuneMeeting of Executive BoardBarcelona (E)

19 JuneMeeting of NEXUS BoardBarcelona (E)

20 JuneMeeting of User-Supplier Club 2Barcelona (E)

September 199611 SeptemberMeeting of General AssemblyLeuven (B)

12 SeptemberMeeting of Executive BoardLeuven (B)

November 199619 - 20 NovemberMeeting of Executive BoardNeuchâtel (CH)

21 NovemberMeeting of NEXUS BoardNeuchâtel (CH)

For updated information on NEXUSevents, you are referred to the NEXUS homepage under EMSTO onWWWhttp://www.vdivde-it.de/it/EMSTO/

NEXUS Calendar

At the last Board meeting ofNEXUS , held in Frankfurt last

November, I was elected chairmanof both NEXUS Board and (Execu-tive Board). In this capacity, I wouldlike to welcome all of the NEXUScommunity to an exciting newphase. In the latest issue of MSTNews, Hans Christian PETZOLDreported on the main changes thatoccurred within NEXUS, particu-larly with regards to organisation,objectives and tasks.

In this article, Iwould like to take theopportunity to fur-ther clarify our effortsin launching this newphase of NEXUS IIand to restate ourmain objectives andtasks.

Firstly, it is worthmentioning that NEX-US is starting from agood position; NEX-US now representsroughly 200 members and NEXUSis well known to the MST EuropeanCommunity. It has successfullybeen pursuing its primary objectiveof promoting the exploitation ofMicrosystems Technology (MST) byEuropean industries. NEXUS hasbecome an important tool for accel-erating the dissemination process ofMST into industry and for helpingto ensure that Europe will secure aprime position in this difficult in-dustrialisation phase of MST. NEX-US intends to achieve this goal bycarrying out the following tasks :

• To provide an industrial plat-form for discussion to facilitateinterdisciplinary co-operationwhich is needed to realise com-plex products of Microsystemstechnology.

• To analyse and demonstrate fu-ture application opportunities ina systematic way by organisingindustrially driven User SupplierClubs in important fields of appli-cation.

• To establish a common Europe-an MST-representation at allimportant authorities in Europeand to represent Europe in inter-national events of importance toindustrial applications of MST.

Secondly it's my pleasure to de-scribe the activities carried out, todate, by the members of the Execu-tive Board who have all helped tolaunch NEXUS II within the con-

text of these newaims and objectives;An Academic Work-ing Group (AWG)has been installedand Prof. Robert Puers,from K.U. Leuven(see contribution onpage 36) has beenelected as co-ordina-tor for this group.The specific aims andoperating methodolo-gies of the User Sup-pliers Clubs (USCs)have been defined bythe overall co-ordina-

tor for these clubs, Dr. Ayman El-Fa-tatry. A preliminary approach for amarket study of MST technologieshas been initiated by Dr.ReinerWechsung, co-ordinator of this task.Rob Turner proposed simple waysfor dealing with non-disclosureagreements and IPR by the NEXUSExecutive Board and the USCs. Dr.Jan Suski has participated in meet-ings with NEXUSPAN and he hasbeen nominated co-ordinator ofthe relations with eastern Europe.Prof. Ron Lawes proposed a meansof strengthening the links betweenNEXUS and Europractice througha networking activity. In this con-text, EMSTO, as the basic tool willbe enhanced for this purpose.

From my side, I have been in-volved in different events, confer-ences and workshops aimed atpromoting NEXUS. I have alsovisited ARPA in the USA, on be-half of NEXUS and I have beenpreparing a new proposal forNEXUS III with Hans Christian

NEXUS • THE RIGHT PLATFORMFOR THE FUTURE OF EUROPEANMST BUSINESS !

Gaëtan Menozzi (Chairman of NEXUS Board)

NEXUS news

NEXUSTASK is funded underthe Commission’s HCM pro-

gramme, and aims at an exchangeof young scientists between the la-boratories of the 22 NEXUS partnersinvolved, in order to perform jointMST related R&D work. After a du-ration of two years, the initial con-tract with the CEU on NEXUSTASKexpired on 30 September 1995. TheCommission now agreed, however,to extend that contract by a thirdyear, thus enabling the partners tocontinue and complete the R&Dcooperations started. The partnersnow have proposed a redistributionof the remaining financial resourcesto the CEU which corresponds bet-ter with the actual needs of the indi-vidual partners.

From SINTEF to IMT Neuchâtel

Jon Nysaether of SINTEF, Oslo (N)has been working at the Institute ofMicrotechnology, University ofNeuchâtel (CH) from Aug 15 toNov 10, 1995. The aim of the workwas to improve processes for mak-ing thick layers of photoimageablepolysiloxane rubbers on silicon wa-fers. Such layers are used as flexiblemechanical interconnects betweensilicon or glass substrates in stackedmicrofluidic systems. Because of thephotoimaging property of the poly-siloxane, the layers can be patternedto form flow channels etc.

A part of the work was dedicatedto obtain polysiloxane layers with areproducible and uniform thicknesson 4 inch silicon wafers, and to in-vestigate developing processes thatdo not degrade the definition of thepolysiloxane pattern. The work in-volved layout of a mask set for ademonstrator, and development of aprocess for opening small structures(< 800 µm) in a 150 - 300 µm thickpolysiloxane layer. The obtained uni-formity and reproducibility of thepolysiloxane thickness was ±10 µm.

Contact: Jon NysaetherSINTEF, Postboks 124 BlindernN-0314 OsloTel: +47 22067-790 (fax: -350)

From the Central MicrostructureFacility, UK to NCSR „Demokritos“, Greece

Ms Jan Friday at the Central Mi-crostructure Facility (CMF), Ruth-erford Appleton Laboratory, Unit-ed Kingdom, was hosted by theInstitute of Microelectronics,NCSR „Demokritos“, Greece, for atotal of three months in 1994 and1995.

The collaboration aimed toshow that pressure transducerscould be produced using standardintegrated circuit manufacturingtechniques. Chemical vapour dep-osition, lithography and etch pro-cesses were used to create free-standing three-dimensional struc-tures on silicon with both openand sealed cavities.

The first, preliminary, visit de-termined what could be achievedat the laboratory in Athens andwhat supportive work wouldneed to be carried out at CMF. Inaddition to exploratory resist stud-ies, a set of seven photomasks wasdesigned and fabricated at CMF toprovide templates for each lithog-raphy step required for the sec-ond, longer visit to NCSR. Duringthis visit, open cavities were pro-duced using polysilicon as themembrane layer and oxide as thesacrificial layer. Closure of the cav-ities was achieved by reactive seal-ing using polysilicon deposition.The study indicated that a work-ing pressure transducer could beproduced and is now continuingas a PhD project at the Institute.

Contact: Prof P D PrewettCentral Microstructure FacilityRutherford Appleton LaboratoryDidcot, OxonUnited Kingdom OX 11 0QXTel: +44 (0) 1235 445-159, (-706 Fax)e-mail: p.d.prewett@rl.ac.uk

NEXUSTASK ExchangeProgramme

Petzold. This first, busy phase hasdemonstrated the strong commit-ment of the key members of theExecutive Board.

Finally, I would like to officiallylaunch the start of the User Suppli-er Clubs. The first meeting of theUSC- 2 -"Medical, bio-medical andenvironmental" co-ordinated by Dr.Ayman El-Fatatry took place inMünchen on March the 21st. At thatmeeting, the basic aims, guidelinesand tasks of this User Supplier Clubwere identified and agreed upon bythe club members.

User Supplier Clubs will consti-tute the main core activity of NEX-US for the future. The clubs will al-so present a platform for all the rep-resentatives of each specific domainencompassing customers, manufac-turers and academic establish-ments. These platforms will pro-vide the basis of analysing andidentifying the specific MST tech-nologies for mid to long term in-dustrial requirements. These plat-forms will also create the opportu-nities for all members to set the ba-sis of future industrial co-operation.

As far as future MST applica-tions are concerned, these dedicat-ed USCs will provide a strong im-pulse to the European MST R&Dand manufacturing activities.

I would strongly recommend thatall the key MST European playersjoin and actively participate in theseUSCs. To do so, please contact theUSC co-ordinators identified in thededicated article on USCs (page 38)by Dr. Ayman El-Fatatry. To end thisarticle, I wish to conclude with thecomment that we have now,through NEXUS, a good Europeantool that is innovative in its ap-proach. I sincerely hope that theproposed actions will constitute theright basis for launching a success-ful European MST network. So seeyou soon at the NEXUS USCs andthe General Assembly.

Gaëtan Menozzi(Chairman of NEXUS Board)

For further information please contactthe author at Sextant Avionique, Tel: +33 75 79 8-763 (-674 Fax)

NEXUS news

One of the main objectives ofNEXUS II is to identify core in-

dustrial applications that will benefitfrom the introduction of MST tech-nologies. As a result, NEXUS II hasset-up four „User Supplier Clubs“aimed at addressing specific applica-tion areas which are most likely tobenefit from the impact of MST tech-nologies.

The User Supplier Clubs of NEX-US II are tasked with initiatingstrong links between MST technolo-gy suppliers and manufacturers, us-ers and organisations involved in thefields of Medical, Bio-Medical andEnvironmental Monitoring, Automo-tive and Aerospace, Instrumentationand Process Control, and Peripheralsand Multimedia.

These User Supplier Clubs aim toaddress technological aspects, stan-dardisation issues and identify themarket requirements in this field ofapplication. The Clubs will dissemi-nate their findings, through the NEX-US Executive Board, to the NEXUScommunity. Members of these Clubswill also provide a link to other Eu-ropean initiatives/projects such asEUROPRACTICE.

The „Automotive and Aero-space“ User Supplier Club (1)of NEXUS II is coordinated by J. P.Rouet of Sagem SA (F), and in-cludes representatives from RobertBosch (D), Schlumberger (F), Daim-ler-Benz (D), Sextant (F), SensoNor(N), VDI/VDE-IT (D), GEC-Marconi(UK), and Siemens (D). For furtherinformation relating to this User-Supplier Club (1), or if you wish tojoin the club, please contact

Jean-Paul Rouet (Sagem SA)Tel: +33 140 706-296 (-664 Fax)

The „Medical, Bio-Medicaland Environmental Monitor-ing“ User Supplier Club (2) ofNEXUS II is coordinated by Dr. Ayman El-Fatatry of GEC-Mar-coni Materials Technology Ltd. (UK)and includes representatives fromMicroParts (D), Schlumberger In-dustries (F), Balteadisk SpA (I),Fraunhofer-ISiT (D), Fraunhofer-IFT(D), CRL-Thorn EMI (UK), the Na-tional Microelectronics ResearchCentre (IRL), and IMSAS (D). Forfurther information relating to this User Supplier Club (2), or if you wishto join the club, please contact

Dr. Ayman El-Fatatry(Coordinator of User-Supplier Clubs,Deputy Chairman of NEXUS II)Tel: +44 181 732-0090 (-0100 Fax)e-mail: ayman.elfatatry@gecm.comThe „Instrumentation andPro-

cess Control“ User-SupplierClub (3) of NEXUS II is coordinatedby Dr. P. Pfluger and Dr. A. Zumsteg ofCSEM (CH), and includes representa-tives from CRL-Thorn EMI (UK), Druck(UK), and Siemens (D). For further infor-mation relating to this User-Supplier Club(3), or if you wish to join the club, pleasecontactDr. Peter Pfluger (CSEM)Tel: +41 38 205-218 (-741 Fax)Dr. Alphonse ZumstegTel: +41 38 205-401 (-700 Fax)

The „Peripherals and Multimedia“ User-Supplier Club (4) is newly initiated. For fur-ther information, or if you wish tojoin this club, please contact

Dr. Alessandro Bellone(BALTEADISK SpA)Tel: +39 125 968-293 (-228 Fax)

User-Supplier Clubs Launched

News and AnnouncementsFor fast dissemination of your information andnews please follow the button „news and an-nouncements“ and fill in the related form.

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Country ReportsEMSTO provides information about MST/MEMSactivities in various countries. Please email yourcomments. Authors for new reports are welcome.

Yellow PagesWith your inputs a comprehensive on-line electro-nic directory of MST/MEMS products and sup-port services will be available on EMSTO. The ser-vice also provides contact details for personneland institutions active in the MST/MEMS field.Please fill in the short questionnaire provided.

Project AreaEvery European MST-project consortium is gi-ven the opportunity to freely report on its ac-tivities and to exchange information betweenproject partners and externals. A private areaensures the security of confidential data.

MST Publications, Preprint and ReviewsPlease insert your bibliographical data onbooks, scientific papers, studies or documen-tations in our database.

MST Discussion GroupCommunication platform under preparation.Envisaged topics are:• Markets• Technologies• Applications

EMSTO: European MST OnlineThe success of EMSTO essentially relies on your contribution. Here are the ways you can participate.You are kindly invited to follow the further developments on http://www.vdivde-it.de/it/EMSTO/

NEXUS news

Between December 1995 andMarch 1996, the following insti-tutions became new members ofNEXUS:

• ENSIEG-L.E.G.,Saint-Martin-D’Heres (F)

• Thomson-CSFSemiconducteurs Specifiques,Saint-Egrève (F)

• 3 D plus Electronics, Buc (F)

• Universität Freiburg (D)

• Technion-IIT, Haifa (IL)

• BALTEADISK, Arnad (I)

• CREO, L’Aquila (I)

• I.D.E.A., Pisa (I)

• Chalmers TU, Göteborg (S)

NEXUS membership is opento all European companies

and institutes able to contributeexpertise in areas relevant to mi-crosystems technology.

For additional information on NEXUS, to apply for member-ship, to submit contributions toor comments on this NEXUSnewsletter, please contact:

Hans-Christian Petzold

NEXUS Office,Fraunhofer - Institut fürSiliziumtechnologie (ISiT)D - 14199 Berlin,Dillenburger Str. 53Tel.: +49/30/829 98-110(-199 Fax)

Membership

New Members

Contact

NEXUSEAST/NEXUSPANworkshop

in Szczyrk (Poland)

As already announced in mst news 15/96, the second internationalworkshop on microsystem technology organised and sponsored by NEXUSEAST/NEXUSPAN will be held on 17 May 1996 in Szczyrk, beautifully located in a mountain resort in the south of Poland.

The workshop aims at increasing the awareness of MST developments inthe Central and East European countries, and at promoting cooperationbetween MST laboratories in companies and institutes throughout Europe.Towards those goals, invited papers will be given by leading Europeanspecialists, and a poster session will present results of research teamsfrom Poland and other Central/East European countries.

To obtain more information, and to register for the workshop, pleasecontact

Prof. Andrzej JelenskiITME, Warszawa (PL)Phone: +48 223 54416 (-49003 Fax)E-Mail: itme@frodo.nask.org.pl

Within the NEXUS activities,the Academic Working

Group (AWG) takes care of the sci-entific and precompetitive issues.Its first purpose is to act as an ad-visory board to the industrial com-munity, providing information onthe long term prospectives inR&D. It is expected that the resultsof this action will be considered asa valuable input to the definitionof future European programmes.This will be one of the major in-puts of the AWG to the NEXUSExecutive Board. To maintain closecontact with the existing industrialrequirements, it is the intention tostrongly participate in the UserClubs, and to stimulate innovativeideas within such practical envi-ronments. The intention, however,is not to create a one-directionalflow of information, but also to setup guidelines towards the insti-tutes and universities as how toorient the future research for max-imal benefit in this domain.

Another responsibility is the co-ordination and stimulation of theeducation in the field of MST.Training on new technologies andknow-how is envisaged, in collab-oration with Europractice, by or-ganizing dedicated workshopsand by setting up programmes forexchange of researchers or scien-tists amongst all the members.

Finally, it is the intention tocreate dedicated networkingamongst the different researchcentres to increase the critical massto come to innovative but realisticand realizable solutions faster. TheAWG will provide inputs tolaunch possible cooperation in thismatter.

Robert Puers

For further information, please contactthe author at K.U. Leuven, ESAT-MICAS, Kardinaal Mercierlaan 94,B-3001 Leuven-Heverlee, Tel.: +32 16 32-1082 (-1975 Fax), e-mail: puers@esat.kuleuven.ac.be

Academic Working Group

Rem

inde

r

NEXUS Job Opportunities

A one year position (perhaps longer) is currently open at ourInstitute in the area of microsystem modelling and simulation. Itexists in the framework of a Swiss national project in the fieldof global simulation of microsystems. The project is strongly re-lated to industrial needs, and has strong industrial participa-tion.

The project deals with the development of a three level simula-tion tool for the „global simulation of microsystems: device lev-el - FE calculations compenent level - HDL-A system level -SPICE.A parameter extraction tool allows the automatic characterisa-tion of simulated devices and the generation of behavioralmodels for a mixed-mode analog simulator. The behavioralmodels are described in HDL-A (an implementation of VHDL-Aby RANACAD Engineering). System level simulations are per-formed by installations of the behavioral models in a SPICEnetlist.

Candidates who are familiar with the above simulators andtools should contact: Dr. Philippe Lerch. Swiss Federal Institute of Technology (EPFL) Department of Microengineering (DMT) Institute of Microsystems (IMS) CH-1015 Lausanne, Phone: (+41) 21 693 66-27 (-70 Fax) e-mail: lerch@ims.dmt.epfl.ch L DMT-Ecublens Switzerland

Position openAs a part of the recently approved Swiss Priority Programmein Micro & Nano System Technology (MINAST), we arelooking for a graduate student who will work on a projectin the area of microfluidics.

The development of various micro liquid dosing systems willfocus on valves, pumping mechanisms, and flow measure-ment. Projects in MINAST are carried out in close collabora-tion with industrial partners and emphasize the creation oftechnology displays that will lead to future generations of in-dustrial products.

Duration: The program will last for 4 years, 1996-1999.

We are looking for a candidate with some experience inmicro fabrication technology and a background in physicsor electrical engineering. She or he will be given the oppor-tunity to expand the work into a Ph.D. thesis. For further in-formation, please contact: Bart van der Schoot Institute of Microtechnology, University of Neuchatel Rue Jaquet Droz 1 CH-2007 Neuchatel, Switzerland or: bart.vanderschoot@imt.unine.ch

Faculty of Computer and Control Engineering, Institute of Electronics

Position offered:two post-graduate student positions (doctorate research)

Tasks: There will be two research topics:

• Modern interconnection technologies andtheir reliability studies

• Phase-locked loops (PLL) and phase-sensitivesignal processing in test and measurement systems

Requirements: Successful candidates should have aMaster’s or equivalent degree in Electrical Engineering, Ma-terial Sciences or Solid State Physics.

Duration: 3 years, optionally another year.

Deadline for application:15.06.1996 (acceptance will be declared on 03.07.1996)Required Documents:Application, C.V., Diploma with Annex, Two Recommenda-tions (one from Talinn Techn. Univ.)contact: Prof. Dr. Thomas Rang, Head of the Chair of Electronic Design, Talinn Technical University, Ehitajec tee 5, EE-0026 Talinn, Estonia, E-mail: TRANG@EDUTTU.EE

Positions open:The Institute for Microsensors, -actuators and -systems (IMSAS)affiliated with the Department of Physics and Electrical Engi-neering University of Bremen is looking for 2 Scientific Re-searchers in Microsystem Technology for a three year contract.

Tasks to be addressed:Our Institute will expand the project groups working on

• Development and characterization of a microsystem for multicomponent gas analysis

• Development and characterization of a microsystem for multicomponent liquid analysis

Qualification requirements: degree in physics, electrical engi-neering or in chemistry

Desirable: experience/knowledge of microsystem technologyand/or surface science and/or physical chemistry This scientific work is addressed to young scientists with theaim of performing PhD-workcontact: Dr. Zacheja: mail: zacheja@theo.physik.uni-bremen.de fax:+49 421-2184774Dr. rer. nat. Johannes ZachejaInstitute for Microsensors, -actuators and -systems (IMSAS) University of Bremen, P.O. Box 330 440,D-28334 Bremen,Germany, Phone +49 421 218 4949 (-4774 Fax)

e-mail: zacheja@physik.uni-bremen.de

Institute of Microsystems (IMS) Institute of Microtechnology University of Neuchâtel

Talinn Technical UniversityIMSAS at University of Bremen

Events

OFS-11 - 11th International Conference on Optical Fiber Sensors Hokkaido (J) 21.05. - 24.05.96

PATLIB '96 - Annual Conference forPatent Information Specialists in Eu-ropeAberdeen (GB) 29.05. - 31.05.96

Adhesives in Electronics `96 - 2nd International ConferenceStockholm (S) 03.06. - 05.06.96

OPTATEC - International Trade Fairfor Optics and Optoelectronics -Application and TechnologyFrankfurt/Main (D) 18.06. - 21.06.96

CPEM `96 - Conference on PrecisionElectromagnetic MeasurementsBraunschweig (D) 17.06. - 20.06.96

Actuator 96 - 5th International Conference on New ActuatorsBremen (D) 26.06. - 28.06.96

OE Expo '96 - 7th Taipei Internatio-nal Optoelectronics ExpositionTaipei - (ROC) 25.07.- 28.07.96

SMT-10 - 10th International Conference on Surface ModificationTechnologiesSingapore 02.09. - 04.09.96

NANO '96 - EPS InternationalWorkshop towards Applications ofNano- and Quasi Crystalline MaterialsBerlin (D) 02.09. - 04.09.96

Microsystems Design for High Reliability and High DependabilityApplications- 1st International IEE WorkshopAmbleside (GB) 03.09. - 05.09.96

EUROSENSORS X - 10th European Conference on Solid-State Transducers Leuven (B) 08.09. - 11.09.96

ICIP `96 - IEEE International Confe-rence on Theoretical Experimentaland Applied Image ProcessingLausanne (CH) 16.09. - 19.09.96

MST `96 - International Congress and Exhibition on Micro System Technologies Berlin (D) 18.09. - 20.09.96

Further information and an extensive list of MST - related eventsare available at VDIIVDE - IT,Mr. Alfons BotthofTel.: +49/3328/435-195 (-216 Fax)E-Mail: botthof@vdivde-it.deFor updated information seehttp://www.vdivde-it.de/it/emsto/

Workshopsof the Innovation

Support ProgrammeMST

of the BMBF

Inkorporal insertierbarer Biosensor zur Glukosemessungmit Glykämie-Schrankenalarm

Berlin(D) 15.05.96Contact: Herr Fromm, VDI/VDE-IT

Tel: +49/3328/435-137

Kombinierter Einsatz von Gassensoren verschiedener

TechnologienDuisburg(D) 30.05. - 31.05.96

Contact: Herr Fromm, VDI/VDE-ITTel: +49/3328/435-137

Latest Developments of theChip-on-Board Technology inEurope and their Applications

in Multi-Chip-ModulesBerlin(D) 02.07.96

Contact: Dr. Schließer, EU-Verbindungsbüro Norddeutschland

Tel: +49/3328/435-226

Grundlagen für eine optischeHybridtechnik

Stuttgart(D) 29.10.96Contact: Dr. Schließer,

EU-Verbindungsbüro NorddeutschlandTel: +49/3328/435-226

Return this slip by mail or by fax +49 (3328) 435-216

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