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Evolution of CMP Pad Conditioners
& Abrasive Technology’s
Leadership Role
Northern California Chapter of the American Vacuum
Society
June 1, 2005
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Historical Perspective
1990s• Early diamond pad conditioning
disks were manufactured using electroplating technology to bond diamond to the substrate.
• EP disks often caused high down time & wafer defects.
Diamond Nickel Where is Waldo?
Electroplated - circa 1990
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AT’s Entry Into the Market
• AT began manufacturing CMP pad conditioner disks in late 1995.
• AT was approached by an end user seeking to “cut”polyurethane materials.
Brazed - circa 1995
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AT’s Entry Into the Market
• P.B.S.® brazing process was selected based on its superior crystal retention.
• AT was the FIRST to manufacture a brazed CMP pad conditioner.
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AT: A Natural Leader
• AT has a deep knowledge of diamond and grinding, which are fundamental to CMP pad conditioning today.
• While CMP pad conditioners have been around since the 1990s, AT has been involved in superabrasives since 1971.
AT was a natural to take the leadership position in the evolution of CMP pad conditioners
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AT Overview
• Founded in 1971 in Columbus, Ohio• Globally integrated leader in super-
abrasive grinding products.• Process-centered organizational
structure to facilitate excellent communications and service to customers.
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AT Markets Served
• Automotive• Bearings• Ceramics• Composites• Oil & Gas• Textiles• Tires• Tool & Die• Toolroom• Medical • Stone
•General Industrial• Ferrite• Friction•CV Joint•Glass Fabrication•Refractory•CMP / Electronics•Aerospace•Glass• Lapidary •Ophthalmics
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AT’s Global Presence
Headquarters: Lewis Center, Ohio, USA• Elgin, Illinois, USA• Johnson City, Tennessee, USA•Montreal, Quebec, Canada•Barcelona, Spain • London, UK•Colwyn Bay, UK
• Lichfield, UK• Saltash, UK• Singapore• Poland•Germany• Taiwan•China
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Generation #1: 1995-1997
• Introduction of P.B.S.®brazed process.
• Early stages featured industrial quality products, but quickly moved to highly engineered and controlled products.
• Use of brazed conditioners resulted in lower cost of ownership & defectivity.
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Generation #2: 1997-1999
• Continued working with major customers to refine product.• Inspection parameters fixed & serialization was added to
improve traceability.
155764(Disk Serial #)
5511718(Patent #)
S3410538X(ATI part #)
2D Bar Code(contains disk serial #)
ATI
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Generation #3: 1999-2000
• Introduction of Infinity™ and Infinity II™ pad conditioners.
• Introduction of RAS (Relative Abrasive Sharpness).
• Introduction of pre-conditioning.
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
Pad
Rem
oval
Rat
e (m
m/h
r)
5.2
5.4
5.6
5.8
6
6.2
6.4
6.6
RA
S (R
elat
ive
Abr
asiv
e Sh
arpn
ess)Pad Removal Rate
Calibrated RAS
Shape A Shape B Shape C Shape D
Pad Removal Rate & RAS as a function of 100 mesh Abrasive Shape
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Generation #4: 2000-2001
Complete Data
Record
Abrasive, Braze Weight
Manufacturing Operators
Abrasive Applicator
Specific FurnaceExact Within -
Furnace Location
Furnace Profile
FP Visual Inspection
FP Inspector
RAS
Flatness
(Crystal Count)
(Covered Crystals)
(Crystal Exposure)
QC Visual Inspection
QC Inspectors
ConditioningProtective Coating
• Introduction of better temperature control, clean scribe lines & improved process monitoring.
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Generation #5: 2001-2003
Pad Removal Rate Comparison, IC-1000 Padwith DI Water
0
0.02
0.04
0.06
0.08
0.1
0.12
Tungsten Very LongLife (20+hrs)
Tungsten Long Life(15+ hrs)
Legacy Disk
Disk Type
Pad
Rem
oval
Ra
te (m
m/h
our)
Conditioner Disks for Tungsten CMP
• Introduction of Process Infinity™-- Tailoring of abrasive, concentration and type allowed the disk to better perform for specific processes.
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Generation #6: 2004-Present
Multi-step in-situ Copper CMP**
15
45
0
10
20
30
40
50
60
Legacy Infinity v6.1
Disk
Life
, Hou
rs
** Fab Data
Oxide CMP**
40
70
0
10
20
30
40
50
60
70
80
Legacy Infinity v6.1
Dis
k Li
fe, H
ours
** Fab Data
• Introduction of Infinity v6.1™
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Product Development Expertise
• AT is successful at developing solutions to address customers’ needs.
• AT has proven strength in sustaining and evolving a product line. ∗ Example is the Two Striper® product line.
− Founded in 1971 as the initial AT product. − Has successfully evolved through many
generations and applications. − Continues today to evolve and grow. − Among AT’s most successful product lines.
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Collaboration
• Common thread through all generations is involvement & communication with end users.
• Next solutions will come from collaborative work between slurry / pad & conditioner makers.
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Lessons Learned
• In the past, products took many years to develop -- now we require quicker learning cycles, quicker time to yield.
• Learning times of years are not possible as our customers move forward we need to move forward also.
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Successes - Have Farther to Go!
• “Best in class” of a few years ago is now not acceptable. • Our focus is to keep the technology moving forward.
100 Mesh Shaping Characterization
0%
10%
20%
30%
40%
50%
60%
Blocky Non Blocky .
Wei
ght P
erce
nt
Shape AShape BShape CShape D
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AT’s Future in CMP
• Commitment to continue to move product & technology forward.
• Introduce alternative bonding materials -- hyper-corrosion resistance.
• Re-exploration of electroplating -- bringing this technology back to the forefront of CMP.
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Ready to meet the Challenge!
Source: EE Times Issue 1252 (Lightspeed Semiconductor))