3D sensor testbeams at FNAL

M. Arneodo, M. Obertino, M. Ruspa, A. Solano, A. Vilela Pereira

1E

FBK ATLAS09 (QUALIFICATION BATCH)

CMS pixel detectors

1E

1E

Different wafer thicknesses: 200-230-250 m

Slim edge (200 m on two sides)

1E

Lots of wafers available, but …waiting for a general agreement with ATLAS about the use of CMS sensors

Expected low leakage current and high breakdown.