desy mmc system on module

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DESY MMC System on Module DMMC-STAMP HIGHLIGHTS Complete MicroTCA management on a single module Ready-to-use solder-in component based on ARM Cortex®-M4 processor Flexible CPLD for FPGA update and control (variable IO voltage) Pre-programmed component with HPM Firmware-update support FEATURES Full IPMI handling (MCH communication, LEDs, AMC/RTM power, FRU read/write) 2kBit EEPROM with unique ID (MAC address) Complete AMC power management via PmBUSBoard failure handling (over-current, over- temperature) Supports two FPGA interfaces (custom interface voltage: 1.2V - 3.3V) including IPMI firmware update Control of up to two FMC modules Re-configurable JTAG chain management USB virtual COM port for MMC and FPGAs Pre-programmed firmware can be modified with optional SDK Breakout Board available The DESY MMC System on Module is a small stamp-sized (25.5x29x2.3 mm) component which can be mounted on top or bottom side of any AMC card. The stamp provides a complete hardware and firmware solution to manage the target board including power system, FPGAs, JTAG and RTM. It fully supports in-system update via IPMI. For basic operation no external components are required (except handle and LEDs). The board is a drop-in solution with minimal design effort and no additional development required. The module complete JTAG arbitration for up to two FPGAs and two FMC modules. It allows JTAG access to all user components over the on-board connector or the MTCA backplane (JSM support). A fully assembled breakout board with the following features is available: 1/3 AMC format, compatible with MTCA.4 and MTCA.0 RTM connector (Zone 3) DC/DC converter with PMBUS manager Serial FLASH chip (image for payload FPGA) USB connector for command-line access (Virtual COM port) All LGA module pins are accessible on breakout section DESY Deutsches Elektronen-Synchrotron Notkestraße 85 22607 Hamburg [email protected] techlab.desy.de INTERESTED? CONTACT US!

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Page 1: DESY MMC System on Module

DESY MMC System on Module DMMC-STAMP

HIGHLIGHTS

Complete MicroTCA management on

a single module

Ready-to-use solder-in component

based on ARM Cortex®-M4 processor

Flexible CPLD for FPGA update and

control (variable IO voltage)

Pre-programmed component with

HPM Firmware-update support

FEATURES

Full IPMI handling (MCH communication, LEDs,

AMC/RTM power, FRU read/write)

2kBit EEPROM with unique ID (MAC address)

Complete AMC power management via PmBUS™

Board failure handling (over-current, over-

temperature)

Supports two FPGA interfaces (custom interface

voltage: 1.2V - 3.3V) including IPMI firmware update

Control of up to two FMC modules

Re-configurable JTAG chain management

USB virtual COM port for MMC and FPGAs

Pre-programmed firmware can be modified with

optional SDK

Breakout Board available

The DESY MMC System on Module is a small

stamp-sized (25.5x29x2.3 mm) component which

can be mounted on top or bottom side of any AMC

card. The stamp provides a complete hardware and

firmware solution to manage the target board

including power system, FPGAs, JTAG and RTM. It

fully supports in-system update via IPMI.

For basic operation no external components are

required (except handle and LEDs). The board is a

drop-in solution with minimal design effort and no

additional development required. The module

complete JTAG arbitration for up to two FPGAs and

two FMC modules. It allows JTAG access to all user

components over the on-board connector or the

MTCA backplane (JSM support).

A fully assembled breakout board with the following

features is available:

1/3 AMC format, compatible with MTCA.4 and

MTCA.0

RTM connector (Zone 3)

DC/DC converter with PMBUS manager

Serial FLASH chip (image for payload FPGA)

USB connector for command-line access

(Virtual COM port)

All LGA module pins are accessible on

breakout section

DESY

Deutsches Elektronen-Synchrotron

Notkestraße 85 • 22607 Hamburg

[email protected]

techlab.desy.de

INTERESTED? CONTACT US!

Page 2: DESY MMC System on Module

DESY MMC System on Module

DESY Deutsches Elektronen-Synchrotron

Notkestraße 85 • 22607 Hamburg

[email protected]

techlab.desy.de

Block diagram

Low-cost breakout board

Actual size views:

DMMC-STAMP size comparison

LGA bottom view (2mm pitch)

RTM

hot-plug

controller

RTM 12V PP

RTM 3V3 MP

ADCs inputVCC_+3V3_MMC

(from payload power)

Power

system

RTM 12V

input

RTM

current

limit

adjust

RTM IPMI (I2C)

RTM

current

readback

PMBus™ control (I2C)

12V payload

input

3.3V MP

input

JTAG

input

connector

FPGA

JTAG

(2x)

FPGA

SPI

FLASH

(2x)

VCC

FPGA

input

FPGA

UART

(2x)2x FMC control

and JTAG

FPGA

GPIO

(2x)

IPMI LEDs

IPMI handle

USER GPIOs

(SDK)

ISP

pogo pin

header

USB

to

UART

USB

CPLD

Backplane

interface

USER GPIOs

(SDK)

MAC

address

FRU

Cortex®-M4

Microcontroller

RTM JTAG

TEMP

sensor

JTAG

AMC

backplane