FloTHERM XT Flotrend Seminar
23 May 2013 1
Voon Hon Wong, PhD.
FloTHERM®XT Introduction
FloTHERM v10 demonstration
Mechanical Analysis Division
www.mentor.com© 2013 Mentor Graphics Corp. Company Confidential
Agenda
IWC, FloTHERM XT Intro, April 2013
� Project Motivation
� FloTHERM XT Review
� FloTHERM XT Demo
� FloTHERM v10 introduction
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Mentor Graphics
� Founded in 1981
� Revenue last fiscal year > $1 billion
� Software and hardware products— Electronics Design and Simulation (EDA):
– IC– PCB– Electrical System Design– Embedded Software
— Mechanical Analysis:– Electronics Cooling Software– 1D & 3D General Purpose Computational Fluid Dynamics (CFD)
– Hardware for Thermal Characterization of Electronics and LEDs
Wilsonville, Oregon U.S.A. Headquarters
IWC, FloTHERM XT Intro, April 2013
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� 1D Thermo-Fluid CFD for Aero, Auto, Process and Power Generation Industries
� Flowmaster ® – fast and accurate simulation of fluid mechanics and pipe flow in complex systems
� Concurrent CFD for All Industries� FloEFD ™– a paradigm shift in CFD: fully embedded in
the mechanical design environment
� Heating and Ventilation in Buildings� FloVENT ® – optimizes airflow, temperature distribution
and contamination control in and around buildings
� Hardware for Thermal and Optical Testing� T3Ster ® – thermal testing of electronic parts and systems
� Thermal Analysis of Electronic Systems� FloTHERM® – CFD market leader in the electronics
vertical market (IC Packages, PCBs, Systems)� FloTHERM ® XT – Concept through verification electronics
cooling simulation
Mentor’s Mechanical Analysis Solutions
IWC, FloTHERM XT Intro, April 2013
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Systems Design Division Heritage
IWC, FloTHERM XT Intro, April 2013
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Systems Design Division Today
PCB Development Solutions
BOARD SYSTEMS DIVISION
DxDesignerFPGA DesignHyperLynx SI & PIHyperLynx ThermalExpedition PCBXtremePCBECAD/MCADFabLink XEvisECADPADSHL 3D
PCB Assembly, Test, & Manufacturing Execution
VALOR DIVISION
Valor NPIVPLvPlanvManagevCheckValor MSS
Thermal Analysis & Fluid Dynamics
MECHANICAL ANALYSIS DIVISION
FloTHERMFloEFDT3SterTERALEDFlowmaster
Platform Engineering
INTEGRATED ELECTRICAL SYSTEMS DIVISION
CapitalVeSys
IWC, FloTHERM XT Intro, April 2013
FloTHERM XT
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PROJECT MOTIVATION
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Technology Trend - Integrated Circuits Increasing in Heat Dissipation
� Increasing IC power dissipation driven by speed and density— Boards exceeding 300W— Systems exceeding 1000’sW— Smaller form factors driving heat
density
Alcatel-Lucent >300W per bladeSource: Intel
IWC, FloTHERM XT Intro, April 2013
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Technology Trend - PCBs & Systems: Denser, Faster, Hotter!
* Data based on Mentor Graphics Technology Leadership Awards (TLA) entry averages
3.5X
0.5X
7X increase in PCB Density
IWC, FloTHERM XT Intro, April 2013
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Customer Driven Development
IWC, FloTHERM XT Intro, April 2013
http://mentorideas.brightidea.com/mechanical
� Mentor ‘IDEAS’ site allows software enhancement requests to be posted and voted on by users (under maintenance).
� Allows feature implementation decisions to be based on feedback from a wide portion of the user base.
� A transparent and accountable process that drives the product portfolio roadmap.
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Customer Driven Development
IWC, FloTHERM XT Intro, April 2013
� The project addresses many issues reflected by the electronics cooling community over the last 10-15 years, including feedback relating to angled/complex geometry.
� Fundamental to the FloTHERM XTproject is addressing these issues while trying to retain as much as possible the original FloTHERM DNA and ethos.
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Market Changes Require New SolutionsFor A Wider User Demographic
Mechanical Designers
Thermal Designers
Thermal Specialists
FloTHERM
MechanicalDesigners
Thermal Designers
Thermal Specialists
FloEFDFloTHERM
XT
MechanicalDesigners
Thermal Designers
Thermal Specialists
Product diversification drives wider user demographics
One size does not fit all
IWC, FloTHERM XT Intro, April 2013
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FLOTHERM XT REVIEW
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FloTHERM XT – From Concept to Verification Phases for Electronics Cooling
� Continuum supporting all phases from concept through verification/prototyping
� Interconnecting the EDA and MCAD design flows
� Targeted at the design engineer as well as thermal specialist
� Focused solely on electronics cooling
� Harnessing two successful DNAs:
� FloTHERM, and
� FloEFD as a CFD-enabling technology
IWC, FloTHERM XT Intro, April 2013
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FloTHERM XT
IWC, FloTHERM XT Intro, April 2013
Supports direct interfaces with all major CAD vendors
Full geometric and non-geometric SmartPart and Library functionality
Integrated solution progress and dynamic messaging window
CAD centric UI, geometry engine and controls
Stand-alone product, single application window
PDML import to support use of existing FloTHERM models
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Design Centricity
IWC, FloTHERM XT Intro, April 2013
� FloTHERM XT, designed with a CAD-centric UI and geometry engine, is designed to fit into the complex mechanical design environments and associated processes that exist in todays electronics companies.
� Use of FloEFD meshing and solver technology allows general non-aligned and complex geometry to be handled easily and efficiently.
� Multiple control volumes formed in any cell containing more than one material.— Shape of control volume
matches CAD geometry— Ensures that both surface
area and surface normal are correct
Fluid
Solid
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SmartPart and Library Technology
IWC, FloTHERM XT Intro, April 2013
� Retains the power and simplicity of the SmartPart infrastructure in FloTHERM.
� Utilises the power and geometric flexibility of CAD and so have been extended to handle features and parts at angles and more complex shapes.
� Support for FloTHERM style libraries with full two-way, drag & drop controls.
� All geometry and associated attributes stored together.
� Provides a consistent and familiar focus on electronics parts and the needs of the electronics thermal designer.
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Thermal Model Supply Chain
IWC, FloTHERM XT Intro, April 2013
� Features and Benefits— Existing thermal models can be
imported via the PDML format.— SmartParts will be automatically
recognised and updated to the FloTHERM XT equivalents.
— Hierarchical structure in project will be retained.
— Supports both assembly and project-based PDML, enabling support for data from FloTHERM PACK, PCB and IC.
— Also direct support for FloTHERM user created material libraries
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EDA Support
IWC, FloTHERM XT Intro, April 2013
� FloTHERM XT includes access to CircuitWorks for IDF and PADS support.
� The FloTHERM XT FloEDA Bridge module is developing into an unrivalled capability for interfacing with the EDA world –focussing initially on Expedition Enterprise.
� It currently supports a number of key features, including— Import of encrypted CCE data
from Expedition.— Filtering of thermally irrelevant
parts.— Importing of power lists— Automatic library swapping of
parts to enable appropriate thermal modelling in FloTHERM XT
— Auto-creation of 3-D PCB’s and Components.
— Edit and Update functionality, to easily remain concurrent with the Expedition design.
Expedition FloEDA Bridge
FloTHERM XT BoardFloTHERM XT System
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FLOTHERM XT DEMONSTRATION
FloTHERM XT Flotrend Seminar
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