denton e-gun sop

Denton E-Gun SOP of 18 Revision 5-601019

Denton E-Gun SOP 1 Scope

1.1 This document provides the operating procedures for the Denton SJ20C E-Gun.

2 Table of Contents

1 Scope ______________________________________ 1 2 Table of Contents _________________________ 1 3 Reference Documents _____________________ 2

3.1 Referenced within this Document ........ 2 3.2 External Documents ................................... 2

4 Equipment and/or Materials_______________ 2 5 Safety ______________________________________ 2 6 Setup Procedures__________________________ 3

6.1 Enable System in Coral ............................. 3 6.2 Check Crystal Thickness ........................... 4 6.3 Vent Chamber .............................................. 5 6.4 Check Chamber ........................................... 6 6.5 Load Samples ............................................... 6 6.6 Load Crucible(s) ........................................... 6 6.7 Pump Down Chamber............................... 7

7 Film Deposition Procedures _______________ 7 7.1 Hi Vacuum Pump Down ........................... 7 7.2 Substrate Heating (optional) ............................................................................................................................ 8 7.3 Initialize Components ......................................................................................................................................... 8

7.3.1 Program the Deposition Controller ....................................................................................................... 8 7.3.2 Rotation (optional, but recommended)................................................................................................ 9 7.3.3 Main Power .................................................................................................................................................... 10 7.3.4 Function Generator .................................................................................................................................... 10 7.3.5 Voltage ............................................................................................................................................................ 11 7.3.6 Verify Beam Position .................................................................................................................................. 11 7.3.7 Initialize Beam .............................................................................................................................................. 11 7.3.8 Verify Beam ................................................................................................................................................... 12 7.3.9 Reset Crystal Thickness Monitor ............................................................................................................ 12

7.4 Material Deposition ........................................................................................................................................... 12 7.5 Stop Deposition .................................................................................................................................................. 13 7.6 Deposit Additional Material(s) (Optional) ................................................................................................. 13 7.7 Turn Off Components ....................................................................................................................................... 14 7.8 Vent Chamber ...................................................................................................................................................... 14 7.9 Unload Chamber ................................................................................................................................................. 15 7.10 System Standby ................................................................................................................................................... 15 7.11 Disable System in Coral ................................................................................................................................... 16

8 Process Notes ___________________________________________________________________________________ 16 8.1 Thickness and Uniformity ................................................................................................................................ 16

9 Appendix ________________________________________________________________________________________ 17 10 Revision History _________________________________________________________________________________ 18


Figure 1, System Control Panels ............................................................................................................................... 3 Figure 2, Type 286 Controller ................................................................................................................................... 4 Figure 3, Deposition Controller ................................................................................................................................ 4 Figure 4, Main Control Panel ..................................................................................................................................... 4 Figure 5, Sample Holder Loading ............................................................................................................................ 5 Figure 6, Crucible Pocket ............................................................................................................................................ 6 Figure 7, Crucible Pocket Selection Knob .............................................................................................................. 6 Figure 8, Door Locking Handle ................................................................................................................................ 7 Figure 9, Ion Gauge Controller ................................................................................................................................. 8 Figure 10, OMEGA CN76000.................................................................................................................................... 8 Figure 11, High Voltage Main Power Source (TT-3) ......................................................................................... 10 Figure 12, Function Generator ............................................................................................................................... 10 Figure 13, Current Controller .................................................................................................................................. 11

TABLE 1, COMMON MATERIAL PROPERTIES ...................................................................................................... 9 TABLE 2, UNIT CONVERSIONS.......................................................................................................................... 17

3 Reference Documents

3.1 Referenced within this Document

3.1.1 None

3.2 External Documents

3.2.1 Lab User Guide

3.2.2 VEM Thin Film Evaporation Guide 2017

4 Equipment and/or Materials

4.1 Denton SJ20C E-gun

4.2 Wafer/sample

4.3 Target materials

4.4 Glass microscope slides

4.5 Kapton tape

4.6 Aluminum foil

4.7 Crucible, (standard size)

4.8 Crucible, (small size)

5 Safety

5.1 Follow all Nanofab safety procedures.

5.2 Following deposition, exercise caution when touching any items inside the process chamber. They may be HOT.


6 Setup Procedures

6.1 Enable System in Coral

6.1.1 Log into Coral.

6.1.2 Enable the Denton SJ20C E-gun.

NOTE: The tool can only be enabled if there is an active reservation.

ION GAUGE CONTROLLER

Function Generator (XY SWEEP)

High Voltage Main Power Source (TT-3)

Rotation Speed Control

Current Controller (TT-3/6 CONTROL)

Main Control Panel

DEPOSITION CONTROLLER

TYPE 286 CONTROLLER

Figure 1, System Control Panels


6.2 Check Crystal Thickness

6.2.1 Ensure the chamber is in high vacuum.

6.2.1.1 On the TYPE 286 CONTROLLER, ensure the red bar for Chamber, CH. 1 is below 10 (see Figure 2, Type 286 Controller).

6.2.2 Turn on the DEPOSITION CONTROLLER (see Figure 3, Deposition Controller).

6.2.3 Check the lower right corner of the crystal monitor display.

6.2.3.1 If it displays “XTAL FAIL”, contact lab staff.

6.2.4 Press the button.

6.2.5 Press the 1 button to show the resonance frequency of the crystal at the top right corner of the display.

6.2.6 If the resonance frequency is less than 4800 kHz, contact Staff to replace the crystal.

Figure 3, Deposition Controller

ON/OFF Switch

Chamber, CH. 1

Figure 2, Type 286 Controller

Figure 4, Main Control Panel

HI-VAC VALVE

HEAT POWER

ROTATION POWER

GUN SHUTTER

SHIFT FUNCT.

VENT


6.3 Vent Chamber

6.3.1 Ensure each of the following components are turned OFF (see Figure 1, System Control Panels).

• Current Controller (TT-3/6 CONTROL) • Function Generator (XY SWEEP) • High Voltage Main Power Source (TT-3) • ION GAUGE CONTROLLER • HEAT POWER on the Main Control Panel (the corresponding LED should be OFF, see

Figure 4, Main Control Panel) • ROTATION POWER on the Main Control Panel (the corresponding LED should be

OFF, see Figure 4, Main Control Panel)

6.3.2 On the Main Control Panel (see Figure 4, Main Control Panel):

6.3.2.1 Press the HI VAC VALVE button (the corresponding LED should be OFF).

!!! WARNING !!!

Failure to close the Hi-Vac Valve can result in damage to the system and a cryo regen will be necessary.

!!! WARNING !!!

6.3.2.2 Press the SHIFT FUNCT. button (the corresponding LED should be ON).

6.3.2.3 Press the VENT button.

NOTE: The AUTO VENT LED will turn on. 6.3.2.4 Wait for the chamber to vent (approximately 5 minutes).

6.3.2.5 When the chamber is vented (you will hear the vent gas more loudly), open the chamber door.

NOTE: The vent gas will turn off. NOTE: If the door does not open, the chamber is not fully vented. Do NOT force

it open. Wait a little longer and try again.

Sample Holder

Hanger

Thickness Monitor

Slide

Sample Wafer

Figure 5, Sample Holder Loading

Crystal


6.4 Check Chamber

6.4.1 Verify the upper and lower glass windows are not opaque.

6.4.1.1 If either window is opaque, notify staff.

6.4.2 Verify there is no flaking on any surface inside the chamber, including the shutter.

6.4.2.1 If any flaking is observed, notify staff.

6.4.3 Press on the edges of the crystal to ensure it is firmly seated in the holder.

6.5 Load Samples

6.5.1 Remove the sample holder from the hanger (see Figure 5, Sample Holder Loading).

6.5.2 Using Kapton tape, mount the samples/wafers on the holder (see Figure 5, Sample Holder Loading).

6.5.3 If the final thickness will not be measured on the sample/wafer, mount a glass microscope slide on the holder.

6.5.4 Replace the sample holder on the hanger.

6.6 Load Crucible(s)

6.6.1 On the Main Control Panel (see Figure 4, Main Control Panel), press the GUN SHUTTER button to open the shutter.

6.6.2 Inspect the crucible pocket.

6.6.2.1 If there is any material or residue in the pocket, contact Lab Staff.

6.6.3 Obtain the crucible(s) for the material to be deposited.

NOTE: For some materials (i.e., gold) a smaller crucible is placed inside the standard crucible.

6.6.4 Inspect the crucible.

6.6.4.1 If there are any cracks, defects, or overflow of melted material, do not use the crucible.

6.6.4.1.1 Obtain a new crucible.

6.6.4.1.2 Place the material to be deposited into the crucible.

Shutter

Crucible Pocket

Figure 6, Crucible Pocket

Figure 7, Crucible Pocket Selection Knob


CAUTION

Do not fill the crucible more than 1/3 full.

CAUTION

6.6.5 Rotate the crucible pocket selection knob until a pocket is centered and unobstructed by the crucible shielding (see Figure 7, Crucible Pocket Selection Knob).

NOTE: The lines on the white and yellow labels should be aligned. 6.6.6 Place the crucible in the centered pocket position.

6.6.7 If multiple materials will be used, turn the crucible pocket selection knob on the right side of the chamber to an available pocket position (see Figure 7, Crucible Pocket Selection Knob).

6.6.7.1 Repeat 6.6.2 through 6.6.6.

6.6.7.2 Ensure you know which material is in which pocket.

NOTE: There are 4 crucible pockets. One full rotation of the pocket selection knob will move to the next position. The arrows on the label refer to the rotation direction of the knob, while the text refers to the rotation direction of the crucible pockets (CW = clockwise; CCW = counter-clockwise).

6.6.8 On the Main Control Panel (see Figure 4, Main Control Panel), press the GUN SHUTTER button to close the shutter.

6.7 Pump Down Chamber

6.7.1 Close the chamber door.

6.7.2 Rotate the door locking handle to the latch position (slightly past 90°, see Figure 8, Door Locking Handle).

6.7.3 On the Main Control Panel (see Figure 4, Main Control Panel) if the SHIFT FUNCT. LED is OFF, press the SHIFT FUNCT. button.

6.7.4 On the Main Control Panel (see Figure 4, Main Control Panel), press the MECH PUMP button.

NOTE: The AUTO PUMP LED light will turn on. When the vacuum reaches 150 mTorr (approximately 10 minutes), the High-Vac Valve will open automatically).

6.7.5 After the door locking handle falls, pull on the door slightly to verify the vacuum seal.

6.7.6 Wait a minimum of 45 minutes after the Hi-Vac Valve opens for the chamber to pump down.

7 Film Deposition Procedures

7.1 Hi Vacuum Pump Down

7.1.1 Ensure the HI VAC VALVE LED on the Main Control Panel (see Figure 4, Main Control Panel) is ON.

Figure 8, Door Locking Handle


7.1.1.1 If it is OFF, do NOT proceed. Contact Lab Staff.

7.1.2 Turn on the ION GAUGE CONTROLLER (see Figure 9, Ion Gauge Controller).

7.1.3 Wait until the pressure is less than 1.0x10-6.

NOTE: A total pump down time of 75 – 90 minutes is typical.

7.2 Substrate Heating (optional)

7.2.1 If substrate heating is desired, adjust the setpoint of the OMEGA CN76000 temperature controller to the desired value (see Figure 10, OMEGA CN76000).

7.2.1.1 Press the INDEX button until the upper display reads 1SP1.

7.2.1.2 Use the Up and Down arrows (▲, ▼) until the lower display shows the desired temperature setpoint value.

7.2.1.3 Press the ENTER button.

CAUTION

Never use a setpoint above 150°C.

CAUTION

7.2.2 On the Main Control Panel (see Figure 4, Main Control Panel), press the Heat Power button (LED will be ON.)

7.2.3 Wait until the temperature reaches setpoint.

7.3 Initialize Components

7.3.1 Program the Deposition Controller

7.3.1.1 Turn on the DEPOSITION CONTROLLER (see Figure 3, Deposition Controller).

7.3.1.2 Program the parameters for the material to be deposited.

7.3.1.2.1 Using TABLE 1, COMMON MATERIAL PROPERTIES or the VEM Thin Film Evaporation Guide 2017, find the Density and Z-Ratio of the material to be deposited.

ON/OFF Switch

Figure 9, Ion Gauge Controller

Figure 10, OMEGA CN76000


7.3.1.2.2 On the DEPOSITION CONTROLLER (see Figure 3, Deposition Controller), press the PROG button.

7.3.1.2.3 Press the or button until the cursor is at Density.

7.3.1.2.4 Enter the Density value.

7.3.1.2.5 Press the button.

7.3.1.2.6 Enter the Z-Ratio.

7.3.1.2.7 Press the button.

7.3.1.2.8 Press the PROG button.

TABLE 1, COMMON MATERIAL PROPERTIES

Material Symbol Density (bulk, g/cm3)

Z-Ratio Current (Amps)

Dep Rate1

(Å/sec) Aluminum Al 2.7 1.08 0.100 15.0 Chromium Cr 7.2 0.305 0.035 3.0 Copper Cu 8.92 0.437 0.100 4.0 Gold Au 19.32 0.381 0.040 2.0 Nickel Ni 8.91 0.331 0.100 0.5 Platinum Pt 21.45 0.245 0.100 0.5 Silver Ag 10.49 0.529 0.040 3.0 Titanium Ti 4.5 0.628 0.050 1.0 1Approximate deposition rate. Actual rate could vary ±50%.

7.3.2 Rotation (optional, but recommended)

7.3.2.1 On the Main Control Panel (see Figure 4, Main Control Panel), press the ROTATION POWER button to start the sample rotation.

7.3.2.2 Adjust the ROTATION CONTROL SPEED knob for the desired rotation speed.

NOTE: There should be at least 10 full rotations during the deposition cycle.


7.3.3 Main Power

7.3.3.1 Turn on the High Voltage Main Power Source (TT-3, see Figure 11, High Voltage Main Power Source (TT-3)).

7.3.3.2 Wait a minimum of 2 minutes.

7.3.4 Function Generator

7.3.4.1 Turn on the Function Generator (XY-SWEEP, see Figure 12, Function Generator).


VOLTAGE ADJUST Knob

MAIN POWER Breaker Switch

Figure 11, High Voltage Main Power Source (TT-3)

Figure 12, Function Generator

Position LED’s

Position Knob Amplitude Knob


7.3.5 Voltage

7.3.5.1 On the Current Controller (TT-3/6 CONTROL, see Figure 13, Current Controller), press the VOLTAGE/EMISSION ON button to turn on the controller.


7.3.5.3 On the High Voltage Main Power Source (TT-3, see Figure 11, High Voltage Main Power Source (TT-3)), slowly rotate the VOLTAGE ADJUST knob clockwise until the outer display on the Current Controller (TT-3/6 CONTROL, Figure 13, Current Controller) reads 6.5 KV.

7.3.6 Verify Beam Position

7.3.6.1 On the Function Generator (XY SWEEP), ensure both the LATERAL and LONGITUDINAL position LED’s are near 0 and green in color (see Figure 12, Function Generator).

7.3.6.1.1 If the lit LED is yellow (not near 0), adjust the POSITION knob until the lit LED is green and near 0.

!!! WARNING !!!

Once the beam initialization is started, DO NOT LEAVE THE SYSTEM UNATTENDED!

You must closely monitor and adjust the current, voltage, beam location, and deposition rate until the beam is turned off.

!!! WARNING !!!

7.3.7 Initialize Beam

7.3.7.1 On the Current Controller (TT-3/6, see Figure 13, Current Controller), slowly turn the EMISSION CURRENT ADJUST knob clockwise until the current is between 0.010 – 0.020 Amps.

Voltage Display

Figure 13, Current Controller

Voltage OFF/ON Current Adjust Knob

Current Display


NOTE: This step should take 1 – 2 minutes. 7.3.7.2 Wait a minimum of 5 minutes for the melt/crucible to glow orange.

7.3.8 Verify Beam

7.3.8.1 Using UV light protection, open the upper view shutter of the chamber.

7.3.8.2 Look at the melt/crucible.

7.3.8.3 If the beam size is not 50 – 75% the size of the melt/crucible, adjust the AMPLITUDE knob of the LATERAL and/or LONGITUDINAL control on the Function Generator (XY SWEEP, see Figure 12, Function Generator).

7.3.8.4 If the beam is not centered on the melt/crucible, adjust the POSITION knob of the LATERAL and/or LONGITUDINAL control on the Function Generator (XY SWEEP, see Figure 12, Function Generator).

NOTE: Rotating the LATERAL knob clockwise will move beam to the right. Rotating the LONGITUDINAL knob clockwise will move the beam up.

!!! WARNING !!!

Do not allow the beam to hit the edge of the crucible or the hearth. Sparks will be visible. Adjust the beam, as necessary, to center and size the beam.

!!! WARNING !!!

7.3.9 Reset Crystal Thickness Monitor

7.3.9.1 On the DEPOSITION CONTROLLER (see Figure 3, Deposition Controller), press the

button.

7.3.9.2 Press the 2 button to zero the thickness display.

NOTE: The crystal thickness is displayed in kiloAngstroms (1.000 KÅ = 1000Å = 100 nm = 0.1 um). TABLE 2, UNIT CONVERSIONS can be used for conversion between units.

7.4 Material Deposition

!!! WARNING !!!

Never adjust the current above 0.150 amps without Staff approval. High current settings can

damage crucibles and/or the equipment.

!!! WARNING !!!

7.4.1 VERY slowly increase the current (~0.010 Amps/minute) to an initial setting and allow the material to melt.

NOTE: The pressure will rise slightly as the material begins to melt and evaporate. The necessary temperature and current to melt varies by material.


7.4.2 On the Main Control Panel (see Figure 4, Main Control Panel), press the GUN SHUTTER button to open the shutter and begin deposition.

7.4.3 Using UV light protection, open the upper view shutter of the chamber and ensure the beam is scanning nicely across the material in the crucible.

7.4.3.1 If necessary, adjust the POSITION and AMPLITUDE knobs.

7.4.4 While watching the upper left corner of the DEPOSITION CONTROLLER (see Figure 3, Deposition Controller), VERY slowly turn the EMISSION CURRENT ADJUST knob on the Current Controller (TT-3/6, see Figure 13, Current Controller) until the desired deposition rate is achieved.

NOTE: The effect of the current change on the material and deposition rate will be delayed approximately 15 seconds.

NOTE: Typical deposition rates for common materials are shown in TABLE 1, COMMON MATERIAL PROPERTIES. Materials with higher melting points may have a lower deposition rate. If the actual deposition rate is much lower than typical, it is likely the crucible is cracked.

NOTE: During deposition, the chamber pressure will rise to approximately 1.0 x 10-6 Torr. 7.4.5 Verify the voltage on the Current Controller ((TT-3/6, see Figure 13, Current Controller) is

still set for 6.5 KV.

7.4.5.1 If necessary, adjust the voltage.

7.4.6 During deposition, frequently verify the deposition rate, material quantity in the crucible, and the beam position (using UV light protection).

7.4.6.1 If necessary, adjust the beam position, using the LATERAL and LONGITUDINAL knobs on the Function Generator (XY SWEEP, see Figure 12, Function Generator).

7.4.6.2 If the deposition rate drops dramatically, immediately stop deposition (see 7.5.2).

7.5 Stop Deposition

7.5.1 Wait until the desired thickness is displayed on the upper right corner of the DEPOSITION CONTROLLER (see Figure 3, Deposition Controller).

7.5.2 On the Main Control Panel (see Figure 4, Main Control Panel), press the GUN SHUTTER button to close the shutter and stop deposition.

7.5.3 On the Current Controller (TT-3/6) (see Figure 13, Current Controller), slowly turn the EMISSION CURRENT ADJUST knob counter-clockwise until the current is 0.000 Amps.

NOTE: This step should take 2 – 5 minutes. 7.5.4 Wait a minimum of 5 minutes for the melt/crucible to cool.

7.6 Deposit Additional Material(s) (Optional)

7.6.1 If another material is to be deposited, turn the crucible pocket selection knob to rotate the desired crucible pocket to the active position.

7.6.2 Repeat paragraphs 7.3.1 Program the Deposition Controller through 7.6 Deposit Additional Material(s) (Optional).


NOTE: When running multiple materials, the wait steps for Main Power and Function Generator are not necessary.

7.7 Turn Off Components

7.7.1 On the High Voltage Main Power Source (TT-3, see Figure 11, High Voltage Main Power Source (TT-3)), slowly rotate the VOLTAGE ADJUST knob counter-clockwise until the outer display on the Current Controller (TT-3/6 CONTROL, see Figure 13, Current Controller) reads 0.0 KV.

7.7.2 Wait a minimum of 2 minutes.

7.7.3 On the Current Controller (TT-3/6 CONTROL, see Figure 13, Current Controller), press the VOLTAGE/EMISSION OFF button to turn the controller off.


• Current Controller (TT-3/6 CONTROL) • Function Generator (XY SWEEP) • Ion Gauge Controller • Deposition Controller • HEAT POWER on the Main Control Panel (the corresponding LED should be OFF, see



7.7.5 Turn off the High Voltage Main Power Source (TT-3, see Figure 11, High Voltage Main Power Source (TT-3)).

7.7.6 Wait a minimum of 5 minutes.

7.8 Vent Chamber


• Current Controller (TT-3/6 CONTROL) • Function Generator (XY SWEEP) • High Voltage Main Power Source (TT-3) • ION GAUGE CONTROLLER • HEAT POWER on the Main Control Panel (the corresponding LED should be OFF, see



7.8.2 On the Main Control Panel (see Figure 4, Main Control Panel):

7.8.2.1 Press the HI VAC VALVE button (the corresponding LED should be OFF).


!!! WARNING !!!

Failure to close the Hi-Vac Valve can result in damage to the system and a cryo regen will be necessary.

!!! WARNING !!!

7.8.2.2 Press the SHIFT FUNCT. button (the corresponding LED should be ON).

7.8.2.3 Press the VENT button.

NOTE: The AUTO VENT LED will turn on. 7.8.2.4 Wait for the chamber to vent (approximately 5 minutes).

7.8.2.5 When the chamber is vented (you will hear the vent gas more loudly), open the chamber door.

NOTE: The vent gas will turn off. NOTE: If the door does not open, the chamber is not fully vented. Do NOT force

it open. Wait a little longer and try again. 7.9 Unload Chamber

CAUTION

Components may be HOT. Exercise caution

to prevent physical injury.

CAUTION

7.9.1 Carefully remove the sample holder.

7.9.2 Remove the samples from the holder.

7.9.3 On the Main Control Panel, press the GUN SHUTTER button to open the shutter.

7.9.4 Carefully remove all crucibles.

7.9.4.1 If multiple crucibles/materials were used, turn the crucible pocket selection knob on the right side of the chamber to access each crucible.

7.9.5 On the Main Control Panel, press the GUN SHUTTER button to close the shutter.

7.10 System Standby

NOTE: The system is to remain under vacuum while not in use. 7.10.1 Close the chamber door.

7.10.2 Rotate the door locking handle to the latch position (slightly past 90°, see Figure 8, Door Locking Handle).

7.10.3 On the Main Control Panel (see Figure 4, Main Control Panel) if the SHIFT FUNCT. LED is OFF, press the SHIFT FUNCT. button.


7.10.4 On the Main Control Panel (see Figure 4, Main Control Panel), press the MECH PUMP button.

NOTE: The AUTO PUMP LED light will turn on. When the vacuum reaches 150 mTorr (approximately 10 minutes), the High-Vac Valve will open automatically).

7.10.5 After the door locking handle falls, pull on the door slightly to verify the vacuum seal.

7.11 Disable System in Coral

7.11.1 Log into Coral.

7.11.2 Disable the Denton SJ20C E-gun.

7.11.3 Enter all required data and information.

8 Process Notes

8.1 Thickness and Uniformity

8.1.1 In October of 2003, aluminum was deposited on a glass slide in the middle of the sample holder (planetary) and another on the edge.

8.1.2 Rotation was used during the deposition cycle.

8.1.3 The thickness as measured by the crystal (Deposition Controller) was 1.000 micron.

8.1.4 Using a profilometer, the glass slide at the middle of the sample holder measured 1.2 microns.

8.1.5 Using a profilometer, the glass slide at the edge of the sample holder measured 0.93 microns.


9 Appendix

TABLE 2, UNIT CONVERSIONS Angstrom

(Å) Nanometer

(nm) Micron (μm)

kiloAngstrom (kÅ)

10 1 0.001 0.010 20 2 0.002 0.020 30 3 0.003 0.030 40 4 0.004 0.040 50 5 0.005 0.050 60 6 0.006 0.060 70 7 0.007 0.070 80 8 0.008 0.080 90 9 0.009 0.090

100 10 0.010 0.100 200 20 0.020 0.200 300 30 0.030 0.300 400 40 0.040 0.400 500 50 0.050 0.500 600 60 0.060 0.600 700 70 0.070 0.700 800 80 0.080 0.800 900 90 0.090 0.900

1000 100 0.100 1.000 2000 200 0.200 2.000 3000 300 0.300 3.000 4000 400 0.400 4.000 5000 500 0.500 5.000 6000 600 0.600 6.000 7000 700 0.700 7.000 8000 800 0.800 8.000 9000 900 0.900 9.000

10000 1000 1.000 10.000 20000 2000 2.000 20.000 30000 3000 3.000 30.000 40000 4000 4.000 40.000 50000 5000 5.000 50.000 60000 6000 6.000 60.000 70000 7000 7.000 70.000 80000 8000 8.000 80.000 90000 9000 9.000 90.000

100000 10000 10.000 100.000


10 Revision History

Rev Date Originator Description of Changes

5 10 Jun 2019 T. Olsen Update document format. 4 02 Jan 2019 T. Olsen Major Rewrite. 3 01 Jun 2014 Brian Baker Move to SMBB. 2 8 Dec 2010 Sam Bell Added 6.2 & 6.3.3 1 19 Jan 2010 Sam Bell Initial Release