dspic33ck256mp506 digital power plug-in module (pim) user...

2018 Microchip Technology Inc. DS50002819A

dsPIC33CK256MP506Digital Power

Plug-In Module (PIM)User’s Guide

DS50002819A-page 2 2018 Microchip Technology Inc.

Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights unless otherwise stated.

Note the following details of the code protection feature on Microchip devices:• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

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== ISO/TS 16949 ==

TrademarksThe Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A.Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies.© 2018, Microchip Technology Incorporated, All Rights Reserved.

ISBN: 978-1-5224-3763-5

dsPIC33CK256MP506 DIGITAL
POWER PIM USER’S GUIDE
Table of Contents

Preface ........................................................................................................................... 5Introduction............................................................................................................ 5Document Layout .................................................................................................. 5Conventions Used in this Guide ............................................................................ 6Recommended Reading........................................................................................ 7The Microchip Website.......................................................................................... 7Product Change Notification Service..................................................................... 7Customer Support ................................................................................................. 7Document Revision History ................................................................................... 7

Chapter 1. Overview....................................................................................................... 91.1 Introduction ..................................................................................................... 91.2 Features ......................................................................................................... 9

1.2.1 Test Points ................................................................................................ 101.2.2 Electrical Characteristics ........................................................................... 101.2.3 Analog and Digital Signals ........................................................................ 101.2.4 dsPIC33CK256MP506 DP PIM – PCB Edge Connector ........................... 11

1.3 UART Communication .................................................................................. 111.4 Low-Frequency Bode Plot Measurements ................................................... 11

Appendix A. Board Layout and Schematics.............................................................. 13A.1 Pinout ........................................................................................................... 13A.2 Board Schematics ........................................................................................ 15A.3 PCB Layout .................................................................................................. 17

Appendix B. Bill of Materials (BOM)........................................................................... 21B.1 Bill of Materials ............................................................................................. 21

Worldwide Sales and Service .................................................................................... 24

2018 Microchip Technology Inc. DS50002819A-page 3

dsPIC33CK256MP506 Digital Power PIM User’s Guide

NOTES:


dsPIC33CK256MP506 DIGITALPOWER PIM USER’S GUIDE

Preface

INTRODUCTIONThis chapter contains general information that will be useful to know before using the dsPIC33CK256GS806 Digital Power Plug-In Module (PIM). Items discussed in this chapter include:• Document Layout• Conventions Used in this Guide• Recommended Reading• The Microchip Website• Product Change Notification Service• Customer Support• Document Revision History

DOCUMENT LAYOUTThis document describes how to use the dsPIC33CK256MP506 Digital Power PIM as a development tool to emulate and debug firmware on a target board. The document is organized as follows:• Chapter 1. “Overview” — This chapter introduces the dsPIC33CK256MP506

Digital Power PIM and provides a brief overview of its various features.• Appendix A. “Board Layout and Schematics” — This appendix presents the

schematics and the board layouts for the dsPIC33CK256MP506 Digital Power PIM.

• Appendix B. “Bill of Materials (BOM)” — This appendix presents the Bill of Materials for the dsPIC33CK256MP506 Digital Power PIM.

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our website (www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level of the document.

For the most up-to-date information on development tools, see the MPLAB® IDE online help. Select the Help menu, and then Topics to open a list of available online help files.


http://www.microchip.com


CONVENTIONS USED IN THIS GUIDEThis manual uses the following documentation conventions:

DOCUMENTATION CONVENTIONSDescription Represents Examples

Arial font:Italic characters Referenced books MPLAB® IDE User’s Guide

Emphasized text ...is the only compiler...Initial caps A window the Output window

A dialog the Settings dialogA menu selection select Enable Programmer

Quotes A field name in a window or dialog

“Save project before build”

Underlined, italic text with right angle bracket

A menu path File>Save

Bold characters A dialog button Click OKA tab Click the Power tab

N‘Rnnnn A number in verilog format, where N is the total number of digits, R is the radix and n is a digit.

4‘b0010, 2‘hF1

Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>Courier New font:Plain Courier New Sample source code #define START

Filenames autoexec.bat

File paths c:\mcc18\h

Keywords _asm, _endasm, static

Command-line options -Opa+, -Opa-

Bit values 0, 1

Constants 0xFF, ‘A’

Italic Courier New A variable argument file.o, where file can be any valid filename

Square brackets [ ] Optional arguments mcc18 [options] file [options]

Curly brackets and pipe character: { | }

Choice of mutually exclusive arguments; an OR selection

errorlevel {0|1}

Ellipses... Replaces repeated text var_name [, var_name...]

Represents code supplied by user

void main (void){ ...}


Preface

RECOMMENDED READINGThis user’s guide describes how to use the dsPIC33CK256MP506 Digital Power PIM. Other useful document(s) are listed below. The following Microchip document(s) are recommended as supplemental reference resources.• “dsPIC33EPXXXGS70X/80X Family Data Sheet” (DS70005258) is available for

download from the Microchip website (www.microchip.com)

THE MICROCHIP WEBSITEMicrochip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information:• Product Support – Data sheets and errata, application notes and sample

programs, design resources, user’s guides and hardware support documents, latest software releases and archived software

• General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events; and listings of Microchip sales offices, distributors and factory representatives

PRODUCT CHANGE NOTIFICATION SERVICEMicrochip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest.To register, access the Microchip website at www.microchip.com, click on Product Change Notification and follow the registration instructions.

CUSTOMER SUPPORTUsers of Microchip products can receive assistance through several channels:• Distributor or Representative• Local Sales Office• Corporate Application Engineer (CAE)• Embedded Solutions Engineer (ESE)Customers should contact their distributor, representative or Embedded Solutions Engineer (ESE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.Technical support is available through the website at: http://www.microchip.com/support.

DOCUMENT REVISION HISTORYRevision A (October 2018)This is the initial release of this document.





http://www.microchip.com/support


NOTES:



Chapter 1. Overview

1.1 INTRODUCTIONThe dsPIC33CK256MP506 Digital Power Plug-In Module (DP PIM) is a demonstration board that, in conjunction with different power boards, showcases the Microchip dsPIC33CK256MP506 16-bit Digital Signal Controller (DSC) features. The DP PIM provides access to the dsPIC33CK256MP506 analog inputs, the Digital-to-Analog Converter (DAC) output, the Pulse-Width Modulator (PWM) outputs and the General Purpose Input and Output (GPIO) ports. The Microchip series of DP PIMs for digital power share the same pinout at the mating socket. However, these PIM cards show slightly different performing characteristics.

1.2 FEATURESThe dsPIC33CK256MP506 DP PIM has the following features, as shown in Figure 1-1:

FIGURE 1-1: dsPIC33CK256MP506 DP PIM

1. Microchip dsPIC33CK256MP506 16-Bit Digital Signal Controller (64-pin TQFP package).

2. ICSP™ programming header (6-pin, 2.54 mm header).3. On-board LDO with Power Good (PG) function.4. Solder pad for ground connection.5. Micro USB connector.6. MCP2221A USB to UART/I2C serial converter.7. Power indicator LED (Green).8. User LED (Red).9. Board edge connection interface for analog inputs/outputs, PWM outputs and

GPIO ports.10. Analog input with op amp buffer via test point loop connector; can be used for

Bode plot measurements.11. Op amp buffer for Bode input.12. Test point loop for DAC output.13. Op amp buffers for shared ADC inputs.14. MEMS oscillator.Board dimensions are: 51 mm (length) x 38.5 mm (width).

1

2

4

5

78

611

10

13

12

14

3

9

A D

4

9

AD



1.2.1 Test PointsTable 1-1 lists the test points on the dsPIC33CK256MP506 DP PIM.

1.2.2 Electrical CharacteristicsTable 1-2 shows the electrical characteristics of the dsPIC33CK256MP506 DP PIM.

1.2.3 Analog and Digital SignalsThe dsPIC33CK256MP506 DP PIM ensures good signal integrity and provides all signals needed to control a power train. These signals are divided into two main sections: Analog, marked with A; Digital, marked with D (see Figure 1-1).1. Analog Section

The analog section is located at the left connector side (smaller section in Figure 1-1). It consists of 17 signals, all referenced to analog ground. These lines are split into four subsections:• High-Speed Comparator Inputs: RC filtered with corner frequency of 10 MHz

and maximum signal rise/fall time of 33 ns. These lines are designed to be used with on-chip comparators for signal zero-cross detections, etc.

• High-Speed ADC Inputs: RC filtered with corner frequency of 2 MHz and maximum signal rise/fall time of 180 ns. These lines are connected to the Track-and-Hold (T&H) circuitry of the dedicated ADC inputs and to the Sample-and-Hold (S&H) circuitry of the shared ADC inputs.

• High-Speed ADC Inputs: Buffered through operational amplifiers. RC filtered with corner frequency of 1 MHz and maximum signal rise/fall time of 347 ns. These lines are connected to the Sample-and-Hold (S&H) circuitry of the shared ADC inputs.

• Medium Speed ADC Inputs: RC filtered with corner frequency of 190 kHz and maximum signal rise/fall time of 1.8 µs. These lines are connected to the Sample-and-Hold (S&H) circuitry of the shared ADC inputs. The different RC filtering is needed because of the significant difference between T&H and S&H circuitry, and the sampling times.

TABLE 1-1: TEST POINTSTest Point Name Function/Description

TP1, TP2 Bode Measurement Signal Insert PointTP3 RA3_DAC1_OUT: Digital-to-Analog Converter OutputTP4 Test Point for Debug (right upper corner of the MCU)TP5 General Purpose Test Point Connected to Port RD15 together

with LD2 (Red LED) (near to the right bottom corner beside LD2)

TABLE 1-2: ELECTRICAL CHARACTERISTICSParameter Value

Input Voltage Range 3.6 VDC to 6.3 VDC

Current Consumption <100 mAPower Dissipation <0.6W max.Operating Temperature Range -40°C to +85°C


Overview


2. Digital SectionThe digital section is located at the right connector side (larger section in Figure 1-1). It consists of 31 signals, all referenced to digital ground. These lines are split into four subsections:• High-Speed PWM Outputs: Each line has a 75 series resistance.• Medium Speed GPIO: Each line has a 270 series resistance.• Programing/Debugging Lines: Each line has a 100 series resistance.• Communication Lines (I2C): Each line has a 100 series resistance.

1.2.4 dsPIC33CK256MP506 DP PIM – PCB Edge ConnectorThe dsPIC33CK256MP506 DP PIM has an edge connector compatible with any application board that provides a mating socket.The mating socket type is Samtec, Inc.: MECF-30-01-L-DV-WT.

1.3 UART COMMUNICATIONThe on-board USB to UART serial bridge enables easy serial connection to PCs. The USB port can provide power to the digital power PIM and allows the user to communicate with the dsPIC® Digital Signal Controller (DSC).

1.4 LOW-FREQUENCY BODE PLOT MEASUREMENTSThe dsPIC33CK256MP506 device, with the additional on-board circuitry, is able to perform Bode plot measurements without the need for an isolation transformer. The transformer might be difficult to use if the injecting signal tends to be at a very low frequency (for instance, in case of Power Factor Correction (PFC) applications).Perform the following steps:1. Solder the 150 resistor from position R74 to R94.2. Run the power stage in Open-Loop mode with a fixed duty cycle.3. Connect the Bode 100 AC output across TP2 and TP1. The on-board operational

amplifier is adding a VDD/2 (1.65V) offset. In this case, no injection transformer is needed.

4. Connect RA3_DAC1_OUT to CH2 of the Bode 100.5. Use the AN18 input to sample the signal from Bode 100 in every PWM cycle at

Frequency Switching (FSW) (action in firmware is needed).6. Remove the VDD/2 offset to regain a signal with no DC value (action in firmware

is needed).7. Add sampled AC signal to the nominal duty cycle (PDCx) (action in firmware is

needed).8. Use a second dedicated ADC core input (ANx) to sample the output of the plant

at FSW. The output can be:• Output voltage• Average coil current sampled at TON/2, where TON is the switch-on time.

9. Duty cycle input and plant output are converted into an analog signal using RA3_DAC1_OUT.

Note: RC filtering and series resistance are needed for good signal integrity, and for reducing EMI issues. Hence, the board can be used for development purposes under frequent plug-in/out cycles. This decoupling also increases robustness in case of accidental shorts and EMC issues.


Measured transfer function is the plant (Power Stage + Digital Modulator), after scaling and ADC sampling, versus digital duty cycle input (PDCx).

Figure 1-2 and Figure 1-3 show measuring procedure examples for plant and closed-loop measurements.

FIGURE 1-2: MEASURING PROCEDURE FOR PLANT MEASUREMENT

FIGURE 1-3: MEASURING PROCEDURE FOR CLOSED-LOOP MEASUREMENT

Note: Due to run-time delays of Sample-and-Hold circuits and conversion time of ADC and DAC, this measurement is only recommended for low-frequency measurements (a maximum of two decades below sampling frequency).

Power Stage

PWM

VOUTVIN

NominalDuty Ratio

Output

+Signal Injection

AN18

VDD/2

Remove Offset

InBode100

In

DAC1

Bode100Generator

VDD/2

50R

CH2

CH1

VBODE

G=2

VAMP=VDD/2+2xVBODE

Output

Power Stage

PWM

VOUTVIN

Compensator

Output

Bode100Generator

InBode100

In

VDD/2

SignalInjection

ANx

VDD/2

Remove Offset

Min/MaxClamp

Reference

AN18

+

DAC1

50R

CH2

CH1

VBODE

VAMP=VDD/2+2xVBODE

Output



Appendix A. Board Layout and Schematics

This appendix contains the pinout, the schematics and the board layouts for the dsPIC33CK256MP506 DP PIM.• Pinout• Board Schematics• PCB Layout

A.1 PINOUTPinout and electrical parameters are shown in Table A-1.

TABLE A-1: PINOUT AND ELECTRICAL PARAMETERS

NameEdge

Connector Pin

Device Pin Function/Description Remark

GND_A 1 20 Analog Ground —GND_A 2 20 Analog Ground —RA3_DAC1_OUT 3 17 DAC Output, Optional RC

Filter560R series resistance

RC3_AN15_IN 4 27 Analog Input, RC Filtered Fc = 190 kHz, tr = 1.8 µsRB8_AN10_IN 5 48 Analog Input, RC Filtered,

BufferedFc = 1 MHz, tr = 347 ns

RB2_AN1_IN 6 33 Analog Input, RC Filtered Fc = 1.9 MHz, tr = 180 ns— 7 — — —

RA4_CMP3B_IN 8 18 Analog Input, RC Filtered Fc = 10 MHz, tr = 33 nsRC6_AN17_IN 9 24 Analog Input, RC Filtered,


RB7_AN2_IN 10 47 Analog Input, RC Filtered, Buffered

Fc = 1 MHz, tr = 347 ns

RA1_ANA1_IN 11 15 Analog Input, RC Filtered Fc = 1.9 MHz, tr = 180 nsRA0_AN0_IN 12 14 Analog Input, RC Filtered Fc = 1.9 MHz, tr = 180 nsRD11_AN19_IN 13 30 Analog Input, RC Filtered Fc = 1.9 MHz, tr = 180 nsRC7_AN16_IN 14 32 Analog Input, RC Filtered,


RD10_AN18_IN 15 31 Analog Input, RC Filtered, Optional Bode Input

Fc = 1.9 MHz, tr = 180 ns

RC0_AN12_IN 16 13 Analog Input, RC Filtered Fc = 190 kHz, tr = 1.8 µsRC2_AN14_IN 17 23 Analog Input, RC Filtered Fc = 190 kHz, tr = 1.8 µsRC1_CMP1B_IN 18 22 Analog Input, RC Filtered Fc = 10 MHz, tr = 33 nsRA2_AN9_IN 19 16 Analog Input, RC Filtered Fc = 190 kHz, tr = 1.8 µsRB1_AN6_IN 20 29 Analog Input, RC Filtered Fc = 190 kHz, tr = 1.8 µs

slot 21 slot slot slotslot 22 slot slot slot

RB9_RP41 23 49 Digital General Purpose 270R series resistance



RC8_RP56_ASDA1 24 36 Digital General Purpose 100R series resistanceRC10_RP58 25 52 Digital General Purpose 270R series resistanceRD14 26 11 Digital General Purpose 270R series resistanceRC11_RP59 27 53 Digital General Purpose 270R series resistanceRD9 28 38 Digital General Purpose 270R series resistance

— 29 — — —— 30 — — —

RC14_PWM6H 31 5 PWM Output 75R series resistanceRC9_RP57_ASCL1 32 37 Digital General Purpose 100R series resistanceRC15_PWM6L 33 6 PWM Output 75R series resistanceRD5_RP69 34 44 Digital General Purpose 270R series resistanceRC4_RP52 35 50 Digital General Purpose 270R series resistanceRD6_RP70 36 43 Digital General Purpose 270R series resistanceRB10_PWM3H 37 61 Digital General Purpose 75R series resistanceRC5_RP53 38 51 Digital General Purpose 270R series resistanceRD2_RP66 39 58 Digital General Purpose 270R series resistanceRB13_PWM2L 40 64 PWM Output 75R series resistanceRB11_PWM3L 41 62 PWM Output 75R series resistanceRB12_PWM2H 42 63 PWM Output 75R series resistanceRD1_PWM4H 43 59 PWM Output 75R series resistanceRD0_PWM4L 44 60 PWM Output 75R series resistanceRB14_PWM1H 45 1 PWM Output 75R series resistanceRC12_RP60 46 3 Digital General Purpose 270R series resistanceRB15_PWM1L 47 2 PWM Output 75R series resistanceRC13_RP61 48 4 Digital General Purpose 270R series resistanceMCLR_IN 49 7 Device Reset 100R series resistanceRD7_RP71 50 42 Digital General Purpose 270R series resistanceRB4_PGC2 51 35 Programing/Debugging 100R series resistanceRD8_RP72 52 39 Digital General Purpose 270R series resistanceRB6_SCL2 53 46 Digital General Purpose 100R series resistanceRD13 54 12 Digital General Purpose 270R series resistanceRB5_SDA2 55 45 Digital General Purpose 100R series resistanceRB3_PGD2 56 34 Programing/Debugging 100R series resistanceVDD 57 LDO VDD Rail 6.3V max, 70 mA maxGND_D 58 9,26,40,56 Digital Ground —VDD 59 LDO VDD Rail 6.3V max, 70 mA maxGND_D 60 9,26,40,56 Digital Ground —

TABLE A-1: PINOUT AND ELECTRICAL PARAMETERS (CONTINUED)

NameEdge

Connector Pin

Device Pin Function/Description Remark


Board Layout and Schematics

A.2

BO

AR

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A-1

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dsPI

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5600

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100 p

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F50

V04

02

C17

GN

D_D

GN

D_D

GN

D_D

GN

D_D

GN

D_A

GN

D_A

GN

D_A

GN

D_A

GN

D_A

GN

D_A

GN

D_A

1k 0402

1%R77

5600

pF06

0325

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C32

GN

D_A 56

00 pF

0603

25V

C38

GN

D_A

GN

D_D

TP3

GN

D_A

GN

D_D

GN

D_A

GN

D_A

5600

pF06

0325

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C40

GN

D_A10

0 pF

0603

50V

C39

GN

D_A

GN

D_A

560 p

F06

0350

V

C30

Fg =

500

kH

z

GN

D_D

100R

R20

100R

R21

560 p

F06

0350

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C31

GN

D_A

GN

D_A

75R

R42

75R

R41

RED

0603

LD2

12

34

56

78

910

1112

1314

1516

1718

1920

2324

2526

2728

2930

3132

3334

3536

3738

3940

4142

4344

4546

4748

4950

5152

5354

5556

5758

5960

Edge

Car

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J5

RB0_

CLKI

+3.3

V_O

PA

GN

D_A

0.1 μ

F50

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02

C20

GN

D_A

VIN-

3

VIN+

1VOUT

4VSS 2

VDD5

MCP6

V91U

TU

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RA3_

DAC1

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RA3_

DACO

UT1

RB2_

AN1

RB3_

PGD2

RB4_

PGC2

+3.3

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MCLR

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4_PG

C2RB

6_SC

L2RB

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1k 0402

1%R78

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C21

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D_A

VIN-

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V91U

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V_O

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1k 0402

1%R79

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GN

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F50

V04

02

C22

GN

D_A

VIN-

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VDD5

MCP6

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TU

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A_3

+3.3

V_O

PA

+3.3

V_O

PA

GN

D_A

0.1 μ

F50

V04

02

C23

GN

D_A

OP

A_4

+3.3

V_O

PA

1k 0402

1%R80

OPA_

1_IN

OPA_

2_IN

OPA_

3_IN

OPA_

4_IN

150R

0603

1%R74

150R

0603

1%R60

150R

0603

1%R63

150R

0603

1%R64

150R

0603

1%R70

150R

0603

1%R61

150R

0603

1%R62

150R

0603

1%R68

150R

0603

1%R69

5600

pF25

V06

03

C43

150R

0603

1%R71

VIN-

3

VIN+

1VOUT

4VSS 2

VDD5

MCP6

V91U

TU

4

27R

0603

1%R67

27R

0603

1%R66

27R

0603

1%R73

1 μF

10V

0402

C13

1 μF

10V

0402

C14

1 μF

10V

0402

C15

1 μF

10V

0402

C16MC

LR

+3.3

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Pro

gram

min

g

GN

D_D

1 2 3 4 5 6

HDR-2.54 Male 1x6

J1

RB3_

PGD2

RB4_

PGC2

MCLR

+3.3

V

GN

D_D

100R

0402

1%R

1310

k04

021%R

12 56 pF

50V

0402

C25

MCLR

_INM

CLR

_IN

SDA

2

SCL2

UA

RT

TX

UA

RT

RX

MCLR

_IN

RC7_

AN16

RC0_

AN12

RC3_

AN15

RC1_

CMP1

B

RA2_

AN9

RA3_

DACO

UT1

RA1_

ANA1

RA1_

ANA1

_IN

RA4_

CMP3

B

RA0_

AN0_

INRA

0_AN

0

RC6_

AN17

RB1_

AN6

GN

D_A

150R

0603

1%R65

RB2_

AN1_

IN

RD10

_AN1

8RD

11_A

N19

5600

pF06

0325

V

C41

RC8_

RP56

_ASD

A1

RB12

_PW

M2H

RD14

RB13

_PW

M2L

RD9

RD6_

RP70

RD5_

RP69

RC9_

RP57

_ASC

L1

RB14

_PW

M1H

RB10

_PW

M3H

RB11

_PW

M3L

RD4_

RP68

_UAR

T_RX

RD3_

RP67

_UAR

T_TX

RB15

_PW

M1L

RD2_

RP66

RC5_

RP53

RC4_

RP52

RD1_

PWM4

HRD

0_PW

M4L

RC10

_RP5

8RC

11_R

P59

RC12

_RP6

0RC

13_R

P61

RD7_

RP71

RD8_

RP72

RB6_

SCL2

RB5_

SDA2

RB6_

SCL2

RB5_

SDA2

RD13

RC15

_PW

M6L

RC14

_PW

M6H

RD15

_LED

RB7_

AN2

RB8_

AN10

RB9_

RP41

0.1 μ

F50

V04

02

C18

GN

D_D

+3.3

V

75R

0402

1%R11

RB0_

CLKI

STB

1

GN

D2

OU

T3

VD

D4

8.000

MHz

DSC6

011J

I2A-0

08.00

00

Y1

0603

DNP

C46

560R

0603

1%R76

DB2S

3100

0LD

4

GN

D_ADB

2S31

000L

D3

DB2S

3100

0LD

6

GN

D_ADB

2S31

000L

D5

+3.3

V_O

PA

+3.3

V_O

PA

VD

D57

VD

D41

VD

D25

VD

D10

VSS

40V

SS26

VSS

9

RD

060

RD

159

RD

258

RD

355

RD

454

RD

544

RD

643

RD

742

RD

839

RD

938

RD

1031

RD

1130

RD

1221

RD

1312

RD

1411

RD

158

MC

LR7

VSS

56

AV

DD

19

AV

SS20

RA

014

RA

115

RA

216

RA

317

RA

418

RB

028

RB

129

RB

233

RB

334

RB

435

RB

545

RB

646

RB

747

RB

848

RB

949

RC

013

RC

122

RC

223

RC

327

RC

450

RC

551

RC

624

RC

732

RC

836

RC

937

RC

1052

RC

1153

RC

123

RC

134

RC

145

RC

156

RB

1061

RB

1162

RB

1263

RB

1364

RB

141

RB

152

dsPI

C33C

K256

MP50

6-I/P

T

U3

RC3_

AN15

_INOP

A_1_

IN

OPA_

3_IN

OPA_

4_IN

RA0_

AN0_

IN

RA2_

AN9_

IN

RA3_

DAC1

_OUT

RA4_

CMP3

B_IN

RA4_

CMP3

B_IN

RA2_

AN9_

IN

RB1_

AN6_

IN

RB1_

AN6_

IN

RB7_

AN2_

IN

RB7_

AN2_

IN

RB8_

AN10

_IN

RB8_

AN10

_IN

RB10

_PW

M3H

RB11

_PW

M3L

RB12

_PW

M2H

RB13

_PW

M2L

RB14

_PW

M1H

RB15

_PW

M1L

RC0_

AN12

_IN

RC0_

AN12

_IN

RC1_

CMP1

B_IN

RC1_

CMP1

B_IN

RC2_

AN14

_IN

RC2_

AN14

_IN

GN

D_A

27R

0603

1%R72

560 p

F50

V06

03

C44

RC3_

AN15

_IN

RC4_

RP52

RC5_

RP53

RC6_

AN17

_IN

RC6_

AN17

_IN

150R

0603

1%R75

GN

D_A56

0 pF

50V

0603

C45

RC7_

AN16

_IN

RC8_

RP56

_ASD

A1

RC9_

RP57

_ASC

L1

RC10

_RP5

8RC

11_R

P59

RC12

_RP6

0RC

13_R

P61

RC14

_PW

M6H

RC15

_PW

M6L

RD1_

PWM4

HRD

0_PW

M4L

RD13

RD14

RD10

_AN1

8_IN

RD10

_AN1

8_IN

RD11

_AN1

9_IN

RD11

_AN1

9_IN

RD2_

RP66

RD5_

RP69

RD6_

RP70

RD7_

RP71

RD8_

RP72

RD9

RD4_

RP68

_UAR

T_RX

RD3_

RP67

_UAR

T_TX

75R

R25

75R

R26

75R

R27

75R

R28

75R

R29

75R

R30

75R

R39

75R

R40

100R

R22

100R

R23

100R

R33

100R

R34

150R

0603

1%

DNP

R94

Bode

_Inj

R74

and

R94

are

alte

rnat

epl

aces

for t

he sa

me

resi

stor

.It

form

s an

isol

atio

n sw

itch

for B

ode

100

Sign

al In

ject

ion.

5600

pF06

0325

V

C37

560 p

F06

0350

V

C35

5600

pF06

0325

V

C42

5600

pF06

0325

V

C36

VIN-

3

VIN+

1VOUT

4VSS 2

VDD5

MCP6

V91U

TU

8

10k

0402

0.5%

R9549.9R

0805

1%R90

GN

D_A

TP LO

OP Y

ellow

Vbo

de_m

ax =

1 V

rms

TP2

VB

OD

E

TP LO

OP B

lack

TP1

49.9R

0603

1%R

93

GN

D_A

10k

0402

0.5%

R92 0.1

μF

50V

0402

C51

GN

D_A

10k

0402

0.5%

R91 3.3

k04

020.5

%

R96

+3.3

V_O

PA

+3.3

V_O

PA

GN

D_A

0.1 μ

F50

V04

02

C24

GN

D_A

+3.3

V_O

PA

VB

_inj

= V

cc/2

– V

BO

DE

22 pF

50V

0402

C50

Bode

_Inj

RB9_

RP41

+VD

D_E

XT

270R

R24

270R

R31

270R

R32

270R

R35

270R

R36

270R

R37

270R

R38

270R

R43

270R

R44

270R

R45

270R

R46

270R

R47

270R

R48

270R

R49

270R

R50

3.3k

0402

1%R81

OPA_

2_IN

RB2_

AN1_

IN

RA1_

ANA1

_IN

RC7_

AN16

_IN

TP LO

OP Y

ellow

DNP

TP4

RD12

TP LO

OP Y

ellow

DNP

TP5



FIG

UR

E A

-2:

dsPI

C33

CK

256M

P506

DIG

ITA

L PO

WER

PIM

SC

HEM

ATI

C R

EV. 1

.0 (P

AG

E 2

OF

2)

10k

0402

1%R1

270R

0402

1%R

4

270R

0402

1%R

5

+3.3

V+3

.3V

MCP2

221A

VD

D16

GP0

1

GP1

2

RST

3

UA

RT

RX

4

UA

RT

TX5

GP2

6

GP3

7

SDA

8

SCL

9V

USB

10

D-

11D

+12

VSS

13

EP17

NC

14

NC

15

U1

4.7k

0402

1%R6

4.7k

0402

1%R7

SDA

2

SCL2

UA

RT

TX

UA

RT

RX

GN

D_D

+VD

D_E

XT

+3.3

V

GN

D_D

GN

D_D

3.6V

..6 V

MA

X fr

om E

dge

Con

nect

or

+5V

_USB

0.1 μ

F50

V04

02

C8

GN

D_D

GREE

N06

03

LD1

VIN

1

SHD

N3

GN

D2

PWR

GD

4

VO

UT

5MC

P175

5/3.3V

U2

MCLR

_INM

CLR

_IN

GN

D_A

0R 0603

R9

GN

D_D

0R 0603

R10

Shie

ld

“Shi

eld”

= B

otto

m C

oppe

r Pou

t Con

nect

ion

+3.3

V_A

GN

D_A

+3.3

V_O

PA+3

.3V

GN

D_A

1 μF

10V

0402

C6

0.47 μ

F6.3

V04

02

C7

10 μ

F10

V06

03

C9

10 μ

F10

V06

03

C10

10 μ

F10

V06

03

C11

10 μ

F10

V06

03

C12

600R

0402

900 m

A

FB3

600R

0402

900 m

A

FB5

600R

0402

900 m

A

FB6 60

0R04

0290

0 mA

FB7

GN

D_U

GN

D_U

SBR1

A20T

5

D2

12

34

50

DN

GV5+

-D

+D

DIM

icro

-AB

Rec

epta

cle

J3 USB

2.0 M

ICRO

-B F

EMAL

E

GN

D_S

+5V

_USB

USB_

N

USB_

P3

14

2

7442

3090

0

L1 WE

CN

SW

1

2

3456

8240

0152

D1

GN

D_U

US

BP

ort

0.1 μ

F50

V04

02

C3

47 pF

50V

0402

C1

47 pF

50V

0402

C2

GN

D_U

GN

D_U

GN

D_U

GN

D_U

600R

0402

900 m

A

FB4

US

B/U

AR

T-I2 C

Inte

rface

600R

0402

900 m

A

FB1

600R

0402

900 m

A

FB2

4.7k

0402

1%R

0

15R

0402

1%R

2

15R

0402

1%R

3

0.1 μ

F50

V04

02C

0

5V fr

om U

SB

Con

nect

or

1.5k

0402

1%R8



A.3

PCB

LA

YOU

TTh

e ds

PIC

33C

K25

6MP

506

DP

PIM

is a

four

-laye

r FR

4, 1

.55

mm

, Pla

ted-

Thro

ugh-

Hol

e (P

TH) P

CB

con

stru

ctio

n. F

igur

eA

-3 th

roug

h Fi

gure

A-5

illust

rate

th

e P

CB

laye

rs a

nd F

igur

eA-

6 sh

ows

the

asse

mbl

y dr

awin

gs o

f the

dsP

IC33

CK

256M

P506

DP

PIM

.

FIG

UR

E A

-3:

dsPI

C33

CK

256M

P506

DIG

ITA

L PO

WER

PIM

TO

P SI

LKSC

REE

N A

ND

TO

P C

OPP

ER

Top

Silk

scre

enTo

p C

oppe

r



FIG

UR

E A

-4:

dsPI

C33

CK

256M

P506

DIG

ITA

L PO

WER

PIM

MID

1 A

ND

MID

2 IN

NER

CO

PPER

(BO

TTO

M V

IEW

)

Mid

1 In

ner C

oppe

rM

id2

Inne

r Cop

per



FIG

UR

E A

-5:

dsPI

C33

CK

256M

P506

DIG

ITA

L PO

WER

PIM

BO

TTO

M C

OPP

ER A

ND

BO

TTO

M S

ILK

SCR

EEN

(BO

TTO

M V

IEW

)

Bot

tom

Cop

per

Botto

m S

ilksc

reen



FIG

UR

E A

-6:

dsPI

C33

CK

256M

P506

DIG

ITA

L PO

WER

PIM

TO

P A

ND

BO

TTO

M A

SSEM

BLY

Top

Asse

mbl

yBo

ttom

Ass

embl

y

15

0

0

1

234

0

0

6

1

121122

1

2

2

3 21211 331

2

3

1

1 2

1 21

121

2

21

122

21

21

12

2

1 2

32

2

12

1 2

3029282

12

2 1

1 2262524

2

12

222120

1

12

2 1

1817

2115 4 39 8 713 12 1116 15

221

1 211 11

22222

1 212

1212111

22

1

222

11

2

2 1

112

23 21

2 1

1

2

1224 11

221

21 21

1

1

1

3 12 2 2

1

57

121

12 2

112

1113

21

12

12

17

1

49

1

23

5352

51

1

27

5756

551

29

6160

59

2

336463

37

14 10 6 2

1

39

12

22 2

4345

1212

4921

53555

21

4

21

1211

12

591

43

3

12

109

12

112

4555 445

21

4

1

12

1 2

1 2

122

1

11

11

1 2

1 2

2

4846454442414038373634332

3127

223

12

2 121

21

2319

22

2

11

1

22

2

1 2

22

122 2

1211111

21

22

165

14138 72

21

6

25

1

11

1

3 25

4 5

22

93

1221

11

2519

15

5450

2

47433935

224

353162

58

11

1

5147

41

2

12

2

1111 1

57

1 212

156

34

11

2

22

2

0

4 1

00

17

0

2

1

15

0

0

1

234

0

0

6

1

26

812

1418

2428

3034

3840

4446

5054

5660

104

2620

1636

3252

4842

58



Appendix B. Bill of Materials (BOM)

This appendix contains the Bill of Materials (BOM) for the dsPIC33CK256MP506 Digital Power PIM.• Bill of Materials

B.1 BILL OF MATERIALSTable B-1 shows the Bill of Materials for the dsPIC33CK256MP506.

TABLE B-1: dsPIC33CK256MP506 DIGITAL POWER PIM BILL OF MATERIALS (BOM)Qty. Designator Description Manufacturer Manufacturer Part Number

11 C0, C3, C8, C17, C18, C20, C21, C22, C23, C24, C51

Capacitor, Ceramic, 0.1 µF, 50V, 10%, X7R, SMD, 0402

TDK Corporation C1005X7R1H104K050BB

2 C1, C2 Capacitor, Ceramic, 47 pF, 50V, 5%, NP0, SMD, 0402

Murata Electronics® GRM1555C1H470JA01D

5 C6, C13, C14, C15, C16

Capacitor, Ceramic, 1 µF, 10V, 10%, X7S, SMD, 0402

TDK Corporation C1005X7S1A105K050BC

1 C7 Capacitor, Ceramic, 0.47 µF, 6.3V, 10%, X5R, SMD, 0402

Murata Electronics GRM155R60J474KE19D

4 C9, C10, C11, C12 Capacitor, Ceramic, 10 µF, 10V, 20%, X5R, SMD, 0603

Samsung Group CL10A106MP8NNNC

1 C25 Capacitor, Ceramic, 56 pF, 50V, 5%, C0G, SMD, 0402

TDK Corporation C1005C0G1H560J050BA

5 C30, C31, C35, C44, C45

Capacitor, Ceramic, 560 pF, 50V, 5%, C0G, NP0, SMD, 0603

KEMET C0603C561J5GACTU

9 C32, C34, C36, C37, C38, C40, C41, C42, C43

Capacitor, Ceramic, 5600 pF, 25V, 5%, C0G, SMD, 0603

TDK Corporation C1608C0G1E562J080AA

2 C33, C39 Capacitor, Ceramic, 100 pF, 50V, 5%, NP0, SMD, 0603

Cal-Chip Electronics Inc.

GMC10CG101J50NTLF

1 C50 Capacitor, HiQ, 22 pF, 50V, 5%, NP0, 1.95 GHz, SMD, 0402

Johanson Technology Inc.

500R07S220JV4T

1 D1 Diode, TVS Array, 82400152, 5V, USB 2.0, SMD, SOT-563

Wurth Elektronik 82400152

1 D2 Diode Schottky, SBR1A20T5-7, 520 mV, 1A, 20V, SOD-523

Diodes Incorporated® SBR1A20T5-7

4 D3, D4, D5, D6 Diode Schottky, DB2S31000L, 470 mV, 200 mA, 30V, SMD, SOD-523

Panasonic® - ECG DB2S31000L

7 FB1, FB2, FB3, FB4, FB5, FB6, FB7

Ferrite, 600R at 100 MHz, 0.23R, 900 mA, SMD, 0402

Murata Electronics BLM15PX601SN1D



1 J1 Connector Header-2.54 Male, 1x6, Gold, 5.84MH, TH, Vertical

FCI 68000-106HLF

1 J3 Connector, USB 2.0 micro-B,Female, TH/SMD, R/A

FCI 10118194-0001LF

1 L1 Common-Mode Choke, 90R, 100 MHz, 0.145R, 550 mA, SMD, 0603

Wurth Elektronik 744230900

1 LD1 Diode LED Green, 2V,30 mA, 35 mcd, Clear, SMD,0603

Lite-On®, Inc. LTST-C190KGKT

1 LD2 Diode LED Red, 1.8V,40 mA, 10 mcd, Clear, SMD,0603

Lite-On, Inc. LTST-C190KRKT

3 R0, R6, R7 Resistor TKF, 4.7k, 1%, 1/10W, 0402

KOA Speer Electronics, Inc.

RK73H1ETTP4701F

2 R1, R12 Resistor TKF, 10k, 1%, 1/10W, SMD, 0402

Panasonic® - ECG ERJ-2RKF1002X

2 R2, R3 Resistor TKF, 15R, 1%, 1/10W, SMD, 0402

Panasonic - ECG ERJ-2RKF15R0X

17 R4, R5, R24, R31, R32, R35, R36, R37, R38, R43, R44, R45, R46, R47, R48, R49, R50

Resistor TKF, 270R, 1%, 1/10W, SMD, 0402

Panasonic - ECG ERJ-2RKF2700X

1 R8 Resistor TKF, 1.5k, 1%, 1/16W, SMD, 0402

Yageo Corporation RC0402FR-0775RL

2 R9, R10 Resistor TKF, 0R, 1/10W, SMD, 0603

NIC Components Corp.

NRC06Z0TRF

11 R11, R25, R26, R27, R28, R29, R30, R39, R40, R41, R42



7 R13, R20, R21, R22, R23, R33, R34



12 R60, R61, R62, R63, R64, R65, R68, R69, R70, R71, R74, R75


Stackpole Electronics, Inc.

RMCF0603FT150R

4 R66, R67, R72, R73 Resistor TKF, 27R, 1%, 1/10W, SMD, 0603


1 R76 Resistor TKF, 560R, 1%, 1/10W, SMD, 0603


4 R77, R78, R79, R80 Resistor TKF, 1k, 1%, 1/10W, SMD, 0402


1 R81 Resistor TKF, 3.3k, 1%, 1/10W, SMD, 0402


1 R90 Resistor TKF, 49.9R, 1%, 1/8W, SMD, 0805

Panasonic - ECG ERJ-6ENF49R9V

3 R91, R92, R95 Resistor TF, 10k, 0.5%, 1/16W, SMD, 0402

Susumu Co., Ltd. RR0510P-103-D

1 R93 Resistor TKF, 49.9R, 1%, 1/10W, SMD, 0603

Panasonic - ECG ERJ-3EKF49R9V

TABLE B-1: dsPIC33CK256MP506 DIGITAL POWER PIM BILL OF MATERIALS (BOM) (CONTINUED)Qty. Designator Description Manufacturer Manufacturer Part Number


Bill of Materials (BOM)

1 R96 Resistor TKF, 3.3k, 0.5%, 1/16W, SMD, 0402

Panasonic® - ECG ERA-2AED332X

1 TP1 Misc, Test Point Multipurpose Mini, Black

Keystone Electronics Corp.

5001

1 TP2 Misc, Test Point PC Mini,0.040", D, Yellow


5004

1 TP3 Connector, Test Point, TAB, Silver, Mini, 3.8x2.03, SMD


5019

1 U1 Microchip Interface, USB,I2C/UART, MCP2221A-I/ML,QFN-16

Microchip Technology Inc.

MCP2221A-I/ML

1 U2 Microchip Analog LDO, 3.3V,MCP1755T-3302E/OT,SOT-23-5


MCP1755T-3302E/OT

1 U3 Microchip MCU, 16-Bit, 100 MIPS, 256k, 24k, dsPIC33CK256MP506-I/PT, TQFP-64


dsPIC33CK256MP506-I/PT

5 U4, U5, U6, U7, U8 Microchip Analog Op Amp,1-Ch, 10 MHz, MCP6V91UT-E/LTYCT-ND, SC-70-5


MCP6V91UT-E/LTY

1 Y1 Microchip Clock Oscillator,Single, 8.000 MHz, DSC6011JI2A-008.0000, VDFN-4


DSC6011JI2A-008.0000

TABLE B-1: dsPIC33CK256MP506 DIGITAL POWER PIM BILL OF MATERIALS (BOM) (CONTINUED)Qty. Designator Description Manufacturer Manufacturer Part Number



AMERICASCorporate Office2355 West Chandler Blvd.Chandler, AZ 85224-6199Tel: 480-792-7200 Fax: 480-792-7277Technical Support: http://www.microchip.com/supportWeb Address: www.microchip.comAtlantaDuluth, GA Tel: 678-957-9614 Fax: 678-957-1455Austin, TXTel: 512-257-3370 BostonWestborough, MA Tel: 774-760-0087 Fax: 774-760-0088ChicagoItasca, IL Tel: 630-285-0071 Fax: 630-285-0075DallasAddison, TX Tel: 972-818-7423 Fax: 972-818-2924DetroitNovi, MI Tel: 248-848-4000Houston, TX Tel: 281-894-5983IndianapolisNoblesville, IN Tel: 317-773-8323Fax: 317-773-5453Tel: 317-536-2380Los AngelesMission Viejo, CA Tel: 949-462-9523Fax: 949-462-9608Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510New York, NY Tel: 631-435-6000San Jose, CA Tel: 408-735-9110Tel: 408-436-4270Canada - TorontoTel: 905-695-1980 Fax: 905-695-2078

ASIA/PACIFICAustralia - SydneyTel: 61-2-9868-6733China - BeijingTel: 86-10-8569-7000 China - ChengduTel: 86-28-8665-5511China - ChongqingTel: 86-23-8980-9588China - DongguanTel: 86-769-8702-9880 China - GuangzhouTel: 86-20-8755-8029 China - HangzhouTel: 86-571-8792-8115 China - Hong Kong SARTel: 852-2943-5100 China - NanjingTel: 86-25-8473-2460China - QingdaoTel: 86-532-8502-7355China - ShanghaiTel: 86-21-3326-8000 China - ShenyangTel: 86-24-2334-2829China - ShenzhenTel: 86-755-8864-2200 China - SuzhouTel: 86-186-6233-1526 China - WuhanTel: 86-27-5980-5300China - XianTel: 86-29-8833-7252China - XiamenTel: 86-592-2388138 China - ZhuhaiTel: 86-756-3210040

ASIA/PACIFICIndia - BangaloreTel: 91-80-3090-4444 India - New DelhiTel: 91-11-4160-8631India - PuneTel: 91-20-4121-0141Japan - OsakaTel: 81-6-6152-7160 Japan - TokyoTel: 81-3-6880- 3770 Korea - DaeguTel: 82-53-744-4301Korea - SeoulTel: 82-2-554-7200Malaysia - Kuala LumpurTel: 60-3-7651-7906Malaysia - PenangTel: 60-4-227-8870Philippines - ManilaTel: 63-2-634-9065SingaporeTel: 65-6334-8870Taiwan - Hsin ChuTel: 886-3-577-8366Taiwan - KaohsiungTel: 886-7-213-7830Taiwan - TaipeiTel: 886-2-2508-8600 Thailand - BangkokTel: 66-2-694-1351Vietnam - Ho Chi MinhTel: 84-28-5448-2100

EUROPEAustria - WelsTel: 43-7242-2244-39Fax: 43-7242-2244-393Denmark - CopenhagenTel: 45-4450-2828 Fax: 45-4485-2829Finland - EspooTel: 358-9-4520-820France - ParisTel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - GarchingTel: 49-8931-9700Germany - HaanTel: 49-2129-3766400Germany - HeilbronnTel: 49-7131-67-3636Germany - KarlsruheTel: 49-721-625370Germany - MunichTel: 49-89-627-144-0 Fax: 49-89-627-144-44Germany - RosenheimTel: 49-8031-354-560Israel - Ra’anana Tel: 972-9-744-7705Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781Italy - PadovaTel: 39-049-7625286 Netherlands - DrunenTel: 31-416-690399 Fax: 31-416-690340Norway - TrondheimTel: 47-7288-4388Poland - WarsawTel: 48-22-3325737 Romania - BucharestTel: 40-21-407-87-50Spain - MadridTel: 34-91-708-08-90Fax: 34-91-708-08-91Sweden - GothenbergTel: 46-31-704-60-40Sweden - StockholmTel: 46-8-5090-4654UK - WokinghamTel: 44-118-921-5800Fax: 44-118-921-5820

Worldwide Sales and Service

08/15/18

http://support.microchip.com
