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10 MEMS Products & Case Histories
•Ken Gilleo PhD•ET-Trends LLC
92%
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Newer
OLD
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Silicon Load Cell for Loads up to 1000 kg
Silicon Load Cell for Loads up to 1000 kg
An array of capacitors is used instead of a single capacitor to compensate for nonhomogeneous force distributions.
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Micro fluid handling systems
By sensing the pressure drop over a fixed hydraulic resistance with use of pressure sensors, the flow through the shunt resistor can be obtained.
The monolithic sensor consists of two capacitive read-out pressure sensors, connected by a resistance channel.
Because two pressure sensors are used (relative to atmospheric pressure) the sensor can be used both to measure flow-rate as well as pressure
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20020102004 - Knowles
From variousKnowles articles on web
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InfineonInfineon
The microphone consists of two chips, the MEMS chip and an application-specific integrated circuit (ASIC), both of which share the same package on a surface-mounted device. The MEMS consists of a rigid, perforated back electrode and a flexible silicon membrane that serves as a capacitor, transforming acoustic pressure waves into capacitive variations. The ASIC detects these variations, converts them into electrical signals and passes them to the appropriate processing devices, such as a baseband processor or amplifier.
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MEMS MicrophonesMEMS Microphones
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QFN Package
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Session SummarySession Summary• MEMS Mfgs. pioneered packaging
Inertial sensors
Pressure sensors
Ink jets
Microphones
• Most attempt to stay within infrastructure
• MEMS packing vendors are emerging
• No clear trend for packaging outsourcing
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12 Summary & Future
•Ken Gilleo PhD•ET-Trends LLC
98%
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MarketsMarkets
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Top MEMS Co’sTop MEMS Co’s
Much of HP’s MEMS is simple ink jet chips with no moving parts.
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MOEMSMkt.
MOEMSMkt.
By region
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TrendsTrends• New MEMS startups will be fabless
• More MEMS good fab services
• More reuse MUMPS standards
Existing libraries
• Packaging Still custom designed by MEMS device designer
Some use of MEMS-specific packagers
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Final SummaryFinal Summary
• Adding motion to chips is a very big deal
• MEMS: a top technology for 21st century
• MEMS: long lifetime (beyond silicon electronics)
• MEMS and Nano are compatible, synergistic
• MEMS: greatest packaging challenge
• MEMS packaging should work for nano