detector r&d summary walter f.j. müller, gsi, darmstadt 6 th cbm collaboration meeting piaski,...
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Detector R&D SummaryDetector R&D Summary
Walter F.J. Müller, GSI, Darmstadt
6th CBM Collaboration MeetingPiaski, September 7-10, 2005
300
MIMOSA11 @ 1MRad (First results from Frankfurt)
300Charge collected [ADC] Charge collected [ADC]
Ent
ries
(no
rmal
ized
)
Ent
ries
(no
rmal
ized
)E
ntri
es (
norm
aliz
ed)
Ent
ries
(no
rmal
ized
)
4 pix. 4 pix.
1 pix.
1 pix.
Minor degen- eration.
Minor degen- eration.
Signal remains stable
Signal remains stable
Shoulder dissapears
Signal drops
Small peakdissapears
MIMOSA11 before and after 1MRad X-rays (@ +10°C, Treadout=700µs)
Hardened pixel (A0 Sub 1) Standard pixel (A0 Sub 2)
Optimal conditions (-25°C, Treadout= 170µs) : 15% more noise (~11 e- )=> Chip ok
! P
reli
min
ary
resu
lts
and
conc
lusi
ons
!
From M. Deveaux
10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005
3
Fast readout speed, the inner layers
External 12-bit ADCMIMOSA
Offline Cluster finding
Output
Standard approach for MAPS:
Sensor array (~100 pixels/line)
~1000 on - chip ADCsand/or discriminators
On - chip cluster-finding processor
Output: Cluster information(zero surpressed)
The design concept for CBM:
Goal: A readout time of 10µs for the CBM
3mm 2mm
From M. Deveaux
10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005
4
Vertex Detector
MAPS Significant progress in the radiation hardness front Still much too do, further tests planned
demonstrate limit under best operating conditions more tests with neutrons
Fast column-based readout in work since a while building blocks studied chip planned for late next year
DEPFET interesting alternative; 100 um thickness...; puts Λc in reach concept for fast readout to be worked out in an early stage...
10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005
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Silicon Strip Detector Stations
Sectorized segmentation:Basic sensor elements: 200 m thick silicon wafers.double-sided, rad-tolerant. 25 m strip pitch.
Inner : 6x4 cm Middle : 6x12 cmOuter : 6X20 cmOpen questions: strip length, stereo angle
(to reduce fake hits) location of read-out
(on sensor, all at edge ?)
Prosal: Four tracking detector stations,built from a few types of silicon strip wafers.
From J. Heuser
10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005
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Silicon Strip
3 R&D contracts for Sensor, FEE, and layout now active Many loose ends:
module layout how to arrange and connect sensors into a ladder and to read-out ? can the read-out be put on the perimeter ?
requirements on sensor and read-out optimal sensor thickness radiation hardness for read-out
10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005
7
STS technological options
STS
VT ITS
MAPS DEPFET
ITS
SI-StripHybrids ?
ILC, RHIC
ILC, Astrophysicis (X-ray observatory)
Contact to the Halbleiter Labor of MPI Munich,Peter Fischer (Mannheim)
Giga Tracker,LHC upgrade
Contact to ALICE group,G. Stefanini, P. Giubellino.ATLAS P. Fischer
(other) driving communities:
R&D started(talk by M. Merkin)St. Petersburg, Moscow; Obninsk
R&D started(next talk)St. Petersburg, Moscow; Obninsk
(FNAL), Phenix, Neutron imaging
R&D in progress(talk by Michael Deveaux)IReS, (GSI, JWGU)
From J. Stroth
10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005
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Technology development for the PMT FEU-Hive, August 2005
Vladimir Rykalin
•Technology for the high frequency welding of the covar ring electrodes with the glass tubes has been installed
•Technology of the Sm evaporation on the PMT window has been tested •Technology of bialkaline photocathode activation has been tested
•The first distributed dinodes have been evaporated, but not still be tested
From S. Sadovsky
10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005
9
RICH
GSI-IHEP R&D contract for PMT development now active Next steps:
study and test mirror alternatives (Be, glas, Carbon) Is N radiator feasible ?
Are all properties known ? Do we need measurements, or simulations ?
Design issues: mirror support look at existing setups beam pipe look at the whole system
10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005
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TRD
From C. Garabatos
10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005
11
A preliminary TOF system layout
Most central part : highest rate and occupancy Small single cells
Intermediate part : high occupancy and large area Single strip shielded RPCs
External part : largest area Multistrip (differential) counters
The uniformity of the response over the full detector surface is a key element for the physics performance
From E. Cordier
10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005
12
RPC
Key issues Rate:
new low resistivity glasses (ceramic, Glaverbel) high T operation
Aging tested to 600 mC/cm2
much to be learned from HADES/FOPI RPC projects
10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005
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ECAL
Prototype being build (Y. Kharlov) 20 X0 ; 0.275 mm Pb+1.5 mm Sci; Target: 3%/sqrt(E) tests on U70 in fall 2005 and 2006
Much emphasis on MC and optimization of layout (I. Korolko) improving e/pi handling hit density
To be resolved: What is the prime mission of ECAL ?
help in e/pi look for direct photons
What is the required solid angle coverage to achieve physics goal
10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005
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A CBM A CBM M-M-MPW RunMPW Run CBM organized a Multi-Multi Project Wafer run in UMC 0.18 μm CMOS
6 different parts combined on a 5 x 5 mm2 wafer submitted June to Europractice (IMEC) dies (already cut) just delivered, now come the moments of truth
Atkin
Fischer
Brüning
Deppe
Muthers
Tontisirin
Content addressable
memory
12bit 50MSPS ADC
Test structures
PreAmp for Si Strip
DLL based TDC
Clock-Data recovery
Coordination:Marcus Dorn @ KIP
From W.F.J. Müller
10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005
15
CBM FEE/DAQ DemonstratorCBM FEE/DAQ Demonstrator Mission: Provide a platform to
demonstrate essential architecture elements of the CBM FEE-DAQ concept FEE: self-triggered, data push, conditional RoI based readout CNet: combined data, time, control, and RoI traffic TNet: low jitter clock and synchronization over serial links BNet: high bandwidth, RDMA based architecture E/DCS: integrated approach for DCS/ECS
provide test bed for all future FEE/DAQ prototyping in hardware firmware controlware software
perform beam tests with detector prototypes form basis for medium-scale applications in intermediate-term
experiments
Be operational by end 2006 avoid cathedrals, go for the bazaar, try and learn build a first generation (G1) demonstrator quickly
From W.F.J. Müller