ep&dee no 9 - november 2012

EP&DeeDESIGN & MANUFACTURING NOVEMBER, 2012 ISSUE NO. 9, VOL. 10

E L E C T R O N I C S P R O D U C T S & D E S I G N E A S T E R N E U R O P E

T H E E A S T E U R O P E A N J O U R N A L F O R E M B E D D E D A P P L I C A T I O N S

Microchip announces its patentedGestIC® technology, which enablesthe next dimension in intuitive, ges-ture-based, non-contact user inter-faces for a broad range of end prod-ucts. The MGC3130 is the world’s firstelectrical-field (E-field)-based, config-urable 3D gesture controller, offeringlow-power, precise, fast and robusthand position tracking with free-space gesture recognition. Withpower consumption as low as 150microwatts in its active sensing state,the MGC3130 enables always-on 3Dgesture recognition, even for battery-powered products where powerbudgets are extremely tight. TheMGC3130’s low-power design andvariety of configurable power modesprovide the lowest power consump-

tion of any 3D sensingtechnology, up to 90%lower than camera-basedgesture systems.GestIC technology achievesthe exceptionally high gesture-recog-nition rates re quired by today’sconsu mer products through its on-chip library, called the Colibri Suite, ofintuitive and natural human gestures.The Colibri Suite combines a stochas-tic Hidden Markov model and x/y/zhand position vectors to providedesigners with a reliable set of recog-nised 3D hand and finger gesturesthat can be easily employed in theirproducts. Examples include Wake-Upon Approach, Position Tracking, FlickGestures, Circle Gestures and SymbolGestures to perform functions such as

on/off, open application, point, click,zoom, scroll, free-space mouse-overand many others. Designers can usethis library to get to market quicklyand reduce development risks bysimply matching their system com-mands to Microchip’s extensive set ofpredetermined and proven gestures.Additionally, the chip provides devel-opers the flexibility to use pre-fil-tered electrode signals for additionalfunctionality in their applications.

MICROCHIP TECHNOLOGYwww.microchip.com/get/S238

IAR Systems® announced the avail-ability of a new product edition tai-lored for small applications develop-ment using IAR EmbeddedWorkbench® for RX. The Baseline edi-tion is targeted at developers work-ing with smaller memory Renesas RXMCUs and is offered at a price sub-stantially reduced from that of the fulledition. The Baseline edition is limit-ed to a code size of 256 KB but pro-vides full compiler and debuggerfunctionality. IAR Systems is announc-ing the new edition alongside the lat-est version of IAR EmbeddedWorkbench for RX, version 2.41.Renesas Electronics’ RX family isavailable in a wide range of memorysizes. For developers working withmany of the popular low-powerRX200 MCUs, the new edition is a

perfect fit. More than half of theRX200 devices fit into the 256 KBlimit of the Baseline edition of IAREmbedded Workbench, and in addi-tion a number of the high-perform-ance RX600 devices are covered. Tosee the memory size of specificdevices, visit www.renesas.com/rx.IAR Embedded Workbench for RXsupports all RX devices. As previous-ly announced by IAR Systems andRenesas Electronics, the highly opti-mized code created by version 2.41together with the RX coreachieve 3.12 CoreMarks®/MHz, a world-recordbenchmark score. Thenew version also addsimproved functionality,including an extendedinline assembler and a

new Call Graph window displayingall calls made to and from each func-tion from any source file in the activeproject.“IAR Systems offer exceptionally pow-erful development tools for our RXseries,” says Ritesh Tyagi, SeniorDirector, Microc ontroller Products &Solutions Marketing, RenesasElectronics America.

IAR SYSTEMSwww.iar.com/ewrx

IAR Systems introduces new product edition for the smaller memory versions of Renesas RX MCUs

Computeron-Modules' concepts to suit ARM SOC

page 12

Remote Sensors Powered by RF Harvesting

MEMS sensorsIndustrial applications requiring a fine touch

Microchip’s new GestIC® technology enables mobile-friendly 3D gesture interfaces

page 32

page 35

EP&Dee | November, 2012 | www.epd-ee.eu2

MEMS sensors have already established themselvesin mobile phones, tablets and so on. Page 32

A very effective platform for this is ULP-COM, aComputer-on-Module concept which embraces allthe important aspects of efficient design-in for ARM-based applications. Page 12

This combination can help to cut costs whilst maintaining audio quality. Page 8

INDUSTRY NEWS COMPANIES

COMMENTS INDUSTRY NEWS

5 The Path into the Post-PC E

5 WIN a Microchip XLP 8-Bit Development Board

INDUSTRY NEWS INTERVIEW

6 Interview with Mr. Tim Tatton, MD at Invotec Group Ltd.

DESIGN MCUs

8 Digital playback: Cutting cost not audio quality.Cutting cost without cutting audio playback quality is a challenge faced by designers of most audio docking stations and other digital audio devices and accessories. But it is a challenge that can be overcome by using the processing power of a 32-bit MCU or 16-bit Digital Signal Controller (DSC) for sample-rate conversion, and a low-cost, high-quality DAC to tune the sample rate to minimise USB clock differences. This combination can help to cut costs whilst maintaining audio quality.

DESIGN EMBEDDED

12 Computer-on-Modules' concepts to suit ARM SOCUp to now, designs of ARM-based applications were primarily marked by their application-specific characteristics and - more often than not - their full-custom designs. Scalable, standardized building blocks especially for ARM- and SOC-based designs can dramatically reduce the development expenditure and speed up time-to-market of embedded applications even with production batches of >200. A very effective platform for this is ULP-COM, a Computer-on-Module concept which embraces all the important aspects of efficient design-in for ARM-based applications.

INDUSTRY NEWS DISPLAY

INDUSTRY NEWS TEST

INDUSTRY NEWS EMBEDDED SYSTEMS

INDUSTRY NEWS ACTIVE COMPONENTS

INDUSTRY NEWS LEDs

INDUSTRY NEWS PASSIVE COMPONENTS

INDUSTRY NEWS SMT

DESIGN SENSORS

32 MEMS sensors - Industrial applications requiring a fine touch.MEMS sensors have already established themselves in mobile phones, tablets and so on. But these tiny sensors can provide more safety, more security, more convenience, more comfort and less power consumption in industrial, medical and home appliance applications too.

35 Remote Sensors Powered by RF Harvesting.

36 Reliable Switching in Rough Environments.

INDUSTRY NEWS CONNECTORS

INDUSTRY NEWS KITS

Table of Contents

NOVEMBER 2012


INDUSTRY NEWS

COMPANIES

Technical distributor FutureElectronics promised to bring newhigher standards of technical andsupply-chain service to OEM buy-ers of power components andmodules with the launch of its lat-est specialist division, FuturePower Solutions. Future Power Solutions has beenorganised to offer in-depth, spe-cialist technical and market under-standing of power technology,while drawing on the global sup-ply-chain capabilities of its parentbusiness, Future Electronics. It willsell a broad range of discretepower components, power mod-ules, and standard and config-urable power supplies to cus-tomers, starting immediately inthe EMEA region. It will alsodevelop and produce custompower solutions via its SystemDesign Centres. Future Power Solutions employsdedicated applications engineersand business development staffserving key customers. These spe-cialists, who can draw on manyyears of experience in applyingadvanced power technologies inelectronics and electrical systems,are organised regionally.

Steve Carr, Technical and VerticalMarkets Director at FutureElectronics, said: ‘The market forOEM power supplies, both interms of distributors and device

manufacturers, is highly fragment-ed. That means there is space forFuture Electronics, a global distrib-utor with world-class capabilities inapplications engineering, invento-ry management and logistics, tomatch small specialist suppliers’technical capabilities while provid-ing superior supply-chain serviceand global reach.’

FUTURE ELECTRONICSwww.FutureElectronics.com

Future Power Solutions offers in-depth powertechnology expertise alongside the global supply-chain capabilities of parent Future Electronics

Avnet Abacus, one of Europe’sleading interconnect, passive,electro-mechanical and powerdistributors, and a business unit ofAvnet Electronics MarketingEMEA, a business region ofAvnet, Inc., has signed a pan-European distribution agree-ment with Fischer Elektronik.Under the terms of the agree-ment, Avnet Abacus will repre-sent Fischer Elektronik, a special-ist in the design and manufactureof thermal management solu-tions, enclosures and connec-tors, as an authorised reseller andwill supply customers throughoutEurope with a broad array of com-ponents from the Fischer productportfolio. With 40 offices locatedin 18 countries, Avnet Abacus hasa widespread presence acrossEurope and is well placed toaccess the extensive customer

base in the region, providing tech-nical expertise in the local lan-guage. An important focus of thedeal will be Fischer’s range of ther-mal management products, which

are designed to provide effectivethermal cooling of a wide range ofassemblies and semiconductorcomponents, including thoseintended for the fast-growing LEDmarket.

AVNET ABACUSwww.avnet.com

Avnet Abacus seals pan-European franchise dealwith Fischer Elektronik

Rutronik Elektronische BauelementeGmbH and Panasonic IndustrialDevices Sales Europe (PIDSEU)have now extended their existingfranchise agreement: With imme-diate effect, the distributor willmarket the manufacturer's passiveand electro-mechanical compo-nents throughout Europe. Until now, the franchiseagreement has beenrestricted to CentralEurope (D/A/CH). Withthis extension, Panasonic ispursuing its aim toincrease its market shareon the continent. “In this,we are relying onRutronik's technical com-petence, which hasallowed the distributor toundertake an unusual number ofdesign-in activities and therebyachieve above average growth,”explains Christian Bail, SalesManager Broadline DistributionEurope at Panasonic Industrial

Devices Sales Europe. Rutronik markets all of PIDSEU'spassive and electro-mechanicalcomponents (switches, poten-tiometers, encoders), especially tothe Automotive, Industrial, HomeAppliance, Lighting, Medical andAlternative Energy markets.

The flagship technologies areelectrolytic capacitors, shunt resis-tors and batteries.

RUTRONIKwww.rutronik.com

As the new CEO of the MSCGleichmann-Group, LotharKümmerlin is taking over globalbusiness operations at the inter-national technology enterprisebased close by Karlsruhe(Germany). He will be supportedin his new assign-ment by JohannesAlberti, who isresponsible as theCFO for the Financeand ControllingDivisions.Lothar Kümmerlinhas worked at thecompany since1987, most recentlyas director of the EmbeddedComputer Technology Division,which will undergo a significantinternational expansion in future.He also has responsibility for theDistribution Division, which con-stitutes a pillar of strength withinthe MSC Gleichmann-Group.Johannes Alberti previouslyworked at a listed medium-sizedcorporation and has been incharge of finance at the MSCGleichmann-Group as director

since 2011. In addition, he willalso head the Human Resourcesand IT Division. Company founder ManfredSchwarztrauber remains themajority shareholder and willcontinue to support the compa-

ny in an advisoryrole in future. Thetransfer of opera-tional managementto his long-timedeputy LotharKümmerlin ensuresthat clients canretain confidence inthe tradition andcontinuity of this

medium-sized enterprise. “Wewill to continue the successful workof Manfred Schwarztrauber andsee potential in the synergiesbetween our three business divi-sions - Distribution, EmbeddedComputer Technologies andDisplay Solutions division whichwe will expand significantly”,explains CEO Lothar Kümmerlin.

MSC-GLEICHMANN-GROUPwww.msc-ge.com

New top executive at the MSC Gleichmann-Group

Rutronik and Panasonic agree on pan-Europeancooperation

www.epd-ee.eu | November, 2012 | EP&Dee 5

The Path into the Post-PC Era The term “post-PC” is an official Apple corporate propagandaphrase, coined by Steve Jobs and promoted most of all byhardcore Apple loyalists ever since. In the near future, the con-cept of a personal computer may be radically different than itis today. Soon a phone could be smart enough to not just be acomputer but it could be my computer. It will be a world where the only computer you will ever need,is a mobile one. Call it a phone, call it a tablet, or just call it acomputer. The next generation of computers is poised toenable truly personal computing experiences. These deviceswill be tuned to the specific needs of its owner with an un-thinkable amount of computing resources at its disposal.Computational resources will be harnessed locally throughpowerful 48 core CPUs combined with a near limitless supplyof remotely accessible cloud computing capacity.Powerful multi-core mobile PCs play a central role in both ourpersonal and professional computing lives. The one mobilecompute device of the future will be in the hand and will auto-matically and wireless connects to a 30-inch display when theowner walks into the office. He has a touch, a keyboard, a mouseand voice to interact with it. It changes the whole concept ofwhat it is and what it can do. In 10 years, the devices we carry willbe continually using any information available to them to makebetter decisions. A continuous stream of location, identity, ad-driven information and presence status will all continually be cal-culating to help us do the stuff we do better and faster. To enable all these, 48-core chips for small mobile devices couldhit the market “much sooner” than the researchers’ 10-year pre-diction. The industry is working on finding new ways to use andmanage many cores in mobile devices. With many cores, some-one could, for instance, be encrypting an email while also work-ing on other power-intensive apps at the same time. Industry pundits have faith that by the time this complex hard-ware is ready, the software will be, too. These days, 5 to 10 yearsis somewhat of an eternity in technology time. If we are going tohave this technology in five to 10 years, the smart phone will nothave just one camera. It would have two to three cameras thatare always on. It could build a three-dimensional map of what it’slooking at and do object recognition. Users could finally dothings that take way too much processing power today. n

(inspired and adapted from Forbes)

Radu Andrei

EP&Dee is giving you thechance to WIN a Microchip XLP 8-Bit Development Board(DM240313). The XLP 8-bit DevelopmentBoard provides a low-cost,highly configurable develop-ment system for Microchipsnew line of extreme-low-power

8-bit PIC18F or PIC16FEnhanced core microcontrollersthat allow for design of sleepcurrents down to 20 nA. Theboard supports developmentfor the PIC18F87K22 orPIC16LF1947 MCUs, whichhighlight the capabilities ofeach product family. The boardcan be powered by five differ-ent power sources includingbatteries or energy harvestingmodules (sold separately), and

it supports a variety of commoncomponents that can be selec-tive enabled. The board is alsoexpandable through the on-board PICtail connector thatpermits the addition of capabil-ities such as RF connectivity.The kit includes a USB cable, aPower Measurement cable, a

Quick Start guide and aPIC16LF1947 PIM. The board issuitable for prototyping manylow power applications includ-ing RF, temperature sensors,electronic door locks, LCD ,remote controls, security sen-sors, smart cards, and energyharvesting. The PICtail™ inter-face supports Microchip’sextensive line of daughter cardsfor easy evaluation of your nextlow power application.

WIN a Microchip XLP 8-BitDevelopment Board

For the chance to win a Microchip XLP 8-Bit Development Board,please visit: www.microchip-comps.com/epdee-xlp

XLP 8-bit Development Board Features:• PIC18F87K22 (128KB Flash, 80-pin PIM) installed• Supports other PIC16LF1947 (28KB Flash, 64-pin PIM)

Separate/Un-programmed• Current measurement terminals allow device or board level current

measurements• Expansion connector accessing full device pin-out and breadboard

prototype area• Convenient connections for MPLAB PICkit 3, ICD 3 or REAL ICE for

in-circuit programming and debugging• USB interface for power and PC communication• 24AA256 Low Power (100nA Sleep, 1.7V Vdd) SPI serial-EEPROM• Potentiometer (connected to 10-bit A/D, analog input channel)• Analog output temperature sensor and CTMU based diode

temperature sensor• LEDs for indication• Power Options: AAA, CR2032, Energy Harvesting, USB, External,

or 9V power supply


INDUSTRY NEWS

INTERVIEW

The company’s sale output figures reached arecord- high in July this year, reaching over 2.7million Euros, what do you think this means forInvotec Group’s future? We have demonstrated in a tough marketplace that we can continue to grow our marketshare & gain new customers. We have alsodemonstrated that our facilities can convertthese opportunities into customer deliverieswith ever increasing demands.

Invotec Group Ltd appointed a new MD, TimTatton in recently this year. What does MrTatton see as his main goal for Invotec GroupLtd and what changes will Mr Tatton be imple-menting in his new role?Our primary goal is to con-tinue to deliver the technol-ogy, quality & service thatour customers demand.From that perspective noth-ing changes. What we aim todo differently, is invest evenmore in our facilities & espe-cially our people to make Invotec’s positioneven stronger moving forward. We are embark-ing on a much more focussed approach torecruitment, training & development & we areincreasing capital investment levels also.

Invotec Group has recently acquired a share-holding in additive electronics and integrationspecialists, Printed Electronics Ltd (PEL). Whatdoes Invotec Group hope to gain from this part-nership and how will this affect the company?PE is a technology which is very much in itsinfancy. We see possibilities for putting elec-tronics in applications where they don’t current-ly exist. Our interest would be in niche applica-tions, in much the same way as our current PCBportfolio, we are not necessarily interested inhigh volume consumer packaging for example.To this effect, we already have some Invoteccustomers who are interested in this technologythrough projects with PEL. The effect onInvotec in the short term will be relatively smalluntil the technology develops further beyondthe proof of concept stage.

Invotec Group has announced the developmentof its Student/Graduate Apprentice programme.Why has Invotec decided to make this commit-ment to younger generations of Engineers andhow will this benefit the company?

We are based in the Midlands which has athriving automotive & aerospace sector withsome large players in close proximity. It istough for SMEs such as Invotec to recruit expe-rienced or graduate engineers when we havelarge corporations literally employing scores ifnot hundreds of graduate engineers each year.For this reason we decided to take talent fromlocal schools/colleges & develop them our-selves, with education & practical training tai-lored to our needs.

Why has Invotec Group decided to exhibit atElectronica this year and what does the compa-ny hope to achieve whilst they are at the event? We have chosen to exhibit as we plan to bemore European focussed. We already have sig-nificant exports to Europe, but our aim is togrow this proportion of our sales. This applies in the military & civil aviation sec-tors & especially the space sector. This exhibi-tion reaffirms our commitment to theEuropean Market place.

Invotec Group won 4 customer awards thisyear, how does the company plan to build onthis success and further strengthen its relation-ship with its customers? We are committed to the SC21 process (SupplyChains 21st Century) which is driven by themajor Aerospace OEMs. This process encom-passes business & manufacturing excellence,underpinned by Lean Manufacturing & continu-ous improvement. Ultimately this delivers con-sistent cost, quality & delivery for our businessand our customers. Over time we expect to con-tinue this process & continue our improvement.

We are confident this will push us towards thetop performers to our customers, not just withinPCB suppliers but across all categories.

Invotec Group was recent bought by Rubiconpartners, how has this changed the company?Invotec has a good reputation for technology& quality in a very demanding sector.However, we are seen as quite conservativegiven the talent & capabilities we have. With alarger, more financially powerful backer, weare open to grow more aggressively bothorganically and potentially through acquisitionof companies with a similar profile in differentterritories. Our new shareholders wish toleverage our technology, quality & strongfinancial performance on a larger scale.

Will you be announcing any company news atthe show?We will be announcing further news ahead ofthe show regarding significant new capitalinvestments & also news of a further customer

award. We can then share this news with ourvisitor at the show.

What do you see as the main current chal-lenges in your sector? As with most sectors, general economic uncer-tainty is always a concern. Clearly defencespending is under threat, but electronics is play-ing an increasing role in defence so this isn’t nec-essarily all bad news. Visibility is certainly short-er than it historically used to be in this sector.We feel that our strategy will equip us well forthe challenges that lie ahead. n

Interview withMr. Tim Tatton,MD at InvotecGroup Ltd.

8

Digital audio systems consist of a docking sta-tion and an audio device: the serial stereo audiodata, streamed from the digital audio source viathe dock’s USB interface, is captured and routedto a Digital-to-Analogue Converter (DAC) at aset sample rate. Figure 1 details the compo-nents: a serial data-input channel; deserialiser;

sample-rate adjustment circuit; DAC with out-put filtering; and audio power-output stage.Not all of digital audio sources use the samesampling rate, so the dock typically adapts thesampling frequency to the source, or convertsthe sampled data stream into a common datarate. The first challenge, therefore, is to per-

form the sample-rate conversion at the lowestcost without degrading audio quality.Typically, designers have used a dedicatedsample-rate conversion circuit or a high-endaudio DAC that incorporates complex phase-locked loops to ensure flexible sample ratesfor stable communication of the sampledaudio data. However, whilst USB provides aconvenient interface for transferring audiodata, USB jitter produces a subtle loss of audioquality meaning that, in addition to convertingsample rates, a sample-rate converter mustalso mitigate USB jitter.

Understanding digital audioAnalogue audio is converted into digital for-mat, by sampling the analogue signal at a fre-quency which is at least twice the highest-fre-quency component in the analogue signal, orthe Nyquist rate. An audio signal of 0 to 20kHzcan, therefore, be sampled at a data rate of44.1kHz, which is the appropriate Nyquist rate,so that the signal can be reconstructed withoutaliasing when converted back to the analogue

DESIGN

MCUs

Figure 1: Block diagram of a typical audiodocking station or device accessory.

Cutting cost without cutting audio playback quality is a challenge facedby designers of most audio docking stations and other digital audiodevices and accessories. But it is a challenge that can be overcome by

using the processing power ofa 32-bit MCU or 16-bit DigitalSignal Controller (DSC) forsample-rate conversion, and alow-cost, high-quality DACto tune the sample rate tominimise USB clock differences. This combination can help tocut costs whilst maintainingaudio quality.

by Jayanth MadapuraSenior Applications Engineer High-Performance Microcontroller Division Microchip Technology Inc.

Digital playback: Cutting cost not audio quality

EP&Dee | November, 2012 | www.epd-ee.eu


domain. In addition to the sampling rate,designers have to decide whether the resolu-tion of the conversion will be a 16-bit word ora 24-bit word. For compact disc (CD) audiofiles, the standard is 16-bit resolution with a44.1kHz sample rate. However, there are high-er-performance options for audiophiles, suchas encoding the data at 24-bit resolution andincreasing the sampling rate to 96kHz. Foraudio professionals, the audio files are encod-ed with a resolution of 24 bits per sample,which provides sufficient headroom when theaudio is mixed and manipulated by the studiosin preparation for creating the master.The choice of resolution allows the designer totrade-off sound quality against the file sizeeven when compression is applied. Larger res-olutions provide higher audio quality, butmean that the storage file size will be larger.For example, a 4-minute stereo audio file witha 44.1kHz sample rate and 16-bit resolution,requires a file size of about 42 Mbytes.However, if the resolution is reduced, less stor-age would be required. With a resolution of12 bits, the audio file size would drop toaround 30 Mbytes, but at the expense of rela-tively lower audio quality. The USB interface is capable of streaminghigh-quality audio and is popular among manyaudio users. With its universal ease-of-use,USB audio can transfer high-resolution andhigh-sample-rate audio with negligible jitter,when packaged with a flexible audio interface.Isochronous data transfer is used to streamaudio data to and from a source at a constantrate in real time. Stereo audio data packets,with size governed by the sample rate of theaudio stream, are transferred as part of USBframes every 1 ms on the USB full-speed link.USB audio also provides controls for featuressuch as volume, tone, gain control, and equalis-ers, among many control and processing units.

Quality versus costThe difference between bit rates and samplerates means that the hardware in the playbacksystem or dock must be able to handle the dif-fering-rate data streams. To do this, thedesigner has three options: the system musteither use a more complex, and thereforemore expensive, DAC to phase-lock to eachsample rate and adjust itself to each playbackoption; or use an external sample-rate con-verter IC with the low-cost DAC; or convert allthe streams into a standard sample rate and bitrate using an algorithm running on a microcon-troller (MCU) that a simple low-cost DAC canhandle. Figure 2 shows these options.These solutions are used by many playbacksystem designers. In one scenario, a designerpurchases an off-the-shelf SRC and DAC solu-tion to do the sample-rate conversion andDAC playback. An alternative solution com-bines an SRC IC with a low-cost DAC. Thissolution is optimised for a high signal-to-noise

ratio, low power, and minimal jitter, however,the SRC chip adds to the total system cost.Another alternative is to use a more expensiveaudio DAC that contains the phase-lock cir-cuits and switched capacitor filters to handlethe fractional clocks so that they can lock ontoeach of the different sample-rate data streams.Although these approaches are all viable, theyall either require an extra chip, or a higher-costDAC. However, by using a relatively powerful32-bit microcontroller or 16-bit Digital SignalController (Digital Signal Controller) which candeliver performance levels of 40 to 80 MIPS,designers can eliminate the need for an exter-nal rate-conversion chip. This is because the32-bit MCU or 16-bit DSC is able to performsample-rate conversion on-chip, without com-promising audio quality. Since the SRC outputsample rate is constant, a low-cost, high-quality24-bit audio DAC can be used.

Many systems use an 8- or 16-bit embeddedMCU to handle all the housekeeping functions,such as communicating over the USB interface;controlling the display; button control; volumecontrol; and interface management. Microchip’shigh performance PIC32 MCUs and dsPIC33EDSCs can be used to perform SRC on-chip andcan also to perform all of the system interfaceand housekeeping functions. For example, byusing a high-performance MCU, the sample-rateconversion can be performed whilst maintainingaudio quality, since the intermediate calculationsare 32 bits. Any deterioration due to truncationof the calculated values is therefore avoided.The dsPIC33E DSCs and PIC32 MCUs, shown inFigure 3, provide a choice of on-chip resources,such as non-volatile Flash memory, static RAM,and peripherals, to enable designers to use themost suitable variant for their system. Somedevices also offer low power consumption foruse in power conscious applications.

Using an MCU for sample-rate conversionSample-rate conversion can be achieved, formost common audio sampling rates, by using

the SRC algorithm to convert real-time audiodata sampled at 44.1kHz or 32kHz to a sam-pling rate of 48kHz. To accommodate the USBlink frame rate, the size of the input audio dataframe is an interval of 1 ms, with 64 stereo sam-ples for 32kHz input, or 88 or 90 stereo sam-ples for 44.1kHz input. The output consists of96 stereo samples per 1ms.In a typical SRC block, the incoming audio datapasses through an up-sampler or an interpola-tion stage. The signal then passes through ananti-aliasing low-pass filter, followed by a down-sampler or decimation stage. A simplified sample-rate conversion circuit isshown in Figure 4. Assuming conversion from a32kHz to a 48kHz sample rate where the con-version factor is 3:2, the input is up-sampled bya factor of 3, followed by a FIR filter with a steeproll-off to smooth the signal. A gain factor of 3 isapplied to the smoothed signal to compensate

for the loss caused by inserting the zeros. Theresulting intermediate signal is down-sampledby a factor of 2 to obtain an output audio signalat a sampling rate of 48kHz. Since down-sam-pling creates redundancy in the filtering of thesample that is decimated, the filtering of thissample can be skipped. This simplified form ofthe polyphase filtering technique improves thespeed of the SRC. For a 44.1kHz to 48kHz sam-ple-rate conversion, where the conversion fac-tor is 160:147, the processing block is as fol-lows: The input is up-sampled by a factor of 2by inserting a zero after every input sampleand applying a FIR filter to smooth the signal.A gain factor of 2 is applied to the smoothedsignal to compensate for the loss caused byinserting the zeros. Polynomial interpolation isused to reduce every sequence of 147 sam-ples at 88.2kHz, to 80 samples at 48kHz. Thisensures that the sampling rate of the outputaudio data is 48kHz. Polyphase filtering is alsoemployed in this mode to reduce redundancy.The overall processing load is dominated bythe filter, with a trade-off between filter lengthand the quality of the outputs.

DESIGN

EMBEDDED

Figure 2: Playback options:

cost versus performance

trade-offs.


Microchip’s code library includes a free sam-ple-rate conversion (SRC) algorithm whichprovides good SNR and requires around 30MIPS of processor bandwidth, 6 KB of Flashand 1.5 KB of RAM.

Mitigating USB clock mismatchA tolerance budget and a limit on the USB clockfrequency are included in the USB specifica-tions to achieve immunity to radio interference.The USB clock with the allowed tolerancebudget results in reduced audio quality if thereis USB clock mismatch. The real-time streamingaudio samples must arrive at precise and regu-lar time intervals so that the DAC can convertthe digital samples to an analogue signal withthe expected constant rate at which it is config-ured. The DAC clock that expects and receivesthe audio samples at a particular sample ratemust not miss a single sample. For the listener, amissing sample becomes a slight click, since theDAC fails to generate an accurate representa-tion of the streamed audio signal. On a MCU ormicroprocessor with embedded USB module,the USB clock is sourced from an independentclock such as an on-chip PLL with an externalcrystal oscillator of a specific value. Since theclock is not sourced from the USB interface, themismatch in clocks introduces buffer over-runor under-run, which causes clicks, as shown inFigure 5. An easy answer to the problem of

audio data under-run or over-run is to use agood Asynchronous Sample Rate Converter(ASRC), where the input sample rate is estimat-ed with jitter attenuation, and the internal filtersare dynamically tuned for a new sample rate.

The trade-off here is that a good ASRC is veryexpensive and the system will still need a DACfor analogue conversion.

An alternative solution, which is both effectiveand low cost, is to buffer the USB audio packetsand tune the DAC clocks using a feedbackmechanism to prevent under-run or over-run.

The feedback mechanism monitors the bufferlevel and ensures that it stays within an accept-able range, while achieving at least the same, ifnot better, quality achieved by an expensiveASRC. One option is to use the DAC with a PLLthat allows fractional tuning of the sample ratebased upon buffer-level feedback. This solu-tion is relatively less expensive than an ASRCchip. The PIC32 MCUs and dsPIC33E DSCshave a flexible independent system clock PLL,and a USB clock PLL with independent clocksources. The USB PLL can be clocked with anexternal crystal to achieve the exact 48 MHzUSB clock required. The system clock can besourced from the Fast RC (FRC) clock. On thePIC32 and dsPIC33E devices, the FRC clock istunable and can be configured to tune the DACclocks. This prevents buffer under-run andover-run while maintaining an acceptable DACsample rate with a swing range of 0.2%. Of thethree possible solutions, this is the lowest-costsolution whilst still achieving low power.

SummaryThe trade-off between cost and audio qualityin docks or device accessories can be mitigat-ed by adapting to the sample rate of thesource or converting the sampled data streaminto a common data rate. USB clock mismatchmust also be addressed by tuning the samplerate to prevent buffer over-run and under-run.By using a MCU for sample-rate conversionand sample-rate tuning, the external chipcount can be reduced to minimise system costand maintain high audio playback quality.A 32-bit MCU or 16-bit DSC, such as thePIC32 and dsPIC33E, can perform sample-rateconversion as well as interfacing to a low-cost,high-quality DAC which can tune the samplerate to address the problem of USB clock mis-matches. These MCUs and DSCs provide arange on on-chip features which provides theflexibility to manage the trade-offs which are

inherent in maintaining high audio qualitycombined with low power consumption andthe lowest possible system cost. nwww.microchip.com

DESIGN

EMBEDDED

Figure 3: The PIC32 MCUs with a MIPS processor core handle sample-rate conversion and housekeeping functions.

Figure 4: Simplified sample-rate conversion circuit.

Figure 5: Clock jitter causes DAC under-run or over-run resulting in audible clicks.

12

DESIGN

EMBEDDED

For a long number of years, ARM technologyhas been the established technology for dedi-cated systems, whether in set-top boxes,receivers, switches or as simpler smart inter-faces for higher-quality white goods. Newapplications, like smartphones and tablets,have emerged which bring ARM technologycloser to the application areas of ×86 architec-ture. And with this, ARM technology – evenjust because of its enormous sales impact inthe consumer market - has become very inter-esting for embedded designs. This mainstreamsuccess makes it possible to offer a powerfulembedded roadmap. Often though, full-cus-tom designs play an important role, as many ofthese solutions are sold in particularly largenumbers.

Scalable building blocks are requiredWhat is however the case with embeddedapplications with quantities that make full-cus-tom designs non-economical? Here, develop-ers and OEMs need a solution which delivers abalance between development time and costson the one hand and average costs on theother. This is where scalable building blocksare an ideal solution, as OEMs can quickly andsimply design them into their applications and

they offer maximum flexibility and designsecurity. It is also ideal if OEMs can integratethe ARM processors into their applications viabuilding blocks which have already been vali-

dated. By doing this, OEMs can save signifi-cantly on resources, which in turn can consid-erably reduce the Total Cost of Ownership ofthe whole application.

Up to now, designs of ARM-based applications were primarilymarked by their application-specific characteristics and - more oftenthan not - their full-custom designs. Scalable, standardized buildingblocks especially for ARM- and SOC-based designs can dramaticallyreduce the development expenditure and speed up time-to-marketof embedded applications even with production batches of >200. A very effective platform for this is ULP-COM, a Computer-on-Moduleconcept which embraces all the important aspects of efficient design-infor ARM-based applications.

by Gerhard SzczukaProduct Manager for Computer-on-ModulesKontron Europe

Computer-on-Modules'concepts to suit ARM SOC

EP&Dee | November, 2012 | www.epd-ee.eu

Current ARM processors are on the same performance level as Intel Atomprocessor technology while offering significantly lower power consumption.


ARM-COMs on the advanceComputer-on-Modules are such buildingblocks and the COM concept with additionallypurchased and integrated components andapplication-specific carrierboard is gainingpopularity. Figures from IMS Research confirmthis trend. In 2011 39% of all COM shipmentswere ARM-based modules, the majority ofwhich were full-custom designs. Up to 2016 it isexpected that they will account for a massive59% of the module market. The market's needfor ARM-based COMs is therefore giganticand will experience a further sharp increase.ARM-COMs will not however replace current×86 designs but penetrate market segments inwhich ×86 technology to date – due to price,power and TDP restrictions - was not able toenter. Target applications are to be found pre-dominantly in areas with graphical user inter-faces featuring touch screen control, whereupgrades from simple line displays to full-graphic support with minimum power con-sumption are taking place or migration from×86 platforms to ARM is required. Applicationscenarios are, for example, medical devices,handheld devices in harsh environments, solar-driven outdoor devices, like ticketing machinesfor parking, electric pumps for e-cars or digitaladvertising at bus stops. Vehicle applicationsfor fleet management or digital signage/info-tainment in buses and trains and mobile testingequipment as well as kiosks, cash- and weighingsystems are further examples.

High performance low consumptionWhat though makes ARM processors onCOMs so interesting? Current ARM proces-sors in dual- or quad-core configurationsdeliver a performance on the level of IntelAtom processors. On average, the power con-sumption during operation is under 2 watt.There are also many ARM-SoCs available forthe extended temperature range. This meansthat, all in all, passive cooling solutions can bekept very simple and complete devices can becreated which are compact and cost-efficient.The demands of ARM SoC in terms of powersupply are much lower than the voltage pro-cessing needed for ×86 platforms, which fur-ther reduces development effort and costs.What's more, ARM processors boast a long-term availability of up to 15 years.

Still no uniform COM standardARM processors, however, 'come by' theirhigh energy efficiency through their designswhich are tailored to meet specific applicationscenarios. Quite different from ×86 technology,which connects application-specific peripher-als and interfaces via generic data buses likePCI, PCI Express or USB, ARM processors inte-grate dedicated controllers and interfaces.This dedicated form of I/O of the differentARM SoCs has to date led to proprietaryCOM designs which usually were developed

on a specific ARM System-on-Chip. An addi-tional issue is that ARM SoCs use differentinterfaces than ×86 technology does for simi-lar tasks. An example are MIPI interfaces forsmall, inexpensive displays and cameras ratherthan DisplayPort or USB in the case of x86designs. The SPI Serial Peripheral Interfaceinstead of PCI or PCI Express is used in ARMdesigns much more frequently for connectingperipherals and data storage or extensionmodules are connected via SDIO and not fre-quently via SATA. So, all in all, COM conceptslike Qseven or Core Express®, which were orig-inally developed for ×86 processors are notideal for ARM designs. If they have to remainwithin the specification, ARM variants can onlyhave the smallest common denominator ofinterfaces implemented. That, however, limitsthe usability of such modules considerably, asthe non-defined pins can be used by any man-ufacturer for different purposes. With that,one of the basic ideas of COM technology, di -fferent sources and reliable standard docu-mentation, crumbles. To date there is no over-all Computer-on-Module available which satis-

fies the expectations of a COM specificationwhich is as universal as possible.

A new standard is requiredIn order to be able to create such a multi-func-tional and long-term available COM standard– as has been successfully achieved in the ×86with COM Express® - a new COM specificationhas to be created. A platform has to be devel-oped which, based on its plug-in connectorand the largest possible selection of usableARM-specific interfaces, integrates severalSoCs with different performance classes.Together with other embedded firms whichare globally successful, Kontron has thereforedeveloped a Computer-on-Module standardespecially designed for ARM and SoCs whichoffers the industry an optimized pin-out andthe highest level of design safety: ULP-COM.With this new specification Kontron has made

it possible for OEMs to reduce their develop-ment time for ARM-based applications byaround nine months.

The ULP-COM specificationThe new specification for Ultra Low PowerCOMs has been designed to suit the typicaldemands of new mobile and – more often thannot – battery-driven applications. Mobiledevices, like embedded tablets, have to be slim-ly built while still offering room for additionalcomponents or coming higher performanceSoCs. Therefore, ULP-COM specifies right fromthe start two different module sizes: a shortmodule with 82 mm × 50 mm and a full-size mo -dule measuring 82 mm × 80 mm. The module'width' of 82 mm is defined by the connectorand with that cannot be altered. The shortmodule is suitable for compact handhelddevices, which fit into a closed hand. Full-sizemodules offer enough space i.e. for future, high-er performance SoCs designs which need morespace for heat dissipation. The standard offersgreat flexibility right from the start and enoughroom for up- and coming developments.

Compact, flat designsOne of the most important issues for thesenew applications is the flat build of the modu -les. The connector between the module andthe carrierboard has the greatest influence. Itdictates the minimum thickness which is possi-ble. ULP-COM modules rely on the MXM 3.0plug-in connector. The plug is just 4.3 millimeters thick and thusallows for especially flat designs with a boardto board distance of just 1.5mm. Applicationswith a total thickness of just under 9 mm arepossible, this thickness is therefore only fur-ther influenced by the interfaces which thecustomers requires. The plug-in connector has proved reliable indedicated graphic cards in notebooks and isavailable from several manufacturers. So it isnot just an established but an inexpensive andabove all long-term available solution.

DESIGN

EMBEDDED

ULP-COM specification defines two different module sizes: 'short' and 'full size'.


Numerous signaling linesOn the electrical side, the connector offers atotal of 314 pins. 33 are reserved for signalinglines for power supply and grounding, soeffectively the ULP-COM offers 281 signalinglines. That means 50 more than, for example,the MXM 2.0 connector had, which amongstothers is used on Qseven Computer-on-Modules. A high signal capacity is therefore anespecially important issue, as the number ofavailable signal pins is the basis for the mostextensive and at the same time versatile pin-out of the Computer-on-Modules. In this way,significantly more dedicated interfaces can bespecified on the connector.

A special feature of ULP-COM is the so-calledAlternate Function Block (AFB). This is a set of20 signaling lines which are reserved in thecurrent specification for application- and man-ufacturer-specific usage. In future versions ofthe specification new standard functions cantherefore be assigned to these reserved sig-naling lines. This ensures that the specificationcan flexibly incorporate future technical devel-opments which today are not even on thecards, while still upholding full compatibilitywith existing designs.

First modules available soonAlready, Kontron is developing the first threeComputer-on-Modules according to the newULP-COM specification. The first module isthe Kontron ULP-COM-sAT30. According to the ULP-COM specification itmeasures just 82 × 50 mm and integratesNvidia's Cortex A9 processor design Tegra 3Quadcore with 800 MHz. The module is des-tined for graphic-orientated applications suchas digital signage or media players. To fit thisbill, it offers superior high-end graphics withdedicated interfaces for two independent dis-plays including hardware-accelerated HDvideo decoding for MPEG2 and HD videoencoding as well as 2D and 3D acceleration. Flexible display connection is carried out viaparallel LCD, LVDS 18 bit single channel and

HDMI. Further to this, the Kontron ULP-COM-sAT30 supports camera connection via twodual-lane CSI camera ports.

Manufacturer-independent standardWith all these technical advantages of the ULP-COM specification, the question of manufac-turer-independent offerings of modules andservices as well as the supervision of a manu-facturer-independent panel arises. This is amajor criterium to ensure that a standard actu-

ally becomes a standard. Kontron and Adlinkrely on the newly founded manufacturer-inde-pendent Standardization Group forEmbedded Technologies e.V (SGET). TheSGET already has received the ULP-COMspecification for ratification. The SGET workgroup plans to examine this specification atshort notice and to approve it as an officialSGET specification as soon as possible. Withfurther embedded companies like ADLINK,Fortec and Greenbase more modules and car-rierboards are being developed.

Kontron already has a carrierboard availableand a starter-kit in the pipeline which willbecome available in Q4. This allows customersto immediately start testing their embeddedtarget platforms. Apart from these standardproducts, Kontron also offers extended com-plementary services for its platforms to speedup hard- and software integration.

Software servicesIn addition to obtaining the right hardwaredesign, ARM requires substantial support onthe software front. In order to pave the wayfor developers to enter this PC-like ARM tech-nology as easily as possible, Kontron offers awide range of software services. As ARM doesnot 'entertain' a BIOS as such, a bootloader isresponsible for the start and the rest is takencare of by the operating system.

If the application is, for example, to be run onthe Android operating system to profit from auniform Look & Feel on all platforms, certaininitial requirements have to be fulfilled foreach ARM processor. An ARM-optimizedLinux kernel has to be equipped with the driv-ers for the required peripherals and preparedfor operation via several patches. This is thebasis on which the application framework ofAndroid can be superimposed. This has beendesigned as such, in order to create a uniformLook & Feel on different devices. Androidachieves this by integrating a HardwareAbstraction Layer (HAL) which presents theapplication framework with the interfaces tothe hardware in the form of abstract modules.

This requires manufacturers of ARM-basedhardware however to guarantee that all com-ponents are available respectively as HALmodules for the software level and are further-more anchored in the application framework.The effort therefore required in terms ofoperating system integration is considerable.Kontron has a solution which saves customerscarrying out this very time-consuming work,ARM hardware platforms are provided notjust as barebones but increasingly equippeddirectly with the fitting software support and –if so required – with the necessary licenses. n

www.kontron.com

DESIGN

EMBEDDED

The extremely thinly built MXM 3.0 connector (4.3 mm) allows for the deve -lopment of compact handheld devices.Owing to the 314 pins a large number ofdedicated I/Os in current and future SoCand ARM processors can be assigned.

The Kontron ULP-COM-sAT30 measures just 82 mm × 50 mm asdefined in the ULP-COM specificationand integrates Nvidia's Tegra 3Quadcore processor with 800 MHz.

The second new module is the highly scala-ble Kontron ULP-COM-sAMX6i with single,dual or quad core ARM® Cortex A9 tech-nology. Based on Freescale’s i. MX6 Seriesprocessors, they cover an extremely wideperformance range with a balanced proces-sor and graphics performance. The KontronULP-COM-sAMX6i Computer-on-Modulesexceed the traditional scale of longevitywith their availability of at least ten years.

Furthermore they support the extendedtemperature range from -40°C to +85°C by-design. Thus this new module family is idealfor market sectors demanding highestruggedness and long-term availability, suchas for example transportation, medical andmilitary based on open standards software.

And a third ULP-COM module will be com-ing soon. It will be based on the TexasInstruments Sitara AM3874 with ARM®Cortex™-A8 microprocessor (MPU) and willprovide a wide range of choices for integra-tion onto industrial applications.

Those modules offer peripherals for highbandwidth connectivity such as SATA, DualCAN, PCI Express (PCIe) and a GigabitEthernet switch.


INDUSTRY NEWS

DISPLAY

At this year's electronica,Electronic Assembly will be showa starter kit that allows you toquickly explore and enter theworld of intelligent displays. Thekit comprises an evaluation boardfor the EA eDIPTFT43-ATP dis-play type as well as a USB cable,touch panel, and mini DVD con-taining software, documentation,and sample macros. The evaluation board contains aUSB connection for communicat-ing with the PC and additional,optional interfaces such as RS-232, I²C, and SPI for networkingwith the host computer of the tar-get application. An externalpower supply is not required. Aseries of LEDs provides informa-

tion about the data traffic and sta-tus of the eight digital outputs onthe display. The evaluation boardfeatures two potentiometers and

eight buttons to simulate sensors,switches, or relay contacts in thetarget application.

ELECTRONIC ASSEMBLYwww.lcd-module.de

Electronic Assembly markets abroad spectrum of top-qualityindustrial displays to customers ina number of industries rangingfrom process automation andmachinery manufacturing to IT. Ahigh level of vertical integrationenables the company to keep alarge portion of the value-addchain in house. Because ElectronicAssembly offers all the familiaradvantages of a mid-tier compa-ny, it has the flexibility to accom-modate the wide-ranging needsof its customers. The product portfolio extendsfrom simple seven-segment instru-mentation displays to sophisticat-ed color touchpanel displays foruse at information booths or incomplex system controllers. Thewide-ranging portfolio includesfor example products designedfor extremely low power con-sumption as well as display mod-ules for special markets and appli-cations such as Cyrillic fonts.The company philosophy atElectronic Assembly is based on asimple vision. The senior manage-ment team of Stefan Eber andCarola Wittmann along with theentire staff is fully focused on“making things easy”. This vision isreflected in the design of the com-pany’s products. The displays havea built-in controller which makesthings a lot easier for design engi-

neers. High-level language func-tions eliminate the need for sys-tem-level programming by thecustomer. The display controllersare shipped with an extensive setof sophisticated, pre-packagedgraphic functions such as anima-tion and bar graphs. Developerscan access these features with sim-ple function calls. There is no need

to write and test assembler pro-grams for these functions. Many ofthe displays run right out of thebox. The customer can get prod-ucts to market much quicker and atlower cost. Electronic Assemblyhas its own engineering develop-ment group and helps shape thetechnological landscape. In-houseproduction, which is not necessari-ly the norm in today’s market envi-ronment, puts the company in fullcontrol of quality and gives it thatlittle bit of extra flexibility whichfrom the customer perspectiveoften makes the crucial difference.


ELECTRONIC ASSEMBLY – Displays designed to make things easy

Available starting immediately: starter kit with TFTEA EVALeDIPTFT43 and 480 × 272 Pixel Resolution

Electronic Assembly developed itsEA DIP203-4 LCD module forapplications that require excep-tional readability and will beshown it at the electronica 2012.The module features a high-con-trast, alphanumeric LCD super-twist display for four rows of textat 20 characters per row. The dot-matrix display comes inthree variants. Users can choosefrom black text on a yellow/greenbackground, white text on a bluebackground, and black text on awhite background. An automatictemperature compensation facili-ty eliminates the need to adjustthe contrast. The display is drivenby a built-in controller of typeSSD1803, which is 90% compati-ble with the popular HD44780controller. The character set thatships with the display supports240 letters, numbers, and sym-bols; users can also define eightcharacters of their own. The con-troller receives its control com-mands via a fast SPI interface.

A 4 and 8-bit databus interface isalso available for the display. TheEA DIP203-4 is particularly easy toinstall, since no mechanical assem-bly is required. Simply insert themodule into the circuit board and

solder! Power is supplied via a sin-gle line carrying 3.3 volts. The LEDillumination requires a constant150 mA for the green/yellow vari-ant and a constant 45mA for theblue/white and black/white vari-ants. The wide range of operatingtemperatures (from - 20°C to +70°C) makes the display the idealcandidate for applications in manyindustrial environments.


The EA eDIPTFT57-A intelligentdisplay from Electronic Assemblyis the ideal candidate for imple-menting interactive controls inmechanical engineering or indus-trial electronics applications. Thescreen, which measures 5.7" in thediagonal and has LED backgroundillumination, offers a crisp, colorfulresolution of 640 × 480 pixels. Itsmost important feature, however,is the built-in intelligence thatgreatly facilitates developers whowant to integrate the dis-play modules in their appli-cation. The device alsoprovides acoustic feedbackin addition to outputtinginformation on screen,thanks to the integratedsound module that canplay start-up tones, confirmkeyboard inputs, and issuewarning messages. A virtualon-screen keyboard rounds offthe list of convenience features ofthe EA eDIPTFT57-A. The intelli-gence of the display unit makes iteasy to program interactive user

interfaces. In conjunction with theoptional touch panel, developerscan create a virtual keyboard injust a few steps. Keyboard inputsare processed directly on the dis-play in an “edit box”. This allowsoperators to use standard text for-matting commands without plac-ing a large workload on the pro-grammer. A high-level languagemacro programming facility is animportant aspect of the integrat-ed intelligence of this display and

represents an elegant way ofdeveloping applications.


Brilliant and intelligent: 5.7" display for industrialand many other applications

Dotmatrix displays are dead - long live theDotmatrix display


New Extech HDV600 now available in TME’s range of productsTME company has enriched its offerwith Extech Instruments HDV600boroscopes. This is an inspection camera used toinspect difficult-to-access areas.Those instruments are highly resistant, shock-proof, aswell as water-resistant. They provide high-sharpness andclarity of image and can be used in almost every workingenvironment. Examples of HDV600 boroscopes applica-tions include: in automotive industry-inspection of engineor gearbox elements; in sanitary engineering-inspectionof channels and ducts or compressors; security and safetycontrol; diagnostics of mechanical equipment (e.g. millingmachines), and also household applications such as, forexample, locating electrical cables or tubes in walls,detecting mould or insects. The equipment operates bestin the temperature range from -10°C to 50°C.HV600 boroscope is equipped with colour 5,7” LCD thatenables recording images in the resolution of 640 x 480.It is connected with 4 LED’s illuminated digital cameralocated on a 1-metre conduit. Collected data is stored onthe SD card added to the kit. The card allows storingalmost 15 000 images. Apart from the SD card, USB inter-face is used to communicate with a PC. It is also possibleto record up to 4 hours film with a sound. Since theHV600 boroscope is equipped with AV output, it is alsopossible to easily display collected images or films on themonitor. This series includes four different product models:• HDV610 with 5,5 mm diameter camera head,• HDV620 with 5,8 mm diameter camera head,• HDV640 with 6,0 mm diameter camera head (camera iscontrolled by means of a manipulator),• HDV640W with a 6,0 mm diameter camera head andembedded transmitter for the wireless image transmis-sion to the distance of up to 30 metres (camera is con-trolled by means of a manipulator). The equipment weight is 3,94 kg, and its dimensions are:70 x 241 × 178 mm. It is supplied with a 3,7V Lithium-Polymer rechargeable battery. The manufacturer grantsan annual warranty. The functionality of ExtechInstruments HDV600 boroscope can be additionallyextended thanks to the application of multiple optionalaccessories which are also available on TME’s offer. More more information on HDV600 boroscopes at themanufacturer’s Website: http://www.extech.com/instru-ments/hdv600.asp

Transfer Multisort ElektronikTel.: +48 42 645 54 44Fax: +48 42 645 54 70 [email protected]

Aeroflex Limited announced that ithas added support for 4×2 multi-input multi-output (MIMO) to the7100 Digital Radio Test Set for theR&D testing of LTE user equipment(UE) being designed with this feature. 4×2 MIMO is used adaptively to offerimproved throughput in good signalconditions, and improved resilience inpoor signal conditions. When the sig-nal-to-noise ratio (SNR) at the UE isgood, the device can make use of spa-tial multiplexing, where multiple infor-mation streams are transmitted simul-taneously to improve throughput.When the SNR is poor then transmitdiversity is employed. This is where asingle information stream is distrib-

uted across separately-encodedantenna ports to reduce the variationsin SNR experienced by the UE, thus

improving the cell coverage.Measurements are made both at thebase station and at the UE and theseare used to determine how manystreams can be supported in the pre-vailing signal conditions.AEROFLEX www.aeroflex.com

Aeroflex adds 4×2 MIMO support to 7100Digital Radio Test Set

Amplicon have launched an excitingnew eShop website, NexcomShop.com. This underlines the con-tinuing and growing partnershipwith Taiwan’s leading embedded IPCmanufacturer, Nexcom.Nexcom were established in 1992and have seen remarkable growthover the following years. They havea reputation for market leading inno-vative product design combinedwith outstanding attention to quality,and this has underpinned the part-nership with Amplicon which hasbeen in existence for some 15 years.This new venture will give clientsaccess to an unrivalled hardwareportfolio; with options ranging from

small form factor motherboards, railapproved PCs, compact embeddedPCs, closed or open frame panel PCs

and medically approved panel PCs.This can also be used for the out-standing post sales technical supportthat you would expect from a marketleader like Amplicon.AMPLICON www.amplicon.com

Amplicon expand eShop portfolio withNexcomShop.com

Amplicon is to broaden its Test &Measurement and Data Acquisitionproduct portfolio with an excitingnew partnership venture withTeledyne LeCroy. Amplicon aredelighted to announce an excitingnew partnership venture withTeledyne LeCroy, a global leader inthe design, development and manu-facture of high quality Oscilloscopes,Protocol Analyzers and complemen-tary Test & Measurement solutions.Amplicon’s excellent track record inproviding high quality Test &Measurement and Data Acquisitionproducts coupled with their extensivetechnical knowledge, has positionedAmplicon as the exclusive UK techni-

cal provider of Teledyne LeCroyrange of products. This new partner-ship with Teledyne LeCroy will broad-

en the existing Amplicon Test &Measurement portfolio and providecustomers with a wider spectrum ofinnovative Test & Measurement andData Acquisition solutions.AMPLICON www.amplicon.com

Amplicon announce an exciting newPartnership with Teledyne LeCroy

INDUSTRY NEWS

TEST


INDUSTRY NEWS

EMBEDDED SYSTEMS

Kontron announced the releaseof the Kontron CP3003-V, the lat-est extension to its popularCompactPCI Value Line Series.The PICMG 2.0 compatibleKontron CP3003-V comes withthe Intel Celeron processor807UE. Kontron’s V(Value Line) boards offercustomers a cost-opti-mized solution with a rea-sonable set of featuresand a less complexdesign. It delivers out-standing cost-effective-ness without compromis-ing computing performance. Thismakes the Kontron CP3003-V anideal fit for price-sensitive indus-trial applications, such as machineand factory control, visualizationor inspection systems. The Kontron CP3003-V includesa 1.0 GHz Intel Celeron processor807UE in combination with theIntel® Platform Controller Hub

QM77. A Smart Cache of 1 MBand up to 4 GB DDR3 SDRAMmemory with up to 1333 MHzguarantee high data throughput.The new CompactPCI CPU boardcomes as a double slot version(8HP) that offers a comprehen-

sive set of interfaces such as 1×VGA, 2× DisplayPort, 1× USB 3.0,2× USB 2.0, 3× Gigabit Ethernetports and a Serial port on thefront panel plus the option tohold a CFast module or up to 2×2.5” HDD/SSD onboard.

KONTRON www.kontron.com

Microchip announces the expan-sion of its mTouch™ SensingSolutions portfolio, with fourturnkey controllers for multi-touchprojected-capacitive touchscreensand touchpads, proximity detec-tion, and haptic touch feedback.The MTCH6301 is a turnkey pro-jected-capacitive touch controllerthat makes it easy for designers toadd popular multi-touch and ges-ture interfaces, eliminating thelearning curve and time for creat-ing a design from scratch. This con-troller’s sophisticated combinationof Self and Mutual capacitive scan-ning for XY touchscreens andtouchpads enables a host offeatures including: single anddual-touch drawing, thereporting of 11 single-fingergestures and the detection ofup to 10 touches. TheMTCH6301 supports sensordesigns with up to 13 × 18channels and cover lenses upto 5 mm. Additionally, Microchipoffers its free “Projected

Capacitive Confi guration Utility”with automatic tuning, enablingfast customisation for differentscreen sizes and top-layer thick-nesses. Microchip also providesdesigners with the firmwarelibrary, so they can make furthercustomisations.The MTCH101 and MTCH112are turnkey controllers in smallpackages that provide an easyway to add robust proximitydetection with a range of up to 8inches. Additionally, these low-cost controllers maximise batterylife with power consumption aslow as 5 microamps.

MICROCHIP TECHNOLOGYwww.microchip.com/get/LFNJ

Microchip expands mTouch™ Sensing portfolio withturnkey controllers for Multi-touch, ProximityDetection and Haptic Feedback

Kontron’s new 3U CompactPCI Value Line SBC opti-mizes price/performance ratio of cost sensitiveindustrial applications

Innovasic announces that it hasenhanced its RapID PlatformNetwork Interface to achievePROFINET Net Load Class III per-formance. Achieving Net Load Class IIImeans Innovasic’s solu-tion conforms to thePROFINET standardeven under the highestnetwork load condi-tions. By using theRapID Platform in theirfield device designs,developers can expectto achieve these sameresults. Innovasic achieves NetLoad Class III perform-ance with its patentedPriorityChannel™ tech-nology. PriorityChannel elimi-nates the effects of network traf-fic loading and ensures real-timePROFINET messages are alwaysprocessed on-time, every time.A field device incorporatingInnovasic’s Network Interface

solution is protected from unpre-dictable packet delays, excessivelatency, and connection failurewithout worrying about networksegmentation or switch configu-ration. The RapID Platform

Network Interface is available as amodule or an embedded design,and the transition can be made atany time.

INNOVASICwww.innovasic.com

Innovasic announces it haslaunched the fido2100, a newIndustrial Ethernet switch for highperformance Device Level Ring(DLR) networks. DLR beacon ratesdown to 100 μs support faultrecovery and ring restore times ofless than 10 ms. A host processorconnects to one of the threeswitch ports via MII for Ethernetcommunication and to a proces-sor bus for configuration and sta-tus. A C library support packagesimplifies integration of the switchto any type of processor.The fido2100 is an IEEE 802.3standard compliant, Layer 2switch that is compatible with theIEEE 802.1D standard. In additionto supporting rings, the switchalso supports star, line, and treetopologies. It utilizes cut throughforwarding to swiftly pass trafficfrom one port to the other port tominimize packet delay.The fido2100 also supports IEEE1588 v2 Precision Time Protocol(PTP) and supports both ordinaryand transparent clocks. Either

ordinary master or slave clock canbe implemented on an enddevice, and the transparent clockhas a resolution of 5ns. Two inputsto the switch allow external eventsto be synchronized to systemtime, and one output provides apulse-per-second time base.Third-party PTP stacks can beused with the switch, and there isa C Library available that supportsCIPSync. Engineering samples are

available now in both 128-pinLQFP and BGA packages

INNOVASICwww.innovasic.com

Innovasic Launches First Ever 3-Port IndustrialEthernet Switch with Device Level Ring

Achieve PROFINET Net Load Class III Performancewith Innovasic’s RapID Platform


INDUSTRY NEWS

EMBEDDED SYSTEMS

Atmel® Corporation announcedsampling of the maXTouch® SSeries touchscreen controllersdesigned for the rapidly growingUltrabook™ and notebook mar-kets. Building upon the success ofthe maXTouch S Series, the newWindows 8 Certified AtmelmXT3432S is a touchscreen con-troller with a small footprint opti-mized for touchscreens up to 17.3inches. As a co-engineering collab-orator with Microsoft, Atmel hashelped develop high performancetouchscreen specifications to sup-port prominent features ofWindows 8. These include first-touch latency, finger separation,and support for up to 10 simulta-neous touches on thescreen as well as edge ges-tures. Original equipmentmanufacturers (OEMs) aredemanding touch integra-tion into Ultrabooks andnotebooks. The move to thinner,lighter devices with larger touch-

screens requires higher noiseimmunity due to the adoption ofshieldless sensors, as well as moredata processing due to highernode count. The mXT3432Senables designers to develop anew class of touch-optimizedproducts that meet their designrequirements. The new controlleris designed to meet the require-ments of Windows 8, and alsosupports Linux and Android. ThemXT3432S is Atmel’s first touchcontroller for Ultrabooks andnotebooks featuring patentedtechnologies. Atmel’s patentednoise immunity technology ensuresrobust performance with variouschargers in noisy environments.

ATMELwww.atmel.com

Kontron today introduced its lat-est ULP-COM standards-basedComputer-on-Modules to helpembedded OEMs drive downsystem costs for ultra-low powerSFF (small form factor) solutions.Kontron's expanded ULP-COMportfolio is designed as a highlyscalable building block for theswift and cost-effective develop-ment of energy-efficient mobiledevices. Featuring an extremelylow TDP (Thermal Design Power),the Kontron ULP-COM-sA3874i iswell-suited for space-constrained,fanless and harsh environmentapplications. Offering single coreARM Cortex A8 technology per-formance based on TexasInstrument's AM3874 Sitara ARMprocessors, Kontron's latest ULP-COM module delivers the com-puting power required by thediverse range of smart devicesbeing designed today in anexceptionally small 82mm × 50mmfootprint. The Kontron ULP-COM-sA3874i module supports

an extended operating tempera-ture range of -40°C to +85°C andexpands the scalable Computer-on-Module building block modelto a broader range of SFF systems

that must operate in harsh envi-ronmental conditions such asthose in the military, industrialautomation/HMI, digital signageand medical markets. Support forAndroid, Linux, WEC7, and addi-tionally a variety of real-time oper-ating systems on project request,enables embedded OEMs toleverage an active ecosystem ofdevelopment partners.


Kontron helps reduce costs of ultra-low power SFFsystems with latest Texas Instruments-based ULP-COM Computer-on-Modules

Atmel Expands into Rapidly Growing Ultrabook andNotebook Markets with New Windows 8 CertifiedmXT3432S

For more than 30 years MENMikro Elektronik has been one ofthe leading manufacturers forrugged and safety-critical elec-tronics in embeddedapplications. In its cor-porate video the con-stantly growing compa-ny explains its core com-petencies and the rea-sons for its success in itstarget markets. Apartfrom the video therevised standard cataloghas been publishedshowing how flexible the MENproduct range is.MEN Mikro Elektronik developsand produces failure-safe com-puter boards and systems forextremely safety-critical mobilemarkets like railway, buses, agricul-tural machines, commercial vehi-cles, avionics and shipbuilding aswell as other mission-critical appli-cations in industrial automationand medical engineering. In orderto comply with the high and spe-

cific requirements of these mar-kets, MEN has been the firstGerman company to be certifiedto EN 9100 (avionics) as well as to

IRIS (railway). Only around tencompanies worldwide have beencertified to both standards. MENis also certified to e1 (automotive),ISO 9001:2008 (quality manage-ment) and ISO 14001:2005 (envi-ronmental management). When itcomes to product level, MENalready offers COTS computerscertified to SIL 4.

MEN MIKRO ELEKTRONIKwww.men.de

The new F75P CompactPCIPlusIO SBC was specially designedfor rail applications and bringsfunctional safety to the boardlevel, using redundant Intel Atomprocessors. While two redundantCPUs with independent RAM andFlash memory increase systemsafety, a third processor controlsthe I/O interfaces. The safe F75P sin-gle-board computerunites the benefitsof a 1oo2 multipro-cessing system andthe ruggedness andflexibility of theCompactPCI PlusIOstandard on one sin-gle card.Two of the totalthree Intel Atom E680T proces-sors with 1.6 GHz and 512 MBDDR2 RAM are set up to beredundant, forming the safe con-trol unit of F75P. The third Intel Atom with 1 GBDDR2 controls I/O. It passes onthe commands to the interfaces

that were sent by the two controlCPUs across an FPGA-based com-munication interface.Two supervisor units monitor theenvironmental conditions speci-fied for the two control CPUs andput the system into a safe state, forinstance if the maximum operatingtemperature was exceeded. The

output of a faulty processor is notpassed through (fail-silent), or thecomplete system is shut down incase of an error and a train, forexample, is stopped (fail-safe).

MEN MIKRO ELEKTRONIKwww.men.de

SIL 4-Ready Safety on CompactPCI® PlusIO - DualRedundancy for Rail Applications

MEN in Word, Sound and Vision: New StandardCatalog and Corporate Video

Microchip announces its latest-generation SMSC JukeBlox® Wi-Fi® connectivity platform, featur-ing the JukeBlox 3.1-AAP ( JB3.1-AAP) Software Development Kit(SDK) in combination with thenew CX875 Wi-Fi NetworkMedia Module. This platformexpansion delivers highly inte-grated and specialised connec-tivity software along with a cost-optimised and fullycertified CX875 Wi-Fi module, featuringthe new, low-costDM875 NetworkMedia Processorand 8MB of SDRAMto reduce BOMcosts by up to 20%.Through these costreductions and ease of use, thislatest-generation JukeBlox plat-form enables a new category ofAirPlay®-compatible wirelessaudio streaming systems withretail pricing down to $149.Enhancements to Microchip’s JBConnect simplified Wi-Fi networksetup technology, along with theeasy network setup features inApple’s iOS, make this JukeBlox

technology expansion the easiestand most user-friendly solutionfor designing AirPlay products todate. This easy setup, in conjunc-tion with improvements to Wi-Fiperformance and system boot-uptimes, makes Wi-Fi streaming evenmore robust and improves theoverall user experience.Microchip’s latest-generationJukeBlox platform also provides

seamless support for the new iOS6 and iPhone® 5, with their relatedAirPlay music streaming and con-trol features. Microchip’s newCX875 Wi-Fi Network MediaModule is based on its new, low-cost SMSC DM875 Wi-Fi NetworkMedia Processor.

MICROCHIP TECHNOLOGYwww.microchip.com/get/SET4

Microchip’s new SMSC JukeBlox® 3.1 SDK and CX875Wi-Fi® Network Media Module provide easiest andmost cost-effective AirPlay® solution

At this year’s SPS IPC Drives inNuremberg, Germany, Kontron(hall 7, stand 306) announced acomprehensive expansion of itscurrent Panel PC range with theaddition of two new productseries. The first is the KontronMicro Client 3 series for monitor-ing and controlling individualproduction lines. The second isthe Kontron OmniClient seriesfor supervising and managingcomplete manufacturing facili-ties. A major new feature addedto these new Panel PC ranges isthe multi-touch support, withtouch-sensitive glass displays,making them intuitively easy touse. Another attractive feature istheir updated industrial design ina widescreen format providing asmooth, edgeless display.Kontron’s new Panel PCs willbecome employed as shop-floor

systems in processing industriessuch as the chemicals and phar-maceutical sectors, food andbeverages, and the power sector,plus sophisticated machines andplants or factories and facilitymanagement. In short, they are

destined to be used whenevermachine and plant operators feelthe need to have convenientPanel PC systems to improvemonitoring and managing alltheir production processes.


Kontron reinvents its Panel PC lineup with two newmulti-touch, scalable Panel PCs in a widescreen format

IAR Systems® announced a newversion of its world-leadingdevelopment tool suite, IAREmbedded Workbench® forARM® version 6.50. The new ver-sion adds expanded integrationand new functionality. In addi-tion, enhancements to the opti-mization technology in the pow-erful IAR C/C++ Compiler resultin even faster code execution. To make it easy for developersto use device configurationtools alongside IAREmbedded Workbench, IARSystems has implemented newfunctionality for adding proj-ect connections. Automatedintegration with Freescale’sProcessor Expert Software,Infineon’s DAVE™ code genera-tor, and other device configura-tion tools enables developers toimport files or file packages gen-erated by the tools. IAR Embedded Workbenchautomatically detects changes in

the generated file set.Providing fast and compact code,the IAR C/C++ Compiler per-forms multiple levels of optimiza-tions for code size and executionspeed, such as loop unrolling andfunction inlining. The operationsperformed are global as well ascore- and target-specific. By further advancing its compiler

technology, IAR Systems hasimproved the already outstand-ing results of industry-standardbenchmarks by more than 10percent.

IAR SYSTEMS www.iar.com

DSM Computer has augmented itscompact DIN rail-mounted PCfamily H1-A with a further modelwith integrated 7.2 GB flash mem-ory. The large flash memory per-mits the installation of sophisticat-ed operating systems, such as stan-dard Windows® and Linux, as wellas the saving of comprehensiveuser data. The DIN rail-mountedPC variant with 7.2 GB flash mem-ory is based on the energy-savingIntel® Atom™ processor Z530 (1.6GHz) and the Intel® US15W SCHSystem Controller hub with theIntel® GMA 500 Graphics MediaAccelerator. It also integrates a 1GB DDR2 RAM in the Qseven™module from MSCVertriebs GmbH installedin the H1-A. To ensureoptimum heat dissipa-tion, the small 70 × 70 mmassembly unit is connect-ed directly with the com-puter housing.The application areas forthe compact DIN rail-mounted PC are wide ranging.The robust computer can be

deployed as gateway and commu-nications system, Web server ordistributed control unit in theprocess automation, plant control,power engineering, buildingautomation, smart metering andelectro-mobility. The standard-ized installation capabilities allowthe system that is 90 mm high andonly 41 mm (55 mm with coolingfins) deep to be installed veryquickly in the electrical-equip-ment or switchgear cabinet. With a width of 124 mm (7 U), theindustrial PC in the robust, high-quality aluminium housing can beinstalled under the rail-mountedstandard cover.

DSM COMPUTER www.dsm-computer.com

Compact, robust DIN rail-mounted PC with 7.2 GBflash memory

Latest IAR Embedded Workbench for ARM offersnew functionality and compiler optimizations


INDUSTRY NEWS

EMBEDDED SYSTEMS


Silicon Laboratories Inc. intro-duced the industry’s first crystal-less USB-to-I²S audio bridgedesigned to support a wide rangeof codecs and digital-to-analogconverters (DACs) used in USB-based audio applications.The new CP2114 audiobridge chip simplifies theprocess of transferringaudio data from USB toI²S without time-consum-ing code development,speeding time to marketfor USB audio accessoriessuch as speakers, head-phones, music boxes,point-of-sale terminals,navigation systems and VoIP sys-tems. USB system developmentoften involves significant expert-ise, design effort and cost to over-come implementation issuesranging from compatibility topoor performance. USB-to-I²Saudio data transfer also requiressophisticated clock synchroniza-tion, which poses complex devel-

opment challenges. To addressthese needs, Silicon Labs’ CP2114audio bridge provides a highly-integrated, plug-and-play solu-tion for streaming audio betweenUSB and I²S.

The CP2114 audio bridge inte-grates a USB 2.0 full-speed func-tion controller, a USB transceiver,crystal-less oscillator, one-timeprogrammable ROM, UART, IICand I²S interface into a single-chipsolution.

SILICON LABORATORIESwww.silabs.com

CUI Inc has introduced a line offully regulated intermediate busdc-dc converters with advanceddigital control from their Novum®Advanced Power product line.The converters are CUI’s firstproduct release based on therecently announced licenseagreement with Ericsson,the world's leading pro -vider of technology andservices to telecom opera-tors, for their Advanced BusConverter portfolio basedon the FRIDA II platform.CUI’s NQB and NEB series arepin and function compatible withEricsson’s BMR456 and BMR457series respectively, enabling ori -gi nal equipment makers (OEMs)to address interoperability chal-lenges, reduce time to market,and decrease supply chain riskfor these leading-edge digitalproducts. The NEB series,housed in an 1/8 brick package,and the NQB series, housed in a1/4 brick package, incorporate a

32-bit ARM-based microcon-troller with power-optimizingfirmware designed to maximizeand flatten the efficiency curve,providing peak performanceacross a much wider range ofloading conditions when com-

pared to intermediate bus con-verters currently on the market.With typical efficiencies as high as96.4% and optimized efficiencyfrom 20% to 100% load, the mod-ules are ideal in applications whereloading conditions can vary great-ly, including next-generationInformation and CommunicationTechnology (ICT) equipment.

CUIwww.cui.com

Fully Regulated Intermediate Bus ConvertersIncorporate Digital Control to Provide IndustryLeading Performance

Silicon Labs USB-to-I2S Audio Bridge Chip BringsPlug-and-Play Simplicity to Audio Design

Murata announced theLBEL6Z2TXC wireless combina-tion module aimed at automotiveapplications and utilizing an AEC-Q100 compliant chipset.Providing support for wirelessLAN, Bluetooth,Bluetooth LowEnergy (BLE) commu-nications in additionto providing an FMradio receiver andGPS receiver themodule measure just24.6 × 18.0 × 3.0 mm.The WLAN feature isIEEE 802.11 b, g and ncompliant and alsosupports WiFi Direct. Bluetooth4.0 class 2 compliant support andH4 protocol is standard. By com-bining the five wireless functionsinto a single package allowdesigners to simplify their end-designs, save valuable boardspace in addition to easing theburden of procurement whencompared to having to select

multiple modules from othersuppliers. Also compared to con-sidering developing their ownwireless designs, the use of theLBEL6Z2TXC speeds time tomarket since the modules are

pre-qualified removing the needto time consuming design testingand evaluation. Module interfaces include aUART, PCM, SDIO, I²S and audio.Power requirements are +3.3 and+1.8 VDC.

MURATAwww.murata.eu

Atmel® Corporation announced arange of microcontroller-basedsolutions that integrate touch andsensor hub functionality to enablesuperior user experience for avariety of mobile devices includ-ing smartphones, tablets,Ultrabooks and convertible PCs.The new solutions build onAtmel’s leading maXTouch® con-trollers and incorporate the com-pany’s patented maXFusion™ sen-sor fusion technology to addressthe growing motion sensor mar-ket. Atmel maXFusion combinesinputs from multiple sen-sors that detect motion,including accelerometers,magnetometers and gyro-scopes, to provide real-time direction, orientationand inclination data bringing visi-bly superior performance to arange of applications includinggaming, navigation and virtualreality. Atmel is also the first com-pany in the industry to integratesensor hub functionality into

touchscreen controllers extendinghuman interface solutions beyondtouch to deliver performance andpower efficiency gains in a single-chip solution. The combination ofmultiple sensor systems enablesthe development of new function-ality leveraging both touch andmotion sensing, driving furtherinnovation for user interfacedevelopment. Atmel’s new solu-tions with maXFusion technologyinclude advanced sensing algo-rithms that result in 3x the per-formance compared to managing

sensors on the applica-tions processor.

ATMELwww.atmel.com

Atmel Delivers World’s First Single-chip Solution thatIntegrates Touch And Sensor Hub Functionality toEnhance Users’ Experience

Wireless modules provide five connectivitystandards within a miniature single package

INDUSTRY NEWS

ACTIVE COMPONENTS


INDUSTRY NEWS

ACTIVE COMPONENTS

Microchip announces a new fami-ly of power-conversion con-trollers and its first-ever family ofpower MOSFET devices. This newPulse Width Modulation (PWM)controller and complementaryfamily of low-Figure of Merit(FOM) MOSFET products com-bine to support high-efficiencyDC/DC power-conversion designs,covering a broad array of con-sumer and industrial applications.Together, these two familiesdemonstrate a significant expan-sion of Microchip’s commitmentto enabling higher-voltages andhigher efficiencies, as well as theindustry trend toward smaller,power-conversion systems.The MCP19035 is a small, ana-logue-based PWM controller fam-ily with integrated synchronousMOSFET drivers offering out-standing transient performance.The MCP19035 devices operateover a wide 4.5-30Vdc range,have a 300kHz switching-frequen-cy, and offer a factory-adjustabledead-time setting, allowingdesigners to optimise perform-ance across a wide selection ofMOSFET devices. The MCP19035family, when combined withMicrochip’s MCP87xxx MOSFETs,

or any low-FOM MOSFET, pro-duces high-efficiency (>96%)DC/DC power-conversion solu-tions. The MCP87xxx family ofhigh-speed MOSFETs offers verylow FOMs and is packaged inindustry-standard 5×6 mm and3.3×3.3 mm PDFN packages. The MCP87022, MCP87050, andMCP87055 devices offer on-state resistance of 2.2mΩ,5.0mΩ, and 5.5mΩ, respectively

and enable high-efficiencypower-conversion designs.

MICROCHIP TECHNOLOGYwww.microchip.com/get/SET4

Microchip introduces high-voltage analogue buckPWM controller with integrated MOSFET drivers,and high-speed, low-Figure of Merit MOSFET family

Mouser Electronics, Inc. is nowstocking STMicroelectronics’STM32 F3 Series of MCUs thatcombines the 32-bit ARM Cortex-M4 core with a DSP, FPU instruc-tions, and advancedanalog peripherals. TheSTM32 F3 series inno-vates in embedded DSCdesign by combining aCortex-M4 core withfast 12-bit 5 MSPS andprecise 16-bit sigma-delta ADCs, programmable gainamplifiers (4 gains, 1% accuracy),fast 50 ns comparators and versa-tile time control units running at144 MHz, giving optimum inte-gration. The devices are opti-mized for efficient handling andprocessing of mixed signals in cir-cuits such as 3-phase motor con-trollers, biometrics and industrial

sensor outputs or audio filters,allowing designers to tacklemixed-signal control applications.These devices help simplifydesign, cut power consumption

and reduce PCBsize in consumer,medical, portablefitness, systemmonitoring andmetering applica-tions. STM32 F3Series Mixed-

Signal MCUs are pin compatiblewith the STM32 F1 series, and thenew STM32 F3 series enlarges theSTM32’s Cortex-M4 portfolio tonow offer both entry-level costwith the F3 series and highest per-formance with the F4 series.

MOUSER ELECTRONICSwww.mouser.com

STMicroelectronics STM32 F3 Mixed-Signal MCUs

ST released the TS881, a singlecomparator featuring nanopowerconsumption and a responsetime of 2μs. These performances

allow this rail-to-rail comparatorto be used in a wide range ofportable applications and any-where consumption matters.TS881 is available in tiny SC-70package at distributor Rutronik.The TS881 minimizes the supplyleakage and works down to 1.0Vsupply, thus enhancing batterylifetime of applications runningon rechargeable batteries. It fea-

tures an ultra low current con-sumption of 210nA typ and anESD tolerance of 4kV HBM/300VMM. Its propagation delay

amounts to 2μs typ. It works in awide temperature range from -40°C to +125°C. With these fea-tures the single comparator isideally suitable for battery-pow-ered products, portable systems,signal conditioning and medicalinstrumentation.


Microchip announces three newfamilies of low-power, general-purpose operational amplifiers(Op Amps) that expand the rangeto 12V supply voltages. Becausethe MCP6H7X/8X/9X maintain thesame pin-outs and features asMicrochip’s existing 6V and 16Vfamilies, designers can easilymigrate to the ideal volt-age rail, in addition to thenew families’ higher-speed Gain BandwidthProduct (GBWP) rangeof 2.7-10 MHz. All ninemembers of the newfamilies are available insingle, dual and quadconfigurations. Designersoften have to compen-sate for noise from transients in thepower supply or the common-mode voltage. With high CommonMode Rejection Ratio (CMRR),high Power Supply Rejection Ratio(PSRR), unity-gain stable and rail-to-rail output, the new MCP6H7X/

8X/9X Op Amps are ideal forapplications that operate in noisyenvironments, such as currentsensing and power supplies forthe automotive and industrial mar-kets. Additionally, wide operat-ing-voltage and common-mode-voltage ranges, in combinationwith small 2 × 3 mm package

options, make these Op Ampswell suited for portable and bat-tery-powered applications in theconsumer and medical markets.

MICROCHIP TECHNOLOGYwww.microchip.com/get/G4TD

Microchip expands low-power Op Amps into highervoltages with three new 12V Families

Rutronik presents the Lowest ConsumptionComparator from ST

INDUSTRY NEWS

ACTIVE COMPONENTS

Silicon Laboratories Inc. intro-duced the industry’s first univer-sal clock buffers capable ofreplacing LVPECL, LVDS, CML,HCSL and LVCMOS buffers witha single IC, eliminatingthe need for multiplefixed-format buffers. Thenew Si533xx family inte-grates common clock treefunctions including clockdistribution, clock mux-ing, clock division, formattranslation and leveltranslation. Based on apatented low-phase-noise clockdriver architecture, the Si533xxfamily features ultra-low additivejitter with guaranteed maximumjitter specifications, simplifyingclock tree design and providingdesigners more jitter margin forother devices. The Si533xx clockbuffers are purpose-built toaddress the demanding require-

ments of communications, datacenter, wireless infrastructure,broadcast video and embeddedcomputing applications. The Si533xx clock buffer family is

part of Silicon Labs’ comprehen-sive portfolio of timing devices,enabling customers to simplifyboth the design and procure-ment of complete clock tree solu-tions for virtually any high-per-formance application.

SILICON LABORATORIESwww.silabs.com

CML Microcircuits, a leader in thedesign, development and supplyof low-power analogue, digital andmixed-signal telecommunicationsemiconductors, has launched anew ACE (Analogue Communi -cations Enhancements) Processor,the CMX188.The CMX188 ACEProcessor is specificallytargeted at providing thedigital advantage to ana-logue two-way radios andwalkie-talkies, servingboth licence-free andlicensed two-way radiomarket sectors. The com-bination of an embeddedlow bit-rate vocoder,audio-band modem anddigital voice featuresmakes the CMX188 an outstandingproduct. The migration from ana-logue to digital two-way radio isproving to be very slow, with themajority of two-way radios in thefield still being analogue. This slowtransition is associated with thecomplexity and implementation

cost of modern digital radio sys-tems together with the need toprovide backward compatibleoperating modes, to enable com-munication with the wealth of lega-cy analogue systems alreadydeployed today. The CMX188ACE Processor solves these prob-

lems, bringing new life to analoguePMR radios by working alongsidethe radio’s existing analogue base-band processing and providing thedigital advantage.

CML MICROCIRCUITSwww.cmlmicro.com

CML launches a new ACE Processor, the CMX188Providing the Digital Advantage to AnalogueTwo-way Radios

Silicon Labs Introduces Low-Jitter Clock Bufferswith Industry’s Highest Integration of Clock TreeFunctions

Renesas Electronics, a premiersupplier of advanced semicon-ductor solutions, todayannounced the R-IN32M3 seriesof industrial Ethernet communi-cation chips with support formultiple communication proto-cols in response to the rapidadoption of industrial Ethernetcommunication technology. One of the most distinctive fea-tures of the R-IN32M3 is thehigh-speed operation with thebasic function of the real-time OSin hardware to implement high-speed real-time response andhigh-precision communicationcontrol for industrial Ethernetcommunication. Because thehardware in the new R-IN32M3series covers heavy load opera-tions for the CPU, the combina-tion of the CPU and integratedreal-time OS offload engine(HW-RTOS [Note 1]) result inultra-high-speed real-timeresponsiveness five to ten timesthat of a conventional softwarereal-time OS. In addition, thefluctuation caused by inconsis-

tencies in the operation time withconventional CPU processing isreduced substantially from one-fifth to one-tenth of the previous

level. The new R-IN32M3 seriesinclude an integrated ARMCortex-M3 CPU (100 MHz). Thenew Ethernet controllers acceptprotocols for industrial Ethernetcommunication such as CC-LinkIE and EtherCAT and will acceptthe control area network (CAN)which is heavily used in industriesand generic interface such as uni-versal asynchronous receivertransmitter (UART)

RENESAS ELECTRONICS EUROPEwww.renesas.eu

Avago Technologies announcedits ACPL-M49U/K49U/M71U/M72U digital optocouplers, whichare new additions to itsR2CouplerTM family. These opto-couplers provide a wider offeringof extended temperaturerangedigital optocouplers to the exisit-ing family and are designed tomeetcustomer needs for lowpower, low leakage, higher isola-tion voltage and higher common-mode rejection (CMR).Avago Technologies’ extendedoperating temperature digitaloptocouplers are increasinglyused in a wide variety of isolationapplications ranging from powersupply, computing, factoryautomation, data communicationsand digital logic interface circuits.These new digital optocouplers,ACPL-M49U/K49U/M71U/M72Uensure the AC and DC perform-ances over the extended temper-

ature range of –40°C to +125°C.The ACPL-M71U/M72U devicesare high speed, low power digitaloptocouplers with R2CouplerTMisolation and a low power con-sumption of 1.5mA. The ACPL-M71U uses a high-speed LED toachieve 35ns maximum propaga-tion delay, while the ACPL-M72Uuses a low current LED for lowerpower consumption. The ACPL-M49U/K49U are low speed, highCMR digital optocouplers, bothconfigurable as low power andlow leakage optocouplers.

AVAGO TECHNOLOGIESwww.avagotech.com

Avago Technologies Announces Extended OperatingTemperature Digital Optocouplers with R2CouplerIsolation

Renesas Electronics Introduces Low-power IndustrialEthernet Communication Chips with IntegratedReal-Time OS Offload Engine



Everlight Electronics Co., Ltd., aleading player in the global LEDand optoelectronics industry, hasextended its signage LED portfo-lio to offer five new products forindoor, semi-outdoor and out-door applications.Two new SMD Chip type LEDs,the 18-038 (1010 package) andthe 19-037A (1616 package) areideally suited for indoor LEDapplications with highly compactboard sizes. Both the 18-038(1.0×1.0×0.5 mm) and the 19-037A (1.6×1.6×0.9 mm) LEDSeries are much smaller than leadframe type components, thusenabling smaller board sizes,reduced package and storagespace and a higher packing den-sity, resulting in finally smallerequipment. They represent thenext level ofSMD LED tech-nology byimplementing ablack PCB whichenhances thecontrast and anadvantageoussolution for highcontrast andhigh resolutionindoor signagedisplays.Two new SMDPLCC type LEDsadd toEverlight’s HongLED family,designed foradvancedindoor(HN0325) orsemi-outdoor(HN0507) LEDsignage displayapplications.The Hong seriesLED packageprovides a per-fect solutionwhen a clearview of the sig-nage display is

required on boards of any size.Using 3-in-1 full color SMD PLCCLEDs offers a smaller pixel pitchbetween two LEDs to create ahigh resolution and better con-trast with its black surface design.The high performance 3474AHSeries LED Lamp, a 3mm ovalpackage, features an extensivewide viewing angle of 110° andUV curable epoxy with enhancedchemical resistance to best fit foroutdoor applications, specificallydesigned for passenger informa-tion signs. The 3474AH LEDLamp has matched radiation pat-terns ensuring consistent colormixing in red, green and bluemixed-color applications.

EVERLIGHT ELECTRONICS www.everlight.com

Everlight Electronics ExtendsSignage LED PortfolioEverlight Electronics Co., Ltd., a

leading player in the global LEDand optoelectronics industry,presents highly efficient white midpower LED series 62-227B (0.4W)and 62-217B (0.5W). These topview LEDs (5630 Package) providehigh efficacy, high CRI (min. 80 ormin. 75), low power consumption,a high luminous flux output, highcurrent capability, a wide viewingangle and a compact form factor.These features make this packagean ideal LED for all lighting appli-cations. The design of Everlight’s0.5W 62-217B LED provides ahigh lumen, high quality of lightsolution in particular for midpower applications. Due to its lowpower consumption and its ultra-thin size of 5.6 mm x 3.0 mm x 0.9mm (LxWxH), the 62-217B topview white LED is truly ideal formany lighting applications likedecorative and entertainmentlighting, light bars, light tubes, lightpipes, indicators and backlights in

offices and family equipment aswell as general lighting. 62-217BLEDs come in a PLCC-4 package,are Pb-free, RoHS compliant andmatch ANSI Binning.Everlight’s 62-217B Mid PowerLED is available in 13 versions inwarm white (2700-3000 K), neu-tral white (4000 K) and cold white(5700-6500 K) with typical lumi-nous fluxes ranging from 40 lm to60 lm. Everlight is fostering closerworking relationships betweenour R&D, Sales and Marketingteams to meet and exceed ourcustomer’s expectations in bothproduct offering and technology.


Everlight Electronics Co.announces the ELMM-457SURCB/A3, a high perform-ance, easy to use through-holedot matrix display driven by pack-aged IC. Each display can bedirectly interfaced with a micro-processor. The serial IC interfaceallows the display of 104built-in characters and 24custom user-defined char-acters in a 5×7 pixel format.The LED sources of this pro-grammable, four digitalphanumeric module dis-play with a flat height of6.5mm and configured in a140 dots 4×5×7 matrix fea-ture latest solid state tech-nology in light emittingdiodes. The display in brilliant redis categorized for luminous inten-sity and provides excellent relia-bility and readability even inbright ambient light.The ELMM-457SURCB/A3 fea-tures a custom design display forunique customized usage.

Common denominators of all vari-ants of customer-specific configu-rations include low power con-sumption, a 3.3V operating volt-age, a serial input and its 128 char-acter ASCII format that allows thedisplay of upper and lower casecharacters. Additional characteris-

tics of this Pb free and RoHS com-pliant device include color selec-tion variety, convenient brightnesscontrols and software controlledfeatures.


Everlight Electronics Announces High PerformanceCustomizable 4-Character 5×7 Dot Matrix Through-Hole Display ELMM-457

Everlight Electronics Presents New Top View LEDswith High Quality of Light for Midpower Applications

INDUSTRY NEWS

LEDs

Five new 3-in-1 full color LEDs and Lamp for indoor,semi-outdoor and outdoor applications combineperformance with efficiency

OMC, the pioneer in optoelec-tronics, today announced a newversion of their rugged, robustand high-brightness multi-angleLED light tube range which can beused to replace traditional lightsources in hundreds of applica-tions, saving power and lastingmuch longer than fluorescentproducts. These compact, lowvoltage linear LED lighting fixturesfeature advanced lens/reflectorassemblies that provideextremely bright and uniformillumination across a broadand well-defined target illumi-nation area, with a power con-sumption of just 2.9W perfoot of tube. With a slim pro-file and robust metal housing,the new light tubes are easy toinstall and require no addi-tional fixtures or fittings – they aresimply screw-mounted to theinstallation surface using the rangeof secure, multi-angle bracketsprovided. The adjustable mount-ing brackets allow the light to bedirected to where it is needed,

and low voltage 24V DC opera-tion means that they are safe andsimple to power electrically.Available in one-foot to five-foottube lengths and dimmable usingOMC’s range of controllers, thenew LED light tubes are suitablefor a wide range of applications inboth the commercial and industri-al sectors, such as food cabinets,vending machines, CNC machinelighting, POS displays, shelves and

cabinets, architectural lighting,freezers, refrigerators and chillers,vehicles, and office, factory,garage and shed illumination.

OMCwww.omc-uk.com

EVERVISION Electronics Europeintroduces “Ultra Wide Viewing“at electronica 2012, a new tech-nology that upgrades the opticalproperties of all standard TFTdisplays up to a diagonal of 7,0“in EVERVISION’s portfolio.The new technology compen-sates the grey inversion of TFTdisplays and enlarges the viewingangle in all four viewing direc-tions to values of 80° / 80° / 80° /80°. A preferred viewing angle nolonger needs to be considered.Up to now, such a characteristicwould not have been feasiblewithout considerably moreexpensive display technologies.Ultra Wide Viewing by EVERVI-SION enables to drive all displaysin portrait-mode view (uprightposition) at an attractiveprice/performance ratio. Especially wide format (16:9)TFT displays with diagonals of4.3“ / 5.0“ / 7.0“ in portrait modeare well-suited for a range of newapplications.

ApplicationsTFT displays in portrait formatare increasingly applied in HMIenvironments (Human MachineInterface), measurement andmedical technology, and also instudio technology.Availability: now.

EVERVISION ELECTRONICS www.evervisionlcd.de

EVERVISION Presents Optical Angle Optimization forTFT Display Portfolio

Multi-angle LED light tubes from OMC are bright,robust and long life

Avnet Abacus, one of Europe’sleading interconnect, passive,electro-mechanical and powerdistributors and a business unit ofAvnet Electronics MarketingEMEA, a business region of Avnet,Inc. has been rewarded for out-standing sales growth in2011/2012 by Kingbright, theTaiwan-based supplier of lightemitting diodes (LEDs) and relat-ed products. This is the third con-

secutive year that Avnet Abacushas been recognised for its success

in increasing sales revenues ofKingbright’s product rangethroughout Europe.With offices located in 18 coun-tries, Avnet Abacus is Kingbright’slargest pan-European distributor,stocking a comprehensive selec-tion of SMD LEDs, through-holeLED lamps, LED displays and otherLED related products from themanufacturer for a broad array ofindustrial applications.

AVNET ABACUS www.avnet-abacus.eu

OMC, the pioneer in optoelec-tronics, have launched new lightengines which offer very highluminous efficiencies of up to 30per cent higher than alternativescurrently available. 220-seriesSPECTRALUX® light enginesdeliver up to 130lm/W and fea-ture life expectancies ofup to 40 years. In theSPECTRALUX® lightengine range, highly effi-cient, tightly-matchedLED die material is bond-ed to a thermally con-ductive substrate andencapsulated with a pre-cision-applied phosphorcoating. OMC is able toachieve such high performance inthe 220-series because the com-pany uses a greater LED chip areawhich has been optimally distrib-uted across the substrate surfaceto enhance optical efficacy andreduce current density. In addi-tion, the electronic configurationof the die elements has beenarranged to keep drive currents

low, thereby reducing the powerdissipation further. Not only doesthis technique result in high lumi-nous efficiency, it also ensuresthat heat is spread more effec-tively across the substrate surfaceresulting in lower junction tem-peratures and longer life

expectancy. In applications wherevery high efficiency is not themain consideration, the die areacan be tailored to reduce powerconsumption or cost so as tomeet the requirements of indi-vidual customer applications.

OMCwww.omc-uk.com

High performance SPECTRALUX® light engines fromOMC deliver 130 lumens/watt

Kingbright commends Avnet Abacus for outstandingsales for third successive year


INDUSTRY NEWS

LEDs

Photo caption (left to right):Alan Jermyn, Vice President Marketing, Avnet Abacus; Udo Reinhold,Managing Director Kingbright; Hagen Goetze, Marketing ManagerIP&E, Avnet Abacus.

INDUSTRY NEWS

PASSIVE COMPONENTS


Murata announced one of theworld’s smallest HF-band RFIDtags. Operating in the 13.56 MHzband also used by contactless ICcards, the LXMS33HCNG-134tag measures just 3.2 × 3.2 × 0.7mm. Compliant with ISO 15693standard, the tag can be usedwith any reader / writer that con-forms to the same standard. The tag is suitable for use in mostoperating environments includ-ing high temperature and highhumidity so itsuits a widerange ofappliance andobject track-ing, certifica-tion and au -thenticationapplications.Normally, anRFID devicerequires anantenna andthe IC tag anddue to the frequencies involvedthe antenna tends to become

extremely large. However, byapplying multi-layer circuit boardand high-frequency moduletechniques, Murata has beenable to incorporate the antennawithin the ceramic substrate.Using this approach, theLXMS33HCNG tag is extremelyresistant to environmental condi-tional and is highly stable inoperation. Read range, whenused with a 200mW reader/writer is typically 15 mm.

MURATAwww.murata.eu

Murata launches one of the world’s smallestHF-band RFID tags

Murata today announced what isbelieved to be the world’s first270nH chip inductor available ina 0603 (EIA 0201) sized packagemeasuring 0.6 × 0.3 × 0.3 mm.Extending the LQP series line-up

of ultra compact high frequencyinductors that previously wereavailable from 0.6 to 120 nH, theLQP03TN-02 series now addsinductance values from 150 to270 nH. Specifically targetinghigh frequency circuits in smart

phones, cellular phones andother small portable wirelessdevices the production of suchlarge inductor values have beenpossible by applying Murata’sunique microfabrication technol-

ogy and by revising the internalstructure. Inductance deviation iswithin +/- 5% and the inductorshave a high Q factor of 5.

MURATAwww.murata.eu

Murata commences mass production of the world’sfirst 270 nH 0603 (EIA 0201) size chip inductor

AVX Corporation, a leading man-ufacturer of advanced passivecomponents and interconnectsolutions, has developed a newseries of enhanced MLC capaci-tors specifically designed for gen-eral ESD protection. Available instandard 0603, 0805, and 1206case sizes, the new ESD-Safe™MLC Chip’s small footprint makesthem ideal for high density elec-tronic devices like automotivemodules, which often use ESDcaps on nearly every pin.“The new ESD-Safe™ Series capaci-tors were made to withstand ESDstrikes without failure, providingour automotive engineering part-ners with unparalleled perform-ance,” said Ron Demcko, AVXFellow. ESD-Safe™ X7R Series capacitorsare designed to protect general-purpose I/O gates from ESD dam-age during the connector towiring harness mating operation.The AECQ200-qualified chipsare available in 25, 50, and 100V,feature a +/-15% capacitancevariation, and are rated for use intemperatures ranging from -55°C

to +125°C. The series is also avail-able with FLEXITERM® soft termi-nations, which allow for morethan twice as much board flexure

as standard terminations andprotect the electrical integrityfrom external forces. Lead timefor the ESD-Safe™ MLC Chipseries is 10 weeks.

AVXwww.avx.com

AVX Corporation is now exceed-ing the 100V milestone - which isalmost twice the rated voltage ofsimilar products on the markettoday - with the introduction ofits new high voltage TCJ series6.8μF/100V (V case) and TCJseries 3.3μF/125V (D case) tanta-lum polymer SMD capacitors.Following the award winning 50VTCJ series capacitor released in2010 and the 63V and 75V ver-sions launched only in spring2012, the new components offerthe benefits of great capacitance,high voltage, and low ESR tech-nology in a small case size.Maintaining 20% recommendedvoltage derating, TCJ seriescapacitors significantly extendthe usable voltage range. Thisunique combination enablesdesign engineers to replace up totwo of the highest rated compo-nent values in this technology byjust one component. AVX’s new

100V and 125V tantalum poly-mer capacitors will be available

from early 2013 with engineeringsamples already available uponrequest.

AVXwww.avx.com

AVX exceeds 100V milestone with new high volt-age tantalum polymer SMD capacitors

AVX’s new MLC capacitor series provides superiorprotection against ESD strikes

INDUSTRY NEWS

PASSIVE COMPONENTS


Murata today announced line-upadditions to its EVC series of highpermissive current capacitorsaimed at automotive applica-tions. Three new multilayermonolithic ceramiccapacitors prod-ucts have beendesigned for thepower electronicsmarket. These surfacemounting capaci-tors, measuring 16× 20 mm and hav-ing an EIA U2Jtemperature char-acteristic offeringan operating temperature rangefrom -55°C to +125°C. Anabsolute maximum case temper-ature of +150°C is permitted fora short duration.The additions to the EVC seriesare 1.2uF / 500 VDC, 300 nF /

1kV and 100 nF / 1.4 kV. Themaximum allowable current, at100 kHz, is 30 Amps (RMS).Typical applications for the EVCseries include use as a smoothing

or snubber capacitor for invert-er/converter applications or as aresonance capacitor for a wire-less charging system.

MURATAwww.murata.eu

Crystek's CVCO55FL-0183-0219VCO (Voltage ControlledOscillator) operates from 183MHz to 219 MHz with a controlvoltage range of 0.5V~4.5V. ThisVCO features a typical phasenoise of -123 dBc/Hz @ 10KHzoffset and has excel-lent linearity. Outputpower is typically+8.5 dBm.Engineered and man-ufactured in the USA,the model CVCO55FL-0183-0219 ispackaged in theindustr y-standard0.5-in. x 0.5-in. SMDpackage. Input volt-age is 5 V, with a max. currentconsumption of 25 mA. Pullingand Pushing are minimized to 0.5MHz and 0.5 MHz/V, respective-ly. Second harmonic suppressionis -20 dBc typical.

The CVCO55FL-0183-0219 isideal for use in applications suchas digital radio equipment, fixedwireless access, satellite commu-nications systems, and base sta-tions. For pricing details, contactCrystek Corporation.

Family datasheets are availablefor download at the web pagewww.crystek.com

CRYSTEKwww.crystek.com

NEW 183-219 MHz VCOFROM CRYSTEK CORPORATION

AVX Corporation has recentlydeveloped two new series of TESmolded tantalum and TCH her-metically sealed SMD tantalumpolymer hi-rel capacitors offeringvery low ESR, high capacitanceand high voltage. The improvedconstruction of the new capacitorsallows the devices to be used forEuropean aerospace applicationsand offers a significant payloadreduction for power supplies.Compared with existing tantalumdevices for use in aerospaceapplications and manufactured inaccordance with ESCC standards,new TES series SMD tantalum chipcapacitors offer numerous down-sizing options on the one handand higher capacitance and lowerESR on the other hand. Thedevices have recently been EPPL2listed according to the new ESCCspecification ESCC3012/ 004. ForE case sizes as per the ESCC spec-ification a vertical multi-anodeinternal construction is being usedto reduce the ESR down to30mOhm. D case sizes use a ‘mir-

ror’ multianode design with thebenefit of Equivalent SeriesInductance (ESL) reduced to half.TES series SMD tantalum chipcapacitors are produced in AVX’sEuropean Space Agency (ESA)

qualified manufacturing plant inLanskroun, Czech Republic. FullQPL qualification is scheduled forthe third quarter 2013.

AVXwww.avx.com

New generation of multi-anode and hermeticallysealed SMD tantalum hi-rel capacitors from AVXenable payload reduction

Murata extends line-up of high permissive currentcapacitor series aimed at automotive applications

TMOV34S Varistors fromLittelfuse carry UL1449 recogni-tion to 750VAC to protect cir-cuits from abnormal overvoltageconditions. TMOV34S VaristorSeries’ higher voltage rangemakes it an ideal solution for solarpower inverter and high voltage

power supply applications. TheSeries is available at distributorRutronik as of now.Devices in the TMOV34S VaristorSeries combine a 34mm-square-format Varistor element (MOV)with high surge capability (up to40kA) with an integrated thermal-ly activated element. This element

will open in the event of over-heating due to abnormal over-voltage, limited current condi-tions. Some TMOV34S devicesinclude a monitor lead, which maybe connected to signaling circuit-ry to indicate if the MOV hasbeen disconnected from the cir-

cuit. Due to the close proximity oftheir integrated thermal elementto the MOV body, they can offerquick thermal response in a farsmaller component than solutionsthat rely on mechanical designs.


Rutronik presents: Littelfuse Varistorwith UL1449 recognition


Fully automated product changeovers In a joint project the Danish com-pany Danfoss Power ElectronicsA/S, in Hasselager, Denmark, andSIPLACE realized fully automatedproduct changeovers and non-stop setup changes onthe company’s SMTlines. Groundbreaking:controlled by the bar-codes on the PCBs mov-ing through the line –consisting of five high-flexibility SIPLACE SX2placement machines –each machine switchesplacement programs and convey-or widths as needed. By combin-ing SIPLACE software options withinnovative setup concepts, a non-stop SMT production was creat-ed, featuring random feeder

setup. The Danish maker of fre-quency inverters and power elec-tronics thus invests in process reli-ability, flexibility and speed inorder to guarantee to customers

in the future delivery times lowerthan 24 hours – despite an ever-rising product range.

ASM ASSEMBLY SYSTEMSwww.siplace.com

INDUSTRY NEWS

SMT

CyberOptics Corporation announ -ces that it has been awarded theBest Emerging Exhibit of the Year2012 China East and China Southby SMTA China for its all-newadvanced SPI system – theSE500ULTRA™. The awards recog-nize the best products at NEP-CON China and NEPCON SouthChina as judged by the highlyregarded Technical AdvisoryCommittee of SMTA China. Experience a new dimension toSolder Paste Inspection with theSE500ULTRA™ system that hasbeen designed to deliver thebest of everything: high speed,more accurate and repeatablesolder paste inspection results,and a revamped software userexperience. Through intensive research,CyberOptics has developed anall-new, improved ultra-fast sen-sor that, combined with a unique‘all-in-one’ scan algorithm, makesthe SE500ULTRA™ 30 percent

faster than any of its predecessorSPI systems. Plus, with its optimized directionsense, scanning on theSE500ULTRA™ is more efficientwith lesser number of swathsrequired, which also means muchless board height tracking and

vibration effects. All theseimprovements mean that usersnow can achieve up to210cm2/sec inspection speed at30μm resolution.

CYBEROPTICSwww.cyberoptics.com

CyberOptics Bags the Best Emerging Exhibit of theYear 2012 Award for its SE500ULTRA™ SPI System

Within only a few years, PP-Elektronix has become one of theleading electronics manufactur-ers in Poland. Maintaining a con-tinuous high quality level hasmade its name known through-out Europe, America and Asia. Byusing production machines fromEssemtec, Switzerland, PP-Elektronix can provide ahighly flexible full service.Inventing new ideas andsolutions to satisfy cus-tomer needs is a continu-ous challenge for techni-cians working for PP-Elektronix. The company,based in Lublin, Poland,offers custom, high-qualityelectronics manufacturing servic-es, combined with comprehensivecomponent management andtesting. PP-Elektronix is a dynamicteam of specialists, most of themeducated at the Faculty ofElectronics at the TechnicalUniversity of Lublin and many ofthem working for the companysince its founding nine years ago.When Piotr Policha founded PP-Elektronix in 2003, he already

had many years of experience inelectronics manufacturing. Hefocused on the assembly ofproducts that other manufactur-ers could not or did not want todo. Manual productions ofunusual or highly complexboards were his market niche. Inthe beginning, these services

were offered only to small- tomid-size enterprises in the Lublinregion. But the quality of PP-Elektronix was outstanding com-pared to others and, as a result,the company grew quickly, win-ning customers from all overPoland, Germany, the UnitedStates and even Japan.

ESSEMTECwww.essemtec.com

The Daily Search for New Ideas and Solutions

Nordson DAGE announces that ithas been awarded a 2012 GlobalTechnology Award in the categoryof Best Asian Product for itsXD7500VR Jade FP X-rayInspection System. The NordsonDAGE XD7500VR Jade FP X-rayinspection system uses the latesttechnology flat panel detector toprovide the market-leading, costeffective approach where highquality real-time imaging is need-ed for production tasks. This out-standing system utilizes its superiorFlat Panel detector to quickly cap-ture images with low noise at highgray scale depth resulting incrisper, faster imaging so providing

the production operator with opti-mum throughput for decisions onacceptable product quality.

NORDSONwww.nordson.com

Nordson DAGE’s XD7500VR Jade FP Named Best AsianProduct by Global Technology Award Program

VisionMaster, Inc. introducesA500, the best benchtop SPI sys-tem in world. Fully automatic, thesystem is set-and-forget SPI formonitoring and tweaking your sol-der paste printing process. The A500 is unbelievably easy-to-use. Simply open a Gerber fileand select the components thatneed to be measured by drag-ging the mouse. With a singleclick, the system takes over, auto-matically finding fiducials, identi-fying pads and filing away heightand volume data for each pad.Color-coded pads on the Gerber

data show pads outside thethresholds in real-time.

VISIONMASTERwww.visionmasterinc.com

VisionMaster Changes the Game with New BenchtopSPI System

AIM Solder Products Now Available throughOnline Leader Stanley Supply and ServicesAIM Solder has teamed with theelectronic manufacture supplyleader Stanley Supply andServices to offer AIM’s advancedsolder products online. The part-nership provides solder cus-tomers greater capabilities thanever before due to Stanley’sonline vendor managed inventoryprograms, nationwide supplycapabilities, and an e-commerceprocurement system that can sim-plify the supply chain. Stanley alsoprovides knowledgeable cus-tomer support, easy ordering andaccount management, same dayshipping, an online knowledgebase, and also international andgovernment sales. AIM’s solderline includes surface mount epoxy,SN100C lead-free bar solder,water-soluble and no-clean wiresolder, water-soluble and no-clean solder paste, flux, and more. “The availability of AIM Solderproducts on Stanley’s Web site is adefinite advantage for multi-site

customers offering material continu-ity with volume discounts,” said TimO’Neill, Northeast RegionalManager. Stanley Supply and Services hasbeen a leading supplier of prod-ucts for the electronic manufac-ture and assembly industry formore than 50 years and also isknown for Jensen Tools. To viewAIM’s solder line on StanleySupply and Services site, visitwww.stanleysupplyservices.comand type AIM in the search box.

AIMwww.aimsolder.com

OK International Debuts Metcal’s MX-5200 DualSimultaneous Rework SeriesInternational announced thelaunch of the new Metcal MX-5200 Soldering, Desoldering andRework Series, offering the sameincreased productivity andprocess control as the MX-5000Series, nowwith dual-simultaneousports.The MX-5200now featuresa dual simulta-neous useoption, mean-ing that twohand-piecescan work fromone power supply at the sametime. The dynamic option enablesthe two hand-pieces to share 80watts output power based ondemand, adding even more appli-cation flexibility and speed. Supporting the MX-5200 Seriessimultaneous dual operation arefour different hand-pieces and a

comprehensive range of solderingand rework cartridges. These include the MetcalAdvanced™ Hand-Piece for SMDrework, a Metcal Ultra-Fine™Hand-Piece for fine access, a

Precision Tweezer capable ofremoving a range of componentsfrom 0201 chips to 28 mmSOICs, and a Desoldering Gunfor safely removing through-holecomponents.

OK INTERNATIONAL www.okinternational.com

INDUSTRY NEWS

SMT


Micro-electromechanical systems (MEMS)combine logic elements and micromechanicalstructure on a single chip. Tiny measurementsensors measuring thousandths of a millimetresuch as springs, bars, weights or diaphragmsare etched directly into the silicon layer andcan detect linear acceleration, rotationalspeed, pressure or sound. The weak signalsare processed or amplified by the integratedelectronics and delivered via an analogue ordigital interface. MEMS have made many inno-vative applications possible – as accelerationsensors, as gyroscopes and microphones withtiny dimensions. They were pioneered by theconsumer, mobile communications and auto-motive markets. They were the first to recog-nise the uses of MEMS sensors, be it for con-soles that allowed users to participate in theOlympic Games in the comfort of their livingroom, in mobile phones that react to move-ment, in cameras for image stabilisation, or inairbags and ESP in cars.In light of this, the global market for MEMS isgrowing constantly, currently by around onebillion dollars a year. Global MEMS marketleader Bosch sold one billion units in the thir-teen years between 1995 and 2008, with thesecond billion taking just three years.STMicroelectronics is also pleased to haveexperienced such a sudden rise – in 2011, thecompany grew its MEMS sensor revenues byan enormous 80%, primarily in the consumerand mobile sector, and is thus now among themarket leaders in this segment.

The experience gathered here is something thatthe company would now like to use in othermarkets. There's more than enough potential –MEMS sensors open up entirely new applica-tions practically everywhere and can makeexisting applications more convenient, safer,more secure and more energy efficient, or evenadd new features to stand out from the compe-tition. The revolution that occurred in themobile phone market is yet to occur.

More operating comfortA promising field of use is that of human-machine interfaces (HMI). This is where theexperience from use in mobile phones can beexploited, with the tap and double-tap func-tions simply copied over. A type of HMI canalso be implemented with voice control, withmobile phones demonstrating the opportuni-ties – iPhone users can already use 'Siri' to man-

age their appointments or emails. Such voicerecognition and control technology is alsomade possible using MEMS microphones inother devices, such as navigation systems. Thesecombine small sizes with high audio quality androbustness. These benefits are also provided inhand-free kits or conferencing systems – with-out any additional costs. Omron, for example,offers MEMS microphones in the price bracketas traditional electret condenser microphones(ECM), but are more reliable and more robust.ST designs its MEMS microphones with aunique plastic packaging that enables slenderform factors and a longer life than conventionalmetal designs. The highest quality MEMS micro-phone from ST, the SNR model, is also suitablefor applications with stricter requirements thanconsumer applications, for example inphonometers and sound-level meters, whichrequire a high dynamic range.

Data from a Bosch Sensortec BMP085 / BMP180 pressure sensor during a lift transport

Industrial applications requiring a fine touchMEMS sensors

MEMS sensors have alreadyestablished themselves inmobile phones, tablets andso on. But these tiny sensorscan provide more safety,more security, more convenience, more comfortand less power consumptionin industrial, medical andhome appliance applications too.

DESIGN

SENSORS


More safetyRotational speed sensors are an example ofhow safety is being improved in drills. Theydetect the speed of the drill as soon as the drill

gets stuck in concrete and ensure that it is shutdown. Acceleration sensors make 'free-falldetection' possible, which is used predomi-nantly at present in laptop hard disks. If thesensor registers that it is in free fall, it ensuresthat the write and read head does not crashinto the disk, but rather is retracted in goodtime. This principle can be equally applied toa chainsaw or crane remote control, in order tomake the device safe using an emergency shut-off system if it ends up in free fall. The acceleration sensors detect even thesmallest movements and vibrations, meaningthat oil and gas pipelines or vending machinescan be protected simply and effectivelyagainst vandalism and valuable items can beprotected against theft. Machines can bechecked to determine if they are working cor-rectly by detecting their vibrations. Barometrics MEMS pressure sensors are capa-ble of measuring altitude differences to a pre-cision of 25cm. Unless satellite-based trackingsystems, which do not work in closed environ-ments due to poor or no reception, theseenable applications such as indoor navigationin shopping centres or car parks. These meas-ure the air pressure, which can be used todetermine the altitude and thus the storey.They are also used in navigation systems, forexample to locate a vehicle in a multi-storeycar pack. During fire brigade and police oper-ations, MEMS pressure sensors can even helpto save lives by locating accident victims inbuildings.

More efficiencyIf a machine switches off immediately when it isnot working properly, this also increases theirenergy efficiency. This can be further optimisedby combining multiple sensors. In a washingmachine, for example, pressure sensors canmeasure the fill level and acceleration sensorscan detect vibrations, thus enabling themachine to be controlled optimally in accor-dance with needs. Motion sensors enabledevices such as remote controls, lamps or audiosystems to be switched off automatically if they

do not register movement within the certaintime period. STMicroelectronics and BoschSensortec offer first-class products for applica-tions such as these. The LIS3DH (STMicro -

electronics) and BMA250 (Bosch Sensortec) tri-axial MEMS acceleration sensors are primarilyrecommended for use in mobile devices,because both are very energy efficient and small. The LIS3DH consumes only 2μA of power inultra-low power mode, while the Bosch modelrequires less than 5μA in low-power mode. Itsdimensions of 3 × 3 × 1mm (LIS3DH) or 2 × 2× 0.95mm (BMA250) are ideal for applicationswhere space is a commodity. Both sensors sup-ply values to ± 2g, ± 4g, ± 8g and ±16g preci-sion via programmable measurement rangeswith a sensitivity of 1mg/digit with the LIS3DHand 256LSB/g with the BMA250 in the 2grange. Their digital resolution is 12-bit or 11-bit respectively, the typical zero-g offset dur-ing the entire service life is ± 40mg for the STmodel and ± 80mg for the Bosch model.

Schematic diagram of a fill level gauge usingan LPS331AP MEMS pressure sensor fromSTMicroelectronics

The BMA250 acceleration sensor from Bosch Sensortec uses little power and is smallin size.

The LIS3DH acceleration sensor fromST consumes only 2 μA of power inultra-low power mode.

DESIGN

SENSORS


For mobile devices, intelligent power manage-ment, free-fall recognition and the step count-er function are also of interest. For HMI appli-cations, the sensors provide the means toadapt the display and provide tap/double-tapcontrol. They also support gaming and virtualreality functionality. Both manufacturers offersoftware and hardware tools for initial testingwith a user-friendly GUI. These provide a clearmeans to adjust and test settings and copythem later one-to-one into the application.Both ST and Bosch provide pro-gramming boards and softwarewith application programminginterfaces (API).

More mobilityThe various sensor types shouldnot be considered in isolation,however. By combining them,they provide applications with ahuge number of 'senses' that arealmost identical to those of ahuman being. Acceleration sen-sors combined with gyroscopes,for example, are capable of gen-erating complex movement pro-files. Both sensors are also avail-able in a single module, forexample in the LSM303DLCfrom STMicroelectronics. In just4 × 5 × 1mm, this module contains the LIS3DHtri-axial acceleration sensor and the L3GD20tri-axial gyroscope. This offers a full measure-ment scale of ±250dps to ±2000dps and has aprogrammable interrupt.MEMS sensors or modules enable remotemonitoring of patients or elderly people with-out limiting their movement. For example, ifthey fall, a nurse can be alarmed immediately,and mentally handicapped people who havegot lost can be found again. Occupational

therapy, training for sportspeople and medi-cine dosages can also be fine-tuned to a spe-cific movement profile and thus be designedto achieve greater effect. In blood pressuregauges, the sensor can check the position ofthe arm, thereby ensuring that they provide acorrect measurement when used at home. Instock breeding, the sensor can be used tospecifically measure out the amount of feedconcentrate depending on how much the ani-mal moves.

More degrees of freedomSensor modules that combine a larger numberof sensor types offer even more degrees offreedom (DoF). With their comparatively lowsizes, they are primarily suited to space-criticalapplications. The most popular combinationsat present are acceleration, gyroscope andcompass sensors. STMicroelectronics recentlypresented a multi-sensor module with ninedegrees of freedom. The iNEMO M1 inte-grates a 6-axis geomagnetic field sensor, a tri-

axial gyroscope and the 32-bit STM32 micro-controller together with special software – andthis with a compact size of just 13x13x2mm. Itcan be used to fully detect and process linearacceleration values, angular velocities, free-fallacceleration and direction, meaning that direc-tion, position and movement can be detectedprecisely. The sensor fusion software com-bines the output signals of all sensors, whileprediction algorithms and filter algorithmsautomatically correct distortions and inaccura-

cies in the measurements. Thisis how the module achieves ahigher degree of realism ingaming application, human-machine interfaces, robots andportable navigation devices, aswell as patient monitoring.

Making use of the abundantopportunitiesThe example show that theapplications and opportunitiesprovided by MEMS sensorsare practically infinite. Fordevelopers that wish to usethem for their application,however, they do also pose achallenge, because it is notalways clear to begin withwhich sensor type would best

serve their goals. A broad range of differentmodels and manufacturers on offer ensuresthat your perspective is not obscured at thebeginning of the development process.Rutronik maintains the by far most extensiverange of sensors and MEMS sensors with inno-vative products from renowned manufactur-ers. The right solution can be created for everyrequirement using this broad palette. n

www.rutronik.com/sensors

DESIGN

SENSORS

With its latest innovation inPanasonic Passive InfraRed sensors (PaPIRs), PanasonicElectric Works has realized yetanother eco idea. With a height of just 6mm (siliconlens type) or 9.7mm (polyethyl-ene lens type) and power con-sumption as low as 1μA, PaPIRscan be mounted anywhere, incon-spicuously controlling your motionsensing applications and savingenergy. The unique, flat siliconlens has an aperture of just 3mm,yet motion can be sensed atangles of 58° horizontally and 34°vertically. The slightly larger poly-ethylene lens type can sense

motion at angles of 94° horizon-tally and 80° vertically! PaPIRs are available in three priceclasses:• the high-end A series withexceptional design and electrical

characteristics• the B series with slightly largerdimensions• the moderately priced C seriesYou can select current consump-tion from 1μA, 2μA, 6μA or 170μA

depending on your applicationneeds. The standard detection dis-tance for the silicon lens model is3m and for the polyethylene lenstype 5m, but the sensing distancecan be increased up to 12m usingthe long-distance lens!Despite their miniature size andlow profile, PaPIRs incorporatethe best features of existingNaPiOn sensors such as an inte-grated amplifier and digital signalprocessing, which prevent erro-neous switching caused by extra-neous electromagnetic fields.

O’BOYLEwww.oboyle.ro

PaPIRs – Another Eco Idea from Panasonic


DESIGN

SENSORS

Energy CaptureSources of energy, such as light,wind, temperature, vibration,radio waves and even PH havebeen converted to usable energybut the challenge is how to con-vert the tiny amount of energygenerated to perform a usefulfunction, such as reliably power-ing an environmental sensor.Figure 1 shows a variety of theseenergy harvesting methods.An examination of the power

budget holds the key, togetherwith the harvested source and thecomponents. RF energy can beobtained from ambient energy orcontrolled by the use of a dedicat-ed transmitter. Devices using RFharvesting can be untethered andwork in almost any environment.

RF as a Power SourceRF energy can be harvested fromsources such as broadcast TV andradio stations, mobile phones andbase stations, and transmitters inunlicensed bands including915MHz, 868MHz or 2.4GHz,making it commercially viableworldwide. RF does not dependon the time of day or requireexposure to heat or wind, and canbe moved freely within the rangeof the transmission source. Energycan transmitted continuously, on a

scheduled basis or on demand. Arechargeable battery or supercapacitor can store the convertedRF energy for operation duringthe peak periods.

Selecting a Low-PowerComponent A convenient and reliable powersource is just the start; a propersystem design is needed to maxi-mize performance with the tinyamount of energy provided. This

can be addressed by either usingextremely low power componentsor implementing power balancing.The trend for lower-power elec-tronic components is fueled byconsumer demand for portableproducts, and has delivered newlow power microcontrollers, ana-log, radios and communicationprotocols that complement RF har-vesting. Low power consumptionlevels are standard on Micro -controllers. Microchip’s PIC24Fwith eXtreme Low Power (XLP)technology consumes only 20nAwhile sleeping, and can executecode with currents as low as 8μA.Analog components and a radioare required to complete an envi-ronmental sensor. The radio stretches the power-budget because of the protocolused and the Transmit/Receive

(Tx / Rx) current. New radios havestarted to address the issue, andnow feature receive currents aslow as 3mA, which helps toreduce power consumption, butthe wireless communications pro-tocol remains the driving factor.

Balancing PowerLong execution times and bloatedwireless protocols will consumethe power budget when workingwith the tiny amounts of powergenerated by energy harvesting.The key reduction is to select aprotocol that allows for scalingfunctionality. Microchip’s MiWi™protocol allows for minimalistimplementation, with radio trans-mission times driven as low as 5ms. Power management throughcharge-based execution andstate-of-charge monitoring willdeliver further improvements. Power is cut off completely fromthe sensor system in charge-basedexecution. When the RF harvesterhas collected enough energy thedevice consumes zero power whilereplenishing the energy reservoir.

The frequency of the sensor’s exe-cution is dependent upon the rateof charge to the reservoir. This isimpacted by distance to the RFsource, the receiving antenna, andobstructions such as walls, whichworks well when the sensor islocated such that the frequency ofsensor operation is fitted to theneeds of the overall system. Toavoid flooding the network withunnecessary packets the RF har-

vester can also use the receivedsignal strength (RSSI) as a mecha-nism for controlling the rate of datatransmissions. If the RF harvester is charging abattery, a microcontroller can beused to monitor the length of thecharging cycle and estimate thestate of charge. It can then calcu-late the run-time based on whatsensor operations are performedby recording the current con-sumed during the various parts ofthe sensor operation. For exam-ple, the sensor node might con-sume 100μA when measuring thesensor’s output, and 20mA duringthe radio transmission of thatdata. The microcontroller can usethis information to estimate thecharge that will be depleted eachtime one of these functions iscompleted. The state of charge isthus found in the comparisonbetween charging and depleting.This method can taper off the fre-quency of sensor transmissions,based upon state of charge andcan even call for help, by transmit-ting a message to the RF powersource to send more power.

Energy Harvesting: The Practical SolutionRF harvesting is a viable option fora wide range of applications withproven technology providing aplatform for prototyping newproducts. Battery powered sensorscan be replaced with a selection ofcomponents and power balancing.RF harvesting is a practical optionproviding control of the sourceand the ability to operate in anyenvironment, which may also driveRF harvesting to the mainstream.RF harvesting is the first proven andreliable option; it meets environ-mental regulations and CSR re -quirements, makes economic senseand avoids being at the mercy ofthe sun, wind or unpredictabletemperature conditions. nwww.microchip.com

by Jason Tollefson, Product Marketing Manager, Microchip Technology

Figure 1: Power Density of Energy Harvesting MethodsSource: The Journal of Technology Studies

Figure 2: Advantages of RF Energy Harvesting

Remote Sensors Powered by RF Harvesting


DESIGN

SENSORS

PRODUCT DESCRIPTIONThe new C44 from Contrinex offers enhanced performance, reliabilityand flexibility at an extraordinary price performance ratio. The activeface is mountable in five directions, giving you the freedom to adaptthe sensor to your application and not the other way round.• Highly flexible sensor solution;• Suitable for rough environments, IP 69K impervious;• High switching frequencies;• Changeover outputs;• Rotatable active face;• 100 % compatibility with Pepperl + Fuchs mounting systems and easy interchangeability.

AUTOMOTIVE INDUSTRYTo reach the high automation degree needed in modern automotive factories, flowless processes are of utmost importance.C44 offers enhanced sensing technology enclosed in a rugged industry standard housing that not only ensures process sta-bility but also lasts in these rough conditions. Its flexibility helps you solve various applications.• Reliable switching;• Quick and tool-free installation;• 4 indication LEDs;• Active face is mountable in five directions.

AUTOMATED MATERIALS HANDLINGAutomated materials handling systems improve efficiency, which enables logistics systems to respond quickly and efficientlyto plant and customer requirements. To ensure all this, a reliable, robust and flexible sensing solution is needed.• Reliable and cost-effective sensing solution;• Quick and tool-free installation;• Long operating distances.

AMUSEMENT RIDESAmusement rides make children’s dreams come true. To realize these dreams safely a lot of technology is needed. Reliablesensing devices play a major role in controlling positions and delivering accurate information to ensure safe operation.Reliability, robustness and a long lifetime are required independently of the environmental influences.• Resistant to environmental influences IP 69K;• Temperature range from -25°C to +85°C;• Active face mountable in five directions.

New Products - AUTOMATIONTEST THE BEST - C44

Tel. +40 256-201346 Mail [email protected] +40 0256-221036 Web www.oboyle.ro

RELIABLE SWITCHING IN ROUGH ENVIRONMENTS


DESIGN

SENSORS

n Optical sensorsn Sensors for logistic applicationsn Safety at work

n Optical Sensorsn Inductive Sensors

n Color Sensorsn True Color Sensors, Spectrometersn Gloss Sensors

Leuze

Contrinex

Sensor Instruments

n Linear Sensorsn Angle Sensorsn Tilt Sensors

n PLCsn Temperature Controllern Timer

n Flowmetersn Level Indicators and Switchesn Pressure Sensors and Switches

ASM

Selec

Koboldn Linear Solenoidsn Permanent Electromagnets

Westec

HTP

Intertec

Visit our online shopww.oboyle.ro

n Circular connectors M8; M12; M23n Cable and Connectors for Sensorsn Valve Connectorsn Distribution Blocks

n Heavy Duty Industrial Connectorsn Power and Data Transmission Connectorsn Aluminium Junction Boxes

AUTOMATION

Nowadays, energy efficiencyand caring for our naturalresources is on everyone'smind.With the AEQ series switches,optimized specifically to handlelow level loads in the μA range,Panasonic Electric Works presentsanother trend-setting, environ-mentally friendly product. A newly developed contact sys-tem primarily differentiates thePanasonic AEQ series from con-ventional ultraminiature switches.Sliding contacts mean the contactforce does not depend on theactuating path but rather ensure astable and even contact force

across the entire actuating area.This innovative sliding contactsystem also guarantees bounceless operation. Over travel of 2.2mm on the NO

side and 2.5mm on the NC sideenables a high degree of toler-ance during the design phase andhence makes the switch attractivefor a wide variety of applications.

In comparison to conventionalmicroswitches, the AEQ series canreliably switch loads that arelower by a factor of 10. A switching capacity range from0.1mA/3V DC to 100mA/30V DCis guaranteed, opening up newdimensions for developing ener-gy-efficient applications. An IP40 degree of protectionallows this switch to be imple-mented in all kinds of applica-tions, from household appliancesto safety applications to measure-ment technology.


AEQ microswitches from Panasonic the most energy-efficient way to reliably switch low level loads


INDUSTRY NEWS

CONNECTORS

Here is a solution that many ofthose who develop telecommu-nications and networking prod-ucts for use in industrial and dataprocessing technology as well asfor a broad spectrum of otherapplications have been waitingfor: In the form of its030183MHFG4M565ZA prod-uct, SUYIN is offering a highlycompact connector that bringstogether an RJ45 jack and twoType-A USB receptacles to meetthe needs of complex applica-tions. This female connector,which has been designed forthrough-hole mounting andoffers a total of 18 + 14 terminals,is fitted with contacts featuring10 μm to 50 μm gold plating over50 μm nickel plating, and it hasoverall dimensions (L×W×H) of27.30 mm × 18.80 mm × 30.96mm. The RJ45 jack (8P/8C) isequipped with eight transmit/receive filters (transformer mod-ules) as well as two high-luminos-ity LEDs (green/ orange and yel-low). During transmission of10/100/ 1000 Base-T signals, theinsertion loss is specif ied atbetween 1MHz to 125MHz at -1.2dB (min.) and the common-mode rejection as well as thecrosstalk are specified as being

within the range of 1MHz to100MHz, both at -30dB (min.).The dual USB-A jack complieswith the USB 3.0 standard andoffers an insulation resistance of1000MΩ (min.) with a dielectricstrength of 750VAC. Sophisticated shielding measuresprotect this complex componentagainst electromagnetic interfer-ence. Custom variants with orwithout filters and with modifiedwiring diagrams are availableupon request – as well as customspecific platings.

SUYINwww.suyin-europe.com

Convenient Combination

At Electronica 2012 ITT Inter-con-nect Solutions presented its com-plete range of MIL-DTL-38999series III connectors. ITT’s advancesin design and engineering haveenabled a redesign of its D38999offering which introduces productimprovements, achieves fasterassembly times and reduces costs.The established market leader inhi-rel D38999 specification mili-tary interconnects; ITT ICS is alsothe only connector company tohave been awarded silver statusin the ADS SC21 supply chaininitiative for aerospace, defenceand security companies. TheQPL-approved MIL-DTL-38999Series III connector range utilisesnew elastomer technologies foreven greater reliability, ensuringenvironmental sealing through-out the entire connector system.Cavity identifiers are black laser-

marked on the white grommetswhich provides easy identificationfor assembly accuracy andreduced assembly rework. Fewerinternal parts and simplified con-nector construction have resultedin faster and easier final assembly.As well as QPL-qualifiedCadmium olive-drab and silverNickel platings, ITT also offersRoHS-compliant platings specifi-cally for the European market.

ITT INTERCONNECT SOLUTIONSwww.ittcannon.com

QPL approved MIL-DTL-38999 Series III connectorsfrom ITT ICS are assembled on short lead times

By employing sophisticateddesign and production tech-niques, SUYIN has again succeed-ed in further reducing the widthand length of its female D-subconnectors. Its 070546XR015XX69XX model is a 15-position,right-angle high-density (HD) D-sub socket with extremely com-pact dimensions of just 20.6mm × 10.9 mm (L × D). Thisreversed-type three-row D-sub connector is designed forthrough-hole reflow (THR)mounting using a pin in pastesoldering process. Two sol-dering tags attached to thesides provide extra stabilityfor anchoring on the PCB;they ensure a sturdy hold, evenwhen high insertion and removalforces are applied. The number ofmating cycles is specified at 5,000.Other technical specifications forthis compact D-sub socket are acontact rating of 250VDC/0.5Aper pin, a low contact resistance of50mΩ (max.), an insulation

resistance of 1,000MΩ (min., ini-tial) and an operating tempera-ture range from –40°C to + 105°C.This lead-free, HD D-sub socket isspecified in accordance withUL94V0 and is available in thecolours black, blue and grey. Theyare supplied in reel packagingwith placement caps. SUYIN offers

them beginning at order volumesof 80,000 pieces per year, and – ofcourse – provides small batches tohelp you launch your project.Customer-specific adaptations areavailable upon request.


SUYIN’s primary strength lies inits ability to adapt connectors tomeet its customers’ exactrequirements as well as the needsof the given application in termsof form and function. To do this,SUYIN – as a Taiwanese companywith production locations anddevelopment teams in China, butwith technical support, service,sales and logistics teams based inGermany for its European cus-tomers – draws on both stan-dardized subcomponents and onthe tremendous expertise that ithas developed in recent decadesin areas such as industrial, auto-motive and communicationsapplications.A good example for the designrule that “form follows function”can be seen in a RJ45 jack with ahousing that has been adaptedto match the product design pre-cisely. This right-angle, surface-mount RJ45 jack with high-quali-ty 8P/8C contacts (S1 to S6 with 5μm to 50 μm gold plating over 30μm nickel) is housed in a shieldedplastic housing that has been

nicely rounded to match thedesign specifications. In accor-dance with another of the cus-tomer-specific specifications,mounting on the printed circuitboard can be countersunk by1.92 mm. Two side-mounted sol-dering tabs ensure an ideal fix onthe PCB. All of the other technicalspecifications for the tempera-ture range, dielectric strength,

number of mating cycles, inser-tion and removal forces, plating,and many other characteristicsalso match the requirementsdefined by the customer or bythe relevant state-of-the-art stan-dards.


SUYIN – Custom tailoring for connectors

SUYIN's new HD D-Sub socket – appreciating the“little things” in life


INDUSTRY NEWS

CONNECTORS

ITT Cannon has recently releaseda new Zero Insertion Force (ZIF)Quad Lock Connector (QLC) foruse in medical imaging and diag-nostic equipment. The device isan industry first which achieves areduction in interconnect packag-ing whilst accommodating robustperformance requirements andfunctional enhancementssuch as press-fit. Reducingthe spacing from the stan-dard DL line to 0.8mmmade it possible for ITTICS’ engineers to designthe ZIF QLC portableconnector system with afull 260 pin configurationand a reduced package size - it isup to 65% smaller than existing DLproducts and competitive QLCproducts currently on the market.This enables customers to achievea drastic reduction in the overallsize of diagnostic equipment. Thehigh pin count of 260 positionsoffers multiple channel optionsand makes improvements to

image resolution possible at thedesign stage, which will ultimatelyresult in enhanced diagnosticfunctionality. The ZIF QLC con-nector system exceeds 20,000mating cycles - an industry “best inclass”. Utilizing two 130 pin PCBsurface mount connectors makesthe Zero Insertion Force Quad

Lock Connector more flexible incustomer PCB designs. The com-ponent incorporates a patentedand unique extended insulator tosecure the four locking pins andmore than double the connectionretention force.


New Zero Insertion Force Quad Lock Connector fordiagnostic and imaging medical equipment fromITT Cannon

ITT Interconnect Solutions hasdeveloped a new composite con-nector specifically for the aero-space market. Today’s military andcommercial aerospace manufac-turers are under continual pres-sure to reduce the weight of oper-ational aircraft and lightweightcomponents can play a key role inachieving this. Consequently,many OEM’s are migratingfrom aluminium to light-weight composite materialsfor all components. Suitablefor both commercial and mil-itary aircraft, the new MIL-DTL 38999 series III compos-ite connector is engineeredusing advanced materialsand techniques coupled withITT’s thirty years of proven inter-connect design expertise. Marketed under the ITT Cannonbrand, the new MIL-DTL-38999series III composite connector ison average 30% lighter than

equivalent standard aluminiuminterconnects. Full advantage hasbeen taken of recent improve-ments in the qualified ‘KJB’ design,which include part standardisationplus faster and easier assembly.Qualified operational tempera-ture range for Class J is -65°C up to+175°C, and for Class M -65°C up

to +200°C. Suitable applicationsinclude commercial and militaryaircraft, avionics systems andunmanned aerospace vehicles.


New composite MIL-DTL-38999 series III connectorfrom ITT Interconnect Solutions reduces aircraftweight

Mobile communications haveevolved over the past 20 yearsand have led to new, complexapplications. Initially, SIM cardswere only used for security andidentification on the network.Today they perform many every-day tasks. Users can make pay-ments with a SIM card or use it asa ticket. It is even possible tosecurely download multimediafiles or perform online bankingtransactions. SUYIN is now pre-senting the 33ZL version from its254070FB series, an 8-pin SIMcard reader for mobile phones,notebook computers, navigationand other mobile applications.This new card connector featuresa low mounting height of 1.73 mmand a push-push mechanism thatmakes it easy to use. It has a foot-print of 19.3 mm × 26.65 mm (L ×W) and a standard-mount design.In addition, the connector isequipped with a switch that reli-ably detects whether or not a cardis currently inserted. Four solder-ing tags attached to the sidesensure high stability for anchoringon the PCB. The card connector’s

operating life is specified at up to5,000 mating cycles. Further tech-nical specifications include anoperating temperature rangebetween –40°C and +85°C and amaximum initial contact resistanceof 100mΩ at the connector con-tacts. This card connector is con-figured for a maximum of 10VDCand 0.5A per pin.

Key specifications at a glance:Connector type:Low-profile SIM card connectorwith user-friendly push-pushmechanismNumber of contacts: 8-pinDimensions:19.3×26.65×1.73 (L×W×H mm)Part number254070FB009XX33ZL


Harwin has introduced a newhigh-reliability connector familybased on a 1.25mm pitch. NamedGecko, the new connectors havebenefited from Harwin’s excep-tional track record of manufactur-ing high-reliability con-nectors for safety-criti-cal applications.Harwin’s low profileG125 series connectorsare designed to offerhigh performance in aminiature package. The1.25mm pin spacingresults in a 35% spacesaving over other high-performance connectors such asMicro-D. The connectors arerated to handle 2A per contact.Tested and proven to allow highperformance in extreme condi-tions, the G125 family can oper-ate within a wide temperaturerange (-65 to +150°C) and underextreme vibration (Z axis 100g6m/s). This high performance ismade possible by Harwin’s four-

finger patented Copper Alloycontact. Offering up to 50 con-tacts per connector and availablein dual row cable-to-board andboard-to-board configurations,Gecko family connectors include

a wealth of features includingpolarization points that preventmis-mating, easy identification ofthe No 1 position for fast visualinspection and optional latchesthat allow simple and fast de-latching that requires no specialtooling.

HARWINwww.harwin.com

Hi-Rel just got smaller – new 1.25mm connectorsfrom Harwin suit demanding applications

Keeping a low profile with SUYIN


EUROSTANDARD PRESS 2000

Tel.: +40 31 805 9955

Fax: +40 31 805 9887

[email protected]

www.esp2000.ro

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Company number: J03/1371/1993

EP&Dee (Electronics Products & Design Eastern Europe) is published 8 times per year in

2012 by Euro Standard Press 2000 s.r.l.

It is a free to qualified electronics engineers and managers involved in engineering

decisions. Starting on 2010, this magazine is published only in digital format.

Copyright 2012 by Euro Standard Press 2000 s.r.l. All rights reserved.

© 2012 by Eurostandard Press 2000

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AdvertisementIrina Ganea

WEBEugen Vărzaru

Contributing editorsRobert Berger Ross Bannatyne

ConsultingMarian BlejanBogdan GrămescuMihai Savu

Asian Reprezentative Taiwan Charles YangTel: +88643223633

[email protected]

INDUSTRY NEWS

KITs

Gas Sensor - Spirits testerThis instrument indicates gases such as alcohol,acetone, benzole, propane, carbon monoxide(contained in the smoke of fire). Perfect asalarm for gases and fire.

Ultrasonic proximity sensorAn LED lights up if a body approaches theultrasonic sensors at a distance of 10 - 80cm(depending on the size of the body). Use:parking-in assistance for cars in garages, alarmsignal for persons or animals staying in a cer-tain area. Operating voltage: 9 - 12 V/DC. The device works according to the same prin-ciple as the ultrasonic echo ranging of bats!

Temperature switch 12 V/DCSwitches according to a preset temperature (-30°C to +150°C) a relay on or off. Ideal asthermostat, ice alarm, fire detector, etc

Infrared light barrier 4 mReady assembled infrared light barrier withtransmitter and receiver. Range: more than 4metres. When people walk through the lightbarrier quickly, a relay switches on, in a time of0,5 - 7 sec. It does not react on short interrup-tion (example: insects) or on very long inter-ruptions (example: slow walking). Thus it ispossible to switch on a bell, counter or lamp orthe like for this period.

Stepper motor driver 6 PinA stepper motor with 6 connections can beoperated at this module. It is possible to changethe direction of rotation of the motor. The num-ber of revolutions of the motor can also beadjusted from ca. 2 - 1000Hz (impulse

sequence). For motors from 5 - 12Volt, max. 2A.The operating voltage of the module dependson the operating voltage of the motor (5 -12Volt). Furthermore a potentiometer 1M lin-ear and a switch 2 × change over are necessaryfor operation. These parts are not included.The module works without computer and canonly control the direction of rotation and thenumber of revolutions of the motor. A con-trolled program flow is not possible!

PWM Power control 9-28 V/DC, max. 10 APower control to control direct current loads(motors, lamps, heatings, LEDs with protectiveresistors, etc.). Electric motors start well also atlow revolution speeds because of theemployed PWM (pulse width) modulation


Kemo Electronic can offer unassambled kits (the packagecontains: PCB, electronic parts, assembly instructions) andassambled modules (ready to use in its application)

ep&dee no 9 - november 2012

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