digital image correlation presentation
DESCRIPTION
Our presentation about Digital Image Correlation. Trilion.comTRANSCRIPT
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The Principals of
Digital Image
Correlation
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Motivation
Previous Solution:Problem: Static / dynamic measurement
Position
Dynamic displacement
Dynamic deformation
Speed / velocity
Acceleration
Strain
• Displacement Sensors
• Laser trackers
• LVDT
• Draw Wire Sensors
• Accelerometers
• Strain Gages
• Extensometers
• Clip gages
• Profilometer
• LVDT
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MotivationCollecting data at a single point
Setup (Displacement Sensor):
– Reference Frame
– Mounting the Sensor
– Wire up Sensor
– Data Acquisition
– Data Analysis
Data Acquisition
Displacement Sensor
Reference
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MotivationCollecting data at several points
Reference
Reference
Reference
Reference
Reference
Reference
Setup (Displacement Sensor):
– Reference Frame
– Mounting the Sensor
– Wire up Sensor
– Data Acquisition
– Data Analysis
Data Acquisition
Still only 1D
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Imagine a 3D setup
MotivationIndustry requires comprehensive analysis tools
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Measure & Visualize Entire Structure’s Response including:
• 3D displacements & strain gradients
• including complex material types & geometries
MotivationDesign Criteria
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Verify Finite Element Models with 10,000+ measurement points
MotivationDesign Criteria
Reduce the Number of Required Prototypes ($$$)
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DIC is a powerful method for detecting deformation on the surface
of a material or component and is most commonly used in applications
that involve:
Materials testing and Characterization
Failure and Fatigue Studies
Long Term Health Monitoring
Materials that have a complex composition or shape
Static and Dynamic Measurements of Strain or Motion
DIC Overview
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DIC OverviewTheory
- Digital Image Correlation (DIC) systems use the
principals of photogrammetry, digital image
processing, and in most cases stereo imaging to
track features in space and assign their position to a
predetermined coordinate system
- The measurement is made by the comparison of an
image series that is captured over timescales from
microseconds to years
- 2D measurements (in-plane) and 3D measurements
(in and out of plane) are possible
- Analysis is done in post-processing
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- Much like a strain gage is zeroed to a condition
that is said to be “undeformed” and then used as
reference for future deformations the first image taken
by DIC is used as the undeformed reference condition.
- DIC is a non-contact optical measurement system that
measures surface displacements of an object
subjected to a driving force
- Provides experimental data that is directly comparable
to Finite Element simulations
- Triangulation between the stereo camera pair is used
to determine location in z-direction (out of plane)
DIC OverviewTheory
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Advantages:
Non-Contact Measurement
Rich data set compiled from over 10,000 pts on the surface
Analysis is done in post-proccessing (place gages on after
test)
Provides information for shape, position, displacement, and
strain
Calibration Technique ensures high accuracy
Not affected by rigid body motion
Disadvantages:
Cannot Measure Existing Damage
Must have clear line of sight to part by both cameras
DIC Overview
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DIC Hardware Today
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• High Resolution CCD Cameras (no
internal moving parts) 2MP – 12MP
• Larger Sensors than point and shoot
cameras provide better pixel quality
with less pixels
• High Light Sensitivity
• Typically Monochrome (Black and
White)
• Capable of Image Acquisition Rates
from 15Hz to 1M fps
DIC Hardware TodayCameras
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• Data Acquisition Controller that triggers cameras to take
pictures
• Synchronizes with Test machines and records analog-to-
digital signals
•Load, and Displacement
•Temperature
• Uploads images and AD information to computer
DIC Hardware TodaySensor Controller and Computer
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• Provide Scale information for the
field of view and used to create a
calibrated volume within which the
3D coordinates are known
• Calibration Objects have a dense
grid of points on them which are at a
known location by sensor supplying
in-plane coordinate information
• By moving the calibration object
closer or further from the
camera, information can be
provided to the sensor relating
depth of field and out of plane
coordinates
DIC Hardware TodayCalibration Artifacts
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The center point of an
ellipse or a target can be
tracking in calibrated space
by interpolating to find its
location
The perimeter of the ellipse
where the color changes
from black to white is
traced by some n number
of pixels
The more pixels that trace
the ellipse the more
accurate its location can be
tracked
Sub Pixel Interpolation
Using Photogrammetry
To track a single point
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Undeformed Specimen
Deformed Specimen
• Speckle Pattern on the specimen tracked in both camera images by regularly spaced facets as part deforms
DIC ProcedureUsing Facets to create 3D coordinates from a 2D image
• Image acquisition by stereo camera pair
L
RL
R
R
R
L
L
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DIC Procedure3D Results
• Image processing
• 3D coordinates
• 3D displacements
and velocity
•Strain tensor
– Major and Minor strain
– Strain in X, Y, shear strain
– Thickness reduction
– Strain rates for all strain
values
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DIC ProcedureSensitivity
• Displacement Sensitivity out of plane is 1/30,000
the field of view regardless of camera resolution
• In Plane sensitivity is 10x higher and increases
with resolution
Field of View Displacement
Sensitivity
10 x 8 mm 0.3 Microns
100 x 80 mm 3.0 Microns
1 Meter x 800 mm 30.0 Microns
• Strain Sensitivity is Constant; 50-100 Microstrain but
resolution for strains increase as field of view
decreases (pixel scaling factor)
Noise Floor for 135mm FOV is 0.16 Microns.
Total Displacement of 0.6 Microns is Clearly
Visible
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Thank you for your attention
Trilion Quality Systems500 Davis Drive, Suite 200,
Plymouth Meeting, PA 19462
Office: (215) 710-3000
Fax: (215) 710-3001
Email: [email protected]
Web Site: www.Trilion.com
www.Trilion.com