design for nanomanufacturing at uc berkeley - a chip-scale … · 2013. 10. 27. · a chip-scale...
TRANSCRIPT
A chip-scale imprinter with integrated optical
interference for calibrating models of NIL
resists and resist-stamp boundary conditions
23 October 2013
Hayden Taylor* and Niswan Dhakal
Nanyang Technological University, Singapore
Joel Yang and Zhu Di
Institute for Materials Research and Engineering, Singapore
Outline
2
• Resist model calibration by fitting
simulations to imprint experiments
• The need for new tools to characterise
resist–stamp material combinations
• Real-time optical monitoring of imprint
• Potential RLT sensing enhancements:
• Plasmonic
• Ellipsometric
• Potential applications of real-time
optical imprint monitoring:
• Endpoint detection
• Process control
• Defect detection (including non-fill)
1 Taylor NNT 2009, 2011; 2 Taylor SPIE 7641 2010; 3 Boning et al. NNT 2010
0
0.5
1
Pattern abstraction
De
ns
ity
Stamp
Resist
Wafer
Stamp deflections
Residual thickness (RLT) nonuniformity
Incomplete cavity filling
Lateral resist flow RLT homogenization
Stamp’s load response (bending, indentation)
Resist
Stamp
Resist surface’s impulse response
Resist
Substrate
Example questions:
Does changing stamp material affect
residual layer uniformity? 1,2
Can ‘dummy fill’ accelerate stamp cavity filling? 3
92
99
10
165
Elastomer Silicon
(nm)
Simulations need to be highly scalable
At least 103 times
faster than FEM Can trade off spatial
resolution and speed
101
102
103
104
102
103
104
Simulation size, N
~O(N2logN)
101
N
Tim
e (
s)
1
2
3
4
3
Our existing simulation technique quickly finds RLT and cavity-filling distributions
A
B
C
D
E
F
G
H
The NIL simulation technique has been experimentally validated
1 mm
Silicon test stamp:
Cavities
(~500 nm deep)
Protrusions
C
A
E
G
D
B
F
H
5
The technique has been validated for five thermoplastic materials
8 8
Nanoscale experiments may involve substantial slip between resist and stamp
9 9
Assuming no slip between resist and
stamp or substrate
The imprinting rate will depend strongly on any slip between resist and stamp/substrate
10
d𝑟
d𝑡= −
𝑟3𝑝0
4𝑘𝜂0𝑎02 1 − 2𝛿 +
𝑟
𝑎0
2
1 + 2𝛿
−1
Laun, J. Non-Newtonian Fluid
Mechanics 81 (1999) 1-15 10
Real-time observation of evolving RLT could accelerate material/stamp characterisation
100 µm
Real-time observation of evolving RLT could accelerate material/stamp characterisation
Simulations
RLT–colour relationships are calibrated using a known stamp topography
13
Radius = 3.1 mm
Silicon
150 µm
Resist
Stamp
Intensity gradient
> 1/nm
Videos of the imprinting process allow the temporal response of resist to be extracted
14
• Material:
MRT mr-UVCur-21
• Stamp-average
pressure 20 kPa
• Consistent with
viscosity ~ 7 Pa.s
100 µm
If features are sub-wavelength, plasmonic effects could enhance RLT detection
Large features
25 nm-pitch dot array
D
h
g
h
RLT
h = D = 16 nm
g = 9 nm
Silicon
Resist, n = 1.52
Quartz, n = 1.45
10 nm gold Simulated
reflectivity
spectra
RLT
E-field
intensity
(Joel Yang + Zhu Di)
An anti-reflective stamp coating and light polarisation could enhance RLT contrast
16
DLC: diamond-like carbon (n ~ 2.09). “Polarised” means with crossed polarisers
Contrast: relative change in intensity for a 1 nm change in RLT about a given RLT
Substrate-enhanced ellipsometric contrast: Ausserré, Optics Express, 15 8329 (2007)
Potential applications include endpoint detection and cavity filling monitoring
17
• Endpoint detection
• Feedback control in R2R processing
• Cavity filling
• Stamp inspection/defect detection
• Probing of complex fluids (e.g. biological samples)
100 µm
Partially
filled
cavity
100 µm
Resist
residue
Conclusions and outlook
18
• Resist rheological behaviour can be extracted
from nanoscale imprint experiments
• Resist-stamp boundary conditions are critical
and require characterising
• Real-time measurement of RLT can be
accomplished interferometrically using simple
white light microscopy
• Optical RLT measurement sensitivity can be
tuned using plasmonic or ellipsometric
approaches
• Real-time RLT measurement could be applied to
improve NIL yield and throughput
Collaborators and acknowledgements
19
• AMO, Germany • Christian Moormann
• Ulrich Plachetka
• Microresist Technology, Germany • Arne Schleunitz
• Marko Vogler
• Freimut Reuther
• IMRE, Singapore • Goh Wei Peng
• NTU, Singapore • Tan Boon Hwee
• IBN, Singapore • Ciprian Iliescu
• Trinity College Dublin • Graham Cross