3d s en sor testbeams at fnal
DESCRIPTION
3D s en sor testbeams at FNAL. M. Arneodo, M. Obertino, M. Ruspa, A. Solano, A. Vilela Pereira. FBK ATL A S09 ( QUALIFICATION BATCH ). Different wafer thicknesses: 200- 230 -250 m m Slim edge (200 m m on two sides). Expected low leakage current and high breakdown. 1E. 1E. 1E. 1E. - PowerPoint PPT PresentationTRANSCRIPT
3D sensor testbeams at FNAL
M. Arneodo, M. Obertino, M. Ruspa, A. Solano, A. Vilela Pereira
1E
FBK ATLAS09 (QUALIFICATION BATCH)
CMS pixel detectors
1E
1E
Different wafer thicknesses: 200-230-250 m
Slim edge (200 m on two sides)
1E
Lots of wafers available, but …waiting for a general agreement with ATLAS about the use of CMS sensors
Expected low leakage current and high breakdown.