en ke970 svc eng 070404[up.by.nasirahmed]

Date: February, 2007 / Issue 1.0

Serv

ice M

an

ual

Mo

del : K

E970/M

E970

Service ManualKE970/ME970

Internal Use Only

LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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* The information in this manual is subject to change without notice and should not be construed as acommitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changesto equipment design as advances in engineering and manufacturing methods warrant.

* This manual provides the information necessary to install, program, operate and maintain the KE970.

REVISED HISTORY

Editor Date Issue Contents of Changes S/W Version

G.C. LIM 2006/03/29 0.1


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1. INTRODUCTION ...............................71.1 Purpose .................................................. 71.2 Regulatory Information............................ 71.3 ABBREVIATION ..................................... 9

2. PERFORMANCE.............................112.1 H/W Features.........................................112.2 Technical specification...........................12

3. TECHNICAL BRIEF ........................173.1 KE970 Component Block diagram.........173.2 Baseband Processor (BBP)

Introduction ............................................183.3 Power management IC ..........................303.4 Power ON/OFF ......................................353.5 SIM interface..........................................373.6 Memory ..................................................383.7 LCD Display ...........................................393.8 Keypad Switching & Scanning ...............403.9 Keypad back-light illumination ...............423.10 LCD back light illumination...................433.11 Battery current consumption monitor ...453.12 JTAG & ETM interface connector ........453.13 Audio....................................................463.14 Multi port switch ...................................483.15 USB charging circuit ............................503.16 BLUETOOTH.......................................513.17 Micro SD external memory card slot.....553.18 18pin Multi Media Interface connector .573.19 General Description .............................593.20 Receiver part........................................613.21 Transmitter part....................................623.22 RF synthesizer .....................................633.23 TCXO...................................................633.24 Front End Module control.....................643.25 Power Amplifier Module .......................64

4. PCB layout......................................654.1 Main & Sub PCB component

placement ..............................................65

5. Trouble shooting............................725.1 Trouble shooting test setup....................725.2 Power on Trouble...................................725.3 Charging trouble ....................................765.4 LCD display trouble................................785.5 Camera Trouble .....................................805.6 Receiver & Speaker trouble ...................825.7 Microphone trouble ................................845.8 Vibrator trouble ......................................865.9 Keypad back light trouble.......................885.10 Micro SD and SIM card trouble............905.11 RF PART TROUBLESHOOTING ........93

6. Download & S/W upgrade...............1086.1 S/W download setup ............................1086.2 Download program user guide.............109

7. CIRCUIT DIAGRAM ......................117

8. PCB LAYOUT................................123

9. RF Calibration ..............................1299.1 Test Equipment Setup .........................1299.2 Calibration Steps..................................129

10. Stand along ................................13510.1 Test Program Setting .........................13510.2 Tx Test ...............................................13710.3 Rx Test...............................................138

11. ENGINEERING MODE ................139

12. EXPLODED VIEW &REPLACEMENT PART LIST ..... 141

12.1 Exploded View .................................. 141

12.2 Replacement Parts ............................14612.3 Accessory ......................................... 159

Table Of Contents

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1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download thefeatures of the KE970.

1.2. Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,persons other than your company’s employees, agents, subcontractors, or person working on yourcompany’s behalf) can result in substantial additional charges you’re your telecommunicationsservices. System users are responsible for the security of own system.There are may be risks of toll fraud associated with your telecommunications system. System usersare responsible for programming and configuring the equipment to prevent unauthorized use. LGEdoes not warrant that this product is immune from the above case but will prevent unauthorized use ofcommon-carrier telecommunication service of facilities accessed through or connected to it. LGE willnot be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possiblycausing harm or interruption in service to the telephone network, it should disconnect telephoneservice until repair can be done. A telephone company may temporarily disconnect service as long asrepair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If thesechanges could reasonably be expected to affect the use of the KE970 or compatibility with the network,the telephone company is required to give advanced written notice to the user, allowing the user to takeappropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the KE970 must be performed only at the LGE or its authorized agents.The user may not make any changes and/or repairs expect as specifically noted in this manual.Therefore, note that unauthorized alternations or repair may affect the regulatory status of the systemand may void any remaining warranty.

1. INTRODUCTION


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1. INTRODUCTION

E. Notice of Radiated Emissions

The KE970 complies with rules regarding radiation and radio frequency emission as defined by localregulatory agencies. In accordance with these agencies, you may be required to provide informationsuch as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightlydifferent.

G. Interference and Attenuation

An KE970 may interfere with sensitive laboratory equipment, medical equipment, etc. Interferencefrom unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign.Following information is ESD handling: Service personnel should ground themselves by using a wriststrap when exchange system boards.When repairs are made to a system board, they should spread the floor with anti-static mat which isalso grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protectivepackages until these are used. When returning system boards or parts such as EEPROM to thefactory, use the protective package as described.

LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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1. INTRODUCTION

1.3 ABBREVIATION

For the purposes of this manual, following abbreviations apply:


APC Automatic Power Control

BB Baseband

BER Bit Error Ratio

CC-CV Constant Current - Constant Voltage

CLA Cigar Lighter Adapter

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milli-watt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

EL Electroluminescence

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GPRS General Packet Radio Service

GSM Global System for Mobile Communications

IPUI International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

LGE LG Electronics


1. INTRODUCTION

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OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

STMR Side Tone Masking Rating

TA Travel Adapter

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

VCTCXO Voltage Control Temperature Compensated Crystal Oscillator

WAP Wireless Application Protocol

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2. PERFORMANCE

2.1 H/W Feature

2. PERFORMANCE


Item Feature Comment

Standard Battery Li-ion, 800mAh

AVG TCVR Current 280mA PL5

Standby Current <2.7mA @PP9

Talk time 3hours (GSM TX Level 7)

Standby time 277 hours (Paging Period:9, RSSI: -85dBm)

Charging time 3 hours

RX Sensitivity GSM900 : -105dBm, DCS/PCS : -105dBm

TX output powerGSM900: 32dBm (Level 5)

DCS/PCS: 29dBm (Level 0)

GPRS compatibility Class 10

SIM card type 3V Small

Display 320 x 240 pixels, 2.2 inch wide, 265K color, TFT

Soft icons

Key Pad

Status Indicator 0 ~ 9, #, *, END/PWR, SEND, CLEAR Key

Side Key

Up/Down, AF/Camera double action key

ANT Built in antenna

EAR Phone Jack 18pin multi port Headset jack with Remote controller

PC Synchronization Yes

Speech coding EFR/FR/AMR

Data and Fax Yes

Vibrator Yes

Buzzer No

Voice Recoding Yes

C-Mic Yes

Receiver Yes

Travel Adapter Yes

Options Bluetooth hands-free kit, Data Kit

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2. PERFORMANCE

2.2 Technical specification


Item Description Specification

GSM900TX: 890 + 0.2 x n MHz

RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )

EGSM

1 Frequency Band TX: 890 + 0.2 x (n-1024) MHz

RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )

DCS1800

TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885)

RX: TX + 95 MHz

PCS1900

TX: 1850.2 + ( n-512 ) x 0.2 MHz (n = 512 ~ 810)

RX: TX + 80MHz

2 Phase ErrorRMS < 5 degrees

Peak < 20 degrees

3 Frequency Error < 0.1ppm

GSM900/EGSM

Level Power Toler. Level Power Toler.

5 33 dBm 2dB 13 17 dBm 3dB

6 31 dBm 3dB 14 15 dBm 3dB

7 29 dBm 3dB 15 13 dBm 3dB

8 27 dBm 3dB 16 11 dBm 5dB

9 25 dBm 3dB 17 9 dBm 5dB

10 23 dBm 3dB 18 7 dBm 5dB

11 21 dBm 3dB 19 5 dBm 5dB

4 Power Level 12 19 dBm 3dB

DCS1800/PCS1900

Level Power Toler. Level Power Toler.



2 26 dBm 3dB 10 10 dBm 4dB






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2. PERFORMANCE



GSM900/EGSM

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600~ <1,200 -60

1,200~ <1,800 -60

1,800~ <3,000 -63

3,000~ <6,000 -65

5Output RF Spectrum 6,000 -71

(due to modulation) DCS1800/PCS1900

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600~ <1,200 -60

1,200~ <1,800 -60

1,800~ <3,000 -65

3,000~ <6,000 -65

6,000 -73

GSM850

Offset from Carrier (kHz) Max. (dBm)

Output RF Spectrum 400 -196

(due to switching transient) 600 -21

1,200 -21

1,800 -24

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2. PERFORMANCE



DCS1800/PCS1900

Offset from Carrier (kHz). Max. (dBm)

Output RF Spectrum 400 -226

(due to switching transient) 600 -24

1,200 -24

1,800 -27

7 Spurious Emissions Conduction, Emission Status

GSM850

8 Bit Error RatioBER (Class II) < 2.439% @-102dBm

DCS1800/PCS1900BER (Class II) < 2.439% @-100dBm

9 Rx Level Report accuracy 3 dB

10 SLR 8 3 dB

11 Sending Response

12 RLR -15 3 dB

13 Receiving Response

* Mean that Adopt a straight line in between 300 Hzand 1,000 Hz to be Max. level in the range.

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2. PERFORMANCE



14 STMR > 17 dB

15 Stability Margin > 40 dB

16 Idle Noise Sending < -64dB

17 Idle Noise Receiving < -47dB

18 Side tone Distortion Three stage distortion < 10%

19<Change> System frequency

2.5ppm(26 MHz) tolerance

20 <Change>32.768KHz tolerance 30ppm

Standby21 Power consumption

- Normal 5.2mA(Mix. power)

22 Talk TimeGSM900/Lvl 7(Battery Capacity 800mA) : Min. 2.5 hrGSM900/Lvl 12(Battery Capacity 800 mA) : Min. 3hrUnder conditions, at least Min. 250 hr1. Brand new and full 800mAh battery

23 Standby Time2. Full charge, no receive/send and keep GSM in idle mode.3. Broadcast set off.4. Signal strength display set at 3 level above.5. Backlight of phone set off.At least 65 dB under below conditions:

24 Ringer Volume 1. Ringer set as ringer.2. Test distance set as 50 cm

25 Charge VoltageFast Charge : < 450 mASlow Charge: < 55mA

Antenna Bar Number Power

5 -85 dBm ~

4 -90 dBm ~ -86 dBm

26 Antenna Display 3 -95 dBm ~ -91 dBm

2 -100 dBm ~ -96 dBm

1 -105 dBm ~ -101 dBm

0 ~ -105 dBm

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2. PERFORMANCE



Battery Bar Number Voltage( 0.05V)

4 3.86V~4.2V

27 Battery Indicator 3 3.75V~3.85V

2 3.75V~3.69V

1 3.69V~3.62V

0 3.62V~

28 Low Voltage Warning3.62V↓ 0.05V (Call)

3.50V↓ 0.05V (Standby)

29 Forced shut down Voltage 3.35 0.05 V

1 Li-ion Battery

30 Battery TypeStandard Voltage = 3.7 VBattery full charge voltage = 4.2 VCapacity: 800mAh

Switching-mode charger31 Travel Charger Input: 100 ~ 240 V, 50/60Hz

Out put: 4.8, 0.9A


3. TECHNICAL BRIEF

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3.1. KE970 Component Block diagram.

KE970 is composed with 3 different PCB part such as main PCB, keypad FPCB and slide FPCB.

3. TECHNICAL BRIEF

Figure 1. KE970 Hardware architecture

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3. TECHNICAL BRIEF

3.2. Baseband Processor (BBP) Introduction

3.2.1 General Description

S-GOLD2TM is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digitalfunctionality of a cellular radio. Additionally S-GOLD2TM Provides multimedia extensions such ascamera, software MIDI, MP3 sound. It is designed as a single chip solution, integrating the digital andmixed signal portions of the base band in 0.13um, 1.5V technology. The chip will fully support the FR,EFR, HR and AMR-NB vocoding. S-GOLD2TM support multi-slot operation modes HSCSD (up to class10), GPRS for high speed data application (up to class 12) and EGPRS (up to class 12) withoutadditional external hardware.


Figure 2. Top level block diagram of the S-GOLD2TM (PMB8876)

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3. TECHNICAL BRIEF

3.2.2. Block Description

• Processing coreARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU,and the Jazelle Java extension for Java acceleration.- TEAKLite DSP core

• ARM-Memory- 32k Byte Boot ROM on the AHB- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM- 16k Byte Cache for Program (internal)- 8k Byte tightly coupled memory for Program(internal)- 8k Byte Cache for Data(internal)- 8k Byte tightly coupled memory for Data(internal)

• DSP-Memory- 104K x 16bit Program ROM- 8k x 16bit Program RAM- 60k x 16bit Data ROM- 37k x 16bit Data RAM- Incremental Redundancy(IR) Memory of 35904 words of 16bit

• Shared Memory Block1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.

• Controller Bus systemThe processor cores and their peripherals are connected by powerful buses. Multi-layer AHB forconnecting the ARM and the other master capable building blocks with the internal and externalmemories and with the peripheral buses.

• Clock systemThe clock system allows widely independent selection of frequencies for the essential parts of theS-GOLD2. Thus power consumption and performance can be optimized for each application.

• Functional Hardware block- CPU and DSP Timers- MOVE coprocessor performing motion estimation for video encoding algorithms

(H.263, MPEG-4)- Programmable PLL with additional phase shifters for system clock generation- GSM Timer Module that off-loads the CPU from radio channel timing- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)- GMSK Modulator: gauss-filter with B*T=0.3- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter- Hardware accelerators for equalizer and channel decoding.- Incremental Redundancy memory for EDGE class 12 support- A5/1, A5/2, A5/3 Cipher unit- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission


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3. TECHNICAL BRIEF

- Advanced static and dynamic power management features including TDMA-Frame synchronouslow power mode and enhanced CPU modes(idle and sleep modes)

- Pulse Number Modulation output for Automatic Frequency Correction(AFC)- Serial RF Control interface: support of direct conversion RF- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI)

serial data transmission- 1 Serial Synchronous SPI compatible interfaces in the controller domain- 1 Serial Synchronous SPI compatible interface in the TEAKLite domain- 2 USART with autobaud detection, hardware flow control and integrated IrDA controller

supporting IrDA’s SIR standard (up to 115.2Kbps)- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards (up to 4Mbps)- I2C-bus interface (e.g. connection to S/M power)- A fast display interface supporting serial and parallel interconnection- An ITU-R BT.656 compatible Camera interface.- Programmable clock output for a camera- An multimedia/Secure Digital Card Interface (MMCI/SD:SDIO capable)

3.2.3. External Devices connected to memory interface

Table 1 Memory interface

3.2.4. RF Interface (T_OUT)

S-Gold2 uses this interface to control RF IC and Peripherals. 13 signals are provided switch on/off RFICs Periodically each TDMA frame.

Table 2 RF Interface Spec.


Device Name Maker Remark

FLASH PF38F5060M0Y0B0 Intel Synchronous / A synchronous

SDRAM PF38F5060M0Y0B0 Intel Synchronous 104MHz

LCD IL220DBN1A LGIT 8bit access 3times transmission

Melody IC Not Used S/W Infineon Software CODEC

T_OUT

Resource Interconnection Description

T_OUT0 TXON_PA PAM Power on

T_OUT1 VIBRATOR_EN VBRATOR ON-

T_OUT2 PA_BAND TX RF band select

T_OUT3 ANT_SW1 FEM control



T_OUT6 MODE PAM Mode select

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3. TECHNICAL BRIEF

3.2.5. USART Interface

KE970 have two UART Drivers as follow :- USART1 : Hardware Flow Control / SW upgrade / Calibration- USART2 : SW debug trace.

Table 3 USART Interface Spec.

3.2.6. ADC channel

BBP ADC block is composed of 7 external ADC channel . This block operates charging process andother related process by reading battery voltage and other analog values.

Table 4 S-Gold2 ADC channel usage


USART_0(USART1)

Resource Name Remark

USART0_TXD TXD_0 Transmit Data

USART0_RXD RXD_0 Receive Data

USART0_CTS CTS_0 Clear To Send

USART0_RTS RTS_0 Request To Send

DSR N.C.

USART_1(USART2)

USART1_TXD TX_DEBUG Trace data tx

USART1_RXD RX_DEBUG Trace data rx

USART1_CTS N.C. N.C.

USART1_RTS N.C. N.C.

ADC channel

Resource Interconnection Description

M0 BATT_TEMP Battery temperature measure

M1 RF_TEMP RF block temperature measure

M2 JACK_TYPE Accessory type detect

M7 H/W VERSION S-Gold2 H/W version detect

M8 VSUPPLY Battery supply voltage measure

M9 I_MONITOR Current consumption measure

M10 REMOTE_ADC Remote control key detect

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3. TECHNICAL BRIEF

3.2.7. GPIO map

Over a hundred allowable resources, KE970 is using as follows except dedicated to SIM and Memory.KE970 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level,is shown in below table.

Table 5 S-Gold2 GPIO pin Map


Port function KE260 Net Name Description

KEY MATRIX

KP_IN0 KP_IN0 Refer to Key Matrix






KP_OUT5 KP_OUT5 Refer to Key Matrix





USART_0

USART0_RXD RXD_0 UARTO, RS232 Data

USART0_TXD TXD_0 UARTO, RS232 Data

USART0_RTS_N CTS_0 UARTO, RS232 RTS

USART0_CTS_N RTS_0 UARTO, RS232 CTS

CC1CC6IO FM_INT For FM Radio Interrupt

USART_1

USART1_RXD TX_DEBUG For debugging

USART1_TXD RX_DEBUG For debugging

USART1_RTS_N Not Use

USART1_CTS_N Not Use

USB

USB_DPLUS USB_DP USB data

USB_DMINUS USB_DM USB data

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3. TECHNICAL BRIEF


MEMORY &CLK

GPIO_20 F_DPD For INTEL Memory

CLK32K CLK32K For FM Radio & BLUETOOTH

GPIO_22 Not Use

CAMERA I/F

CIF_D0 CIF_D(0) Camera DATA[0]








CIF_PCLK CIF_PCLK Camera pixel clock

CIF_HSYNC CIF_HS Camera H sync

CIF_VSYNC CIF_VS Camera V sync

CLKOUT CIF_MCLK Camera main clock

CIF_PD CIF_PD Camera power down(active high)

CIF_RESET CIF_RESET Camera reset

LCD IF/

DIF_D0 DIF_D(0) LCD data[0]








DIF_CS1 DIF_CS LCD chip select

GPIO_96 FM_BBP_SELAudio amp inuput select(High:

FM sound, Low: BBP sound)

DIF_CD DIF_CD Command Data switch

DIF_WR MM_WR LCD Write

DIF_RD MM_RD LCD Read

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3. TECHNICAL BRIEF


GPIO_99 _USB_CHG_EN USB charging (High: charge disable, Low: enable)

DIF_VD (in) _TF_PWR_EN Trans-Flash card power enable(active low)

DIF_RESET1_GPIO DIF_RESET1 LCD Reset

EINT6 REMOTE_INT For Remote Control Headset

I2c

I2C_SCL SCL For SM-Power, FM Radio, Audio AMP

I2C_SDA SDA "

PM_INT (EINT) PM_INT SM-Power interrupt

SIM CARD

CC_IO SIM_IO SIM CARD I/O

CC_CLK SIM_CLK SIM CARD CLOCK

CC_RST SIM_RST SIM CARD RESET

I2S

I2S2_CLK0 Not Use

GPIO_102 _WP Not Connected

I2S2_RX Not Use

I2S2_TX Not Use

I2S2_WA0 Not Use

I2S2_WA1 Not Use

EXTERNAL MEMORY

MMCI_CMD TF_CMD For T-Flash

MMCI_DAT[0] TF_DAT0 "

MMCI_CLK TF_CLK "

BT I/F

USIF_TXD_MTSR USIF_TXD For Bluetooth

USIF_RXD_MRST USIF_RXD "

GPIO_109 _USB_EOCUSB End of charging detect(High:

EOC, Low: charging)

GPIO_110 RPWRONRemote power on detect (High:

Remote , Low: Normal

GPIO_111 SPK_RCV_SELAudio pass select( high:

Speaker, Low: Receiver)

I2S

I2S1_CLK0 I2S1_CLK For Bluetooth

GPTU0_0 FLASH_EN For Camera Flash LED

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3. TECHNICAL BRIEF


I2S1_RX I2S1_RX For BluetoothI2S1_TX I2S1_TX "I2S1_WA0 I2S1_WA0 "MMCMMCI_DAT[1] TF_DAT1 For T-FlashMMCI_DAT[2] TF_DAT2 "MMCI_DAT[3] TF_DAT3 "AUDIO I/FEPN1 RCV_N For ReceiverEPP1 RCV_P "EPPA1 BBP_SND_L For SpeakerEPPA2 BBP_SND_R For SpeakerMICN1 MIC1_N For MicMICP1 MIC1_P "MICN2 MIC2_N For Headset MicMICP2 MIC2_P "VMICP VMICP For MicVMICN VMICN "RF I/FPAOUT1PAOUT2BB_IBB_IXBB_QBB_QXADCM_0 BAT_TEMP Battery temperature detect

M_1 RF_TEMP RF Power amp reference temperature detect

M_2 JACK_TYPE For 18Pin Cable Type DetectM_7 HW revision indicationM_8 Battery voltage measurementM_9 I_MONITOR Current consumption measurement

M_10 REMOTE_ADCFor Remote Control Headset Key detect with REMOTE_INT

ReferenceVREFIREFJTAGTDO TDO For JTAG & ETM InterfaceTDI TDI "TMS TMS "TCK TCK "TRST_n TRSTn "RTCK RTCK "

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3. TECHNICAL BRIEF


ETM

TRIG_IN TRIG_IN "

MON1 MON1 "

MON2 MON2 "

TRACESYNC TRACESYNC "

TRACECLK TRACECLK "

PIPESTAT[2] PIPESTAT[2] "



TRACEPKT[0] TRACEPKT[0] "








Memory

EBU_AD[0] D(0) Data bus[0]
















EBU_WR_n _WR Write strobe

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3. TECHNICAL BRIEF


EBU_RD_n _RD Read strobe

EBU_BC0_n _BC0

EBU_BC1_n _BC1

EBU_A[0] A(0) Address bus[0]

























EBU_CS0_n _FLASH1_CS Flash ROM chip select

EBU_CS1_n _RAM_CS SDRAM Chip select

EBU_CS2_n _FLASH2_CS Not used

EBU_CS3_n _CS3 Not used

EBU_ADV_n _ADV

EBU_RAS_n _RAS

EBU_CAS_n _CAS

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3. TECHNICAL BRIEF


EBU_WAIT_n _WAIT

EBU_SDCLKO SDCLKO

EBU_SDCLKI SDCLKI

EBU_BFCLKO BFCLKO

EBU_BFCLKI BFCLKI

EBU_CKE CKE

Memory

FCDP_RBn F_DPD

TDMA RF I/F

T_OUT0 TXON_PA RF Power amp turn on

GPIO_44 VIBRATOR_EN Vibrator enable(High: enable, Low:disable)

T_OUT2 PA_BAND RF band select

T_OUT3 ANT_SW1 RF FEM control signal 1

T_OUT4 ANT_SW2 RF FEM control signal 2

EINT3 ANT_SW3 RF FEM control signal 3

T_OUT6 MODE For RF

GPIO_50 KP_OUT(4) Key pad

EINT7 JACK_DETECT Headset Detect(High: unplugged, Low: plugged)

CC1CC3IO LCD BACKLIGHT LCD Backlight Control

GPIO_53 LCD ID Neodis : L

GPIO_54 _FM_RESET FM Radio chip reset

GPIO_55 AU_PWR_EN Audio amp power enable( active high)

RF I/F

RF_STR0 EN RF Transceiver chip enable

GPIO_57 TF_DETECTMicro SD card detect (High:

inserted, Low: ejected)

RF_DATA DA RF Transceiver chip data

RF_CLK CLK RF Transceiver chip clock

System port

AFC AFCAutomatic Frequency control DAC

output for 26MHz VCTCXO

CLKOUT0 [<=26MHz] Not Use

F26M 26MHZ_MCLK Baseband processor PLL

input Main clock

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3. TECHNICAL BRIEF


F32K Sleep crystal 32.768KHz

OSC32K Sleep crystal 32.768KHz

RESET_n _RESET Baseband processor reset

CC1CC1IO TRIG_OUT For JTAG & ETM Interface

RTC_OUT RTC_OUTWake up signal to alarm (High;

wake up, Low: Power off)

VCXO_EN VCXO_EN 26MHz clock enable

DSP

DSPIN0 _BT_RESET Bluetooth chip reset

GPIO_62 MIC_GAIN_SEL Microphone gain select (High: 12dB, Low: 0dB)

GPIO_63 _SIM_EN SIM card power enable

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3. TECHNICAL BRIEF

3.3. Power management IC

3.3.1. General Description

SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It hasbeen specially designed for usage with S-Gold2. Although optimized for usage with the Infineon S-GOLD baseband device it is suitable for the S-GOLDlite and the E-GOLD+ baseband devices aswell. It also supports the cellular RF devices like SMARTi-DC, SMARTi-DC+, SMARTi-SD and theBluemoon Single, Infineon’s single chip solution for Bluetooth. If used with S-GOLD2 it provides allpower supply functions (except for the RF PA) for a complete advanced GSM Edge smart phoneminimizing external device count.

Block Description• Highly efficient step-down converter for main digital baseband supply including Core, DSP and

memory interface (External Bus Unit).• Support of S-GOLD standby power-down concept• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices• Voltage independent switching of two SIM cards• LDO regulators for baseband I/O supply• LDO regulator for analog mixed-signal section of S-GOLD• Low-noise LDO regulators for RF devices• Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth• Audio amplifier 8 Ohms for handsfree operation and ringing• Charge Control for charging Li-Ion/Polymer batteries under software control• Pre-charge current generator with selectable current level• RTC regulator with ultra-low quiescent current• USB interface support for peripheral and mini-host mode• Backlight LEDs driver with current selection and PWM dimming function• Two single LED driver outputs for signaling• Vibrator driver with adjustable voltage• Fully controlable by software via I2C - Bus• Temperature and battery voltage sensors• Interrupt channels for peripherals• System debug mode• VQFN 48 package with heat sink and non-protruding leads• Compatible with the Infineon E-GOLD+ V2 and V3


- 31 -

3. TECHNICAL BRIEF

SM-POWER is a further step on the successful E-Power product line with enhanced and optimizedfunctionality. SM-POWER features a baseband supply concept with a DC/DC step-down converter(SDBB) cascaded by two linear regulators (LBB1/2)- SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone

functions (e.g. organizer functions, games, MP3 decoding) possible.- SDBB has high efficiency up to 95% and also a power save mode.- Memory Interface is directly supported by the SDBB- SDBB can also act as main supply voltage for E-GOLD+ or S-GOLDlite baseband devices.- For S-GOLD two linear regulators for DSP and Core are cascaded after the SDBB.


Figure 3 Top level block diagram of the SM-Power(PMB6812)

- 32 -

3. TECHNICAL BRIEF

SM-POWER supports the standby power-down concept of S-GOLD by temporarily switching off thelinear regulator LBB1 for the DSP during mobile standby whenever this subsystem is not used. In thisphase the ARM controller and most peripherals including parts of the on-chip SRAM are keptpowered-up with power being supplied by the other linear regulator LBB2.SM-POWER includes a fully differential audio amplifier able to drive loads down to a nominal value of8 Ohm for usage in hands-free phones and for ringing

- 400 mW maximum output power- adjustable gain- mute switch- click and pop - protection

SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries- Precharge current source with two current levels- Constant current / constant voltage charging with 3 different termination voltages- Programable charge current limitation for use with different batteries- Freely programable pulse charging to reduce the thermal power dissipation in the constant voltage

charging phase- Top-off charge current sensing

SM-POWER completes the USB interface of S-GOLD- Regulated voltage for S-GOLD USB interface including reverse current and overvoltage protection- Switch to supply USB pull-up resistor- Mini-host pull down resistor functionality- Charge pump with internal switching capacitor for USB host VBUS supply voltage

SM-POWER fully supports LED and Vibra Motor functionality- no external components needed- driver for backlight LEDs adjustable in steps up to 140mA and with soft turn on and off by PWM

dimming- two driver outputs for single LEDs for precharge indication and signaling with i.e. change of colour- driver for Vibra Motor with adjustable voltages, soft startup / shutdown and current limitation

SM-POWER offers several control functions- Power-on Reset Generator with logic state machine- I2C bus interface- I2C bus configurable mode control logic with ON (push-button or RTC), VCXOEN and LRF3EN

(wake-up by Bluetooth) inputs- Programable interrupt channels to handle peripherals like SIM, MMC and USB- Monitoring of charging functions- Undervoltage Shut-Down- Errorflags (volatile or non-volatile) from many power-supply functions and thermal sensor in order

to debug system- Overtemperature Shut-Down- Overtemperature Warning- Support of S-GOLD standby power-down concept- Support of S-GOLD Power-Down Pad Tristate Function


- 33 -

3. TECHNICAL BRIEF

Table 6 LDO Output Table of SM-Power


LDO Net name Output Voltage Output Current Usage

SDBB 1V8_MEM 1.8V 850mA Memory & for LDO

LRFC 1V5_RF 1.5V 120mA RF transceiver

LBB1 1V5_DSP 1.5V 170mA DSP in BBP

LBB2 1V5_CORE 1.5V 300mA ARM core in BBP

LINT 2V72_IO 2.72V 135mA Peripherals

LSIM 2V85_SIM 2.85V 22mA SIM card

LSIM2 2V85_IO2 2.85V 200mA Peripherals

LMMC 2V85_CARD 2.85V 135mA SD card

LANA 2V65_ANA 2.65V 220mA Analog block in BBP

LRTC 2V11_RTC 2.11V 0.3mA RTC block & Backup battery

LRF1 2V85_RF 2.85V 250mA RF IC

LRF2 2V7_RF 2.7V 10mA RF IC

LRF3 2V65_BT 2.65V 150mA BT IC(Blue moon)

LUSB 3V1_USB 3.1V 45mA USB I/F

Figure 4 Power domain block diagram of KE970

- 34 -

3. TECHNICAL BRIEF

3.3.2. Charging

SM-POWER provides together with an external p-channel FET Siliconix Si3455 an external AC-adapter a complete charge control function for charging of Li-Ion or Li-Ion-Polymer batteries. Eithera 1-cell Li-Ion or Li-Ion-Polymer battery with 4.1, 4.2 or 4.4 Volts may be used.

1. Charging method : CC-CV2. Charger detect voltage : 4.0V3. Charging time : 3h4. Charging current : 500mA5. CV voltage : 4.2V6. Cutoff current : 100mA7. Full charge indication current (icon stop current) : 100mA


(1608)

(1608)

(1608)

PMIC & Li-ion CHARGER

(1608)(1608)(1608)

connecto GND to PIN7 / PIN8 (1608)

C224

VBAT

2.2u

FB201

470KR207

C2412.2u

C2060.1u

2.2uC217

R211100K

3V1_USB

10uC229

220K

R204

C2342.2u

VCHG

C2212.2u2.2u

C218

VBAT

2V65_BT

C24068u

2.2uC220

2.2uC244

2.2uC245

10uC226

2V72_IO

C2282.2u

C2422.2u

C22710u

VCHG

2.2uC219

VBAT

82KR210

C2050.1u

D201SDB1040

2V7_VCXO

2V85_CARD

C215 C2162.2u2.2u

2V11_RTC

C2080.1u

VBAT

R205

22K

R2210.15

C2330.1u

C23010u

C222 0.1u

2V85_SIM

2.2uC223

C235

VBAT

VBAT

4.7u

2V85_IO2

2.2uC243

1V5_DSP

2.2uC225

1V8_MEM 1V5_RF

2V85_RF

10uHL201

VS

IM1

18

VS

IM2

19

VSSAU27

VSSFB8

VSSPW7

33VSSR

10VUPU

11VUSB

30VDDAU

17V

DD

B

46V

DD

C

43V

DD

CH

5VDDPW

VD

DR

F39

13V

IB

21V

INT

VLB

B1

45

VLB

B2

47

20V

MM

C40

VR

F1

38V

RF

2V

RF

337

3VRFC

42V

RT

C

16LE

D

LRF

3EN

22

ON4

48R

ES

ET

Q

SC

L23 24

SD

A

SLE

D1

15S

LED

214

SW6

VANA34

2VBATS

VBUS12

44V

CH

C

VCHS1

VCXOEN3635

VDDA

U203PMB6812

AUIN2526

AUIP

28AUONAUOP

29

31BYP

FB9

49G

ND

INT

OU

T41

IREF32

C2322.2u

0.1uC207

G

SQ201

D1 D2 D3 D4

SI3457BDV

1V5_CORE

2V65_ANA

C2312.2u VCH_CTL

VCHS

USB_PU

VBACKUPRTC_OUT PWRON

VBUS_USB

VCH_CTL

VCHS VCXO_EN

SPOWER_INT

KE

Y_B

AC

KLI

GH

T

BT

_VC

XO

_EN

PWRON

_PMRST

SC

LS

DA

SLE

D1

Figure 5 SM-Power circuit diagram with charging part

Figure 6 Battery Block Indication

3.69V~3.62V 4.2V~3.86V 3.85V~3.75V 3.75V~3.69V

- 35 -

3. TECHNICAL BRIEF

8. Recharge voltage : 4.00V9. Low battery alarm

a. Idle : 3.50V~3.35Vb. Dedicated : 3.59V~3.35V

10. Low battery alarm intervala. Idle : 3minb. Dedicated:1min

11. Switch-off voltage : 3.35V12. Charging temperature adc range

a. ~ -5˚C : low charging voltage operation (3.6V ~ 3.9V) .b. -5˚C ~ 50˚C : standard charging (up to 4.2 V)c. 50˚C ~ : low charging voltage operation (3.6V ~ 3.9V)

3.4. Power ON/OFF

KE970 Power State : Defined 3cases as follow] Power-ON : Power key detect ( SM-Power’s ON port] Power-ON-charging : Charger detect.] Power-ON-remote : remote power on detect (Factory use only)


Figure 7 Power on application.

- 36 -

3. TECHNICAL BRIEF

Input ON is a power-on input for SM-POWER with 2 active high levels (see Figure 8). It might betriggered by a push button or by the RTCOUT output of the S-GOLD device as well. To detect if thepush-button is pressed during system operation the logical level at pin ON or its change (if Bit 1 EIONin INTCTRL2 is asserted) is recorded in bit LON of the ISF register. If the high level of voltage at pinON does not reach VIHdet (Vbat-0.8 ~ Vbat-0.3) the above-mentioned bit won’t be set.To support Remote power on function for factory mass production, applied an analog switch asfollowing figure. As monitoring the RPWRON(GPIO_110) and Key matrix KP_OUT(1) & KP_IN(5),KE970 system recognize whether remote power on or End-key pushed


C3260.1u

6 NO

2V

CC

U305 NLAST4599DFT2G

5COM

GN

D3 1

IN

NC4

R329100K

VBAT

PWRON

RPWRON

END_KEY

R311 10K2SC5585 2

3

1

Q301

100KR310

END_KEY

KP_IN(5)

KP_OUT(1)

END

END KEY ON/END

VBAT

END_KEY

Figure8 Remote power on and End-key power on circuit

- 37 -

3. TECHNICAL BRIEF

3.5. SIM interface

KE970 supports 3V plug in SIM, SIM interface scheme is shown in (Figure 10).SIM_IO, SIM_CLK, SIM_RST ports are used to communicate with BBP(S-Gold2) and the SIM powersupply enabled by BBP (_SIM_EN).

SIM InterfaceSIM_CLK : SIM card reference clockSIM_RST : SIM card Async /sync resetSIM_IO : SIM card bidirectional reset


Figure 9 SIM CARD Interface

27pC236

2V85_SIM

100KR212R213100K

2V72_IO

22pC251

47R22311

10SWASWB

9

45

56

67

78

8

C1

C1

C2

C2

C3

C3

C5

C5

C6

C6

C7

C7

GND11615

GND214

GND3GND4

1312

GND5GND6

CN202

112

23

34

1uFC252

R217100K

C2501000p

D1 6

3 D2

G12 5G2

1 S1

S2 4

2V85_CARD

NTJD4105CT1G

Q203

100KR219

27p

D

G

S

C239Q202SI1305-E3

100KR216R215

100K 100KR218

4.7KR214

C237NA

C2381u

TF_PWR_EN

SIM

_RS

T

SIM

_CLK

SIM

_IO

_SIM

_EN

TF_DAT2TF_DAT3TF_CMD

TF_CLK

TF_DAT0TF_DAT1

TF_DETECT


3. TECHNICAL BRIEF

- 38 -

3.6. Memory

512Mbit Flash & 256Mbit SDRAM employed on KE970 with 16 bit parallel data bus thru ADD(0) ~

ADD(24). The 512Mbit Sibley Wireless Flash memory with LPSDRAM stacked device family offers

multiple high-performance solutions. The Sibley flash die is manufactured on 90 nm process

technology.

It delivers 108 MHz synchronous burst and page-mode read rates with supports multi-partitioning with

Read-While-Write (RWW) or Read-While-Erase (RWE) dual operations. The LPSDRAM is a high-

performance volatile memory operating at speeds up to 104 MHz with configurable burst lengths.

Figure 10 Flash memory & SDRAM MCP circuit diagram

32

1

4

$V1KR114

TP103

0.1uC125

10KR112

K4

D5_ADV

H7_OE

_WEE2

S_VCC

J2VCCQ1VCCQ2

J3

VCCQ3J7

VCCQ4J8

VSS1C2

VSS10K6K7

VSS11VSS12

K8

C3VSS2VSS3

C4

VSS4C6C7

VSS5VSS6

C8

VSS7K2K3

VSS8VSS9

F2__CEH3

F3__CEF4__CE_A27

E6K5

F_CLK

F_DPDB6

F_VPPJ1

F_WAITJ9G7

F__RST

F__WP1E1

F__WP2F1

N_ALED8

N_CLEE5

H1N_RY__BY

N__RE_S__CS1F6H2

N__WE_S_CS2

G1RFU

D2

D_DM0_S__LBD_DM1_S__UB

H8

M3D_LDQSD_UDQS

M7

C5D_VCC1D_VCC2

D3

D_VCC3D7

D__CASF3

D__CLKH5

D__RASF4

H6D__WE

F1_VCC1D4

F1_VCC2J4

F1__CEG3

F2_VCC1D6

F2_VCC2J6

G2

DQ2L2

DQ3DQ4

M4

DQ5L3

DQ6L4

DQ7L5M5

DQ8L6

DQ9

DU1A1

DU2A9M1

DU3M9

DU4

G4D_BA0D_BA1

H4

D_CKEG6

D_CLKJ5

H9

A4A5

B3A3

A6A4

A7A8

G8

A9F8

F2D1__CS

E3D2__CS

DQ0M2

DQ1L1

DQ10M6

DQ11L7L8

DQ12K9

DQ13DQ14

L9

DQ15M8

K1

A13D9

A14A15

C9B9

A16B4

A17B5

A18A19

A5

B1A2

F7A20

E7A21

B7A22A23

A6

A24A7A8

A25A26

B8

A3B2A2

PF38F6070M0Y0BEU101

D1A0A1

C1

A10E8

A11G9F9

A12E9

R108 NA

C1280.1u

100KR115

1V8_MEM

1V8_MEMTP105

C1260.1u

TP106

R110 24

0.1uC127

TP111

R107 NA

R106 0

1KR113

R109 24

TP112

TP108

TP110

TP102

R111 0

C1290.1u

TP109

0.1u

_ADV

C130

_FLASH2_CS

_FLASH1_CS

_1G_CS

_FLASH1_CS

A(14)A(13)

_CAS_RAS

CKE

_BC0_BC1

BFCLKI

SDCLKI

_RESET

A(0:24) D(0:15)

D(5)D(6)D(7)D(8)D(9)

SDCLKOBFCLKO

F_DPD

_WAIT

_RAM_CS

_WR

_RD

A(5)A(6)A(7)A(8)A(9)

D(0)D(1)

D(10)D(11)D(12)D(13)D(14)D(15)

D(2)D(3)D(4)

A(12)A(13)A(14)A(15)A(16)A(17)A(18)A(19)

A(2)

A(20)A(21)A(22)A(23)A(24)

A(3)A(4)

A(0)A(1)

A(10)A(11)

- 39 -

3. TECHNICAL BRIEF

3.7. LCD Display

LCD module include:- LCD : 320*240 265K Color TFT LCD- Backlight : 5 piece of white LED illumination

LCD module is connected to main board thru 35 pins connector.LCD FPC Interface Spec:Table 7 LCD FPC Interface Spec.


Pin No. Pin Name I/O Description

1 VCC(2.8V) Power LCD power supply

2 VDDIO(2.8V) Power LCD power supply

3 GND Power LCD power supply

4 MAKER_ID O LCD maker Identification

5 D0 I/O Data[0] for LCD
















21 GND - Ground

22 /RESET I Reset

23 /WR I Write strobe

24 /RD I Read strobe

25 /CS I LCD chip select

26 RS I Command / Data switch

27 IFMODE I 8bit / 16bit switch

28 GND - Ground

29 VSYNC_OUT I NA

30 MLED_Cathod5 O Back light LED Cathode





35 MLED_Anode I Back light LED Anode

- 40 -

3. TECHNICAL BRIEF

3.8. Keypad Switching & Scanning

The keypad interface is a peripheral which can be used for scanning keypads up to 6 rows (outputsfrom Port Control Logic) and 6 columns (inputs to PCL). The number of rows and columns depend onsettings of the PCL.


Figure 11 KEY FPCB part numeric key matrix

SIDE KEY

END RIGHT

MENU

AF

SHUTTERLEFT

SERCHOKKB_SND

510

503

KB_STAR KB_BGM

509

502

KB_SHA

501

KB_UP505

507

506

KB_CAM

KB_DOWN508

KB_CLR

KP_IN(5)

KP_OUT(3)

KP_OUT(0:4)

KP_OUT(4)

504

KP_IN(4)

KP_IN(0:5)

KP_OUT(0)

KP_OUT(1)

KP_OUT(2)

KP_IN(0)

KP_IN(1)

KP_IN(2)

KP_IN(3)

4O

UT

3P

DN

1V

DD

VS

S2

U601EM-0611

V_SCROLL_2.8

4O

UT

3P

DN

1V

DD

VS

S2

U602EM-0611

SCROLL_KEY_A SCROLL_KEY_B

HALL_EN

- 41 -

3. TECHNICAL BRIEF

Most of numeric keys are located on the Keypad FPCB, Scroll key for menu navigation is on the LCDFPCB, and Power on (End key), BGM hot key, Camera shutter and volume up & down keys areconnected via 70pin board to board connector between main PCB and Keypad FPCB.


Figure 12 LCD PCB part Navi & Scroll key matrix

SERCHOK

LEFT

MENU

RIGHT

605604

603

ICVL0505600V150FRVA602

ICVL0505600V150FR

602

VA601

601

KP_OUT(1)KP_OUT(2)

KP_IN(5)

KP_IN(0)

KP_OUT(0)

- 42 -

3. TECHNICAL BRIEF

3.9. Keypad back-light illumination

There are 2 snow white color LEDs on the KEY FPCB for keypad illumination. Keypad Back-light iscontrolled by SM-Power LED port which has constant current control function.The whole configuration of the SM-POWER LED drivers is shown in below Figure16.


Figure 13 Keypad Back-light LEDs

Figure 14 Keypad Back-light LEDs

change to LEWWS44

LD501 LEWWS44-E

LEWWS44-ELD502100ohmR502

R501 100ohm

VBAT

KEY_BACKLIGHT

- 43 -

3. TECHNICAL BRIEF

3.10. LCD back light illumination

The MAX8645Y charge pump drives up to 6 white LEDs in the main display for backlighting and up to2 white LEDs for flash, all with regulated constant current for uniform intensity. By utilizing adaptive1x/1.5x/2x charge pump modes and very-low-dropout current regulators, it achieves high efficiencyover the 1-cell lithium-battery input voltage range. 1MHz fixed-frequency switching allows for tinyexternal components and low input ripple. Two on-board 200mA programmable output voltage LDOsare provided to meet camera module requirements.

For more dimming flexibility or to reduce the number of control traces, the MAX8645Y supports serialpulse dimming. Connect ENM1 and ENM2 together to enable single-wire pulse dimming of the mainLEDs (or ENF only for single-wire pulse dimming of the Flash LEDs). When ENM1 and ENM2 (orENF) go high simultaneously, the main (or flash) LEDs are enabled at full brightness. Eachsubsequent low-going pulse (500ns to 250•Ïs pulse width) reduces the LED current by 3.125% (1/32),so after one pulse the LED current is 96.9% (or 31/32) * ILED. The 31st pulse reduces the current to0.03125 x ILED. The 32nd pulse sets the LED current back to ILED. Figure 1 shows a timing diagram forsingle-wire pulse dimming.Because soft-start is longer than the intitial tHI, apply dimming pulses quickly upon startup (after initialtHI) to avoid LED current transitioning through full brightness.


Figure 15 LCD Back light unit and Flash LED charge pump IC

M1 = 18.4mA

F1 = 160mA

C517

1u

10u

C511

7500ohmR512

1PIN

REFBP6

7SETF

SETM8

F1109

F2

3GND

IN2

LDO145

LDO2

16M1M2

15

M31413

M4M5

1211

M6

OUT25

28P1P2

17

24PGNDBGND

29

22C1N

C1P23

C2N27

26C2P

ENF2118

ENLDO

20ENM1ENM2

19

MAX8645YU501

D50

1

MS

MF

05C

-PV_SCROLL_2.8

1uC516

1u

C514

VA503

VBAT

5.1KR513 C515

0.01u

10uC509

MLED_C1MLED_C2MLED_C3MLED_C4MLED_C5

MLED_A

FLASH_LED_C

FLASH_EN

LCD_BACKLIGHT

SCROLL_EN

- 44 -

3. TECHNICAL BRIEF

Setting the Main Output CurrentSETM controls M1-M6 regulation current. Current flowing into M1, M2, M3, M4, M5, and M6 is amultiple of the current flowing out of SETM.

IM1=IM2=IM3=IM4=IM5=IM6 = K * (0.6V / RSETM) = 18.4mAwhere K = 230, RSETM = 7500

where K = 23, 69, or 230 (depending upon the state of ENM1 and ENM2, see Table 8), and RSETM isthe resistor connected between SETM and GND (see the Typical Operating Circuit).

Table 8. ENM1/ENM2 current setting table

Setting the Flash Output Current

SETF controls the F1-F2 regulation current. Current flowing into F1 and F2 is a multiple of thecurrent flowing out of SETF.

IF1=IF2 = N * (0.6V / RSETF) = 162mAwhere N = 1380, RSETF = 5100


ENM1 and ENM2

IM_ or IF_SHDN

32/32 31/32 30/32 29/32 28/32 27/32 5/32 4/32 3/32 2/32 1/32

32/32 31/32

SHDN

2ms (typ.)

1 3231302928275432

tLO

tHI

tSHDN

> 500ns500ns to 250us

0

tSOFT-START

Initial tHI

> 200 s

Figure 16 Seiral pulse dimming timing diagram

ENM1/ENM2 STATES BRIGHTNESS M1 - M6 CURRENT

ENM1 = low, ENM2 = low Shutdown 0

ENM1 = low, ENM2 = high 1/10 Brightness 23 x ISETM

ENM1 = high, ENM2 = low 3/10 Brightness 69 x ISETM

ENM1 = high, ENM2 = high Full Brightness 230 x ISETM

- 45 -

3. TECHNICAL BRIEF

3.11 Battery current consumption monitor

KE970 use a current monitoring function to calculate the battery capacity and the remaining time, asmonitoring current flow from the battery thru 47mohm resistor.

3.12 JTAG & ETM interface connector

In case of KE970 mass production, the JTAG & ETM interface connector will not be mount on board.That is only for developing and software debugging purpose.


(F)

(F)

VBAT

1KR202

VSUPPLY

2.2uC202

IOUT3

5LOAD NC

1

4VIN

ZXCT1010E5TA

U201

2GND

C21147p

D2

123

10p

CN201D1

27pC209 C210

C204100p

R2062.2K

R20347mohm

C2010.1u

2.2uC203

C2121u

BATT_TEMPI_MONITOR

Figure 17 Current monitor circuit

2V72_IO 1V8_MEM

192021222324

G1 G2

G3 G4

3456789

16

252627282930

1718

CN101

1

101112131415

2

TRACEPKT(2)

TRACEPKT(3)

TRIG_OUT

_TRSTTDI

TMSTCK

RTCKTDO

_EXTRSTTRIG_IN

TRACEPKT(7)

TRACEPKT(0:7)

TRACEPKT(4)

TRACEPKT(5)

TRACEPKT(6)

TRACECLK

TRACESYNCPIPESTAT0PIPESTAT1PIPESTAT2

TRACEPKT(0)

TRACEPKT(1)

Figure 18 JTAG & ETM(Embedded Trace Module) interface connector

- 46 -

3. TECHNICAL BRIEF

3.13. AudioKE970 Audio signal flow diagram as following diagram.


Figure 19 Audio signal flow diagram

- 47 -

3. TECHNICAL BRIEF

3.13.1. Audio amplifier sub system IC with 3D effect

Audio amplifier sub system IC is an audio power amplifier capable of delivering 500mW ofcontinuous average power into a mono 8Ω load, 25mW per channel of continuous average powerinto stereo 32Ω single-ended (SE) loads. The LM4845 features a 32-step digital volume control andeight distinct output modes. The digital volume control, 3D enhancement, and output modes(mono/SE/OCL) are programmed through a two-wire I2C interface that allows flexibility in routingand mixing audio channels.


Figure 20 Audio amplifier Sub-system IC

Figure 21 Audio signal distribute analog switch

R233 100K

C264 100u

0.1uC256

3V3_AUDIO

C2600.068u

C268 220n

R238 0

C269 1u0.068uC270

220nC262

R2374.7K

4.7KR243

15

MONO-17

MONO_IN+23

MONO_IN-22

PG

ND

25

19RHP3D1

24RHP3D2

8RIN

ROUT5

11SCL

10SDA

VD

D1

3 16V

DD

2

2VOC

LM4946SQXU207

CB

YP

AS

S21

4G

ND

1

GN

D2

12 20G

ND

3

14I2CSPI_SEL

I2CSPI_VDD7

ID_ENB13

LHP

3D1

18 1LH

P3D

2

LIN

9 6LO

UT

MONO+

C2551u

470nC267

2V72_IO

100uC266

R241 0

0.1uC263

BBP_SND_R

BBP_SND_L

HS_OUT_L

SPK_P

SPK_N

HS_OUT_R

SCL

SDA

C258

3V3_AUDIO

27p

27pC254

24R228

7NC2

2NO1

10NO2

1VCC

U205

NLAS5223BMNR2G

COM13

COM29

6GND

4IN1

8IN2

NC15

2V72_IO

C271100p

47KR2302V85_IO2

R232 24

1VCC

100R235

NLAS5223BMNR2G

U208

COM13

COM29

GND

64IN1

8IN2

NC15 7

NC2

2NO1

10NO2

R22510K

100R224

R227 47

C265100p

C253 100p

100pC261

2V85_IO2

47R226

HS_OUT_R

CTS_0

HSO_SEL

SPK_RCV_SEL

SPK_N

RCV_P

RCV_N

HS_OUT_LMULTI_PORT_3

MULTI_PORT_2RTS_0

SPK_P

SPK_RCV_P

SPK_RCV_N

- 48 -

3. TECHNICAL BRIEF

3.13.2. Microphone with gain switching circuit

When a call is established, MICBIAS signal goes up to ‘2.5V’ in the MKE970. PMB8876(S-Gold2)provides both 2.0V and 2.5V for MICBIAS to circuit designer. VA01, VA02 are employed to enhanceESD immunity.

3.14. Multi port switch

Multi port switch has employed to decrease MMI(Multi Media Interface) connector’s pin number. USB,USART, Remote controlled Headset is connected via this multi port switch. When USB VBUS voltageis detected Multi port 0 and 1 is connected to USB_DP and USB_DM each. If the remote controlledheadset is plugged into MMI connector, then multi port 0 and 1 in go through REMOTE_INT andREMOTE_ADC.

Table 9 Multi port switch truth table


MICROPHONE

R505 220

C50347p

1KR504

C50233p

220

12

R503

MIC501OSF213-42DC

VA502ESD9X5.0ST5G

1KR5071u

R506NA

C506

C50115p

ESD9X5.0ST5GVA501

VMICN

MIC1_P

VMICP

MIC1_N

Figure 22 Microphone circuit

VBUS_USB='L' VBUS_USB='L' VBUS_USB='H'

JACK_DETECT='L' JACK_DETECT='H'

Pin6 REMOTE_INT TXD USB_DP

Pin7 REMOTE_ADC RXD USB_DM

- 49 -

3. TECHNICAL BRIEF


Figure 23 Multi port switch 1

Figure 24 Multi port switch 2

GND

IN

OUT

Pin7

Pin7

Pin6

Pin

6

Pin

6 Pin7

Pin7

Pin6

Pin7

Pin6

NO411

14V

+

2V72_IO

BG

ND

17 16C

OM

1

4COM2

8C

OM

3

12COM4

6G

ND

2IN1_2

IN3_410

1NC1

NC

25

9NC3

NC

413

NO

115

NO23

7N

O3

10R240

DG2018DN_T1_E4U206

C2570.1u

10KR236

R242 10

VBAT

VBAT

1.5KR239

R22910K

10K

R234B

C

E

RN1307Q204

100pC259

VA201

10KR231

100K

R244REMOTE_INT

TXD_0

JACK_DETECT

USB_PU

MULTI_PORT_0

MULTI_PORT_1

REMOTE_ADC

USB_DPUSB_DM

RXD_0

VBUS_USB

CTS_0

H SPK_P SPK_N

RTS_0

MULTI_PORT_2 MULTI_PORT_3

L HS_OUT_L

SPK_RCV_P SPK_RCV_N

L RCV_P RCV_N

HHS_OUT_R

SPK_RCV_SEL

HSO_SEL

C258

3V3_AUDIO

27p

27pC254

24R228

7NC2

2NO1

10NO2

1VCC

U205

NLAS5223BMNR2G

COM13

COM29

6GND

4IN1

8IN2

NC15

2V72_IO

C271100p

47KR2302V85_IO2

R232 24

1VCC

100R235

NLAS5223BMNR2G

U208

COM13

COM29

GND

64IN1

8IN2

NC15 7

NC2

2NO1

10NO2

R22510K

100R224

R227 47

C265100p

C253 100p

100pC261

2V85_IO2

47R226

HS_OUT_R

CTS_0

HSO_SEL

SPK_RCV_SEL

SPK_N

RCV_P

RCV_N

HS_OUT_LMULTI_PORT_3

MULTI_PORT_2RTS_0

SPK_P

SPK_RCV_P

SPK_RCV_N

- 50 -

3. TECHNICAL BRIEF

3.15. USB charging circuit

The USB charging circuit is a fully integrated USB VBUS voltage single-cell Li-ion battery chargercircuit.The charger uses a CC/CV charge profile required by Li-ion batteries. CC charging current and End ofcharging current is programmable IREF & IMIN resistors. IREF resistor between this pin and the GND pin toset the charge current limit determined by the following equation:

ICC = 12089/33K = 366mA

The End Of Charging current is set by IMIN That can be programmed by the as following equation:IEOC = 11000/220K = 50mA

Charging indicator LED controlled by two ICs, one is a SM-Power, the other is a ISL6294. WhenTA(Travel Charger) is plugged in to MMI connector, the LD100 controlled by SM-Power both power offcase and power on case. When USB cable is connected via MMI connector, indicator LED iscontrolled by ISL6294 in power off case and by SM-Power in power on case.


Figure 25 USB charging circuit

360mA

50mA

8BAT

5GND

IMIN6

IREF7

9PGND

VIN1

3_CHG

_EN4

2_PPR

ISL6294U202

R20933K

2V72_IO

1uC214

1uC213 R208

220K

VBAT

10KR201

_USB_EOC

VBUS_USB

_USB_CHG_EN

- 51 -

3. TECHNICAL BRIEF

3.16. BLUETOOTH


Figure 26 BLUETOOTH Functional block diagram.

- 52 -

3. TECHNICAL BRIEF

3.16.1. General Features

• Single Chip Bluetooth device for cellular applications integrating radio, baseband and memory• Fabricated in advanced low power 0.13•Ïm CMOS technology• Very low component count (6 external components)• Ultra low power design

- Peak current 40mA for basic data rate- Peak current 45mA for enhanced data rate- Bluetooth low power mode typ. 25µA

• Multiple input clock signals supported (10-40MHz)• Supply from external voltage regulator 1.8V..3.6V 1)• Autonomous power down scenarios of Bluetooth and cellular system supported• Packages:

- P-VQFN-48 package- P-WFLGA-56 package

• Temperature range from -40°C up to 85°C• Boundary scan for interface lines via JTAG

3.16.2 Micro-Controller-Section

• ARM7TDMI-STM ARM® Processor for protocol and application software• Timers + Watchdog + Interrupt Module

3.16.3 Micro-Controller Memory

• 32 KByte RAM• 256 KByte read only Program Memory• 8 KByte Patch RAM

3.16.4 Interfaces

• UART (Bluetooth - Interface, support for HCI UART and Three-Wire UART transport layerswith/without hardware handshaking) up to 3.25MBaud

• Two channel PCM Audio interface with I2S mode• I2C Interface• Three channel full duplex CVSD trans coder• General Purpose I/Os

- External interrupt- Port output levels available during low-power mode (VDD supplied)

• Separate voltage domains for GPIO, UART and PCM interfaces• Control signal for requesting external (cellular) system clock• Multi frequency (e.g. 32.768 kHz) low power clock input


- 53 -

3. TECHNICAL BRIEF

3.16.5. RF-Section

• Integrated antenna switch to minimize external components count• Programmable RF transmit power between -55dBm...+6dBm

- Fine tuning in 2dB programmable steps also supported• 20dBm power class 1 supported with external power amplifier

- Separate TX output interface to PA (bypass of internal T/R switch)- Digital power step control

• Receiver sensitivity typ. -90dBm• High performance integrated LNA with excellent blocking and inter modulation performance• Low-IF receiver topology eliminates external IF filters• Digital demodulation for optimum sensitivity and co- / adjacent channel performance

- Digital offset compensation, symbol and frame synchronization• RSSI information for power control


- 54 -

3. TECHNICAL BRIEF

3.16.6 System Integration

The UART (serial interface) is used for the software interface between S-Gold2 baseband and theBluetooth chip. For the HCI UART transport layer four interface lines are needed, two for data(UARTTXD and UARTRXD) and two for hardware flow control (UARTRTS and UARTCTS). For theHCI Three-Wire UART transport layer two interface lines (UARTTXD and UARTRXD) are needed. Thehardware flow control lines (UARTRTS and UARTCTS) are supported but the use is optional. InKE970 used three-wire UART communication.The UART interface has its own supply voltage (VDDUART) to ensure compatibility with the I/Ovoltages used by the S-Gold2.The PCM/I2S interface is used as audio interface and can handle up to two voice channels. The PCMinterface also has its own supply voltage (VDDPCM) to ensure compatibility with the I/O voltages usedby the S-Gold2 baseband processor.


Figure 27 Mobile system integraton

- 55 -

3. TECHNICAL BRIEF

3.17. Micro SD external memory card slot

The TransFlash Memory Module has eight exposed contacts on one side. The S-Gold2 is connectedto the module using a dedicated eight-pin connector


BLUETOOTH

C340

1V8_MEM

1000p

C347100p

10nC339

0.1uC335

NAR336

L305 1.2nH

R3330

5G

16

G2

1UB

DBF71B601FL308

3B1

4B2

DC2

PAD302

H9

VDD_1A8B3

VDD_2

D4

VS

S1

VS

S2

D5

D6

VS

S3

VS

S4

E6

F6

VS

S5

VSSRF1F4E5

VSSRF2VSSRF3

F5

VSSRF4E4

F2VSSVCO

B2WAKEUP_BT_P1_7

WAKEUP_HOST_P1_8B1

UA

RT

CT

SU

AR

TR

TS

J8 J7U

AR

TR

XD

UA

RT

TX

DH

8

J6VCOCAP1

H6VCOCAP2

VDDC1F9B5

VDDC2

D2VDDCREG

E9

VD

DP

CM

VDDPLLH1

G2VDDPMREG

H4VDDRFVDDRFREG1

E1E2

VDDRFREG2

F1VDDSUP

VD

DU

AR

T

J4J5R

FIO

XRFOUT

H5

RTCKB9

SCL0_P0_13C9

SLEEPX_P0_15F8

TCKB7

TDIA7B6

TDO

B4TMS

A6TRST_

TX

A1

J3 H3

TX

A2

TX

AX

J2

TX

_CO

NF

_P0_

14H

7

TX_CONF_RXONA2

G8

JTAG_

H2

LOA

D

NC

1A

1A

9N

C2

J1N

C3

NC

4J9

C1

P1_

6

PAONA4

PC

MC

LKD

9D

8P

CM

FR

1

C8PCMFR2_SDA0_P0_12

PC

MIN

G9

E8

PC

MO

UT

A3PSEL0PSEL1

B8

D1RESET_

RF

IOPMB8753

U307

C2CLK32_P1_5

G1

CLK

IN_X

TA

L

A5

1V8_MEM

0.1uC338

2V65_BT 1V5_CORE

C3370.1u

VBALUN

VBALUN

C3230.1u

C3240.1u

0.1uC334

2pC343

PAD301

NAR335

2V72_IO

L304 1.2nH

C3360.1u

US

IF_T

XD

US

IF_R

XD

CLK32K

BT_CLK

I2S

1_C

LKI2

S1_

WA

I2S

1_T

XI2

S1_

RX

_BT_RESET

BT_VCXO_EN

Figure 28 Bluetooth circuit

Figure 29 Micro SD pin assignment

- 56 -

3. TECHNICAL BRIEF

Table 10 Micro SD memory pad assign.

Table 11 Micro SD memory card detect truth table.


SD mode

Pin No. Name Type Description

1 DAT2 I/O Data bit [2]

2 CD/DAT3 I/O Data bit [3]

3 CMD I/O Command response

4 VDD Power Power supply

5 CLK I Clock

6 VSS Ground Power ground



Micro SD card status

it is removed it is inserted

TF_DETECT High Low

Figure 30 Micro SD memory card detection scheme

- 57 -

3. TECHNICAL BRIEF

3.18. 18pin Multi Media Interface connector

Table 12 Multi media interface pin assign


Figure 31 Micro SD socket circuit with power control

18PIN MUILTIPORT RECEPTACEL

NAR332

R322220K

10K

R32

4

1MR320

C33122n

G1

5

G2

10

INOUT_A11

2INOUT_A2

INOUT_A33

4INOUT_A4

9INOUT_B1

INOUT_B28

7INOUT_B3

INOUT_B46

FL307 ICVE10184E150R101FR

R32

7N

A

R3231.5K

VCC

VIN+3

4 VIN-

2V85_IO2

2V65_ANANCS2200SQ2T2GU306

GND

2

1OUT

5

VA

302

47

R321

10K

R32

5C32922n

VA

304

27pC332

C32727p

R32

647

K

1KR330

FB

303

VA

303

100pC328

C325100p

VA

306

0.1uC346

2.2KR32819

2

20

3456789

CN303

1

101112131415161718

33uC342

R337 1K

10u

2V65_ANA

FB

304

C333

100K

R319

NAR318

8GATE

GATE_OUT9

2GND

IN11

IN24

5IN3

NC11112

NC2

6OUT1

OUT27

10_EN

_FLAG3

VCHG

U304 NCP348MTR2G

VSUPPLY

10pC330

FB

302

VBUS_USBVA

305

R338NA

C3491000p

2.2uC348

2V72_IO

JACK_TYPEJACK_DETECT

RPWRON_ENDSR

MIC2_N

MIC2_P

TX_DEBUGRX_DEBUG

HOOK_DETECT

MULTI_PORT_2MULTI_PORT_3MULTI_PORT_0MULTI_PORT_1

KE970 MMIPin Function Description

1 FM_ANT FM radio antenna / Audio ground2 HS_MIC Headset microphone signal3 JACK_TYPE Accessory type detect4 HS_OUT_L / CTS Headset left sound / CTS5 HS_OUT_R / RTS Headset Right sound / RTS

6TXD / USB_DP /

USART / USB/ Remote control interruptREMOTE_INT

7RXD / USB_DM /

USART / USB/ Remote control Key ADCREMOTE_ADC 8 JACK_DETECT Headset detect (active low)9 VBAT Battery voltage10 VBAT Battery voltage11 RPWRON Remote power on (active high. 2.8V)12 VCHG Charger voltage13 VCHG Charger voltage14 DSR N.C.15 VBUS_USB USB VBUS16 TX_DEBUG Trace TX data(Debug)17 RX_DEBUG Trace RX data(Debug)18 GND Power GND

- 58 -

3. TECHNICAL BRIEF


Figure 32 MMI 18pin connector circuit


NAR332

R322220K

10K

R32

4

1MR320

C33122n

G1

5

G2

10

INOUT_A11

2INOUT_A2

INOUT_A33

4INOUT_A4

9INOUT_B1

INOUT_B28

7INOUT_B3

INOUT_B46


R32

7N

A

R3231.5K

VCC

VIN+3

4 VIN-

2V85_IO2


GND

2

1OUT

5

VA

302

47

R321

10K

R32

5C32922n

VA

304

27pC332

C32727p

R32

647

K

1KR330

FB

303

VA

303

100pC328

C325100p

VA

306

0.1uC346

2.2KR32819

2

20

3456789

CN303

1

101112131415161718

33uC342

R337 1K

10u

2V65_ANA

FB

304

C333

100K

R319

NAR318

8GATE

GATE_OUT9

2GND

IN11

IN24

5IN3

NC11112

NC2

6OUT1

OUT27

10_EN

_FLAG3

VCHG

U304 NCP348MTR2G

VSUPPLY

10pC330

FB

302

VBUS_USBVA

305

R338NA

C3491000p

2.2uC348

2V72_IO


RPWRON_ENDSR

MIC2_N

MIC2_P

TX_DEBUGRX_DEBUG

HOOK_DETECT


- 59 -

3. TECHNICAL BRIEF

RF circuit technical brief

3.19. General Description

The RF transceiver (PMB 6272 SMARTi-PM) is an integrated single chip, quad-band transceiver forGSM850/GSM900/GSM1800/GSM1900 designed for voice and data transfer applications. Thetransceiver provides an analog I/Q baseband interface and consists of a direct conversion receiver anda quad-band polar transmitter for GSM and EDGE with integrated PGA functionality. Further on acompletely integrated SD-synthesizer with HSCSD and GPRS/EDGE capability, a digitally controlledreference oscillator with three outputs, a fully integrated quad-band RF oscillator and a three wire businterface with all necessary control circuits complete the transceiver.


Figure 33 RF transceiver PMB7262 SMARTi-PM functional block diagram

- 60 -

3. TECHNICAL BRIEF


GSM850 DCS1800GSM900

(PIN21)

PCS1900

(PIN20)

R413NA

C423C4221.2p1.2p

C4340.1u

C4182.2p

R427

0

L403

18nH

C4450.1u

VD

DLN

A1V

5

VDDMIX2V839

VDDRX1V51920

VDDRX2V8VDDTX1V535

38VDDTX2V8 VDDVCO2V8

17

VDDXO2V815

XO

11 12X

OX41

29R

X1

RX

1X30 27

RX

2R

X2X

28

RX

32425

RX

3X

RX

42223

RX

4X

36TX1TX2

37

34VBIAS

VCO_RC18

31V

DD

BIA

S2V

8

8V

DD

DIG

1V5

VD

DD

IG2V

85

21

PMB6272

A1 2

AX

B3 4

BX

CLK

76D

A

16EN

FE

132

FE233

14FSYS1

10F

SY

S2

FS

YS

39

13GND1

GN

D2

26

40GND3

GND4

U403

R41510

R410

0

R425

0.1u

0

C425

C4320.1u

R4160

R420620

5.6nH

L405

820R411

C440

GND2

3OUT

VCC4

VCONT1

100p

26MHz

X401

0.1uC424

C450

1V5_CORE

NA

NAR412

2V7_VCXO

1uFC444

NA

NAC449

C447

1000p

2V85_RF

C441

2.5pC416

0

R409

1V5_RF

0

R426

0.1u

R421

10

C446

0.1uC435

R422

0

1.5p

2V85_RF

C420

1000p

C437NAR417

5.6nH

L404

0

R424

2V85_RF

2V85_RF

0.1uC439

1V5_RF

0R419

R423

0

C4172.5p

C4211.5p

C442

2V7_VCXO

22p

22nH

L402

R408

0

47n

NAC443

C436

R418NA

C448NA

0.1uC433

0.1uC438

2.2pC419

HBAND_PAM_INLBAND_PAM_IN

AFC

VBIAS

26MHZ_MCLK

QX

Q

IX

I

BT_CLK

RF_CLK

RF_DA

RF_EN

Figure 34 RF transceiver PMB7262 SMARTi-PM schematic


3. TECHNICAL BRIEF

- 61 -

3.20. Receiver part

The constant gain direct conversion receiver contains all active circuits for a complete receiver chainfor GSM/GPRS/EDGE (see Figure 39). The GSM850/900/DCS1800/ PCS1900 LNAs with balancedinputs are fully integrated. No inter-stage filtering is needed. The orthogonal LO signals are generatedby a divider-by-four for GSM850/900 band and a divider-by-two for the DCS1800/PCS1900 band.Down conversion to baseband domain is performed by low/high band quadrature direct downconversion mixers. The baseband chain contains a LNB (low noise buffer), channel filter, output bufferand DC-offset compensation. The 3rd order low pass filter is fully integrated and provides sufficientsuppression of blocking signals as well as adjacent channel interferers and avoids anti-aliasingthrough the baseband ADC. The receive path is fully differential to suppress on-chip interferences.Several gain steps are implemented to cope with the dynamic range of the input signals. Dependingon the baseband ADC dynamic range, single- or multiple gain step switching schemes are applicable.Furthermore an automatic DC-offset compensation can be used (depending on the gain setting) toreduce the DC-offset at baseband-output. A programmable gain correction can be applied to correctfor front end- and receiver gain tolerances.

Figure 35 Receiver part block diagram


3.21. Transmitter part

The GMSK transmitter supports power class 4 for GSM850 and GSM900 as well as power class 1 forDCS1800 and PCS1900. The digital transmitter architecture is based on a very low power fractional-NSigma-Delta synthesizer without any external components (see Figure39). The analog I/Q modulationdata from the baseband is converted to digital, filtered and transformed to polar coordinates. Thephase/frequency signal is further on processed by the Sigma-Delta modulation loop. The output of itsassociated VCO is divided by four or two, respectively, and connected via an output buffer to theappropriate single ended output pin. This configuration ensures minimum noise level. The 8PSKtransmitter supports power class E2 for GSM850 and GSM900 as well as for DCS1800 and PCS1900.The digital transmitter architecture is based on a polar modulation architecture, where the analogmodulation data (rectangular I/Q coordinates) is converted to digital data stream and is subsequentlytransformed to polar coordinates by means of a CORDIC algorithm. The resulting amplitudeinformation is fed into a digital multiplier for power ramping and level control. The ready processedamplitude signal is applied to a DAC followed by a low pass filter which reconstructs the analogamplitude information. The phase signal from the CORDIC is applied to the Sigma-Delta fractional-Nmodulation loop. The divided output of its associated VCO is fed to a highly linear amplitudemodulator, recombining amplitude and phase information. The output of the amplitude modulator isconnected to a single ended output RF PGA for digitally setting the wanted transmit power. The PAinterface of SMARTi-PM supports direct control of standard dual mode power amplifiers (PA’s) whichusually have a power control input VAPC and an optional bias

3. TECHNICAL BRIEF

- 62 -

Figure 36 Transmitter part block diagram


3. TECHNICAL BRIEF

- 63 -

control pin VBIAS for efficiency enhancement. In GMSK mode, the PA is in saturated high efficiencymode and is controlled via its VAPC pin directly by the baseband ramping DAC. In this way both up- /down-ramping and output power level are set. In 8PSK mode, the ramping functionality is assured byan on-chip ramping generator, whereas output power is controlled by the PGA’s as described above.

3.22. RF synthesizer

The transceiver contains a fractional-N sigma-delta synthesizer for the frequency synthesis in the RXoperation mode. For TX operation mode the fractional-N sigma-delta synthesizer is used as Sigma-Delta modulation loop to process the phase/frequency signal. The 26MHz reference signal is providedby the internal crystal oscillator. This frequency serves as comparison frequency of the phase detectorand as clock frequency for all digital circuitry.The divider in the feedback path of the synthesizer iscarried out as a multi-modulus divider (MMD). The loop filter is fully integrated and the loop bandwidthis about 100 kHz to allow the transfer of the phase modulation. The loop bandwidth is automaticallyadjusted prior to each slot (OLGA2). To overcome the statistical spread of the loop filter element valuesan automatic loop filter adjustment (ALFA) is performed before each synthesizer startup. The fullyintegrated quad-band VCO is designed for the four GSM bands (850, 900, 1800, 1900 MHz) andoperates at double or four times transmit or receive frequency. To cover the wide frequency range theVCO is automatically aligned by a binary automatic band selection (BABS) before each synthesizerstartup.

3.23. TCXO

The transceiver contains a fully integrated 26MHz temperature compensated controlled crystaloscillator (DCXO) with three outputs for the system clock, one output for the GSM baseband and twoadditional for other subsystems (GPS, Bluetooth, etc.). The only external part of the oscillator is thecrystal itself. The overall pulling range of the TCXO consists of eight subranges. The subrange closestto the ‘0ppm’ at the middle AFC-value is selected during the calibration process in the mobile¢•sproduction and is used for the rest of the lifetime. The frequency tuning is performed along theselected subrange by programming the frequency control word (XO_TUNE) via the three wire bus(“3Wbus”).

- 64 -

3. TECHNICAL BRIEF

3.24. Front End Module control

Implemented in the Transceiver are two outputs for direct control of front end modules with two logicinput pins to select RX- and TX-mode as well as low- and high band operation.

3.25. Power Amplifier Module


100ohmR401

C40522p

10pC404

2V85_RF

C4071.2p

U401

NC7WV16P6X

A1

A2

GNDVCC

Y1

Y2

100ohmR402

100pC403

VC

1V

C2

13

3.3nHL406

9

GN

D2

11

GN

D3

16 18G

ND

4G

ND

519 20

GN

D6

GS

M18

00_1

900_

TX

12

GS

M18

00_R

X_O

UT

15

GS

M18

00_R

X_O

UT

26 7

GS

M19

00_R

X_O

UT

1G

SM

1900

_RX

_OU

T2

8 15G

SM

850_

900_

TX

1G

SM

850_

RX

_OU

T1

GS

M85

0_R

X_O

UT

22 3

GS

M90

0_R

X_O

UT

14

GS

M90

0_R

X_O

UT

2

14

LSHS-M085FEFL401

17ANT

10E

SD

GN

D1

R404

0

NAC406

L401100nH

1000pC401

KMS-512SW401

ANTG1

G2RFANT

G123

G2G3

4

CN401WFL-R-SMT10

C402100p

ANT_SW1

ANT_SW2

Figure 37 FEM schematic

Figure 38 PAM schematic

VSUPPLY

820p100pC431C430

NAC411 C412

NA

C42827p68u

C413

R4070

0R406

17

GND71819

GND8GND9

20

7GSM_IN

9GSM_OUT

1MODE

4RSVD1

12RSVD2

5VBATT

6VRAMP

2526

GND15

GND1636

GND1735

GND1834

GND1933

14GND2

GND2032

GND213130

GND22GND23

2928

GND2427

GND25

13GND3

11GND4

10GND5

GND6

3BS

2DCS_PCS_IN

16DCS_PCS_OUT

8EN

15GND1

GND1021

GND1122

GND1223

GND1324

GND14

U402SKY77340

R405 1.2K

100pC414C429

100pC4271u

C415100p

0.5pC409

100pC408

C410NA

C4260.1u

PA_BAND

PA_LEVEL

MODE

TXON_PA

HBAND_PAM_IN

LBAND_PAM_IN

VBIAS


4. PCB layout

- 65 -

4. PCB layout

4.1 Main & Sub PCB component placement

Figure 39 Main PCB top

Figure 40 Main PCB top placement


4. PCB layout

- 66 -

Figure 41 Main PCB bottom

Figure 42 Main PCB bottom placement


4. PCB layout

- 67 -

Figure 43 KEY FPCB top

Figure 44 KEY FPCB placement


4. PCB layout

- 68 -

Figure 45 KEY FPCB bottom

Figure 46 KEY FPCB bottom placement


4. PCB layout

- 69 -

Battery contact

PMIC

Memory

BBP

Mobile SWAntenna feeding

Power inductor

Sleep crystal

Charging block

RF PAM

FEMRF transceiver

26MHzMain clock

SIM/T-Flashsocket

Audio Amp

KEY FPCB

connector

18Pin connector

BlueTooth

Back Up Battery

Cameraconnector

OVP block

Audio/AF LDO


4. PCB layout

- 70 -

Key lightLED

Microphone

AF trig /Shutter

LCD FPCBconnector

Flash LED

LCD Backlightblock

Mainconnector

Volumedown

MP3

Volume up


4. PCB layout

- 71 -

LCDconne ctor

Slide key LED

Hall IC

KEY FPCBconne ctor

VibratorPAD

SPKPAD

- 72 -

5. Trouble shooting

5.1 Trouble shooting test setup

Power on all of test equipment- Connect PIF-UNION JIG or dummy battery to the DUT for power up.- Connect mobile switch cable between Communication test set and DUT when you need to make a

phone call.-Follow trouble shooting procedure

5.2 Power on Trouble

Check Points-Battery Voltage( Need to over 3.35V)-Power-On Key detection (PWRON signal)-Outputs of LDOs from PMIC

5. Trouble shooting


4.000V 0. 0000A

Figure 51 Equipment setup

- 73 -

5. Trouble shooting


C3260.1u

6 NO

2V

CC

U305 NLAST4599DFT2G

5COM

GN

D3 1

IN

NC4

R329100K

VBAT

PWRON

RPWRON

END_KEY

470

R331

100pC344

C3410.1u

R1114D281D-TR-FU308

CE6

2GND1

5GND2

4NC

VDD1 3

VOUT

VBAT

100KR334

0.1uC345

RPWRON_EN

RPWRON

R311 10K2SC5585 2

3

1

Q301

100KR310

END_KEY

KP_IN(5)

KP_OUT(1)

End key

_RESET

- 74 -

5. Trouble shooting


(1608)

(1608)

(1608)


(1608)(1608)(1608)

connecto GND to PIN7 / PIN8 (1608)

C224

VBAT

2.2u

FB201

470KR207

C2412.2u

C2060.1u

2.2uC217

R211100K

3V1_USB

10uC229

220K

R204

C2342.2u

VCHG

C2212.2u2.2u

C218

VBAT

2V65_BT

C24068u

2.2uC220

2.2uC244

2.2uC245

10uC226

2V72_IO

C2282.2u

C2422.2u

C22710u

VCHG

2.2uC219

VBAT

82KR210

C2050.1u

D201SDB1040

2V7_VCXO

2V85_CARD

C215 C2162.2u2.2u

2V11_RTC

C2080.1u

VBAT

R205

22K

R2210.15

C2330.1u

C23010u

C222 0.1u

2V85_SIM

2.2uC223

C235

VBAT

VBAT

4.7u

2V85_IO2

2.2uC243

1V5_DSP

2.2uC225

1V8_MEM 1V5_RF

2V85_RF

10uHL201

VS

IM1

18

VS

IM2

19

VSSAU27

VSSFB8

VSSPW7

33VSSR

10VUPU

11VUSB

30VDDAU

17V

DD

B

46V

DD

C

43V

DD

CH

5VDDPW

VD

DR

F39

13V

IB

21V

INT

VLB

B1

45

VLB

B2

47

20V

MM

C40

VR

F1

38V

RF

2V

RF

337

3VRFC

42V

RT

C

16LE

D

LRF

3EN

22

ON4

48R

ES

ET

Q

SC

L23 24

SD

A

SLE

D1

15S

LED

214

SW6

VANA34

2VBATS

VBUS12

44V

CH

C

VCHS1

VCXOEN3635

VDDA

U203PMB6812

AUIN2526

AUIP

28AUONAUOP

29

31BYP

FB9

49G

ND

INT

OU

T41

IREF32

C2322.2u

0.1uC207

G

SQ201

D1 D2 D3 D4

SI3457BDV

1V5_CORE

2V65_ANA

C2312.2u VCH_CTL

VCHS

USB_PU


VBUS_USB

VCH_CTL

VCHS VCXO_EN

SPOWER_INT

KE

Y_B

AC

KLI

GH

T

BT

_VC

XO

_EN

PWRON

_PMRST

SC

LS

DA

SLE

D1

628 628 36.6 34.3 32.2 30.2 28.1 26.2 26.2 23.7 24.2 20 Delay

time(msec)

VRF1

VRFC

VUSB

VMMC VSIM2

VSIM1

VANAVINTVLBB1

SW(SDBB)

VLBB2

VRF2 LDO NAME

2V85_RF

1V5_RF

3V1_USB

2V85_CARD

2V85_IO2

2V85_SIM

2V65_ANA

2V72_IO

1V5_DSP

1V5_CORE

1V8_MEM

2V7_VCXO

SM-POWER LDOS

ON (PWRON)

Delay time SM-P LDOs


5. Trouble shooting

- 75 -

START

Check the RPWRON,

replace U305

Check solder U303 or replace it

Check solder U203 or replace it

Check solder X401, U403

or replace it

Yes

Yes

Yes

Yes

Yes

No

No

No

No"PWRON"

signal

"_RESET" signal

Check the all LDO's output

Is the 26MHz clock From

Replace main PCB

Connect power supply to the DUT Vbat = over 3.35V

- 76 -

5. Trouble shooting

5.3 Charging trouble

Check Points-Connection of TA (check TA voltage 4.8V)-Charging Current Path component voltage drop-Battery voltage• Charging method : CC-CV • Switch-off voltage : 3.35V• Charger detect voltage : about 4.0V • Charging temperature ADC range• Charging time : 3h under - ~ -20°C : small charging operation.• Charging current : 500mA - -20°C ~ 60°C : charging.• Cutoff current : 100mA - 60°C ~ : not charging operation small • Low battery alarm charging operation.

-. Idle : 3.62V-. Dedicated : 3.50V


3.69V~3.62V 4.2V~3.86V 3.85V~3.75V 3.75V~3.69V

VBAT

R211100K

C24068u

VCHG

D201SDB1040

R2210.15

C2354.7uG

SQ201

D1 D2 D3 D4

SI3457BDV

VCH_CTL

VCHS

- 77 -

5. Trouble shooting


START

18pin MMI(CN303)

Source pin of Q201=

Drain pin of Q201 =

D201 voltage drop

Resolder the CN303

Battery voltage is over 3.4V?

Charge is operating

The TA can be broken Change other TA

then retest

Check solder Q201 or replace it

Replace it

Waiting until battery Voltage goes up to 3.4V

Yes

Yes

Yes

Yes

Yes

No

No

No

No

No

Battery thermistor

Change the Battery retest

No

Yes

- 78 -

5. Trouble shooting

5.4 LCD display trouble

Check Points-LCD assembly status ( FPCB)-Connector combination


47pC505L501 270nH

7

70

89

5556575859

6

60616263646566676869

40414243444546474849

5

5051525354

26272829

3

303132333435 36

373839

4

111213141516171819

2

202122232425

CN5011

10

270nHL502

VBAT

1uC508

15pC504

1uC507

2V72_IO

L_D(6)

L_D(5)

L_D(4)

L_D(3)

L_D(2)

L_D(1)

L_D(0)L_D(0:7)

KP_OUT(3)

KP_OUT(2)

KP_OUT(1)

KP_OUT(0:4)

LCD_VSYNCSLED1

SCROLL_KEY_BSCROLL_KEY_A

END_KEY

SLIDE_KEY_BACKLIGHT

KP_OUT(4)

LCD_BACKLIGHT

SCROLL_ENHALL_EN

L_CDL_WR

L_CS

LCD_ID

MOTOR_N

DIF_RESET

KEY_BACKLIGHT

L_D(7)

SPK_RCV_P

KP_IN(0)

KP_IN(1)

KP_IN(2)

KP_IN(3)

KP_IN(4)

KP_IN(5)

KP_OUT(0)

VMICNVMICP

SPK_RCV_N

FLASH_ENLCD_IF_MODE

KP_IN(0:5)

MIC1_N

MIC1_P

LCD connector

70pin FPCB connector

At first check the LCD back light enable signal

- 79 -

5. Trouble shooting


START

Is LCD FPCBnormal?

Assemble

Replace LCD module

Yes

No

Check LCD connector combination then LCD test

with New LCD

Is LCD connector OK?

Replace LCD connector

Yes

No

- 80 -

5. Trouble shooting

5.5 Camera Trouble

Check Points-Connectors combination-EMI filter soldering


R301NA

272829

3

3031323334

456789

1314151617 18

19

2

20212223242526

CN301G1 G2

G3 G4

1

101112

FB301

2V85_IO2

2

IN33

IN44

IN556

IN67

IN7IN8

8

16OUT1

15OUT2

14OUT3OUT4

13

OUT51211

OUT6OUT7

109

OUT8

PG

ND

17

CM1431-08 FL3011

IN1IN2

2V8_AF

1V8_MEM

2.2uC314

2V85_IO2

0R306

13

OUT51211

OUT6OUT7

109

OUT8P

GN

D17

1IN1IN2

2

IN33

IN44

IN556

IN6IN7

7

IN88

16OUT1

15OUT2

14OUT3OUT4

FL304

C3050.1u

C3150.1u

100pC301

0.1uC313

0.1uC304

CIF_PCLKCIF_RESET

SDASCL

CIF_D(4)

CIF_D(5)

CIF_D(6)

CIF_D(7)

CIF_D(0:7)CIF_D4CIF_D5CIF_D6CIF_D7

FLA

SH

_EN

CIF_D5CIF_D4

CIF_D(0:7)

CIF_PD

CIF_D6CIF_D7

CIF_VSCIF_HS

CIF_MCLK

CIF_D(0)

CIF_D(1)

CIF_D(2)

CIF_D(3)

Check the connector combination

Check signal flow via EMI filter

- 81 -

5. Trouble shooting


START

Replace New Camera

Assemble

Resolder

Yes

Yes

No

No

Check camera connector, 34pin main PCB connector combination then Camera test with equipped camera module

Replace Camera module

Yes

Replace Main PCB

FL301, FL304 are soldered well?

- 82 -

5. Trouble shooting

5.6 Receiver & Speaker trouble

Check Points-Speaker wire-Audio amp soldering


R233 100K

C264 100u

0.1uC256

3V3_AUDIO

C2600.068u

C268 220n

R238 0

C269 1u0.068uC270

220nC262

R2374.7K

4.7KR243

15

MONO-17

MONO_IN+23

MONO_IN-22

PG

ND

25

19RHP3D1

24RHP3D2

8RIN

ROUT5

11SCL

10SDA

VD

D1

3 16V

DD

2

2VOC

LM4946SQXU207

CB

YP

AS

S21

4G

ND

1

GN

D2

12 20G

ND

3

14I2CSPI_SEL

I2CSPI_VDD7

ID_ENB13

LHP

3D1

18 1LH

P3D

2

LIN

9 6LO

UT

MONO+

C2551u

470nC267

2V72_IO

100uC266

R241 0

0.1uC263

BBP_SND_R

BBP_SND_L

HS_OUT_L

SPK_P

SPK_N

HS_OUT_R

SCL

SDA

L302 100nH

C30727p

C30615p

C3021u

100nHL301

15pC303

VMICP

VMICN

MIC1_N

MIC1_P

SPK_RCV_P

SPK_RCV_N

Check signal flow via Inductor

L301, L302

Check the SPK wire and soldering

Check Audio amp, In output

signal

- 83 -

5. Trouble shooting


START

L301, L302 have low resistance?

Between L301, L302 and Speaker contact

Assemble

Yes

Check Speaker wire

U207 is working properly?

Yes

Replace Main PCB

Yes

Resolder orReplace SPK

module

No

No

No Replace LCD FPCB then retest

Resolder orReplace it

- 84 -

5. Trouble shooting

5.7 Microphone trouble

Check Points-Microphone hole-Mic. Bias & signal come from


MICROPHONE

R505 220

C50347p

1KR504

C50233p

220

12

R503

MIC501OSF213-42DC

VA502ESD9X5.0ST5G

1KR5071u

R506NA

C506

C50115p

ESD9X5.0ST5GVA501

VMICN

MIC1_P

VMICP

MIC1_N

Mic. bias


5. Trouble shooting

- 85 -

START

Make a phone call then R503 Mic. Bias come

from BBP?

Assemble

Check mic. Bias line

Repair the damaged part

Yes

No

No

Check microphone sound hole

Signal comes out from Microphone

Replace microphone

Yes

No

70pin connector combination

is good?


5.8 Vibrator trouble

Check Points- Vibrator contact- IC is working correct

5. Trouble shooting

- 86 -

R314

10

L303

100nHR315100K

0.1uC322

R313

1K

U302SUY98005LT1G

2 GND

VIN1

3VOUT

VIBRATOR_ENMOTOR_N

Check the driver IC Enable signal goes to high then vibration

Check the wire and soldering


5. Trouble shooting

- 87 -

START

Pin1 of U302 is high ?

Pin3 of U302 is low?

Assemble

Check U302 or replace it

Check U302 or replace it

Yes

No

No

Check Vibrator wire and soldering

Replace Vibrator

Yes


5.9 Keypad back light trouble

Check Points-Signal path is connected well-Control IC is working properly

5. Trouble shooting

- 88 -

LD501 LEWWS44-E

LEWWS44-ELD502100ohmR502

R501 100ohm

VBAT

KEY_BACKLIGHT

Check R501,502 resistor


5. Trouble shooting

- 89 -

START

R181ís voltages goes down

70pin connector combination

Assemble

Check U203ís pin17 or replace it

Repair the damaged

part

Yes

No

No

Check All of LEDs solder

Replace Sub PCB

Yes


5.10 Micro SD and SIM card trouble

Check Points-Power control FET is working-Socket soldering-Proper SIM is used-Card detect is working

5. Trouble shooting

- 90 -

27pC236

2V85_SIM

100KR212R213100K

2V72_IO

22pC251

47R22311

10SWASWB

9

45

56

67

78

8

C1

C1

C2

C2

C3

C3

C5

C5

C6

C6

C7

C7

GND11615

GND214

GND3GND4

1312

GND5GND6

CN202

112

23

34

1uFC252

R217100K

C2501000p

D1 6

3 D2

G12 5G2

1 S1

S2 4

2V85_CARD

NTJD4105CT1G

Q203

100KR219

27p

D

G

S

C239Q202SI1305-E3

100KR216R215

100K 100KR218

4.7KR214

C237NA

C2381u

TF_PWR_EN

SIM

_RS

T

SIM

_CLK

SIM

_IO

_SIM

_EN


TF_CLK

TF_DAT0TF_DAT1

TF_DETECT


5. Trouble shooting

- 91 -

7 6 5

3 2 1

Pin 1,6 / 2V85_SIM

Pin 3 / SIM_CLK

Check soldering all pin of socket

TF_DETECT


5. Trouble shooting

- 92 -

START

6 pins are soldered well?

Q202 is working?

Assemble

Repair it

Replace the damaged

part

Yes

No

No

Check All of SIM card voltageKE820/KG99 support 1.8V & 3V SIM only

10 pins are soldered well?

Q203 is working?

Repair it

Replace the damaged

part

Yes

No

No

SIM connector OK

Yes


5. Trouble shooting

- 93 -

5.11 RF PART TROUBLESHOOTING

5.11.1 RF Components

SW401

U402

X401 U403 FL401

REFERENCE PART Description

U402 PAM (Power Ampilifier Module)

X401 VCTCXO (26MHz)

FL401 FEM (Front End Module)

U403 Transceiver

SW401 Mobile Switch


5.11.2 Trouble Shooting of Receiver Part

5. Trouble shooting

- 94 -

Checking Flow

START

Check point VCTCXO

Check point PLL Control

Setup Test Equipment Cell Power : -7 4dBm

EGSM CH30 DCS CH699

Check point Mobile SW &FEM

Re-Download S/W & CAL

Check point RX I/Q Signal


5. Trouble shooting

- 95 -

5.11.3 Checking VCTCXO Circuit

Checking Points Checking Flow

Pin : 2.7V

Pin 3: 26MHz

X401

Is the waveform of Pin3 similar to

Is the waveform of Pin4 similar to

Replace X401

Checking U203(PMIC)

Yes

No

No

Yes

VCTCXO Circuit is OK.See next page to check

PLL Circuit.

VCTCXO Circuit Diagram Waveform

R420620

GND2

3OUT

VCC4

VCONT1

26MHz

X401

2V7_VCXO

1uFC444

0R419

C44222p NA

C443AFC

Pin 4

Pin 3


5.11.4 Checking PLL Control signals

5. Trouble shooting

- 96 -

Checking Points Checking Flow

EN Signal is OK ?

DA(Data) is Normal?

Check U403

Yes

No

No

Yes

Control Signal is OK.See next page to check

Mobile SW & FEM.

CLK(Clock) is Normal?

No

Yes

Check U403

Check U403 R416 (RF_EN)

R426 (RF_CLK)

R423 (RF_DATA)

U403

RF Transceiver Circuit Diagram Waveform

(PIN21) (PIN20)

0.

VD

DLN

A1V

5

VDDMIX2V839

VDDRX1V51920

VDDRX2V8VDDTX1V535


17

VDDXO2V815

XO

11 12X

OX41

29R

X1

RX

1X30 27

RX

2R

X2X

28

RX

32425

RX

3X

RX

42223

RX

4X

36TX1TX2

37

34VBIAS

VCO_RC18

31V

DD

BIA

S2V

8

8V

DD

DIG

1V5

VD

DD

IG2V

85

21

PMB6272

A1 2

AX

B3 4

BX

CLK

76D

A

16EN

FE

132

FE233

14FSYS1

10F

SY

S2

FS

YS

39

13GND1

GN

D2

26

40GND3

GND4

U403

0.1u

820R411

C440100p

1000pC441

u46

R422

0

R423

0

47nC436

0.1u

BT_CLK

RF_CLK

RF_DA

RF_EN

RF_CLK

RF_DATA


5. Trouble shooting

- 97 -

5.11.5 Checking Mobile SW & FEM

Mobile SW & FEM Circuit Diagram

RX Mode EGSM DCS PCS

ANT_SW1 Off Off Off

ANT_SW2 On Off Off

Checking Points

FL401

SW401

C40522p

10pC404

C4071.2p

VC

1V

C2

13

3.3nHL406

9

GN

D2

11

GN

D3

16 18G

ND

4G

ND

519 20

GN

D6

GS

M18

00_1

900_

TX

12

GS

M18

00_R

X_O

UT

15

GS

M18

00_R

X_O

UT

26 7

GS

M19

00_R

X_O

UT

1G

SM

1900

_RX

_OU

T2

8 15G

SM

850_

900_

TX

1G

SM

850_

RX

_OU

T1

GS

M85

0_R

X_O

UT

22 3

GS

M90

0_R

X_O

UT

14

GS

M90

0_R

X_O

UT

2

14

LSHS-M085FEFL401

17ANT

10E

SD

GN

D1

R404

0

NAC406

L401100nHKMS-512

SW401

ANTG1

G2RFANT

G123

G2G3

4

CN401WFL-R-SMT10


5. Trouble shooting

- 98 -

Checking Flow

Check Pin 1, 2 of SW401with RF Cable

Signal is OK ? Replace Mobile SW

(SW401)

Yes

No

Yes

Mobile SW & FEM is OK.See next page to check I/Q

Signals.

Check PMB8876 (U102)Control Signal is OK?

No

Yes

Check Pin 20, 21, 22 of FL308?

Replace FEM (FL308) Pin 16, 17 or 14, 15

No

Yes

EGSM RX

ANT SW

ANT SW2

ANT SW


5. Trouble shooting

- 99 -

5.11.6 Checking RX I/Q Signals

Checking Flow

R427

0

R425

0

C450NA

NA

NAC449

C447

0

R426

R422

0

0

R424

R423

0

C448NA

QX

Q

IX

I

RF_CLK

RF_DA

Check RX I/Q Signals

Signals are Normal ?

Replace Transceiver

PMB6272(U403)

Yes

No

RX Part is OK.Check Base Band Circuit

or Re-Download S/W and Cal

Checking Points

Q Q

I I RX

I

Q

I

Q


5.11.7 Shooting of Transmitter Part

5.11.8 VCTCXO CircuitSee RX Part “1. Checking VCTCXO Circuit”

5.11.9 Checking PLL Control SignalSee RX Part “2. Checking PLL Control Signal”

5. Trouble shooting

- 100 -

Checking Flow Checking Points

Check point VCTCXO

Check point PLL Control

Setup Test Equipment Cell Power : - 74dBm

EGSM CH30 DCS CH699

Check point TX I/Q Signal

Re-Download S/W & RF CAL

Check point Transceiver

Check point PAM Control

Check FEM & Mobile

1

2

3

4

5

6

1

2

3

4

56

6


5. Trouble shooting

- 101 -

5.11.10 Checking TX I/Q Signals

Checking Flow

R427

0

R425

0

C450NA

NA

NAC449

C447

0

R426

R422

0

0

R424

R423

0

C448NA

QX

Q

IX

I

RF_CLK

RF_DA

Check TX I/Q Signals


Yes

TX Part is OK. Check Base Band Circuit

or Re-Download S/W and Cal

Checking Points

I

Q

I

Q

TX

Q Q

I I

U403

- 102 -

5. Trouble shooting

5.11.11 Checking Transceiver Output Signals


Checking Points

R413NA

VD

DLN

A1V

5

VDDMIX2V839

VDDRX1VDDRX2VDDTX1V5

35

38VDDTX2V8 VDDVCO2

VDDXO2

XO

11 12X

OX41

29R

X1

RX

1X30 27

RX

2R

X2X

28

RX

32425

RX

3X

RX

42223

RX

4X

36TX1TX2

37

34VBIAS

VCO_

31V

DD

BIA

S2V

8

8V

DD

DIG

1V5

VD

DD

IG2V

85

21

PMB6272

A1 2

AX

B3 4

BX

CLK

76D

A

FE

132

FE233

FSY

10F

SY

S2

FS

YS

39

GN

GN

D2

26

40GND3

GND4

U403

R41510

R410

0

NAR412

0

R409

NAR417

0.1uC439

R418NA

0.1uC438


VBIAS

LBAND PAM IN

HBAND PAM IN (DCS/PCS)

U402

MODE Transceiver Output

GMSK Fixed

8PSK Ramp Burst Control

- 103 -

5. Trouble shooting


Checking Flow

Check Output Signal


Replace PMB6272(U402)

Yes

N

Transceiver is OK.See next page to check

PAM Control Circuit.

- 104 -

5. Trouble shooting

5.11.12 Checking PAM Control Signals


VSUPPLY

820p100pC431C430C428

27p68uC413

0R406

17

GND71819

GND8GND9

20

7GSM_IN

9GSM_OUT

1MODE

4RSVD1

12RSVD2

5VBATT

6VRAMP

2526

GND15

GND1636

GND1735

GND1834

GND1933

14GND2

GND2032

GND213130

GND22GND23

2928

GND2427

GND25

13GND3

11GND4

10GND5

GND6

3BS

2DCS_PCS_IN

16DCS_PCS_OUT

8EN

15GND1

GND1021

GND1122

GND1223

GND1324

GND14

U402SKY77340

R405 1.2K

100pC414C429

100pC4271u

C415100p

C4260.1u

PA_BAND

PA_LEVEL

MODE

TXON_PA

HBAND_PAM_IN

LBAND_PAM_IN

VBIAS

Checking Points

MODE

PA LEVEL

TXON PA

MODE MODE PA_LEVEL TXON_PA

GMSK LOW Ramp Burst Control HIGH

8PSK HIGH Control Amp bias HIGH

- 105 -

5. Trouble shooting


Checking Flow

Check Control Signals


Check PMB8876(U102)

Yes

N

PAM Control Signal is OK.

See next page to check FEM & Mobile SW Circuit

- 106 -

5. Trouble shooting

5.11.13 Checking FEM & Mobile SW

Mobile SW & FEM Circuit Diagram


C40522p

10pC404

C4071.2p

VC

1V

C2

13

3.3nHL406

9

GN

D2

11

GN

D3

16 18G

ND

4G

ND

519 20

GN

D6

GS

M18

00_1

900_

TX

12

GS

M18

00_R

X_O

UT

15

GS

M18

00_R

X_O

UT

26 7

GS

M19

00_R

X_O

UT

1G

SM

1900

_RX

_OU

T2

8 15G

SM

850_

900_

TX

1G

SM

850_

RX

_OU

T1

GS

M85

0_R

X_O

UT

22 3

GS

M90

0_R

X_O

UT

14

GS

M90

0_R

X_O

UT

2

14

LSHS-M085FEFL401

17ANT

10E

SD

GN

D1

R404

0

NAC406

L401100nHKMS-512

SW401

ANTG1

G2RFANT

G123

G2G3

4

CN401WFL-R-SMT10

Checking Points

FL401

SW401

TX Mode EGSM DCS PCS

ANT_SW1 On Off Off

ANT_SW2 Off On On

- 107 -

5. Trouble shooting


Checking Flow

Check Pin 1, 2 of SW401with RF Cable

Signal is OK ? Replace Mobile SW (SW401)

Yes

No

Yes

Mobile SW & FEM is OK. Check Antenna.

Check PMB8876 (U102) Control Signal is OK?

No

Yes

Check Pin 20, 21, 22 of FL308?

Replace FEM (FL308) Pin 16, 17 or 14, 15

No

Yes

EGSM TX

ANT SW

ANT SW2

ANT SW


6.1 S/W download setup

Preparation• Target terminal• PIF-Union• RS-232 Cable and PIF-UNION to Phone interface Cable• Power Supply or Battery• IBM compatible PC supporting RS-232 with Windows 98 or newer.

If you are going to use battery, the voltage of the battery should be over 3.7V for stable powersupplying during S/W download.

6. Download & S/W upgrade

- 108 -


4.000V 0.0000A

Saisie

- 109 -


6.2 Download program user guide

Execute Flashtool program, then below window will be appeared. Click the OK button



- 110 -


When the application is started first time the following screen appears.Each section is described in the text below.

Click the check box to enable or disable file download.Click on the blue text to select the file to download.This will open a normal file select box. Select the wanted file.


- 111 -


Click on the blue text to select the COM port.

- 112 -


Click on the blue text to select the Baud rate.Click OK button to next step.


- 113 -


Will change the window as below

Click to anywhere on the control panel to start download.Can see the “Reset the phone/module” then remote power on the target phone


- 114 -


During download, the screen will look something like this:

The blue bar shows the download progress. The FLS filename and the expected checksum areshown. The download statistics are shown. Click “Reset” to reset the counters.

After download, the status is shown.


- 115 -


If there is a need to stop the download process, click on the panel for the channel to be stopped.To stop the download the panel must be clicked twice.This is to avoid that the download is stopped accidentally.Furthermore, to avoid that the download is stopped on a mouse double-click, there must be at least0.5 second between the two clicks.If the panel is clicked only once, the text “Click again to stop” will disappear and the download willcontinue.

If a valid second click is detected, the download process is stopped and the progress bar turns yellow.At this point the download can be started from the beginning as usually.

NOTE: That the download statistic is unaffected when the download is stopped manually.


- 116 -



- 117 -

VBATPWRURXDUTXD

3G 2.5G

GNDRXTXUFLSON_SW

1.23

MFG ENGR CHK:

4

VBR

F

5 12

Drawing Number:

G.C.LIM

NA

3

NA

USB

M

1G 256M 1

LG Electronics

REV:

(Infineon S-GOLD2)

DIGD

DIGA

Engineer:

RTC

1

DIGB

DOC CTRL CHK:

2

NOR SDRAM DIEPF38F5070M0Y0B0

Do not assemble CN101, It is only for debugging purpose

6

EUSY0319301

DIGD

2 10

G

PLL

NA

G

1

NA

DIGC2

B.Y.YANG

0 ohm512M 256M 1

B

KP

_OU

T(5

)-N

A

9

BB

Time Changed:

H

0 ohm

R&D CHK:

DIGD

D

EUSY0328701

F

QA CHK:

BASE BAND PROCESSOR

DIGC1

8

MMC

11

0 ohm

RT

C

4

F

NA

2

9

B

Drawn by:

7

BB

1

DIGA

DIGD

4

E

DIGC1~2

F

A

PF38F6070M0Y0BE Capulet1G 256M 2EUSY0302101

Size:

Date Changed:

12

EBU

SIM

DIGC1~2

D

C

10

Sibley

DIG

A

DIGC2

11

RTC

H

INTEL MEMORY

A

C

ETM

DIGD

(U18 U17 T15 : Voice)

E

DIGA

DIGC1

5

Changed by:

DIGD

1/4

KE/ME970 MAIN

A3

12 1 8 A

DIGD

Maker P/NNA

8

0 ohmNA

7

TITLE:

ON BOARD ARM9 JTAG & ETM INTERFACEDIGA

0 ohm

6

1

Page:

3

2 3

4

PF38F5570MMY0B0

mentor 2006-10-25

OJ103

1V5_CORE

TP104

2V85_CARD

$V1KR114

15pC140

C1121u

C131 220n

R118 24

2V85_SIM

0.1u

C124

C1100.1u

C106

0.1u0.1u

TP103

C101

C1091u

R123 1K

R122 1K

15pC132

OJ102

22KR119

OJ104

TP115

0.1u

2V72_IO

C125

10KR112

K4

D5_ADV

H7_OE

_WEE2

10nC111

S_VCC

J2VCCQ1VCCQ2

J3

VCCQ3J7

VCCQ4J8

VSS1C2

VSS10K6K7

VSS11VSS12

K8

C3VSS2VSS3

C4

VSS4C6C7

VSS5VSS6

C8

VSS7K2K3

VSS8VSS9

F2__CEH3

F3__CEF4__CE_A27

E6K5

F_CLK

F_DPDB6

F_VPPJ1

F_WAITJ9G7

F__RST

F__WP1E1

F__WP2F1

N_ALED8

N_CLEE5

H1N_RY__BY

N__RE_S__CS1F6H2

N__WE_S_CS2

G1RFU

D2

D_DM0_S__LBD_DM1_S__UB

H8

M3D_LDQSD_UDQS

M7

C5D_VCC1D_VCC2

D3

D_VCC3D7

D__CASF3

D__CLKH5

D__RASF4

H6D__WE

F1_VCC1D4

F1_VCC2J4

F1__CEG3

F2_VCC1D6

F2_VCC2J6

G2

DQ2L2

DQ3DQ4

M4

DQ5L3

DQ6L4

DQ7L5M5

DQ8L6

DQ9

DU1A1

DU2A9M1

DU3M9

DU4

G4D_BA0D_BA1

H4

D_CKEG6

D_CLKJ5

H9

A4A5

B3A3

A6A4

A7A8

G8

A9F8

F2D1__CS

E3D2__CS

DQ0M2

DQ1L1

DQ10M6

DQ11L7L8

DQ12K9

DQ13DQ14

L9

DQ15M8

K1

A13D9

A14A15

C9B9

A16B4

A17B5

A18A19

A5

B1A2

F7A20

E7A21

B7A22A23

A6

A24A7A8

A25A26

B8

A3B2A2

PF38F6070M0Y0BEU101

D1A0A1

C1

A10E8

A11G9F9

A12E9

L103100nH

4.7

R101

1V8_MEM

R108 NA

OJ101

1V8_MEM

C128

270nH

0.1u

L101

100K

TP114

R115

C135

1V8_MEM

10n

0.1u

C118

C122

1V8_MEM

2V72_IO

C103

0.1u

0.1u

390KR104

TP105

0.1u

C134

192021222324

G1 G2

G3 G4

3456789

16

252627282930

1718

CN101

1

101112131415

2

TP107

C1260.1u

100KR105

TP106

C119

1u

VSSVBR_2P17

VSSVBTR16

VS

S_D

SP

MA

IN1

J8

VS

S_D

SP

MA

IN2

J9 J10

VS

S_D

SP

MA

IN3

J11

VS

S_D

SP

MA

IN4

VS

S_D

SP

MA

IN5

L8

VS

S_D

SP

MA

IN6

L9 L10

VS

S_D

SP

MA

IN7

L11

VS

S_D

SP

MA

IN8

VS

S_P

LL_R

TC

T12

R12

VS

S_U

SB

VSUPPLY

VM

ICP

L16

P16VREFN

L17VREFP

VSSBBL15

N19VSSBG

U16VSSD

V15VSSM

VS

SP

_DIG

1J1

5E

13V

SS

P_D

IG2

E10

VS

SP

_DIG

3V

SS

P_D

IG4

E8

J5V

SS

P_E

BU

1V

SS

P_E

BU

2M

5

VS

SP

_EB

U3

R8

P5

VS

SP

_ET

M

T17VSSVBR_1

U18VDDVBR_1VDDVBR_2

R17

T15VDDVBT

VD

D_D

SP

1H

9H

10V

DD

_DS

P2

H11

VD

D_D

SP

3

M9

VD

D_M

AIN

1V

DD

_MA

IN2

M10

VD

D_M

AIN

3K

8K

9V

DD

_MA

IN4

K10

VD

D_M

AIN

5V

DD

_MA

IN6

K11

VD

D_P

LLW

12W

13V

DD

_RT

C

W11

VD

D_U

SB

K16

VM

ICN

VCXO_ENK19

M15VDDBB

VDDBGK17

VDDDT14

VDDMV14

VD

DP

_DIG

AG

19

VD

DP

_DIG

BA

9

A15

VD

DP

_DIG

C1

B19

VD

DP

_DIG

C2

VD

DP

_DIG

DB

1

VD

DP

_EB

U1

J1

VD

DP

_EB

U2

W2

W7

VD

DP

_EB

U3

W10

VD

DP

_ET

M

VD

DP

_MM

CA

13

L19

VD

DP

_SIM

T_OUT7D14A18

T_OUT8T_OUT9

C14

G3

US

AR

T0_

CT

S_N

US

AR

T0_

RT

S_N

H4

US

AR

T0_

RX

DG

1G

4U

SA

RT

0_T

XD

F15

US

AR

T1_

CT

S_N

US

AR

T1_

RT

S_N

E19

US

AR

T1_

RX

DF

17G

18U

SA

RT

1_T

XD

USB_DMINUSV11U11

USB_DPLUS

US

IF_R

XD

_MR

ST

B7

D9

US

IF_S

CLK

US

IF_T

XD

_MT

SR

A7

TRACEPKT5V10R10

TRACEPKT6TRACEPKT7

T11

U8TRACESYNC

TRIG_INE14

TRST_NC19

T_OUT0B17B16

T_OUT1

A16T_OUT10T_OUT11

C13D17

T_OUT12

T_OUT2B15D13

T_OUT3T_OUT4

B14C18

T_OUT5T_OUT6

D15

RS

TO

UT

_NF

18

D18RTCK

RTC_OUTV12

SS

C1_

MR

ST

J17

K18

SS

C1_

MT

SR

H15

SS

C1_

SC

LK

E16TCK

TDID19E17

TDO

F16TMS

TRACECLKV8

R9TRACEPKT0TRACEPKT1

W9T10

TRACEPKT2TRACEPKT3

V9U10

TRACEPKT4

L5N

C8

H5

NC

9

V13OSC32K

L12PAOUT1APAOUT1B

M11K12

PAOUT2APAOUT2B

J12

T9PIPESTAT0PIPESTAT1

U9

PIPESTAT2W8

PM

_IN

TT

13

RESET_NU14

B18RF_CLK

C16RF_DATA

C17RF_STR0RF_STR1

A17

MIC

P2

N18

MMCI_CLKC11

MMCI_CMDE12

MMCI_DAT0C12D12

MMCI_DAT1MMCI_DAT2

B12

MMCI_DAT3A12

B13MON1MON2

A14

NC

1W

19

NC

2W

14W

1N

C3

A19

NC

4N

C5

A1

U15

NC

6R

11N

C7

KP

_IN

5E

2E

1K

P_I

N6

KP

_OU

T0

D3

KP

_OU

T1

F4

KP

_OU

T2

C2

C1

KP

_OU

T3

M0U17W17

M1

M10W18

M2W16W15

M7V16

M8V17

M9

MIC

N1

M18

P19

MIC

N2

M17

MIC

P1

G15

I2S

1_T

XE

18I2

S1_

WA

0

I2S

2WA

0J1

9

I2S

2WA

1H

16

I2S

2_C

LK0

J18

I2S

2_C

LK1

H17

H19

I2S

2_R

XH

18I2

S2_

TX

B2IRDA_RXIRDA_TX

A2

IREFM16

D2

KP

_IN

0K

P_I

N1

D1

D5

KP

_IN

2F

5K

P_I

N3

KP

_IN

4E

3

EP

P11

R19

T19

EP

P12

EP

PA

11T

18R

18E

PP

A12

V18

EP

PA

2V

19E

PR

EF

1E

PR

EF

2U

19U12

F26M

F32KU13

FCDP_RB_NG2

K15GUARD

C3

I2C

_SC

LE

4I2

C_S

DA

F19

I2S

1_C

LK0

I2S

1_C

LK1

G16

I2S

1_R

XG

17

V3EBU_BFCLKI

EBU_BFCLKOR3

EBU_CAS_NM4

EBU_CKET3

P4EBU_CS0_NEBU_CS1_N

V1T2

EBU_CS2_NP3

EBU_CS3_N

M2EBU_RAS_N

EBU_RD_NN3

EBU_SDCLK1U4

EBU_SDCLKOU3

EBU_WAIT_NT6U1

EBU_WR_N

P18

EP

N11

N17

EP

N12

EBU_AD11W6T8

EBU_AD12EBU_AD13

U7V7

EBU_AD14EBU_AD15

R7

EBU_AD2W3T5

EBU_AD3EBU_AD4

R6U5

EBU_AD5EBU_AD6

W4

EBU_AD7W5

EBU_AD8U6

EBU_AD9V5

T7EBU_ADV_N

M3EBU_BC0_NEBU_BC1_N

P2

EBU_A2J4

EBU_A20N5T1

EBU_A21EBU_A22

R2U2

EBU_A23V2

EBU_A24

J2EBU_A3

J3EBU_A4EBU_A5

K1K2

EBU_A6K3

EBU_A7K5

EBU_A8EBU_A9

L2

EBU_AD0V4R4

EBU_AD1

V6EBU_AD10

F3

DS

P_I

N0

DS

P_I

N1

G5

DS

P_O

UT

0F

1

F2

DS

P_O

UT

1

EBU_A0H2H3

EBU_A1

L1EBU_A10EBU_A11

M1N1

EBU_A12EBU_A13

K4L4

EBU_A14P1

EBU_A15EBU_A16

L3R1

EBU_A17EBU_A18

N2N4

EBU_A19

DIF

_CS

1A

4E

6D

IF_C

S2

DIF

_D0

A6

C7

DIF

_D1

B6

DIF

_D2

DIF

_D3

D8

DIF

_D4

E7

A5

DIF

_D5

D7

DIF

_D6

DIF

_D7

C6

B4

DIF

_HD

DIF

_RD

C5

D6

DIF

_RE

SE

T1

DIF

_RE

SE

T2

C4

B3

DIF

_VD

A3

DIF

_WR

E11

CIF

_D0

B11

CIF

_D1

CIF

_D2

C10

CIF

_D3

A11

D11

CIF

_D4

B10

CIF

_D5

CIF

_D6

A10

CIF

_D7

B9

A8

CIF

_HS

YN

C

C9

CIF

_PC

LK

CIF

_PD

B8

C8

CIF

_RE

SE

T

CIF

_VS

YN

CD

10

CLK

OU

TE

9

CLKOUT0H1

DIF

_CD

B5

AFCC15

AGNDN16

BB_IR13

BB_IXR14

P15BB_Q

N15BB_QX

CC_CLKJ16

L18CC_IO

M19CC_RST

R110 24

PMB8876U103

0.1u

0.1u

C127

C104

15pC133

C121

10n

0.1u

C136

C117

TP113

0.1u

C114

TP111

10n

22KR102

NA

R12

0

L104100nH

0.1uC113

VBAT

1V8_MEM

UART

12CTS

10DSR

1GND

4NC1

NC278

NC3

NC49

ON_SW5

RTS11

2RX

TX3

6

R107 NA

R106 0

3.3KR116

C1150.1u

C13915p

C108

1V5_DSP

0.1u

3.3KR103

1V8_MEM

C102

0.1u

C116

1V8_MEM

1u

1KR113

TP116

1V8_MEM

R109 24

R1210

TP101

2V65_ANA

C107

1V5_DSP

0.1u

22nC137

TP112

TP108

TP110

GND

C1

A1

B1C2

A2VCC

2V72_IO

SN74AUC1G08YZPRU102

C120

0.1u 0.1u

C123

24R117

L102270nH

2V11_RTC

TP102

C13822n

R111 0

C1290.1u

C105

0.1u

3V1_USB2V72_IO

TP109

32.768KHz12

1V5_CORE

0.1u

X101

_ADV

KP_OUT(4)

C130

_FLASH2_CS

_FLASH1_CS

_1G_CS

_FLASH1_CS

_1G_CS_FLASH1_CS

_FLASH2_CS

A(14)A(13)

_CAS_RAS

CKE

SC

RO

LL_E

N

CIF

_D(6

)C

IF_D

(5)

CIF

_D(4

)C

IF_D

(3)

CIF

_D(2

)C

IF_D

(1)

CIF

_D(0

)

SIM_RST

SIM_IO

SIM_CLK

QXQ

IXI

AFC

DIF

_D(4

)D

IF_D

(3)

DIF

_D(2

)D

IF_D

(1)

DIF

_D(0

)

LCD

_IF

_MO

DE

DIF

_CS

DIF

_CD

SLIDE_OPEN

CIF

_MC

LKC

IF_V

S

CIF

_RE

SE

TC

IF_P

D

CIF

_PC

LKC

IF_H

S

CIF

_D(7

)

A(13)A(12)A(11)A(10)

A(1)A(0)

SC

RO

LL_K

EY

_B

SC

RO

LL_K

EY

_A_S

IM_E

N

_BT

_RE

SE

T

DIF

_WR

LCD

_VS

YN

C

RE

MO

TE

_IN

TD

IF_R

ES

ET

HO

OK

_DE

TE

CT

_US

B_C

HG

_EN

DIF

_D(7

)D

IF_D

(6)

DIF

_D(5

)

D(5)D(4)D(3)D(2)

D(15)D(14)D(13)D(12)D(11)D(10)

D(1)D(0)

A(9)A(8)A(7)A(6)A(5)A(4)A(3)

A(24)A(23)A(22)A(21)A(20)

A(2)

A(19)A(18)A(17)A(16)A(15)A(14)

26MHZ_MCLK

BB

P_S

ND

_R

BB

P_S

ND

_L

RC

V_P

RC

V_N

_WR_WAIT

SDCLKI

_RD

_RAS

_FLASH2_CS_RAM_CS_FLASH1_CS

CKE

_CAS

BFCLKI

_BC1_BC0

_ADV

D(9)D(8)D(7)D(6)

RPWRONSPK_RCV_SEL

HA

LL_E

N

SLI

DE

_KE

Y_B

AC

KLI

GH

TT

F_P

WR

_EN

I2S

1_W

AI2

S1_

TX

I2S

1_R

XF

LAS

H_E

NI2

S1_

CLK

SD

AS

CL

FCDP

I_MONITOR

JACK_TYPE

REMOTE_ADC

RF_TEMPBATT_TEMP

KP

_OU

T(3

)K

P_O

UT

(2)

KP

_OU

T(1

)K

P_O

UT

(0)

KP

_IN

(5)

KP

_IN

(4)

KP

_IN

(3)

KP

_IN

(2)

KP

_IN

(1)

KP

_IN

(0)

RF_CLK

_RESET

PM

_IN

T

PIPESTAT2PIPESTAT1PIPESTAT0

PA_LEVEL

MON2MON1

TF_DAT3TF_DAT2TF_DAT1TF_DAT0

TF_CMDTF_CLK

TXON_PA

_TRST

TRIG_IN

TRACESYNC

TRACEPKT(7)

TRACEPKT(6)

TRACEPKT(5)

TRACEPKT(4)

TRACEPKT(3)

TRACEPKT(2)

TRACEPKT(1)

TRACEPKT(0)

TRACECLK

TMS

TDOTDI

TCK

F_D

PD

CLK

32K

RTC_OUT

RTCK

TR

IG_O

UT

TF_DETECTRF_EN

RF_DA

TX

_DE

BU

GR

X_D

EB

UG

HS

O_S

EL

AU

DIO

_AM

P_E

N

TX

D_0

RX

D_0

RT

S_0

CT

S_0

LCD_BACKLIGHTJACK_DETECT

MODE

ANT_SW2ANT_SW1PA_BAND

AF_PWR_EN

LCD_ID

VIBRATOR_EN

VCXO_EN

US

IF_T

XD

_US

B_E

OC

US

IF_R

XD

USB_DPUSB_DM

MIC

2_N

VCXO_EN

VM

ICP

VM

ICN

TRACEPKT(2)

TRACEPKT(3)

TRIG_OUT

_TRSTTDI

TMSTCK

RTCKTDO

_EXTRSTTRIG_IN

TRACEPKT(7)

TRACEPKT(0:7)

_BC0_BC1

BFCLKI

SDCLKI

_RESET

A(0:24) D(0:15)

TRACEPKT(4)

TRACEPKT(5)

TRACEPKT(6)

TRACECLK

TRACESYNCPIPESTAT0PIPESTAT1PIPESTAT2

TRACEPKT(0)

TRACEPKT(1)

D(5)D(6)D(7)D(8)D(9)

SDCLKOBFCLKO

F_DPD

_WAIT

_RAM_CS

_WR

_RD

A(5)A(6)A(7)A(8)A(9)

D(0)D(1)

D(10)D(11)D(12)D(13)D(14)D(15)

D(2)D(3)D(4)

A(12)A(13)A(14)A(15)A(16)A(17)A(18)A(19)

A(2)

A(20)A(21)A(22)A(23)A(24)

A(3)A(4)

RTS_0DSR

TXD_0

VSUPPLY

D(0:15)

DIF_D(0:7)

CIF_D(0:7)

DS

R

TRACEPKT(0:7)

A(0:24)

A(0)A(1)

A(10)A(11)

MIC

1_N

MIC

1_P

MIC

2_P

SDCLKO

BFCLKO

CTS_0

RPWRON_EN

RXD_0

7. CIRCUIT DIAGRAM


- 118 -

GND

IN

OUT

3

C (1608)

(1608)

Page:

F

USB CHARGING CIRCUIT WITH INDICATE LED

LG Electronics

CTS_0

4 5 11

JACK_DETECT VBUS_USB MULTI_PORT_0 MULTI_PORT_1

Pin7

Time Changed:

H SPK_P SPK_N

RTS_0

MULTI_PORT_2 MULTI_PORT_3

L HS_OUT_L

SPK_RCV_P SPK_RCV_N

52 6

(1608)

H

L RCV_P RCV_N

F

Drawn by:

G

3

B

Pin7

119

9

Drawing Number:

Pin6

Engineer:

G.C.LIM

0 0 REMOTE_INT REMOTE_ADC

REV:

(F)

Pin

6

8

MICRO SD & SIM HYBRID SOCKET


H

Pin

6

1 0 TXD_0 RXD_0

E

(1608)(1608)

12

Pin7

(F)

AUDIO AMP SUB SYSTEM

D

Pin7

2

Pin6

H

A

B.Y.YANG

Pin7 G

(1608)

10

C

Size:

12

1.26 7

7

TITLE:

MULTI-PORT SWITCH 2

D

R&D CHK:

DOC CTRL CHK:

1

HS_OUT_R

SPK_RCV_SEL

2/4

KE/ME970 MAIN 12 1 8 A

A3

(PMIC, AUDIO, etc.)

B

Changed by: Date Changed:

8

A

E

MFG ENGR CHK:

BATTERY CURRENT MONITOR

0/1 1 USB_DP USB_DM

4

1

AUDIO/AF LDO connecto GND to PIN7 / PIN8

Pin6

360mA

50mA

QA CHK:

10

(1608)

MULTI-PORT SWITCH 1HSO_SEL

C224

2006-10-25mentor

VBAT

2.2u

FB201

R233 100K

470K

VBAT

R207

C2412.2u

C2060.1u

2.2uC217

C258

3V3_AUDIO

VBAT

27p

C2481u

C264 100u

8BAT

5GND

IMIN6

IREF7

9PGND

VIN1

3_CHG

_EN4

2_PPR

R211100K

ISL6294U202

3V1_USB

NO411

14V

+

2V72_IO

27pC236

BG

ND

17 16C

OM

1

4COM2

8C

OM

3

12COM4

6G

ND

2IN1_2

IN3_410

1NC1

NC

25

9NC3

NC

413

NO

115

NO23

7N

O3

10R240

DG2018DN_T1_E4U206

27pC254

24R228

100KR222

R209

C2570.1u

33K

10uC229

C246

2V85_SIM

2V72_IO

1u

7NC2

2NO1

10NO2

1VCC

0.1uC256

U205

NLAS5223BMNR2G

COM13

COM29

6GND

4IN1

8IN2

NC15

220K

R204 1KR202

100KR212

C2342.2u

R213100K

2V72_IO

VCHG

C2212.2u2.2u

C218

3V3_AUDIO

VSUPPLY

VBAT

2V65_BT

C24068u

22pC251

10K

2.2u

R236

C202

2.2uC220

C2600.068u

47R223

2.2uC244

2.2uC245

10uC226

2V72_IO

3V3_AUDIO2V72_IO

C2282.2u

IOUT3

5LOAD NC

1

4VIN

C268 220n

2V8_AF

ZXCT1010E5TA

U201

2GND

C2422.2u

R242 10

C22710u

VBAT

11

10SWASWB

9

45

56

67

78

8

C1

C1

C2

C2

C3

C3

C5

C5

C6

C6

C7

C7

GND11615

GND214

GND3GND4

1312

GND5GND6

VCHG

CN202

112

23

34

2.2uC219

1uFC252

VBAT

82KR210

C2050.1u

R238 0

D201SDB1040

2V7_VCXO

C269 1u

2V85_CARD

C215 C2162.2u2.2u

0.068uC270

C271100p

47KR2302V85_IO2

2V11_RTC

R217100K

C2080.1u

C21147p

220nC262

VBAT

R205

22K

R2210.15

R232 24

100K

1uC249

VBAT

R220

C2330.1u

C23010u

C2471000p

1VCC

100R235

NLAS5223BMNR2G

U208

COM13

COM29

GND

64IN1

8IN2

NC15 7

NC2

2NO1

10NO2

C222 0.1u

1.5KR239

C250

2V85_SIM

R22910K

1000p

2.2uC223

C235

R2374.7K

VBAT

VBAT

4.7u

D2

123

4.7KR243

10p

CN201D1

27pC209

2V85_IO2

C210

D1 6

3 D2

G12 5G2

1 S1

S2 4

R225

2V85_CARD

NTJD4105CT1G

Q203

10K

100R224

2.2uC243

10K

R227 47

R234

1V5_DSP

100KR219

2.2u

C265

C225

1V8_MEM 1V5_RF

100p

1uC214

1uC213

C253 100p

100pC261

15

MONO-17

MONO_IN+23

MONO_IN-22

PG

ND

25

19RHP3D1

24RHP3D2

8RIN

ROUT5

11SCL

10SDA

VD

D1

3 16V

DD

2

2VOC

2V85_IO2

LM4946SQXU207

CB

YP

AS

S21

4G

ND

1

GN

D2

12 20G

ND

3

14I2CSPI_SEL

I2CSPI_VDD7

ID_ENB13

LHP

3D1

18 1LH

P3D

2

LIN

9 6LO

UT

MONO+

2V85_RF

B

C

E

10uHL201

RN1307Q204

47R226

27p

D

G

S

C239Q202SI1305-E3

C204100p

R208

R2062.2K

220K

VS

IM1

18

VS

IM2

19

VSSAU27

VSSFB8

VSSPW7

33VSSR

10VUPU

11VUSB

30VDDAU

17V

DD

B

46V

DD

C

43V

DD

CH

5VDDPW

VD

DR

F39

13V

IB

21V

INT

VLB

B1

45

VLB

B2

47

20V

MM

C40

VR

F1

38V

RF

2V

RF

337

3VRFC

42V

RT

C

16LE

D

LRF

3EN

22

ON4

48R

ES

ET

Q

SC

L23 24

SD

A

SLE

D1

15S

LED

214

SW6

VANA34

2VBATS

VBUS12

44V

CH

C

VCHS1

VCXOEN3635

VDDA

U203PMB6812

AUIN2526

AUIP

28AUONAUOP

29

31BYP

FB9

49G

ND

INT

OU

T41

IREF32

R203

2EN1

3EN2

6GND

NC15

NC27

8NC3

PGND11

VIN1

10VO1

VO29

47mohm

ISL9014IRJNZU204

CBYP4

C2551u

470nC267

100KR216R215

100K

100p

C201

C259

0.1u

C2322.2u

0.1uC207

2V72_IO

100uC266

G

S

2.2uC203

Q201

D1 D2 D3 D4

VBAT

SI3457BDV

10KR201

C2121u

VA201

100KR218

4.7KR214

10KR231

R241 0

0.1u

1V5_CORE

2V65_ANA

C263

C237NAC231

2.2u

100K

R244

C2381u

HS_OUT_R

CTS_0

_USB_EOC

REMOTE_INT

TXD_0

JACK_DETECT

HSO_SEL

SPK_RCV_SEL

SPK_N

RCV_P

RCV_N

HS_OUT_L

TF_PWR_EN

SIM

_RS

T

SIM

_CLK

SIM

_IO

_SIM

_EN

AUDIO_AMP_EN


TF_CLK

TF_DAT0TF_DAT1

TF_DETECT

VBUS_USB

_USB_CHG_EN

MULTI_PORT_3

MULTI_PORT_2RTS_0

SPK_P

SPK_RCV_P

SPK_RCV_N

BBP_SND_R

BBP_SND_L

VCH_CTL

VCHSAF_PWR_EN

HS_OUT_L

SPK_P

SPK_N

HS_OUT_R

SCL

SDA

USB_PU


VBUS_USB

VCH_CTL

VCHS VCXO_EN

USB_PU

SPOWER_INT

KE

Y_B

AC

KLI

GH

T

BT

_VC

XO

_EN

PWRON

_PMRST

SC

LS

DA

SLE

D1

BATT_TEMPI_MONITOR

MULTI_PORT_0

MULTI_PORT_1

REMOTE_ADC

USB_DPUSB_DM

RXD_0

VBUS_USB

7. CIRCUIT DIAGRAM


- 119 -

100ohm/15pF/15KV

REMOTE POWER ON

108

4

VIBRATOR

A

11

(AXK870145YG PLUG)

BLUETOOTH

BACK UP BATTERY 2V 0.5mAh

MAIN PCB & SUB PCB INTERFACE CONNECTOR

2

1 93 11

G

1.2Date Changed:

Drawn by:

1

HALL EFFECT S/W

Page:

H

G

C

F

E

Changed by:

7 8

12

2M AF CAMERA I/F CONNECTOR

F

Drawing Number:

2

EXTERNAL RESET

5

B.Y.YANG

5

A3

12 1 8 A

3

G.C.LIMLG Electronics

E

AND GATE

QA CHK:

D

A

MFG ENGR CHK:

TITLE:

B

Size:

(BT, External connector, etc.)

Time Changed:

H

7 9

12

REV:

10

C


6

R&D CHK:

DOC CTRL CHK:

6

Engineer:

4

B

D

mentor 2006-10-25 3/4

KE/ME970 MAIN

L302 100nH

NC

32

OU

T

1V

DD

VS

S4

BAT301

EM-0781-T5U301

0.1u

6IN6

7IN7IN8

8

16OUT1

15OUT2

14OUT3OUT4

13

OUT51211

OUT6OUT7

109

OUT8

PG

ND

17

C316

FL303

1IN1IN2

2

IN33

IN44

IN55

C340

1V8_MEM

R314

10

1000p

C347100p

1000pC312

C308

18p

10n

R304 100

C307

C339

27p

100KR308

78

IN8

OUT116

OUT215

OUT31413

OUT412

OUT5OUT6

1110

OUT7OUT8

9

17P

GN

D

CM1431-08FL302

IN112

IN23

IN3IN4

45

IN5IN6

6

IN7

0.1uC319

470

R331

15

OUT31413

OUT412

OUT5OUT6

1110

OUT7OUT8

9

17P

GN

D

FL305

IN112

IN23

IN34

IN45

IN5IN6

6

IN77

IN88

OUT116

OUT2

R301NA

NAR3320.1uC335

NAR336

L305 1.2nH

R322220K

10K

R32

4

1MR320

L303

100nH

C33122n

G1

5

G2

10

INOUT_A11

2INOUT_A2

INOUT_A33

4INOUT_A4

9INOUT_B1

INOUT_B28

7INOUT_B3

INOUT_B46


R32

7N

A

C306

VBAT

15p

R315100K

272829

3

3031323334

456789

1314151617 18

19

2

20212223242526

CN301G1 G2

G3 G4

1

101112

R333

100p0 C344

C3260.1u

6 NO

2V

CC

R3231.5K

U305 NLAST4599DFT2G

5COM

GN

D3 1

IN

NC4

PG

ND

FB301

2V85_IO2

12

IN23

IN34

IN45

IN5IN6

6

IN778

IN8

16OUT1OUT2

15

OUT31413

OUT412

OUT5OUT6

1110

OUT7OUT8

9

17

VCC

VIN+3

4 VIN-

2V85_IO2

FL306

IN1


GND

2

1OUT

5

2

IN33

IN44

IN556

IN67

IN7IN8

8

16OUT1

15OUT2

14OUT3OUT4

13

OUT51211

OUT6OUT7

109

OUT8

PG

ND

17

5G

16

G2

1UB

CM1431-08 FL3011

IN1IN2

DBF71B601FL308

3B1

4B2

DC2

VA

302PAD302

R307 100K

NAR317

2V72_IO

47

R321

1000pC309

10K

R32

5

C3021u

H9

VDD_1A8B3

VDD_2

D4

VS

S1

VS

S2

D5

D6

VS

S3

VS

S4

E6

F6

VS

S5

VSSRF1F4E5

VSSRF2VSSRF3

F5

VSSRF4E4

F2VSSVCO

B2WAKEUP_BT_P1_7

WAKEUP_HOST_P1_8B1

UA

RT

CT

SU

AR

TR

TS

J8 J7U

AR

TR

XD

UA

RT

TX

DH

8

J6VCOCAP1

H6VCOCAP2

VDDC1F9B5

VDDC2

D2VDDCREG

E9

VD

DP

CM

VDDPLLH1

G2VDDPMREG

H4VDDRFVDDRFREG1

E1E2

VDDRFREG2

F1VDDSUP

VD

DU

AR

T

J4J5R

FIO

X

RFOUTH5

RTCKB9

SCL0_P0_13C9

SLEEPX_P0_15F8

TCKB7

TDIA7B6

TDO

B4TMS

A6TRST_

TX

A1

J3 H3

TX

A2

TX

AX

J2

TX

_CO

NF

_P0_

14H

7

TX_CONF_RXONA2

G8

JTAG_

H2

LOA

D

NC

1A

1A

9N

C2

J1N

C3

NC

4J9

C1

P1_

6

PAONA4

PC

MC

LKD

9D

8P

CM

FR

1

C8PCMFR2_SDA0_P0_12

PC

MIN

G9

E8

PC

MO

UT

A3PSEL0PSEL1

B8

D1RESET_

RF

IO

C329

PMB8753U307

C2CLK32_P1_5

G1

CLK

IN_X

TA

L

A5

22n

2V8_AF

VA

304

27pC332

1V8_MEM

C327

0.1u

27p

C322

C3180.1u

R32

647

K

C341

1V8_MEM

0.1u

100nHL301

1KR330

R313

1K

R311 10K

2.2uC314

2V85_IO2

FB

303

VA

303

100pC328

0.1uC338

0R306

U302SUY98005LT1G

2 GND

VIN1

3VOUT

13

OUT51211

OUT6OUT7

109

OUT8

PG

ND

17

2V65_BT 1V5_CORE

1IN1IN2

2

IN33

IN44

IN556

IN6IN7

7

IN88

16OUT1

15OUT2

14OUT3OUT4

FL304

C3050.1u

C325

R1114D281D-TR-FU308

CE6

2GND1

5GND2

4NC

VDD1 3

VOUT

100p

C3370.1u

2V11_RTC

VA

306

0.1uC320

R302

VBALUN

VBALUN

C323

100K

0.1u

0.1uC346

C3240.1u

0.1uC334

2.2KR328

100KR309

C3150.1u

R329100K

R316 NA

19

2

20

3456789

CN303

1

101112131415161718

33uC342

2p

2SC5585 2

3

1

C343

Q301

VBATR337 1K

0.1u

PAD301

C310

10u

2V65_ANA

FB

304

C333

100KR310

C3170.1u

100K

R319

NAR318

8GATE

GATE_OUT9

2GND

IN11

IN24

5IN3

NC11112

NC2

6OUT1

OUT27

10_EN

_FLAG3

VCHG

7

70

89

U304 NCP348MTR2G

5556575859

6

60616263646566676869

40414243444546474849

5

5051525354

26272829

3

303132333435 36

373839

4

111213141516171819

2

202122232425

CN3021

10

100KR312

100KR334

NA

VSUPPLY

0.1uC345

R335

10pC330

15pC303

FB

302

2V72_IO

NC7WZ08L8X

7 A1

3A2

6 B12B2

GND4

VCC 81Y1

Y25

U303

0.1uC321

100pC301

220R303220R305

VBAT

MSMF05C-PD301

VA301ICVL0505600V150FR

0.1uC313

0.1uC304

VBUS_USBVA

305

1000pC311

L304 1.2nH

R338NA

VBACKUP

C3491000p

2.2uC348

C336

2V72_IO

2V72_IO

2V72_IO

0.1u

KP_IN(2)

KP_IN(1)

KP_IN(0:5)


KP_OUT(4)

KP_IN(0)

KP_IN(5)

KP_OUT(0)

KP_OUT(1)

KP_OUT(2)

FLASH_EN

HALL_EN

DIF_D(7)

DIF_D(6)

DIF_D(5)

DIF_D(4)

DIF_D(3)

DIF_D(2)

DIF_D(1)

DIF_D(0)DIF_D(0:7)

KP_OUT(3)

KP_OUT(0:5)KP_IN(4)

KP_IN(3)

RPWRON_EN

SLED1END_KEY

LCD_VSYNCSLIDE_KEY_BACKLIGHT

LCD_IF_MODE

SCROLL_EN

CIF_PCLKCIF_RESET

SDASCL

CIF_D(4)

CIF_D(5)

CIF_D(6)

CIF_D(7)

CIF_D(0:7)

SLIDE_OPEN

RPWRON

PM_INTSPOWER_INT_RESET

PWRON

RPWRON

END_KEY

VIBRATOR_ENMOTOR_N

DIF_RESETLCD_ID

DIF_CSDIF_CDDIF_WR

END_KEY

KP_IN(5)

KP_OUT(1)

LCD_BACKLIGHT

_EXTRST

_PMRST

KEY_BACKLIGHT

VMICP

MOTOR_N

VMICN

MIC1_N

MIC1_P

SPK_RCV_P

SPK_RCV_N

CIF_D4CIF_D5CIF_D6CIF_D7

FLA

SH

_EN

CIF_D5CIF_D4

CIF_D(0:7)

CIF_PD

CIF_D6CIF_D7

CIF_VSCIF_HS

CIF_MCLK

CIF_D(0)

CIF_D(1)

CIF_D(2)

CIF_D(3)


RPWRON_ENDSR

MIC2_N

MIC2_P

TX_DEBUGRX_DEBUG

HOOK_DETECT


US

IF_T

XD

US

IF_R

XD

CLK32K

BT_CLK

I2S

1_C

LKI2

S1_

WA

I2S

1_T

XI2

S1_

RX

_BT_RESET

BT_VCXO_EN

7. CIRCUIT DIAGRAM


- 120 -

12

E

B.Y.YANG

Engineer:

R&D CHK:

DOC CTRL CHK:

F

9

L

5

L

(RF)

8

REV: Drawing Number:

E

L

GSM850

DCS_PCS TX

10

F

DCS1800

4

GSM850_EGSM TX

Date Changed: Time Changed:

L

PIN 14

D

7

8

GSM900

(PIN21)

L

Size:

63

B

C

L

1

21

C

PCS1900

5

B

D

G

A

9 1 0 112

4

H

VC1

L

L

G

H

Page:

Drawn by:

1.2

L

PIN 13

H

TITLE:

LG ElectronicsH.T.LEE

VC2

L

2006-10-25mentor4/4

KE/ME970 MAIN 12 1 8 A

A3

7

QA CHK:Changed by:

MFG ENGR CHK:

3

PCS1900 RX

H

(PIN20)

GSM850 RX

DCS1800 RX

EGSM900 RX

6

11 12

A

R413NA

C423C4221.2p1.2p

C4340.1u

C4182.2p

R427

0

VSUPPLY

L403

18nH

C4450.1u

820p100pC431C430

VD

DLN

A1V

5

VDDMIX2V839

VDDRX1V51920

VDDRX2V8VDDTX1V535


17

VDDXO2V815

XO

11 12X

OX

NAC411

41

29R

X1

RX

1X30 27

RX

2R

X2X

28

RX

32425

RX

3X

RX

42223

RX

4X

36TX1TX2

37

34VBIAS

VCO_RC18

31V

DD

BIA

S2V

8

8V

DD

DIG

1V5

VD

DD

IG2V

85

21

PMB6272

A1 2

AX

B3 4

BX

CLK

76D

A

16EN

FE

132

FE233

14FSYS1

10F

SY

S2

FS

YS

39

13GND1

GN

D2

26

40GND3

GND4

U403

100ohmR401

R41510

R410

0

R425

0.1u

0

C425

C412NA

C4320.1u

C42827p

R4160

R420620

5.6nH

L405

820

68u

R411

C440

C413

GND2

3OUT

VCC4

VCONT1

100p

R407

26MHz

X401

0

0R406

0.1uC424

C450

1V5_CORE

NA

22KR414

NAR412

2V7_VCXO

C40522p

1uFC444

10p

17

GND71819

GND8GND9

20

7GSM_IN

9GSM_OUT

1MODE

4RSVD1

12RSVD2

5VBATT

6VRAMP

C404

2526

GND15

GND1636

GND1735

GND1834

GND1933

14GND2

GND2032

GND213130

GND22GND23

2928

GND2427

GND25

13GND3

11GND4

10GND5

GND6

3BS

2DCS_PCS_IN

16DCS_PCS_OUT

8EN

15GND1

GND1021

GND1122

GND1223

GND1324

GND14

NA

U402SKY77340

NAC449

C447

1000p

2V85_RF

2V85_RF

C441

2.5pC416

0

R409

C4071.2p

U401

NC7WV16P6X

A1

A2

GNDVCC

Y1

Y2

100ohmR402

100pC403

VC

1V

C2

13

3.3nHL406

9

GN

D2

11

GN

D3

16 18G

ND

4G

ND

519 20

GN

D6

GS

M18

00_1

900_

TX

12

GS

M18

00_R

X_O

UT

15

GS

M18

00_R

X_O

UT

26 7

GS

M19

00_R

X_O

UT

1G

SM

1900

_RX

_OU

T2

8 15G

SM

850_

900_

TX

1G

SM

850_

RX

_OU

T1

GS

M85

0_R

X_O

UT

22 3

GS

M90

0_R

X_O

UT

14

GS

M90

0_R

X_O

UT

2

14

LSHS-M085FEFL401

17ANT

10E

SD

GN

D1

1V5_RF

0

R426

0.1u

R421

10

C446

0.1u

PT401 10K

C435

R422

0

R404

0

R405 1.2K

1.5p

2V85_RF

C420

1000p

C437

100p

NA

C414

NAR417

C406

C429

L401100nH

1000p

100p

C401

5.6nH

L404

0

R424

C4271u

C415

2V85_RF

100p

2V85_RF

0.5pC409

0.1uC439

1V5_RF

0R419

R423

0

KMS-512SW401

ANTG1

G2RF

C4172.5p

C4211.5p

C442

2V7_VCXO

100pC408

ANT

G123

G2G3

4

22p

CN401WFL-R-SMT10

22nH

L402

R408

0

C410NA

47n

NAC443

C436

R418NA

C448NA

0.1uC433

C402100p

C4260.1u

0.1uC438

2.2pC419

ANT_SW1

ANT_SW2

PA_BAND

PA_LEVEL

MODE

TXON_PA

HBAND_PAM_IN

LBAND_PAM_IN

VBIAS


RF_TEMP

AFC

VBIAS

26MHZ_MCLK

QX

Q

IX

I

BT_CLK

RF_CLK

RF_DA

RF_EN

7. CIRCUIT DIAGRAM


- 121 -

C

G

10

SIDE KEY

6

Time Changed:

11

LCD BACKLIGHT / FLASH

E

B

KEY_BACKLIGHT_LED

MFG ENGR CHK:

2

A

DOC CTRL CHK:

2

12

(PLUG)

END

9

Size:

3

C

9

FPCB INTERFACE CONNECTOR

G

RIGHT

change to LEWWS44

A

E

1

M1 = 18.4mA

Changed by:

(SOCKET:AXK770145G)

6

REV:

F1 = 160mA

SLIDE_KEYLED_CONTROL

D

Drawing Number:

Drawn by:

Date Changed:

R&D CHK:

10

5

F F

B

KEY FPCB

MAIN PCB & SUB PCB INTERFACE CONNECTOR

MENU

AF

SHUTTERLEFT

1

11

3 7

LG Electronics

D

1.1

4

12

Page:

END

SERCH

7

QA CHK:

KEYPAD

OK

8

TITLE:

2006-11-10mentor 1/1

KE970/ME970

12 1 8 A

A3

4

8

H Engineer:

5

JASON

END KEY

MICROPHONE

H

G.C.Lim

R505 220

100nHL504

KB_SND

2.7KR508

EMX182

56

31

4

510

Q501

C503

47p

47p

89

G1G2

G3G4

C519

4243444546474849

55051525354

67

2829

3

30313233343536373839

4

4041

13141516171819

2

2021222324252627

CN502

1

101112

1KR504

503

47pC505

IN501

V_SCROLL_2.8

KB_STAR KB_BGM

C517

1u

10u

C511

C50233p

509

220

12

R503

LD501 LEWWS44-E

MIC501OSF213-42DC

L501 270nH7

70

89

502

5556575859

6

60616263646566676869

40414243444546474849

5

5051525354

26272829

3

303132333435 36

373839

4

111213141516171819

2

202122232425

CN5011

10

7500ohmR512

1PIN

REFBP6

7SETF

SETM8

F1109

F2

3GND

IN2

LDO145

LDO2

16M1M2

15

M31413

M4M5

1211

M6

OUT25

28P1P2

17

24PGNDBGND

29

22C1N

C1P23

C2N27

26C2P

ENF2118

ENLDO

20ENM1ENM2

19

MAX8645YU501

D50

1

MS

MF

05C

-P

R510

IN504

12ON/END

LEWWS44-ELD502

IN502

KB_SHA

IN503

501

VA502ESD9X5.0ST5G

LEWWH25LALD503

1KR507

270nHL502

2V72_IO VBAT

V_SCROLL_2.8

KB_UP505

VBAT

507

1uC508

1uC516

1u

506

C5131uC512

15pC504

1uC507

100ohmR502

R501 100ohm

KB_CAM

12R509

VBAT

KB_DOWN

1u

508

C514

1u

R506NA

C506

L503 100nH

2V72_IO

VA503

VBAT

C501

KB_CLR

5.1KR513

15p

VA504

R511 NA

ESD9X5.0ST5G

VBAT

VA501

C5150.01u

10uC509

L_D(6)

L_D(5)

L_D(4)

L_D(3)

L_D(2)

L_D(1)

L_D(0)L_D(0:7)

KP_OUT(3)

KP_OUT(2)

KP_OUT(1)

KP_OUT(0:4)

LCD_VSYNC

KP_IN(5)

KP_OUT(3)

KP_OUT(0:4)

KP_OUT(4)

504

SLED1


END_KEY

SLIDE_KEY_BACKLIGHT

KP_OUT(4)

LCD_BACKLIGHT

SCROLL_ENHALL_EN

L_CDL_WR

L_CS

LCD_ID

MOTOR_N

DIF_RESET

KEY_BACKLIGHT

L_D(7)

MOTOR_N

MLED_A

SPK_RCV_P

KP_IN(0)

KP_IN(1)

KP_IN(2)

KP_IN(3)

KP_IN(4)

KP_IN(5)

KP_OUT(0)

VMICNVMICP

SPK_RCV_N

FLASH_ENLCD_IF_MODE

SLIDE_LED

SLIDE_KEY_BACKLIGHT

SLIDE_LEDSLED1

FLASH_LED_C

MLED_C1MLED_C2MLED_C3MLED_C4

END_KEY

KEY_BACKLIGHT

MLED_C5

L_CSL_CDLCD_IF_MODEHALL_EN

MLED_A

MLED_A

LCD_VSYNC

KP_IN(4)

DIF_RESET

L_D(4)

L_D(7)

L_D(5)

SCROLL_KEY_BSCROLL_KEY_ALCD_ID

MLED_C5MLED_C4MLED_C3MLED_C2MLED_C1

L_WR

L_D(1)

L_D(2)

SPK_RCV_P

SPK_RCV_N

KP_IN(0:5)

KP_IN(0)

KP_IN(5)

KP_OUT(0)

KP_OUT(1)

KP_OUT(2)

KP_OUT(0:5)

KP_IN(0:5)

KP_OUT(0)

KP_OUT(1)

KP_OUT(2)

KP_IN(0)

KP_IN(1)

KP_IN(2)

KP_IN(3)

KP_IN(0:5)

MIC1_N

MIC1_P

L_D(0)

VMICN

MIC1_P

VMICP

FLASH_LED_C

FLASH_EN

LCD_BACKLIGHT

SCROLL_EN

MIC1_N

L_D(0:7)

L_D(6)

L_D(3)

7. CIRCUIT DIAGRAM


- 122 -

KEY_BACKLIGHT_LED

Size:

4

B

C

G.C.LIM

2

Changed by: REV:

C

2

E E

Time Changed:

TITLE:

JASON

SERCH

7

HALL EFFECT S/W(SCROLL)

Drawn by:

83

8

OK

Drawing Number:

6

LG Electronics

SCROLL_KEY

VIBRATOR

1 3

F

1.1

B

HEngineer:

D

7

11

QA CHK:

5

9

1

MFG ENGR CHK:

10

G

Date Changed:

KEY INTERFACE CONNECTOR

11

VISION MARK

6

G

10

R&D CHK:

LEFT

A

MENU

LCD_Connector

PRE_CHARGING_LED

H

54

D

LCD FPCB(LGIT/HITACHI)

SPEAKER

A

9

Page:

RIGHT

mentor 2006-10-15 1/1

KE970/ME970

A3

12 1 8 ADOC CTRL CHK:

F

12

12

VBAT

R602NA

LD601

2V72_IO

605

OUT601

2V72_IO

1uC603

604

OUT602

R601100K

C601

4O

UT

3P

DN

1V

DD

VS

S2

1u

U601EM-0611

D601

MSMF05C-P

NAC605

603

V_SCROLL_2.8

VBAT

TP601 TP602

R603 220

ICVL0505600V150FRVA602

ICVL0505600V150FR

602

VA601

C602

V_SCROLL_2.8

0.1u

5354

6789

G1G2

G3G4

OUT603

39

4

40414243444546474849

5505152

2425262728

29

3

303132333435363738

1

10111213141516171819

2

20212223

4O

UT

3P

DN

1V

DD

VS

S2

CN601

U602EM-0611

LD602SSC-TWH104-HL

OUT604

C604NA

3233

3435

45

67

89

2V72_IO

VBAT

1819

2

2021

2223

2425

2627

2829

3

3031

IMSA-9671S-35Y902

CN602

1

1011

1213

1415

1617

220R604

LCD_VSYNC

LCD_VSYNC

L_D(5)

L_D(7)

L_D(0)

601

SCROLL_KEY_A

SCROLL_KEY_A SCROLL_KEY_B

HALL_EN

SLIDE_LED

KP_OUT(1)

KP_OUT(0:5)

SLIDE_LED

MOTOR_N

MLED_A

MLED_C3MLED_C2MLED_C1

L_WRL_CSL_CDLCD_IF_MODEHALL_EN

L_CSL_CD

KP_OUT(2)

KP_OUT(1)

KP_OUT(0)

SCROLL_KEY_B

L_D(3)

L_D(4)

L_D(5)

L_D(6)

L_D(7)

KP_IN(0)

KP_IN(5)

KP_OUT(0)

KP_OUT(1)

KP_OUT(2)

SPK_RCV_PSPK_RCV_N

SCROLL_KEY_BSCROLL_KEY_ALCD_ID

MLED_C5MLED_C4

MLED_C1

L_D(0:7)

MOTOR_N

SPK_RCV_P

SPK_RCV_N

KP_IN(0:5)

KP_OUT(2)

KP_IN(5)

L_D(0:7)

L_D(2)

DIF_RESET

L_D(0)

L_D(1)

L_D(2)

KP_IN(0)

MLED_C2

DIF_RESETL_WR

LCD_ID

KP_OUT(0)

L_D(1)

L_D(3)

L_D(4)

L_D(6)

MLED_C4

MLED_A

LCD_IF_MODE

MLED_C5

MLED_C3

7. CIRCUIT DIAGRAM


- 123 -

8. PCB LAYOUT


- 124 -

8. PCB LAYOUT


- 125 -

8. PCB LAYOUT


- 126 -

8. PCB LAYOUT


- 127 -

8. PCB LAYOUT


- 128 -

8. PCB LAYOUT


9.1 Test Equipment Setup

9.2 Calibration Steps

9.2.1. Turn on the Phone.

9.2.2. Execute “HK_24.exe”

- 129 -

4.00 V 0.000 A

9. RF Calibration

9. RF Calibration


- 130 -

9. RF Calibration

9.2.3. Click “SETTING” Menu

9.2.4. Setup “Ezlooks” menu such as the following figure


- 131 -

9. RF Calibration

9.2.5. Setup “Line System” menu such as the following figure

9.2.6. Setup Logic operation such as the following figure.


Adjust the number of

PWR : Power Supply CELL :Call-Test Equipment

Operation Mode1. By-Pass: not control by GPIB 2. Normal : control by GPIB

Setup UART Port

- 132 -

9. RF Calibration

9.2.7. Select “MODEL”.

9.2.8. Click “START” for RF calibration

9.2.9. RF Calibration finishes.



10. Stand-alone Test

- 133 -

9.2.10. Calibration data will be saved to the following folder.

Saving format:

year/month/day_PASS

- 134 -


Notices:

1. The state of Phone is “ test mode “ during the CALIBRATION.

2. Calibration program automatically changes either “normal mode” or “ptest mode”.

3. RF Calibration steps as follow:

TX Channel compensation: EGSM->DCS->PCS->EDGE EGSM->EDGE DCS->EDGE PCS

RX Channel compensation: EGSM->DCS->PCS

4. Phone Operation Mode



10. Stand along

- 135 -

10. Stand along

10.1. Test Program Setting1 Set COM Port.

2 Check PC Baud rate.

3 Confirm EEPROM & Delta file prefix name.

4 Click “Update Info” for communicating Phone and Test -Program.

1 2

3

Not Connected

4

- 136 -

10. Stand along

5 For the purpose of the Standalone Test, Change the Phone to “ptest mode” and then Click the

“Reset” bar.

6 Select “Non signaling” in the Quick Bar menu. Then Standalone Test setup is finished.


Connected

Change "ptest mood"

5

6

- 137 -

10. Stand along

10.2. Tx Test1 Click “Non signaling mode” bar and then confirm “OK” text in the command line.

2 Put the number of TX Channel in the ARFCN.

3 Select “Tx” in the RF mode menu and “PCL” in the PA Level menu.

4 Finally, Click “Write All” bar and try the efficiency test of Phone.


1

2

3

4

- 138 -

10. Stand along

10.3. Rx Test1 Put the number of RX Channel in the ARFCN.

2 Select “Rx” in the RF mode menu.

3 Finally, Click “Write All” bar and try the efficiency test of Phone.

4 The Phone must be changed “normal mode” after finishing Test.

5 Change the Phone to “normal mode” and then Click the “Reset” bar.


1

2 3

Change "normal mode "

4

5


11. ENGINEERING MODE

- 139 -

11. ENGINEERING MODE

Engineering mode is designed to allow a service man/engineer to view and test the basic functions providedby a handset. The key sequence for switching the engineering mode on is “2945#*#” Select. Pressing ENDwill switch back to non-engineering mode operation. Use Up and Down key to select a menu and press‘select’ key to progress the test. Pressing back key will switch back to the original test menu.

[1] BB test

[1-1] Battery Info

[1-1-1] BattInfo

[1-2] Bluetooth Test

[1-2-1] Enter Test Mode

[1-2-1-1] Audio Test

[1-2-1-2] RF Test

[1-2-2] OnOff Test

[1-2-2-1] Bluetooth On

[1-2-2-1] Bluetooth Off

[1-2-3] Headset Test

[1-2-4] Communication Mode

[1-2-5] Xhtml compose print

[1-2-6] Xhtml Print Test

[2] Model Version test

[2-1] Version

[3] ENG MODE

[3-1] CELL ENVIRON

[3-2] PS Layer Info

[3-2-1] Mobility

[3-2-2] RadioRes

[3-2-3] Gprs

[3-3] LAYER1 INFO

[3-3-1] Close

[3-4] Reset Information

[3-4-1] Excpt

[3-5] Memory Configuration

[3-6] MenGenConf

[3-7] MemAllUse

[3-8] MemDetUse

[3-9] MemDump

[3-0] Change Frequency Band

[3-0-1] Close

[4] Call Timer

[5] Factory Reset

[6] MF Test

[6-1] All Auto Test

[6-2] Backlight

[6-2-1] Backlight On

[6-2-1] Backlight Off

[6-3] Audio

[6-3-1] Audio test

[6-4] Vibrator

[6-4-1] Vibrator on

[6-4-2] Vibrator off

[6-5] LCD

[6-5-1] Auto LCD

[6-6] Key pad

[6-7]Mic Speaker

[6-8] Camera

[6-8-1] Camera Main Preview

[6-8-2] Flash On

[6-8-2] Flash Off

[7] DRM Engineering Mode

[7-1] GetAllRoTable

[7-2] GetRoTable


- 140 -

- 141 -

1 23

5758

46

7

5

11

10

8

9

14

15 16

75

17

70 73

18

56

69

6854

5348474644

42

43

41

66

65

40

37

3836

35

33

63

32

24

23

22

29

21 34

28

26

2530

64

31

39

45

50

49

51

5255

71

72 6120

62

7419

5960

12

13

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.1 EXPLODED VIEW


- 143 -



12.2 Replacement Parts<Mechanic component>

LevelLocation

NoDescription Part Number Spec Color Remark

1 GSM(SLIDE) TGLL0006901Aluminum

Silver

2 AAAY00 ADDITION AAAY0180102Aluminum

Silver

3 MCJA00 COVER,BATTERY MCJA0037301 PRESS, STS, , , , , Silver 56

2 APEY00 PHONE APEY0370401 KE970 EUAAVAluminum

Silver

3 ACGM00 COVER ASSY,REAR ACGM0080801 KE970_COVER ASSY,REARAluminum

Silver

4 MCCC00 CAP,EARPHONE JACK MCCC0043501 MOLD, Urethane Rubber S195A, , , , , Without Color 51

4 MCCF00 CAP,MOBILE SWITCH MCCF0037701 MOLD, Urethane Rubber S195A, , , , , Silver 46

4 MCJN00 COVER,REAR MCJN0059801 MOLD, PC LUPOY SC-1004A, , , , , Black 45

4 MDAD00 DECO,CAMERA MDAD0026901 ELECTROFORMING, Ni, , , , , Silver 54

4 MLAB00 LABEL,A/S MLAB0000601 HUMIDITY STICKER Without Color

4 MLCE00 LENS,FLASH MLCE0007001 MOLD, PMMA HI835M, , , , , Transparent 48

4 MLEA00 LOCKER,BATTERY MLEA0034801 MOLD, POM LUCEL FW-700A, , , , , Silver 42

4 MPBT00 PAD,CAMERA MPBT0034201 COMPLEX, (empty), , , , , Black 67

4 MPBZ00 PAD MPBZ0157301 COMPLEX, (empty), , , , , Black 66

4 MPBZ01 PAD MPBZ0173201 COMPLEX, (empty), , , , , Without Color 41

4 MSDB00 SPRING,COIL MSDB0003701 COMPLEX, (empty), , , , , Without Color 43

4 MTAA00 TAPE,DECO MTAA0127001 COMPLEX, (empty), , , , , Without Color 53

4 MTAB01 TAPE,PROTECTION MTAB0159501 COMPLEX, (empty), , , , , Without Color 68

4 MTAD00 TAPE,WINDOW MTAD0060201 COMPLEX, (empty), , , , , Without Color 49

4 MTAZ00 TAPE MTAZ0162601 COMPLEX, (empty), , , , , Without Color 47

4 MTAZ01 TAPE MTAZ0171701 COMPLEX, (empty), , , , , Without Color

4 MWAE00 WINDOW,CAMERA MWAE0021701 COMPLEX, (empty), , , , , Black 50

3 ACGQ00 COVER ASSY,SLIDE ACGQ0013501 KE970/ME970_COVER ASSY,SLIDEAluminum

Silver

4 ACGK00 COVER ASSY,FRONT ACGK0081001 ME970_ COVER ASSY,FRONTAluminum

Silver

5 MBJL00 BUTTON,SIDE MBJL0036601 MOLD, PC LUPOY SC-1004A, , , , , Silver 21

5 MCJK00 COVER,FRONT MCJK0065401 MOLD, PC LUPOY SC-1004A, , , , , Silver 23

5 MDAG00 DECO,FRONT MDAG0024901 MOLD, POM LUCEL FW-700A, , , , , Gray 22

5 MFBD00 FILTER,MIKE MFBD0018901 COMPLEX, (empty), , , , , Black 29

5 MGAZ00 GASKET MGAZ0052401 COMPLEX, (empty), , , , , Silver 30

5 MICZ00 INSERT MICZ0028801 COMPLEX, (empty), , , , , Gold 28

Note: This Chapter is used for reference, Part orderis ordered by SBOM standard on GCSC

- 144 -



LevelLocation


5 MICZ01 INSERT MICZ0028901 COMPLEX, (empty), , , , , Gold 24

5 MTAB00 TAPE,PROTECTION MTAB0140001 COMPLEX, (empty), , , , , Green 34



4 ACGR00COVERASSY,SLIDE(LOWER)

ACGR0009201Aluminum

Silver

5 MCJV00 COVER,SLIDE(LOWER) MCJV0009401 MOLD, PC LUPOY SC-1004A, , , , ,Aluminum

Silver19

5 MGAD00 GASKET,SHIELD FORM MGAD0132401 COMPLEX, (empty), , , , ,Aluminum

Silver73

5 MGDA00 GUIDE,LEFT MGDA0007001 MOLD, POM LUCEL N109-LD, , , , , Gray

5 MGDB00 GUIDE,RIGHT MGDB0002901 MOLD, POM LUCEL N109-LD, , , , , Gray

5 MICZ00 INSERT MICZ0024601 C4605BD,M1.4x0.3pitch,1.7T,2.5PI Without Color

5 MICZ01 INSERT MICZ0028501 COMPLEX, (empty), , , , , Without Color

5 MMAA00 MAGNET,SWITCH MMAA0006901 COMPLEX, (empty), , , , , Without Color

5 MPBJ00 PAD,MOTOR MPBJ0039301 COMPLEX, (empty), , , , ,Aluminum

Silver18



4 ACGS00COVERASSY,SLIDE(UPPER)

ACGS0011701 Silver

5 MCJW00 COVER,SLIDE(UPPER) MCJW0009201 PRESS, STS, , , , , Without Color 4

6 MDAY00 DECO MDAY0034001 PRESS, STS, , , , , Without Color

6 MFEZ00 FRAME MFEZ0011801 PRESS, STS, , , , , Without Color

6 MICZ00 INSERT MICZ0028401 PRESS, STS, , , , , Without Color

6 MICZ01 INSERT MICZ0029301 COMPLEX, (empty), , , , , Without Color

5 MFBC00 FILTER,SPEAKER MFBC0025301 PRESS, STS, , , , , Black 57

5 MPBG00 PAD,LCD MPBG0056801 COMPLEX, (empty), , , , , Black 6

5 MTAA00 TAPE,DECO MTAA0132401 COMPLEX, (empty), , , , , Without Color 58

5 MTAD00 TAPE,WINDOW MTAD0064801 COMPLEX, (empty), , , , , Without Color 3

4 GMEY01 SCREW MACHINE,BIND GMEY00154011.4 mm,2.7 mm,MSWR3(BK) ,N ,+ , ,; ,[empty] ,[empty] , ,,[empty] ,BLACK ,[empty] ,[empty]

Black 10

4 GMZZ00 SCREW MACHINE GMZZ0017701 1.4 mm,3.0 mm,MSWR3 ,N ,+ ,- , Silver 11,62,64

4 GMZZ01 SCREW MACHINE GMZZ00235011.4 mm,1.5 mm,MSWR3(FN) ,B ,+ ,- , ,; ,[empty] ,[empty], , ,[empty] ,SILVER ,[empty] ,[empty]

Silver 63,70

4 GMZZ02 SCREW MACHINE GMZZ00236011.4 mm,3.75 mm,MSWR3(BK) ,N ,+ ,- , ,; ,[empty],[empty] , , ,[empty] ,BLACK ,[empty] ,[empty]

61

4 MBJA00 BUTTON,DIAL MBJA0022401 COMPLEX, (empty), , , , , Without Color 32

4 MCCH00 CAP,SCREW MCCH0100901 COMPLEX, (empty), , , , , Silver 20

4 MDAY00 DECO MDAY0035401 CASTING, Zn Alloy, , , , , Silver 8

4 MGAD00 GASKET,SHIELD FORM MGAD0131001 COMPLEX, (empty), , , , , Gold



- 145 -

LevelLocation


4 MKAC00 KEYPAD,FUNCTION MKAC0009001 COMPLEX, (empty), , , , , Without Color 5

4 MLAC00 LABEL,BARCODE MLAC0003401 EZ LOOKS(user for mechanical) Without Color

4 MPBJ00 PAD,MOTOR MPBJ0040801 COMPLEX, (empty), , , , , Black 16

4 MPBZ00 PAD MPBZ0183101 COMPLEX, (empty), , , , , Black




4 MRAA00 RAIL,SLIDE MRAA0004801 COMPLEX, (empty), , , , ,Aluminum

Silver71



4 MTAC00 TAPE,SHIELD MTAC0044801 COMPLEX, (empty), , , , , Blue

4 MTAZ00 TAPE MTAZ0192001 COMPLEX, (empty), , , , , Without Color

4 MWAC00 WINDOW,LCD MWAC0073501 COMPLEX, (empty), , , , , Without Color 2

6 ADCA00 DOME ASSY,METAL ADCA0060201 Without Color 33

3 GMEY00 SCREW MACHINE,BIND GMEY0009201 1.4 mm,3.5 mm,MSWR3(BK) ,B ,+ ,HEAD D=2.7mm Black 69

3 MCCH00 CAP,SCREW MCCH0097401 MOLD, Urethane Rubber S195A, , , , , Without Color 52

3 MLAK00 LABEL,MODEL MLAK0006301 LG (30.5x21.5 4-1R) Pearl White

5 MCBA00 CAN,SHIELD MCBA0012801 PRESS, STS, , , , , Silver 36

6 MPBZ00 PAD MPBZ0180401 COMPLEX, (empty), , , , , Black

5 MCBA01 CAN,SHIELD MCBA0012901 PRESS, STS, , , , , Silver 39

6 MGAD00 GASKET,SHIELD FORM MGAD0132601 COMPLEX, (empty), , , , , Gold

6 MSAZ00 SHEET MSAZ0044001 COMPLEX, (empty), , , , , Silver


5 MLAZ00 LABEL MLAZ0038301 PID Label 4 Array Without Color



- 146 -

LevelLocation


4 SNGF00 ANTENNA,GSM,FIXED SNGF00226013.0 ,-2.0 dBd,, ,bluetooth, internal ,; ,SINGLE ,-2.0 ,50,3.0

44

4 ESQY00 SWITCH,ROTARY ESQY0000801 1 V,1 A,VERTICAL ,1 G, 9

4 SACY00 PCB ASSY,FLEXIBLE SACY0054601 Slide LCD FPCB 14

5 SACB00PCBASSY,FLEXIBLE,INSERT

SACB0034801 Slide LCD FPCB

6 MSAZ00 SHEET MSAZ0042501 COMPLEX, (empty), , , , , Without Color 13

5 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0049301 Slide LCD FPCB

6 SACC00PCB ASSY,FLEXIBLE,SMTBOTTOM

SACC0029401 Slide LCD FPCB

7 C601 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

7 C602 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

7 CN602 CONNECTOR,FFC/FPC ENQY0012201 35 PIN,0.3 mm,ETC , ,H=1.0

7 D601 DIODE,TVS EDTY0008604 SOT-563 ,6 V,100 W,R/TP ,PB-FREE

7 LD601 DIODE,LED,CHIP EDLH0011901 WHITE ,1608 ,R/TP ,PB-FREE(ZENER)

7 LD602 DIODE,LED,CHIP EDLH0011901 WHITE ,1608 ,R/TP ,PB-FREE(ZENER)

7 R601 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

7 U601 IC EUSY0311501 ,4 PIN,R/TP ,1.8X1.2 size Hall IC for FD JOG Dial

7 U602 IC EUSY0311501 ,4 PIN,R/TP ,1.8X1.2 size Hall IC for FD JOG Dial

7 VA601 VARISTOR SEVY0003602 5.6 V, ,SMD ,1005, 60pF


6 SACD00PCB ASSY,FLEXIBLE,SMTTOP

SACD0040201 Slide LCD FPCB


7 CN601CONNECTOR,BOARD TOBOARD

ENBY0023701 54 PIN,0.4 mm,ETC , ,H=0.9, Socket

5 SACB00PCBASSY,FLEXIBLE,INSERT

SACB0034901 Key FPCB Ass'y

6 SACC00PCB ASSY,FLEXIBLE,SMTBOTTOM

SACC0029501 Key FPCB Ass'y

7 C502 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

7 C503 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP


ENBY0017201 70 PIN,0.4 mm,STRAIGHT ,AU ,FEMALE

6 SACD00PCB ASSY,FLEXIBLE,SMTTOP

SACD0040301 Key FPCB Ass'y



<Main component> Note: This Chapter is used for reference, Part orderis ordered by SBOM standard on GCSC

- 147 -



LevelLocation






7 C509 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP





7 C515 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP





ENBY0023601 54 PIN,0.4 mm,ETC , ,H=0.9, Header


7 KB_CAM SWITCH,TACT ESCY0004201 12 V,0.02 A,HORIZONTAL ,0.2 G,

7 L501 INDUCTOR,CHIP ELCH0010402 270 nH,M ,1005 ,R/TP ,CHIP


7 L503 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP ,


7 LD501 DIODE,LED,CHIP EDLH0013701WHITE ,ETC ,R/TP ,SIDEVIEW ,; ,[empty] ,2.9~3.75,30mA , , ,120mW ,[empty] ,[empty] ,2P

7 LD502 DIODE,LED,CHIP EDLH0013701WHITE ,ETC ,R/TP ,SIDEVIEW ,; ,[empty] ,2.9~3.75,30mA , , ,120mW ,[empty] ,[empty] ,2P

7 LD503 DIODE,LED,MODULE EDLM0008601 WHITE ,1 LED,2.0*1.5*0.45 ,R/TP ,PB-FREE

7 MIC501 MICROPHONE SUMY0010508 PIN ,42 dB,4*4 ,SMD Bridge Type

7 Q501 TR,BJT,NPN EQBN0013701 EMT6 ,150 mW,R/TP ,DUAL TRANSISTORS

7 R501 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP







7 R509 RES,CHIP,MAKER ERHZ0000410 12 ohm,1/16W ,J ,1005 ,R/TP

7 R512 RES,CHIP,MAKER ERHZ0000346 7500 ohm,1/16W ,F ,1005 ,R/TP

7 R513 RES,CHIP,MAKER ERHZ0000294 5100 ohm,1/16W ,F ,1005 ,R/TP

- 148 -



LevelLocation


7 U501 IC EUSY029KG70 TQFN , PIN,R/TP ,6 BLU+2 LDO+1 Flash LED Drv, 4*4

7 VA503 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005


6 SPCY00 PCB,FLEXIBLE SPCY0088201POLYI , 0.28mm,3-1-3 RF ,KE/ME970 KEY FPCB ,; , , , ,, , , , ,

35

4 SJMY00 VIBRATOR,MOTOR SJMY0008404 3 V,80 mA,10*2.7 , ,; ,3V ,55mA , ,12000 , , , , 17

5 ELCH00 INDUCTOR,CHIP ELCH0004711 22 nH,J ,1005 ,R/TP ,

5 ELCH01 INDUCTOR,CHIP ELCH0005807 5.6 nH,S ,1005 ,R/TP ,

5 ENWY00 CONN,RF SWITCH ENWY0003901 ,SMD , dB,

5 ERHZ00 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

5 SNGF00 ANTENNA,GSM,FIXED SNGF00225013.0 ,-2.0 dBd,, ,internal, GSM900/1800/1900 ,; ,TRIPLE ,-2.0 ,50 ,3.0

31

4 SUSY00 SPEAKER SUSY0024101 ASSY ,8 ohm,88 dB, mm, ,; , , , , ,750 ,18*10*3T ,WIRE 15

4 SVLM00 LCD MODULE SVLM0021001 MAIN ,240*320 ,37.9*53.9 ,262k ,TFT ,TM ,HM15CP200 , 12

3 SAFY00 PCB ASSY,MAIN SAFY0179902

4 SAFB00 PCB ASSY,MAIN,INSERT SAFB0064701

5 SVCY00 CAMERA SVCY0012801 CMOS ,MEGA ,2M AF (FPCB, 1/4", SOC2020) 37

5 SWCC00 CABLE,COAXIAL SWCC000390191 mm,2 LINE, ,; ,[empty] ,[empty] ,[empty] , ,WHITE ,,[empty]

40

4 SAFF00 PCB ASSY,MAIN,SMT SAFF0101102

5 SAFC00PCB ASSY,MAIN,SMTBOTTOM

SAFC0081801

6 BAT301 BATTERY,CELL,LITHIUM SBCL00017012 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67,phi 4.8, Pb-Free

6 C101 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP










6 C111 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP





- 149 -



LevelLocation

















6 C131 CAP,CHIP,MAKER ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP






6 C137 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP

6 C138 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP






6 C204 CAP,CERAMIC,CHIP ECCH0009103 100 pF,50V ,J ,X7R ,TC ,0603 ,R/TP





6 C209 CAP,CERAMIC,CHIP ECCH0009514 10 pF,25V ,D ,X7R ,HD ,0603 ,R/TP

6 C210 CAP,CERAMIC,CHIP ECCH0009506 27 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP



- 150 -



LevelLocation


6 C215 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP












6 C227 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP














6 C247 CAP,CERAMIC,CHIP ECCH0009512 1000 pF,25V ,K ,X7R ,HD ,0603 ,R/TP











- 151 -



LevelLocation














6 C329 CAP,CERAMIC,CHIP ECCH0009110 22 nF,6.3V ,K ,X7R ,TC ,0603 ,R/TP

6 C330 CAP,CERAMIC,CHIP ECCH0009514 10 pF,25V ,D ,X7R ,HD ,0603 ,R/TP

6 C331 CAP,CERAMIC,CHIP ECCH0009110 22 nF,6.3V ,K ,X7R ,TC ,0603 ,R/TP










6 C343 CAP,CHIP,MAKER ECZH0000803 2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP






6 C401 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP



6 CN201 CONNECTOR,ETC ENZY0019401 3 PIN,3.0 mm,ETC , ,H=5.3


ENBY0017301 70 PIN,0.4 mm,STRAIGHT ,AU ,MALE

6 CN303 CONNECTOR,I/O ENRY0006501 18 PIN,0.4 mm,ETC , ,1.2 Offset

- 152 -



LevelLocation



6 FB201 FILTER,BEAD,CHIP SFBH0001003 220 ohm,2012 ,

6 FL302 FILTER,EMI/POWER SFEY0012901 SMD ,TDFN,100Ohm & 15pF / 15kV





6 FL308 FILTER,DIELECTRIC SFDY0001601 2450 MHz,2.0*1.25 ,SMD ,Pb-free_Bluetooth_Dielectric





6 L201 INDUCTOR,SMD,POWER ELCP0005104 10 uH,M ,3.8*3.8*1.8 ,R/TP ,power inductor/ 850mA

6 L304 INDUCTOR,CHIP ELCH0001411 1.2 nH,S ,1005 ,R/TP ,PBFREE


6 Q301 TR,BJT,NPN EQBN0007101 EMT3 ,0.15 W,R/TP ,LOW FREQUENCY

6 R101 RES,CHIP,MAKER ERHZ0000488 4.7 ohm,1/16W ,J ,1005 ,R/TP

6 R102 RES,CHIP ERHY0009517 22 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP

6 R103 RES,CHIP ERHY0009522 3.3 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP

6 R104 RES,CHIP ERHY0000166 390 Kohm,1/16W ,F ,1005 ,R/TP

6 R105 RES,CHIP,MAKER ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP

6 R107 RES,CHIP ERHY0009501 0 ohm,1/20W(0.05W) ,J ,0603 ,R/TP













6 R203 RES,CHIP ERHY0011901 47 mohm,1/4W ,F ,2012 ,R/TP



- 153 -



LevelLocation


6 R210 RES,CHIP ERHY0000278 82K ohm,1/16W,J,1005,R/TP












6 R320 RES,CHIP ERHY0009507 1 Mohm,1/20W(0.05W) ,J ,0603 ,R/TP













6 U101 IC EUSY0302101BGA ,105 PIN,R/TP ,1G Nor+256MSDRAM, 1 8VI/O(Sibely)

6 U103 IC EUSY0274601 BGA ,293 PIN,R/TP ,EDGE BASE BAND S-GOLD2

6 U201 IC EUSY0286901SOT23-5 ,5 PIN,R/TP ,2.5V Sense voltage(max), currentmonitor

6 U203 IC EUSY0269101 PG-VQFN-48 ,48 PIN,R/TP ,PMIC, Pb Free

6 U204 IC EUSY0304401 DFN ,10 PIN,R/TP ,2.8V/3.3V 300mA Dual LDO

6 U306 IC EUSY0250501SC70 ,5 PIN,R/TP ,Comparator, pin compatible toEUSY0077701

6 U401 IC EUSY0279801 SC70 ,6 PIN,R/TP ,Dual Buffer, Pb Free




- 154 -



LevelLocation


6 VA305 DIODE,TVS EDTY0009101 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4

6 VA306 DIODE,TVS EDTY0009101 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4

6 X101 X-TAL EXXY001870132.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9,

5 SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0080601


6 C235 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP


6 C240 CAP,TANTAL,CHIP,MAKER ECTZ0004203 68 uF,6.3V ,M ,STD ,3216 ,R/TP



6 C252 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP







6 C260 CAP,CHIP,MAKER ECZH0003121 68 nF,10V ,K ,X7R ,HD ,1005 ,R/TP



6 C264 CAP,TANTAL,CHIP,MAKER ECTZ0006301 100 uF,4V ,M ,L_ESR ,3216 ,R/TP


6 C266 CAP,TANTAL,CHIP,MAKER ECTZ0006301 100 uF,4V ,M ,L_ESR ,3216 ,R/TP




6 C270 CAP,CHIP,MAKER ECZH0003121 68 nF,10V ,K ,X7R ,HD ,1005 ,R/TP










- 155 -



LevelLocation



6 C342 CAP,TANTAL,CHIP,MAKER ECTZ0000318 33 uF,10V ,M ,STD ,3216 ,R/TP


6 C404 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP


6 C407 CAP,CERAMIC,CHIP ECCH0000701 1.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP


6 C409 CAP,CHIP,MAKER ECZH0001002 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP

6 C413 CAP,TANTAL,CHIP,MAKER ECTZ0004203 68 uF,6.3V ,M ,STD ,3216 ,R/TP



6 C416 CAP,CERAMIC,CHIP ECCH0004906 2.5 pF,50V ,C ,X7R ,TC ,1005 ,R/TP

6 C417 CAP,CERAMIC,CHIP ECCH0004906 2.5 pF,50V ,C ,X7R ,TC ,1005 ,R/TP



6 C420 CAP,CHIP,MAKER ECZH0000822 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

6 C421 CAP,CHIP,MAKER ECZH0000822 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP











6 C436 CAP,CERAMIC,CHIP ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP







6 C444 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP





- 156 -

LevelLocation


6 CN202 CONN,SOCKET ENSY0017901 14 PIN,ETC , ,2.54 mm,Micro-SD, UIM Dupli Socket


ENBY0015601 34 PIN,0.4 mm,STRAIGHT ,AU ,0.9MM HEIGHT

6 CN401 CONN,RF SWITCH ENWY0004001 ,SMD ,1.3 dB,

6 D201 DIODE,SWITCHING EDSY0017701SOD-123 ,40 V,1 A,R/TP , ,; , , , , , , ,[empty] ,[empty] ,2P,1

6 FB301 FILTER,BEAD,CHIP SFBH0007102 10 ohm,1005 ,Ferrite Bead




6 FL401 FILTER,SEPERATOR SFAY0009001850.900 ,1800.1900 ,3.5 dB,3.5 dB, dB, dB,ETC,5.4X3.2X1.2 Size, Quad FEM





6 L402 INDUCTOR,CHIP ELCH0001413 22 nH,J ,1005 ,R/TP ,PBFREE

6 L403 INDUCTOR,CHIP ELCH0001402 18 nH,J ,1005 ,R/TP ,Pb Free



6 PT401 THERMISTOR SETY0006301NTC ,10000 ohm,SMD ,1005, 3350~3399k, J, R/T,PBFREE

6 Q201 TR,FET,P-CHANNEL EQFP0008301 TSOP-6 ,1.14 W,-30 V,-3.7 A,R/TP ,P-Channel FET

6 Q202 TR,FET,P-CHANNEL EQFP0004501SOT-323 ,.29 W,1.8 V,.86 A,R/TP ,P-Chanel MOSFET,Pb free

6 R209 RES,CHIP ERHY0009560 33 Kohm,1/20W(0.05W) ,F ,0603 ,R/TP










6 R221 RES,CHIP ERHY0000715 0.15 ohm,1/8W ,F ,2012 ,R/TP






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LevelLocation





























6 R406 RES,CHIP ERHY0000101 0 ohm,1/16W,F,1005,R/TP

6 R407 RES,CHIP ERHY0000101 0 ohm,1/16W,F,1005,R/TP




6 R411 RES,CHIP ERHY0000185 820 ohm,1/16W ,F ,1005 ,R/TP







- 158 -

LevelLocation










6 SPFY00 PCB,MAIN SPFY0136901 FR-4 ,0.8 mm,STAGGERED-10 , ,; , , , , , , , , , 38

6 SW401 CONN,RF SWITCH ENWY0002304 STRAIGHT ,SMD ,0.8 dB,MUSE MODEL

6 U202 IC EUSY0292601DFN ,8 PIN,R/TP ,Li-ion charger IC, 8 Ld 2 x 3 DFN, Pb-free

6 U205 IC EUSY0300101WQFN ,10 PIN,R/TP ,Small package Dual SPDT analogSwitch, PB-Free

6 U206 IC EUSY0314501 QFN ,16 PIN,R/TP ,

6 U207 IC EUSY0309801Output capless audio subsystem with 3D ,24 PIN,R/TP,NS subsystem audio amp

6 U208 IC EUSY0300101WQFN ,10 PIN,R/TP ,Small package Dual SPDT analogSwitch, PB-Free

6 U302 IC EUSY0160401SOT-23 ,3 PIN,R/TP ,DC MOTOR DRIVER /INTEGERATED RELAY

6 U304 IC EUSY0319201 DFN ,10 PIN,R/TP ,OVP

6 U402 PAM SMPY0012301 dBm, %, A, dBc, dB, ,SMD ,

6 U403 IC EUSY0274801 VQFN ,40 PIN,R/TP ,GPRS, EDGE TRANSCEIVER


6 X401 VCTCXO EXSK000560326 MHz,2 PPM,10 pF,SMD ,3.2*2.5*0.9 ,2.5ppm at -20 to+75, AFC 0.5V to 2.5V, Supply 2.6V



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LevelLocation


3 SBPL00 BATTERY PACK,LI-ION SBPL0085703

3.7 V,800 mAh,1 CELL,PRISMATIC ,CMW PJT BATT,Innerpack, Europe Label, Pb-Free ,; ,3.7 ,800 ,0.2C,PRISMATIC ,43x34x46 , ,ALLTEL SILVER ,Innerpack,CMW Slide & Folder

AIRY BLUE 55

3 SGDY00 DATA CABLE SGDY0010901 LG-US03K ,18pin USB DataCable

3 SGEY00EAR PHONE/EAR MIKESET

SGEY0005526; ,40mW ,16 OHM ,100dB ,F0 ,10KHZ ,[empty] ,[empty],18P MMI CONNECTOR ,SILVER,LG MARK

3 SSAD00 ADAPTOR,AC-DC SSAD0021002 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug

12.3 Accessory Note: This Chapter is used for reference, Part orderis ordered by SBOM standard on GCSC

en ke970 svc eng 070404[up.by.nasirahmed]

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