29.07.2011 1

From Chip to Systemthe demanding challenges for

power semiconductor producers

In this talk we want to:

Look at the market trends

Tell you what demands they are placing on semiconductor producers

Show you the technological challenges and solutions we have

……up to now

Show you how far we’ve come

29.07.2011 2

Challenges imposed by the market

Our application expertise

The challenging technological demands we face

How far we’ve come

Enabling Technology

29.07.2011 3

Energy demand: challenges and opportunities

By 2030 global energy demand increases 50% over today (2% p.a.)

Europe is a forerunner in modern energy and climate policy, and

Germany a prime example of the use of new energy technologies

to reduce CO2 emissions by 14% by 2020 (vs 2005) the regenerative

energy share is to be more than doubled to 30% (70% by 2050)

29.07.2011 4

Renewable energy: Rising demand - Reducing cost

Political requirements & financial incentives drive the market

Photovoltaics still regarded as most expensive renewable source, but

falling in cost

By end 2010 price drops to €1/Watt (down from €3.5) are expected

Price/kWh of solar electricity will move into the range of conventional production

Single converters of 0.5MW, rising to 1MW

PV plants up to 10MW common, with 60MW plants in operation

Wind generator costs are below those of solar PV

Wind generators average size is increasing from 2MW to 3MW,

large units of 5MW are in use.

29.07.2011 5

Profitable for the power semiconductor industry

Power semiconductors needed for energy conversion

Grid tied converters for Wind and Solar PV

Active front end boost rectifiers for wind generators

Power semiconductors are core element of variable speed drives

Solar trackers for PV installations

Blade pitch adjustment for wind generators

Precise feed and mixing of Biomass material in biogas plants

Variable speed drives save energy of mostly non-controlled motors consuming large

part of electrical power generation

Power semiconductors for renewables is the largest growth market

Mere 7.5% share of the market in 2008

Growing at 25% per annum

Expected to generate US$380 million in sales in 2012

29.07.2011 6

29.07.2011 7

Don’t forget electric vehicles

Forecast 20% of Global Automobile Market by

2030

Climate change grows as an issue

Reduced emissions, noise, operating cost

Obstacles:

Li-Ion Battery cost & lifetime ~US$1000/kWh (16kWh

in Volt, 24kWh in Leaf)

Recharge stations/ smart grid

Challenges imposed by the market

Our application expertise

The challenging technological demands we face

How far we’ve come

Enabling Technology

29.07.2011 8

29.07.2011 9

Application expertise

1 MW

100 kW

10 kW

1 kW

1 kW

100 W

29.07.2011 10

Systems, Solutions, SKiiP in 3 growing markets

Electric

vehicles

Renewable

energy

Industrial

drives

25% yearly growth

29.07.2011 11

Top 4 markets → 86% of revenue

SEMIKRON revenue in core applicationsStrongest market growth in solar and wind applications

Drives 35%

Wind, Solar 31%

Power Supply 12%

E-vehicles 8%

Others 14%

29.07.2011 12

IGBT

MOSFET

Thyristor

Diode

SEMITRANS SEMITOP

MiniSKiiP

SystemSEMiX

Focus on power electronics - from chip to system

SEMI-

STACK

SEMiSTART

Market leader with 30% market share in diode / thyristor modulesSource: IMS Research “The global power semiconductor market 2010”

Module Solution/SystemDiscrete

SEMIPACK

SEMIPONT

SKiiPSKiM

Driver

29.07.2011 13

Innovative portfolio

11% Rest

47% Modules

42% Embedded Systems, Solutions, SKiiP

In % of revenue

Challenges imposed by the market

Our application expertise

The challenging technological demands we face

How far we’ve come

Enabling Technology

29.07.2011 14

Challenging technological demands:

In all sectors, reliability is top priority as this guarantees economic

operation

Compact size

High efficiency

These demands are conflicting

As converter power increases, components are massively paralleled

Size must shrink

Power density increases, heat management becomes difficult

For example: 3MW wind turbine

45kW power losses in power semiconductors

Equivalent to heating system for 3 homes

29.07.2011 15

Demands on design

Windpower

Demands:

Very high intermittent operating lifetime

Long term availability

Very high reliability

Environment:

Very difficult to access

Extreme cyclical nature of load

Large temperature swings

High vibration

Solar is similar, with less short term cycling

PV systems have largest potential for increasing efficiency of panels and overall

system design

Higher switching frequencies

Higher DC link voltages

Topologies: AFE booster, 3 level GTI

29.07.2011 16

29.07.201117

Electric Vehicle requirements are most severe

High ratio output power / volume

High ratio output power / weight

Passive temperature cycles @ ΔT 100K 10.000 cycles (two cold starts every day for 15 years)

Active temperature cycles @ ΔT 40K 3.000.000 cycles

Non-operational life 20 years

Operational life 10.000 h - 50.000 h

Ambient temperature -40°C to +135°C

Liquid cooling -40°C to +105°C

Vibration 5g-12g random

Shock 50g-100g

Protection class IP 54 – IP69K

Automotive power market is a special challenge

Only 4% share for power modules, but growing ~19% p.a.

Special challenges are:

High ambient temperature

High number of cycles

Compact size

Shock and vibration

Design challenges:

Chip temperatures increase to 175°C

Cooling density increases

Temperature gradients much larger

Solder joints fail

Large module base plates deform

Symmetrical operation of large numbers of parallel chips

These challenges are not much tougher than high power renewables!

29.07.2011 18

Challenges imposed by the market

Our application expertise

The challenging technological demands we face

How far we’ve come: 2011

Enabling Technology

29.07.2011 19

29.07.2011 20

SKiiP 4

Lowest thermal resistance 13,8 K/kW

Most powerful module on the market with 3600 A

33% more power than SKiiP3

100% solder-free, sintered chips

Unique burn-in test, in real converter mode

Approx. 2 hours under worst case conditions

Junction temperature of the silicon reaches up to 140°C

SKiiP4

13,816,5

19,0

Mega

Dual

Prime

Pack

In 2010: 3MVA converter >4MVA/m3

3 MVA 3-phase inverter fits into standard

600mm x 600mm x 2000 mm cabinet

29.07.2011 21

29.07.2011 22

Qualified and tested power semiconductor solutions, air- & water-cooled

Solution Center platforms in 2011

SKiiPRACK 450 kW - 2,5 MW

Synchronous wind generators

Double-fed wind generators

Solar inverters

High power inverters

SEMiXBOX 10 kW - 100 kW

Elevators

AC/DC drives

Solar inverters

Uninterruptible power supplies

SEMIKUBE 75 kW - 1 MW

Solar inverters

Industrial inverters

Pump & compressor drives

29.07.2011 23

Powered by SKiiP® Technology

Almost every 2nd windmill is powered by SEMIKRON technology

57 Gigawatt wind capacity is powered by SEMIKRON

122 Gigawatt is the worldwide installed wind capacity since 1993 (Source: BTM Consult ApS, 03/2009)

560.000 electric fork lifts are powered by SEMIKRON systems

8.300 hybrid buses save 30% fuel with solder-free SKiM IGBT modules

29.07.2011 24

Experience in electric/hybrid vehicles since 1992

SEMIKRON automotive projects

Hybrid trucks

Agricultural vehicles

Construction vehicles

Passenger cars

Racing cars

Hybrid busses

29.07.2011 25

VePOINT - a SEMIKRON company

100% subsidiary of SEMIKRON Automotive Systems GmbH & Co. KG

Specialising in the automotive market

Developing and producing for electric and hybrid cars

Inverters

DC/DC converters

Chargers

Goal: smaller power electronic packages

higher power density

higher integration level

29.07.201126

Platform technologies used for vehicle application

Electronics

Packaging

Chips

CALSiC

SOI

BOT Le

ve

l sh

ifter

Bootstrap

TOP1

TOP2

TOP3Logic

I/O

No base plate

Spring contacts

Terminal: pressure contactSinter joint between

chip and DCB

100% solder-free – long lifetime

29.07.2011 27

SKAI Systems in 2011

Fully integrated systems

for vehicles

29.07.201128

SKAI = SEMIKRON Advanced Integrated System

Heat sink

ProtectionGate driverPower supply

DSP controller

CAN comm., external I/OAux. power

IP67 enclosure

Water inlet Water outlet

ACΦ1

Φ2

Φ3I

I

V

T

temperature

voltage

currentDC+

DC-

DC link

capacitorI

SKAI model range

29.07.2011 29

SKAI HV

Vbattery: 150-850V

250kVA in 448x244x109mm

Motor Ratings:

150kW (1200V IGBT)

100kW (600V IGBT)

SKAI LV

Vbattery: 24-160V

Up to 55kVA

29.07.2011 30

Case study: Pioneer in tractors with generator

Objective

Reduced fuel consumption

Increased power

14V on-board power-supply with 50% more power

More power in the main drive thanks to optimised

cooling

Solution

Generator connected to the main drive powers

Fan, air compressor, air conditioning, 14V on-

board power-supply

Customised multi-converter system in a water-

cooled IP67 case

M M

G

20KW

750V

DC-bus

pre-charge

10W/14V

Charge

1,2KW/14V

Air con

5KW/480V

Motor fan

10KW/480V

Battery M M

Challenges imposed by the market

Our application expertise

The challenging technological demands we face

How far we’ve come

Enabling technology

29.07.2011 31

Technological evolution

Soldertechnology

1974 1992 1996 2007 2011

Spring contacts

Replaced solder pins

Provides electrical connection to the controller

100% solder-free

Sinter layer between DCB and chip

Replaces solder layers

Sintered SKiN flex layer

Replaces wire bonds and thermal paste

Double-sided chip sintering

Pressure contact technology

Reduced numberof solder layers.

No copper base plate needed

Standard technology

Solder pins and screw terminals

7/29/2011 32

33V. Demuth 29.07.2011

SKiM: no solder

Substrate with gold flash surface

Sinter layer (silver powder)

Chip

Pressure < 50 MPa

Temperature < 200 °C

Silver powder before sintering Silver powder after sintering

29.07.2011 34

SKiiP: Construction principle

Chips: IGBT4/ CAL4sintered

TerminalsPressure contacted

No base plateDCB directly pressed to

heat sink

Heat sinkLiquid, air, customized

Gate driverSpring contacted

Additional fixationMore robust against external

forces

3600A Module rating

35V. Demuth 29.07.2011

SKiM: the combination of the best

High performance

TerminalsPressure contacts

Low thermal

resistanceDCB directly on heat sink

Revolutionary

stability of chip /

DCB connectionSintering instead of

soldering

29.07.2011 36

Sinter + Spring + SKiiP Technology = 100% solder-free

Chips

CALSiC

Electronics

SOI

Technology

100% solder-free = long lifetime = SKiM

Packaging

No base plate,pressure contact

Sinter joint betweenchip and DCB

Springcontacts

+ +

SKiN Technology

New packaging technology

No wire bonds, thermal paste or solder

Standard Technology Wire bond-free

Wire bond-free

Wire bonds replaced by sintered SKiN flex layer

Double-sided chip sintering for excellent thermal and electrical chip characteristics

Continuous sinter layer on top of chips → 25% higher surge currents than with

wire bonds

SKiN Technology

Wire bonds

Soldered

Wire bond-free

Solder-free

Standard Technology

7/29/2011 38

Thermal paste-free

30% lower thermal resistance at 0.65 K/W

Increased thermal conductivity results in improved chip cooling and higher

inverter current

Thermal paste replaced by sinter layer between DCB and heat sink

SKiN Technology

Chip + DCB

Thermal paste

Cooling

0.25

0.25

0.35

Standard Technology Rth[j-a] [K/W]

0.85 0.65

0.28

0.37

Heat dissipation @ 81mm2 chip size 95W 125W

7/29/2011 39

Current density doubled – 3.0 A/cm2

3 MW inverter 2200 Arms per

phase

Compact integration of driver,

protection, interfaces, snubbers

and semiconductors in SKiN

Technology

1.5 A/cm2

Module based unit

3.0 A/cm2

SKiN based unit

7/29/2011 40

10 x higher power cycling

10 x higher power cycling compared to standard modules

Expected life time: 20 years

High chip junction temperatures ≥ 200°C for SiC and GaN can be exploited

thanks to sinter technology

Power cycles to failure

SKiN Technology

Standard Technology

10x higher

2.000.000

200.000

∆Tj [K], Tj,max = 150°C

30 40 50 60 70 80 90 100 110 120 130

100.000

1.000.000

7/29/2011 41

For 35% smaller inverters

Wind power

3 MW 4-quadrant inverter, low-voltage

Compact integration of driver, fiber optic

interfaces, DC-link, capacitors, liquid

cooling and power semiconductors in

SKiN Technology

Automotive

90 kW in 5.5 l, liquid-cooled

8.5 kg, IP6K9K protection

Compact integration of 3-phase IGBT

inverter, DC-DC converter, cooling,

controller, DC-link and capacitors

7/29/2011 42

Packaging

The SKiN flex layer replaces

the bond wires

Chips are sintered on chip

upper and underside

The thermal paste layer is

replaced by a sinter layer

Terminals are sintered to the

DBC

7/29/2011 43

Flat integration

Interface to driver / controller via the SKiN flex layer

welded on the PCB side by side

Example showing flat, sintered terminals

7/29/2011 44

Flexible integration

The connections are flexible and can be bent upwards

The driver / controller can be placed on the upper

above the SKiN flex layer

7/29/2011 45

3D integration

Future integration of driver and protection functions on the upper

of the SKiN flex layer possible

Advantage: optimum switching control owing to close location of

driver and IGBT

7/29/2011 46

Wire bond-free

Thank you