g2m research multi-vendor webinar #2: nvme ssds: new...
TRANSCRIPT
RESEARCH
G2M Research Multi-Vendor Webinar #2: NVMe SSDs: New Features and Form FactorsSeptember 11, 2018
Sponsored By:
2 © 2018 G2M Communications, Inc.. All rights reserved.RESEARCH
Webinar Agenda
9:00-9:05 Ground Rules and Webinar Topic Introduction(G2M Research)
9:06-9:20 Sponsoring Vendor presentations on topic (5 minute each) 9:21-9:22 Audience Survey #1 (2 minutes) 9:23-9:36 Key Question #1 (2-minute question; 4 minutes response
per vendor) 9:37-9:50 Key Question #2 (2-minute question; 4 minutes response
per vendor) 9:51-9:52 Audience Survey #2 (2 minutes) 9:53-10:06 Key Question #3 (2-minute question; 4 minutes response
per vendor)10:07-10:08 Audience Survey #3 (2 minutes) 10:09-10:14 Audience Q&A (6 minutes) 10:14-10:15 Wrap-Up
3 © 2018 G2M Communications, Inc.. All rights reserved.RESEARCH
Panelists
Scott ShadleyVP of MarketingNGD Systemswww.ngdsystems.com
Cameron BrettDirector of MarketingToshiba Memory Americawww.toshiba.com/tma
Jonmichael HandsProduct Marketing ManagerIntel Corporationwww.intel.com
Host/Emcee: Mike HeumannManaging PartnerG2M Researchwww.g2minc.com
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How Have SSDs Changed the Storage Landscape?
SSDs (“Flash”) has significantly reduced storage media latency vs HDDs– Reduced the need for huge RAM
buffers, and eliminated the need toshort-stroke hard disk drives
– NVMe further accelerates this trend– SSDs have also significantly improved
storage reliability
Result: SSDs are now the mainline storage medium of choice for enterprise and consumer applications
vs
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What is a Solid State Drive (SSD)?
A simple view of SSDs is that they are a bunch of NAND chips on a board, mounted in a protective carrier
– They can have more or less buffering RAM
– Some “driver” or management capabilities can also be embedded in the controller
– AND they have “standard” PC formats (2.5” drive or PCIe add-in card formats)
6 © 2018 G2M Communications, Inc.. All rights reserved.RESEARCH
How are SSDs Evolving?
Several new form factors have been created for SSDs that are tailored for flash media– M.2– EDSFF (actually multiple form
factors) AND companies are putting more
capabilities into SSDs beyond just adding additional capacity or performance– Computational storage– Indexing and searching– Increased redundancy/error
correction
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Why Are These New Capabilities Important?
Density and Cooling– Both PCIe AOC, 2.5” small disk drive, and M.2 form factors all negatively
impact the number of NAND chips that can be put on those devices– These form factors also result in “hot spots” that
can impact product reliability– New form factors offer higher storage densities
and better cooling for internal components
Lowering Overall Compute Costs– For petabyte-scale analytics,
data movement from storageto RAM can take several minutes
– This impacts the “real-timeness”of the analytics
– New features such as in-situprocessing eliminate most ofthis data movement
© 2018 Toshiba Memory America, Inc.
New Features and Form Factors
G2M NVMe Webinar
September 2018
Cameron T Brett, Director of Marketing, SSD and Storage Solutions
9© 2018 Toshiba Memory America, Inc. |
U.3 (SFF-TA-1001) Universal Backplane
• Today’s end-users must choose what kind of storage they want in their system and predict usage and performance needs– Hardware configurations limit the number and types of SSDs that can be installed– Do not allow for changing from SAS/SATA to NVMe SSDs
• U.3-enabled systems allow end-users to configure their storage for now and have flexibility for future growth, protecting their investment– Defines universal hardware that can accept any configuration of SAS/SATA/NVMe SSDs– Maintains hardware compatibility for systems that can only accept NVMe SSDs
All SAS/SATAAll NVMeLimited NVMe (2 Max)
???
SATA SSD (Any Qty)
SAS SSD (Any Qty)
x4 NVMe SSD (Any Qty)
10© 2018 Toshiba Memory America, Inc. |
EDSFF 1U Long 318.75mm
38.4
mm
EDSFF 3-inch Long
142.2mm
EDSFF 3-inch Short
76.0
mm
104.9mm
EDSFF 1U Short
111.49mm
31.5
mm
Scale among form factor diagramsis approximate
EDSFF 3-Inch Short and Long
• 7,972.4 mm2, 2x capacity• Optimized for 2U servers
• 10,807.2 mm2, 4x capacity• Optimized for 2U servers
• 12,240.0 mm2, 4x capacity• Designed for 1U servers
• 3,511.9 mm2, 1x capacity• Designed for 1U servers
11© 2018 Toshiba Memory America, Inc. |
NVMe-oF™ Enables Disaggregated NVMe™ Architecture
• Storage local to each compute node
• “One-size fits all” – leads to islands of stranded storage or compute power
Direct-attached SSD’s1st Generation Cloud
• Disaggregates & shares fast NVMe storage at full performance
• Enables optimal allocation of storage capacity & performance to each node
Disaggregated Storage with NVMe-oF2nd Generation Cloud
Disklesscompute nodes
NVMe-oF storage node
Each job gets “just the right amount” of high performance, low latency storage
RESEARCH
Intel IntroductionJonmichael Hands, Product Marketing Manager
M.2
U.2
AIC
PCI Express* SSD Form Factor Evolution
EDSFF
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M.2 initially designed for client and mobile use. Used in data center for boot or compute nodes, but lacks
hot-plug support and requires carrier cards / heatsinks to manage thermals
U.2 2.5in x 15mm and 7mm supports hot-plug and serviceability, designed to share physical dimensions
with HDDs for hybrid HDD/SSD server designs. Mainstream PCIe* SSD form factor
PCIe* low profile add-in-cards have broadest compatibility with the most mature ecosystem and compliance. Shares same form factor with network
cards, graphic cards, etc.
Built for data center racksHigh per drive, per server and per rack capacity
Improved manageability and serviceabilityEfficient thermal design
Integrated enclosure, latch, LEDs*Other names and brands may be claimed as the property of others.
Edsff. Formed by industry leaders.
Enterprise and Data Center SSD Form Factor Workgroup
A group of 15 companies working together11 Goal is to limit storage form factor
proliferation by defining revolutionary industry standard form factors2 Broad, dynamic range of
solutions that scales with new interface speeds
3
7
https://edsffspec.org/
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EDSFF Addressed the Hurdles
General Purpose Scalable connector Flexible: Multiple orientations, widths, Gen 5+ support Supports interoperable specs (EDSFF, OCP Mezz, Gen Z, etc.)
Break legacy to Optimize for SSDs 50-100% increase in media package sites
Improved thermal efficiency 2-3x less airflow needed Or support higher power devices
SFF-TA-1002
https://www.amphenol-icc.com/product-series/mini-cool-edge-0-60mm.htmlSource – Intel. Comparing airflow required to maintain equivalent temperature of a 4TB U.2 15mm Intel® SSD DC P4500 to a 4TB “1U.L” form factor for Intel® SSD DC P4500. Source – Intel. Comparing airflow required to maintain equivalent temperature of an 8TB U.2 7mm Intel® SSD DC P4500 to a 8TB EDSFF 1U-Short form factor for Intel® SSD DC P4510.Results have been estimated or simulated using internal analysis or architecture simulation or modeling, and provided for informational purposes. Simulation involves three drives for each form factor in a sheet metal representation of a server, 12.5mm pitch for “Ruler” form factor, 1000m elevation, limiting SSD on case temp of 70C or thermal throttling performance, whichever comes first. 5C guard band. Results used as a proxy for airflow anticipated on EDSFF spec compliant “Ruler” form factor Intel® SSD P4510.
EDSFF Form Factors
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E1.S (SFF-TA-1006)• 111.5 x 31.5 mm• Supports >12W• Up to 12 Standard NAND sites
E3 (SFF-TA-1008)• (104.9/142.2) x 78mm• Supports up to 70W• Up to 48 Standard NAND sites
E1.L (SFF-TA-1007)• 318.75 x 38.4 mm• Supports > 40W• Up to 48 Standard NAND sites
Same Protocol: NVMe Same Interface: PCIe Same Connector: SFF-TA-1002 Same Pinout and Functions (hot
plug, serviceable) Different Usages, Same
Expectations!
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High capacity per drive and per rack U Scalable bandwidth, drives and PCIe* lanes Thermally efficient design Fully serviceable with hot-plug support
Key Benefits:
More media sites and board real estate enables higher capacity drives vs. U.2
Purpose built systems optimized for TB/rack unit
Enables dense JBOF and disaggregated storage
Maximizing capacity per rack unit, thermally efficient design, with built in manageability and serviceability lead to lower data center TCO
E1.L: Optimized for Storage
System-optimized NVMe* drives for 1U rack space
*Other names and brands may be claimed as the property of others.
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1PB in 1U at FMS liveIntel E1.L /w QLC | Supermicro
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EDSFF at FMS: New Flexible Form Factors for Enterprise and Datacenter SSDs
• How Form Factors Will Help Shape Tomorrow's Data Center World, Amber Huffman, Intel Fellow, Intel Corporation
• EDSFF: Mainstream NVMe for the (Datacenter) Masses, Jonathan Hinkle, Principal Researcher, Lenovo
• EDSFF - The Future of Enterprise Storage and Beyond, Paul Kaler, Advanced Storage Technologist, HPE
• Datacenter Designs Using the EDSFF Form Factors, Mark A Shaw, Principal Hardware Engineering Manager, Microsoft
• EDSFF is Here, Panel, Cliff Smith, Sr Product Line Manager, Micron
Micron Microsoft WD HPE Intel Lenovo Micron Dell EMC ToshibaMemory
Demos for E1.S and E1.L from AIC, Inventec, Celestica, Quanta, Supermicro, LenovoEDSFF long announcements and demos from Liteon, Marvell, Microsoft Azure, WD, and more
Enterprise & Data Center SSD Form Factor (EDSFF)Specs are complete!
SFF-TA-1002: Protocol Agnostic Multi-Lane High Speed Connector
SFF-TA-1006: Enterprise and Datacenter 1U Short SSD Form Factor
SFF-TA-1007: Enterprise and Datacenter 1U Long SSD Form Factor
SFF-TA-1008: Enterprise and Datacenter 3” Media Device Form Factor
SFF-TA-1009: Enterprise and Datacenter SSD Pin and Signal Specification
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Bringing Intelligence to Storage
Bringing Intelligence to Storage
Scott Shadley – VP Marketing
NVMe Computational StorageMore Intelligence – Better Results
NGD Systems, Inc - G2M NVMe Webinar - Sept 2018
Bringing Intelligence to Storage
A Real World Problem – Managing Data
bandwidth mismatchby >60X
09/11/2018 NGD Systems, Inc - G2M NVMe Webinar - Sept 201822
Bringing Intelligence to Storage
Standard SSD
• Reduce data movement across storage/network/memory/CPU for compute
Key Attributes:• Maintain familiar methodology (no new learning)• Use standard protocols and processes (no new commands)• Minimize interface traffic (power and time savings)
Solution – Moving Compute Closer to Data
Host Platform
Intelligent
Standard NVMe Protocol
Bringing Intelligence to Storage
09/11/2018 NGD Systems, Inc - G2M NVMe Webinar - Sept 201823
Bringing Intelligence to Storage
Delivering the Solution – NGD Systems NVMe SSD Family
8TB / 8W 32TB / 12W
64TB / 13WUp to 64TB
16 flash channels16TB / 12W
New Rack-Scale Form Factors Traditional Storage Form Factors
09/11/2018 NGD Systems, Inc - G2M NVMe Webinar - Sept 201824
Bringing Intelligence to Storage
• Finding the Needle FasterOn Drive Linux OS, Container
SupportDedicated Compute Cores
• Bigger Pipes Feed Smaller OnesMitigating Data MovementOptimizing Application
Execution• Smarter Storage Does Work
Partnerships for SuccessReal World Implementation
• Requires Intelligent ControllersFlash Agnostic –
ONFI/Toggle, TLC/QLC16 Channels - Capacities
greater than 64TB• Power is Factor - Always
.35 W/TB @ 16TB
Key Tenants of NGD NVMe Solutions
Newport Platform Provides
09/11/2018 NGD Systems, Inc - G2M NVMe Webinar - Sept 201825
Bringing Intelligence to Storage
Bringing Intelligence to Storage
Thank You
NGD Systems, Inc - G2M NVMe Webinar - Sept 2018
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Panel Question #1
Over the past several years, flash storage capacities have grown exponentially, while prices continue to drop, making flash the de facto mainline storage medium. What do you see as the biggest challenge in the future to flash storage usage?– Toshiba– Intel– NGD Systems
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Audience Survey Question #1
What is are the greatest concerns your organization has for the adoption of flash storage, both in servers and in storage systems? (check all that apply; 72 responses):
• Cost (as measured in $/GB): 71%
• Reliability: 49%
• Impacts on Application Performance: 33%
• Storage Management: 32%
• Avoiding Vendor Lock-In: 25%
• Difficulties Migrating from Hard Disk Drives: 11%
• Other: 14%
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Panel Question #2
The Enterprise Data Center Form Factor (EDSFF) for flash “solves” the physical form factor problem for now. What can the industry do to better match flash capacity growth (which grows as the square or better of feature size) with I/O speed (which grows linearly to clock speeds)?– Intel– NGD Systems– Toshiba
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Audience Survey Question #2
Who will you primarily look to for guidance when considering adopting a new flash form factor (choose one; 63 responses):
• Server Vendors: 17%
• Storage Systems Vendors: 24%
• My System Integrator (SI) or reseller: 5%
• End-User Focused Analysts (Gartner, IDC, Forrester, etc.): 10%
• My peers in the industry: 24%
• SSD Vendors: 17%
• Other: 3%
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Panel Question #3
The concept of computational storage holds significant promise to eliminate the problem of data movement from storage to the CPU. What do you see as the hurdles to its adoption, and are there alternatives that provide similar benefits?– NGD Systems– Toshiba– Intel
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Audience Survey Question #3
What would be your biggest concerns when considering computational storage (choose all that apply):
• Porting Applications: 40%
• Lack of Interoperability across computational storage devices: 52%
• Computational Storage Vendor Maturity/Stability: 40%
• Lack of a clear potential ROI: 18%
• Lack of support from application vendors: 42%
• Vendor Lock-In: 27%
• Other: 3%
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Audience Q&A
RESEARCH
Thank You For Attending
RESEARCH