gem muon group meeting - sscllss.fnal.gov/archive/other/ssc/ssc-gem-tn-93-440.pdf · panels...
TRANSCRIPT
GEM TN-93-440
GEM Muon Group Meeting - SSCL
July 12-13, 1993
Abstract;
Agenda, attendees, and presentations of the GEM Muon Group Meeting held at the SSC Laboratory on July 12-13, 1993.
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Agenda July 12: Discussion of CSC chamber development
1. Chamber performance, prototype results and plans
Discussion ( 30 min) including: Large prototype status - Johnson, Golutvin Small prototypes plans - Mitselrnakher, Prokofiev Electronics for prototypes - Polychronakos, Whitaker, Marlow BNL prototype results Balagura, Polychronakos, ( 30 min)
2. Chamber design
,Johnson - 15 min Golutvin - 15 min Polychronakos - 15 min Lau - 15 min Horvath - 15 min Discussion - 30 min.
3. Pannel,strip boards and frames prototyping and production prospects
Johnson - 15 min. Pratuch - 10 min. Discussion - 20 min.
Agenda July 13: Discussion of alignment and FNAL test beam program
1. Guidelines for GEM R&D program: goals, $, schedule
G. Sanders
2. Progress on alignment: axial vs projective vs coverage
J. Paradiso, A. Korytov, Yu. Gerstein
3. Pros and cons: monolith vs sector - physics considerations
M. Marx - convenor
4. ATS plans
C. Wuest
5. Plans for FNAL test beam program
- scope and schedule C. Bromberg, et al.
- proposal writing discussion/task assignments Group
6. Slow control system
V. Glebov
7. Discussion and plans for next meeting
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REFERENCE POINTS
CSC PROTOTYPES PRODUCTION FACILITY
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T = 20 C HUMIDITY = 603
Reference oints
AIR RATE CLEAN =10 000 dust part./cu.ft 11
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CSC PROTOTYPE MILESTONES -* 1. Panels preprocessing June 1993
Materials from SSCL received June 1993 -* 2.
3. Panels processing, precise gauges mounting, stripped boards gluing 2 August 1993
4. Getting bars ready for gluing 13 August 1993
5. Glue bars to panels 15 August 1993
6. Drill holes 16 August 1993
17 August 1993 .. * 7. Test assembly of the panels
8. Assemble spacers and gas outlets 24 August 1993
9. Cover strips with resistive mater. 25 August 1993 .. 19. Install anode wires 1 September 1993
11. Mount capacitors, resistors, connectors 2 September 1993
*12. Assembled planes acceptance check 3 September 1993 ... 13. Get planes ready to assemble,
clean 4 September 1993
*14. Assemble chamber 5 September 1993 .. 15. Mount exterior parts 8 September 1993
*16. Final test 9-13 September 1993 *17. Packing 14 September 1993 ...
Steps 4-6, 8-9, 19-13 go Key operations are shoWn
In para I lel In bold.
tor al I planes.
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From se.jinr.dubna.su POP3 server Return-Path: <viz> Received: by SE.jinr.dubna.su (4.1/SMl-4.1)
Id AA18596; Tue, 15 Jun 93 17:42:55 MSK Date: Tue, 15 Jun 93 17:42:55 MSK From: viz (Victor Zhiltsov) Message-Id: <[email protected]> To: golutvin@se SUbject: reply to M.Harris from Yu.Kiryshln Status: RO
Dear Dr Harris, In reply to your request of Dubna Muon Chamber Prototype Specifications:
>> 1. Facilities description I. Bui I ding lt1
- Panels preprocessing area:
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-199 sq.m - equipped with two metal tables 4.5 x 2.4 sq.m (9.1mm); 59 sq.m - equipped with crane, 9.5 tonns; •
- wire arrays winding area: 54 sq.m - equipped with two winding machines, and two tables;
- Clean room: 5.4 x 5.1 = 27.54 sq.m - chamber testing area:
54 sq.m - testing equipment for tests with cosmic rays; *no temperature control;
**no hllllidlty control;
11. Bui I ding lt2 - Gluing area (two rooms):
129 sq.m
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47 sq.m - the two room s are equipped with three metal tables 3.4 x 1.7 sq.m (9.311111), and six wooden service tables; •
*no temperature control; **no humidity control;
In the new CSC fsctory building both temperature and humidity controls wi 11 be aval I able.
>> 2. Materials specif !cations List of Materials for Full-SCale SSCL-Dubna CSC Prototype:
1. honeycomb panel 7 pc (at Dubna) 2. strip cathodes 6 pc 3. cathode 3111 x 1.2m 8 pc 4. G19 frames 48 pc 5. conductive epoxy for strip cathode 9.5 kg 6. conductive epoxy for wires 2 kg 7. epoxy glue AW196 + AV953 15 kg 8. 5 minutes set epoxy glue (two 8.5 oz tUbes) 18 pc 9. 5 hours set epoxy glue (two 2 oz tubes) 18 pc
18. capacitors CERA-MITE 9.881 uF/6 kV· 258 pc 11. capacitors CERA-MITE 8.81 uF/6 kV 59 pc 12. resistors Allen-Bradley 1m0hn/8.5 w 258 pc 13. gold plated tungsteln wire 39 mkll with Rhe 15 km 14. air-powered dispenser 18880 with accesorles 2 pc 15. rUbber seal 188 m 16. flat cable 3M (part It 3517 serles/34) 58 m 17. flat cable connector 3M (part It 3514) 58 pc 18. printed board connector 3M (part It 3594) 58 pc 19. HV connector BNC - 5kV (male+fmiale) 58 pc 28. L.EMO connector (male+fmiale) 28 pc 21. HV cable RG-59 188 m 22. set of shrinking tUbes (1m long) 18 pc 23. wire for spacers, 8.8 mm diameter 5 m
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24. red X corona dope (28 oz) 2 pc
>> 3. Fabrication Specifications and sequlence Fabrication specif !cation:
1. spacers 2. gas system prts 3. gauges 4. parts to mount amplifiers, HV supply, power supply 5. chamber assembly and fix parts 6. seal elements 7. screens 8. tranportatlon container 9. spacers Installation tools
18. panels and bars gluing tools 11. drill Ing tools 12. gauges installation tools 13. tools for chamber assebly using gauges
Fabrication sequence 1. printed cirqult boards 2. preparation of the panels 3. mechanical parts assembly
>> 4. Assembly procedures 1. glue stripped electrodes onto the planes 2. assemble precise positionning monitors onto the planes 3. glue chamber frames to the panels 4. glue pc-boards to the chamber planes 5. drill holes in the planes 6. assemble spacers onto the planes 7. assemble resistors onto the stripped electrodes 8. clean cathodes and the chamber frames 9. wind wire areas on the on transfer frames
(wire transition control, cleaning wires) 18. transfer wires from transfer frames to the chamber frames
(wire tensioncontrol, cleaning the electrodes) 11. electrodes acceptance test 12. final cleaning of the electrodes 13. assemble and close the chamber 14. assemble exterrior mechanical parts 15. assemble ground conductors, signal and HV connectors, etc. 16. flush chamber with gas 17. chamber HV training 18. complete test with cosmic rays 19. crate chambers 28. shipping to SSCL
>> Testing procedures A. test of single chambers of the llOdule
1. production quality test of each ch8111ber 1.1 cutting of anode wires 1.2 soldering of HV parts (R,C) 1.4 check of lnterstrlp shortclrqults 1.5 readout strips soldering, Including cables and connectors 1.6 wire tension check 1.7 check of anode boards junction (Mechanical, HV, gas) 1.8 seal surfaces quality check 1.9 anode-cathode gap check 1.18 spacers Installation
2. HV leaks check (flll chamber with N, apply HV=5kV, leakage current< 1 uA)
3. clean assembly check (no noise (discharges) in ch8111ber with Ar/CH4, HV=2.6kV.
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chamber training, including disassembly and cleaning If needed)
s. Module check 1. gas leakage check of the module after assembly 2. strips misalignment measurement (with respect to outer gauge) 3. measurement of working voltage of the module
(Ar/CFn/C02 (38:28:58), measure space and time accuracy) 4. accumulation of statistics in working point (18e& events)
C. Passport (diskette) 1. gas leakage 2. strips misalignment
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-3. working voltage/current -4. 2-dimensional map of uniform cosmic rays exposition/noise 5. readout electronics calibration data (pedestal, linearity, noise, e
>>Schedule and personell Schedule
1. Fabrication of technological equipment and csc parts at workshop - 1 .-2. chamber assembly - 1.5 months 3. chamber testing - 8.5 months 4. shipping to SSCL - 8.5 months
Personnel V.Rashevskl Yu. Vlctorov A.Vlshevski V.Perelygin S.Movchan V.Karjavln A. Ivanov s.selunln V.Khabarov A.Chvyrov + 12 technicians
With the best regards, Yu. Klryushln
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I : Measurements for Readout Sheet ! ' 1 I I i
Trial 1 ' i 6/30/93 I I I I ' Note: Sheet was held flat horizontallv, with an Aluminum bar P..~r!?endicular to the strins.
Measurements are in inches. I 1
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Measurement i . iA i !B \ :c ! ~~·- --·---·-: --
!Value iDev !Value iDev :value !Dev Position I ~ ! . i . . I
Nominal ' 1.8000 ' 38.0600! 1.8000 1. l 1.79971 -0.0003 ! 38.06381 0.0038! 1.8001 0.0001 2 i 1. 7996 -0.0004 38.0637! 0.0037! 1. 7999i ·0.0001 3 i 1. 7997 -0.0003 38.0632! 0.0032! 1.7994! -0.0006 4 . 1.7995 -0.0005 i 38.06331 0.0033! 1 .8002i 0.0002 s . 1.7997 -0.0003 38.0632 ! 0.0032! 1.79931 -0.0007 Gl . 1.7995 ·0.00051 38.0631 i 0.0031 i 1. 7998 -0.0002 7! ' 1.79951 -0.00051 38.0633i 0.0033\ 1. 7997! -0.0003 . 8 ! 1.79981 -0.0003 38.06301 0.0030! 1. 7998 -0.0002 9 i 1.79921 -0.0008 38.0623! 0.0023! 1. 7994! -0.0006
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1.7995 -0.0005' 38.0611 i 0.0011 i 1.80001 0.0000 1 1 ' 1.79941 -0.0006 38.0625 i 0.0025! 1.80011 0.0001 '
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! . Trial 2 i 7/1/93 i j
Note: This data is from measurements beina made with two reference wires as a check of the StriifCiiltness of the traces. l .
l
The sheet was held flat hv two steel bars runnina oarallel to the traces, in the o:naces between the contrast line and the first trace. . ; I
i· l . l Measurement \A B . iC l
!Value Deviation Value !Deviation !Value Deviation Position l I '
. . l Nominal i 1.8000 38.0600! ' 1.80001 j
l l 1.8000 0.0000 38.0626! 0.0026! 1.79951 -0.0005 2 i 1.7996 -0.0004 38.0628i 0.0028! 1.79961 -0.0004 3 I 1 .7998 -0.0002 38.06251 0.0025! 1.7993 -0.0007. 4 l 1.7999 -0.0001 38.0626! 0.0026! 1.7993 -0.0007 5 ! 1.7996 -0.0004 38.0623! 0.0023! 1.7991 -0.0009 6 ' 1.7995 -0.0005 38.0629! 0.0029i 1.7995.· ·-o.ooos·. 7 i 1.7995 -0.0005 38.0632! 0.0032! 1.7994 -0.000£ 8 ~ 1.7993 -0.0007 38.0618i 0.0018\ 1. 7995 -0.0005 9 ' 1.7992 -0.0008 38.0590! -0.0010! 1.7996 -0.0004 •
10 i 1.7997 -0.0003 36.05441 -0.0056! 1.7996 -0.0004 11 ' 1.7995 -0.0005 38.04951 -0.01 OS! 1.7993 -0.0007 '
i I i Notes: In the second triat the sheet had an a""rDX. 1 cm bulne in the ioint side. This would
cause an ""n2 rent shorteni""' in measurement B with minimum mannitude of 7 thousandths. Furthermore. a 500 mil lift of the e""" of the sheet from the table outside of the hold down bars is needed to cause the discre""""'' between trials of measurement C. It is likelv that there was such a lift. There is confidence in the measurements of Trial 1. while sources of error have been found for Trial 2.
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... Measurements for Terminatina Sheet .
• ;
Trial , 6/30/93 ; . ' ; i '
Nate: Sheet was held flat horizantallv, with an Aluminum bar rn.roendicular to the strios. Measurements are in inches. . . . ...
I \ ; , Measurement A i \B . c ' Value Deviation !Value !Deviation Value Deviation Position
. i .
Nominal 1.8000 i 38.0600i I 1.8000 -l 1.7992, -0.0008! 38.0642! 0.0042 1.8027 0.0027 2 1.7993 -0.0007! 38.0632! 0.0032 1.8028 0.0028 3 • 1. 7991 -0.0009[ 38.0633! 0.00331 1.8029 0.0029 4 1.7990 -0.0010: 38.063Si 0.0035 1.8025 0.0025 5 1.7994 -0.0006: 38.0635! 0.0035 1.8024 0.0024 6 1.79921 -0.0008! 38.0644l 0.0044 1.8025 0.0025
... 7 1. 79891 -0.0011 i 38.0653! 0.0053 1.8024 0.0024 8 1. 7991 -0.00091 38.0649! 0.0049 1.8019 0.0019 9 1.7989 -0.0011: 38.0643! 0.0043 1.8018 0.0018
10 1.7990 -0.001 Oi 38.0644! 0.0044 1.8015 0.001 s 11 i 1.79871 -0.0013\ 38.06661 0.0066 1.8018 0.0018 -I ~
. 1
Notes: These measurements were made with the orocedure of the Trial l measurements of the Readout sheet. and the same confidence in our measurements annlv.
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Status of CSC Readout Work
at Princeton
GEM Muon Meeting at the SSCL
July 12, 1993
Daniel R. Marlow
Princeton University
...
-
Muon CSC Electronics
• Work aimed toward production readout
• Pursuing SCA option, but work is directly rele-vant to T /H option.
• IC design by Bob Wixted
• Test fixture development by Stan Chidzik
• 2x2 mm2 IC prototype fabricated using ORBIT 1.2 µm double-poly, double-metal CMOS
• First prototype
3-channel x 24-sample 10 MHz SCA
CMOS comparator (building block for lowcost CF discriminator)
35
Test Setup
!----------------------------------------------------------------------------------------~
' ' ' ' ' ' ' ' ' ' ' ' ' '
, __
r-- 12-bit DAC SCA 12-bit ADC -AD DAC87v AD HAS1201
Write Addr Read Addr
' . ' ' Test board 100 ns 5µ s
' ---------------------------------- ------------ ~---------------------------------· --_.,
I HP Pattern Generator/
I
I Logic Analyzer - I
12 12
SCA Test Fixture '
- '486 PC
• Current tests use pattern generator to sequentially address the capacitors in the array. Readout follows same sequence and is not (yet) simulataneous with write.
• DAC settling time is 3 µs, so only "quasi-dynamic" tests are possible.
38
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-
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Input DAC (Counts)
37
..
... 38
-
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2000 DAC
2000 DAC
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39
/marlow/gem/sco/docsco.kumac
3-Params/Cell
2000 DAC
2000 DAC
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..
..
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-
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-
Fit Parameters by Cell - 900 0 ~
rn <lJ 895 "D <lJ
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41
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.. /morlow/gem/sco/docsca2.kumoc
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-
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2000 DAC
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Conclusions & Future Work on SCA Evaluation
• Ten-bit operation appears to be readily achievable.
• Random noise and cell-gain variations are already at the 10-11 bit level.
• Cell pedestals are uniform to only "' 8 bits.
• Future Work
- Use FPGA-based logic to measure noise under simultaneous read/write operation.
- Work to understand cell pedestal variations.
An improved test setup, using a 16-bit ADC, a faster DAC, and incorporating a number of "conveniences," is being developed.
SCA's from other labs (ORNL, LBL) will be tested.
Quantitative measurements of capacitor decay time will be made.
Layout of the first "production" device for FNAL test electronics will commence late summer.
44
-
-
-..
-
..
..
..
-Constant Fraction Discriminator Tests
• Goal is to develop low-cost fully integrated CF discriminator to correct for pulse-height walk.
• Design is based on Turko and Smith concept
vth
from Fast Shaper
Noninv. Input
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Delay
Inv. Input
',,, / ... ...
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• Key building block is CMOS comparator.
• Current version requires external R's and C's, but these can be integrated.
45
Constant Fraction Discriminator Test Setup
• Test setup is very simple.
Attenuator
p"""' ~6 6 9 6 9H~_c_F_D_is_c ____,
'scope
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Pins 15,35 +5V 16,36 GND
v in
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100
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. 1 µ F
3 v out
• Measure delay of trailing edge with respect to trigger as a function of Vin.
46
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-
... 48
-Conclusions from Discriminator Tests
• The CMOS constant-fraction discriminator functions well and should easily meet GEJ\1's requirements.
• Further tests with more realistic pulse shapes and with actual chamber pulses are needed.
• In the current design, there is a slight tendency to fire early on smaller pulses. This could be problematic and should be corrected.
.-
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GEMUON Coleman Johnson 7.:12-93
CHAMBER DESIGN
• Edge spacer frame update • Summer workshop questions • Intra chamber alignment transfer test prototype
PANEL PRODUCTION • Cost summary
CVJlll 12:10 PM July 13, 1993 1
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CHAMBER EDGE SPACER FRAME
FUNCTIONS:
• Cathode-cathode spacing • Cathode-anode spacing • Wire support · • Gas seal • Location for resistors, capacitors
ONLY 2 REQUIRE ACCURATE DIMENSIONS: • Cathode-cathode spacing • Cathode-anode spacing
DESIRED PROPERTIES:
C\')XlUCXX• I 5/llll'll
•
• Minimum material • Minimize fabrication costs • Minimize assembly costs
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SUMMER WORKSHOP QUESTIONS ~ CHAMBER DETAILS TO BE STUDIED, TESTED, RESOLVED:
• HONEYCOMB PANEL • EDGE FRAME • BOLTS • MID PLANE SPACERS
~ • ALIGNMENT DETAILS • ON CHAMBER ELECTRONICS • COOLING FOR ELECTRONICS • • •••••••
• ••••••••
CVJIII 2:21 PM July 9, 1993 1
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GEMUON SUMMER WORKSHOP QUESTIONS
11 HONEYCOMB PANEL: DRAFT a) unetched cathode side with anode readout connector; b) precision strip cathode side with cathode readout connector; • c) honeycomb plate with edgefill and details; d) gas inlet/outlet features
questions to be studied, tested, and resolved:
a) how to provide edge close outs, connector details, reinforcing for sealing, bolting, etc. b) how to minimize density and total mass of close-out features c) how to join layers of chambers together, bolts vrs adhesive bonding, effects on shear stiffness of final chamber, sag, etc., reinforcing for bolts, spacer tension wires, etc. d) how to provide holes for support spacer wires, location, reinforcing, etc. e) edge machining, raw honeycomb vrs edge filled, with or without face sheets
• bonded, etc. f) cleaning, all holes, gas passages, etc. g) soldering connectors to panel, reinforcing to withstand attachment forces, handling, etc.
21 EDGE FRAME:
a) provide wire position (both wire to wire and anode to cathode spacing) and fixation details; b) provide wire anode circuit connections, distribution to connectors, etc. c)provide location, isolation for resistors and capacitors d) provide cathode to cathode dimension control e) provide gas sealing details
questions to be studied, tested, and resolved:
a) detail component design to meet all functions and minimize mass and density of total system (compare three design concepts presented and others, evaluate, choose) b) how should the frame elements be attached to the honeycomb panels? adhesive bond with controlled bond thickness, adhesive bond with line to line contact to control dimensions, casting in place, etc. c) how should the anode wire connection copper pads be configured to allow staggering of wire groups from layer to layer in a given chamber? details of the required stagger? etc. d) how should anode wires be fixed, electrically connected to frames? what kind of structural epoxy, how much; solder vrs conductive epoxy, etc. e) what should the procedure, sequence be for attachment of resistors and capacitors? before wire attachment or after? above board or inside honeycomb/edgefill volume? f) how to protect the high voltage distribution track, corona, surface leakage (dark current?) proximity to grounded bolts, etc. under gas seal? g) how should we specify the cleaning processes and quality assurance testing, etc.
cvrrn 3:24 PM July 9. 1993
75
3! BOLTS DRAFT a) join honeycomb panels together to form chamber b) ensure ttlat elastic gas seal is intact c) provide shear strength to chambers for sag d) keep cathode planes in intimate contact with part of edge frame that determines cathode to cathode spacing. e) possibly provide attachment to chamber mounting hardware f) possibly provide attachment to chamber mounted electronics like mother boards g) resist gas pressure
questions to be studied, tested, and resolved:
a) should bolts be inside of or outside of sealing location? b)if bolts are inside of sealing location, how should the end be sealed, not compromise shear strength considerations, etc.
, c) how should we define the bolting procedure, sequence, torques, etc.?
4l Mio PLANE SPACERS
a) provide additional cathode to cathode spacing control, in compression b) provide location for tensile element to ensure contact and resist gas pressure
questions to be studied, tested, and resolved:
a)study original Dubna design, new SSCL design, others, evaluate, choose b) minimize lost readout area, volume c) simplify fabrication d) determine installation procedure constraints on design, when and how bonded into place, how to locate with respect to wires, etc. e) how to prevent surface current leakage (dark current?) from high voltage anode wires to ground potential tensile element f) how many do we need? how much performance degradation? etc.
Sl ALIGNMENT DETAILS
a) provide means to transfer knowledge of precision strip locations outside of the given plane for layer to layer alignment in a specific chamber and transfer to straightness monitor systems
questions to be studied, tested, and resolved:
a) study various ideas for transferring etched pattern to a mechanical (washer/) external feature, registration, phi and theta directions?, attachment schemes, etc. b) study possible external etched pattern concepts such as for the stretched wire concept (AK) identify limitations of photolithography process like minimum gaps achievable with accuracy, etc. c) study details of straightness monitor hardware attachment to the chambers, machined grooves to indent lines of sight into chamber volume, etc.
CVJIIl 3:2.+ P'vt July 9. 1993
78
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6l ON CHAMBER ELECTRONICS DRAFT a) provide pre amplifiers to get signals from cathode strips to mother board for processing b) marry information with adjacent pre amp boards for triggering information c) provide pre amplifiers to get signals from anode wire sets to the mother board for processing d) provide mother board to accept signals from both cathodes and anodes, process data, and send data and triggering information to control center e) provide regulated low voltage to electronics f) calibration functions g) possibly provide high voltage system fault detection, circuit interruption h) possibly provide calculations for straightness monitors i) possibly provide input to and receive output from functional transducers like pressure, temperature, flow, etc.
questions to be studied, tested, and resolved:
• a) study implications of the various locations for the first electronics, effects of cable lengths on signal to noise ratios, effects of access specific design features on the theta coverage, mounting, etc. b) determine best shielding concept, compare woven with solid shields, feed thrus, straightness monitors, access for maintenance or replacement problems, support problems, grounding isolation concerns, etc. c) study high voltage feed thru concerns d) study effect of captured gas, dead air space, etc. e) study overall temperature impact of closed shielding (see cooling, below)
7l COOLING FOB ELECTRONICS:
a) remove heat generated by the electronics b) prevent any heat from distorting the chamber elements
questions to be studied, tested, and resolved:
a) study ways to attach the electronics to the cooling system, make good thermal contact, etc. b) ensure that attachment is consistent with maintenance access c) study combinations of conductive and radiative cooling shields d) consider the impact of the EM shielding on static air around heated electronics e) study reliability impact of design features like soldered joints, feedthrus, etc. f) study impact of pressure and flow controls on overall system design
CVJIII 3:2~ PM July 9. 1993 3
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INTRA CHAMBER ALIGNMENT TRANSFER
TEST PROTOTYPE
• SSCL design concept • Design coordinated with/transferred to LLNL • Model to be constructed, tested at LLNL
CVJlll 12:10 PM July 13, 1993 2
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Questions and Recommendations
-,-
1. Access to the muon system is claiined to require 3-4 1nonths. The subpanel v ic ws this as undesirable and encourage the proponents to explore shon-tun1-arounu emergency access, perhaps through a small section of the rnuon end cap.
2. The 48"'.'fold azimuthal segmentation may be unnecessarily fine. The subpancl requests that the proponents perform a cost-benefit analysis of the degree of segmentation. Reduced segmentation could lead to a lower overall cost and less material to produce multiple scattering and backgrounds.
3. The measurement and monitoring of the magnetic field requires more detailed study.
~ 4. The proponents are encouraged to consider methods to improve the geo1neuical efficiency of the system within the angular region covered.
5. The proponents should proceed expeditiously towards a full·scale pre-production chamber.
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No. of X0 in Barrel middle layer Y.Fisyak
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0.8
0.6
0.4
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I •1 : l'..U '1 : 1• -.J •1 :
1.2
...
0.8
0.6 ... 0.4
0.2 ...
10 20 30 40 50 0
60 70 80 90
1.2
0.8
0.6
0.4
0.2
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... 0.7
0.6
0.5 -0.4
0.3
0.2 -0.1
10 20 30 40 50. 60 70 80 0
90
...
-94
-
2500
2000
1500
1000
500
0
2500
2000
1500
1000
500
- 0
93/07 /11 14.54
No. of X0 seen by muon in 2-nd barrel superlayer
Y.Fisyak
I: ! I Mean F- ....... , ............. :·············:············-r-···········.,· .2014
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' ' ' . . . . . : : : : : . . . .
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I• : - - : i i . ,. 1· ' ,. :
1 t I ' 1 t r I
0.2 0.4 0.6 0.8 t 1.2 1.4 1.6 1.8 2 No. of X0
Medin . i 578 . . . . . . . ' . ······-············-············-·············-·····································································-············ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
······r············r·····-······ 1-··-----·r·-------··r···--·-··--·i·---·-·······r··-·········1········-····r············ : : : : : : : : ..... ·f ............ ·+· ........ ···f ........... ··[ ............ ··[ ........... ··[ ............ --~-............ j· ............ t ............ . ~ ~ ~ ! ! .P.cl~ vmer' c.oocr1 ete i ' ...... ..:. ............ ..:. ............ .:. ............. , ............. :...... •• ;J• • • .!. . . . .... .:. ............ : : : : : : : : : : :
: : : : : : : :
.... ··7····· ....... 7 ............ ~ ............. 1 ............. 1 ............. ; ............. i ............. ~ ............ ;. ........... . : : : : : : : : . ~ ~ ~ ~ ~ ~
0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 No. of X0
95
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Presentation by:
Vinnie Polychronakos
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Gravity Sag of Sandwich Panel Assemblies
As Applied To Precision Cathode Strip Chamber Structural Design
John Horvath
July 12, 1993 ...
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108
OF />rN :r.- 8-EA-M. f
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Figure 1
Sandwich Construction
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Normalized Moment of Inertia Vs. Skin Thickness, Gap Thickness, & Gap "Sllp"
Seven 20.0mm-thick Sandwich Panels
("ideal" zero-shear glue assumed) •n-squared" Rule-of· Thumb
is exact for a "solid slab" v (skin=10mm, sandwich=20mm, gap=Omm) •h
- ---· >!.> __ _.c;
~ I'""' _... • ' .,.- ··-----"' _,, ~
.. .t:..---"
~ ' :... y
"'
),
,r
I.Ir'
. ,.
v...,....i r
~ v v ."r --~ y--v factor of 39 INCREASE IN MOMENT OF
INERTIA going from slip-allowed to no-slip J stack of seven 20mm-thick sandwiches
wfth 0.5mm skins and 10mm gaps
............. ~
I/
v v skin thickness = 0.5mm (baseline)
.. .... . . . . . . . . . . . . . I I I I
1 2 3 4 5 6 7 skin thickness (mm)
8
• • • •
•
. 9 10
solid
slab
•
-4- gap= 20.0mm ("IDEAL" glue)
-a- gap= 15.0mm ("IDEAL" glue)
.... ~r·- gap= 10.0mm ("IDEAL" glue)
-e- gap = 5.0mm ("IDEAL" glue)
-tr- gap= O.Omm ("IDEAL" glue)
-Jtr- "n-squared" Rule-of-Thumb
--e- ANY gap size (SLIP ALLOWED)
•
file: skinvgap.moi
jah 7/12/93
• • •
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Normalized Gravity Sag Vs. Skin Thickness, Gap Thickness, & Gap "Sllp"
Seven 20.0mm-thlck Sandwich Panels ("IDEAL" massless zero-shear gap frame and glue assumed)
1
~
~ ~ Factor of 39 Increase In gravMy sag for a
0.1 1 stack of 7 sandwich panels with 0.5mm
j skins and 10mm gaps (wHh "IDEAL" glue)
·~ I .._,
0.01 ·: i._ ' . ·- .
-
'""' ' ' ' ... i_:· .. - .
.... ~
'°'- skin thickness - 0.5mm (baseline)
0.001 I I
0 1 2 3 4 5 6 7 8 9 skin thickness (mm)
?'-
--
'
' )
' I
10 solid
slab
Factor of 49 Increase In gravity sag
(n-squared Rule-of-Thumb Is exact) for
stack of 7 solid slabs with gap = o. Omm
-+- ANY gap size (SLIP ALLOWED)
~ gap= O.Omm ("IDEAL" glue)
-tr- gap= 5.0mm ("IDEAL" glue)
-e- gap= 10.0mm ("IDEAL" glue)
-·"'1:1'-·- gap= 15.0mm ("IDEAL" glue)
-e- gap= 20.0mm ("IDEAL" glue)
file: sklnvgap.nogl
)ah 7/12/93
)
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Normalized Gravity Sag Vs. Gap Frame Width & Gap Frame Material
Seven 20.0mm-thick Sandwich Panels, No Core Edge Filler, Skin Thickness = 0.5mm, Gap Height = 1 Omm, NO SLIP ALLOWED
1 -I I I I I I ~ Materials "less stiff' than the sandwich v _,, - panels are partially •carried' by the panels. 0.95
v ,/"
. ~
. v _,.,.
0.9
0.85 v -,/
i=== • :"' .
""' Materials 'stiffer' than the sandwich
C> Ill UI
£; 0.8 fa .... ~0.75 Ql . !::! ...
...... panels 'carry' part of the panel weight. -,........_
""': ..............
Ill 0.7 E .... 0
c 0.65
.............. ~ -........ ' -
0.6
0.55 -,
0.5 . . . . . . .. 0 5 10 15 20 25 30 35 40 45 50
gap frame width (mm)
• • • • • •
The 'IDEAL• gap frame material
adds no weight to the assembly and
ALLOWS NO SLIP (no shear deflection)
between panels.
-·E- epoxy gap frame
-V- "Vinny's" gap frame
-6- G 1 O gap frame
-+- "IDEAL" glue gap frame
-A- aluminum gap frame
---------------·-----·
• •
file: gfvmat.base
jah 7/12/93
• •
f-• (\)
t-··
1
0.95
0.9
i 0.85
f D> 0.8
i "iii § 0.75 0 c
0.7
0.65
0.6
·--.
Normalized Gravity Sag Vs. Skin Thickness & Gap Frame Material
Seven 20mm Sandwich Panels, 10mm Gaps, 25mm Gap Frame, No HC Core Edge Filler, ("IDEAL" zero-shear glue assumed)
t
0
'\
""' '
""' Although Hs modulus of elastlcffy Is
" 25 times that of epoxy, aluminum
I gap frame reduces gravity sag by
only30%.
~ '~ :-.........
I - ........ --......... -
""-..._
skin thickness = 0.5mm (baseline)
I I I I .... ' I ' ..
' I
1 2 3 4 5 6 skin thickness (mm)
-E- 25mm-wide epoxy
-V- 25mm wide "Vinny's"
-6- 25mm wide G 10
-/It- 25mm-wide aluminum
. 7 8
. 9 10
file: sklnvmat.gf25mm
jah 7/12/93
,
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Normalized Gravity Sag Vs. Sandwich Core Edge Fiiier Width & Core Edge Fiiier Material
Seven 20.0mm-thick Sandwich Panels, 25mm-wide Epoxy Gap Frame, Skin Thickness= 0.5mm, Gap Height= 10mm, NO SLIP ALLOWED
1,.-~~-.~~~.-~~-.-~~~r-~-::::"'l: Materials "less stHI" than the
sandwich panels "load" the panels.
···1:a=r t t J 0>08..J' ~--== I Ill . -, \ I I I
.. ~ 1-~~~~~~+-~~-t--.~~:t::::--~ I!! 0>01-1 ~·
·~ ~-+-~~~-r--~~l Materials "stHler" than the sandwich
panels "carry" part of the panel weight.
g 0.6-t
0.5-1 I
0.4 I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' I ' ' I I ' I ' I 0 5 10 15 20 25
core edge filler width (mm)
The "IDEAL" core edge flller material
adds no weight to the assembly but
removes core mass (replaces H wHh
massless zero-shear glue).
-E- epoxy core frame
-l,J- "Vinny's" core frame
-f- "IDEAL" glue core frame
--&- G 1 O core frame
-fir- aluminum core frame
file: cfvmatbase
jah 7/12/93
•
..... l\J .. ~'.)
•
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• J)E'Sl 4fJ OJ: 6AP FllCAIV\E
Qii.'f' FR1'tt\E DES.\4;11J WI\..\. PE'TERl"tHE HOW
C\.OSE w C Co"4\E IN 08TAtNIH't -rHE '' PE:RFECT '' S ... E~R. 801'0 BE'TWE£~ SAND.w.•cH PANELS.,
Tl-\ \1 S ~' ~ t I"\ & 1 N '1 CM A~ B S-R S A~ : • Ei~O~ETRY (Tti)ca( ,JESS, Wl'OTH, fl<T~N,T AR.oVJ..10
f'ER.• f'l\E"TER OF PP.>11 E &..)
• rt>~TE'R1AL f'l\E~M AIJtCAC.. 'PRof>ERTIES
• f'~NEC.-To- PA>JEI- AT"T~tM 1'\EN r TECMA/J ~ V( ( •ot-TS, AP ~E'S>VE' _. eTC.)
GEM Muon Meeting, 12July1993 F. C. Belser l\\:
4 f f f f f f f • - 4
- ~o~LQµ.. ':lr/t -z.. I q ~
5c\'V\e thtiw:s-r,\ts DY\ Opef\ u;;~ csc...
' I .
\we
..
+ ....
.. ,
L.owo~t-oYd.l!Y- Le. e ~'lr\~e.
+. •
• - ~- _ ... "" .,,,, ..
• .. . . - -
+
elb.h(,,~c.. ~. · :. ··- ... ·
• .... -
t ~ \A. l~,p e : C.E:Q.tJ 6'\-te(l1l' & ..,;\ r-
•• - •• ·-eo ., -· --. • --' ..•. _, ..
""' - -+- .;. -
f e - ~ l {.l. u ~ ,~ ~ -·· · ~ '2. "\\ E:o s s. ~ ;> ~
127
. . .
. . =
\-uy- 5 :. R_ :. '2.· ~ '111\M
\ """' :. o · 4. s tJ tw" '2.. o Y-""" -t ~ ~ \ ~ w I~
, L c.. " - \· ''+ ""' .
D-¥1.t e..... e..~ e..tA-s
~-j. CP..~ck ·~
·it-'~~ . -••
. -
..
128
+.
•
..
... •
·~ .
• •
•. .
• . 1'
-
...
...
-...
...
-
...
-
~. '>hl it i 1 \IA. \)(., tl.e.s~\1" CpM. ~ \'~1bve..A_
.•. ~A..r.I ~ ~1~ -tlt \ c.k.er ~·t. ld w it-e..<.
(., .
d .\ t' M \ y ~ DC. Jtt,\~'111 t<, ~· P~""'°'f 11 w~
\.u_-t S~lc\ ~ o.J.~~
··--·-··- .. - .. · ...
Q... ~~ Q.. u,t\cl~ (. \·'S' wt ')( ~ ) p "D ~~ ~ ~ -...e.sal.w'h·tM l ~~\l~-~)
b. ~T~ ~ ~~ l ) ~~
~~ L :t .. ~ ~ 0 TW\i __ =a-~ ~ - .
-'c{M\ 'f\.\ • 12~j
-
-
.-
H. Ohgaki ~I al. /Position .r~nsing in thL SQS lransition r~ion 523
·c, 30
Q; Ar· CH•(7:3) ~··
c c Va:2375V .~ .. 20 .t: Proportional mode u
(~ -"' c
" 10 0 110µm
",'!; u
' r •.
712 Channel
~-.: fig. 2. Typical position spcc:trum obtained in the proportional / mode. .-,. ~·
tbe figure, the position resolution of· the proportional <: mode reaches a value which is determin~ by the instru-
mattal limitation due to the beam collimation and the dectron noise. On the other hand, the position resolu· lion ol the SQS mode begins with a value higher than the instrumental limitation and goes to a serious value of about 1 mm. As for the avalanche size, the transition
·-. (diJplayed in lig. 3 as an arrow) from the proportional ,. ID the SQS mode as a !unction ol high voltage can be ... observed in the position resolution data. The position ~-. resolution of the SQS mode is worse than that or the
!, proportional mode. The fluctuation of the localization ol the SQS discharge, however, can be considered to be less than I mm. Since the width of the SQS avalanche is considered lo be less than 1 mm [2,5], the large nuctuation or the localization of the SQS discharge cannot depend on the avalanche width. Then, the fluctuation may be due mainly to that of the path ol the SQS walanche.
In addition to the standard quenching gas. so called second quenching gas, !or example ethanol, methylal and so on. is considered to stabilize the SQS operation [8,9). We measured the position resolution ol the SQS
c ,g ;; 0
Q.
sos.-
Proportional
0.1 ·-- • -- • :....:.:..
0-•~. ~·:_t;Afn"Width-Ar+CH.(7:3)
SIN limit
0-01 L-..LJ...J..;UULL-...L...U..LJ.IJW....-'-......_.....,_.,.. 0.1 10 100
Avalanch" Slz" (pC)
Fig. 3. Results or the measurement of the position rc~lution =i~ a function of avalanche !>i7.c.
(a) 'thanol ··i e 0 ·1. .. .s c 0.1 0
"5 1 (b) .
0 2-6·1. .. .. i "' "' <r c 0.1 0
1 "iii (c) 0 8 .,. .. a. . "~1
Oll--L...1....U.il.ll~-L..LLU.U~ 1 10 100
Avalanche Size(pC)
Fig. 4. Results of the measurement or the posilion resolution in lhe SQS mode..The counter gas was Ar+ CH, (7:3) adding
:eth;.,,.,I vapour or (a) Oli. (b) 2.6!1> and (c} 8!1>. Arrows in the figures show the 50$ transition points.
mode in different concentrations or ethanol. In this measurement. the beam collimation was nearly 0.25 mm. Fig. 4 shows the results or the position resolution or the SQS mode. Arrows in fig. 4 show the 50$ transition points. In this figure. the position resolution improves with higher concentrations or ethanol. From this result, the second quenching gas. ethanol, can be considered to suppress the fluctuation of the localization ol the SQS discharge. In the practical use ol the SQS discharge for position sensing. the second quenching gas promises stable counter operation and good resolution in an Ar+ CH 4 gas mixture. Furthermore, ethanol can absorb the UV photons which play an i1npo1 taut role in the transition- mechanism of the SQS.
[R our previous data [6], the double SQS mode was observed clearly and the position sensing was tried 'vith this mode. In the present work. we could collect no tneaningrul events that arose £rom this mode. This may be due to the dif(erent cathode surface conditions in the two experiments. The double SQS mode is considered to be sensitive to the:· material and the· condi-ti:on. of the cathode (SJ.
4. Condusion
Position sensing has been investigated around the transition region from the proportional ·mode to the SQS mode. The position resolution ol the proportional mode reaches to about 0.13 mm (FWHM) which is limited by the beam collimation. On the other hand. the position resolution of the SQS mode is \Vorse than that of the proportional mode. The nuctuation of the localization of the SQS discharge. ho,vever, is less than I mm.
11. GASEOUS DETECTORS
' p
11 i! !3
!J ... •• •• ;l
~- ~
u v' -""" ~
'3) uo ~ .c u
• •
(o,AtlJjJ~J,,"f Charge Distribution of G~s 1-a 1 00% Source Fess, SQS mode significant by 3.20 kV
30 micron wire chamber
No pfJ.~ fo 1 fr~"''V lltoJt 11;.U' ~Ill
105 1 1xr--tl~-t-l~-t-I ~:1:---1~-t~-t-~-+~~~u~I ~ I I I I I I -;1~11~+---+~+-~~+---+~4- I I I I I I ; ' , , I
---------------!---------------···l~ •••••• : ••••••• i i • • • • i ----- ---- ----------- 'f-------- . ! • • ' )iJ . -----·+··-
-----..~~:_L I -.. ! - ------• ' ------------- ---- ' '"!I,, ""' ' • • I -r-------,-: __ _'._ ____ !- -- -
I ' 1' ! ' . .
-----1----------f-- --------t------"-l---- --l i I 1 . i ! 1 I ! I 1 ;
;
1000
100
104
10 I I I I I I I I I I I I I I I I. I I I, I I 2 2.4 2.8 3.2 :3.6 4
Voltage (kV)
• • • f • • • • •
1-•
"' C."l
~
~ ~
~
Rate Curve of Ga~ CF4 87%, 1-1:3 13% Threshold -3omv, Source Fess, lntarval 100 s
SQS mode significant at 2.6 kV
)
~ u .H. ,:.1,~1;,/"1. /
0. 7 -l----+---+--l---+--~-+---+---l--!--+-+--4---<>--+--+--+--+---+-----+-
0.6
0.5
0.4
0.3
0.2
0.1
. i I • ·-·················-··-··- I i 1 ; ........... ,................................................ • • • • i I~ ~ • ! ........ ·················j····,.·~··············· ·-···-···········i··· 1 .•.•.••.••••••••••.•••••••.••.•.•
. • i . ! l ic'rJ5· -··············-···-·-- I ! I) VJ..
-' ---·.-~=i--~-~==~-+~~~-~==~==J-~- --=~-----t • I ! I i
0 I . I I I I l I ! 1 8
I I I I I : • I I I I. i I ) I f 2 2.2 2,4 • 2.6 2.8
Voltage (l<.V)
)
) )
HONEYCOMB PANELS ~ G-10
• GE: 60 x 144 in; 0.021 in; 0.5 oz Cu; $184.40 • min order 150
t; Bare honeycomb c.D
• 48 x 96 x 0.75 in; $230 • 60 x 144 x 0.75 in; $678
Fabricate panels, including honeycomb material
• Hexcell 48 x 138 x 0.8 in ATF quality $1419.66 • 48 x 108 x 0.8 in Flat $2100 • Both plus tooling, setup charges
CVJIII 1:04 PM July 12, 1993 1
relephone: (800) 284-3923 ~ax. (817) 274-1121
2UOTED TO: 82280-01
QUOTATION HEXCEL CORPORATION 201 E. ABRAM STE 300 ARLINGTON TX 76010
TERMS: FOB:
NET 30
Page:
~ote Nbr: ote Date: /CSR Nbr:
Cust. Ph: (214) Fax: ( 214)
Casa Grande AZ
1'"' A3C0406 05/21/93 105/1R4 708-1188 708-6088
.. SUPER COLLIDER LABORATORY ATTN: COLEMl\N .JOHNSON 9050 AUTOBAHN DR BLDG 2 DALLAS TX 75237-3946
RFO· coV'T CONTRACT:
FAX FROM NORRIS DATED 4/22 -I T MATERIAL UNIT OF -E DESCRIPTION MEASURE gr'{ UNIT PRICE TOTAL M
01 HRH-10-1/8-8.1 Piece 10 $1,419.66 $14,196.60
SHIPMENT: 10 Weeks After Receipt Of Order
SPECIFICATIONS: ~s ~~o ~~ D/S 4000 ~ \ . QUANTITY TOLERANCE: + 0\ - 0% 0'1- f~ .1 I'\
TQ: 1 ----- \ 02 HRH-10-1/8-8.1 Piece 10 $1,397.82 $13,978.20 ..
SHIPMENT: 10 Weeks After Receipt Of Order
SPECIFICATIONS: D/S 4000
QUANTITY TOLERANCE: + 0\ - 0%
TQ: 1 .. I 03 HRH-10-1/8-8.1 Lot 1 $2,446.23 $2,446.23
TOOLING FOR ITEM 01
SHIPMENT: 10 Weeks After Receipt Of Order
! SPECIFICATIONS: i DIS 4000
QUANTITY TOLERANCE: + 0% - 0% ' I
-TQ: l I
04 HRH-10-1/8-8.1 Lot TOOLING FOR ITEM 2
l $2,446.23 $2,446.23
-SHIPMENT: 10 Weeks After Receipt Of Order
SPECIFICATIONS:
I DIS 4000
QUANTITY TOLERANCE: + 0\ - 0% I TQ: l I
I -I
QUOTE TOTAL s~' 06"" "'6 I ........ , I ..... I I
!otes & Conditions: ..
•• ..... !lotes & Conditions• (Continued)
QUOTATION Page:
~otc Nbr: ote Date: /CSR Nbr:
Cust. Ph: (214! Fax: (214
- 1 48 L +l-.125 X 138 W +l-.125 X 0.80 T +/-.045 DIMENSIONS fiND TOLERANCE OF ITEM 02 28 L +/-.125 X 138 +/-.125 x 9.80 T +/- .045 SKINS: Fl85-7781 2 PLYS ADHESIVE: MA 562 S POTTING COMPO: EPOLITE 2402 THE PARTS ARE QUOTED PER REQUEST WITH THE FOLLOWING
- EXCEPTIONS:
-
-
-
lJJHE L AND W DIMENSIONS ARE REVERSE OF THE RFQ DIMENSIONS. 2 RATHER THAN EPOXY FILLING THE OUTSIDE PERIMETER OF THE P EL, HEXCEL WILL USE A GLASS REINFORCED POLYESTER TUBE.
-, ··-
THANK YOU FOR THE OPPORTUNITY TO QUOTE.
05/21/93 09127
DATE TIME Marla Dowdle customer Service Rep.
NOTE: This quote is valid for 60 days. Please read NOTES & CONDITIONS on reverse side.
141
2 A3C0406 05/21/93 105/1R4 708-1188 708-6088
TO 12147006J8E P.Jl
QUOTATION l:IEXCEL COl\?ORATION 201 E. ABRAM STE 570 1'RL!NGTON TX 76010
Page, 1 ._ Quote Nbr: A2C0622 Quote Date: 10/29/92 AE/CSR Nbr: 105/lRS
'1dephone: (800) 284-3923 Fax: (817) 274-1121
QUOTED 'l'O: 82280-01
Cust. Ph: (214) 708-1188
SUPER COl.LIOER LJ\SORATORY TERMS: NET 30 ll.T'l'N: COu:?l!IN JOHNSON FOa: Casa Grande, AZ 9050 AUTOBAHN DR BBJLDG~.,32;_..--=:::::::::::---uo~---___;------'-----~ DALT.AS TX 75237-39~ GOV;T CONTRACT: UNKNOWN -,
I T MA'l'ER!AL E DESCRIPTION M
IJN!T OF ME:ASURE QTY
~M of )
UN1'l' PRICE
-/ 0 ,_,/
---TOTAL
01 BONDED PANEL l!RH-10-1/8-1.8 WITH .5 OZ./SF COPPER
Panel 2,100 $2,616.37 $5,494,377.00
w ~:125 ~~{i5 T ~;~30 ~~~30 48.000 1.000 10a7000 ~~f25 ~~f25 SPECil'lCATIOllS:
HEXCEL BONDING CAPABILITIES
QUANTITY TOLEAAHCE, ... 0% - 0\
'l'Q• 3
This iten has !Jeen prepared u a ROl1GH ORDER or MAGNITUDE. HEXCEL reserves the ri¢it to submit a tlrm quotation be~ore placement of an order.
~ !t.1 ,.. '
02 BONDED PllNEL Panel 2,000 $3,751.59 $7,503,180.00 HRH-10-1/8-1.8 WITH 1 OZ,/SF COPPER
L 108.0e<ll
SPECIFICATIOMS 1 HEXCEL BONDING CAPABILITIES
QUANTITY TOLERANCE: + 0\ - 0\
'l'Q: 3
w 48.000
, .. ) 0.125
(-1 0.125
T 1.000
This item !las been f::epared as a ~UGH OllDER OF MAGNITUDE. HEXCEL reserves the ri;llt to submit a f.rm quoution before placement ot an orl2er.
03 80JIDEO PANEL Panel 2,100 $4,394.36 $9,228,156.00 HF'l'~3/16-2.0 WITH .S OZ.IS? COPPER
L l0S.0e0
C+ I 0.125
Sl'ECll'ICATIONS:
(-) 0.125
HE%CEL BONDING CAPABIUTIES QUANTIT'! TOU:lWICE1 • 0\ • 0\
'l'Q1 3
w 48.000
(-) 0.125
T 1.000
(-} 0.630
This item has .been prepared as a ROUGH ORDER or MAGNITUDE:. HliXCEL reserves the ~iOh~ 'tO stiClilit a tlrm quotation be:oi:e pl~cement of an order.
-..
-
-
..
-
-...
-
- I T E M
04
05
LU
QUOTATION
MATERIAL UNlT OF Dl:SCRllTION MEASURE
BOlfllED PMEL Panel ~-3/16-2.0 WITH l OZ.IS?
p~
"
QTY
2,000
T
P.Q~
Pag:e:
~ote Nbr: oee Date: /CSR Nbr:
cust. Ph: (214)
2 A2C0622 1012!1/!12 105/lRS 708-1188
UNIT PRICE TOTAI.
$4,954. 70 $9,909,400.00
108~000 ~:bs ~~bs 48.000 ~:bs ~~bs 1.000 ~:~30 t~30 SPECmCATIONS:
HEXCEL BONDING CAPABILITIES
QU]\N'l'ITY TOLERANCE : + 0t. - 0\
'l'Q' 3
This item has beenlrepued as a ROUGH ORDER OF Ml\GNJ:TUOE. KEXCEI. reserves the right. to submit. a im quotation before placement of sn order. NON-RECURRING ENGINEERING Lot l $100,000.00 $100,000.00
SPECIFICATIONS a NIA
QUANTI'fi TOLERANCE: ... 0% - 0\
'l'Qt 3
This itelll has beend'.repared as a ROUGH ORDER or MAGH!TUDE. !!EXCEL reserves the right to submit a rm quotation before placement. o! an order .
. QUO'l.'!l 'ro'.l'AL $32,23!5,113.00
Bott• & Cqnditjmw1 l QUOTE IS BASED ON THE ASSUMPTION THAT PULTRUSIONS WILL BE
FLUSH WITH THE EDGE OF THE SXIN.
NON-RECURRING ENGINEERING SUBJECT TO F!RAL DESIGN. NOT TO EXCEED PRICE QUOTED.
2 FREIGHT COLLECT
THANK YOU FOR THE OPPORTu1'ITr TO QUOT!l.
10/2!U92 15:39 I Barbara Rust
Customer Service Rep.
NOTEc This quQt.e is valid for 60 days. Please :i:ead NOTES & CONDITIONS on reverse side.
5-Mar-93 Barrel CSCs Malerlals Cosl Estlmale r·;; •. ,z, "6-6·6"
Tolals ch•mber type lnn1r·1 lnner-2 Mlddlo·t Mlddlo·2 Oulor·t Outer-~ 8ASEl..INE wldlh (mm) 854 854 938 938 1200 1200 lenglh (mm) 3249 3471 2387 2587 3297 3500 panel area (111"2) 2.123 2.270 2.220 2.408 3.958 4.200
gaps/chamber • • • • 8 11J
8 chamberl/aeclor 4 4 • 8 8 8 seclorslbarrel hall 12 12 12 12 12 12 lolal chambers t8 t8 192 192 192 192 980
lolal arH (111"2) 1223 1308 2558 2774 4558 4838 17258
wire (m/gap) c;.o) 881.9 850.8 925.8 1534.8 1832.0 2.5 mm pllch, lull chamber wldlh wlro (m/GEM) 59~555 834935 1224833 1332890 2209788 2350080 8345080 (25" ...... ,.,
\ i ) ' '. i ,,
unll co111: wires Sim 0.21 0.29 0.29 0.29 0.29 0.29 OUokt from Luma -~
I-' ckcull boards Shn'2 ol penal 20 20 20 20 20 20 End cap oollmale
~ ~· calhodeo. ploln S/m•2 5 5 5 5 5 5 End cap quole
calhodeo, aklpo Slm'2 258 258 258 258 258 258 t/2 Actual Buckbee Meara cost
manulactured panels 0.12725 0.12725 0.12725 0.12725 0.12725 0.12725 M. C. GHl "b" laclor 450.71 450.71 450.71 450.71 450.71 450.71 M. C. GHI •a· leclor
$/panel 889.42 891.44 888.82 925.83 1231.08 1279.11 M. C.Glll (Cos1-a • b • aroa(ln • "2)) number req'd. 872 872 1344 1344 1344 1344 8720
'Li I . I ·1 • \00·6/'h Y6l\ ,41) 311. 19 "JO '-1. 5.; s I AfA2
Total Co111: :i• wires $171,841 St84, 131 $355,202 $388,538 $840,832 S88t,52~ $2,420,087 f40.23
clrcuh boards $48,911 $52,302 St02,309 Stt0,954 $182,311 $193,538 $890,322 40.00
JINR- $24,458 $28, 151 $51,154 $55,477 $91, 155 $98,788 $345, 181 asllmalod •• aamo as cir bids 20.00
calhodeo, plain '8, 114 $8,538 $12,789 $13,889 122,789 $24, 192 $88,290 5.00
calhodes, 1klp1 S315,478 $337,345 $859,893 $715,850 St,175,905 $1,248,307 $4,452,578 2511.00 1111~
manufactured panels $514,251 '803,755 St,194,312 SI ,244,042 St,854,543 $1,719,118 S7,000,022 rsr.1s 405.81
MATEllM.S $1,151,051 St ,210,221 $2,375,858 $2,528,530 $3,787,538 $3,983,445 $14,994,441 1166.114
315113 page 1 R.E.Gusllt"9atl
• • ( • • t • f • j •
-
-.
-
CSC panel Fabrication Specs
Panel Definition: A 19 mm (nominal) honeycomb NOMEX core (l .8 lb/ cu. ft.; 0.25 in. cell) sandwiched between two .5 mm fiberglass (G-10 or FR-4; NEMA specs.) face sheets. The fiberglass face sheets are copper claded (17 µm thick; 1/2 oz. per sq. ft.) on the outward facing sides. The copper on one of the face sheets is etched to provide a precision cathode plane.
Specifications (prioritized) l. Flatness
700 µm over 7.2 m
2. Parallelism 700 µmover 1.2 m
3. Net thickness (incl. face sheets) 20mm±250µm
4. Squareness Diagonal measurements± 250 µm of each other
5. Length and width dimensions Nof set at this time.
Cathode strip
i------1.2 meters------'o.j
147
Gap Spacer
Fiber Glass Face Sheet (Copper Clad)
Prototype Manufactured Precison
Panel Flatness Parallelism Thickness Cost
f-' Manufacturer (over 1.2 m) (over 1.2 m) <Nom.20mm) (2 pCllels)
~ co LLNL/M.C. Giii lOOµm• lOOµm ±250µm 150 KS
Composite Optics 75 µm (side 1) 7 5 µm (side 1) ±250µm 25 KS
150 µm (side 2) 150 µm (side 2)
• Cu"ent Physics requirement: Anode to cathode spacing within± 100 µm.
' f f ' f ' f f f f '
I-' ..: .. ~
) . )
Material Thickness Tolerances
Fiber Glass Face Sheets • 10% or 20 mil± 2 mil
NOMEXCore • 19mm(748mil)±l0mil
Resulting Precision
Flatness (coarse Cathode) and Parallelism
Thickness
)
Panel Prototype Fabrication process
Step 1: Fiber glass face sheet sucked down flat onto granite table and NOMEX core bonded to it via a room temperature curing epoxy.
Step 2: NOMEX core machined down ( using Toshiba cutting tool) to a flatness of 2 mil over 1.2 m.
Step 3: Top fiber glass sheet bonded to NOMEX core.
6 mil over 1.2 m
20mm ± 14 mil
Improve Fiber glass thickness tolerance and/or machine tolerance Improve NOMEX thickness tolerance
19.65 mm Overall Thickness 19.8 mm
Low Point
Machine down 24 ± l mil -4 756.5 ± 1 mil
-4 757 .5 mil (high)
High Point
)
I-' c,, 0
•
Concern:
Solutions:
• •
A seven-panel (6-gap) chamber sags 67 µm under its own weight leaving only 33 µm of manufacturing tolerance for the panel Qild. gap frame assemblies.
l. Review the physics requirement (and possibly loosen-up tolerances).
2. Stiffen-up the individual panels • Rib stiffeners across the panel width • Alternative face sheet materials which
Increase stiffness relative to mass.
• • • ' • • • '
-
CJ) ...
(iu. 5~p h4M~ Sevwvp/rl W\fkcl.L ~y
I PEA 1. , kii ik-'.
. . .
lnterstrip Capacitance for PRC board 40
~ 30 a.
rms 34.4 pF
a: 0.66 pF a. ·;:: -• -0 .... • .a E ::s z
._> .• ; -
20
10
0 30 32 34 36 38 40
tnterstrip capacitance [pFJ . - --·:----
.. f I
I PRC (Bottom) i : board
I I I 0.05
"' I -., r ; 11 .r:
tJ 0.04
/ ;§. I I ! ,, l l e 0.03 iii '
"' ~ ~ <I)
'( "'"' ~ ::; 0.02 ' -f c;; ' c: 0.01 r .E F 0
j ::: VJ-1.S" - '/ ""! f/4w~reJ. z 0 •
0 20 40 60 80 100 120 -Readout Strip ('It)
PRC board (Middle) '\ r
l 0 i1 \ 0.05 \
"' ' ., .r:
) 111
.. " 0.04 ~ ,, e 0.03 :::>
!"'- ' D "' i "' ., I ::; 0.02
\ -1i
eecro~ c: 0.01 e 0 z
0 0 20 .. o 60 80 1·00 120
Readout Strip -
PRC board (Top) -0.05 -;;;
"' .r:
" 0.04 ~ .., e 0.03 :::> ., .. ., ::E 0.02
1i c 0.01 e 0 z -
0 0 20 40 60 80 100 . 120
Readout Strip ··,-:·.
.. 154
-
M.l.T. June 29, 1993
Most Recent Results on Axial Alignment
(Stretched Wire + mini-Strip Readout).
1 1".'.'•-i iJ I
Reminder:
PROJECITVE + AXIAL ALIGNMENT
as was shown by J.Paradiso and A.Ostapchuk in detail, the axial alignment with a detector accuracy-10 µm is adequate to the GEM alignment goals.
158
..
...
-
-
-
-
-
-
..
-
-
GlOboard
~stretched wire
mini-strips
calibration pad
A pulse is fed to a stretched wire, as large as wanted.
Induced charges are picked up from mini-strips.
The induced charge shape is determined by pure electrostatics, peak of the distribution indicating the "horizontal" wire position and its width giving "vertical" displacement.
Narrow strips (-1 mm) allow to get a high accuracy (<10 µm) over large range (-10 mm) without special concerns about calibration, which is the main issue of a high accuracy + large range aligi:unent.
Monte Carlo simulation showed that the scheme should work and not effected by many systematic errors, such as electronics calibration, wire tilts in both directions, crosstalks and so on (stochastic noise is not a concern at all).
159
wire fixture is NOT attached to strip boards
axial stretched wire
______ _:::::~.._Number of mini-strip bands aloi
1GO
chamber adge may be as freque1 as needed
-
-
-
-
-
-
...
-
-
-
Experimental Set-Up:
A G 10 board with 11 strips equipped with electronics. Pitch= 1.016 mm (40 mil). Etching was made at a standard firm (standard electronic board tolerances, nothing special).
100 µm stretched wire (1 m long) over the board.
The board was fixed on a stage which could be moved by precise micrometers (2 µm min division).
Signal from - 2 V up to -13 V was used for the wire.
Maximum pick-up charge on a strip was around 700 fC. Electronics noise was - 5 fC (30,000 e, really lousy!)
Calibration was done by feeding a test pulse onto the underneath pad (trivial).
161
RMS ~ 1.5 ~Ltn (includes 1rteasure1nertt errors)
8
7
6 -
~ 5 .,...... ~ ..... § 4 0 u 3
2
1
0 -10 -8 -6 -4 -2 0 2 4 6 8 10
Strip Center Deviations, µm
Fig.4. Pitch accuracy of strips etched on GlO board as measured with an optical microscope.
1G2
-
-
-
-
-
---
-
-
f-' C';) c,.J
) ) )
Line - theoretical distribution Dots - experimental data
rn ..... ...... §
•
~
1500
P. 1000 'E Cl)
~
i:: 0 0
~ 500 a "d 0 u .g ~
0 -10 -5 0 5
~ (Xstrip - Xwire), mm
H = 2.0 mm
10
-
-
-June 24, 1993
wire position
H= l.Omm -2000
"' .... 1600 ..... ... = ::s ..ci a . 1200 a>
~ -..c: u 800 "O a> (.) ::s
"O
= 400 ....... ...
0 1 2 3 4 5 6 7 8 9 10 11 ...
STRIPS
...
-164
-
-
June 24, 1993 wire position
H= 3.0 mm 2000
"' 1600 ... ..... i:: ::s
~ «> 1200
~ ..c:: u 800 "O Q) 0 ::s
"O 400 i:: ......
0 1 2 3 4 5 6 7 8 9 10 11
STRIPS
-
165
-
-
June 24, 1993 wire position -H = 7.0 mm
2000
"' - 1600 -..... c: ::l
.ci a . 1200 ~
~ -..c: u 800 -0 ~ u ::l
-0 c: 400 -......
0 1 2 3 4 5 6 7 8 9 10 11 ..
STRIPS
-
-
166
-
-
Straight Line Fit June 24, 1993
with a Slope Constrained to be 1.0000 H- 2.0 mm 11 Strips
8 ::t
11000
i 9000 Cl)
8 Cl)
~ ...... 7000 ~ .... 0
Cl) ·= 5000 ~ 'tj
~ ~ 3000
~
I . . . . : . ! . ··-·····--·t•····•-·--·••C·--••• ••••·•·4-·••·•·••····-·+··--.. --··t·--····--001°-···--••• ....... --·-·• .. ··--···- ·-··--
---·-l··--···-·-l···--·--·· l. ....... -.... i ................ 1 ............... -1----... l.---·-! ·---!-···--· i = ! ! ! = j I l I = i i I ! I I
--·--···!···--···-···1··-··--·-···t- ····--··t·-·-···--!---·--·-~···- i --·t-----LI. ----1 i ! i ! I I I
i ! l ! l i I j · ·--·-··t·-·-·-···-r----·-··t···-·- ···i·-----r-·-······· : ·----·t····--·1·--1····-··-i i i I i 1' I i l ' i I . i I I ---·1------t-···-.. --t---·-·1 ·--- i---r·---·-r---·t·--·--r·---· I : : I ! ! i I I i i ! i I i I I . '-----'---, --: ---· - -:----! -,
' : I • f
j I ! I i --~-----i--: ·---~---L-L----+-' _ _,l_--i---1
! i i i !
I ! I I I I . . . . , I --1-·--·-, · .. ------r----i----!1--·i---·--41--+---1,-.....-1 I I ! :
--!· .. ·- ~4 m~ R~ge _Use~ for Ana_lysis_ : ! · 1 I
1000 1000 3000 5000 7000 9000 11000
Wire Displacement as Measured by Micrometer, µm
---
Note: slope is constrained to be 1.00000 June 24, 1993
H = 1.0 mm
20 ' '
-10
-15
15
10
0
-5
5
-····-··-f--····-·-··t··········--i-·····-···-·+·-·--······~---·---!------t----·-+-·-·---·-f--i ! l I I I l I I
-···-· .. ·-1--·········+·····-·-··+··-·-·····1--··-·····-f-·-··-· .. -+-·-····+-·---··t-·---··t--· • • I • • • I I l
·-·---1-··-···-···l·-·····-·····-r--······-·····t--···--+-·---+·---·-1--·--·-t-····----+··-·-~- l l I i ~. ···r···.! i --·-····-· .... ·~·········f.······-·---'t'···-····•·--:-···~-·-·!·--·-·---·t--·-··--·~··-····-4·-····--·· I i • i. ••• .: •• •i9 • •i i ! • • i
_____ .L ....... -. ..1. .... ____ J .............. [ ___ J ___ l ________ l ____ l. ____ ~t .. i ; ' I ' I I ! I t-j~s = ;1.3 ~ :±4n:n1) t-j·---'
i 1--
-
-,
-20 1 2 3 4 5 6 7 8 9 10 11
Wire Displacement as Measured by Micrometer, mm -
-
-1G8
-
-
-
s ::l -~ § 0 u
15
10
5
0
June 24, 1993
H = 1.0 mm
RMS= 1.3 µm
-20 -15 -10 -5 0 5 10 15 20
Residuals, µm
169
-
-
-Note: slope is constrained to be 1.00000 June 24, 1993
H = 3.0 mm .. 20
,..... ..0 + 15 -(<j
~ 10 II s "' (<j ::1. 5 ~ ~
0 __,ca ... ::s ...... "O ~ ...... II) ~ -5 :3 ~ ... -10 ..c:: bO ·a -15 b
ti)
· , , , · I ! i i i I I I
··········-1---····--···t .. ·············+···············t····-·········1··-···-·--·1·········--··r·-·-·········t·-----··-·i·-·--·· I ! i i i . I l I f i i ! I j I ····-·······-i····· .. ·········:. ............... :. ............... ! ..... - .. - .. -·········-·-·············-···~----·--· -----.:---·· i l l i I I 1· I I ! , , ' . · I 1
·-·-········~·:····:···t-·········· .. ·t-············1···-····-··+-·-··-·····1·········-··-t-···-···-··[· ----·1· _ ........ _ ! • •1 1 ! I L ••• ,. ••
----4-------···rJP .. «-----t----·-·1t·······!·11········1· .. .!--·r--··· --. I · • : • • 'f't r• I
- ....... ...1 ... - ......... .L ......... :.t.._~_...l ......... _J __ ·-l·----- ---- --•• i_ I I I i I ' I ! I =t--J ~s = :1.6 F \±4~m) )-:,.._ __ __, I l ' I ' I • ' 1
'
...
..
.. -20
1 2 3 4 5 6 7 8 9 IO 11
Wire Displacement as Measured by Micrometer, mm -..
..
i70
-
Note: slope is constrained to be 1.00000 June 24, 1993
H = 6.0 mm
20 ' i
-10
-15
15
10
-5
5
: : : l l I l ! I ···-····-·-i················t·-······-····t····--·-··-t··-·-····-·1··-·-··-·f····--··-··-t···-·-·--·t·--·---1··--
i i i i i I l i I • I I ' ' ' ' l '
·-·-·---l------···l· .. ···----t-----~------~-----~---·---~---·-4-----4-1 i : : i • I I • . : : i l I i I i '1 j ! t' ! I j I
! I . . I ! I I --·l'l·-·-··--·i·-----t--··-·--f··-----1 +---·---;.-......... ;.----·-··--t--1 j I l I I je •• , I I I ' I I • ' I. ' l • i i ! •• •! ; • • •1 !9 ! ---·r·-··• ... •t--··---t"--·-··-.. ~·---1---·•··---1---1·---•---J. ____ _ ' . I • I . • I . • I : I • : • • I .,. ••• , I I • •' i ~ • i I I ! i I ;a
---.!------·i·-······..!~------.i.----1---i---·1---4-----1--l l l i j l j · I j i ! : i . !
-·---- ·--1--......j I RMS = 2.5 µm (+4mm) I ~--1.~.l::==:::::;:========:;:::===::::::===i====t..~~i·----i
-20 1 2 3 4 5 6 7 8 9 10 11
Wire Displacement as Measured by Micrometer, mm
·-
171
10
[ 9
8
5
4
3
2
1
0
--
-RESULTS OBTAINED WITH 11 (1 mm wide) STRIPS
10 µm goal June 24, 1993 ..
I
~fEl==~~ : ! i : I I j ! I
-·-····f·--···--i--·····---t-·-···----.:..·--··----t-----·l-·------i-------1--···-······1'-·--···· I. ! ! ' i ; 1· ; i
i i ! ! i : I i ----t---~----r.----~-----+---i ... ---i------1------·-i--···---
'1 I i II j i I I ! i I ! ! I l
--!----i--r-~----r---i---!- 1··-·-i i i I I I i i
1----i';.......-' ' ! ! I • ! r i : .i f . .·,; : i _; __ j_ . ;. '
I •' • T I i I • · i : I I i ... ·--t--·--·-··i··---... ---+--~---... --•---+---1 I I ! l I I I i-
-
-
-0 1 2 3 4 5 6 7 8 9 10 -Distance between Wire and Strip Board (Heiglit), mm
-
e ::t . ... ·-ll. >.. ,.c
= u > ·-0 "' "' ... ..c:: bO ·-u
::c:
M.V. = 999.7 µm RMS= 2.7 µm
June 24, 1993
H- 1.0 mm
1050
1040 1030
1020
1010
1000
990
980
970
960
l ' j . i i i i i i i l _J
-:~:~J::=:=:J::::~~~=r::~~~=1~~~1=:=r=~r--·1=---l-i l i I l ! i i I i i ! ! l ! i I ! -·-·-:-----·-1-····---+---1---?· I •1·--·t---:-·---1 ! ! I ! I . t I i i : ! ' ; i 1' '
-·-i··-··--··~ .. ·--···i----·--~---i------+·----'1'-·-----~--i i l f i i l i j __ ... t..::.::J •. ~ .. ! ...... l .. --···'"·•l..!~l._?.!.!..L._ ...... L _______ J ______ 1. __ t ; •:.. ! i :•. ;. ••• ! •• : l : : : . : i •I • :• i = f i ! i 1 i.. I -·-·r---l-·--:----,·- -,·----·-r--·,....--+---t ! I I I I I : I . ' . I ! I I I ! ' I I . I --i-------~----4----t i----;..1 __ _..,_ _ _, __ __, l l I ! ' I I
··-.. ·-t··--· .. ·-~---i---1- :- :---+---+---! i l i i i i I
--~·---·r-----+-----r--1--i-·----·------;----1
I ! i 1 i 1 I 950
1 2 3 4 5 6 7 8 9 10 11
Horizontal Wire Displacement. mm
173
e ::1..
...: ·-~ >. .0 c:: Cl)
> ·-0 "' «I ....
.c:: bl) ·-Cl)
::r:
M.V. = 3015 µm
RMS = 3.7 µm
June 24, 1993
H-3.0 mm
3050
3040
3030
3020
3010
3000
2990
2980
2970
2960
£ffi1-Fr-Fi-~ ·r .... L •••• i.····r····~· ... J ~-·· J -i----·-i---+·----+·· . --·=··-----~--~ ...... •.,-----!--! l ! ! ! l i i I i I i 1· ! . i ! ; ' ' ' ' I ' --1 ----1 I -I ---~--! ! i i i I ; f l l f I l i j
~--·._-: ... 1 ____ J f H 1 f r--·r-·-j l ! i i t
~--;!----l--··! I . -i---->---+·---t·---1 ! i .1 •• i i
2950 1 2 3 4 5 6 7 8 9 10 11
Horizontal Wire Displacement, mm
174
..
..
-..
..
..
..
-
..
-
100
El ::1. ,-... 80 . "' ....... 0.
>-·E s...,, 60. 4:::E -ti),.::. t.> c
.... 0 40 ~ .. El B Q) 0 .... c "' ._, ;... 20
ti)
0 0
June 24, 1993
Error Bars indicate RMS errors
I I 1
i i i j • ! ! ! I I I i I I I
--1-·-----L----1 ---··t------r--i-1 I I I ;
I . ! I 11 I 1 1
1 2 3 4 5 6 7 8
Distance between Wire and Strip Board (Y), mm
175
SUMMARY:
Regular Etching gives -1 µm (or better) pitch accuracy.
Strip width has - 1 µm uniformity (over 3 cm range).
Using just 11 strips allowed to achieve 1-3 µm resolution over ±4 mm range (goal is -10 µm).
Vertical accuracy is worse (-50 µm and should improve considerably with increasing the number of strips), but much better than 200-400 µm requirement.
PLANS:
1. Multiplex Readout. Say, using an AMPLEX would allow to readout 16 strips with essentially one chip (cost estimations!).
2. Try a silicon carbide wire (it will sag by 300 µm only at 15 m length; 1-2% tension control is simple• and will allow to correct a sagita with a few µm accuracy).
3. Make a full scale prototype (15 m long wire and all accessories).
• As proposed by J .Paradiso, one of the possible options could use the same mini-strips: the wire can be vibrated with a peso-element at varying frequency while the resonance is detected by the mini-strips. However, even a simple weight may tum out to be adequate enough.
17b
...
-
--
-
-
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-
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-
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179
'
G.J.tr\·~·J "'°'! l\, •• & A. Osi,,,l .. 1c:
F '°'9l(- -) - ... ~e)..:.. A(e)_..:.. ~9) • .;.. A(e) __ ..:.. A(e)_! · A(e)_!_ ~.. -, - - -uo ' .... 10 - . --i..il - ... !! -- ' ""''!?O - -:- -:1 - -
''to\ -iW • IJi - 2.02
Different te:ms a.re different linear combinations of F S; (measured values of false sagitta.) and therefore they depend on difi'e:e:it mov=ents. So,
a00 is determined by shift along the x-a.:cis;
ao1 is deter.nined by rotation a.round the y-a."cis;
a10 is determined by rotation a.round the x-a.:cis;
a20 is determined by rotation around the z-a.:cis;
We can apply the same interpolation procedure to the function NS(x,z) and get similar polynomials:
NSC4l(:, z) = ~> + b~!'= + b~~>z + z4~l:z
NS(9l(:, z) = b~ +bl~=+ bf:1z + z4~1:z + b':}:2 + b~~1:2z
The coefficients of these polynomials depend on shifts and rotations of muon modules in different ways, but the shifts and rotations are the same in both cases! So, there must be correlations between coefficients a;; and b;;:
bio is fully correlated with ao1 (see Fig.18),
b,,1 is slightly correlated with a11 (see Fig.19);
and most interesting, iI there are no torque de!o=ations of muon modules,
b11 is fully correlated with a20 (Fig.20, but see Fig. 21).
The last correlation means we are able to correct rotation a.round z-a.xis using only four straightness monitors. This is the second application of monitor measurements of non-bending de1iections.
9. Alignment requirements
We would like to st;ess the sharp distinction between placement and measurement acc:uncy requirements. The only requirement for monitor measurement accuracy is tha.t it mus: be better th;l!I 25µm.
There are two types of placement or p:ope: posi:ion :equirements: l) relative :;: o-
180
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FaJSog(microns) vs Z-resolu~ion(microns) 15GeV
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FclScg (microns) vs Z-resolution (microns) i 5GeV
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FalSag (microns) vs Z-resolution (micrcns) 25GeV
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. -
• Provide a ''Test Bed" for proposed projective alignment hardware.
• Provide variabletemperature cond· itions as would be seen' in GEM.
• Measure the effects of air disturbances on the actual structure.
• Test actual hardware designs:for · chamber/structure· interface.
• Develop alignment procedures, test
t1111 our
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ing and certification. • Demonstr~te the .Physical constraints t L&.~~!"'"''-l*'H . ~ : . " . . . m . ii
of the vanous ahgnment schemes. , " " , , , , , , , , , , " , , " , ; , , , , " , , , . , , , , , , T . . . d k' .. ' ... ',' ... ',',',',',',','··/,",',',' ,',' .. :' ,' ,' ,' ,' ,' ,' ," ,',',' ,' ,' ,' , .... ,' ,' ,' ,' ,' ,' ' 1
• est pos1t1onmg actuators an 1n- ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ·· ·· ' ' ·· ' ' ·. ' , ' ' · ' , ·· , ' ' ' ·· ' ematic mounting ·schemes. · ~.--..... dSllfll
• Test bed for using X rays for. global alignment.
GEM PAC Review, May 26, 1993 C.R. Wuest
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•
Alignment System R&D Program ~e_1)
ATS· Experimental· Plan
• Measure stability of alignment hardware for 3-point projective alignment scheme. ·
• Measure sensitivity of alignment hardware to temperature and atmospheric variations.
• Study procedures for installation of CSC mock chambers and chamber/structure interface hardware concepts.
• Study quadratic interpolation method by intentionally distorting chambers in controlled ways.
• Evaluation of remote actuator system, operation of remote position actuators and C(ncoders, and development of alignment procedures.
• Vibration sensitivity measurement.
• Hardware optimization, including chamber interface hardware.
• Repeat tests for all straightness monitor technologies.
GEM PAC Review, May 26, 1993 C.R. Wuest
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Muon Beam
Cathode-Strip Chamber Tests GEM Muon Detector
MWEST Magnet
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2A. Cu Radiator
Six-Plane Chamber
Lorentz Angle and Resolution Studies
Strips 11 Rotation by ± 10°
to Field
Wires .L to Strips
Resolution Studies from 0 to 50° Polar Angle
0B Beam
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Alarm Management
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Services Provided: Oynarmc Chamel Location
Gel (Corretalad.Asyncnronous)
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Oeve1ooeo Software: tnteracuve Oataoase ·.:.::nngur aucn i co1 Oaiaoase Access Dataoase Scan Tas•s lnouvOutout Drivers
Record Tyoes Suooorted: Ana1og Input : Outout Waveforms. Data Comoress1on Dlscre1e Input / Outout Mo1ors nmang Ca1cu1auons. PIO. Signal Select Suoroullne
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Acauired Software: UNIX Ooeranng System X Server X Client X Window manager
Develooed Software: lnteractNe Oisolay Editor Run-Tima Olsplay Generator Chamel Access
Graohical Elements: Line. Arc. Oval. Rectangle Monitors: Text lnaicator. Meter. Bar Controuers: Text. Button. Slider
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Develooea Software: Arcnive ConhgUra11on Tool Arcnive User iniertace Run- l1111e Data Arenivar
Data Collection On Change On Oemanll Penoclle ltmed Triggered by Event Pre-<1e1ermnea Disk Allocalicln No Per enamel Ouoatas
Data Anat.vsis: Da1a Correlaocn Viewmg HiSIDnC Data through Time PlolS (Time.yy) (x.yy) : (llne)(mark)(pointl Fast Data Access Spread Sheet Repon Fonnat Encacsulatea PoslSCnPt Plot Format
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Hardware Comoonents: Spare Ethernet Connecllon Board SCSI DISk lntertace High SP88d/Hlgh Density Disk
Acauired Software: UNIX Coeradng System SCSI Driver
Develooed Software: Alarm Configuration T col Alarm Access Routines Run-nme Alarm Manager
Alarm Monitorina Faull Tree Dellntion Faull Tree Descent Fault Tree Status Alarm Annunciation Alarm Acknowtedgement Alarm Log Fde Alarm Logger (Scron Wlnaow 1 Disable Sub-tr1111s Acdons Conflgurao111 Dy Sub-tree
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