Amkor Confidential I May-16 2
Bio
Kamel Ait Mahiout
Joined Amkor in 2000 from various experiences R&D,
Manufacturing and Sales Marketing.
RF/Microwave and Semi-conductor technical and business
management expertise.
General Manager Amkor Europe since 2009 with a role of
growing Europe region by gaining market share and
focusing on innovation and differentiation providing
customised services to the customers.
Amkor Confidential I May-16 4
Agenda
SiP Business Model
Amkor Market Focus
Manufacturing Excellence
Amkor SiP Capabilities
Amkor Overview
Amkor Confidential I May-16 5
Broad
Geographic
Footprint 8+ million sq. ft.
of Manufacturing
Space in Asia
Korea 2.3M sf
Japan J-Devices 2.4M sf
China 1.0M sf
Taiwan 850k sf
Philippines 1.4M sf
Malaysia 400k sf
Amkor Confidential I May-16 7
Amkor + J-Devices End Markets: 2015
46%
COMMUNICATIONS
Smartphone
Tablet
Handheld device
CONSUMER
Television
Set-top box
Personal electronics
7%
COMPUTING
PC/Laptop
Hard disk drive
Peripherals
10% NETWORKING
Server
Router
Switch
15%
22% AUTOMOTIVE
Infotainment
Safety
Performance
Amkor Confidential I May-16 8
Advanced System-in-Package (SiP)
$725 Million Sales in 2015. 16% Growth Year-on-Year
Baseband Modules Digital, Memory,
PMU, Audio Digital + RFA
Sensory Modules Biometric
Silicon microphones
Automotive Infotainment
ECU MEMS motion sensor
Companion Modules WLAN, WiMax, GPS, Mobile TV
Radio Modules PA, Transceiver, FEM, FES, Radio
Amkor Confidential I May-16 9
World’s Largest OSAT For Automotive ICs
Camera
Modules
Body
Systems
Safety
Systems
Info-
Center
MEMS &
Sensors
$750 Million Combined Amkor + J-Devices Sales in 2015
Amkor Confidential I May-16 11
Traditional Semiconductor and System model
OEM (ESI, Lenovo, Sony
etc)
EMS (Foxcon, Flextronixs,
Jabil etc)
Semi Comp. (Avago, Skyworks,
QTI etc)
OSAT ( AMKOR, ASE, etc)
OSAT model
Single Die Pkg
Trend
Multi Die SiP: - RF FE
- Connectivity
EMS model:
Board and Final
Assy
Trend
Modularization
Amkor Confidential I May-16 12
SiP - Emerging model driven by modularization
OEM (ESI, Lenovo, Sony
etc)
EMS (Foxcon, Flextronixs,
Jabil etc)
Semi Comp. (Avago, Skyworks,
QTI etc)
OSAT ( AMKOR, ASE, etc)
OSAT model
Single Die Pkg
Trend
Multi Die SiP: - RF FE
- Connectivity
EMS model:
Board and Final
Assy
Trend
Modularization
OSAT / EMS
SiP for mobile
devices
• NEO / Trinity
• WLSiP
- Complexity of mobile devices drives further modularization: ESI lead OEM
- OSAT technology required / EMS expertise insufficient: System companies take the lead
Amkor Confidential I May-16 13
Transforming Reference Design to SiP
Integrated Solutions
Plug-in Solutions
Wearable Solutions
SiP
Single/Multiple
Die Package
Reference Design PCB Mother Board
Sys
tem
Siz
e R
eductions
MCP
Amkor Confidential I May-16 14
Reference Design
Amkor SiP Solution Capabilities
Small Form Factor Passive comp.
/IPD/Embedded
Embedded & Conformal Shielding
Antenna, Crystal, SAW/BAW Filters
Side by Side
Stacked
PoP .
3D-WLFO Benefits
H
Cavity
POSSUM™
F2F
Leadframe 2.5D/3D
Amkor Confidential I May-16 17
SiP Market Segments
Wireless (frontend, transceiver, …)
Solid state drive (SSD)
Automotive
IoT (connectivity, MEMS, sensors, …)
Amkor Confidential I May-16 18
Mobile SiP – FEM, Display, Touch, GPS, WiFi PMIC, etc.
Application Processor
Baseband Processor
NAND
Touch Screen
Controller
Display Touch-Screen
FEM
Multiband/ mode
Transceiver
An
ten
na sw
itch
Filters
Du
ple
xer
Po
we
r Am
plifie
r
Mobile DDR
WiFi/BT
MEMS
Camera
Audio Processor
Battery PMIC
GPS
SiP SCSP
PoP/fcSCSP
WLCSP
fcCSP
WLCSP
MLF MLF
CABGA
WLCSP
WLCSP
fcCSP SiP
Amkor Confidential I May-16 19
SSD Market Segment
Market Segment
– Enterprise
– Client
Platform
– Enterprise SSDs
– Standard SATA
– mSATA
– M.2
– SiP (single package)
www.samsung.com
www.Intel.com
www.amzaon.com
www.amzaon.com
Amkor SSD SiP
Amkor Confidential I May-16 20
Amkor Automotive SiP
Large singulated body SiP
Infotainment & ADAS
Autonomous driving
Computers in a car
Increasing trend in designs
55 x 72 mm, Network Switch, ASIC + Memory
42.5 x 42.5 mm, Infotainment, Processor + DDR
Amkor Confidential I May-16 21
IoT/Wearable SiP
Driving advanced packaging fusion with and without sensors
Memory ASIC L
Amkor Confidential I May-16 23
High accuracy chip shooter 3D Solder Paste Inspection
X-axis high accuracy screen printer
Amkor K4 Advanced SMT Center of Excellence
Full inline hands-free SMT machine configuration
Recipe control by RFID
HVM for 150um pitch CuP and available 90um CuP pitch
HVM of 0402 and possible 0201
Automatic component withdrawal by RFID base component
management system