ELMO

ELMO - Miniaturising Electronics

Duration: 2002-2005 Estimated volume: 100 million euros,

of which Tekes accounts for approximately50 million euros

Programme Manager: D.Sc. Pentti Koskinen,Tietoneuvos Oy

Further information:www.tekes.fi/english/programmes/ELMO

The objective of the ELMO Programme is to build a widelyapplicable knowledge base for the coming years so that thefocus is on the core competence of the electronics sector.The criteria set for the central themes of the programme,

in other words, for the development trends, are miniaturisation,integration, and cost-efficiency.

The objective of the ELMO Programme is to build a widelyapplicable knowledge base for the coming years so that thefocus is on the core competence of the electronics sector.The criteria set for the central themes of the programme,

in other words, for the development trends, are miniaturisation,integration, and cost-efficiency.

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ELMO

Vision-oriented objectives

To promote the technological leadership ofFinland in the sub-areas that are critical fromthe point of view of the electronics sector

To create basis for new businessopportunities

To accumulate high technology knowledge byencouraging research institutes and enter-prises to participate in long-term research

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ELMO

Vision-oriented objectives

To develop the innovation environment byenhancing interaction between universities, research institutes and companies

To develop co-operation networks and management of the value chain

To encourage small and medium-sized enterprisesto renew their operations

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Scenario-oriented results

Intelligent systems take into consideration the

development trends miniaturisation integration cost-efficiency

Optoelectronics and its opportunities new business area

Efficient design processes take into consideration the

core electronics’ value chain

Cost-effective productivity takes into consideration the

core electronics’ value chainDocs 39889

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Example of a smart system

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Key ELMO technologies

Micro-electronics and its materials especially the research on silicon, compound semi-

conductors and optical materials, substrates, andpackaging, together with the related processes,analyses and characteristics

Manufacturing, production, and testing module precision mechanics and manufacturing mechatronics and product processes

Integrated systems resulting in a tested prototype System on Chip System on Package MEMS ...

Future technologies includes long term research projects and preliminary

surveys that are used to steer the ELMO Programme tonew innovative directions

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Generic technologies supporting the value chain

Embedded software and genericmiddleware, software platforms

Tools and methods Integrated design Modelling and simulation Reliability

Reliability and environment Tools Methods Impact of environmental

requirements on reliability

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Clusters and project examples

Future technology Printing optoelectronics Ultrafast optical

telecommunications DSP Systems and

Wireless sensors Molecular electronics and

fotonics

Micromaterials & Processes Package and integration Production Passive and active

components Wires, …

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Intelligent systems SoP MEMS ASIC+RF Ubi Optical systems Sensors Receivers and

Transmitters Low power and low

voltage system Distributed power

systems, ...

Tools Life long testability Environmental factors, …

Situation in 2002Situation in 2002

ELMO

List of research projects

Technical Research Centre of Finland (VTT),Espoo- ElectroMechanical Microcomponents for Precision ApplicationsUniversity of Jyväskylä - Miniatyrizing Sensors University of Oulu- Distributed Power Supply Dynamics Tampere University of Technology- Component integration Tampere University of Technology- Use of flip-chip techniques in industrial applications Helsinki University of Technology- Implications of IPP and EU environmental directives on future activities of electrical and electronics enterprises Technical Research Centre of Finland (VTT),Espoo- Removal of heavy organic compounds with aqueous ozone processes Technical Research Centre of Finland (VTT)- Monolithic integration of SOI micromechanics and electronics Technical Research Centre of Finland (VTT)- Chemical-mechanical planarisation of silicon wafers Tampere University of Technology, Optoelectronics Research Centre, ORC- Towards Lighter Technologies Tampere University of Technology- Lead free components, their connections and mechanical testing University of Oulu- Testability development of integrated mixed-signal circuits

ELMOUniversity of Oulu- LP/LV CMOS circuit block development for sensor micromodules University of Oulu- Additive precise circuit patterns Helsinki University of Technology- Integration of Radiocommunication Circuits (RADINT) Helsinki University of Technology- Self-organized molecular electronics and photonics (SOMEP) Technical Research Centre of Finland (VTT),Oulu- Optics on future printed circuit board in high speed data transmission applications Tampere University of Technology- Flexible Design Methods for DSP Systems Technical Research Centre of Finland (VTT),Oulu- Printing optoelectronics Helsinki University of Technology- Impact of Miniaturization on Manufacturing and Reliability of Electronics Technical Research Centre of Finland (VTT)- New technologies for passive integration and ALCVD dielectics for mircoelectronics Helsinki University of Technology, Electronic Circuit Design Laboratory- Information Processing via Nonlinear Dynamics and Bifurcation Theory Helsinki University of Technology - Environmental and life cycle issues in design and R&D activities of electrical and electronics enterprises Kajaani Polytechnics- Feasibility study on introduction and testing newelectronics manufacturing technologies in Kajaani region Technical Research Centre of Finland (VTT),Tampere- Intelligent tyre development

List of research projects