Rao Tummala

GEORGIA TECH

Shankar Lakka

XILINX

Riko Radojcic

QUALCOMM

Daniel Berger

IBM

Muhannad Bakir

GEORGIA TECH Dean Klein MICRON

Jang Seok Choi

SAMSUNG

Ron Huemoeller

AMKOR

Phil Garrou

YOLE

Jan Vardaman

TECHSEARCH

Masahiko Okuyama

NGK NTK

Masato Tanaka

SHINKO

Venky Sundaram

GEORGIA TECH

DC Hu

UNIMICRON

Abe Yee

NVIDIA

David Clark

SEMTECH

Ritu Shrivastava

SANDISK

Minsuk Suh

HYNIX

Gene Smith

CORNING

Nobu Imajyo

ASAHI GLASS

Ruediger Sprengard

SCHOTT

Reona Nakamura

MITSUBISHI ELEC

Stephan Krause

LPKF

D. Marx RUDOLPH

TECHNOLOGIES

Shigeo Nakamura

AJINMOTO

Sesh Ramaswami

AMAT

Matthew Gingerella

SUSS

Hanock Kopel

ORBOTECH

Horst Clauberg

Kulicke and Soffa

Shinya Tokunaga

PANASONIC

Joungho Kim

KAIST

Dusan Petranovic

MENTOR

Steve Pytel

ANSYS

Humair Mandavia

ZUKEN

Tomoyuki Yamada

KYOCERA

Steffen Kröhnert

NANIUM

Satoru Kuramochi

DNP

Raj Pendse

STATS CHIPPAC

F. Carbolante

QUALCOMM

C. Hoffmann

TDK

J. Papaolymerou

GEORGIA TECH

Raj Pulugurtha

GEORGIA TECH

GIT 2014 @ Georgia Tech 4th Annual Global Interposer Technology (GIT) Workshop

Wednesday, November 5th – Friday, November 7th

GIT Golf Classic, Saturday, November 8th Global Learning Center – Georgia Institute of Technology – Atlanta, GA USA

THE EVENT

IMPORTANT DATES

July 25, 2014 Early Registration and Hotel Opens

Sept. 15, 2014 Call for Academic Posters Closes

Sept. 22, 2014 Notification of Acceptance

Oct. 3, 2014 Early Registration Closes

Oct. 6, 2014 Last Day for Registration Refund

Nov. 1, 2014 Presentations Due

The GIT 2014 Workshop is intended to stimulate development of most advanced semiconductor and systems packaging technologies, comparing and contrasting a wide variety of interposer and package technologies being developed such as silicon, organic, and glass. GIT 2014 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies that supply materials and tools from around the world. Such interposer and package technologies have many applications including packaging of ICs in 2D, 2.5D and 3D for smart and wearable, automotive, and high performance systems.

GIT 2014 Co-Chairs

Rao Tummala

GEORGIA TECH

Matt Nowak

QUALCOMM

Subu Iyer

IBM

GIT 2014 KEYNOTE AND INVITED SPEAKERS

WORKSHOP LOCATION

Georgia Institute of Technology Global Learning Center 84 Fifth Street, NW Atlanta, Georgia 30332 USA

Wednesday, November 5th – Friday, November 7th

GIT 2014 TECHNICAL SESSIONS

Glass Interposers System Integration with Interposers Panel Mfg. Infrastructure – Tools and Materials Design and Design Tools: Electrical, Thermal,

and Mechanical Design Organic and WLFO Interposers Interposer for RF and Power Plenary Keynotes Plenary Panel Session: Interposer Technologies

and Manufacturing Infrastructure 2nd Annual GIT Golf Classic Reynolds Plantation Greensboro, Georgia 30642 USA Saturday, November 8, 2014

GIT GOLF CLASSIC

www.prc.gatech.edu/git2014