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Thermal Considerations in PackageStacking and Advanced Module Technology
February 16, 2006
Ulrich Hansen, Director of Marketing, Staktek
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• Continued drive to increase sub-system density, functionality andperformance– Desire to differentiate systems and derive time-to-market advantages
• System-level power consumption increases– Cooling challenges– Dedicated low-power devices emerging
• Mobile systems volumes increasing– Form factor constraints increase the need for utilizing 3rd dimension
• Supply Chain complexities– New supplier entrants, capacity planning challenges, forecasting accuracy
limitations
Thermal concerns are usually on top of the list when designing high-densitysub-systems
Trends in Electronics Sub-Systems
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The DRAM market continues to go through rapid technology change–increasing the thermal and signal integrity complexities with each transition
Today’s Example: High-Density DIMM
• DRAM speeds to DDR2-667 in mid-2006,followed by DDR2-800 and DDR3
• Module capacity moving to 2GB and 4GB• Transition to Fully-Buffered DIMMs in 2006• FB-DIMM adds ~6W AMB device to each
DIMM and adds thickness / reduces airflow– Max AMB case temperature of 110C– Max DRAM case temperature of 85C
• DRAM speed and module capacityincreases drive module power consumption
• Increasing airflow drives acousticschallenge (e.g. workstations)
• High-density SO-DIMM, Mini SO-DIMM formobile applications are emerging
• DRAM prices continue to fluctuate as fabcapacity and demand change
• Timing of market introductions uncertain asoften coupled to chipset launches
• Continued drive to increasesub-system functionality andperformance
• System-level powerconsumption increases
• Mobile systems increasing
• Supply Chain complexities
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Today, Staktek’s Stakpak® is a market leading high-density DRAM technology
Staktek’s Core Technology: Device Stacking
• Solves problem of high-device density infixed DIMM form factor
• Great supply chain flexibility• Same, standard device used in both high-
density and standard DIMMs• Mature and cost effective
• Uses mature DRAM devices• High-volume manufacturing (>175M Staktek
stacks shipped)
Well suited for current and future high-densityDIMMs, but is there a better solution forthermally challenged systems?
FBGA Stacking
TSOP Stacking
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High-Density Technology Options
PoP Package
DeviceStacking
Dual-DiePackage
Advanced packaging by itself does not address the thermal challenges and introducesadditional technical and economical challenges
Remaining Questions
DIMM Sub-System Design
OptimizationNeeded …
• ThermalPerformance?
• Thickness?
• ThermalPerformance?
• High-SpeedSignal Integrity?
• Thickness?
• Direct Cost (e.g.non-standardmanufacturingprocesses, singlesource)
• Supply ChainCost (e.g.obsolescence,opportunity cost)
• Time-to-Market
• ThermalPerformance
• Direct Cost (e.g.single source)
• Supply ChainCost (e.g.obsolescence,opportunity cost)
• TechnologyMaturity
• Time-to-Market?
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ArctiCore™ Module Technology
The ArctiCore DIMM is a module technology that utilizes a double-sided, flexiblecircuit with an integrated edge connector folded around a rigid thermal core
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The ArctiCore modules deliver a number of significant, system-level benefits
ArctiCore Benefits
• Double Surface Area α High-Density
• Thinner Profile α Less motherboard space while meetingthermal requirements
• Thermally Enhanced α Less Cooling (less Costly, Quieter)
• Improved Electrical α Better High-Speed Margins
• Highly Durable α Improved Reliability and Handling Yield
• JEDEC / RoHS Compliant α Standards Compliant,Sourcing Flexibility
• Next-Gen Module Technology α Future Proof
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ArctiCore’s thinness contributes to better thermal performance for the sameDIMM socket pitch
ArctiCore Thinness
• ArctiCore FBDIMMs are thinner than conventional FBDIMMs• ArctiCore enables narrower DIMM connector pitch while maintaining airflow
– FBDIMM up to 48% thinner – RDIMM up to 20% thinner
10 .16 mm .
6.2 mm .7.65 mm .8 .2 mm .8.8 mm .
JEDEC MAX
2-RankStack
1 Rank FBDIMM
2-Rank 2-Rank Planar
2 -Rank Planar
Conventional FBDIMMs ArctiCore
2-Rank Planar
2-Rank
4.5 mm .6.2 mm . 4.5 mm .
ArctiCoreThermally Enhanced
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ArctiCore RDIMM’s provide improved thermal mass, radiating area and thermalcoupling
ArctiCore Thermal Results
FR4 DIMM w/ Package Stacking
ArctiCore
• Thermal core pulls heat back along the DIMM• Less temperature spread between DRAMs: Coolest not as cool, hottest
not as hot
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ArctiCore FBDIMMs can be cooled with with lower Airflow
ArctiCore Thermal Results
ArctiCore vs. Conventional FBDIMM (JEDEC R/C E)
Note: * Full-Module Heat Spreaders can be applied to further lower the DRAM temperature
1 m/s 2 m/s 3 m/s 4 m/s 5 m/s 6 m/s
AMB
95
80
85
90
110
115
100
105
120
130
125
75
65
70
140
135
Case
Tem
pera
ture
ArctiCore38mm
ArctiCore
Dual Die w/ AMB HS
Planar w/ AMB HS
1 m/s 2 m/s 3 m/s 4 m/s 5 m/s 6 m/s
95
80
85
90
110
115
100
105
120
130
125
75
65
70
140
135
Max DRAM Temp *
Case
Tem
pera
ture
ArctiCore38mm
ArctiCoreDual Die w/
AMB HS
Planar w/ AMB HS
Power – 16.8W
DRAMs – 36 @ 300mW
Conditions:Inlet Air – 50C
Pitch – 10.16 mm
AMB – 6W
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ArctiCore Electrical Results
• ArctiCore’s electrical properties are exceptional compared toconventional printed circuit boards.
• The interconnect environment of the flexible circuit, with its tightspacing and effective dielectrics, is tailored for high-speed signalpropagation at ultra-low crosstalk levels.
ArctiCore Conventional
Conditions: Post Register Address on JEDEC Raw Card-J RDIMM @ DDR2-533
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Sample Sub-Systems
• Processor (Micro, DSP) + DRAM• Processor + DRAM + FLASH• Processor + ASIC• ASIC + DRAM + FLASH• ASIC + Imager + DRAM• MP3 + FLASH• MP3 + GPS + FLASH• MP3 + Radio (Bluetooth, WiFi,
Cellular)
Advanced Module Technology –Additional Applications
Applications
• Computing• Medical• Telecommunication• Defense
Consumer Electronics:• MP3 Player• Cell Phone• GPS• Digital Camera• Digital Video
Most mobile devices represent form factor challenges as more and morefeatures move into the products
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We apply our experience of >175M device stacks to develop and implementhighly standardized manufacturing processes
Example: Processor + DRAM
IllustrativeStandard SMT processes to assemble & test ‘flat’
Simple ‘fold’ step with adhesive utilizing a auto / semi-auto precision fold tool
‘Fold’ step with thermal core inserted
Processor
DRAM 1
DRAM 2
Thermal Core
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Advanced module technology provides time-to-market advantages for next-generation feature integration – often in conjunction with advanced packaging
Advanced Packaging
Feature A(e.g. MP3)
Feature B(e.g. GPS)
Feature C(e.g. Flash)
3D Packagingor
Chip-Integration (Single Die)
3D Packagingor
Chip-Integration (Single Die)
Feature C
Next-Generation Product
‘Planar’
Feature C
Package 2
Feature D
Package 3
FeaturesA + B+ +
+
FeaturesA + B + C
Package 1
FeaturesA + B
“Add Feature D”
FeaturesA + B + CPackage 1
Feature D
Package 2
+
3-Device System StakpakThinner,
2-Device System Stakpak
3-Device System StakpakThinner,
2-Device System Stakpak
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Staktek is a technology IP company providing solutions for sub-system formfactor optimization, including thermal optimization
Summary
• ArctiCore DIMMs have superior thermal performance and provideheadroom to scale into next-generation DRAM speeds
• ArctiCore DIMMs are a great example of Staktek’s sub-systemoptimization in a given, fixed form factor
• Sub-system optimization has many applications, e.g. in form-factorconstraint mobile devices
• Staktek’s System Stakpak is a flexible architecture to deliver sub-system optimization, including thermal solutions with integrated cores
• Meets form factor requirements• Low risk, low investment – standard manufacturing processes• Time-to-market advantage prior to package-level optimization• Accommodates regular or advanced packages