epc8009 – enhancement mode power transistor · – gate charge (pc) v g – gate voltage (v) i d...
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eGaN® FET DATASHEET EPC8009
EPC – THE LEADER IN GaN TECHNOLOGY | WWW.EPC-CO.COM | COPYRIGHT 2019 | | 1
EPC8009 – Enhancement Mode Power Transistor
VDS , 65 VRDS(on) , 130 mΩID , 4 A
EFFICIENT POWER CONVERSION
EPC8009 eGaN FETs are supplied only in passivated die form with solder barsDie Size: 2.1 mm x 0.85 mm
Applications• Ultra High Speed DC-DC Conversion• RF Envelope Tracking• Wireless Power Transfer• Game Console and Industrial Movement
Sensing (Lidar)
Benefits• Ultra High Efficiency• Ultra Low RDS(on)
• Ultra Low QG
• Ultra Small Footprint
HAL
G
D
S
Maximum Ratings
PARAMETER VALUE UNIT
VDS
Drain-to-Source Voltage (Continuous) 65V
Drain-to-Source Voltage (up to 10,000 5 ms pulses at 125°C) 78
ID
Continuous (TA = 25°C, RθJA = 33°C/W) 4A
Pulsed (25°C, TPULSE = 300 µs) 7.5
VGS
Gate-to-Source Voltage 6V
Gate-to-Source Voltage –4
TJ Operating Temperature –40 to 150°C
TSTG Storage Temperature –40 to 150
Static Characteristics (TJ= 25°C unless otherwise stated)PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
BVDSS Drain-to-Source Voltage VGS = 0 V, ID = 125 µA 65 V
IDSS Drain-Source Leakage VDS = 52 V, VGS = 0 V 50 100 µA
IGSSGate-to-Source Forward Leakage VGS = 5 V 100 500
µAGate-to-Source Reverse Leakage VGS = -4 V 50 100
VGS(TH) Gate Threshold Voltage VDS = VGS, ID = 0.25 mA 0.8 1.4 2.5 V
RDS(on) Drain-Source On Resistance VGS = 5 V, ID = 0.5 A 90 130 mΩ
VSD Source-Drain Forward Voltage IS = 0.5 A, VGS = 0 V 2.2 V
Thermal Characteristics
PARAMETER TYP UNIT
RθJC Thermal Resistance, Junction-to-Case 8.2
°C/WRθJB Thermal Resistance, Junction-to-Board 16
RθJA Thermal Resistance, Junction-to-Ambient (Note 1) 82
Specifications are with substrate connected to source where applicable.
Note 1: RθJA is determined with the device mounted on one square inch of copper pad, single layer 2 oz copper on FR4 board.See https://epc-co.com/epc/documents/product-training/Appnote_Thermal_Performance_of_eGaN_FETs.pdf for details
Gallium Nitride’s exceptionally high electron mobility and low temperature coefficient allows very low RDS(on), while its lateral device structure and majority carrier diode provide exceptionally low QG and zero QRR. The end result is a device that can handle tasks where very high switching frequency, and low on-time are beneficial as well as those where on-state losses dominate.
eGaN® FET DATASHEET
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EPC8009
Figure 1: Typical Output Characteristics at 25°C
VDS– Drain-to-Source Voltage (V)
I D– Dr
ain
Curre
nt (A
)
7
6
5
4
8
3
2
1
00 0.5 1.5 1 2 2.5 3
VGS
GS
GS
GS
= 5V = 4V = 3V = 2
7
6
5
4
8
3
2
1
0
VGS– Gate-to-Source Voltage (V)
I D– Dr
ain
Curre
nt (A
)
0.5 1 1.5 2 32.5 3.5 4 4.5 5
Figure 2: Transfer Characteristics
25˚C125˚C
VDS = 3 V
350
300
250
200
400
150
100
50
0
VGS– Gate-to-Source Voltage (V)
2.0 2.5 3.0 3.5 4.54.0 5.0
Figure 3: R DS(on) vs. VGS for Various Drain Currents
R DS(o
n)–
Drai
n-to
-Sou
rce R
esist
ance
(mΩ)
ID= 0.5 A
ID= 1.0 A
ID= 1.5 A
ID= 2.0 A
350
300
250
400
200
150
100
50
VGS– Gate-to-Source Voltage (V)
2 2.5 3 3.5 4.54 5
Figure 4: R DS(on) vs. VGS for Various Temperatures
R DS(o
n) –
Drai
n-to
-Sou
rce R
esist
ance
(mΩ) 25˚C
125˚C
ID = 1 A
Dynamic Characteristics (TJ= 25˚C unless otherwise stated)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
CISS Input Capacitance
VGS = 0 V, VDS = 32.5 V
45 52
pFCOSS Output Capacitance 19 28
CRSS Reverse Transfer Capacitance 0.5 0.8
RG Gate Resistance 0.3 Ω
QG Total Gate Charge
VDS = 32.5 V, VGS = 5 V, ID = 1 A
370 450
pC
QGS Gate-to-Source Charge 120
QGD Gate-to-Drain Charge 55 94
QG(TH) Gate Charge at Threshold 96
QOSS Output Charge VGS = 0 V, VDS = 32.5 V 940 1400
QRR Source-Drain Recovery Charge 0
Specifications are with substrate connected to source where applicable.
eGaN® FET DATASHEET
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EPC8009
40
50
10
20
30
0 0 10 30 40 5020 60
Figure 5: Capacitance (Linear Scale)
VDS– Drain-to-Source Voltage (V)
C – Ca
pacit
ance
(pF)
COSS = CGD + CSD
CISS = CGD + CGS
CRSS = CGD
102
101
100
10-1
0 10 403020 6050
Figure 5A: Capacitance (Log Scale)
VDS– Drain-to-Source Voltage (V)
C – Ca
pacit
ance
(pF)
COSS = CGD + CSD
CISS = CGD + CGS
CRSS = CGD
4
5
3
1
2
0 0 100 300200 400
Figure 6: Gate Charge
QG– Gate Charge (pC)
V G– Ga
te V
olta
ge (V
)
ID= 1 AVDS = 32.5 V
25˚C125˚C7
6
5
4
8
3
2
1
0
VSD– Source-to-Drain Voltage (V)
I SD–
Sour
ce-to
-Dra
in Cu
rrent
(A)
0.5 0 1 1.5 2 32.5 3.5 4 4.5 5
Figure 7: Reverse Drain-Source Characteristics
1.6
1.8
1.4
1
1.2
0.8 0 5025 75 100 125 150
Figure 8: Normalized RDS(on)
ID = 1 AVGS = 5 V
Norm
alize
d On
-Sta
te R
esist
ance
- R D
S(on
)
TJ– Junction Temperature (°C)
ID = 0.25 mA1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
TJ– Junction Temperature (°C)
Norm
alize
d Th
resh
old
Volta
ge (V
)
0 25 50 75 125100 150
Figure 9: Normalized Threshold Voltage vs. Temperature
eGaN® FET DATASHEET
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EPC8009
1.00.90.
80.7
1.2 1.
4 1.6
1.8
2.0
0.6
0.5
0.4
0.3
0.2
0.1
3.0
6.0
8.010
5.0
4.0
20
RF Café2002
100 0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.2
1.4
1.6
1.8
2.0
3.0
4.0
5.0
1.0
0.9
0.8
0.7
1.2
1.4
1.6
1.8
2.0
3.0
6.0
8.010
5.0
4.0
0.6
0.5
0.4
0.3
0.2
0.1
20
3 GHz
200 MHz
S11 – Gate Re�ectionS22 – Drain Re�ectionEPC8009
3 GHz
200 MHz
Figure 11: Smith Chart
S-Parameter CharacteristicsVGSQ = 2.36 V, VDSQ = 30 V, IDQ = 0.50 A
Pulsed Measurement, Heat-Sink Installed, Z0 = 50 Ω
Figure 12: Gain Chart Figure 13: Device Reflection
Figure 14: Taper and Reference Plane details – Device Connection
Frequency Gate (ZGS) Drain (ZDS)
[MHz] [Ω] [Ω]
200 1.98 – j8.58 16.83 – j11.29
500 1.87 – j2.15 10.69 – j9.69
1000 1.39 + j2.14 5.22 – j5.45
1200 1.21 + j3.56 3.53 – j3.42
1500 1.01 + j4.96 2.35 – j0.81
2000 0.83 + j7.83 1.57 + j3.52
2400 0.73 + j10.14 1.54 + j6.19
3000 0.58 + j14.27 1.84 + j10.20
S-Parameter Table - Download S-parameter files at www.epc-co.com
ZDS
ZGS
Gate Circuit Reference Plane
Drain Circuit Reference Plane
Device Outline
914
1621
1621
149
1000
271
271
All dimensions in µm 914 355
0
5
10
15
20
25
30
35
40
45
–0.2
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
100 1000
Amplitude Gmax[dB]
Frequency (MHz)
25˚C125˚C1.2
1.4
1
0.6
0.8
0.4
0.2
010 32 4 5 6
Figure 10: Gate Current
VGS– Gate-to-Source Voltage (V)
I G– Ga
te Cu
rrent
(mA)
Micro-Strip design: 2-layer½ oz (17.5 µm) thick copper30 mil thick RO4350 substrate
All measurements were done with substrate shortened to source.
eGaN® FET DATASHEET
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EPC8009
Figure 16: Safe Operating Area
0.1
1
10
0.1 1 10 100
I D - D
rain
Curre
nt (A
)
VDS – Drain Voltage (V)
Pulse Width (s)
100 ms
10 ms
1 ms
100 µs
10-4 10-3 10-2 10-1 1 10010tp– Rectangular Pulse Duration (s)
0.5
0.20.10.05
10-6 10-5 10-4 10-3 10-2 10-1 1 10
Figure 15: Transient Thermal Response Curves
tp– Rectangular Pulse Duration (s)
Duty Factors:
Junction-to-Board
Junction-to-Case
0.5
0.20.10.05
Duty Factors:
Duty Factor = tp/TPeak TJ = PDM x ZθJB x RθJB + TB
Notes:
tp
T
P DM
0.020.01
Notes:
tp
T
P DM
Duty Factor = tp/TPeak TJ = PDM x ZθJC x RθJC + TC
10-5
Z θJC N
orm
alize
d Th
erm
al Im
peda
nce
1
0.1
0.01
0.001
Single Pulse
Single Pulse
1
0.1
0.01
0.001
Z θJB N
orm
alize
d Th
erm
al Im
peda
nce
0.020.01
eGaN® FET DATASHEET
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EPC8009
8009 YYYYZZZZ
Die orientation dot
Gate Pad bump is under this corner
Part Number
Laser Markings
Part #Marking Line 1
Lot_Date CodeMarking line 2
Lot_Date CodeMarking Line 3
EPC8009 8009 YYYY ZZZZ
DIE MARKINGS
YYYY8009
ZZZZ
TAPE AND REEL CONFIGURATION4mm pitch, 8mm wide tape on 7” reel
7” reel
a
d e f g
c
b
Note 1: MSL 1 (moisture sensitivity level 1) classi�ed according to IPC/JEDEC industry standard.Note 2: Pocket position is relative to the sprocket hole measured as true position of the pocket, not the pocket hole.
Dieorientationdot
Gatepad bump isunder thiscorner
Die is placed into pocketsolder bump side down(face side down)
Loaded Tape Feed Direction
Dimension (mm) target min max a 8.00 7.90 8.30 b 1.75 1.65 1.85
c (see note) 3.50 3.45 3.55 d 4.00 3.90 4.10 e 4.00 3.90 4.10
f (see note) 2.00 1.95 2.05 g 1.5 1.5 1.6
EPC8009 (note 1)
eGaN® FET DATASHEET
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EPC8009
850
570
2050
1 2
4
3
6
5
400
190
600 600 400
440
190
190
RECOMMENDED LAND PATTERN (measurements in µm)
Recommended stencil should be 4 mil (100 μm) thick, must be laser cut, openings per drawing. Intended for use with SAC305 Type 3 solder, reference 88.5% metals content.
Additional assembly resources available at: https://epc-co.com/epc/DesignSupport/AssemblyBasics.aspx
DIE OUTLINESolder Bar View
Side View
DimMicrometers
Min Nominal MaxA 2020 2050 2080B 820 850 880C 555 580 605d 400 400 400e 600 600 600f 200 225 250g 175 200 225h 425 450 475i 175 200 225j 400 400 400
Pad no. 1 is GatePad no. 2 is Source Return for Gate Driver Pad no. 3 and 5 are SourcePad no. 4 is DrainPad no. 6 is Substrate*
*Substrate pin should be connected to Source
RECOMMENDED STENCIL DRAWING (measurements in µm)
2050
R60
850
325 200 245 230 450 Blue = bump, Gray = stencil275
272
200
592
250
2001 2
4
3
6
5
B
A
i
1 2
3
4
5
6
j
gx2
e e d f
h
C
i X2
815 M
ax
100 +
/- 20
Seating Plane
(685
)
Efficient Power Conversion Corporation (EPC) reserves the right to make changes without further notice to any products herein to improve reliability, function or design. EPC does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. eGaN® is a registered trademark of Efficient Power Conversion Corporation.EPC Patent Listing: epc-co.com/epc/AboutEPC/Patents.aspx
The land pattern is solder mask defined. Solder mask opening is 5 µm smaller per side than bump.
Information subject to change without notice.
Revised August, 2019
Pad no. 1 is GatePad no. 2 is Source Return for Gate Driver Pad no. 3 and 5 are SourcePad no. 4 is Drain Pad no. 6 is Substrate*
*Substrate pin should be connected to Source