d3 engineering define ● design ● develop ruggedized camera module p13571 project review may 10,...
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Ruggedized Camera ModuleP13571 Project Review
May 10, 2013
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op Project Description
Design and develop a camera system that can capture, package, and transmit image data in a small form factor which may be subjected to adverse conditions.
Mechanicals Electrical Computer
Jose Portugal Stephen Brown Stephen Goss
Cameron Staunch Andy Anthony Peter Hood
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Customer Needs
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op Engineering SpecificationsSpec. # Importance Source Specification (metric)
Unit of Measure
Marginal Value
Ideal Value
Comments/Status
Enclosure
S1 3 CN1 The enclosure shall be a 1.2" x 1.2" x N package. Length of N is negotiable Inches 1 in3
S2 3 CN2 The enclosure shall be water resistant. Connector and lens excluded. IP64 IP67S3 2 CN2 The enclosure shall be impact resistant. Drop Height 2 ft - 3 ft > 2ftS4 2 CN17 The enclosure shall be oil resistant. UL Oil Res II
S53 The enclosure shall withstand temperatures relevant to the electronics. Co -40 to 85
Beyond range
max. temp inside 125 C
S16 2 CN19 Camera needs to have front, back, and side-mount capabilities. Yes/NoConnector
S6 2 The connector shall be type that supports CoaXPress. Yes/NoLens
S17 CN8 The system shall support an M12 lens. Yes/NoS18 3 CN18 The system shall support a C-mount lens. Yes/NoS7 3 CN9 The system shall support an M3F focus module. Yes/No
CableS8 3 CN13 The system shall use coaxial cable. Yes/NoS9 3 CN11 The cable shall be capable of reaching 3-6 meters in length. MetersS10 3 CN12 The cable shall provide power to camera unit. Volts
S111 Implied The cable should be flexible.
Bend Radius (in)
2 to 5 IN 2 IN
S122 CN9 The cabling shall be ruggedized.
Crush Resistance
(lb/in)100 lbf/in >175 lbf/in IP64
Image SensorS13 2 CN15 The system shall support the Omnivision OV14810 14MP image sensor. Yes/No
Interface ChipsetS14 3 CN15 The interface shall support speeds of at least 2.1 Gbps. bits/sec 2.1 Gbps
S15 3 CN13The interface shall be capable of serializing 12-bit parallel data from image sensor.
Yes/No
The system shall be capable of interfacing with MIPI-CSI2 data format of image sensor. Yes/No
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op Concept Summary
•Heat Dissipation
•IP64 weatherproofing
•Ruggedized
Mechanical Engineers
•High-Speed Printed Circuit Board Design
•System Integration
•Physical Layer Implementation
Electrical Engineers
•FPGA Programming
•Frame Grabber
•CoaXPress Implementation
Computer Engineers
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op Electrical System Architecture
Image Sensor•Image Data Capture
FPGA•Transceiver Architecture
Power•Power Management
Coax•Data Transmitter
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op Mechanical System Architecture
Heat Dissipation•Cold Finger•Fins•Aluminum Body
Water Tight Seal•O-ring Seals•Flat Gasket
Ruggedized•Anodized•Gorilla® Glass
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opSoftware Architecture
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Pixel Capture
Synthetic Data Working
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opTransmitter Working
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opFuture Stage 1 Implementation
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op Electrical Design SummarySystem Testing Results • Voltage and Short Checks
• Short on FPGA-to-Power Board connector• Power over CoaXPress• JTAG functionality• Flash programmable• I2C communication with sensor
• I2C clock on input pin• Transceiver signal integrity
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op Mechanical Design SummaryTesting ResultsAssembly- Material Selection for high temperatures/oil temp.- PCBs and Hardware assemble together without
interference.- Thermal pads compress effectively reducing contact
resistance .- Tolerance Analysis provided an effective connector
engagement.Thermal- Experimental Data was 20% lower than Simulated- Factor of safety of 1.0- Connecting to a stand of any type allows conduction and only increases F.S.Sealing- Distributor provided CAD was not exact, o-rings under compressed (Lens Holder)- O-rings designed to 20 - 40% compression, difficult to assembly- Updated CAD provides up to 15% compression and used measured dimensions from Lens Holder
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op Software Design Summary
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op Objective Project EvaluationSuccesses Assembly fits together
with no interference Properly sinks heat Imager works Programmed FPGA Transceiver works
Remaining Image display Frame grabber
implementation Verification of transceiver
signal integrity
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op Opportunities / Suggestions For Future Work
• Finish CoaXPress protocol • Design frame grabber system• Upgrade FPGA to Cyclone V GX• Auto-focus capability using M3F Focus Module• CNC current release of CAD with tighter tolerance
and modified O-ring grooves• Different housing designs (UAV application)• Incorporate video analytics • Include image processing filter on FPGA
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op Acknowledgments D3 Engineering (sponsor)
• Scott Reardon• Jason Enslin• Jim McGarvey• Alex Sojda• Ben McGee• David Collins
Lightforce Technology• Peter Hammond
Dr. Antonio Mondragon Altera Corporation
• Bill Jenkins• Bob Spurr
Arrow Electronics, Inc.• Gary Fredericks
RIT Machine Shop Personnel