hardware description v200r007_umts

HUAWEI UMG8900

V200R007

Hardware Description

Issue 05

Date 2009-01-09

Part Number 00347892

Huawei Proprietary and ConfidentialCopyright © Huawei Technologies Co., Ltd.

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Huawei Proprietary and ConfidentialCopyright © Huawei Technologies Co., Ltd.

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mailto:[email protected]

Contents

About This Document.....................................................................................................................1

1 Cabinets........................................................................................................................................1-11.1 N68-22/N68E-22 Cabinet...............................................................................................................................1-2

1.1.1 Structure of N68-22 Cabinet..................................................................................................................1-21.1.2 Structure of the N68E-22 Cabinet..........................................................................................................1-51.1.3 Configuration of Internal Components..................................................................................................1-71.1.4 N800 Supports and Accessories.............................................................................................................1-91.1.5 N6X Supports and Accessories............................................................................................................1-131.1.6 Power Distribution Frames...................................................................................................................1-161.1.7 LAN Switches......................................................................................................................................1-201.1.8 LAN Switch Cable Frames..................................................................................................................1-231.1.9 Cabling Troughs...................................................................................................................................1-241.1.10 Fiber Management Tray.....................................................................................................................1-251.1.11 Structures and Mechanical Specifications of the N68-22 Cabinets...................................................1-261.1.12 Technical Specifications of N68E-22 Cabinets..................................................................................1-27

1.2 Auxiliary Devices..........................................................................................................................................1-281.2.1 LMT.....................................................................................................................................................1-281.2.2 Alarm Boxes.........................................................................................................................................1-281.2.3 EAC-2 Environment Alarm Chest.......................................................................................................1-281.2.4 EMU Environment Monitoring Unit....................................................................................................1-29

1.3 Environmental Specifications.......................................................................................................................1-29

2 Frames...........................................................................................................................................2-12.1 Appearance and Structure of the SSM Frame.................................................................................................2-32.2 Fan Boxes........................................................................................................................................................2-72.3 Transfer Boxes................................................................................................................................................2-92.4 Backplanes....................................................................................................................................................2-112.5 Board Deployment........................................................................................................................................2-122.6 Logical Frame Types.....................................................................................................................................2-142.7 Technical Specifications of the SSM Frame.................................................................................................2-20

3 Boards...........................................................................................................................................3-13.1 Categories of Boards.......................................................................................................................................3-33.2 Matching Limitation of Boards.....................................................................................................................3-14

HUAWEI UMG8900Hardware Description Contents

Issue 05 (2009-01-09) Huawei Proprietary and ConfidentialCopyright © Huawei Technologies Co., Ltd.

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3.3 Connection of Boards....................................................................................................................................3-173.4 Signal Streams Between Boards...................................................................................................................3-183.5 Common Characteristics of Boards...............................................................................................................3-22

4 Equipment Management and Maintenance Units...............................................................4-14.1 MOMU............................................................................................................................................................4-2

4.1.1 Panel of the MOMU...............................................................................................................................4-24.1.2 Indicators on the MOMU.......................................................................................................................4-34.1.3 Interfaces on the MOMU.......................................................................................................................4-44.1.4 Jumpers on the MOMU..........................................................................................................................4-54.1.5 Fusess on the MOMU............................................................................................................................4-54.1.6 Technical specifications of the MOMU.................................................................................................4-5

4.2 MOMB............................................................................................................................................................4-64.2.1 Panel of the MOMB...............................................................................................................................4-74.2.2 Indicators on the MOMB.......................................................................................................................4-84.2.3 Interfaces on the MOMB........................................................................................................................4-94.2.4 Fuses on the MOMB..............................................................................................................................4-94.2.5 Technical specifications of the MOMB...............................................................................................4-10

4.3 MMPU...........................................................................................................................................................4-104.3.1 Panel of the MMPU..............................................................................................................................4-114.3.2 Indicators on the MMPU......................................................................................................................4-114.3.3 Interfaces on the MMPU......................................................................................................................4-124.3.4 Jumpers on the MMPU........................................................................................................................4-134.3.5 Fuses on the MMPU.............................................................................................................................4-134.3.6 Technical specifications of the MMPU................................................................................................4-13

4.4 MMPB...........................................................................................................................................................4-134.4.1 Panel of the MMPB..............................................................................................................................4-144.4.2 Indicators on the MMPB......................................................................................................................4-164.4.3 Interfaces on the MMPB......................................................................................................................4-174.4.4 Fuses on the MMPB.............................................................................................................................4-174.4.5 Technical specifications of the MMPB................................................................................................4-17

5 IP and TDM Switching Units..................................................................................................5-15.1 MNET..............................................................................................................................................................5-2

5.1.1 Panel of the MNET................................................................................................................................5-25.1.2 Indicators on the MNET.........................................................................................................................5-45.1.3 Interfaces on the MNET.........................................................................................................................5-65.1.4 Fuses on the MNET................................................................................................................................5-85.1.5 Technical specifications of the MNET...................................................................................................5-8

5.2 MTNU.............................................................................................................................................................5-95.2.1 Panel of the MTNU................................................................................................................................5-95.2.2 Indicators on the MTNU......................................................................................................................5-105.2.3 Interfaces on the MTNU......................................................................................................................5-115.2.4 Fuses on the MTNU.............................................................................................................................5-12

ContentsHUAWEI UMG8900Hardware Description

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5.2.5 Technical specifications of the MTNU................................................................................................5-125.3 TCLU............................................................................................................................................................5-12

5.3.1 Panel of the TCLU...............................................................................................................................5-135.3.2 Indicators on the TCLU........................................................................................................................5-145.3.3 Interfaces on the TCLU........................................................................................................................5-155.3.4 Fuses on the TCLU..............................................................................................................................5-155.3.5 Technical specifications of the TCLU..................................................................................................5-15

5.4 MTNB...........................................................................................................................................................5-165.4.1 Panel of the MTNB..............................................................................................................................5-165.4.2 Indicators on the MTNB......................................................................................................................5-175.4.3 Interfaces on the MTNB.......................................................................................................................5-185.4.4 Fuses on the MTNB.............................................................................................................................5-195.4.5 Technical specifications of the MTNB................................................................................................5-19

5.5 MTNC...........................................................................................................................................................5-205.5.1 Panel of the MTNC..............................................................................................................................5-215.5.2 Indicators on the MTNC......................................................................................................................5-225.5.3 Interfaces on the MTNC.......................................................................................................................5-235.5.4 Fuses on the MTNC.............................................................................................................................5-245.5.5 Technical specifications of the MTNC................................................................................................5-255.5.6 MTNC Subboards................................................................................................................................5-26

6 Resource and Management Units...........................................................................................6-16.1 MCMF.............................................................................................................................................................6-2

6.1.1 Panel of the MCMF................................................................................................................................6-26.1.2 Indicators on the MCMF........................................................................................................................6-36.1.3 Interfaces on the MCMF........................................................................................................................6-36.1.4 Fuses on the MCMF...............................................................................................................................6-46.1.5 Technical specifications of the MCMF..................................................................................................6-4

6.2 MCMB............................................................................................................................................................6-46.2.1 Panel of the MCMB...............................................................................................................................6-56.2.2 Indicators on the MCMB........................................................................................................................6-56.2.3 Interfaces on the MCMB........................................................................................................................6-66.2.4 Fuses on the MCMB..............................................................................................................................6-66.2.5 Technical specifications of the MCMB.................................................................................................6-7

6.3 SCMU..............................................................................................................................................................6-76.3.1 Panel of the SCMU................................................................................................................................6-86.3.2 Indicators on the SCMU.........................................................................................................................6-86.3.3 Interfaces on the SCMU.........................................................................................................................6-96.3.4 Fuses on the SCMU................................................................................................................................6-96.3.5 Technical specifications of the SCMU...................................................................................................6-9

6.4 MPPB............................................................................................................................................................6-106.4.1 Panel of the MPPB...............................................................................................................................6-106.4.2 Indicators on the MPPB.......................................................................................................................6-11



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6.4.3 Interfaces on the MPPB........................................................................................................................6-126.4.4 Fuses on the MPPB..............................................................................................................................6-126.4.5 Technical specifications of the MPPB.................................................................................................6-12

7 Service and Protocol Processing Units...................................................................................7-17.1 MHRU.............................................................................................................................................................7-2

7.1.1 Panel of the MHRU................................................................................................................................7-27.1.2 Indicators on the MHRU........................................................................................................................7-47.1.3 Interfaces on the MHRU........................................................................................................................7-57.1.4 Fuses on the MHRU...............................................................................................................................7-57.1.5 Technical Specifications of the MHRU.................................................................................................7-67.1.6 MHRU Subboards..................................................................................................................................7-6

7.2 MHRD.............................................................................................................................................................7-77.2.1 Panel of the MHRD................................................................................................................................7-77.2.2 Indicators on the MHRD........................................................................................................................7-87.2.3 Interfaces on the MHRD........................................................................................................................7-97.2.4 Fuses on the MHRD...............................................................................................................................7-97.2.5 Technical specifications of the MHRD................................................................................................7-107.2.6 MHRD Subboards................................................................................................................................7-10

7.3 MRPU............................................................................................................................................................7-137.3.1 Panel of the MRPU..............................................................................................................................7-137.3.2 Indicators on the MRPU.......................................................................................................................7-147.3.3 Interfaces on the MRPU.......................................................................................................................7-157.3.4 Fuses on the MRPU..............................................................................................................................7-157.3.5 Technical Specifications of the MRPU................................................................................................7-16

7.4 MASU...........................................................................................................................................................7-167.4.1 Panel of the MASU..............................................................................................................................7-177.4.2 Indicators on the MASU......................................................................................................................7-187.4.3 Interfaces on the MASU.......................................................................................................................7-197.4.4 Fuses on the MASU.............................................................................................................................7-197.4.5 Technical Specifications of the MASU................................................................................................7-207.4.6 MASU Subboard..................................................................................................................................7-20

7.5 MIOE.............................................................................................................................................................7-217.5.1 Panel of the MIOE................................................................................................................................7-217.5.2 Indicators on the MIOE........................................................................................................................7-227.5.3 Interfaces on the MIOE........................................................................................................................7-237.5.4 Fuses on the MIOE...............................................................................................................................7-247.5.5 Technical Specifications of the MIOE.................................................................................................7-24

7.6 MSPF.............................................................................................................................................................7-247.6.1 Panel of the MSPF................................................................................................................................7-257.6.2 Indicators on the MSPF........................................................................................................................7-257.6.3 Interfaces on the MSPF........................................................................................................................7-267.6.4 Fuses on the MSPF...............................................................................................................................7-26


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7.6.5 Technical Specifications of the MSPF.................................................................................................7-277.6.6 Subboards of the MSPF........................................................................................................................7-27

8 Cascading Units..........................................................................................................................8-18.1 MFLU..............................................................................................................................................................8-2

8.1.1 Panel of the MFLU.................................................................................................................................8-28.1.2 Indicators on the MFLU.........................................................................................................................8-38.1.3 Interfaces on the MFLU.........................................................................................................................8-48.1.4 Fuses on the MFLU................................................................................................................................8-48.1.5 Technical specifications of the MFLU...................................................................................................8-4

8.2 MBLU.............................................................................................................................................................8-58.2.1 Panel of the MBLU................................................................................................................................8-58.2.2 Indicators on the MBLU........................................................................................................................8-78.2.3 Interfaces on the MBLU.........................................................................................................................8-88.2.4 Fuses on the MBLU...............................................................................................................................8-98.2.5 Technical specifications of the MBLU..................................................................................................8-9

8.3 MNLU...........................................................................................................................................................8-108.3.1 Panel of the MNLU..............................................................................................................................8-118.3.2 Indicators on the MNLU......................................................................................................................8-128.3.3 Interfaces on the MNLU......................................................................................................................8-128.3.4 Fuses on the MNLU.............................................................................................................................8-138.3.5 Technical specifications of the MNLU................................................................................................8-13

9 Media Resource Processing Units...........................................................................................9-19.1 MVPB..............................................................................................................................................................9-2

9.1.1 Panel of the MVPB................................................................................................................................9-29.1.2 Indicators on the MVPB.........................................................................................................................9-49.1.3 Interfaces on the MVPB.........................................................................................................................9-59.1.4 Fuses on the MVPB................................................................................................................................9-59.1.5 Technical Specifications of the MVPB..................................................................................................9-69.1.6 MVPB Subboards...................................................................................................................................9-7

9.2 MVPD...........................................................................................................................................................9-109.2.1 Panel of the MVPD..............................................................................................................................9-119.2.2 Indicators on the MVPD......................................................................................................................9-139.2.3 Interfaces on the MVPD.......................................................................................................................9-149.2.4 Fuses on the MVPD.............................................................................................................................9-149.2.5 Technical Specifications of the MVPD................................................................................................9-159.2.6 MVPD Subboards................................................................................................................................9-16

9.3 MTCB............................................................................................................................................................9-199.3.1 Panel of the MTCB..............................................................................................................................9-209.3.2 Indicators on the MTCB.......................................................................................................................9-219.3.3 Interfaces on the MTCB.......................................................................................................................9-229.3.4 Fuses on the MTCB..............................................................................................................................9-229.3.5 Technical Specifications of the MTCB................................................................................................9-23



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9.3.6 MTCB Subboards.................................................................................................................................9-249.4 MTCD...........................................................................................................................................................9-24

9.4.1 Panel of the MTCD..............................................................................................................................9-259.4.2 Indicators on the MTCD......................................................................................................................9-259.4.3 Interfaces on the MTCD.......................................................................................................................9-269.4.4 Fuses on the MTCD.............................................................................................................................9-269.4.5 Technical Specifications of the MTCD................................................................................................9-279.4.6 MTCD Subboards................................................................................................................................9-28

9.5 MECU...........................................................................................................................................................9-289.5.1 Panel of the MECU..............................................................................................................................9-299.5.2 Indicators on the MECU......................................................................................................................9-299.5.3 Interfaces on the MECU.......................................................................................................................9-309.5.4 Fuses on the MECU.............................................................................................................................9-309.5.5 Technical Specifications of the MECU................................................................................................9-319.5.6 MECU Subboards................................................................................................................................9-31

10 E1/T1 and E3/T3 Interface Units..........................................................................................10-110.1 ME32...........................................................................................................................................................10-2

10.1.1 Panel of the ME32..............................................................................................................................10-210.1.2 Indicators on the ME32......................................................................................................................10-310.1.3 Interfaces on the ME32......................................................................................................................10-410.1.4 DIP Switches and Jumpers of the ME32............................................................................................10-410.1.5 Fuses on the ME32.............................................................................................................................10-710.1.6 Technical specifications of the ME32................................................................................................10-7

10.2 MESU..........................................................................................................................................................10-810.2.1 Panel of the MESU.............................................................................................................................10-810.2.2 Indicators on the MESU.....................................................................................................................10-910.2.3 Interfaces on the MESU...................................................................................................................10-1010.2.4 DIP Switches and Jumpers of the MESU.........................................................................................10-1010.2.5 Fuses on the MESU..........................................................................................................................10-1210.2.6 Technical specifications of the MESU.............................................................................................10-12

10.3 MT32.........................................................................................................................................................10-1210.3.1 Panel of the MT32............................................................................................................................10-1310.3.2 Indicators on the MT32....................................................................................................................10-1410.3.3 Interfaces on the MT32....................................................................................................................10-1410.3.4 DIP Switches and Jumpers of the MT32..........................................................................................10-1510.3.5 Fuses on the MT32...........................................................................................................................10-1710.3.6 Technical specifications of the MT32..............................................................................................10-17

10.4 MTSU........................................................................................................................................................10-1710.4.1 Panel of the MTSU...........................................................................................................................10-1810.4.2 Indicators on the MTSU...................................................................................................................10-1910.4.3 Interfaces on the MTSU...................................................................................................................10-2010.4.4 DIP Switches and Jumpers of the MTSU.........................................................................................10-20


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10.4.5 Fuses on the MTSU..........................................................................................................................10-2110.4.6 Technical specifications of the MTSU.............................................................................................10-21

10.5 MPIE.........................................................................................................................................................10-2210.5.1 Panel of the MPIE............................................................................................................................10-2210.5.2 Indicators on the MPIE....................................................................................................................10-2310.5.3 Interfaces on the MPIE.....................................................................................................................10-2410.5.4 Fuses on the MPIE...........................................................................................................................10-2510.5.5 Technical specifications of the MPIE..............................................................................................10-2510.5.6 MPIE Subboards..............................................................................................................................10-25

10.6 MEAC.......................................................................................................................................................10-2610.6.1 Panel of the MEAC..........................................................................................................................10-2610.6.2 Indicators on the MEAC..................................................................................................................10-2710.6.3 Interfaces on the MEAC...................................................................................................................10-2810.6.4 DIP Switches on the MEAC.............................................................................................................10-2810.6.5 Fuses on the MEAC.........................................................................................................................10-2910.6.6 Technical specifications of the MEAC............................................................................................10-30

10.7 MTAC.......................................................................................................................................................10-3010.7.1 Panel of the MTAC..........................................................................................................................10-3110.7.2 Indicators on the MTAC..................................................................................................................10-3210.7.3 Interfaces on the MTAC...................................................................................................................10-3210.7.4 DIP Switches and Jumpers of the MTAC........................................................................................10-3310.7.5 Fuses on the MTAC.........................................................................................................................10-3410.7.6 Technical specifications of the MTAC............................................................................................10-34

11 SDH Interface Units..............................................................................................................11-111.1 MS2L...........................................................................................................................................................11-2

11.1.1 Panel of the MS2L..............................................................................................................................11-211.1.2 Indicators on the MS2L......................................................................................................................11-311.1.3 Interfaces on the MS2L......................................................................................................................11-411.1.4 Fuses on the MS2L.............................................................................................................................11-511.1.5 Technical Specifications of the MS2L...............................................................................................11-5

11.2 MS2E...........................................................................................................................................................11-611.2.1 Panel of the MS2E..............................................................................................................................11-711.2.2 Indicators on the MS2E......................................................................................................................11-711.2.3 Interfaces on the MS2E......................................................................................................................11-911.2.4 Fuses on the MS2E.............................................................................................................................11-911.2.5 Technical Specifications of the MS2E...............................................................................................11-9

11.3 MS1L.........................................................................................................................................................11-1011.3.1 Panel of the MS1L............................................................................................................................11-1111.3.2 Indicators on the MS1L....................................................................................................................11-1211.3.3 Interfaces on the MS1L....................................................................................................................11-1311.3.4 Fuses on the MS1L...........................................................................................................................11-1311.3.5 Technical specifications of the MS1L..............................................................................................11-13



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11.4 MS1E.........................................................................................................................................................11-1411.4.1 Panel of the MS1E............................................................................................................................11-1511.4.2 Indicators on the MS1E....................................................................................................................11-1511.4.3 Interfaces on the MS1E....................................................................................................................11-1711.4.4 Fuses on the MS1E...........................................................................................................................11-1711.4.5 Technical specifications of the MS1E..............................................................................................11-17

12 Packet Interface Units............................................................................................................12-112.1 ME8T..........................................................................................................................................................12-2

12.1.1 Panel of the ME8T.............................................................................................................................12-212.1.2 Indicators on the ME8T......................................................................................................................12-312.1.3 Interfaces on the ME8T......................................................................................................................12-412.1.4 Fuses on the ME8T............................................................................................................................12-412.1.5 Technical specifications of the ME8T................................................................................................12-5

12.2 MG1O..........................................................................................................................................................12-512.2.1 Panel of the MG1O............................................................................................................................12-612.2.2 Indicators on the MG1O.....................................................................................................................12-712.2.3 Interfaces on the MG1O.....................................................................................................................12-812.2.4 Fuses on the MG1O............................................................................................................................12-812.2.5 Technical specifications of the MG1O...............................................................................................12-9

12.3 MA4L........................................................................................................................................................12-1012.3.1 Panel of the MA4L...........................................................................................................................12-1112.3.2 Indicators on the MA4L...................................................................................................................12-1212.3.3 Interfaces on the MA4L...................................................................................................................12-1212.3.4 Fuses on the MA4L..........................................................................................................................12-1312.3.5 Technical specifications of the MA4L.............................................................................................12-13

13 Clock Units..............................................................................................................................13-113.1 Panel of the MCLK.....................................................................................................................................13-313.2 Indicators on the MCLK.............................................................................................................................13-413.3 Interfaces on the MCLK..............................................................................................................................13-513.4 Fuses on the MCLK....................................................................................................................................13-613.5 Technical specifications of the MCLK.......................................................................................................13-6

14 Lightning Protection Units...................................................................................................14-114.1 Panel of the MLPB......................................................................................................................................14-214.2 Indicators on the MLPB..............................................................................................................................14-214.3 Interfaces on the MLPB..............................................................................................................................14-214.4 Technical specifications of the MLPB........................................................................................................14-3

15 Cables.......................................................................................................................................15-115.1 Monitoring Cables.......................................................................................................................................15-3

15.1.1 Monitoring Cables from SSM Frames to Fan Boxes.........................................................................15-315.1.2 Monitoring Cables from SSM Frames to Power Distribution Frames and Fan Boxes......................15-5

15.2 Alarm Box Connection Cables....................................................................................................................15-7


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15.3 Cascading Cables......................................................................................................................................15-1015.3.1 FE Cascading Cables........................................................................................................................15-1015.3.2 GE Cascading Cables.......................................................................................................................15-1415.3.3 TDM Cascading Cables...................................................................................................................15-16

15.4 Clock Cables.............................................................................................................................................15-1715.4.1 Clock Distribution Cable..................................................................................................................15-1815.4.2 8 kHz Clock Cables..........................................................................................................................15-2015.4.3 BITS Clock Cables...........................................................................................................................15-2215.4.4 GPS Clock Cables............................................................................................................................15-25

15.5 Trunk Cables of SSM Frames...................................................................................................................15-2715.5.1 75-ohm E1 Trunk Cable...................................................................................................................15-2715.5.2 120-ohm E1 Trunk Cable.................................................................................................................15-3015.5.3 100-ohm T1 Cables..........................................................................................................................15-3415.5.4 75-ohm E3/T3 Cables.......................................................................................................................15-3515.5.5 SDH Trunk Cables...........................................................................................................................15-37

15.6 Internal Trunk Cables from SSM Frames to SIWF Frames......................................................................15-3815.7 Straight Through Cables and Crossover Cables........................................................................................15-4115.8 Optical Fibers............................................................................................................................................15-4415.9 Power Cables and PGND Cables..............................................................................................................15-46

15.9.1 Power Cables and PGND Cables for Cabinets.................................................................................15-4615.9.2 Power Cables and PGND Cables of Service Frames.......................................................................15-50

A Impedance Transfer Boxes.....................................................................................................A-1

B Board Indicators of All SSM Frames.....................................................................................B-1B.1 Indicators on the MA4L.................................................................................................................................B-3B.2 Indicators on the MASU................................................................................................................................B-3B.3 Indicators on the MBLU................................................................................................................................B-4B.4 Indicators on the MCMB...............................................................................................................................B-5B.5 Indicators on the MCMF................................................................................................................................B-6B.6 Indicators on the ME32..................................................................................................................................B-7B.7 Indicators on the ME8T.................................................................................................................................B-8B.8 Indicators on the MEAC................................................................................................................................B-9B.9 Indicators on the MECU................................................................................................................................B-9B.10 Indicators on the MESU.............................................................................................................................B-10B.11 Indicators on the MFLU.............................................................................................................................B-11B.12 Indicators on the MG1O............................................................................................................................B-12B.13 Indicators on the MHRU............................................................................................................................B-13B.14 Indicators on the MHRD............................................................................................................................B-14B.15 Indicators on the MIOE.............................................................................................................................B-14B.16 Indicators on the MMPB............................................................................................................................B-15B.17 Indicators on the MMPU...........................................................................................................................B-16B.18 Indicators on the MNET............................................................................................................................B-17B.19 Indicators on the MNLU............................................................................................................................B-19



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B.20 Indicators on the MOMB...........................................................................................................................B-20B.21 Indicators on the MOMU...........................................................................................................................B-21B.22 Indicators on the MPIE..............................................................................................................................B-21B.23 Indicators on the MPPB.............................................................................................................................B-23B.24 Indicators on the MRPU............................................................................................................................B-23B.25 Indicators on the MS1E.............................................................................................................................B-24B.26 Indicators on the MS1L.............................................................................................................................B-26B.27 Indicators on the MS2E.............................................................................................................................B-27B.28 Indicators on the MS2L.............................................................................................................................B-28B.29 Indicators on the MSPF.............................................................................................................................B-29B.30 Indicators on the MT32..............................................................................................................................B-30B.31 Indicators on the MTAC............................................................................................................................B-31B.32 Indicators on the MTCB............................................................................................................................B-32B.33 Indicators on the MTCD............................................................................................................................B-32B.34 Indicators on the MTNB............................................................................................................................B-33B.35 Indicators on the MTNC............................................................................................................................B-34B.36 Indicators on the MTNU............................................................................................................................B-36B.37 Indicators on the MTSU.............................................................................................................................B-37B.38 Indicators on the MVPB............................................................................................................................B-38B.39 Indicators on the MVPD............................................................................................................................B-38B.40 Indicators on the TCLU.............................................................................................................................B-39B.41 Indicators on the SCMU............................................................................................................................B-41

C Board DIP Switches and Jumpers of all SSM Frames.......................................................C-1C.1 DIP Switches and Jumpers of the ME32.......................................................................................................C-2C.2 DIP Switches on the MEAC..........................................................................................................................C-4C.3 DIP Switches and Jumpers of the MESU......................................................................................................C-5C.4 Jumpers on the MMPU..................................................................................................................................C-7C.5 Jumpers on the MOMU.................................................................................................................................C-7C.6 DIP Switches and Jumpers of the MT32.......................................................................................................C-7C.7 DIP Switches and Jumpers of the MTAC......................................................................................................C-9C.8 DIP Switches and Jumpers of the MTSU....................................................................................................C-10

D Boards of All SSM Frames.....................................................................................................D-1

E Subboards of all SSM Frames.................................................................................................E-1E.1 MECU Subboards...........................................................................................................................................E-2E.2 MHRU Subboards..........................................................................................................................................E-2E.3 MHRD Subboards..........................................................................................................................................E-3E.4 MASU Subboard............................................................................................................................................E-5E.5 MPIE Subboards.............................................................................................................................................E-5E.6 Subboards of the MSPF..................................................................................................................................E-5E.7 MTCB Subboards...........................................................................................................................................E-6E.8 MTCD Subboards...........................................................................................................................................E-6


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E.9 MTNC Subboards...........................................................................................................................................E-6E.10 MVPB Subboards.........................................................................................................................................E-8E.11 MVPD Subboards.......................................................................................................................................E-11



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Figures

Figure 1-1 Appearance of the N68-22 cabinet.....................................................................................................1-3Figure 1-2 Structure of the N68-22 cabinet..........................................................................................................1-4Figure 1-3 Appearance of the N68E-22 cabinet...................................................................................................1-5Figure 1-4 Structure of the N68E-22 cabinet.......................................................................................................1-6Figure 1-5 Appearance and structure of the wire bushing...................................................................................1-7Figure 1-6 Structure of the UMG8900 assembly cabinet.....................................................................................1-8Figure 1-7 Structure of the UMG8900 extended assembly cabinet.....................................................................1-9Figure 1-8 Appearance of the N800 support......................................................................................................1-10Figure 1-9 Appearance of the guide rail.............................................................................................................1-11Figure 1-10 Appearance of the horizontal pallet................................................................................................1-12Figure 1-11 Appearance of the fixing bracket....................................................................................................1-12Figure 1-12 Appearance of the side pallet..........................................................................................................1-13Figure 1-13 Appearance of the N6X support.....................................................................................................1-14Figure 1-14 Appearance of the guide rail...........................................................................................................1-15Figure 1-15 Appearance of the pallet.................................................................................................................1-15Figure 1-16 Appearance and structure of the PDF.............................................................................................1-16Figure 1-17 Structure of the PDF.......................................................................................................................1-17Figure 1-18 Front view of the PDF....................................................................................................................1-18Figure 1-19 Rear panel of the PDF....................................................................................................................1-19Figure 1-20 Front panel of the LAN Switch......................................................................................................1-21Figure 1-21 Rear panel of the DC chassis..........................................................................................................1-22Figure 1-22 Appearance and structure of the LAN Switch cable frames...........................................................1-23Figure 1-23 Appearance and structure of the cabling trough.............................................................................1-24Figure 1-24 Two holes at the bottom of the cabling trough...............................................................................1-24Figure 1-25 Appearance and structure of the side hang fiber coiler..................................................................1-25Figure 1-26 Appearance and structure of the back FMT...................................................................................1-26Figure 2-1 Appearance and structure of the SSM-256 frame...............................................................................2-3Figure 2-2 Front view of the SSM-256 frame......................................................................................................2-4Figure 2-3 Rear view of the SSM-256 frame.......................................................................................................2-4Figure 2-4 Side view of the SSM frame...............................................................................................................2-5Figure 2-5 Appearance and structure of the SSM-32 frame.................................................................................2-5Figure 2-6 Front view of the SSM-32 frame........................................................................................................2-6Figure 2-7 Rear view of the SSM-32 frame.........................................................................................................2-6

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Figure 2-8 Appearance and structure of the fan box............................................................................................2-7Figure 2-9 Front panel of the fan box...................................................................................................................2-8Figure 2-10 Rear panel of the fan box..................................................................................................................2-8Figure 2-11 Front view of the transfer box........................................................................................................ 2-10Figure 2-12 Eight-bit DIP switch on the transfer board.....................................................................................2-10Figure 2-13 Board deployment in the SSM-256 frame......................................................................................2-13Figure 2-14 Board deployment in the SSM-32 frame........................................................................................2-14Figure 2-15 Board deployment in the SSM-256 main control frame.................................................................2-15Figure 2-16 Board deployment in the SSM-32 main control frame...................................................................2-16Figure 2-17 Board deployment in the SSM-256 central switching frame..........................................................2-17Figure 2-18 Board deployment in the SSM-256 service frame..........................................................................2-18Figure 2-19 Board deployment in the SSM-32 service frame............................................................................2-19Figure 2-20 Board deployment in the SSM-256 control frame..........................................................................2-20Figure 3-1 Connections between boards and backplane buses in the SSM-256 frame......................................3-17Figure 3-2 Connections between boards and backplane buses in the SSM-32 frame........................................3-17Figure 3-3 Gateway control signal processing...................................................................................................3-18Figure 3-4 Transfer path of SS7 signaling (SSM-256 frame)............................................................................3-19Figure 3-5 Processing flow for TDM<->IP bearer service flow........................................................................3-20Figure 3-6 Processing flow of OMC signals......................................................................................................3-21Figure 4-1 Panel of the MOMU...........................................................................................................................4-3Figure 4-2 Panel of the MOMB...........................................................................................................................4-7Figure 4-3 Panel of the UG02MOMB..................................................................................................................4-8Figure 4-4 Panel of the MMPU..........................................................................................................................4-11Figure 4-5 Panel of the MMPB..........................................................................................................................4-15Figure 4-6 Panel of the UG02MMPB................................................................................................................ 4-16Figure 5-1 Panel of the UG01MNET...................................................................................................................5-3Figure 5-2 Panel of the UG02MNET...................................................................................................................5-4Figure 5-3 Panel of the MTNU.......................................................................................................................... 5-10Figure 5-4 Panel of the TCLU............................................................................................................................5-13Figure 5-5 Panel of the MTNB...........................................................................................................................5-17Figure 5-6 Panel of the MTNC (UG01MTNC5)................................................................................................5-21Figure 5-7 Panel of the UG02MTNC4...............................................................................................................5-22Figure 6-1 Panel of the MCMF............................................................................................................................6-2Figure 6-2 Panel of the MCMB............................................................................................................................6-5Figure 6-3 Panel of the SCMU.............................................................................................................................6-8Figure 6-4 Panel of the MPPB........................................................................................................................... 6-11Figure 7-1 Panel of the UG02MHRU.A..............................................................................................................7-3Figure 7-2 Panel of the UG02MHRU.C...............................................................................................................7-4Figure 7-3 Panel of the MHRD............................................................................................................................7-8Figure 7-4 Panel of the MRPU...........................................................................................................................7-14Figure 7-5 Panel of the UG02MASU.A.............................................................................................................7-17Figure 7-6 Panel of the UG02MASU.C.............................................................................................................7-18

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Figure 7-7 Panel of the MIOE............................................................................................................................7-22Figure 7-8 Panel of the MSPF............................................................................................................................7-25Figure 8-1 Panel of the MFLU.............................................................................................................................8-3Figure 8-2 Panel of the UG02MBLU_VA...........................................................................................................8-6Figure 8-3 Panel of the UG02MBLU_VC...........................................................................................................8-7Figure 8-4 Panel of the MNLU..........................................................................................................................8-11Figure 9-1 Panel of the UG01MVPB...................................................................................................................9-3Figure 9-2 Panel of the UG02MVPB...................................................................................................................9-4Figure 9-3 Position of the MVPB subboard.......................................................................................................9-10Figure 9-4 Panel of the UG01MVPD.................................................................................................................9-12Figure 9-5 Panel of the UG02MVPD.................................................................................................................9-13Figure 9-6 Position of the MVPD subboard.......................................................................................................9-19Figure 9-7 Panel of the UG01MTCB.................................................................................................................9-20Figure 9-8 Panel of the UG02MTCB.................................................................................................................9-21Figure 9-9 Panel of the MTCD...........................................................................................................................9-25Figure 9-10 Panel of the MECU.........................................................................................................................9-29Figure 10-1 Panel of the ME32..........................................................................................................................10-3Figure 10-2 Panel of the MESU.........................................................................................................................10-9Figure 10-3 Panel of the MT32........................................................................................................................10-13Figure 10-4 Panel of the MTSU.......................................................................................................................10-19Figure 10-5 Panel of the MPIE.........................................................................................................................10-23Figure 10-6 Panel of the MEAC.......................................................................................................................10-27Figure 10-7 Panel of the MTAC.......................................................................................................................10-31Figure 11-1 Panel of the MS2L..........................................................................................................................11-3Figure 11-2 Panel of the MS2E..........................................................................................................................11-7Figure 11-3 Panel of the MS1L........................................................................................................................11-11Figure 11-4 Panel of the MS1E........................................................................................................................11-15Figure 12-1 Panel of the ME8T..........................................................................................................................12-3Figure 12-2 Panel of the MG1O.A.....................................................................................................................12-6Figure 12-3 Panel of the UG02MG1O.B...........................................................................................................12-7Figure 12-4 Panel of the MA4L.......................................................................................................................12-11Figure 13-1 Panel of the MCLK.........................................................................................................................13-3Figure 13-2 Panel of the UG03MCLK_VD.......................................................................................................13-4Figure 14-1 Panel of the MLPB.........................................................................................................................14-2Figure 15-1 Appearance of the monitoring cables from the SSM frame to the fan box....................................15-4Figure 15-2 Monitoring cable from the SSM frame to the PDF and fan box....................................................15-6Figure 15-3 Alarm box RS422 serial port cables...............................................................................................15-8Figure 15-4 Alarm box RS232 serial port cables...............................................................................................15-9Figure 15-5 Common FE cascading cables......................................................................................................15-10Figure 15-6 Connections of crossover cables...................................................................................................15-11Figure 15-7 Appearance of the FE cascading network cable with two terminals at one end...........................15-12Figure 15-8 Structure of the FE cascading network cable with two terminals at one end...............................15-13

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Figure 15-9 Appearance of the GE cascading cable........................................................................................15-14Figure 15-10 Appearance of the LC/PC connector..........................................................................................15-15Figure 15-11 Appearance of the TDM cascading cable...................................................................................15-16Figure 15-12 Appearance of the LC/PC connector..........................................................................................15-16Figure 15-13 Appearance of the clock distribution cable................................................................................15-18Figure 15-14 Structure of the clock distribution cable.....................................................................................15-19Figure 15-15 Appearance of the 8 kHz clock cable.........................................................................................15-21Figure 15-16 Structure of the 8 kHz clock cable..............................................................................................15-21Figure 15-17 Appearance of the 75-ohm BITS clock cable.............................................................................15-23Figure 15-18 Structure of the 75-ohm BITS clock cable.................................................................................15-23Figure 15-19 Appearance of the 120-ohm BITS clock cable...........................................................................15-24Figure 15-20 Structure of the 120-ohm BITS clock cable...............................................................................15-25Figure 15-21 GPS clock cable..........................................................................................................................15-26Figure 15-22 Appearance of the 75-ohm E1 trunk cable.................................................................................15-28Figure 15-23 Appearance of the 120-ohm E1 trunk cable...............................................................................15-31Figure 15-24 Appearance of the E3/T3 trunk cables with two BNC connectors.............................................15-35Figure 15-25 Appearance of the E3/T3 trunk cables with one BNC connector...............................................15-36Figure 15-26 Appearance of the SDH trunk cables..........................................................................................15-37Figure 15-27 Appearance of the internal trunk cable between the SSM frame and the SIWF frame..............15-39Figure 15-28 Structure of the internal trunk cable between the SSM frame and the SIWF frame..................15-39Figure 15-29 Appearance of straight through cable.........................................................................................15-42Figure 15-30 Pin assignments of straight through cables.................................................................................15-42Figure 15-31 Appearance of crossover cable...................................................................................................15-43Figure 15-32 Pin assignments of crossover cables...........................................................................................15-43Figure 15-33 Appearance of the multi-mode optical fiber...............................................................................15-44Figure 15-34 Appearance of the single-mode optical fiber..............................................................................15-45Figure 15-35 Appearance of the LC/PC connector..........................................................................................15-45Figure 15-36 Appearance of the –48 V power cables......................................................................................15-47Figure 15-37 Appearance of the RTN power cables........................................................................................15-48Figure 15-38 Appearance of the PGND cables................................................................................................15-49Figure 15-39 Appearance of the PGND feeder cable.......................................................................................15-50Figure 15-40 Power cables from power distribution frames to SSM frames...................................................15-51Figure 15-41 Power cables from SSM frames to fan boxes.............................................................................15-51Figure 15-42 Appearance of the PGND feeder cable of SSM frame...............................................................15-52Figure A-1 Method for using the impedance transfer box..................................................................................A-1Figure A-2 Appearance of the RJ45 connector...................................................................................................A-2Figure E-1 Position of the MVPB subboard......................................................................................................E-11Figure E-2 Position of the MVPD subboard......................................................................................................E-14

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Tables

Table 1-1 Applicable height range of each support type....................................................................................1-10Table 1-2 Applicable height range of each type of the support..........................................................................1-14Table 1-3 Indicator meaning of the PDF............................................................................................................1-18Table 1-4 Interfaces on the PDF panel...............................................................................................................1-19Table 1-5 Technical specifications of the PDF..................................................................................................1-20Table 1-6 Meaning of indicators on the Ethernet interface................................................................................1-21Table 1-7 Technical specifications of the LAN Switch......................................................................................1-22Table 1-8 Technical specifications of the cabling trough...................................................................................1-25Table 1-9 Technical specifications of the N68-22 cabinet.................................................................................1-26Table 1-10 Technical specifications of the N68E-22 cabinet.............................................................................1-27Table 1-11 General environmental specifications..............................................................................................1-29Table 1-12 Air cleanness specifications.............................................................................................................1-30Table 1-13 Anti-vibration specifications for device running.............................................................................1-31Table 1-14 Anti-vibration specifications for device delivery.............................................................................1-32Table 2-1 DIP switch settings on the monitoring board of the fan frame............................................................2-9Table 2-2 Technical specifications of the fan box................................................................................................2-9Table 2-3 Relationship between frame IDs and DIP switch settings in the SSM-256 frame.............................2-11Table 2-4 Fixed board positions in the SSM-256 main control frame...............................................................2-15Table 2-5 Fixed board positions in an SSM-32 main control frame..................................................................2-16Table 2-6 Fixed board positions in the central switching frame........................................................................2-17Table 2-7 Fixed board positions in the SSM-256 service frame........................................................................2-18Table 2-8 Fixed board positions in the SSM-32 service frame..........................................................................2-19Table 2-9 Fixed board positions in the control frame........................................................................................2-20Table 2-10 Technical specifications of the SSM frame......................................................................................2-21Table 3-1 Equipment and resource management units.........................................................................................3-3Table 3-2 Service and protocol processing units..................................................................................................3-5Table 3-3 Switching and cascading units.............................................................................................................3-7Table 3-4 Interface units.....................................................................................................................................3-10Table 3-5 Media resource processing units........................................................................................................3-12Table 3-6 Clock units.........................................................................................................................................3-14Table 3-7 Lightning protection units..................................................................................................................3-14Table 3-8 Limitation on front and back boards..................................................................................................3-14Table 3-9 Limitation on opposite positions........................................................................................................3-15

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Table 3-10 Limitation on fixed positions...........................................................................................................3-15Table 3-11 Matching limitation of boards..........................................................................................................3-16Table 4-1 Indicator meaning of the MOMU........................................................................................................4-4Table 4-2 Interfaces on the MOMU.....................................................................................................................4-5Table 4-3 Jumper description of the MOMU.......................................................................................................4-5Table 4-4 Fuses on the MOMU............................................................................................................................4-5Table 4-5 Technical specifications of the MOMU...............................................................................................4-6Table 4-6 Indicator meaning of the MOMB.........................................................................................................4-9Table 4-7 Interfaces on the MOMB.....................................................................................................................4-9Table 4-8 Fuses on the MOMB..........................................................................................................................4-10Table 4-9 Technical specifications of the MOMB.............................................................................................4-10Table 4-10 Technical specifications of the UG02MOMB.................................................................................4-10Table 4-11 Indicator meaning of the MMPU.....................................................................................................4-12Table 4-12 Interfaces on the MMPU..................................................................................................................4-12Table 4-13 Jumper description of the MMPU....................................................................................................4-13Table 4-14 Fuses on the MMPU.........................................................................................................................4-13Table 4-15 Technical specifications of the MMPU............................................................................................4-13Table 4-16 Indicator meaning of the MMPB.....................................................................................................4-16Table 4-17 Interfaces on the MMPB..................................................................................................................4-17Table 4-18 Fuses on the MMPB.........................................................................................................................4-17Table 4-19 Technical specifications of the MMPB............................................................................................4-18Table 4-20 Technical specifications of the UG02MMPB..................................................................................4-18Table 5-1 Indicator meaning of the MNET..........................................................................................................5-4Table 5-2 Indicator meaning of clock interfaces on the MNET...........................................................................5-6Table 5-3 Interfaces on the MNET.......................................................................................................................5-6Table 5-4 Fuses on the MNET.............................................................................................................................5-8Table 5-5 Technical specifications of the MNET.................................................................................................5-8Table 5-6 Indicator meaning of the MTNU........................................................................................................5-10Table 5-7 Interfaces on the MTNU....................................................................................................................5-12Table 5-8 Fuses on the MTNU...........................................................................................................................5-12Table 5-9 Technical specifications of the MTNU..............................................................................................5-12Table 5-10 Indicator meaning of the TCLU.......................................................................................................5-14Table 5-11 Interfaces on the TCLU....................................................................................................................5-15Table 5-12 Fuses on the TCLU..........................................................................................................................5-15Table 5-13 Technical specifications of the TCLU.............................................................................................5-16Table 5-14 Indicator meaning of the MTNB......................................................................................................5-17Table 5-15 Interfaces on the MTNB...................................................................................................................5-19Table 5-16 Fuses on the MTNB.........................................................................................................................5-19Table 5-17 Technical specifications of the MTNB............................................................................................5-19Table 5-18 Indicator meaning of the MTNC......................................................................................................5-22Table 5-19 Interfaces on the MTNC...................................................................................................................5-24Table 5-20 Fuses on the MTNC.........................................................................................................................5-24

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Table 5-21 Technical specifications of the UG01MTNC...................................................................................5-25Table 5-22 Technical specifications of the UG02MTNC...................................................................................5-25Table 5-23 Indicator meaning of the TLDA/TLDB...........................................................................................5-26Table 5-24 Technical specifications of the TLDA/TLDB subboards................................................................ 5-26Table 5-25 Power consumption of the TS1C/TS2C/TS4C subboards...............................................................5-27Table 6-1 Indicator meaning of the MCMF.........................................................................................................6-3Table 6-2 Interfaces on the MCMF......................................................................................................................6-4Table 6-3 Fuses on the MCMF.............................................................................................................................6-4Table 6-4 Technical specifications of the MCMF................................................................................................6-4Table 6-5 Indicator meaning of the MCMB.........................................................................................................6-6Table 6-6 Interfaces on the MCMB......................................................................................................................6-6Table 6-7 Fuses on the MCMB............................................................................................................................6-7Table 6-8 Technical specifications of the MCMB...............................................................................................6-7Table 6-9 Indicator meaning of the SCMU..........................................................................................................6-8Table 6-10 Interfaces on the SCMU.....................................................................................................................6-9Table 6-11 Technical specifications of the SCMU............................................................................................ 6-10Table 6-12 Indicator meaning of the MPPB.......................................................................................................6-11Table 6-13 Interfaces on the MPPB................................................................................................................... 6-12Table 6-14 Fuses on the MPPB..........................................................................................................................6-12Table 6-15 Technical specifications of the MPPB.............................................................................................6-13Table 7-1 Indicator meaning of the MHRU.........................................................................................................7-4Table 7-2 Interface on the MHRU........................................................................................................................7-5Table 7-3 Fuses on the UG02MHRU.A...............................................................................................................7-5Table 7-4 Fuses on the UG02MHRU.C...............................................................................................................7-6Table 7-5 Technical specifications of the MHRU................................................................................................7-6Table 7-6 Indicator meaning of the MHRD.........................................................................................................7-8Table 7-7 Interfaces on the MHRD......................................................................................................................7-9Table 7-8 Fuses on the MHRD.............................................................................................................................7-9Table 7-9 Technical specifications of the MHRD..............................................................................................7-10Table 7-10 Service processing capability of the MHRD....................................................................................7-10Table 7-11 Indicator meaning of the D1GO.......................................................................................................7-11Table 7-12 Technical specifications of the D1GO.............................................................................................7-11Table 7-13 Indicator meaning of the D8FT........................................................................................................7-12Table 7-14 Technical specifications of the D8FT..............................................................................................7-12Table 7-15 Indicator meaning of the MRPU......................................................................................................7-14Table 7-16 Interfaces on the MRPU...................................................................................................................7-15Table 7-17 Fuses on the MRPU......................................................................................................................... 7-15Table 7-18 Technical specifications of the MRPU............................................................................................ 7-16Table 7-19 Indicator meaning of the MASU......................................................................................................7-18Table 7-20 Interfaces on the MASU...................................................................................................................7-19Table 7-21 Fuses on the UG02MASU.A............................................................................................................7-19Table 7-22 Fuses on the UG02MASU.C............................................................................................................7-20



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Table 7-23 Technical specifications of the MASU............................................................................................7-20Table 7-24 Indicator meaning of the MIOE.......................................................................................................7-22Table 7-25 Interfaces on the MIOE....................................................................................................................7-23Table 7-26 Fuses on the MIOE...........................................................................................................................7-24Table 7-27 Technical specifications of the MIOE..............................................................................................7-24Table 7-28 Indicator meaning of the MSPF.......................................................................................................7-26Table 7-29 Interface on the MSPF.....................................................................................................................7-26Table 7-30 Fuses on the MSPF...........................................................................................................................7-26Table 7-31 Technical specifications of the MSPF..............................................................................................7-27Table 7-32 Technical specifications of the SHPU subboard..............................................................................7-27Table 8-1 Indicator meaning of the MFLU..........................................................................................................8-3Table 8-2 Fuses on the MFLU..............................................................................................................................8-4Table 8-3 Technical specifications of the MFLU.................................................................................................8-5Table 8-4 Indicator meaning of the MBLU..........................................................................................................8-7Table 8-5 Interfaces on the MBLU.......................................................................................................................8-9Table 8-6 Fuses on the MBLU.............................................................................................................................8-9Table 8-7 Technical specifications of the MBLU..............................................................................................8-10Table 8-8 Indicator meaning of the MNLU........................................................................................................8-12Table 8-9 Interfaces on the MNLU....................................................................................................................8-13Table 8-10 Fuses on the MNLU.........................................................................................................................8-13Table 8-11 Technical specifications of the MNLU............................................................................................8-13Table 9-1 Indicator meaning of the MVPB..........................................................................................................9-4Table 9-2 Interfaces on the MVPB.......................................................................................................................9-5Table 9-3 Fuses on the MVPB.............................................................................................................................9-6Table 9-4 Power consumption and heat dissipation of theMVPB........................................................................9-6Table 9-5 Service processing capability of the MVPB........................................................................................9-6Table 9-6 Technical specifications of the MVDB subboard................................................................................9-7Table 9-7 Technical specifications of the MECC/MECE/MECF/MECG/MECH/MECI/MECJ/MECK subboards...............................................................................................................................................................................9-8Table 9-8 Technical specifications of the UG01MECL subboard.......................................................................9-9Table 9-9 Technical specifications of the MVDD subboard................................................................................9-9Table 9-10 Indicator meaning of the MVPD......................................................................................................9-13Table 9-11 Interfaces on the MVPD...................................................................................................................9-14Table 9-12 Fuses on the MVPD.........................................................................................................................9-15Table 9-13 Power consumption and heat dissipation of the MVPD..................................................................9-15Table 9-14 Technical specifications of the MVPD............................................................................................9-15Table 9-15 Technical specifications of the MVQE subboard............................................................................9-17Table 9-16 Technical specifications of the MVDD subboard............................................................................9-17Table 9-17 Technical specifications of the UG01MVDF subboard...................................................................9-18Table 9-18 Technical specifications of the UG01MECL subboard...................................................................9-18Table 9-19 Indicator meaning of the MTCB......................................................................................................9-21Table 9-20 Interfaces on the MTCB...................................................................................................................9-22Table 9-21 Fuses on the MTCB.........................................................................................................................9-23


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Table 9-22 Power consumption and heat dissipation of the MTCB...................................................................9-23Table 9-23 Service processing capability of the MTCB.................................................................................... 9-23Table 9-24 Indicator meaning of the MTCD......................................................................................................9-25Table 9-25 Interfaces of the MTCD...................................................................................................................9-26Table 9-26 Fuses on the MTCD.........................................................................................................................9-27Table 9-27 Technical specifications of the MTCD............................................................................................9-27Table 9-28 Indicator meaning of the MECU......................................................................................................9-29Table 9-29 Interface on the MECU....................................................................................................................9-30Table 9-30 Fuses on the MECU.........................................................................................................................9-30Table 9-31 Technical specifications of the UG01MECU...................................................................................9-31Table 9-32 Technical specifications of the UG02MECU...................................................................................9-31Table 9-33 Technical specifications of the MECC/MECF/MECG/MECJ/MECK subboards...........................9-32Table 10-1 Indicator meaning of the ME32....................................................................................................... 10-3Table 10-2 Interfaces on the ME32....................................................................................................................10-4Table 10-3 DIP switches of the UG01ME32......................................................................................................10-5Table 10-4 Setting DIP switches of the UG01ME32 (75-ohm E1 coaxial cable)..............................................10-5Table 10-5 Setting DIP switches of the UG01ME32 (120-ohm E1 twisted pair)..............................................10-5Table 10-6 DIP switches of the UG02ME32......................................................................................................10-6Table 10-7 Setting DIP switches of the UG02ME32 (75-ohm E1 coaxial cable)..............................................10-6Table 10-8 Setting DIP switches of the UG02ME32 (120-ohm E1 twisted pair)..............................................10-7Table 10-9 Fuses on the ME32...........................................................................................................................10-7Table 10-10 Fuses on the ME32.........................................................................................................................10-7Table 10-11 Technical specifications of the ME32............................................................................................10-7Table 10-12 Indicator meaning of the MESU....................................................................................................10-9Table 10-13 Interfaces on the MESU...............................................................................................................10-10Table 10-14 DIP switches of the MESU..........................................................................................................10-11Table 10-15 Setting DIP switches of the MESU (75-ohm E1 coaxial cable)..................................................10-11Table 10-16 Setting DIP switches of the MESU (120-ohm E1 twisted pair)...................................................10-11Table 10-17 Fuses on the MESU......................................................................................................................10-12Table 10-18 Technical specifications of the MESU.........................................................................................10-12Table 10-19 Indicator meaning of the MT32...................................................................................................10-14Table 10-20 Interfaces on the MT32................................................................................................................10-14Table 10-21 DIP switches of the UG01MT32..................................................................................................10-15Table 10-22 Setting DIP switches of the UG01MT32 (100-ohm T1 cable)....................................................10-16Table 10-23 DIP switches of the UG02MT32..................................................................................................10-16Table 10-24 Setting DIP switches of the UG02MT32 (100-ohm T1 cable)....................................................10-16Table 10-25 Fuses on the UG01MT32.............................................................................................................10-17Table 10-26 Fuses on the MT32.......................................................................................................................10-17Table 10-27 Technical specifications of the MT32..........................................................................................10-17Table 10-28 Indicator meaning of the MTSU..................................................................................................10-19Table 10-29 Interfaces on the MTSU...............................................................................................................10-20Table 10-30 DIP switches of the MTSU..........................................................................................................10-20



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Table 10-31 Setting DIP switches of the MTSU (100-ohm T1 cable).............................................................10-21Table 10-32 Fuses on the MTSU......................................................................................................................10-21Table 10-33 Technical specifications of the MTSU.........................................................................................10-22Table 10-34 Indicator meaning of the MPIE....................................................................................................10-23Table 10-35 Interfaces on the MPIE.................................................................................................................10-25Table 10-36 Fuses on the MPIE.......................................................................................................................10-25Table 10-37 Technical specifications of the MPIE..........................................................................................10-25Table 10-38 Technical specifications of the ME3A subboard.........................................................................10-26Table 10-39 Indicator meaning of the MEAC..................................................................................................10-27Table 10-40 Interfaces on the MEAC...............................................................................................................10-28Table 10-41 DIP switches of the MEAC..........................................................................................................10-28Table 10-42 Setting DIP switches of the MEAC (75-ohm E1 coaxial cable)..................................................10-29Table 10-43 Setting DIP switches of the MEAC (120-ohm E1 twisted pair)..................................................10-29Table 10-44 Fuses on the MEAC.....................................................................................................................10-30Table 10-45 Technical specifications of the MEAC........................................................................................10-30Table 10-46 Indicator meaning of the MTAC..................................................................................................10-32Table 10-47 Interfaces on the MTAC...............................................................................................................10-33Table 10-48 DIP switches of the MTAC..........................................................................................................10-33Table 10-49 Setting DIP switches of the MTAC (100-ohm T1 cable)............................................................10-34Table 10-50 Fuses on the MTAC.....................................................................................................................10-34Table 10-51 Technical specifications of the MTAC........................................................................................10-34Table 11-1 Indicator meaning of the MS2L.......................................................................................................11-3Table 11-2 Interfaces on the MS2L....................................................................................................................11-5Table 11-3 Fuses on the MS2L...........................................................................................................................11-5Table 11-4 Technical specifications of the MS2L..............................................................................................11-5Table 11-5 Power consumption and heat dissipation of the UG01MS2L..........................................................11-6Table 11-6 Power consumption and heat dissipation of the UG02MS2L..........................................................11-6Table 11-7 Indicator meaning of the MS2E.......................................................................................................11-8Table 11-8 Interfaces on the MS2E....................................................................................................................11-9Table 11-9 Fuses on the MS2E...........................................................................................................................11-9Table 11-10 Technical specifications of the MS2E............................................................................................11-9Table 11-11 Power consumption and heat dissipation of the UG01MS2E......................................................11-10Table 11-12 Power consumption and heat dissipation of the UG02MS2E......................................................11-10Table 11-13 Indicator meaning of the MS1L...................................................................................................11-12Table 11-14 Interfaces on the MS1L................................................................................................................11-13Table 11-15 Fuses on the MS1L.......................................................................................................................11-13Table 11-16 Technical specifications of the MS1L..........................................................................................11-14Table 11-17 Indicator meaning of the MS1E...................................................................................................11-16Table 11-18 Interfaces on the MS1E................................................................................................................11-17Table 11-19 Fuses on the MS1E.......................................................................................................................11-17Table 11-20 Technical specifications of the MS1E..........................................................................................11-17Table 12-1 Indicator meaning of the ME8T.......................................................................................................12-3


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Table 12-2 Interface on the ME8T.....................................................................................................................12-4Table 12-3 Fuses on the ME8T..........................................................................................................................12-4Table 12-4 Technical specifications of the ME8T.............................................................................................12-5Table 12-5 Indicator meaning of the MG1O......................................................................................................12-7Table 12-6 Interface on the MG1O....................................................................................................................12-8Table 12-7 Fuses on the MG1O.A......................................................................................................................12-9Table 12-8 Fuses on the MG1O.B......................................................................................................................12-9Table 12-9 Technical specifications of the MG1O.............................................................................................12-9Table 12-10 Indicator meaning of the MA4L..................................................................................................12-12Table 12-11 Interfaces on the MA4L...............................................................................................................12-13Table 12-12 Fuses on the MA4L......................................................................................................................12-13Table 12-13 Technical specifications of the MA4L.........................................................................................12-13Table 13-1 Indicator meaning of the MCLK......................................................................................................13-4Table 13-2 Interfaces on the MCLK...................................................................................................................13-5Table 13-3 Fuses on the MCLK.........................................................................................................................13-6Table 13-4 Technical specifications of the MCLK............................................................................................13-7Table 14-1 Interfaces on the MLPB...................................................................................................................14-3Table 14-2 Technical specifications of the MLPB.............................................................................................14-3Table 15-1 Connections of monitoring cables from the SSM frame to the fan box...........................................15-4Table 15-2 Pin assignment of monitoring cables from the SSM frame to the fan box......................................15-4Table 15-3 Technical specifications of the monitoring cables from the SSM frame to the fan box..................15-5Table 15-4 Connections of monitoring cables from the SSM frame to the PDF and fan box...........................15-5Table 15-5 Pin assignment of monitoring cables from the SSM frame to the PDF and fan box (1) ................15-6Table 15-6 Pin assignment of monitoring cables from the SSM frame to the PDF and fan box (2).................15-6Table 15-7 Technical specifications of the monitoring cables from the SSM frame to the fan box..................15-7Table 15-8 Connections of alarm box RS422 serial port cables........................................................................15-7Table 15-9 Pin assignment of alarm box RS422 serial port cables....................................................................15-8Table 15-10 Technical specifications of the alarm box RS422 serial port cable...............................................15-8Table 15-11 Connections of alarm box RS232 serial port cables......................................................................15-9Table 15-12 Pin assignment of alarm box RS232 serial port cables..................................................................15-9Table 15-13 Technical specifications of the alarm box RS232 serial port cables..............................................15-9Table 15-14 Technical specifications of the FE cascading network cable.......................................................15-11Table 15-15 Connections of the FE cascading network cables with two terminals at one end........................15-11Table 15-16 Pin assignment of the FE cascading network cable with two terminals at one end.....................15-13Table 15-17 Technical specifications of the FE cascading network cable with two terminals at one end......15-13Table 15-18 Technical specifications of the GE cascading cable....................................................................15-15Table 15-19 Technical specifications of the TDM cascading cable.................................................................15-17Table 15-20 Pin assignments of the clock distribution cable...........................................................................15-19Table 15-21 Technical specifications of the clock distribution cable..............................................................15-20Table 15-22 Connections of the 8 kHz clock cable..........................................................................................15-21Table 15-23 Pin assignment of the 8 kHz clock cable (1)................................................................................15-22Table 15-24 Pin assignment of the 8 kHz clock cable (2)................................................................................15-22



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Table 15-25 Technical specifications of the 8 kHz clock cable.......................................................................15-22Table 15-26 Connections of the BITS clock cable...........................................................................................15-23Table 15-27 Technical specifications of the 75-ohm BITS clock cable...........................................................15-24Table 15-28 Technical specifications of the 120-ohm BITS clock cable.........................................................15-25Table 15-29 Connections of the GPS clock cable............................................................................................15-25Table 15-30 Technical specifications of the GPS clock cable......................................................................... 15-26Table 15-31 Pin assignments of the 75-ohm E1 trunk cable............................................................................15-29Table 15-32 Technical specifications of the 75-ohm E1 trunk cable...............................................................15-30Table 15-33 Pin assignments of the new 120-ohm E1 trunk cable .................................................................15-32Table 15-34 Pin assignments of the old 120-ohm E1 trunk cable ...................................................................15-33Table 15-35 Technical specifications of the 120-ohm E1 trunk cable.............................................................15-34Table 15-36 Connections of 75-ohm E3/T3 trunk cables.................................................................................15-36Table 15-37 Technical specifications of the E3/T3 trunk cable with two BNC connectors............................ 15-36Table 15-38 Technical specifications of the E3/T3 trunk cable with one BNC connector..............................15-37Table 15-39 Connections of SDH trunk cables................................................................................................15-37Table 15-40 Technical specifications of the SDH trunk cable.........................................................................15-38Table 15-41 Connections of the internal trunk cable between the SSM frame and the SIWF frame.............. 15-38Table 15-42 pin assignment of the DB100PIN connector of the internal trunk cable between the SSM frame andthe SIWF frame.................................................................................................................................................15-40Table 15-43 Technical specifications of the internal trunk cable between the SSM frame and the SIWF frame...........................................................................................................................................................................15-41Table 15-44 Technical specifications of the straight through cable.................................................................15-42Table 15-45 Technical specifications of the crossover cable...........................................................................15-43Table 15-46 Technical specifications of the external optical fiber...................................................................15-45Table 15-47 Technical specifications of –48 V power cables..........................................................................15-47Table 15-48 Technical specifications of RTN power cables............................................................................15-48Table 15-49 Technical specifications of PGND cables....................................................................................15-49Table 15-50 Technical specifications of the PGND feeder cable.....................................................................15-50Table 15-51 Technical specifications of the PGND feeder cable of SSM frame.............................................15-52Table A-1 Pin assignment of the RJ45 connector of the 120-ohm twisted pair..................................................A-2Table B-1 Indicator meaning of the MA4L.........................................................................................................B-3Table B-2 Indicator meaning of the MASU........................................................................................................B-4Table B-3 Indicator meaning of the MBLU........................................................................................................B-4Table B-4 Indicator meaning of the MCMB........................................................................................................B-6Table B-5 Indicator meaning of the MCMF........................................................................................................B-6Table B-6 Indicator meaning of the ME32..........................................................................................................B-7Table B-7 Indicator meaning of the ME8T..........................................................................................................B-8Table B-8 Indicator meaning of the MEAC........................................................................................................B-9Table B-9 Indicator meaning of the MECU......................................................................................................B-10Table B-10 Indicator meaning of the MESU.....................................................................................................B-10Table B-11 Indicator meaning of the MFLU.....................................................................................................B-11Table B-12 Indicator meaning of the MG1O.....................................................................................................B-12Table B-13 Indicator meaning of the MHRU....................................................................................................B-13


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Table B-14 Indicator meaning of the MHRD....................................................................................................B-14Table B-15 Indicator meaning of the MIOE......................................................................................................B-15Table B-16 Indicator meaning of the MMPB....................................................................................................B-16Table B-17 Indicator meaning of the MMPU....................................................................................................B-16Table B-18 Indicator meaning of the MNET.....................................................................................................B-17Table B-19 Indicator meaning of clock interfaces on the MNET......................................................................B-18Table B-20 Indicator meaning of the MNLU....................................................................................................B-19Table B-21 Indicator meaning of the MOMB...................................................................................................B-20Table B-22 Indicator meaning of the MOMU...................................................................................................B-21Table B-23 Indicator meaning of the MPIE......................................................................................................B-22Table B-24 Indicator meaning of the MPPB.....................................................................................................B-23Table B-25 Indicator meaning of the MRPU.....................................................................................................B-24Table B-26 Indicator meaning of the MS1E......................................................................................................B-24Table B-27 Indicator meaning of the MS1L......................................................................................................B-26Table B-28 Indicator meaning of the MS2E......................................................................................................B-27Table B-29 Indicator meaning of the MS2L......................................................................................................B-28Table B-30 Indicator meaning of the MSPF......................................................................................................B-30Table B-31 Indicator meaning of the MT32......................................................................................................B-30Table B-32 Indicator meaning of the MTAC....................................................................................................B-31Table B-33 Indicator meaning of the MTCB.....................................................................................................B-32Table B-34 Indicator meaning of the MTCD....................................................................................................B-33Table B-35 Indicator meaning of the MTNB....................................................................................................B-33Table B-36 Indicator meaning of the MTNC....................................................................................................B-35Table B-37 Indicator meaning of the MTNU....................................................................................................B-36Table B-38 Indicator meaning of the MTSU.....................................................................................................B-37Table B-39 Indicator meaning of the MVPB.....................................................................................................B-38Table B-40 Indicator meaning of the MVPD....................................................................................................B-39Table B-41 Indicator meaning of the TCLU......................................................................................................B-40Table B-42 Indicator meaning of the SCMU.....................................................................................................B-41Table C-1 DIP switches of the UG01ME32........................................................................................................C-2Table C-2 Setting DIP switches of the UG01ME32 (75-ohm E1 coaxial cable)................................................C-3Table C-3 Setting DIP switches of the UG01ME32 (120-ohm E1 twisted pair)................................................C-3Table C-4 DIP switches of the UG02ME32........................................................................................................C-3Table C-5 Setting DIP switches of the UG02ME32 (75-ohm E1 coaxial cable)................................................C-4Table C-6 Setting DIP switches of the UG02ME32 (120-ohm E1 twisted pair)................................................C-4Table C-7 DIP switches of the MEAC................................................................................................................C-4Table C-8 Setting DIP switches of the MEAC (75-ohm E1 coaxial cable)........................................................C-5Table C-9 Setting DIP switches of the MEAC (120-ohm E1 twisted pair).........................................................C-5Table C-10 DIP switches of the MESU...............................................................................................................C-6Table C-11 Setting DIP switches of the MESU (75-ohm E1 coaxial cable).......................................................C-6Table C-12 Setting DIP switches of the MESU (120-ohm E1 twisted pair).......................................................C-6Table C-13 Jumper description of the MMPU....................................................................................................C-7



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Table C-14 Jumper description of the MOMU....................................................................................................C-7Table C-15 DIP switches of the UG01MT32......................................................................................................C-7Table C-16 Setting DIP switches of the UG01MT32 (100-ohm T1 cable).........................................................C-8Table C-17 DIP switches of the UG02MT32......................................................................................................C-8Table C-18 Setting DIP switches of the UG02MT32 (100-ohm T1 cable).........................................................C-9Table C-19 DIP switches of the MTAC..............................................................................................................C-9Table C-20 Setting DIP switches of the MTAC (100-ohm T1 cable)...............................................................C-10Table C-21 DIP switches of the MTSU.............................................................................................................C-10Table C-22 Setting DIP switches of the MTSU (100-ohm T1 cable)...............................................................C-11Table D-1 Equipment and resource management units.......................................................................................D-1Table D-2 Service and protocol processing units................................................................................................D-3Table D-3 Switching and cascading units...........................................................................................................D-5Table D-4 Interface units.....................................................................................................................................D-7Table D-5 Media resource processing units......................................................................................................D-10Table D-6 Clock units........................................................................................................................................D-11Table D-7 Lightning protection units................................................................................................................D-12Table E-1 Technical specifications of the MECC/MECF/MECG/MECJ/MECK subboards.............................E-2Table E-2 Indicator meaning of the D1GO..........................................................................................................E-3Table E-3 Technical specifications of the D1GO................................................................................................E-3Table E-4 Indicator meaning of the D8FT...........................................................................................................E-4Table E-5 Technical specifications of the D8FT.................................................................................................E-4Table E-6 Technical specifications of the ME3A subboard................................................................................E-5Table E-7 Technical specifications of the SHPU subboard.................................................................................E-6Table E-8 Indicator meaning of the TLDA/TLDB..............................................................................................E-7Table E-9 Technical specifications of the TLDA/TLDB subboards...................................................................E-7Table E-10 Power consumption of the TS1C/TS2C/TS4C subboards................................................................E-8Table E-11 Technical specifications of the MVDB subboard.............................................................................E-8Table E-12 Technical specifications of the MECC/MECE/MECF/MECG/MECH/MECI/MECJ/MECK subboards..............................................................................................................................................................................E-9Table E-13 Technical specifications of the UG01MECL subboard..................................................................E-10Table E-14 Technical specifications of the MVDD subboard...........................................................................E-10Table E-15 Technical specifications of the MVQE subboard...........................................................................E-11Table E-16 Technical specifications of the MVDD subboard...........................................................................E-12Table E-17 Technical specifications of the UG01MVDF subboard..................................................................E-12Table E-18 Technical specifications of the UG01MECL subboard..................................................................E-13


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About This Document

PurposeThis document describes hardware components of the Universal Media Gateway (UMG8900),including cabinets, frames, boards, cables.

This document provides general guide for equipment installation and routine operation.

Related VersionsThe following table lists the product versions related to this document.

Product Name Version

HUAWEI UMG8900 V200R007

Intended AudienceThe intended audiences of this document are:

l Network administrator

l System engineer

l Installation technician

l Operation and maintenance engineer

Update HistoryUpdates between document versions are cumulative. Therefore, the latest document versioncontains all updates made to previous versions.

Updates in Issue 05 (2009-01-09)

Fourth commercial release.


Third commercial release. The updated contents are as follows.

The MCLK is added as the fixed board in the SSM -32 main control frame. The MMPB is deletedfrom the fixed boards in the SSM-32 service frames. Cable description is optimized.


HUAWEI UMG8900Hardware Description About This Document


1

Second commercial release. The updated contents are as follows.

The description of the EMU is added. The technical specifications of the cabinet and frame aremodified.


Initial commercial release. The updated contents are as follows.

The description of the new features is added.


Initial field trial release

OrganizationThis document describes hardware components of the Universal Media Gateway (UMG8900),including cabinets, frames, boards, cables.

1 Cabinets

This describes the cabinets and accessories of the UMG8900.

2 Frames

This describes the service switching module (SSM) frames, fan boxes, transfer boxes, framebackplanes, board positions, and logic types of frames.

3 Boards

This describes the board types, matching limitation, connection between boards, and universalfeatures of the boards.

4 Equipment Management and Maintenance Units

The equipment management and maintenance units consist of MOMU, MOMB, MMPU, andMMPB.

5 IP and TDM Switching Units

The IP and TDM switching units consist of MNET, MTNU, TCLU, MTNB, and MTNC.

6 Resource and Management Units

The resource and management units consist of MCMF, MCMB, and MPPB.

7 Service and Protocol Processing Units

The service and protocol processing units consist of MHRU, MRPU, MASU, MIOE, andMSPF.

8 Cascading Units

The cascading units consist of MFLU, MBLU, and MNLU.

9 Media Resource Processing Units

The media resource processing units consist of MVPB, MVPD, MTCB, MTCD, MECU.

10 E1/T1 and E3/T3 Interface Units

About This DocumentHUAWEI UMG8900Hardware Description

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The E1/T1 and E3/T3 interface units consist of ME32, MESU, MT32, MTSU, MPIE, MEAC,MTAC.

11 SDH Interface Units

The SDH interface units consist of MS2L, MS2E, MS1L, and MS1E.

12 Packet Interface Units

The packet interface units consist of ME8T, MG1O, MA4L, MP4L, and MP1H.

13 Clock Units

This describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MCLK.

14 Lightning Protection Units

This describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MLPB.

15 Cables

This describes the appearance and structure, signals, and technical specifications of cables ofthe UMG8900.

A Impedance Transfer Boxes

B Board Indicators of All SSM Frames

C Board DIP Switches and Jumpers of all SSM Frames

D Boards of All SSM Frames

E Subboards of all SSM Frames

ConventionsSymbol Conventions

The symbols that may be found in this document are defined as follows.

Symbol Description

Indicates a hazard with a high level of risk, which if notavoided,will result in death or serious injury.

Indicates a hazard with a medium or low level of risk, whichif not avoided, could result in minor or moderate injury.

Indicates a potentially hazardous situation, which if notavoided,could result in equipment damage, data loss,performance degradation, or unexpected results.



3

Symbol Description

Indicates a tip that may help you solve a problem or savetime.

Provides additional information to emphasize or supplementimportant points of the main text.

General Conventions

The general conventions that may be found in this document are defined as follows.

Convention Description

Times New Roman Normal paragraphs are in Times New Roman.

Boldface Names of files, directories, folders, and users are inboldface. For example, log in as user root.

Italic Book titles are in italics.

Courier New Examples of information displayed on the screen are inCourier New.

Command Conventions

The command conventions that may be found in this document are defined as follows.


Boldface The keywords of a command line are in boldface.

Italic Command arguments are in italics.

[ ] Items (keywords or arguments) in brackets [ ] are optional.

{ x | y | ... } Optional items are grouped in braces and separated byvertical bars. One item is selected.

[ x | y | ... ] Optional items are grouped in brackets and separated byvertical bars. One item is selected or no item is selected.

{ x | y | ... }* Optional items are grouped in braces and separated byvertical bars. A minimum of one item or a maximum of allitems can be selected.

[ x | y | ... ]* Optional items are grouped in brackets and separated byvertical bars. Several items or no item can be selected.

GUI Conventions

The GUI conventions that may be found in this document are defined as follows.

About This DocumentHUAWEI UMG8900Hardware Description

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Boldface Buttons, menus, parameters, tabs, window, and dialog titlesare in boldface. For example, click OK.

> Multi-level menus are in boldface and separated by the ">"signs. For example, choose File > Create > Folder .

Keyboard Operations

The keyboard operations that may be found in this document are defined as follows.

Format Description

Key Press the key. For example, press Enter and press Tab.

Key 1+Key 2 Press the keys concurrently. For example, pressing Ctrl+Alt+A means the three keys should be pressed concurrently.

Key 1, Key 2 Press the keys in turn. For example, pressing Alt, A meansthe two keys should be pressed in turn.

Mouse Operations

The mouse operations that may be found in this document are defined as follows.

Action Description

Click Select and release the primary mouse button without movingthe pointer.

Double-click Press the primary mouse button twice continuously andquickly without moving the pointer.

Drag Press and hold the primary mouse button and move thepointer to a certain position.



5

1 Cabinets

About This Chapter

This describes the cabinets and accessories of the UMG8900.

The UMG8900 can be installed in the N68-22 cabinet or the N68E-22 cabinet. The N68E-22cabinet is the enhanced N68-22 cabinet. The N68E-22 cabinet is light to move and easy to install.

The UMG8900 supports two configurations of cabinet. One is the assembly cabinet in whichonly the SSM frames can be configured. Up to three frames can be configured in theUMG8900 assembly cabinet. The other one is the extended assembly cabinet. It is used whenshared interworking function (SIWF) devices are applied.

1.1 N68-22/N68E-22 CabinetThis describes the structure and mechanical parameters of the cabinet, as well as configurationsof internal components, configuration description, N800 supports, N6X supports, andaccessories when the cabinets are used as UMG8900 assembly cabinet and UMG8900 extendedassembly cabinet.

1.2 Auxiliary DevicesThe UMG8900 is managed and maintained through the local maintenance terminal (LMT) andrealizes the alarm function through the auxiliary alarm box. In addition, the UMG8900 monitorsthe environmental parameters through the environment monitoring unit.

1.3 Environmental SpecificationsThis describes the environmental specifications of the cabinets.

HUAWEI UMG8900Hardware Description 1 Cabinets


1-1

1.1 N68-22/N68E-22 CabinetThis describes the structure and mechanical parameters of the cabinet, as well as configurationsof internal components, configuration description, N800 supports, N6X supports, andaccessories when the cabinets are used as UMG8900 assembly cabinet and UMG8900 extendedassembly cabinet.

The UMG8900 integrated equipment adopts N68-22 cabinet or N68E-22 cabinet. The powerdistribution frame (PDF) is located on top of each cabinet. Horizontal wiring trough, cablingtrough, and side hang fiber coiler are installed on the back of the cabinet.

The UMG8900 supports the two configurations of cabinet. One is the UMG8900 assemblycabinet in which only the SSM frames can be configured. Up to three frames can be configuredin the UMG8900 assembly cabinet. The other one is UMG8900 extended assembly cabinet. Itis used when shared interworking function (SIWF) devices are applied.

1.1.1 Structure of N68-22 CabinetThis describes the overall structure of the N68-22 cabinet.

1.1.2 Structure of the N68E-22 CabinetThis describes the overall structure of the N68-22 cabinet.

1.1.3 Configuration of Internal ComponentsThis describes the configuration of internal components when the cabinet is used as aUMG8900 assembly cabinet , UMG8900 extended assembly cabinet.

1.1.4 N800 Supports and AccessoriesThis describes the N800 supports and accessories for the N68-22 cabinet.

1.1.5 N6X Supports and AccessoriesThis describes the N6X supports and accessories for the N68E-22 cabinet.

1.1.6 Power Distribution FramesThis describes the power distribution frame (PDF) of internal components of the cabinet.

1.1.7 LAN SwitchesThis describes the LAN Switch of internal components of the cabinet.

1.1.8 LAN Switch Cable FramesThis describes the LAN Switch cable frame of internal components of the cabinet.

1.1.9 Cabling TroughsThis describes the cabling trough of internal components of the cabinet.

1.1.10 Fiber Management TrayThis describes the side hang fiber coiler and back fiber management tray (FMT) of internalcomponents of the cabinet.

1.1.11 Structures and Mechanical Specifications of the N68-22 CabinetsThis describes the mechanical specifications of the N68-22 cabinets.

1.1.12 Technical Specifications of N68E-22 CabinetsThis describes the technical specifications of the N68E-22 cabinet.

1.1.1 Structure of N68-22 CabinetThis describes the overall structure of the N68-22 cabinet.

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The dimension of the N68-22 cabinet is 2200 mm [87 in.] x 600 mm [24 in.] x 800 mm [32 in.](H x W x D). Figure 1-1 shows the appearance.

Figure 1-1 Appearance of the N68-22 cabinet

800

600

2200

An N68-22 cabinet consists of racks, doors, frames, power distribution frames (PDFs), horizontalwiring troughs, and cabling troughs. The wire bushing can be installed on the front and backsides of racks for laying cables.

Figure 1-2 shows the overall structure of the N68-22 cabinet.



1-3

Figure 1-2 Structure of the N68-22 cabinet

12

34

5

1. Rack 2. Left panel 3. Right panel 4. Front door 5. Back door

There are cabling holes at the top and the bottom of the cabinet. You can choose the overheadcabling or underfloor cabling mode according to actual conditions of equipment room. Rodent-proof nets at the cabling holes can cover the holes after cabling to prevent animals from enteringthe cabinet.

Wire bushings on the side columns of the cabinet, and horizontal wiring troughs and cablingtroughs at the back of the cabinet can facilitate the operation of laying and bundling internalcables.

The mount bars on the side columns are used to fix SSM frames and other internal components.At the back of the cabinet, grounding bars on the side columns are used to connect to theprotection grounding (PGND) cables of internal components and PGND cables betweencabinets.

The cabinet uses double door leaves for both front door and back door, saving the installationspace and facilitating operations to the equipment. In addition, side panels are hung on thecabinet.



Issue 05 (2009-01-09)

The front and back doors and bottom plate all have minute air vents with air filters inside. Thefront-in, back-out and bottom-to-top ventilation modes inside the cabinet realize excellent heatdissipation and dust-proof functions.

In conjunction with the N800 supports and guide rails, the N68-22 cabinet can be installed onthe ESD-preventive floor or on the cement floor in the equipment room.

1.1.2 Structure of the N68E-22 CabinetThis describes the overall structure of the N68-22 cabinet.

The dimensions (H x W x D) of the N68E-22 cabinet is 2200 mm x 600 mm x 800 mm. Figure1-3 shows the appearance.

Figure 1-3 Appearance of the N68E-22 cabinet

Figure 1-4 shows the structure of the N68E-22 cabinet.



1-5

Figure 1-4 Structure of the N68E-22 cabinet

1

3

4

5

2

6

1. Front door 2. Front mount angle 3. Side panel

4. Rack 5. Back door 6. Back mount angle

An N68E-22 cabinet consists of racks, doors, frames, power distribution boxes (PDBs), andhorizontal wiring troughs.



Issue 05 (2009-01-09)

l The front door and the back door are single-leaf doors with locks on the left side. The sidepanels are externally fixed with screws.

l The front mount angles in the cabinet are used to fix internal components. The groundingpoints on the back mount angles are used for grounding of internal components andconnections of protection ground (PGND) cables between cabinets.

l Wire bushings on the front and back columns of the cabinet can facilitate the operation oflaying and bundling internal cables.Figure 1-5 shows the appearance and structure of the wire bushing.

Figure 1-5 Appearance and structure of the wire bushing

l The side hang fiber coiler can be installed on the back column of the cabinet to provide the

cabling routes and space for optical fibers.l The N68E-22 cabinet can be installed either on the ESD-preventive floor or on the cement

floor directly. When the N68E-22 cabinet is installed on the ESD-preventive floor, the N6Xsupports must be used.

1.1.3 Configuration of Internal ComponentsThis describes the configuration of internal components when the cabinet is used as aUMG8900 assembly cabinet , UMG8900 extended assembly cabinet.

UMG8900 Assembly CabinetThe UMG8900 assembly cabinet adopts standard 19-inch frames. The internal componentsinclude power distribution frame (PDF), SSM frame, back fiber management tray (FMT),horizontal wiring trough, and cabling trough. Figure 1-6 shows the full configuration of internalcomponents of the UMG8900 assembly cabinet.



1-7

Figure 1-6 Structure of the UMG8900 assembly cabinet

1 2

3

4

65

4

65

4

65

7

8

9

8

9

89

1. Front view 2. Rear view 3. Power distribution frame

4. SSM frame 5. Fan box 6. Filler panel

7. Horizontal wiring trough 8. Rear cabling trough 9. Back fiber management tray

NOTE

The fan box is at the bottom of the SSM frame.

UMG8900 Extended Assembly CabinetThe UMG8900 extended assembly cabinet is used when the shared interworking function(SIWF) device is applied.

The internal components of the UMG8900 extended assembly cabinet include PDF, SSM frame,SIWF, LAN Switch, LAN Switch cable frame. The LAN Switch works in conjunction with the



Issue 05 (2009-01-09)

SIWF. Figure 1-7 shows the full configuration of internal components of the UMG8900extended assembly cabinet.

Figure 1-7 Structure of the UMG8900 extended assembly cabinet

1

3

2

10

1112

4

5

4

4

8

47

9

8

4

6

1. Front view 2. Rear view 3. Power distribution frame 4. Filler panel

5. SSM frame 6. Fan box 7. LAN Switch 8. LAN Switch cable frame

9. SIWF frame 10. Horizontal wiring trough 11. Rear cabling trough 12. Back fiber management tray

NOTE

The fan box is at the bottom of the SSM frame.

1.1.4 N800 Supports and AccessoriesThis describes the N800 supports and accessories for the N68-22 cabinet.



1-9

N800 Supports

An N800 support assembly contains the support, horizontal pallet assembly, and side palletassembly.

Supports are made from welded steel plates. They are used to block the cabinets up, thusfacilitating floor paving and cabling. Before the whole set of equipment is grounded, insulationplates must be installed under the supports, and insulating coverings must be added to theexpansion bolts to satisfy the insulation requirements.

N800 supports have four kinds of components. Three kinds if components are height-adjustableand one kind of component is fixed in height.

Figure 1-8 shows the appearance of the N800 support.

Figure 1-8 Appearance of the N800 support

1

6

23

5

4

1. Connection hole for guide rail 2. Height mark of ESD-preventive floor 3. Upper support

4. Height-locking bolt 5. Lower support 6. Mounting hole to the ground

Table 1-1 lists the applicable height range of each support type.

Table 1-1 Applicable height range of each support type

Type Height of the Applicable ESD-Preventive Floor (mm)

I 210 to 255

II 256 to 345

III 346 to 525

IV Customized based on the floor height (minimum: 100 mm)



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NOTEThe floor height refers to the distance between the upper surface of the ESD-preventive floor and the cementfloor.

The heights of the N800 series I, II, III supports can be adjusted within their ranges by movingthe upper and lower supports up and down.

N800 series IV supports are of fixed heights, which are suitable for the floors between 100 mm[3.9 in.] to 209 mm [8.2 in.] or higher than 525 mm [20.7 in.]

Horizontal Pallet AssemblyThe horizontal pallet assembly includes the following:

l Horizontal palletThe pallets support the floor around the cabinet. They can be divided into front and backhorizontal pallets, and side pallets.

l Fixing bracket for the palletThe fixing brackets fix the pallets. They are installed under guide rails and used to connectguide rails and front and back horizontal pallets.

l Guide railThe guide rails connect cabinets and supports. They are used to move the equipment andadjust the equipment positions. They can join two supports and a cabinet together to keepthe cabinet in a horizontal line and keep the connection stable. The guide rail can absorbthe vibrations because of its elasticity.

A cabinet uses one horizontal pallet assembly, which includes two guide rails, two horizontalpallets and two fixing pallets. Figure 1-9, Figure 1-10 and Figure 1-11 show appearances ofthem.

Figure 1-9 Appearance of the guide rail

1

2

1. Connection hole for the rack 2. Connection hole for the support



1-11

Figure 1-10 Appearance of the horizontal pallet

2

1

1

1. Connection nut for the side pallet 2. Connection hole for the horizontal pallet

Figure 1-11 Appearance of the fixing bracket

1

2

1. Connection hole for guide rail 2. Connection hole for the horizontal pallet

Side Pallet AssemblyEach side pallet assembly includes two side pallets and four fixing brackets. The side palletssupport the floor on both sides of the cabinet. Figure 1-12 shows the appearance of the sidepallet.



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Figure 1-12 Appearance of the side pallet

1

1. Connection hole for the horizontal pallet

The number of side pallet assemblies varies with the installation mode:

l In single cabinet installation, one cabinet uses one side pallet assembly.

l In combined cabinet installation, a row of cabinets use one side pallet assembly.

Quantity of Supports and Pallet Assemblies

To connect cabinets, 2N mode is used to determine the number of supports to be used. That is,each N68-22 cabinet uses two supports and N cabinets in a row need 2N supports.

Each cabinet has one set of floor holder-guide rail assemblies, and the sets are delivered togetherwith the supports. Each set of pallet assembly includes two slide rails, two side pallets, two fixingbrackets and two horizontal pallets.

Each cabinet needs two fixing brackets, two horizontal pallets, and cabinets in each row needtwo side pallets, even if there is only one cabinet in a row.

1.1.5 N6X Supports and AccessoriesThis describes the N6X supports and accessories for the N68E-22 cabinet.

N6X Supports

An N6X support assembly contains the support, guide rail, and front pallet.

Supports are made from welded steel plates. They are used to block the cabinets up, thusfacilitating floor paving and cabling. Before the whole set of equipment is grounded, insulationplates must be installed under the supports and insulating coverings must be added to theexpansion bolts to satisfy the insulation requirements.

N6X supports have two kinds of components. One kind of components are height-adjustableand the other kind of components are fixed in height. The height of the support can be adjustedbased on the height of the floor on site.

Figure 1-13 shows the appearance of the N6X support.



1-13

Figure 1-13 Appearance of the N6X support

1. Connection hole for the guide rail 2. Connection hole for the front pallet 3. Height mark of the antistaticfloor

4. Height-locking bolt 5. Mounting hole to the ground -

Table 1-2 lists the applicable height range of each type of the support.

Table 1-2 Applicable height range of each type of the support

Type Height of the Applicable ESD-Preventive Floor (mm)

I Height-adjustablesupport

296 to 465

II Height-fixedsupport

Customized based on the floor height (minimum: 100 mm)

NOTE

The floor height refers to the distance between the upper surface of the antistatic floor and the cement floor.

The height of N6X support I can be adjusted within its range by moving the upper and lowersupports up and down.

N6X support II is fixed in height, which is suitable for the floors between 100 mm to 209 mmor higher than 465 mm.

One cabinet uses two supports of the same height.



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Pallet Assembly

The pallet assembly includes the following:

l Guide rail

The guide rails connect cabinets and supports. They are used to move the equipment andadjust the equipment positions. They can join two supports and a cabinet together to keepthe cabinet in a horizontal line and keep the connection stable. The guide rail can absorbthe vibrations because of its elasticity.

Figure 1-14 Appearance of the guide rail

1

2

1. Connection hole for the rack 2. Connection hole for the support

l Pallet

The pallets support the floor around the cabinet.

Two pallets are used to support one cabinet.

Figure 1-15 Appearance of the pallet

1. Connection hole for the support



1-15

Quantity of N6X Support Assemblies

A set of N6X support assembly consists of one guide rail assembly, one pallet assembly, andone N6X support.

When the cabinet is installed on the antistatic floor, the quantity of the N6X support assembliesrequired is 2N (N refers to a number). That is, each N68E-22 cabinet requires two sets of N6Xsupport assemblies. If N cabinets are installed in a row, the quantity of N6X support assembliesis 2N.

1.1.6 Power Distribution FramesThis describes the power distribution frame (PDF) of internal components of the cabinet.

Functions

The PDF is installed at the top of a cabinet. It has two -48 V/-60 V DC input power supplies andprovides six -48 V/-60 V DC power supplies through six miniature circuit breakers to the framesin the cabinet after internal processing of lightning protection.

The PDF detects the input voltage, and the output power after distribution. When the PDF detectsthe fault, audible and visual alarm occurs.

The PDF supports two types of power distribution mode. One is the DC-C, that is the protectionground (PGND) is connected with the return ground (RTN). The other is DC-I, that is the PGNDcannot be connected with the RTN. If the DC-I mode is adopted, you need to take down themental bar connecting the PGND and RTN at the power input terminal block.

Appearance and Structure

Figure 1-16 shows the appearance and structure of the PDF.

Figure 1-16 Appearance and structure of the PDF1 2 3

5

38 7

6

4

9

4

1. Bundling bulge 2. Signal transfer board 3. Cable terminal block (16PIN)

4. Cable terminal block (6PIN) 5. Overvoltage protection transfer board 6. PDF body



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7. Miniature circuit breaker 8. Plastic panel 9. Cabling hole for switch monitorcable

Refer to Figure 1-17. The PDF is composed of the power distribution monitoring unit, lightningprotection unit, and power distribution output unit.

Figure 1-17 Structure of the PDF

-48V1

RTN

-48V1 BGND

J2J3J4

J5 J6

ALM MUTERUNRS485

SW1 SW2 SW4SW3 SW5 SW6

J5J6

J1

-48V2

BGND

-48V1

-48V2

To externalsensor

Lightingprotection

unit

Monitoring unit -48V faultdetection

Air-breaker

Lightingfault

detection

I II III48V1 48V1 48V1

－48V1I －48V1 II

Power distributionoutput unit

-48V2

RTN

Dule holeOT inputterminal

I II III48V2 48V2 48V2

The power distribution frame is designed in conformity with the IEC297 standard. Its dimensionsare 88.9 mm (2 U) x 482.6 mm x 476.2 mm, that is, 3.5 in. x 19.0 in. x 18.7 in. (H x W x D).

Panelsl Front panel of the PDF

Figure 1-18 shows the front panel of the PDF.



1-17

Figure 1-18 Front view of the PDF

RUNALM

12

RUNALM

ON

OFFMONITOR

ALARM

3

SW1 SW2 SW3 SW4 SW5 SW6

SW1 SW2 SW3 SW4 SW5 SW6

4 5 6 7 8 9LIGHTNING

PROTECTION

LIGHTNINGPROTECTION

10

1. Running indicator 2. Alarm indicator 3. Alarm sound switch

4 to 6. -48 V1 output switches 7 to 9. -48 V2 output switches 10. Lightning proof unit panel

NOTE

The UMG8900 supports -48 V/-60 V power supplies. The silkscreen on the components such as thePDF is usually marked according to the standard of -48 V power supply.

Two indicators are located on the front panel of the power distribution frame. Table 1-3lists the indicator meaning.

Table 1-3 Indicator meaning of the PDF

Indicator Identification Color State Meaning

Runningindicator

RUN Green Flashing onceevery twoseconds

There is power supplyand the PDF worksnormally.

Always off There is no powersupply, or the PDF isfaulty.

Flashing onceevery 0.5second

Communicationshave problembetween the PDF andmain control frame.

Alarmindicator

ALM Red Always on The PDF is faulty.

Always off No fault occurs.

The alarm sound switch on the front panel is used to enable/disable the alarm sound. If theswitch is set to ON, alarm sound is generated whenever a fault occurs to the PDF; If theswitch is set to OFF, no alarm sound is generated even if a fault occurs.

l Rear panel of the PDF



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The power input and power output terminal blocks and monitoring port are in the rear panelof the PDF. Refer to Figure 1-19.

Figure 1-19 Rear panel of the PDF

21

-48VIN

-48VOUT

J113 J114 J112 J111 J106 J105 J104

3

COM3

COM1

COM2

J102 J103

J108 J107 J101

J110 J120 J109

1. Power input terminal block 2. Power output terminal block 3. External ports of monitoring board

The power distribution frame has two -48 V/-60 V input power supplies and provides sixindependent -48 V/-60 V output power supplies in hot backup mode. On the power inputand power output terminal blocks, the connection positions are marked -48 V and RTN.

Table 1-4 lists the interfaces on the PDF panel and their functions.

Table 1-4 Interfaces on the PDF panel

Interface Function

COM1 Connecting the COM1 interface of the EAC-2

COM3 Connecting the MONITOR interface of the middle frame in thecabinet

J105 Connecting to the interface on the monitoring module of theEmerson power and monitoring the power supply

Other interfaces on the monitoring board in the power distribution box are not used.

Technical Specifications

Table 1-5 lists the technical specifications of the PDF.



1-19

Table 1-5 Technical specifications of the PDF

Item Specification

Inputparameter

Rated input voltage -48 V/-60 V

Input voltage range -48 V: -57 V to -40 V

-60 V: -72 V to -50 V

Input mode Two -48 V/-60 V power inputs or one -48 V/-60 Vpower input

Maximum inputcurrent

Two -48 V/-60 V inputs (in hot backup mode), eachof which is 100 A.

Outputparameter

Rated output voltage -48 V/-60 V

Output voltage range -48 V: -57 V to -40 V

-60 V: -72 V to -50 V

Output drop Six 70 A outputs, each of which can be closed oropen, and has short circuit protection function.

Output protection 70 A output. The protection point is 87.5 A, and theconnection is recovered manually.

Rated output power 4800 W

DC lightningprotection

Differential modeprotection

Apply testing current of 8/20µs and 3 kA to -48V/-60 V and RTN five times in positive and negativedirections respectively. Residual voltage: ≤ 200 V

Common modeprotection

Apply testing current of 8/20µs and 5 kA to -48V/-60 V (RTN) and PGND five times in positiveand negative directions respectively. Residualvoltage: ≤ 300 V

Environment Working temperature -10°C to +50°C [14℉ to 122℉]

Storage temperature -40°C to +70°C [-40℉ to 158℉]

Relative humidity ≤ 95%

Security compliance In conformity with IEC60950, EN60950, UL60950and GB4943 security specifications.

1.1.7 LAN SwitchesThis describes the LAN Switch of internal components of the cabinet.

FunctionsThe UMG8900 uses the LAN Switch to interconnect frames and servers and achieve inter-component data communication.



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NOTE

This document takes the Quidway S3026 of Huawei as an example. The actual type of the LAN Switchmay be different from the Quidway S3026. Refer to the documentation delivered with the LAN Switch fordetails.

Panel ViewsThe Quidway S3026 provides DC chassis and AC chassis for different power inputs. The DCchassis and AC chassis are the same except the power input socket.

l Front panel of the LAN SwitchRefer to Figure 1-20. There are, from the left to the right, one power indicator (PWR), onestate mode indicator of electrical interface (A/L and D/S), one switch of state mode indicator(MODE), one 24 fixed 10Base-T/100Base-TX auto negotiation electrical interface, twooptional module sockets, and one CONSOLE port on the front panel. The RJ-45 connectoris equipped with two indicators. The left indicator is yellow and the right indicator is green.

Figure 1-20 Front panel of the LAN Switch

3

1 PWRA/LD/S

MODE

4 5 6 7

2

1. Power indicator (PWR) 2. State mode indicator of electrical interface (A/L and D/S)

3. Switch of state mode indicator (MODE) 4. 24 fixed 10Base-T/100Base-TX auto negotiation electricalinterface

5. Optional module socket 6. Optional module socket

7. Console -

The type of Ethernet interface is a standard RJ-45 connector furnished with the statusindicator. Table 1-6 lists the indicator meaning.

Table 1-6 Meaning of indicators on the Ethernet interface

Indicator PanelIndication

Status Description

Power indicator POWER ON The switch is powered on.

OFF The switch is powered off.

State modeindicator

A/L Yellow(left)

ON(FLASH)

If the port is ACTIVE, itindicates that traffic is inprogress.

OFF If the port is DEACTIVE, itindicates that traffic is not inprogress.



1-21

Indicator PanelIndication

Status Description

Green(right)

ON LINK OK (right connection)

OFF LINK FAULT (noconnection); LINK ERROR(wrong connection)

D/S Yellow(left)

ON FULL DUPLEX (full-duplex)

OFF HALF DUPLEX (half-duplex)

Green(right)

ON The transmission rate of theport is 100 Mbit/s.

OFF The transmission rate of theport is 10 Mbit/s.

NOTESwitch the state mode indicator of the port by pressing MODE.

l Rear panelThe DC power input socket, grounding screw, and redundant power input socket are locatedon the rear panel of the DC chassis. Refer to Figure 1-21.

Figure 1-21 Rear panel of the DC chassis

1

NEG(-) RTN(+)

!DC INPUTS FOR REDUNDANT POWER

SYSTEM SPECIFIFD IN MANUALNO HOT PLUGGABLE

2 3

1. DC power input socket 2. Grounding screw 3. Redundant power input socket

Technical SpecificationsTable 1-7 lists the technical specifications of the LAN Switch.

Table 1-7 Technical specifications of the LAN Switch

Item Specification

Dimensions Width: 436 mm [17.2 in.]

Height: 42 mm [1.7 in.]

Depth: 245 mm [9.6 in.]

Weight 3 kg [6.6 lb]



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Item Specification

Input voltage Rated voltage: -60 V to +48 V

Maximum tolerance: -72 V to +36 V

Maximum power ≤ 30 W

Interface Fixed interface 24 x 10Base-T/100Base-Tx

Management port One console interface

Expansion module slot Two module slots, and the interface modulecan be selected

Switching mode Store and Forward

VLAN Supporting 32 VLANs that conform to IEEE802.1Q and are based on the interface

MAC address table Supporting 4K MAC address tables at most

Work environment temperature 0°C to 45°C

Work environment relative humidity 10% to 90%

1.1.8 LAN Switch Cable FramesThis describes the LAN Switch cable frame of internal components of the cabinet.

FunctionsThe LAN Switch cable frame is used together with LAN Switches. It is located at the bottom ofthe LAN Switch, and enables the cabling of network cables from the front panel of the LANSwitch to the back of the cabinet.

Appearance and StructureThe LAN Switch cable frame is 1U in height. Many U-shaped troughs for cable lead-ins existon the front panel. Ventilation holds are located on the bottom plate.

Figure 1-22 shows the appearance and structure of the LAN Switch cable frame.

Figure 1-22 Appearance and structure of the LAN Switch cable frames

1 1

1. Mount angle



1-23

1.1.9 Cabling TroughsThis describes the cabling trough of internal components of the cabinet.

FunctionsThe cabling trough is installed on the back of a cabinet to bundle the cables at the back of thecabinet.

Appearance and StructureThe cabling trough is 2 U (88.9 mm=3.5 in.) high. Refer to Figure 1-23.

Figure 1-23 Appearance and structure of the cabling trough

The two holes at the bottom of the cabling trough can facilitate the cabling of the fiber. Refer toFigure 1-24.

Figure 1-24 Two holes at the bottom of the cabling trough



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Table 1-8 Technical specifications of the cabling trough

Item Specification

Dimensions Height: 2 U (88.9 mm=3.5 in.)

1.1.10 Fiber Management TrayThis describes the side hang fiber coiler and back fiber management tray (FMT) of internalcomponents of the cabinet.

Side Hang Fiber Coilersl Functions

The side hang fiber coiler is installed on the back column of the cabinet to hang up thecoiled optical fibers. That is, coil and tie the superfluous optical fibers, and make sure thatthe diameter of the coiled optical fibers is longer than that of the side hang fiber coiler, andthen put the coiled optical fibers on the side hang fiber coiler.

l Appearance and structure

Figure 1-25 shows the appearance and structure of the side hang fiber coiler. For theUMG8900, each SSM frame uses two side hang fiber coilers, which are located on rightand left sides of the cabinet.

Figure 1-25 Appearance and structure of the side hang fiber coiler

Back Fiber Management Tray (FMT)l Functions

The back fiber management tray (FMT) can be installed at the back of the cabinet to providethe cabling routes and space for optical fibers. Coil the tail fibers into sectors.

l Appearance and structure

Figure 1-26 shows the appearance and structure of the back FMT.



1-25

Figure 1-26 Appearance and structure of the back FMT

1.1.11 Structures and Mechanical Specifications of the N68-22Cabinets

This describes the mechanical specifications of the N68-22 cabinets.

Table 1-9 lists mechanical specifications of the N68-22 cabinet.

Table 1-9 Technical specifications of the N68-22 cabinet

Item Specification

Design It conforms to International Electrotechnical Commission (IEC) 297. Themodular design facilitates expansion and maintenance.

Dimensions 2200 mm (height) x 600 mm (width) x 800 mm (depth)

Capacity Height of available space of a cabinet: 46U (1U = 44.45 mm = 1.75 in.).One cabinet can accommodate a maximum of three standard 19-inchframes.

Weight The empty cabinet without doors is 95 kg [209 lb] and the empty cabinetwith doors is 150 kg [331 lb]. The cabinet is 330 kg [728 lb] when it isfully configured, including the three fully-configured service frame, PDF,and other accessories.

Cabling mode There are cable-through holes both at the top and at bottom of the cabinet,supporting upward cabling and downward cabling.

Heat dissipation The front and back doors and the bottom plate have minute air vents. Thefan box is installed in the service frame The cabinet adopts front-in, back-out and bottom-to-top ventilation mode so that it has excellent heatdissipation and dust-proof functions.

Protection Fully considering EMC in cabinet design. All interfaces enjoyelectromagnetic shielding.

The front and back doors and the bottom plate have minute air vents andair filters.



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Item Specification

There are rodent-proof nets at the cable-through holes to prevent dust andanimals from entering the cabinet.

Material N68-22 cabinet is assembled with electrolytic zinc-coated cold-rolled steelsheet and screws, featuring light weight, simple structure and highversatility. The fireproof materials conform to the Underwriter Laboratory(UL) standards.

Color The cabinet surface is Huawei purple-gray and NC silver-gray, and therack is Huawei purple-gray.

1.1.12 Technical Specifications of N68E-22 CabinetsThis describes the technical specifications of the N68E-22 cabinet.

Table 1-10 Technical specifications of the N68E-22 cabinet

Item Specification

Design It conforms to International Electrotechnical Commission (IEC) 297. Themodular design facilitates expansion and maintenance.

Dimensions(H x W x D) 2200 mm x 600 mm x 800 mm

Capacity Height of available space of a cabinet: 46 U (1 U = 44.45 mm).

Weight

The empty cabinet without doors is 59 kg [130 lb] and the empty cabinet withdoors is 100 kg [221 lb]. The cabinet is 263.6 kg [581 lb] when it is fullyconfigured, including the three fully-configured service frames, PDF, andother accessories.

Powerconsumption

The power consumption of the whole UMG8900 is 3300 W when the threeframes of the UMG8900 are fully configured.

Cablingmode

The cabling mode can be the overhead cabling, underfloor cabling, frontleading-out mode, or rear leading-out mode. The subrack is in front leading-out mode.

Installationmode

You can install the cabinet on either the cement floor directly or on theantistatic floor by using the N6X supports and guide rails.

Heatdissipation

The ventilation rates of front and back doors are 50%. The cabinet realizesthe front-in, back-out, and bottom-to-top ventilation modes. Thus, the cabinetis excellent in heat dissipation.

Protection

Fully considering EMC in cabinet design. All interfaces enjoyelectromagnetic shielding.

The front and back doors and the bottom plate have minute air vents and airfilters.



1-27

Item Specification

Material

N68E-22 cabinet is assembled with electrolytic zinc-coated cold-rolled steelsheet and screws, featuring light weight, simple structure and high versatility.The fireproof materials conform to the Underwriter Laboratory (UL)standards.

Color The cabinet is Huawei purple-gray.

1.2 Auxiliary DevicesThe UMG8900 is managed and maintained through the local maintenance terminal (LMT) andrealizes the alarm function through the auxiliary alarm box. In addition, the UMG8900 monitorsthe environmental parameters through the environment monitoring unit.

1.2.1 LMTThe local maintenance terminal (LMT) is the operation and maintenance client that managesand maintains the UMG8900.

1.2.2 Alarm BoxesThe alarm box is a universal alarm box provided by Huawei.

1.2.3 EAC-2 Environment Alarm ChestThe UMG8900 can realize the environment monitoring function through the EAC-2environment alarm chest (abbreviated as EAC-2).

1.2.4 EMU Environment Monitoring UnitThe UMG8900 can realize the environment monitoring function through the EMU environmentmonitoring unit (abbreviated as EMU).

1.2.1 LMTThe local maintenance terminal (LMT) is the operation and maintenance client that managesand maintains the UMG8900.

The LMT constitutes the Client/Server architecture with the UMG8900. The LMT works in thePC where the Windows 2000, Windows NT, or Windows XP runs.

1.2.2 Alarm BoxesThe alarm box is a universal alarm box provided by Huawei.

For details on specifications and device introduction, see the Universal Alarm Box UserManual.

1.2.3 EAC-2 Environment Alarm ChestThe UMG8900 can realize the environment monitoring function through the EAC-2environment alarm chest (abbreviated as EAC-2).

The EAC-2 is used for data acquisition and voltage monitoring in the equipment room of theUMG8900. Configured with a proper sensor, it can detect corresponding electrical signals andnon-electrical signals in real-time.



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It can control some equipment (such as air conditioner) in remote equipment room, and canprovide thirty-two extension digital signal channels and four additional extension analog signalchannels. It also has the power supply voltage detecting and alarm reporting functions.

When the UMG8900 does not access the EAC-2, it can support the monitoring of one digitalsignal. One UMG8900 can have only one EAC-2. The monitoring function can be realized afterthe UMG8900 accesses the EAC-2. For details, see the EAC-2 User Manual.

1.2.4 EMU Environment Monitoring UnitThe UMG8900 can realize the environment monitoring function through the EMU environmentmonitoring unit (abbreviated as EMU).

The EMU is used for data acquisition and voltage monitoring in the equipment room of theUMG8900. Configured with a proper sensor, it can detect corresponding electrical signals andnon-electrical signals in real-time.

The alarm thresholds of the analog sensor can be set, including those of voltage, temperature,and humidity. The thresholds can be set according to users' needs. Ensure that the upper andlower limits fall within the specified range. Whether the alarm of the Boolean sensor is reporteddepends on the alarm setting by the users.

Four analog input control interfaces, 32 Boolean input control interfaces, and six output controlinterfaces are available. The user can access an appropriate sensor according to the need.

1.3 Environmental SpecificationsThis describes the environmental specifications of the cabinets.

Environmental specifications cover the specifications for storage environment, transportationenvironment, and running environment.

l ETS 300019 Equipment Engineering (EE); Environmental conditions and environmentaltests for telecommunications equipment

l IEC 60721 Classification of environmental conditions

Table 1-11 lists the general environmental specifications.

Table 1-11 General environmental specifications

Item Specification

WorkingEnvironment

StorageEnvironment(Package StorageWithoutTemperatureControl Indoors)

TransportationEnvironment(PackageTransportation)

Temperature Long term: 0°C to 45°C [32℉ to 113℉]Short term: –5°C to55°C [23℉ to 131℉]

Temperature range: –40°C to +70°C[104℉ to 158℉]

Temperature: –40°C(no ventilation) to+70°C [104℉ to158℉]



1-29

Item Specification

WorkingEnvironment



Relativehumidity

Long term: 5% to 85%(1 g/m3 to 25 g/m3)Short term: 5% to 95%(1 g/m3 to 29 g/m3)

10% to 100% 5% to 100%

Height above sealevel

≤ 4000 m [2.5 mi] ≤ 5000 m [3.1 mi]

Wind speed < 5.0 m/s < 30 m/s < 20 m/s

Solar radiation 700 W/m2 1120 W/m2

Heat radiation 600 W/m2

Short-term rain It is prohibited tooperate the device inthe open air.

6 mm/min

IP level IP22

NOTE

Short term means that the consecutive working duration is not more than 96 hours and the accumulativeduration is not more than 15 days in a year.

Table 1-12 lists the air cleanness specifications.

Table 1-12 Air cleanness specifications

EnvironmentChemicalConstitution

Reference Value for Upper Limit of Specification

Long-Term WorkingEnvironment



SO2 0.3 mg/m3 to 1.0 mg/m3 1.0 mg/m3

H2S 0.1 mg/m3 to 0.5 mg/m3 0.5 mg/m3

Cl2 0.1 mg/m3 to 0.3 mg/m3 Not required

HCl 0.1 mg/m3 to 0.5 mg/m3 0.5 mg/m3



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EnvironmentChemicalConstitution

Reference Value for Upper Limit of Specification

Long-Term WorkingEnvironment



NOX 0.5 mg/m3 to 1.0 mg/m3 1.0 mg/m3

NH3 1.0 mg/m3 to 3.0 mg/m3 3.0 mg/m3

HF 0.01 mg/m3 to 0.03 mg/m3 0.03 mg/m3

O3 0.05 mg/m3 to 0.1 mg/m3 0.1 mg/m3

Precipitabledust

1.5 mg/m2h 20 mg/m2h 3.0 mg/m2h

Suspendingdust

0.2 mg/m3 5.0 mg/m3 Not required

Sand 30 mg/m3 300 mg/m3 100 mg/m3

Table 1-13 lists the anti-vibration specifications when the device is running.

Table 1-13 Anti-vibration specifications for device running

Item Sub-Item Range

Sinusoidaloscillation

Frequency 5 Hz to 9 Hz 9 Hz to 200 Hz

Amplitude ≤ 3.5 mm [0.1 in.] None

Peak acceleration None 1 g

Direction 3 axial directions, 6 planes

Times Plus or minus three times in each axial direction,once in each plane

Percussion Percussion waveform Semi-sinusoidal wave

Peak acceleration 5 g

Pulse width 11 ms


Times Plus and minus three times in each axial direction,once in each plane

Earthquake – EUROPEAN ETS 300 019-1-3-Amd(recommended). It can withstand earthquakeintensity of 7 to 9 level.



1-31

Item Sub-Item Range

NOTE1 g equals to 9.8 m/s2.

Table 1-14 lists the anti-vibration specifications during delivery (in 2M3 level packagetransportation).

Table 1-14 Anti-vibration specifications for device delivery

Item Sub-Item Range

Random oscillation(for duration of 30minutes in each axialdirection)

Vertical 5 Hz to 10 Hz ASD: 13 m2/s3

10 Hz to 200 Hz ASD: 3 m2/s3

200 Hz to 500 Hz ASD: 1 m2/s3

Landscapeorientation andlongitudinal

5 Hz to 10 Hz ASD: 10 m2/s3

10 Hz to 200 Hz ASD: 1 m2/s3

200 Hz to 500 Hz ASD: 0.3 m2/s3

Collision Collision waveform Semi-sinusoidal wave


Pulse width 11 ms

Direction Six directions

Times 500 times in each direction

Percussion Percussionwaveform

Semi-sinusoidal wave


Pulse width 6 ms


Times Plus and minus three times in each axialdirection, once in each plane

Free Fall Weight range ≤ 15 kg [33 lb]

Fall height 100 cm [39.4 in.]

Plane Six planes

Times Once in each plane

NOTEASD: Acceleration spectrum density



Issue 05 (2009-01-09)

The mechanical stress of the storage conditions is the same as that of the transportationconditions.



1-33

2 Frames

About This Chapter

This describes the service switching module (SSM) frames, fan boxes, transfer boxes, framebackplanes, board positions, and logic types of frames.

An independent unit composed of various boards connected through the backplane. The SSMframe adopts the standard 19-inch frame. An SSM frame is 12 U (1 U = 44.45 mm = 1.75 in.)high with the backplane installed in the central of the frame. Front and back boards are insertedin pairs into the backplane.

The UMG8900 supports two types of frames, including the SSM-32 and SSM-256, to meetdifferent service requirements. The SSM-32 and SSM-256 are the same in appearance. Theydiffer in the backplane and main control service board.

The SSM-256 frame provides 256 K TDM switching capacity. The SSM-32 frame provides 32K time division multiplex (TDM) switching capacity.

CAUTIONThe SSM frames are of two versions. In the SSM frame of the new version, the fan box is notequipped with the power input interface and monitoring interface. The transfer box is notequipped with the power output interface of the fan box. The power cable and monitoring cableof the fan box are laid inside the SSM frame.In this document, the figures show the SSM frame of the earlier version.

2.1 Appearance and Structure of the SSM FrameThis describes the appearance and structure of the SSM frame.

2.2 Fan BoxesThis describes the functions, appearance and structure, and technical specifications of fan boxesof the UMG8900.

2.3 Transfer BoxesThis describes the functions, appearance and structure, and technical specifications of thetransfer box of the UMG8900.

HUAWEI UMG8900Hardware Description 2 Frames


2-1

2.4 BackplanesThis describes the SSM frame and backplanes.

2.5 Board DeploymentThis describes the board deployment of the SSM-256 and SSM-32 frames.

2.6 Logical Frame TypesBased on service functions, frames fall into four logical types, namely, main control frame,central switching frame, service frame, and control frame. Different boards are configured indifferent frames and provide different functions.

2.7 Technical Specifications of the SSM FrameThis describes technical specifications of the SSM frame.

2 FramesHUAWEI UMG8900Hardware Description


Issue 05 (2009-01-09)

2.1 Appearance and Structure of the SSM FrameThis describes the appearance and structure of the SSM frame.

The UMG8900 adopts semi-integrated frame structure, with embedded filter box, transfer boxand fan box. The front board and back board in an SSM frame are different in height. The frontboard is 9 U high and the back board is 8 U high (I U = 44.45 mm = 17.5 in.).

At the bottom back of SSM frame, there are two filter boxes and one transfer box. Each filterbox outputs one independent –48 V/–60 V DC power supply to the backplane through feed-through filter and blind-match connector.

SSM-256 FramesThe SSM-256 frame has 32 front and back slots. For the main control frame, the defaultconfiguration is the MOMU/MNET. For the service frame, the default configuration is theMMPU/MNET. Figure 2-1 shows the appearance and structure of the SSM-256 frame.

Figure 2-1 Appearance and structure of the SSM-256 frame

Figure 2-2 shows the front view of the SSM-256 frame.



2-3

Figure 2-2 Front view of the SSM-256 frame

1

2

3

1. Frame lintel 2. Mount angle 3. Embedded fan box

Figure 2-3 shows the rear view of the SSM-256 frame.

Figure 2-3 Rear view of the SSM-256 frame

1 2 3 4

1. Filter box 2. Fan box 3. Transfer box 4. Filter box

Figure 2-4 shows the side view of the SSM frame.



Issue 05 (2009-01-09)

Figure 2-4 Side view of the SSM frame

1

2

3

5

4

1. Frame lintel 2. 9 U board 3. Integrated fan 4. 8 U board 5. Filter box

SSM-32 Frames

The SSM-32 and SSM-256 are the same in appearance. They differ in the backplane and maincontrol service board. The SSM-32 frame has 28 front and back slots. For the main control frame,the default configuration is the MOMB/MTNC. For the service frame, the default configurationis the MTNC.

Figure 2-5 shows the appearance and structure of the SSM-32 frame.

Figure 2-5 Appearance and structure of the SSM-32 frame



2-5

Figure 2-6 shows the front view of the SSM-32 frame.

Figure 2-6 Front view of the SSM-32 frame

STATUS

Figure 2-7 shows the rear view of the SSM-32 frame.

Figure 2-7 Rear view of the SSM-32 frame

The side view of the SSM-32 and the SSM-256 frames are the same. See Figure 2-4.



Issue 05 (2009-01-09)

2.2 Fan BoxesThis describes the functions, appearance and structure, and technical specifications of fan boxesof the UMG8900.

CAUTIONThe SSM frames are of two versions. In the SSM frame of the new version, the fan box is notequipped with the power input interface and monitoring interface.In this document, the figures show the fan box in the SSM frame of the earlier version.

FunctionsThe fan box keeps the temperature in appointed range. The fan monitoring board in the fan boxprovides the power input module. The supplied power includes –48 V and –60 V.

Appearance and Structurel Appearance

The fan box is at the bottom of the SSM frame. The panel of the fan box is made of plasticand the fan box body is made of sheet metal. Each fan box contains six fans, and the diameterof each fan is 119 mm [4.7 in.] and the thickness 32 mm [1.3 in.]. Each SSM frame has onefan box. Figure 2-8 shows the appearance and structure of the fan box. The appearancesand structures of the –48 V fan box and –60 V fan box are the same. For details on difference,see item label on the front panel of the fan box.

Figure 2-8 Appearance and structure of the fan box

1

2

3

4

5

6 7

1. Fan box body 2. State indicator 3. Fan 4. Fan driving powersupply, control anddetection terminals



2-7

5. Monitoring board for fanbox

6. DIP switch S1 7. Terminal for stateindicator signal cable

-

l Front panel

Figure 2-9 Front panel of the fan box

1 3

STATE

2

21021201P061000037 N* -UG0E4MFAN

210212018461000037 N* -UG0E4MFAN

1. Captive screws 2. Item label 3. Fan state indicator

NOTE

You can identify the –48 V fan box from the –60 V fan box through the item label on the front panelof the fan box. If the seventh to the tenth numbers are 0184, it indicates that it is the –48 V fan box.If the seventh to the tenth numbers are 0311, it indicates that it is the –60 V fan box

l Rear panel

Figure 2-10 Rear panel of the fan box

1

2

POWER INPOWER IN (BACKUP)

MONITOR

1. Power input terminals 2. RS485 serial port (connected to fan box monitoring cable)

l Indicator

If the indicator is flashing in green (on for 1 s, off for 1 s), it indicates that the fan worksnormally. Otherwise, it indicates that the fan does not run properly, the fan monitoringcommunication board or the power of the fan box is faulty.

l DIP Switches



Issue 05 (2009-01-09)

A DIP switch S1 is located on the monitoring board of the fan box. The first three bits areused to set address information. Generally, they are set to 100. The fourth bit S1-4 is usedto set air direction. The UMG8900 adopts upward ventilation mode. Thus, S1-4 is set toOFF. Table 2-1 lists the settings of the DIP switches.

Table 2-1 DIP switch settings on the monitoring board of the fan frame

Address Information Air Direction

S1-1 S1-2 S1-3 S1-4

OFF ON ON OFF


The fans in the fan box are designed with speed regulation technology. The fan speed can beadjusted when the heat dissipation and system running are affected. The monitoringcommunication modules in the fans help the users know the running states of the componentsin the fan box through indicators, and maintain the fan box remotely through networkmanagement system (NMS) terminal.

Table 2-2 lists related technical specifications of the fan box.

Table 2-2 Technical specifications of the fan box

Item Specification

Input voltage range –48 V power supply: –40 V to –57 V

–60 V power supply: –51 V to –72 V

Maximum power 105 W

Communication rate ofRS485 serial port

9.6 kbit/s

2.3 Transfer BoxesThis describes the functions, appearance and structure, and technical specifications of thetransfer box of the UMG8900.

CAUTIONThe SSM frames are of two versions. In the SSM frame of the new version, the transfer box isnot equipped with the power output interface of the fan box.

In this document, the figures show the transfer box in the SSM frame of the earlier version.



2-9

FunctionsThe transfer box is located below the board slot. The transfer box has transfer boards inside, onwhich there are DIP switches, blind-match connectors, monitoring interfaces, and isolatingdiodes. The transfer box provides power supply interface, system monitoring, and fan boxmonitoring functions, and implements frame ID setting.

Appearance and Structurel Appearance

The transfer box is located below the board slot. Figure 2-11 shows the appearance andstructure of the transfer box.

Figure 2-11 Front view of the transfer box

MONITOR ALARM FAN.48V FRAME.ID

1 2 3 4

1. Monitoring cableinterface

2. Alarm cable interface 3. Fan box poweroutput port

4. Frame ID DIP switches

l DIP Switches

The 8-bit DIP switch on the transfer box is used to set the frame ID. Refer to Figure2-12.

Figure 2-12 Eight-bit DIP switch on the transfer board

ON

1 2 3 4 5 6 7 8

OFF

DIP switches for the SSM-256 and the SSM-32 are set in the following different ways.For the SSM-256, SW1 to SW4 are used to set the frame ID. The SW5 to SW8 are not usedand must be set to OFF. The frame ID is denoted by 4-bit binary number. That is, the frameID = (SW4)(SW3)(SW2)(SW1). The value ON of the DIP switch indicates 0, and OFFindicates 1. Table 2-3 lists the relationship between frame IDs and DIP switch settings.



Issue 05 (2009-01-09)

Table 2-3 Relationship between frame IDs and DIP switch settings in the SSM-256 frame

DIP Switch Setting BinaryNumber

Frame ID

SW4 SW3 SW2 SW1

ON ON ON ON 0000 0

ON ON ON OFF 0001 1

ON ON OFF ON 0010 2

ON ON OFF OFF 0011 3

ON OFF ON ON 0100 4

ON OFF ON OFF 0101 5

ON OFF OFF ON 0110 6

ON OFF OFF OFF 0111 7

OFF ON ON ON 1000 8

For the SSM-32, SW1 to SW6 are used to set the frame ID. SW7 and SW8 are not usedand must be set to OFF. The frame ID is denoted by 6-bit binary number. The frame IDand DIP Switch setting are similar to those in the SSM-256 frame. The difference is thatthe frame ID of the SSM-32 frame is denoted by 6-bit binary number. That is, the frameID = (SW6) (SW5) (SW4)(SW3)(SW2)(SW1).The appearance and structure of the SSM-256 frame and SSM-32 frame are the same whilethe backplanes are different. Distinguish the two frames as follows:– Observe the silkscreen on the backplane.

The silkscreen is located below slots 9 to 12 on the backplane. It is on the side wherethe OMU/MPU is located, rather than the side where the NET is located. The silkscreenmark of the SSM-256 is MBKP, while that of the SSM-32 is BAKP.

– Observe the slot on the backplane.There are 16 slots respectively on the front and back of the backplane of the SSM-256frame. The width of the slots is the same. Each OMB/MPB/TNC board occupies twophysical slots in the SSM-32 frame. Therefore, their corresponding slots on thebackplane also occupy two slots. That is, there are 14 slots respectively on the front andback of the backplane of the SSM-32 frame, and the two slots in the middle are widerthan other slots.

2.4 BackplanesThis describes the SSM frame and backplanes.

SSM-256 FramesFor the SSM-256, the backplane (MBKP) is a standard 9 U central backplane. Its dimension(height x width x thickness) is as follows (The bracket shows the absolute error range):

390.7 (–0.3 to 0) mm x 412.2 (–0.3 to 0) mm x 4.5 (–0.4 to 0.4) mm, that is, 15.4 (0.01 to 0) in.x 16.2 (0.01 to 0) in. x 0.2 (-0.02 to 0.02) in.



2-11

The MBKP provides the following signal interconnection channels for the boards in the SSMframe:

l Control signal channel: 100 Mbit/s fast Ethernet (FE) channels and maintenance bus(MBus) from master and slave MOMUs/MMPUs to other boards. The MBus implementsenvironment monitoring, alarm, power-on/off, hot-pluggable and version control. The FEbus implements data configuration, log, performance and management.

l High-speed TDM data channel: 777 Mbit/s high-speed low-voltage differential signaling(LVDS) channel from the MTNB to other TDM service interface boards.

l High-speed packet data channel: 1.25 Gbit/s or 2.5 Gbit/s high-speed LVDS channel fromthe MNET to packet service boards.

l Cascading signal channel: High-speed LVDS channel and low-voltage transistor-transistorlogic (LVTTL) state identification signal channel from the MFLU and MBLU to theMNET and MTNB.

l Clock signal assignment channel: Channel for distributing clock signals provided by theMCLK from the MNET to service boards.

l The backplane provides service boards with –48 V power supply and 5 V MBus powersupply. The pins for power supply, grounding and signals in the backplane are designed indifferent lengths to avoid mis-plugging boards.

SSM-32 FramesFor the SSM-32, the backplane (BAKP) is a standard 9 U central backplane. Its dimension(height x width x thickness) is as follows (The bracket shows the absolute error range):

390.7 (–0.3 to 0) mm x 412.2 (–0.3 to 0) mm x 4.5 (–0.4 to 0.4) mm, that is, 15.4 (0.01 to 0) in.x 16.2 (0.01 to 0) in. x 0.2 (-0.02 to 0.02) in.

The BAKP provides the following signal interconnection channels for the boards in the SSMframe:

l Control signal channel: 100 Mbit/s FE channel and maintenance bus (MBus) from masterand slave MTNCs to other boards. The MBus implements environment monitoring, alarm,power-on/off, hot-pluggable and version control. The FE bus implements dataconfiguration, log, performance and management.

l High-speed TDM data channel: 147 Mbit/s high-speed low-voltage differential signaling(LVDS) channel from the MTNC to other TDM service interface boards.

l High-speed packet data channel: 1.25 Gbit/s high-speed LVDS channel from theMOMB/MMPB to packet service boards.

l Cascading signal channel: the MTNC provides the TDM and control plane cascadingchannels.

l Clock signal assignment channel: the MCLK or CKMB clock subboard sends the clocksignal to the MTNC, and the MTNC distributes the signal to the other service boards.

2.5 Board DeploymentThis describes the board deployment of the SSM-256 and SSM-32 frames.



Issue 05 (2009-01-09)

Board deployment in an SSM-256 frameIn the UMG8900, the frame is designed to provide width of 16 standard board slots. Thefollowing boards are inserted in fixed slots in a frame and occupy the width of eight standardboard slots.

l TDM switching net unit or TDM convergence cascading unit (MTNU, MTNB or TCLU)

l Operation & maintenance unit or main processing unit (MOMU or MMPU)

l Packet switch unit (MNET)

l Clock unit (MCLK)

Other slots accommodate service boards and interface boards.

Figure 2-13 shows the board deployment in the SSM-256 frame.

Figure 2-13 Board deployment in the SSM-256 frame

76754 5

1

2

3

8 9 8

1. Back board 2. Backplane 3. Front board

4. Clock unit 5. Back interface board or service board 6. Packet switch unit

7. TDM switching net unit 8. Front service board 9. Operation & maintenance unit or mainprocessing unit

NOTE

In multi-frame cascading mode, only the main control frame must be configured with the MCLK.

Board Deployment in the SSM-32 FrameIn the UMG8900, the frame is designed to provide the width of 16 standard board slots. Thefollowing boards are inserted in fixed slots in a frame and occupy the width of 10 standard boardslots. The MOMB and MTNC need to occupy two slots.

l TDM switching net unit C (MTNC)

l Operation & maintenance unit B (MOMB)

l Clock unit (MCLK)

Other slots accommodate service boards and interface boards.



2-13

Figure 2-14 shows the board deployment in the SSM-32 frame.

Figure 2-14 Board deployment in the SSM-32 frame

1

2

3

4 5 6 5

7 8 7

1. Back board 2. Backplane 3. Front board 4. Clock unit

5. Back service board orinterface board

6. TDM switching net unit C 7. Front service board 8. Operation & maintenanceunit B or main processing unitB

NOTE

l In multi-frame cascading mode, only the main control frame must be configured with the MCLK.

l If only stratum-3 clock is required, the UMG8900 can synchronize the clock generated by the CKMBsubboard of the MTNC. In this case, the MCLK does not need to be configured.

2.6 Logical Frame TypesBased on service functions, frames fall into four logical types, namely, main control frame,central switching frame, service frame, and control frame. Different boards are configured indifferent frames and provide different functions.

Main Control FrameThe main control frame manages and controls the whole UMG8900 device and provides clocksignals for other frames.

When the SSM-256 frame serves as the main control frame, the deployment of the front andback boards is shown in Figure 2-15.



Issue 05 (2009-01-09)

Figure 2-15 Board deployment in the SSM-256 main control frame

TNB

NET

NET

TNB

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

OMU

OMU

关系

前插板

TNB

NET

NET

TNB

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

OMU

OMU

关系

前插板

TNB

NET

NET

TNB

TNB

NET

NET

TNB

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

OMU

OMU

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

OMU

OMU

关系

前插板

关系

前插板

TNB

NET

NET

TNB

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

TNB

NET

NET

TNB

CLK

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

OMU

OMU

关系

前插板

OMU

OMU

(1)

(2)(3)

(1)

(3)(3) (2)

(5)

(4)

CLK

1. Universal slots for back boards 2. Universal slots for front boards 3. Slots for front boards with nocorresponding back boards

4. Back boards 5. Front boards

When an SSM-256 frame serves as the main control frame, the following boards are configuredin fixed slots, as listed in Table 2-4.

Table 2-4 Fixed board positions in the SSM-256 main control frame

Board Name Slots

MOMU Front slots 7 and 8

MNET Back slots 7 and 8

MTNU, MTNB, or TCLU Back slots 6 and 9

MCLK Back slots 0 and 1

When the SSM-32 frame serves as the main control frame, the deployment of the front and backboards is shown in Figure 2-16.



2-15

Figure 2-16 Board deployment in the SSM-32 main control frame

TNC

TNC

0 1 2 3 4 5 6 7 8 9 1

0 11 12 13 14 15

OMB

OMB

TNC

TNC

0 1 2 3 4 5 6 7 8 9 1

0 11 12 13 14 15

OMB

OMB

TNC

TNC

TNC

TNC

0 1 2 3 4 5 6 7 8 9 1

0 11 12 13 14 15

OMB

OMB

0 1 2 3 4 5 6 7 8 9 1

0 11 12 13 14 15

OMB

OMB

TNC

TNC

TNC

TNC

OMB

OMB

OMB

OMB

(1) (1)

(2)(2)

(3)

(4)

CLK

CLK

210 543 876 11109 1312 1514

1. Universal slots for back boards 2. Universal slots for front boards


When the SSM-32 frame serves as the main control frame, the following boards are configuredin fixed slots, as listed in Table 2-5.

Table 2-5 Fixed board positions in an SSM-32 main control frame

Board Name Slots

MOMB Front slots 6 to 9

MTNC Back slots 6 to 9

MCLK Back slots 0 and 1

Central Switching Frame

The central switching frame is applied to the cascading of three or more frames. It realizes thecascading between frames and provides service processing functions.

The SSM-32 frame integrates the main control frame and the central switching frame. When theSSM-256 frame serves as the central switching frame, the deployment of the front and backboards is shown in Figure 2-17.



Issue 05 (2009-01-09)

Figure 2-17 Board deployment in the SSM-256 central switching frame

BLU

BLU

BLU

BLU

BLU

BLU

TNB

NET

NET

TNB

BLU

BLU

BLU

BLU

BLU

BLU

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

FLU

FLU

FLU

FLU

FLU

FLU

MPU

MPU

FLU

FLU

FLU

FLU

FLU

FLU

BLU

BLU

BLU

BLU

BLU

BLU

TNB

NET

NET

TNB

BLU

BLU

BLU

BLU

BLU

BLU

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

FLU

FLU

FLU

FLU

FLU

FLU

MPU

MPU

FLU

FLU

FLU

FLU

FLU

FLU

BLU

BLU

BLU

BLU

BLU

BLU

TNB

NET

NET

TNB

BLU

BLU

BLU

BLU

BLU

BLU

BLU

BLU

BLU

BLU

BLU

TNB

NET

NET

TNB

BLU

BLU

BLU

BLU

BLU

BLU

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

FLU

FLU

FLU

FLU

FLU

FLU

MPU

MPU

FLU

FLU

FLU

FLU

BLU

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

FLU

FLU

FLU

FLU

FLU

FLU

MPU

MPU

FLU

FLU

FLU

FLU

FLU

FLU

BLU

BLU

BLU

BLU

BLU

BLU

TNB

NET

NET

TNB

BLU

BLU

BLU

FLU

FLU

BLU

BLU

BLU

BLU

BLU

BLU

TNB

NET

NET

TNB

BLU

BLU

BLU

BLU

BLU

BLU

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

FLU

FLU

FLU

FLU

FLU

FLU

MPU

MPU

FLU

FLU

BLU

BLU

BLU

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

FLU

FLU

FLU

FLU

FLU

FLU

MPU

MPU

FLU

FLU

FLU

FLU

FLU

FLU

(1) (1)

(2)

(3)

1. Filler panel 2. Back boards 3. Front boards

In the central switching frame, the MMPU, MTNB (MTNU) and MNET must be configured.The MFLU and MBLU also need to be configured. Table 2-6 lists the board positions.

Table 2-6 Fixed board positions in the central switching frame

Board Name Slots

MMPU Front slots 7 and 8


MTNB Back slots 6 and 9

MFLU Front slots 0 to 5 and 10 to 15

MBLU Back slots 0 to 5 and 10 to 15

Service FramesService frames process services and provide interfaces.

When the SSM-256 frame serves as the service frame, the deployment of the front and backboards is shown in Figure 2-18.



2-17

Figure 2-18 Board deployment in the SSM-256 service frame

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 150 1 2 3 4 5 6 7 8 9 10 11 12 13 14 150 1 2 3 4 5 6 7 8 9 10 11 12 13 14 150 1 2 3 4 5 6 7 8 9 10 11 12 13 14 150 1 2 3 4 5 6 7 8 9 10 11 12 13 14 150 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

TNB

NET

NET

TNB

MPU

MPU

(1) (1)

(2)(3)(3)(3) (2)

(5)

(4)

1. Universal slots for back boards 2. Universal slots for front boards 3. Slots for front boards with nocorresponding back boards


When the SSM-256 frame serves as the service frame, the boards that must be configured arelisted in Table 2-7.

Table 2-7 Fixed board positions in the SSM-256 service frame

Board Name Slots



MTNB, or TCLU Back slots 6 and 9

When the SSM-32 frame serves as the service frame, the deployment of the front and back boardsis shown in Figure 2-19.



Issue 05 (2009-01-09)

Figure 2-19 Board deployment in the SSM-32 service frame

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 150 1 2 3 4 5 6 7 8 9 10 11 12 13 14 150 1 2 3 4 5 6 7 8 9 10 11 12 13 14 150 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

TNC

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 150 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

TNC

(1) (1)

(2)

(3)

(4)

1. Universal slots for back boards 2. Universal slots for front boards


When the SSM-32 frame serves as the service frame, the boards that must be configured arelisted in Table 2-8.

Table 2-8 Fixed board positions in the SSM-32 service frame

Board Name Slots

MTNC Back slots 6 to 9

Control FramesThe control frame is applied to the large-scale networking of SSM-256 frames and providesextended control function. The SSM-32 frames of the medium-UMG8900 do not require controlframes for cascading networking application.

When the SSM-256 frame serves as the control frame, the deployment of the front and backboards is shown in Figure 2-20.



2-19

Figure 2-20 Board deployment in the SSM-256 control frame

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 150 1 2 3 4 5 6 7 8 9 10 11 12 13 14 150 1 2 3 4 5 6 7 8 9 10 11 12 13 14 150 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

NET

NET

CMB

CMB

CMB

CMB

CMB

CMB

CMB

CMB

CMB

CMB

CMB

CMB

CMB

CMF

MPU

MPU

CMF

CMF

CMF

CMF

CMF

CMF

CMF

CMF

CMF

CMF

CMF

CMF

CMF

(3)

(1)

(2)

1. Back boards 2. Front boards 3. Filler panel

In the SSM-256 control frame, the MMPU and MNET must be configured. The MCMF andMCMB are also required. Table 2-9 lists the board positions in the control frame.

Table 2-9 Fixed board positions in the control frame

Board Name Slots



MCMF Front slots 0 to 6 and 9 to 15

MCMB Back slots 0 to 6 and 9 to 14

NOTE

Back slot 15 in the control frame is occupied. Thus, no board can be configured in this slot.

2.7 Technical Specifications of the SSM FrameThis describes technical specifications of the SSM frame.

The dimensions of the SSM frame are compliant with the IEC297 standard. Table 2-10 listsrelated technical specifications of the SSM frame.



Issue 05 (2009-01-09)

Table 2-10 Technical specifications of the SSM frame

Item Specifications

Dimensions Height: 533.4 mm [21 in.], equal to 12 UWidth: 482.6 mm [19 in.], including amount angleDepth: 500 mm [20 in.] (distance between the front of the rack-mounting ear and the back of the frame)

Weight Empty SSM-256 frame: 16 kg [35.2 lb], fully configured frame: 45kg [99.2 lb]Empty SSM-32 frame: 13 kg [28.7 lb], fully configured frame: 40.2kg [88.6 lb]

EMC 30 MHz to 230 MHz: 30 dB230 MHz to 1000 MHz: 20 dB

Power consumption Empty SSM-256 frame and SSM-32 frame: 70 WFully configured SSM-256 frame: 1100 WFully configured SSM-32 frame: 850 W



2-21

3 Boards

About This Chapter

This describes the board types, matching limitation, connection between boards, and universalfeatures of the boards.

The boards of the UMG8900 can be divided into two categories in terms of management andmaintenance, that is, logical board and physical board.

The logical board is not the actual board but the abstract concept of the board. The logical boardis composed of the actual boards whose functions are similar. The logical board is used for dataconfiguration and alarm output. This is to facilitate the operation to manage and maintain theconcrete boards belonging to the same type.

The physical board is the actual board, that is, the actual object of the logical board. Every logicalboard includes one or more physical boards. The physical boards belonging to the same logicboard are different in terms of interfaces, performance and location.

The same physical boards can back up in master and slave mode or in load-sharing mode.

For different physical boards, the backup mode differs. Some boards can only adopt the masterand slave mode; some only the load-sharing mode. Some boards can adopt either mode. Notethat only one mode can be adopted at one time.

To work in the master and slave backup mode, two boards need to be inserted in paired slots.

The following slots are paired slots: slot 0 and slot 1, slot 2 and slot 3, slot 4 and slot 5, slot 10and slot 11, slot 12 and slot 13, and slot 14 and slot 15.

Some boards whose positions are fixed do not need to be inserted in paired slots when the masterand slave mode is adopted. For example, boards such as the OMU, TNU, CLK need to be insertedin fixed slots.

3.1 Categories of Boards

3.2 Matching Limitation of Boards

3.3 Connection of Boards

3.4 Signal Streams Between Boards

3.5 Common Characteristics of Boards

HUAWEI UMG8900Hardware Description 3 Boards


3-1

3 BoardsHUAWEI UMG8900Hardware Description


Issue 05 (2009-01-09)

3.1 Categories of Boards

As a universal media gateway, the UMG8900 adopts a distributed hardware structure and usesmultiple types of boards to bear and convert different services. The boards can be divided intothe following categories based on their functions:

l Equipment and resource management unit

l Service and protocol processing unit

l Switching and cascading unit

l Interface unit

l Media resource processing unit

l Clock unit

l Lightning protection unit

NOTE

The UMG8900 supports the enhanced M series of boards, and is compatible with the existing F series ofboards. The boards that are excluded in the board list are described based on the M series of boards.

Equipment and Resource Management Units

Table 3-1 Equipment and resource management units

Board Name BackupMode

Board Position Function

LogicalBoard

PhysicalBoard

OperationMaintenanceUnit (OMU)

Media gatewayOperationMaintenanceUnit (MOMU)

Master/slave It is inserted in frontslot 7 or 8 of theSSM-256 maincontrol frame.A correspondingNET back board isrequired.

The OMUmanages all theframes of theUMG8900when multipleframes areconfigured.The MOMB canconvert thebroadbandservice data.The boardprovides theexternalinterfacesincluding theConsoleinterface.

Media gatewayOperationMaintenanceUnit B(MOMB)

Master/slave It is inserted in frontslots 6, 7, 8 and 9 ofthe SSM-32 maincontrol frame.Each board occupiestwo slots.A correspondingTNC back board isrequired.



3-3



LogicalBoard

PhysicalBoard

Mainprocessingunit (MPU)

Media gatewayMainProcessing Unit(MMPU)

Master/slave It is inserted in frontslot 7 or 8 of theSSM-256 frameexcept the maincontrol frame.A correspondingNET back board isrequired.

The MPUmanages theboards in theframe where theMPU is located.The MMPB canconvert thebroadbandservice data.

Media gatewayMainProcessing UnitB (MMPB)

Master/slave It is inserted in frontslots 6, 7, 8 and 9 of aSSM-32 serviceframe.Each board occupiestwo slots.A correspondingTNC back board isrequired.

ConnectionMaintenanceUnit (CMU)

Media gatewayConnectionMaintenanceFront Unit(MCMF)

Master/slave It is inserted in acommon front slot ofthe SSM-256 frameor the SSM-32 frame.No correspondingback board isrequired.

The CMUprocessesmessages of themedia resourcecontrol protocoland operates thecorrespondingresources.

Media gatewayConnectionMaintenanceBack unit(MCMB)

Master/slave It is inserted in acommon back slot ofthe SSM-256 frameor SSM-32 frame.No correspondingfront board isrequired.


Sub-card ofConnection &ManagementUnit (SCMU)

Load sharingor master/slave

It is inserted in thesubboard slot of theUG02MOMB or theUG02MMPB of theSSM-32 frame.




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LogicalBoard

PhysicalBoard

ProtocolProcessingUnit (PPU)

Media gatewayBack ProtocolProcessing Unit(MPPB)

Load sharing It is inserted in acommon back slot ofthe SSM-256 frame.No correspondingfront board isrequired.

The PPUprocesses the H.248/SCTP/UDP/TCP/IPprotocols.The externalinterfacesinclude the FEinterface.


Load sharing It is inserted in acommon front slot ofthe SSM-256 frameor the SSM-32 frame.No correspondingback board isrequired.


Load sharing It is inserted in acommon back slot ofthe SSM-256 frameor the SSM-32 frame.No correspondingfront board isrequired.

Service and Protocol Processing Units

Table 3-2 Service and protocol processing units



LogicalBoard

Physical Board

High-speedRouting Unit(HRB)

Media gatewayHigh-speedRouting Unit(MHRU)

Master/slave It is inserted in acommon front slot ofthe SSM-256 frameor the SSM-32 frame.A correspondingE8T/E1G back boardis required.

The MHRUtransfers theRTP/RTCP andIP bearerservices.


Media gatewayRTP ProcessingUnit (MRPU)


The MRPUprocesses theIP routes,converges anddistributes IPservices.



3-5



LogicalBoard

Physical Board


Media gatewayHigh-speedRouting Unit D(MHRD)

Master/slave It is inserted in acommon back slot ofthe SSM-256 frameor the SSM-32 frame.A correspondingD8FT/D1GOsubboard is required.

The MHRDprocessed theIP routes, and itconverges, anddistributes theIP services.The MHRDprovides theservice accessfunction.


Media gateway IPover E1 Unit(MIOE)

Master/slave It is inserted in acommon front slot ofthe SSM-256 frameor the SSM-32 frame.

The MIOEimplement IPover E1.When the boardis used in theSSM-256frame, theframe must beconfiguredwith theMTNB.

ATM AAL2/AAL5 SARProcessingUnit (ASU)

Media gatewayATM AAL2/AAL5 SARProcessing Unit(MASU)

Master/slave In the SSM-256frame or the SSM-32frame, it is inserted ina common front slotof the main controlframe and the serviceframe.A correspondingA4L/EAC/TAC backboard is required.

The ASUprocesses ATMservices.

FrontSignallingProcessingunit (SPF)

Media gatewayFront SignallingProcessing unit(MSPF)


The SPFperformssignalingadaptation andtransfers thesignaling.



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Switching and Cascading Units

Table 3-3 Switching and cascading units



LogicalBoard

Physical Board

Packetswitch Unit(NET)

Media gatewayPacket switchUnit (MNET)

Master/slave It is inserted in backslot 7 or 8 of theSSM-256 frame.A correspondingMPU or OMU frontboard is required.

The NETimplementsswitching ofpacket servicesand datacascadingbetween frames.The externalinterfacesincludes the2xGE, 4xFE,Clock, MIR,OMCinterfaces.

Front LinkUnit (FLU)

Media gatewayFront Link Unit(MFLU)

Nullbackup It is inserted in a frontslot of the SSM-256central switchingframe except slots 6,7, 8 and 9.A correspondingBLU back board isrequired.

The FLU andBLU provide 32K or 24 Ksubscribercascadingcapacity,interfacing andswitchingfunctions ontime divisionmultiplexing(TDM)narrowbanddata plane, and 2x 1.25 Gbit/scascadingcapacity andinterfacingfunction on thebroadband dataplane.Providing FEcontrol datachannels todirectly connectframesThe BLUprovides the



3-7



LogicalBoard

Physical Board

Back LinkUnit (BLU)

Media gatewayBack Link Unit(MBLU)

Master/slave It is inserted in a backslot of the SSM-256central switchingframe except slots 6,7, 8 and 9.A correspondingFLU front board isrequired.

cascadinginterface.

Net LinkUnit (NLU)

Media gatewayNet Link Unit(MNLU)

Load sharing It is in back slots 4, 5,10 and 11 of theSSM-32 frame.

The NLUprovides 2 x1.25G/1 x1.25Gcascadingcapacity andinterfacingfunction on thebroadband dataplane.

TDM centralswitchingNet Unit(TNU)

Media gatewayTDM switchingNet Unit(MTNU)

Master/slave It is inserted in backslot 6 or 9 of theSSM-256 frame.No correspondingfront board isrequired.

The TNUimplementsTDM serviceswitching.The MTNUprovides 24 Kcascadingcapacity.The TCLUprovides 24 Kcascadingcapacity.The MTNBprovides 32 K



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LogicalBoard

Physical Board

TDMConvergence &Link Unit(TCLU)

Master/slave It is inserted in backslot 6 or 9 of theSSM-256 maincontrol frame or theservice frame.No correspondingfront board isrequired.

cascadingcapacity.The MTNCprovidesmaximum 4 x8K cascadingcapacity.The MTNCprovides the FEswitchingfunction for thecontrol plane.The MTNCprovides multi-frame cascadingchannels for theFE plane and theTDM plane.The MTNCmanages theboards in theframe where theMTNC islocated.The MTNCprovides level 3clock signal forthe systemthrough theclock subboard.

Media gatewayTDM switchingNet Unit B(MTNB)


Media gatewayTDM switchingNet Unit C(MTNC)

Master/slave It is in back slots 6, 7,8 and 9 of the SSM-32frame.Each board occupiestwo slots.A correspondingMOMB/MMPB frontboard is required.

Interface Units

CAUTIONThe ports that the UMG8900 provides are type 2 equipment defined in Electromagneticcompatibility and Electrical Safety for Network Telecommunications Equipment issue 3.The E1/T1 ports are only used to connect with indoor cables. If not, install protectors to avoidany damage to the equipment.



3-9

Table 3-4 Interface units



LogicalBoard

Physical Board

1-port GEOpticalinterface card(E1G)

Media gatewayone-port GEOptical interfacecard (MG1O)

Nullbackup It is inserted in acommon back slot ofthe SSM-256 frameor the SSM-32frame.A correspondingHRB front board isrequired.

The E1Gprovides oneGE interface.

2*155MSDH/SONETopticalinterface card(S2L)

Media gateway2*155M SDH/SONET opticalinterface card(MS2L)

Master/slave or loadsharing

The UG01MS2L andUG01MS2E can beonly inserted in acommon back slot ofthe SSM-256 frame.The UG02MS2L andUG02MS2E can beinserted in a commonback slot of theSSM-256 frame orthe SSM-32 frame.No correspondingfront board isrequired.

The MS2Lprovides two155 Mbit/sSDH opticalinterfaces.The MS2Eprovides two155 Mbit/sSDH electricalinterfaces.

Media gateway2*155M SDH/SONETElectronicalinterface card(MS2E)





It is inserted in acommon back slot ofthe SSM-32 frame.No correspondingfront board isrequired.

The MS1Lprovides one155 Mbit/sSDH opticalinterface.The MS1Eprovides one155 Mbit/sSDH electricalinterface.



4 PortsSTM-1 ATMOpticalInterfaceBoard (A4L)

Media gateway 4Ports STM-1 ATMOptical InterfaceBoard (MA4L)

Nullbackup It is inserted in acommon back slot ofthe SSM-256 frameor the SSM-32frame.A correspondingASU front board isrequired.

The A4Lprovides four155 M ATMopticalinterfaces.



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LogicalBoard

Physical Board

8-port10/100MEthernetinterfaceboard (E8T)

Media gateway 8-port 10/100MEthernet InterfaceBoard (ME8T)


The E8Tprovides eightFE interfaces.

32*E1 portTDMinterfaceboard (E32)

Media gateway32*E1 ports TDMinterface board(ME32)

Loadsharing

It is inserted in acommon back slot ofthe SSM-256 frameor the SSM-32frame.No correspondingfront board isrequired.

The ME32provides 32 E1interfaces toextract linesignaling fromCAS such asR2 and CNo.1or insert linesignaling intothem.The MESUprovides 32 E1interfaces toreceive andsend NO.5 linesignaling andregistersignaling.

Media gateway32*E1 interfacecard with Signalingfunction Unit(MESU)

Loadsharing

32*T1 portTDMinterfaceboard (T32)

Media gateway32*T1 ports TDMinterface board(MT32)

Loadsharing


The MT32provides 32 T1interfaces toextract linesignaling fromCAS such asR2 and CNo.1or insert linesignaling intothem.


Media gateway32*T1 interfacecard with Signalingfunction Unit(MTSU)

Loadsharing


The MTSUprovides 32 T1interfaces toreceive andsend NO.5 linesignaling andregistersignaling.



3-11



LogicalBoard

Physical Board

PDHInterfaceElectronicalUnit (PIE)

Media gatewayPDH InterfaceElectronical Unit(MPIE)



The PIEprovides threeE3/T3 PDHelectricalinterfaces.

32-port E1ATMInterfaceCard (EAC)

Media gateway 32-port E1/T1 ATMInterface Card(MEAC)


The EACprovides 32IMA E1interfaces.

32-port T1ATMInterfaceCard (TAC)

Media gateway 32-port T1 ATMInterface Card(MTAC)

Nullbackup In the SSM-256frame or the SSM-32frame, it is inserted ina common back slotof the main controlframe or the serviceframe.A correspondingASU front board isrequired.

The TACprovides 32IMA T1interfaces.

Media Resource Processing Units

Table 3-5 Media resource processing units



LogicalBoard

Physical Board

VoiceProcessingUnit (VPU)

Media gatewayVoice ProcessingUnit B (MVPB)

Loadsharing

It is inserted in acommon front slot ofthe SSM-256 frame.No correspondingback board isrequired.

The VPU workswith the voicesubboards.The VPUprovides thetranscoding andEC functionsfor voiceservice streams.



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LogicalBoard

Physical Board

Media gatewayVoice ProcessingUnit D (MVPD)

The VPUprovidesannouncementplayingresources toimplement thedigit-collectingandannouncement-playingservices.When theMVPD is usedin the SSM-256frame, theframe must beconfigured withthe MTNB.

Loadsharing

It is inserted in acommon front slot ofthe SSM-256 frame orthe SSM-32 frame.No correspondingback board isrequired.

Media gatewayTransCode Unit B(MTCB)

Loadsharing


Media gatewayTransCode Unit D(MTCD)

Loadsharing


EchoCancellationUnit (ECU)

Media gatewayEcho CancellationUnit (MECU)

Loadsharing

The UG01MECU canbe inserted in acommon front slot ofthe SSM-256 frame.The UG02MECU canbe inserted in acommon front slot ofthe SSM-256 frame orthe SSM-32 frame.No correspondingfront board isrequired.

The ECU workswith the voicesubboards.The ECUimplements theEC function forvoice signals.



3-13

Clock Units

Table 3-6 Clock units



LogicalBoard

Physical Board

Clock Unit(CLK)

Media gatewayClock Unit (MCLK)

Master/slave

It is inserted in backslot 0 or 1 of theSSM-256 frame or theSSM-32 frame.No correspondingfront board isrequired.

The CLKprovides clocksignals forservices.The externalinterfacesincludes theclock input/outputinterfaces.

Lightning Protection Units

Table 3-7 Lightning protection units



LogicalBoard

Physical Board

LightingProtectedBoard (LPB)

Media gateway E1Lightning ProtectedBoard (MLPB)

Nullbackup

It is inserted in acommon back slot ofthe SSM-256 frame orthe SSM-32 frame.No correspondingfront board isrequired.

The LPBprovides thelightningprotection forthe outdoor E1trunk cable.

3.2 Matching Limitation of Boards

Matching limitation of boards refers to the matched usage relationship of boards. Only theconfiguration of some boards is involved. When configuring boards of the UMG8900, complywith the matching limitation. Otherwise, the service may be abnormal. Table 3-8 to Table3-11 list the detailed matching limitation.

Table 3-8 Limitation on front and back boards

Item Description

Front boards inSSM-256 frame

MOMU, MMPU, MHRU, MRPU, MIOE, FLU, VPU, ECU, ASU,SPF and MCMF.



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Item Description

Back boards inSSM-256 frame

MNET, CLK, TNU, E8T, E1G, A4L, BLU, E32, T32, PIE, EAC,TAC, S2L, MHRD, PPU and MCMB.

Front boards inSSM-32 frame

MOMB, MMPB, MHRU, MRPU, MIOE, MVPD, UG02ECU,ASU, SPF and MCMF.

Back boards in SSM-32frame

MTNC, CLK, E8T, E1G, E32, T32, A4L, S1L, UG02S2L, PIE,NLU, EAC, TAC, MHRD,MCMB and PPU.

Table 3-9 Limitation on opposite positions

Item Description

In the SSM-256 frame BLU: FLUMOMU/MMPU: MNETASU: A4L, EAC, TACMHRU and MRPU of HRB: E1G, E8T

In the SSM-32 frame MOMB/MMPB: MTNCIn an SSM-32 frame, a front board and the corresponding backboard cannot use the GE bus of the backplane at the same time.

Table 3-10 Limitation on fixed positions

Item Description

In the SSM-256 frame The OMUs can be inserted only in front slots 7 and 8 in the maincontrol frame. The MPUs can be inserted only in front slots 7 and8 in the frames except the main control frame.The NETs can only be inserted in back slots 7 and 8.The TNUs can only be inserted in back slots 6 and 9.The CLKs can be inserted only in back slots 0 and 1 in frames 0and 1.The FLUs and BLUs can be inserted only in frames 0 and 1.



3-15

Item Description

In the SSM-32 frame The OMUs (MOMB) are physically located in front slots 7 and 9in the main control frame, but logically, they need to be configuredin slots 7 and 8.The MPUs (MMPB) are physically located in front slots 7 and 9 inthe service frame, but logically, they need to be configured in slots7 and 8.The TNUs (MTNC) are physically located in back slots 7 and 9 inthe main control frame or service frame, but logically, they need tobe configured in slots 7 and 8.The CLKs, if required, can only be configured in back slots 0 and1 in the main control frame.NOTE

The MOMB, MMPB, and MTNC occupy two slots. Therefore, slots 6 and8 cannot be inserted with other boards if the MOMB, MMPB, or MTNC isused.

Table 3-11 Matching limitation of boards

Item Description

Boards that can be usedwhen the MTNU/TCLU is inserted in theSSM-256 frame

UG01E32, UG01T32, UG01BLU, UG01FLU, UG02BLU,UG02FLU, UG01SPF, UG01HRU, UG02HRU, UG01MS2L,UG01MS2E, UG02S2L, UG02S2E, UG02ECU, UG01VPB,UG02VPB, UG01ASU, UG02ASU

Boards that can be usedwhen the MTNB isinserted in theSSM-256 frame

UG01E32, UG01T32, UG02E32, UG02T32, UG01ESU,UG01TSU, UG01BLU, UG01FLU, UG02BLU, UG02FLU,UG01SPF, UG02SPF, UG03SPF, UG02S2L, UG02S2E,UG02ECU, UG01VPB, UG02VPB, UG01VPD, UG02VPD,UG01HRU, UG02HRU, UG01ASU, UG02ASU

Boards that can be usedwhen the UG01MTNCis inserted in theSSM-32 frame

UG02E32, UG02T32, UG01ESU, UG01TSU, UG02SPF,UG01HRU, UG02HRU, UG01ASU, UG02ASU, UG01S1L,UG01S1E

Boards that can be usedwhen the UG02MTNCis inserted in theSSM-32 frame

UG02E32, UG02T32, UG01ESU, UG01TSU, UG02SPF,UG01HRU, UG02HRU, UG01ASU, UG02ASU, UG02S2L,UG02S2E, UG01S1L, UG01S1E, UG02ECU

NOTE

l The appearance difference of the UG01, UG02 and UG03 is that the silkscreen of the front panel nameof the UG01 is marked with a, or nothing, that of the UG02 is marked with b, and that of the UG03 ismarked with c.

l Run LST BRDARC to query the information of the board to get the version type of the board.

l UG01HRU and UG01ASU can be configured only in frames 0 to 15.



Issue 05 (2009-01-09)

3.3 Connection of BoardsFront and back boards in the service frame are inserted onto the backplane that is in the centerof the frame. In the UMG8900, boards are divided into front boards, back boards and backplanesaccording to their positions.

l The front boards are all 9 U (1 U = 44.45 mm = 1.75 in.) high, including service processingboards, and control and management boards.

l The back boards are all 8 U high, including protocol processing boards and interface boards.l The backplane provides signal interconnection between boards.

Figure 3-1 shows the connections between the boards and backplane buses in the SSM-256frame.

Figure 3-1 Connections between boards and backplane buses in the SSM-256 frame

MBusFEGE

TDMFront

MBusFEGE

TDM

BackCMU

TNU

CLK

PIE

E32

E8T

E1G

P4L

P1H

T32

A4L

BLU

NET

PPU

EAC

TAC

S2L

MPU

VPU

SPF

HRB

OMU

ASU

FLU

CMU

Figure 3-2 shows the connections between the boards and backplane buses in the SSM-32 frame.

Figure 3-2 Connections between boards and backplane buses in the SSM-32 frame

MBusFEGE

TDM

MBusFEGETDM

Back

Front

CMU

TNU

CLK

PIE

E32

E8T

E1G

P4L

P1H

T32

S1L

PPU

A4L

EAC

TAC

VPU

SPF

MPU

OMU

CMU

ASU

HRB

NLU



3-17

NOTE

Figure 3-1 and Figure 3-2 only show the connections between backplane buses and boards, rather thanslots positions. The front boards and back boards are different in height. Therefore, front boards cannot beinserted into the rear backplane or back boards cannot be inserted into the front backplane. Some boardshave to be inserted in fixed slots. For information about board positions, see the specific description ofeach board.

3.4 Signal Streams Between Boards

Gateway Control Signal Streams

The gateway control signals are used to interact with an MGC and control various serviceresources of the media gateway (MGW). For the UMG8900, the gateway control signals workbased on the H.248 protocol.

The SSM-256 single-frame networking is taken as an example. The HRB is used for centralizedforwarding and the independent CMU is used to explain the H.248 message, extract the specificH.248 command and control the boards of the service resource and bearer resource.

Figure 3-3 shows the gateway control signal processing of the UMG8900.

Figure 3-3 Gateway control signal processing

CMU

CMU

FE

E8T

TNU

FE

Back

Front

NET

MGC

FLU

BLU

SPF

MPU

E32

HRB

VPU

The processing path of gateway control signal streams is:

The MGC sends the gateway control signals → IP interface board →HRB→CMU → mediaresource processing board (VPU) → service bearer board TNU/HRB/ASU → CMU (theexecution result returned from the media resource processing board) → HRB → IP interfaceboard →MGC



Issue 05 (2009-01-09)

Call Control Signal Streams

The call control signal stream refers to the call control signaling used in the service connectionprocess. The UMG8900 supports the embedded signaling gateway (SG) to adapt and transferthe call control signaling. The UMG8900 supports the common channel signaling and channelassociated signaling (CAS). The CAS supported by the UMG8900 mainly includes R2, CNo.1,and No.5. The supported common channel signaling includes the SS7, DSSI, and V5 protocol.

The UMG8900 implements the adaptation processing and forwarding from the TDM to IP packetand adopts the SIGTRAN protocol.

The SPF of the UMG8900 implements the adaptation processing of the common channelsignaling. In addition, the SPF parses the messages of the transmission layer at the narrowbandTDM side and implements adaptation at the IP packet side.

The SSM-256 single-frame networking is taken as an example. Suppose that the upstream IPpacket interface provided by the HRB is used to transfer the SS7 signaling based on the M2UAmode.

Figure 3-4 shows the transfer path of the SS7 signaling.

Figure 3-4 Transfer path of SS7 signaling (SSM-256 frame)

E32

HRB

LE/V5AN

FE

TDM

FETDM

Back

Front

MGC

TNU

SPF

VPU

CMU

NET

MPU

CMU

E8T

MGC: media gateway controller LE: local exchange FE: fast Ethernet

TDM: time division multiplexing V5AN: V5 access network

The adaptation and transfer path of the SS7 signaling is:

Narrowband signaling at the TDM side → TDM interface board → TNU → SPF → HRB → IPinterface board → MGC

For the signaling messages from the MGC, the handling process is same; however, the path isreverse.



3-19

Service Bearer Signal Steams

The service signal streams refer to the processing flows for bearer services in the UMG8900.The service signal streams also include the processing flows of service resources in the serviceconnection process.

The SSM-256 single-frame networking in TDM<->IP bearer application is taken as an example.Figure 3-5 shows the processing flow of service bearer data streams.

Figure 3-5 Processing flow for TDM<->IP bearer service flow

E32

E8T

TNU

IP

GE

TDM

GETDM

Back

Front

NET

TDM

HRB

VPU

TDM: time division multiplexing GE: gigabit Ethernet

In the TDM<->IP mode, the processing flow of the service bearer signals is:

l For the signal stream input from the TDM side

Input of TDM signals → TDM interface board → TNU → VPU → HRB → IP interfaceboard →Output of packet signals

l For the data packet input from the IP side

Input of packet signals → IP interface board → HRB → VPU → TNU → TDM interfaceboard → Output of TDM signals

Related explanation is as follows:

l Different bearer services in the packet mode need to be forwarded through the packetswitching network provided by the NET.

l The TDM interface board can be the E32, T32 or S2L. The IP interface board can be theE8T, E1G, P1H or P4L.

l The service flow between the HRB and its back interface board is not transmitted throughthe backplane bus. Instead, the front HRB connects with its back interface board directly.

l The service resource board is the VPU.



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NOTE

This mainly describes the service processing flow in single-frame mode. In multi-frame cascading mode,the cascading boards are used to provide the service processing flow between frames.

Operation and Maintenance Signal StreamsThe operation and maintenance signal streams refer to the processing flows of various operationand maintenance signals during the operation, maintenance and management. The operation andmaintenance signal stream of the UMG8900 includes the OMC signal stream, alarm signalstream, and board-loading signal stream.

The OMC signal stream sent through the LMT is taken as an example. Figure 3-6 shows theprocessing flow of the operation and maintenance signal streams.

Figure 3-6 Processing flow of OMC signals

Ethernet

Service board

Interface board

Resource board

Service board

OMUMaster

OMUSlave

CANLAN (FE)

UMG900host

Operation andmaintenace client

Service board

Service board

Service board

Service board

MPUMaster

MPUSlave

Serviceboard

Interfaceboard

Resourceboard

Resourceboard

MPUMaster

MPUSlave

Main controlframe

Service frame/central switching frame

Controlframe

MAINTAINNMS

WARN TRACE/DEBUG

NMS: network management system WARN: alarm managementsubsystem

MAINTAIN: operation &maintenance subsystem

CAN: control area network TRACE/DEBUG: trace/debugsubsystem



3-21

The processing flow of the OMC signals is:

Service board → MPU in the same frame → OMU in the main control frame → LMT operationand maintenance system/network management system

NOTE

For the service board in the main control frame, the OMC signals are directly reported to the OMU in thesame frame.

The previous part describes the signal streams between boards in sample service flow of theUMG8900. For details on signal streams, see the HUAWEI UMG8900 Universal Media GatewayProduct Description.

3.5 Common Characteristics of Boards

The UMG8900 boards contain maintenance bus (MBus) modules. The MBus module of a serviceboard communicates with the main control board in the same frame through the controller areanetwork (CAN) bus. The main control board is responsible for board version management, statusquery, board power-on/off control, reset, serial port communication, environment monitor, alarmmanagement and so on.

All boards are hot swappable. Each board has a hot pluggable indicator OFFLINE on its frontpanel and a hot swap switch under its ejector lever. When a board is inserted into a frame andthe ejector levers snap in place, the hot swap switch is on. When the ejector levers are removed,the switch is off and the hot swap indicator lights up. This indicates that the board can beremoved.

The power consumption of the board of the UMG8900 turns to heat, that is, the powerconsumption and heat dissipation are in the same level.



Issue 05 (2009-01-09)

4 Equipment Management and MaintenanceUnits

About This Chapter

The equipment management and maintenance units consist of MOMU, MOMB, MMPU, andMMPB.

4.1 MOMUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MOMU.

4.2 MOMBThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MOMB.

4.3 MMPUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MMPU.

4.4 MMPBThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MMPB.

HUAWEI UMG8900Hardware Description 4 Equipment Management and Maintenance Units


4-1

4.1 MOMUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MOMU.

As the management and control center of the whole equipment, the master and slave MOMUsare inserted in front slots 7 and 8 in the main control frame. Their corresponding back boardsare MNETs, which are in back slots 7 and 8. The MOMU can be inserted only in the SSM-256frames.

The board provides the following functions:

l Providing packet switching function at the control plane to communicate with all the boardswith fast Ethernet (FE) control interfaces and to exchange information with other framesand manage interfaces in multi-frame cascading mode

l Monitoring and managing all boards. When multiple frames are cascaded, the MOMUqueries and manages the MMPUs through FE cascading channels. Therefore, it can manageand monitor the boards

l Realizing the management and maintenance functions through the MML interfaces. TheMOMU provides the embedded disk as the BAM, which enables the server/client modewith the local maintenance terminal (LMT). The embedded disk can save logs and alarmfiles

l Implementing state monitoring and power-on/off management through specialmaintenance bus (MBus) modules; avoiding the influence of instant currents by controllingboard power-on sequence

4.1.1 Panel of the MOMU

4.1.2 Indicators on the MOMU

4.1.3 Interfaces on the MOMU

4.1.4 Jumpers on the MOMU

4.1.5 Fusess on the MOMU

4.1.6 Technical specifications of the MOMU

4.1.1 Panel of the MOMU

Figure 4-1 shows the panel of the MOMU.

4 Equipment Management and Maintenance UnitsHUAWEI UMG8900Hardware Description


Issue 05 (2009-01-09)

Figure 4-1 Panel of the MOMU

CPU

JP1

J13

F4 F1

F2

H10

RTC

12

910

12

910

H8

123

LSWABIOS

LSWBBIOS

POWER POWER

FELSWA

FELSWB

CPLD

MBUS CO

M0

OFFLINE

FE0

RESET

MOMU

ACT

RUNALM

MOMU

CAUTIONThe MOMU must be reset before being removed or inserted. Pull the two ejector levers. Then,pull out the board when the indicator is on. Follow the instructions strictly. Otherwise, the BAMfile may be corrupted.In daily maintenance, it is recommended to run RST BRD to reset the boards with reset buttonsto ensure the completeness of BAM information.

The RESET button on the front panel is used to reset the board.

4.1.2 Indicators on the MOMU

Table 4-1 lists the meaning of the indicators on the MOMU.



4-3

Table 4-1 Indicator meaning of the MOMU

Indicator Identification

Color Status Meaning

Runningindicator

RUN Green Always on There is power supply,but the board is faulty.

Always off There is no power supply,or the board is faulty.

Flashing (on for 1second, off foranother second)

The board runs normallyin accordance withconfiguration.

Flashing fast (4times per second)

Software is being loadedto the board, or the boarddoes not run.

Alarmindicator

ALM Red Always on orflashing fast

Alarms occur to theboard.


Workingindicator

ACT Green Flashing The board is in servicesuch as in the master state.

Always off The board is out ofservice such as in theslave state.

Hot-pluggableindicator

OFFLINE Blue Always on The board can beremoved.

Always off The board cannot beremoved at the moment.

4.1.3 Interfaces on the MOMU

CAUTIONCrossover cables are used to directly connect the debug network port and the PC used fordebugging. If the connection is set up through the LAN Switch, straight through cables are used.

Table 4-2 lists the interfaces on the MOMU.



Issue 05 (2009-01-09)

Table 4-2 Interfaces on the MOMU

Category Quantity PhysicalInterface

Function Specification

COM0 1 RJ48 Used as a debugserial port

RS232 serial port

FE0 1 RJ45 Used as a debugnetworkinterface

FE networkinterface

4.1.4 Jumpers on the MOMU

The jumper JP13 is available on the MOMU to choose packet switching modules to load. Table4-3 lists the setting.

Table 4-3 Jumper description of the MOMU

Jumper Name andLocation No.

State Function

Loading selection jumper ofswitching module JP13

Jumper pins 1 and 2 areclosed.

To load switching module 1



4.1.5 Fusess on the MOMU

For details on fuse positions of the MOMU, see 4.1.1 Panel of the MOMU. Table 4-4 lists thespecifications.

Table 4-4 Fuses on the MOMU

No. Function Specification

F1 –48 V power fuse 4 A

F2 MBus 5 V power fuse 1 A


NOTE

If the fuse on the board of the UMG8900 is damaged, replace the board directly.

4.1.6 Technical specifications of the MOMU

Table 4-5 lists the technical specifications of the MOMU.



4-5

Table 4-5 Technical specifications of the MOMU

Category Parameter Specification Remarks

Powerconsumption

N/A 61 W –

Heatdissipation

N/A 61 W

4.2 MOMBThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MOMB.

The MOMB is the operation and maintenance unit of the UMG8900. It is physically located infront slots 7 and 9 in the main control frame; however, it is logically configured in slots 7 and8. Each MOMB occupies two slots and all the MOMBs occupy four slots from slot 6 to slot 9.The MOMBs work in master and slave mode. The MOMB is inserted opposite to the MTNC inpairs. The MOMB can be inserted only in the SSM-32 frame.

The MOMB provides the following functions:

l Monitoring and managing the boards within the frame. The MOMB can be inserted onlyin the main control frame. The MMPB is inserted in the service frame to maintain andmanage boards in the frame. In multi-frame cascading application, the MOMB and theMMPB maintain and manage the whole device through FE cascading channels betweenframes.

l Providing an embedded CF card, which works as the BAM. The CF card and the localmaintenance terminal (LMT) can work in server/client mode. You can manage and maintainthe device through the graphical MML operating interface that is provided by the LMT.The embedded CF card can save logs and alarm files.

l Being embedded with the high performance GE switching net and implements switchingon the broadband service data plane through the backplane.

The MOMB falls into two types: UG01MOMB and UG02MOMB. The UG02MOMB iscompatible with the UG01MOMB. The new functions of the UG02MOMB are as follows:

l Two CMU subboards are added on the UG02MOMB.

l The maintenance bus (Mbus) is added on the UG02MOMB to control the power-on, power-off, and resetting of the CMU subboard.

l The UG02MOMB provides one GE channel for each front slot and back slot and providestwo GE channels respectively for back slots 4, 5, 10, and 11.

CAUTIONl The CMU subboard must be installed on site.

l The CMU subboard cannot be installed on the UG02MOMB when the UG02MOMB andthe UG01MOMB are used at the same time. Therefore, only the function of the UG01MOMBcan be realized.



Issue 05 (2009-01-09)

4.2.1 Panel of the MOMB

4.2.2 Indicators on the MOMB

4.2.3 Interfaces on the MOMB

4.2.4 Fuses on the MOMB

4.2.5 Technical specifications of the MOMB

4.2.1 Panel of the MOMB

Figure 4-2 shows the panel of the UG01MOMB.

Figure 4-2 Panel of the MOMB

CPU

POWERJ6

CPLD

J17

J10

BIOS

RTC

F1

F2

12

910

2 10

FLASH

GE LSW

MBUSJ8

CompactFLASH

MOMB

RESET

CO

M0 F

E0

OFFLINE

ACT

RUNALM

MOMB

Figure 4-3 shows the panel of the UG02MOMB.



4-7

Figure 4-3 Panel of the UG02MOMB

CPU

POWERJ6F1/4A

F2/1A

5338A

GE LSWMBUS

-48V

+5V

5338AJ10

J17

BOOTROM/CPLD

1208JTAG

J21

SCMU1

SCMU2

S1

MOMBb

ACT

RUNALM

MOMBb

FE0

CO

M0

OFFLINE

SCMU

SCMU

J8

CompactFLASH

CAUTIONThe MOMB must be reset before being removed or inserted. Pull the two ejector levers. Then,pull out the board when the indicator is on. Follow the instructions strictly. Otherwise, the BAMfile may be corrupted.


4.2.2 Indicators on the MOMB

Table 4-6 lists the meaning of indicators on the MOMB.



Issue 05 (2009-01-09)

Table 4-6 Indicator meaning of the MOMB



Runningindicator

RUN Green Always on There is power supply, butthe board is faulty.






Alarmindicator


Alarms occur to the board.


Workingindicator

ACT Green Always on orflashing

The board is in servicesuch as in the master state.

Always off The board is out of servicesuch as in the slave state.




4.2.3 Interfaces on the MOMB

Table 4-7 lists the interfaces on the MOMB.

Table 4-7 Interfaces on the MOMB




RS232 serial port


FE networkinterface

4.2.4 Fuses on the MOMB



4-9

For details on fuse positions of the MOMB, see 4.2.1 Panel of the MOMB. Table 4-8 lists thespecifications.

Table 4-8 Fuses on the MOMB




4.2.5 Technical specifications of the MOMB

Table 4-9 and Table 4-10 list the technical specifications of the MOMB.

Table 4-9 Technical specifications of the MOMB


Power consumption N/A 21.7 W –

Heat dissipation N/A 21.7 W

Table 4-10 Technical specifications of the UG02MOMB


Power consumption N/A 35 W -

Heat dissipation N/A 35 W

4.3 MMPUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MMPU.

As the main processing unit, the master and slave MMPUs are inserted in front slots 7 and 8 inthe central switching frame, service frame, and extended control frame. The MMPU is insertedin a slot opposite to the MNET in pairs. The MMPU can be inserted only in SSM-256 frames.

The MMPU provides the following functions:

l Providing switching functions at the FE control plane to exchange control informationbetween all boards with FE control interfaces in the frame, and exchange controlinformation between frames and manage interfaces in multi-frame cascading mode

l Monitoring and managing boards within the frame

l Implementing state monitoring and power-on/off management through specialmaintenance bus (MBus) modules; avoiding the influence of instant currents by controllingboard power-on sequence

4.3.1 Panel of the MMPU

4.3.2 Indicators on the MMPU



Issue 05 (2009-01-09)

4.3.3 Interfaces on the MMPU

4.3.4 Jumpers on the MMPU

4.3.5 Fuses on the MMPU

4.3.6 Technical specifications of the MMPU

4.3.1 Panel of the MMPU

Figure 4-4 shows the panel of the MMPU.

Figure 4-4 Panel of the MMPU

CPU

JP1

J13

F4 F1

F2

H10

RTC

12

910

12

910

H8

123

LSWABIOS

LSWBBIOS

POWER POWER

FELSWA

FELSWB

CPLD

MBUS CO

M0

OFFLINE

FE0

RESET

MMPU

ACT

RUNALM

MMPU


4.3.2 Indicators on the MMPU

Table 4-11 lists the meaning of the indicators on the MMPU.



4-11

Table 4-11 Indicator meaning of the MMPU



Runningindicator


Always off There is no powersupply, or the board isfaulty.





Alarmindicator




Workingindicator


The board is in servicesuch as in the masterstate.





4.3.3 Interfaces on the MMPU

Table 4-12 lists the interfaces on the MMPU.

Table 4-12 Interfaces on the MMPU




RS232 serial port


FE networkinterface



Issue 05 (2009-01-09)

4.3.4 Jumpers on the MMPU

The jumper JP13 is available on the MMPU to choose packet switching modules to load. Table4-13 lists the setting.

Table 4-13 Jumper description of the MMPU


State Function






4.3.5 Fuses on the MMPU

For details on fuse positions of the MMPU, see 4.3.1 Panel of the MMPU. Table 4-14 lists thespecifications.

Table 4-14 Fuses on the MMPU





4.3.6 Technical specifications of the MMPU

Table 4-15 lists the technical specifications of the MMPU.

Table 4-15 Technical specifications of the MMPU


Power consumption N/A 60 W –


4.4 MMPBThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MMPB.

The MMPB is the main processing unit of the UMG8900. It is physically inserted in front slots7 and 9 in the service frame; however, it is logically configured in slots 7 and 8. The MMPBcan be inserted only in the SSM-32 frame. Each board occupies two slots and all the boards



4-13

occupy slots 6 to 9. They work in master and slave mode. The MMPB is inserted in the slotopposite to the MTNC in pairs.

The MMPB provides the following functions:

l Being embedded with the high performance GE switch net, the MMPB implementsswitching on the broadband service data plane through the backplane

The MMPB falls into two types: UG01MMPB and UG02MMPB. The UG02MMPB iscompatible with the UG01MMPB. The new functions of the UG02MMPB are as follows:

l Two CMU subboards are added to realize the service processing function with highperformance.

l The maintenance bus (MBus) is added on the UG02MMPB to control the power-on, power-off, and resetting of the CMU subboard.

l The UG02MMPB provides one GE channel for each front slot and back slot and providestwo GE channels respectively for back slots 4, 5, 10, and 11.

CAUTIONl The CMU subboard must be installed on site.

l The CMU subboard cannot be installed on the UG02MMPB when the UG02MMPB and theUG01MMPB are used at the same time. Therefore, only the function of the UG01MMPBcan be realized.

4.4.1 Panel of the MMPB

4.4.2 Indicators on the MMPB

4.4.3 Interfaces on the MMPB

4.4.4 Fuses on the MMPB

4.4.5 Technical specifications of the MMPB

4.4.1 Panel of the MMPB

Figure 4-5 shows the panel of the MMPB.



Issue 05 (2009-01-09)

Figure 4-5 Panel of the MMPB

MBUS

CPU

POWERJ6

CPLD

J17

J10

F1

F2

12

910

2 10

FLASH

GELSWA

GELSWB

BIOS

RTC

J8

MMPB

RESET

CO

M0 F

E0

OFFLINE

ACT

RUNALM

MMPB

Figure 4-6 shows the panel of the UG02MMPB.



4-15

Figure 4-6 Panel of the UG02MMPB

CPU

POWERJ6F1/4A

F2/1A

5338A

GE LSWMBUS

-48V

+5V

5338AJ10

J17

BOOTROM/CPLD

1208JTAG

J21

SCMU1

SCMU2

S1

MMPBb

ACT

RUNALM

MMPBb

FE0

CO

M0

OFFLINE

SCMU

SCMU

4.4.2 Indicators on the MMPB

Table 4-16 lists the meaning of the indicators on the MMPB.

Table 4-16 Indicator meaning of the MMPB



Runningindicator




The board runs normally inaccordance withconfiguration.


Software is being loaded tothe board, or the boarddoes not run.



Issue 05 (2009-01-09)



Alarmindicator




Workingindicator




OFFLINE Blue Always on The board can be removed.


4.4.3 Interfaces on the MMPB

Table 4-17 lists the interfaces on the MMPB.

Table 4-17 Interfaces on the MMPB




RS232 serial port


FE networkinterface

4.4.4 Fuses on the MMPB

For details on fuse positions of the MMPB, see 4.4.1 Panel of the MMPB. Table 4-18 lists thespecifications.

Table 4-18 Fuses on the MMPB




4.4.5 Technical specifications of the MMPB

Table 4-19 and Table 4-20 list the technical specifications of the MMPB.



4-17

Table 4-19 Technical specifications of the MMPB


Powerconsumption

N/A 19.6 W –


Table 4-20 Technical specifications of the UG02MMPB


Powerconsumption

N/A 33 W -




Issue 05 (2009-01-09)

5 IP and TDM Switching Units

About This Chapter

The IP and TDM switching units consist of MNET, MTNU, TCLU, MTNB, and MTNC.

5.1 MNETThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MNET.

5.2 MTNUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MTNU.

5.3 TCLUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the TCLU.

5.4 MTNBThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MTNB.

5.5 MTNCThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MTNC.

HUAWEI UMG8900Hardware Description 5 IP and TDM Switching Units


5-1

5.1 MNETThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MNET.

As the packet switching unit of the UMG8900, the master and slave MNETs are inserted in backslots 7 and 8 in the frame. The MNET can be inserted only in SSM-256 frames.

The MNET provides the following functions:

l Providing packet service switching channels in a frame to exchange service data betweenpacket service boards in the frame

l Cascading two frames to realize the cascading function between frames. The embeddedcascading module in the board enables interworking of 2 x GE service data planes andinterworking of 2 x FE service control planes

l Providing service control and maintenance interfaces for the corresponding front boardssuch as the MOMU or the MMPU to meet back cabling requirement

l Receiving clock signals from the MCLK, and sending them to TDM service processingboards after phase lock, signal driving and distributingThe internal clocks synthesized and distributed by the MNET are as follows:– 32.768 MHz clock: TDM HW synchronous clock signals for the TDM bearer processing

– 38.88 MHz clock: TDM SDH synchronous clock, including the synchronous clockrequired by the ATM and POS services in the SDH transmission mode

– 2 kHz clock: TDM SDH frame clock

The TNU, E32, T32, S2L, S1L, TCU, BLU, SPF and ECU use 32.768 MHz, 38.88 MHzand 2 kHz clock signals. The A4L and P1H only use the 38.88 MHz clock signal.For details on system clock, see the HUAWEI UMG8900 Universal Media GatewayProduct Description.

The MNET falls into two types: the UG01MNET and UG02MNET. The difference betweenthem is as follows:

l The UG01MNET provides 16 GE cascading capacity, and the UG02MNET provides 24GE cascading capacity.

l The FE interfaces on the UG01MNET board include FE0 and FE1. The FE interfaces onthe UG02MNET board include FE0, FE1&FE2, and FE3&FE4. The function of FE0interface is same as that on the UG01MNET. FE1&FE2 and FE3&FE4 interfaces arecascading network interfaces which can provide four cascading network interfaces byextended network cables.

5.1.1 Panel of the MNET

5.1.2 Indicators on the MNET

5.1.3 Interfaces on the MNET

5.1.4 Fuses on the MNET

5.1.5 Technical specifications of the MNET

5.1.1 Panel of the MNET

5 IP and TDM Switching UnitsHUAWEI UMG8900Hardware Description


Issue 05 (2009-01-09)

Figure 5-1 shows the panel of the UG01MNET.

Figure 5-1 Panel of the UG01MNET

SwitchingModule

U23

F1F2

CPLDU22

H3

H4

J11

H2

POWER

CPUMBus

OFFLINE

OM

CM

IRFE

0FE

1

ACT LINK

TX0

RX0

ACT LINK

TX1

RX1

CO

M0

CLK

0_IN

CLK

1_IN

MNET

ACT

RUNALM

MNET

Figure 5-2 shows the panel of the UG02MNET.



5-3

Figure 5-2 Panel of the UG02MNET

J22

POWER JTAG

F1/4AF2/1A

J23

CPU

SwitchingModule

J25

FE SWITCH

CPLDU5

CPLDU4

SwitchingModule

POWER

CPU MBUS

OFFLINE

OM

CM

IRFE

0FE

3&FE

4

ACT LINK

TX0

RX0

ACT LINK

TX1

RX1

CO

M0

CLK

0_IN

CLK

1_IN

MNET

ACT

RUNALM

FE1&

FE2

FE2

FE4

12

MNET

1. FE1&FE2 interface 2. FE3&FE4 interface

NOTE

The new indicators on panel of the UG02MNET indicate the ACT state and LINK state of FE2 and FE4interfaces.

5.1.2 Indicators on the MNET

Table 5-1 lists the meaning of the indicators on the MNET.

Table 5-1 Indicator meaning of the MNET



Runningindicator




Issue 05 (2009-01-09)








Alarmindicator




Workingindicator

ACT Green Flashing The board is in servicesuch as in the masterstate.


Optical fiberconnectionstate indicator

LINK Green Always on The received opticalpower meets therequirement.

Always off The received opticalpower does not meet therequirement.

Master opticalchannelindicator

ACT Orange Always on orflashing

The optical channel thatcorresponds to the opticalmodule is in the masterstate.

Always off The optical channel thatcorresponds to the opticalmodule is in the slavestate.




The indicators of CLK0_IN and CLK1_IN interfaces on the panel of the MNET have nosilkscreen. Table 5-2 lists the meaning.



5-5

Table 5-2 Indicator meaning of clock interfaces on the MNET

Indicator Color Status Meaning

CLK0_IN Orange Always on The MNET provides master clock for theframe where it is located.

Always off The MNET does not provide clock forany frame, but it is in hot backup mode.

Green Always on The MNET receives normal clock signalsfrom the CLK in slot 0 through thebackplane or clock cable.

Always off The MNET receives abnormal clocksignals from the CLK in slot 0 through thebackplane or clock cable.

CLK1_IN Orange Always on The interface on the panel of the MNETextracts clock signals from clockdistribution cable normally.

Always off The MNET extracts clock signals fromthe backplane.



5.1.3 Interfaces on the MNET

Table 5-3 lists the interfaces on the MNET.

Table 5-3 Interfaces on the MNET

Category Quantity

PhysicalInterface


COM0 1 RJ48 Used as a debug serial port RS232 serialport



Issue 05 (2009-01-09)

Category Quantity

PhysicalInterface


OMC 1 RJ45 The OMC interface on theMNET in the main controlframe is used to connectnetwork management systemand the LMT to manage andmaintain the equipment.The OMC interfaces on theMNETs in other frames canbe configured as centralizedforwarding interfaces.

FE networkinterface

MIR 1 RJ45 Mirroring network interfaceof FE channels

FE networkinterface

FE0 1 RJ45 The FE0 in the centralswitching frame is used tocascade the extended controlframe.The FE0 in the main controlframe is used to cascade theSIWF frame.The FE0 interfaces in otherframes are not used currently.

FE networkinterface

FE1 1 RJ45 Used to cascade FE channelsbetween frames

FE networkinterface

FE1&FE2 1 RJ45 Used to cascade FE channelsbetween frames

FE networkinterface

FE3&FE4 1 RJ45 Used to cascade FE channelsbetween frames

FE networkinterface

CLK0_IN 1 RJ45 Used to receive clock signalsfrom master/slave CLKboards

RS422

CLK1_IN 1 RJ45 Used to receive clock signalsfrom master/slave CLKboards

RS422

Cascadingpacketopticalinterface(includingRX0, RX1,TX0 andTX1)

2 LC Used to cascade GE dataplanes Used to connect theMNET, MBLU, or MNLU inother frames.

Multi-modeoptical module



5-7

NOTE

FE1&FE2 and FE3&FE4 interfaces are new FE cascading interfaces on the UG02MNET. They can providefour cascading interfaces by extended cascading network cables.

5.1.4 Fuses on the MNET

For details on fuse positions of the MNET, see 5.1.1 Panel of the MNET. Table 5-4 lists thespecifications.

Table 5-4 Fuses on the MNET




5.1.5 Technical specifications of the MNET

Table 5-5 lists the technical specifications of the MNET.

Table 5-5 Technical specifications of the MNET


Optical module Transmissiondistance

500 m [0.3 mi.] UG02MNET

Mode multi-mode

Wavelength 850 nm

Output opticalpower

–9.5 dBm to –2.5 dBm

Maximumreceivesensitivity

–17.0 dBm

Saturationoptical power

0 dBm

Opticalinterface speed

2.125 Gbit/s series



NOTE

The receiving power of the optical module must be larger than the maximum receive sensitivity and lessthan the saturation optical power. Insufficient receiving power may cause bit errors, which destabilizes theservice. Excessive receiving power may cause damage to optical modules.



Issue 05 (2009-01-09)

5.2 MTNUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MTNU.

As the time division multiplex (TDM) central switching unit of the UMG8900, the MTNU isinserted in the main control frame in single-frame or two-frame cascading application, or isinserted in the central switching frame in multi-frame cascading application. The master andslave MTNUs are inserted in back slots 6 and 9. The MTNU can be inserted only in the SSM-256frame.

The MTNU provides the following functions:

l Providing 8 K switching capacity for each interface board, and establishing and releasingTDM timeslots in conjunction with TDM service interface boards

l Connecting with the UG01MBLU or TCLU through multi-mode optical fibers, andproviding 24 K cascading capacity

5.2.1 Panel of the MTNU

5.2.2 Indicators on the MTNU

5.2.3 Interfaces on the MTNU

5.2.4 Fuses on the MTNU

5.2.5 Technical specifications of the MTNU

5.2.1 Panel of the MTNU

Figure 5-3 shows the panel of the MTNU.



5-9

Figure 5-3 Panel of the MTNU

J4

J9J8

J7

J11

Cascading

F2

F1

Module

POWER

SwitchingModule

POWER

FPGA

MBus

BridgeModule

CPU

ETH

J2

OFFLINE

ACT

RUNALM

CO

M0

MTNU

ACTLIN

K

TX0

RX0

ACTLIN

K

TX1

RX1

ACTLIN

K

TX2

RX2

MTNU

5.2.2 Indicators on the MTNU

Table 5-6 lists the meaning of the indicators on the MTNU.

Table 5-6 Indicator meaning of the MTNU



Runningindicator




The board runsnormally inaccordance withconfiguration.



Issue 05 (2009-01-09)



Flashing fast (4 timesper second)

Software is beingloaded to the board, orthe board does not run.

Alarmindicator




Workingindicator




LINK Green Always on The line is in thesynchronous state andthe optical powermeets the requirement.

Always off The line is in theasynchronous state andthe optical power doesnot meet therequirement.



The optical channelthat corresponds to theoptical module is in themaster state.

Always off The optical channelthat corresponds to theoptical module is in theslave state.



Always off The board cannot beremoved at themoment.

5.2.3 Interfaces on the MTNU

Table 5-7 lists the interfaces on the MTNU.



5-11

Table 5-7 Interfaces on the MTNU



COM0 1 RJ48 Used as a debug serialport

RS232 serial port

Cascadingopticalinterface

3 LC Providing 24 Kcascading channels

Multi-modeoptical interface

5.2.4 Fuses on the MTNU

For details on fuse positions of the MTNU, see 5.2.1 Panel of the MTNU. Table 5-8 lists thespecifications.

Table 5-8 Fuses on the MTNU




5.2.5 Technical specifications of the MTNU

Table 5-9 lists the technical specifications of the MTNU.

Table 5-9 Technical specifications of the MTNU


Optical module Wavelength 850 nm –

Transmission distance 500 m [0.3 mi.]

TDM switchingnetwork

Switching capacity 256 K timeslots

Cascading capacity 24 K timeslots

Optical interface speed 960 Mbit/s

Powerconsumption

N/A < 45 W

Heat dissipation N/A < 45 W

5.3 TCLUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the TCLU.



Issue 05 (2009-01-09)

The TCLU is the time division multiplex (TDM) convergence and link unit of the UMG8900.Working in master and slave mode, the TCLUs are inserted in back slots 6 and 9. In two-framecascading application, they are inserted in the service frame. In multi-frame cascadingapplication, they are inserted in the main control frame or the service frame. The TCLUs can beinserted only in SSM-256 frames.

The TCLU provides the following functions:

l Providing 8 K timeslot switching capacity for each interface board. Establishing andreleasing TDM timeslots in conjunction with TDM service interface boards under thecontrol of the MTNU

l Connecting with the UG01MBLU or MTNU through multi-mode optical fibers, andproviding 24 K timeslot cascading capacity

5.3.1 Panel of the TCLU5.3.2 Indicators on the TCLU5.3.3 Interfaces on the TCLU5.3.4 Fuses on the TCLU5.3.5 Technical specifications of the TCLU

5.3.1 Panel of the TCLU

Figure 5-4 shows the panel of the TCLU.

Figure 5-4 Panel of the TCLU

OFFLINE

ACT

RUNALM

CO

M0

TCLU

ACTLIN

K

TX0

RX0

ACTLIN

K

TX1

RX1

ACTLIN

K

TX2

RX2

TCLU

BridgeModule

SwitchingModule

FPGA

J4

J9J8

J7

J11

Cascading

F2

F1

Module

MBus

Power Power

CPU



5-13

5.3.2 Indicators on the TCLU

Table 5-10 lists the indicator meaning of the TCLU.

Table 5-10 Indicator meaning of the TCLU



Runningindicator




The board runsnormally in accordancewith configuration.



Alarmindicator

ALM Red Always on or flashingfast



Workingindicator

ACT Green Always on or flashing The board is in servicesuch as in the masterstate.



LINK Green Always on The line is in thesynchronous state andthe optical power meetsthe requirement.



ACT Orange Always on or flashing The optical channel thatcorresponds to theoptical module is in themaster state.



Issue 05 (2009-01-09)



Always off The optical channel thatcorresponds to theoptical module is in theslave state.




5.3.3 Interfaces on the TCLU

Table 5-11 lists the interfaces on the TCLU.

Table 5-11 Interfaces on the TCLU




RS232 serialport




5.3.4 Fuses on the TCLU

For details on fuse positions of the TCLU, see 5.3.1 Panel of the TCLU. Table 5-12 lists thespecifications.

Table 5-12 Fuses on the TCLU




5.3.5 Technical specifications of the TCLU

Table 5-13 lists the technical specifications of the TCLU.



5-15

Table 5-13 Technical specifications of the TCLU


Optical module Wavelength 850 nm –

Transmission distance 500 m [0.3 mi.]





Powerconsumption

N/A < 45 W

Heat dissipation N/A < 45 W

5.4 MTNBThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MTNB.

As the TDM central switching unit of the UMG8900, the master and slave MTNBs are insertedin back slots 6 and 9 in the main control frame, central switching frame or service frame. TheMTNB can be inserted only in SSM-256 frames.

The MTNB provides the following functions:

l Providing 8 K or 2 K or 1 K switching capacity for each interface board, establishing andreleasing TDM timeslots in conjunction with TDM service interface boards

l Connecting with the MTNB in other frames directly or through the UG02MBLU withmulti-mode optical fibers, and providing 32 K timeslot cascading capacity

l Managing and maintaining the boards through dedicated maintenance bus (MBus) module;reporting the status and version of the boards to the main control board of the same frame;communicating with the main control board of the frame through the FE interface

5.4.1 Panel of the MTNB

5.4.2 Indicators on the MTNB

5.4.3 Interfaces on the MTNB

5.4.4 Fuses on the MTNB

5.4.5 Technical specifications of the MTNB

5.4.1 Panel of the MTNB

Figure 5-5 shows the panel of the MTNB.



Issue 05 (2009-01-09)

Figure 5-5 Panel of the MTNB

J4

J9J8

J7

J11

Cascading

F2

F1

Module

POWER

SwitchingModule

POWER

FPGA

MBus

BridgeModule

CPU

ETHOFFLINE

MTNB

ACT LINK

RX0

TX0

ACTLIN

K

RX1

TX1

ACTLIN

K

RX2

TX2

ACTLIN

K

RX3

TX3

CO

M0

ACT

RUNALM

MTNB

5.4.2 Indicators on the MTNB

Table 5-14 lists the meaning of the indicators on the MTNB.

Table 5-14 Indicator meaning of the MTNB



Runningindicator



Flashing (on for 1second, off for anothersecond)




5-17





Alarmindicator




Workingindicator












5.4.3 Interfaces on the MTNB

Table 5-15 lists the interfaces on the MTNB.



Issue 05 (2009-01-09)

Table 5-15 Interfaces on the MTNB




RS232 serial port




5.4.4 Fuses on the MTNB

For details on fuse positions of the MTNB, see 5.4.1 Panel of the MTNB. Table 5-16 lists thespecifications.

Table 5-16 Fuses on the MTNB




5.4.5 Technical specifications of the MTNB

Table 5-17 lists the technical specifications of the MTNB.

Table 5-17 Technical specifications of the MTNB


Opticalmodule

Transmission distance 500 m [0.3 mi.] –

Mode multi-mode

Wavelength 850 nm

Output optical power –9.5 dBm to –2.5 dBm

Maximum receivesensitivity

–17.0 dBm

Saturation optical power 0 dBm

Optical interface speed 2.125 Gbit/s series

TDMswitchingnetwork






5-19


Powerconsumption

N/A 49 W

Heatdissipation

N/A 49 W

NOTE


5.5 MTNCThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MTNC.

The MTNC is the TDM central switching unit of the UMG8900. The master and slaveMTNCs are physically inserted in back slots 7 and 9 in the main control frame and the serviceframe; however, they are logically configured in slots 7 and 8. Each MTNC occupies two slotsand all the MTNCs occupy slots 6 to 9. The MTNC can only be used in the SSM-32 frame.

The MTNC provides the following functions:

l The MTNC can manage the TDM service switching. The MTNC is the TDM serviceswitching unit. It provides 32 K timeslot switching capability and provides 1 K or 2 Kswitching capacity for each interface board.The UG02MTNC provides 96 K timeslotswitching capacity and provides 1 K, 2 K, or 4 K switching capacity for each TDM interface.The UG02MTNC supports the UG02MS2L and UG02MECU.

l The UG01MTNC2 provides one TDM cascading link and the UG01MTNC5 provides twoTDM cascading links. If the TS1C, TS2C, or TS4C subboard is installed on theUG02MTNC, the UG02MTNC can respectively provide one, two, or four TDM cascadinglinks. The interfaces connect with the corresponding frames through the optical fibers. Eachcascading interface provides 8 K timeslot switching capacity.

l The MTNC is the switching center of the control plane, exchanging the message amongall boards in the control plane.

l The MTNC provides three FE cascading links, exchanging the control message betweenframes.

l The MTNC provides 8 KHz stratum-3 clock through the stratum-3 clock subboard.

l The MTNC receives 16 KHz stratum-2 clock provided by the stratum-2 clock board andgenerates the clock required by the system.

l The MTNC can deliver 8 KHz clock through the cascading path between frames, deliveringthe system clock.

l The MTNC provides device management function. Besides the communication with all theboards through the control plane, the MTNC can also implement board informationmaintenance, power-on management and exceptional situations handling through theindependent MBus maintenance path.

The MTNC falls into two types: UG01MTNC and UG02MTNC. The UG02MTNC is compatiblewith the UG01MTNC. When the UG02MTNC and the UG01MTNC are used at the same time,



Issue 05 (2009-01-09)

all the functions of the UG01MTNC can be realized. When the UG02MTNC and theUG02MTNC are used at the same time, 96 K TDM switching capacity and a maximum of 4 x8 K TDM cascading capacity are available. Other functions are the same as those of theUG01MTNC. The silkscreen on the panel of the UG02MTNC is MTNCb.

The UG01MTNC falls into two types: UG01MTNC2 and UG01MTNC5. The differencebetween two types is that the UG01MTNC2 provides one TDM cascading optical port and theUG01MTNC5 provides two TDM cascading optical ports.

The UG02MTNC contains the UG02MTNC1, UG02MTNC2, and UG02MTNC4 and theyprovide one, two, and four TDM cascading ports respectively.

5.5.1 Panel of the MTNC5.5.2 Indicators on the MTNC5.5.3 Interfaces on the MTNC5.5.4 Fuses on the MTNC5.5.5 Technical specifications of the MTNC5.5.6 MTNC Subboards

5.5.1 Panel of the MTNC

Figure 5-6 shows the panel of the UG01MTNC5.

Figure 5-6 Panel of the MTNC (UG01MTNC5)

J18 J3

J2

F1

F2F3

Power Power

Cascading Module

FEInterface

LANSW

LANSW

LANSW LANSW

FPGA

CPU

CLKModul

MBUS

MTNC

ACT

RUNALM

ACT LINK

TX0

RX0

ACT LINK

TX1

RX1

2M_I

N2M

_OU

T

8K_I

N1

FE2

FE0

OM

C

8K_I

N2

FE3

FE1

MC

OFFLINE

CO

M0

FE4

MTNC



5-21

Figure 5-7 shows the panel of the UG02MTNC4.

Figure 5-7 Panel of the UG02MTNC4

J18 J3

J2

F1

F2F3

Power Power

Cascading Module

FEInterface

LANSW

LANSW

LANSW LANSW

FPGA

CPU

CLKModul

MBUS

MTNCb

ACT

RUNALM

2M_I

N2M

_O

UT

8K_I

N1

FE2

FE0

OM

C

8K_I

N2

FE3

FE1

MC

OFFLINE

CO

M0

FE4

MTNCb

ACT LINK

TX0

RX0

ACT LINK

TX1

RX1

ACT LINK

TX2

RX2

ACT LINK

TX3

RX3

5.5.2 Indicators on the MTNC

Table 5-18 lists the meaning of the indicators on the MTNC.

Table 5-18 Indicator meaning of the MTNC



Runningindicator





Issue 05 (2009-01-09)







Alarmindicator




Workingindicator







LINK Green Always on Optical fiberconnection is normal.

Always off Optical fiberconnection isabnormal.


ACT Orange Always on or flashing The optical channelthat corresponds to theoptical module is in themaster state.


5.5.3 Interfaces on the MTNC

Table 5-19 lists the interfaces on the MTNC.



5-23

Table 5-19 Interfaces on the MTNC




RS232 serial port


4, 2 or 1 LC Providing 4 x 8 K, 2 x8 K or 1 x 8 Kcascading capacity

Multi-mode

2M_OUT 1 SMB maleconnector

2 M BITS clock outputinterface

2 Mbit/s or 2 MHz

2M_IN 1 SMB maleconnector

2 M BITS clock outputinterface

2 Mbit/s or 2 MHz

OMC 1 RJ45 Providing networkmanagement interface,and serving ascentralized forwardinginterface

FE networkinterface

MC 1 RJ45 Connecting with themedia gatewaycontroller (MGC)

FE networkinterface

FE0 1 RJ45 IWF network interface,or cascading interface

FE networkinterface

FE1 to FE3 3 RJ45 FE cascading networkinterface

FE networkinterface

FE4 1 RJ45 FE debug networkinterface

FE networkinterface

8K_IN1 1 RJ45 Input interface for 8 Kline synchronousmaster clock

RS422

8K_IN2 1 RJ45 Input interface for 8 Kline synchronous slaveclock

RS422

5.5.4 Fuses on the MTNC

For details on fuse positions of the MTNC, see Figure 5-6. Table 5-20 lists the specifications.

Table 5-20 Fuses on the MTNC





Issue 05 (2009-01-09)




5.5.5 Technical specifications of the MTNC

Table 5-21 lists the technical specifications of the UG01MTNC.

Table 5-21 Technical specifications of the UG01MTNC



Switchingcapacity

32 K timeslots –

Cascadingcapacity

3 x 8 K timeslots

Optical interfacespeed

960 Mbit/s

Powerconsumption

N/A 38.9 W UG01MTNC2

45.3 W UG01MTNC5

Heat dissipation N/A 38.9 W UG01MTNC2

45.3 W UG01MTNC5

Table 5-22 lists the technical specifications of the UG02MTNC.

Table 5-22 Technical specifications of the UG02MTNC



Switchingcapacity

96 K timeslots -

Cascadingcapacity

4 x 8 K, 2 x 8 K, or 1 x 8 Ktimeslots


960 Mbit/s

Powerconsumption

N/A 65.1 W UG02MTNC1

67.2 W UG02MTNC2

70.9 W UG02MTNC4

Heat dissipation N/A 65.1 W UG02MTNC1

67.2 W UG02MTNC2



5-25


70.9 W UG02MTNC4

5.5.6 MTNC Subboards

UG01MTNC Subboards

The TLDA subboard provides one TDM cascading channel for the UG01MTNC2. The TLDBsubboard provides two TDM cascading channels for the UG01MTNC5. The cascading capacityfor each channel is 8 K timeslots. The interfaces are connected with the corresponding framesthrough optical fibers.

Table 5-23 lists the indicator meaning of the TLDA/TLDB subboards.

Table 5-23 Indicator meaning of the TLDA/TLDB



Workingindicator

ACT Orange Always onor flashing

The optical interface is in themaster state.

Always off The optical interface is in theslave state.


LINK Green Always on Connection established

Always off Connection not established

Table 5-24 lists the technical specifications of the TLDA/TLDB subboards.

Table 5-24 Technical specifications of the TLDA/TLDB subboards


Opticalmodule

Physical type LC –

Wavelength 850 nm –

Output opticalpower

–9.5 dBm to –4.0 dBm –


–17.0 dBm –

Transmissiondistance

550 m [0.3 mi.] 50 um optical fiber

275 m [0.2 mi.] 62.5 um optical fiber

Powerconsumption

N/A 6.4 W –



Issue 05 (2009-01-09)


Heatdissipation

N/A 6.4 W

UG02MTNC SubboardsThe UG02MTNC provides a maximum of 4 x 8 K time division multiplex (TDM) cascadingcapability. The TS1C subboard provides 1 x 8 K TDM cascading capability. The TS2C subboardprovides 2 x 8 K TDM cascading capability. The TS4C subboard provides 4 x 8 K TDMcascading capability.

The meaning of the indicators of the TS1C/TS2C/TS4C subboards is the same as that of theTLDA/TLDB subboards. Refer to Table 5-23.

The technical specifications of the optical interfaces of the TS1C/TS2C/TS4C subboards are thesame as those of the TLDA/TLDB subboards. Refer to Table 5-24.

Table 5-25 lists the power consumption of the TS1C/TS2C/TS4C subboards.

Table 5-25 Power consumption of the TS1C/TS2C/TS4C subboards

Subboard Power Consumption Heat Dissipation

TS1C 22.9 W 22.9 W

TS2C 24.3 W 24.3 W

TS4C 27 W 27 W



5-27

6 Resource and Management Units

About This Chapter

The resource and management units consist of MCMF, MCMB, and MPPB.

6.1 MCMF

6.2 MCMB

6.3 SCMUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the SCMU.

6.4 MPPBThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MPPB.

HUAWEI UMG8900Hardware Description 6 Resource and Management Units


6-1

6.1 MCMFAs the connection maintenance unit, the master and slave MCMFs are inserted in front slots 0to 5 and slots 10 to 15 in the main control frame, service frame or extended control frame. Theboards in slots 0 and 1, 2 and 3, 4 and 5, 10 and 11, 12 and 13, and 14 and 15 are in master andslave mode. The MCMF can be inserted in both SSM-256 frames and SSM-32 frames.

The MCMF provides the following functions:

l The MCMF works with packet service boards, TDM service boards and service resourceboards to implement service bearer conversion and service stream formats conversion. Itreturns the result to the media gateway controller (MGC) in the form of H.248 message.

6.1.1 Panel of the MCMF6.1.2 Indicators on the MCMF6.1.3 Interfaces on the MCMF6.1.4 Fuses on the MCMF6.1.5 Technical specifications of the MCMF

6.1.1 Panel of the MCMF

Figure 6-1 shows the panel of the MCMF.

Figure 6-1 Panel of the MCMF

J5

J9

U2

F61

F15

U3

J8

MBUSPOWER

CPU

BridgeUnit

2 10

1 92 10

1 9

CO

M0

OFFLINE

MCMF

RESET

ACT

RUNALM

MCMF

6 Resource and Management UnitsHUAWEI UMG8900Hardware Description


Issue 05 (2009-01-09)


6.1.2 Indicators on the MCMF

Table 6-1 lists the meaning of the indicators on the MCMF.

Table 6-1 Indicator meaning of the MCMF



Runningindicator







Alarmindicator




Workingindicator






6.1.3 Interfaces on the MCMF

Table 6-2 lists the interfaces on the MCMF.



6-3

Table 6-2 Interfaces on the MCMF




RS232 serialport

6.1.4 Fuses on the MCMF

For details on fuse positions of the MCMF, see 6.1.1 Panel of the MCMF. Table 6-3 lists thespecifications.

Table 6-3 Fuses on the MCMF




6.1.5 Technical specifications of the MCMF

Table 6-4 lists the technical specifications of the MCMF.

Table 6-4 Technical specifications of the MCMF


Powerconsumption

N/A 14.8 W –


Serviceprocessingcapability

Number of the H.248 links

Up to 64 links on each board and128 links in the system

-

6.2 MCMB

As the connection maintenance unit, the master and slave MCMBs are inserted in back slots 2to 5 and slots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in theservice frame or extended control frame. The boards in slots 0 and 1, 2 and 3, 4 and 5, 10 and11, 12 and 13, and 14 and 15 are in master and slave mode. The MCMB can be inserted in bothSSM-256 frames and SSM-32 frames.

The MCMB provides the following functions:



Issue 05 (2009-01-09)

l The MCMF works with packet service boards, TDM service boards and service resourceboards to implement service bearer conversion and service stream formats conversion. Itreturns the result to the media gateway controller (MGC) in the form of H.248 message.

6.2.1 Panel of the MCMB

6.2.2 Indicators on the MCMB

6.2.3 Interfaces on the MCMB

6.2.4 Fuses on the MCMB

6.2.5 Technical specifications of the MCMB

6.2.1 Panel of the MCMB

Figure 6-2 shows the panel of the MCMB.

Figure 6-2 Panel of the MCMB

OFFLINE

CO

M0

MCMB

RESET

ACT

RUNALM

MCMB

MBUS

POWER

CPU

F61

F15

J10


6.2.2 Indicators on the MCMB

Table 6-5 lists the meaning of the indicators on the MCMB.



6-5

Table 6-5 Indicator meaning of the MCMB



Runningindicator







Alarmindicator




Workingindicator







6.2.3 Interfaces on the MCMB

Table 6-6 lists the interfaces on the MCMB.

Table 6-6 Interfaces on the MCMB




RS232 serialport

6.2.4 Fuses on the MCMB

For details on fuse positions of the MCMB, see 6.2.1 Panel of the MCMB. Table 6-7 lists thespecifications.



Issue 05 (2009-01-09)

Table 6-7 Fuses on the MCMB




6.2.5 Technical specifications of the MCMB

Table 6-8 lists the technical specifications of the MCMB.

Table 6-8 Technical specifications of the MCMB


Powerconsumption

N/A 15.7 W –





–

6.3 SCMUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the SCMU.

The SCMU is the subboard of the connection and management unit of the UMG8900. The SCMUis inserted in the subboard slot of the UG02MOMB or the UG02MMPB. If the board type is setto PPU, the SCMU works in load-sharing mode. If the board type is set to CMU, subboard 0 onthe OMB or MPB in slot 7 and subboard 0 on the OMB or MPB in slot 8 work in master/slavemode; subboard 1 on the OMB or MPB in slot 7 and subboard 1 on the OMB or MPB in slot 8work in master/slave mode. The SCMU can be used only in the SSM-32 frame.

The SCMU provides the following functions:

l The SCMU interacts with the packet service processing board, TDM service processingboard, service resource board of the UMG8900. In addition, the SCMU controls the serviceresources to convert the service bearer and service flow format and returns the processingresults to the media gateway controller (MGC) in the form of the H.248 message.

l The SCMU receives the H.248 packets. Then, the SCMU resolves the protocols of thetransport layer and the network layer and processes the H.248 codecs.

CAUTIONThe SCMU needs to be installed on the UG02MOMB or the UG02MMPB on site.

6.3.1 Panel of the SCMU



6-7

6.3.2 Indicators on the SCMU

6.3.3 Interfaces on the SCMU

6.3.4 Fuses on the SCMU

6.3.5 Technical specifications of the SCMU

6.3.1 Panel of the SCMU

Figure 6-3 shows the panel of the SCMU.

Figure 6-3 Panel of the SCMU

RUN

ALM

ACT

OFFLINE

CO

M0

Power

CPU mini system

MBUS modules

Interface

HeartBeat

Clock

6.3.2 Indicators on the SCMU

Table 6-9 lists the meaning of the indicators on the SCMU.

Table 6-9 Indicator meaning of the SCMU



Runningindicator







Issue 05 (2009-01-09)





Alarmindicator




Workingindicator






6.3.3 Interfaces on the SCMU

Table 6-10 lists the interfaces on the SCMU.

Table 6-10 Interfaces on the SCMU




RS232 serialport

6.3.4 Fuses on the SCMU

None

6.3.5 Technical specifications of the SCMU

Table 6-11 lists the technical specifications of the SCMU.



6-9

Table 6-11 Technical specifications of the SCMU


Powerconsumption

N/A 16.5 W -





–

6.4 MPPBThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MPPB.

As the protocol processing unit of the UMG8900, the MPPBs are inserted in back slots 2 to 5and slots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the serviceframe or extended control frame. The MPPB can be inserted in both SSM-256 frames andSSM-32 frames.

The MPPB provides the following functions:

l Receiving the H.248 protocol packet, resolving transport-layer and network-layerprotocols, and implementing H.248 transcoding

l Implementing H.248 transcoding, resolving transport-layer and network-layer protocols,and forwarding adapted messages to the media gateway controller (MGC)

6.4.1 Panel of the MPPB

6.4.2 Indicators on the MPPB

6.4.3 Interfaces on the MPPB

6.4.4 Fuses on the MPPB

6.4.5 Technical specifications of the MPPB

6.4.1 Panel of the MPPB

Figure 6-4 shows the panel of the MPPB.



Issue 05 (2009-01-09)

Figure 6-4 Panel of the MPPB

POWER

MBUS

CPU

F61

J10

F15

OFFLINE

FE0

MPPB

CO

M0

RESET

RUNALM

MPPB


6.4.2 Indicators on the MPPB

Table 6-12 lists the meaning of the indicators on the MPPB.

Table 6-12 Indicator meaning of the MPPB



Runningindicator







6-11





Alarmindicator







6.4.3 Interfaces on the MPPB

Table 6-13 lists the interfaces on the MPPB.

Table 6-13 Interfaces on the MPPB




RS232 serialport

6.4.4 Fuses on the MPPB

For details on fuse positions of the MPPB, see 6.4.1 Panel of the MPPB. Table 6-14 lists thespecifications.

Table 6-14 Fuses on the MPPB




6.4.5 Technical specifications of the MPPB

Table 6-15 lists the technical specifications of the MPPB.



Issue 05 (2009-01-09)

Table 6-15 Technical specifications of the MPPB


Powerconsumption

N/A 16 W -





–



6-13

7 Service and Protocol Processing Units

About This Chapter

The service and protocol processing units consist of MHRU, MRPU, MASU, MIOE, andMSPF.

7.1 MHRUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MHRU.

7.2 MHRDThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MHRD.

7.3 MRPUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MRPU.

7.4 MASUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MASU.

7.5 MIOEThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MIOE.

7.6 MSPFThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MSPF.

HUAWEI UMG8900Hardware Description 7 Service and Protocol Processing Units


7-1

7.1 MHRUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MHRU.

As the high-speed routing unit, the MHRUs are inserted in front slots 2 to 5 and slots 10 to 15in the main control frame, and front slots 0 to 5 and slots 10 to 15 in the service frame. Thecorresponding back boards of the MHRU are the interface boards such as the MP1H, MP4L,and ME8T. The MHRU can be inserted in both SSM-256 frames and SSM-32 frames.

The MHRU provides the following functions:

l Processing IP routes, and converging and distributing IP services

l Monitoring and managing the states of the boards and the corresponding back boards

l Supporting the Internet Protocols over ATM (IPoA) function. After the adaptation of theIP data packets to the ATM is completed, the ATM interface board forwards the IP datapackets out

The MHRU falls into two types: the UG01MHRU and UG02MHRU. The difference betweenthem is as follows:

l The UG01MHRU is used with UG01HPMB subboard.

l The UG02MHRU is used with UG02HPMB subboard.

l The UG01MHRU can be inserted only in frames 0 to 15, whereas the UG02MHRU can beinserted in any frame.

l In appearance, the name silkscreen on the front panel of the UG02MHRU is MHRUb, whilethat of the UG01MHRU is MHRU.

The UG01MHRUs and UG02MHRUs both are categorized as VER A and VER C. Both versionprovide the same functions.

The description of the UG01MHRU is not included.

7.1.1 Panel of the MHRU

7.1.2 Indicators on the MHRU

7.1.3 Interfaces on the MHRU

7.1.4 Fuses on the MHRU

7.1.5 Technical Specifications of the MHRU

7.1.6 MHRU Subboards

7.1.1 Panel of the MHRU

Figure 7-1 shows the panel of the UG02MHRU.A.

7 Service and Protocol Processing UnitsHUAWEI UMG8900Hardware Description


Issue 05 (2009-01-09)

Figure 7-1 Panel of the UG02MHRU.A

ACT

RUNALM

CO

M0

OFFLINE

MHRUb

MHRUb

POWER

MBUS

EPLD

CPU

U1

J2

J10F1

F2

J4J3

S1

U31

Figure 7-2 shows the panel of the UG02MHRU.C.



7-3

Figure 7-2 Panel of the UG02MHRU.C

ACT

RUNALM

CO

M0

OFFLINE

MHRUb

MHRUb

POWER

MBUS

CPLD

CPU

U101

J2

J10F12

F2

J4J3

S1

U108

F10F11

1002Logic

U110

7.1.2 Indicators on the MHRU

Table 7-1 lists the meaning of the indicators on the MHRU.

Table 7-1 Indicator meaning of the MHRU



Runningindicator







Issue 05 (2009-01-09)





Flashing slowly (onfor 2 seconds, off foranother 2 seconds)

The board is isolated.

Alarmindicator




Workingindicator







7.1.3 Interfaces on the MHRU

Table 7-2 lists the interfaces on the MHRU.

Table 7-2 Interface on the MHRU




RS232 serialport

7.1.4 Fuses on the MHRU

For details on fuse positions of the UG02MHRU.A, see 7.1.1 Panel of the MHRU. Table 7-3lists the specifications.

Table 7-3 Fuses on the UG02MHRU.A





7-5



For details on fuse positions of the UG02MHRU.C, see 7.1.1 Panel of the MHRU. Table 7-4lists the specifications.

Table 7-4 Fuses on the UG02MHRU.C






7.1.5 Technical Specifications of the MHRU

Table 7-5 lists the technical specifications of the MHRU.

Table 7-5 Technical specifications of the MHRU

Category Parameter

Specification Remarks

Time of switchoverbetween master andslave boards

N/A < 1 s Time of hardwareswitchover

Power consumption N/A 36.2 W UG01MHRU

38 W UG02MHRU.A

31 W UG02MHRU.C

Heat dissipation N/A 36.2 W UG01MHRU

38 W UG02MHRU

31 W UG02MHRU.C

7.1.6 MHRU Subboards

The subboard of the host process module broad (HPMB) is the main processor module subboard.The MHRU subboard processes the upper-layer protocol, initiates the backplane and implementsthe configuration and management through the HPMB subboard.

The MHRU falls into two types: the UG01HPMB and UG02HPMB. They are similar in function.The UG01HPMB is used with UG01MHRU, whereas the UG02HPMB is used withUG02MHRU.



Issue 05 (2009-01-09)

The technical specifications of the HPMB correspond to the MHRU, see 7.1.5 TechnicalSpecifications of the MHRU.

7.2 MHRDThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MHRD.

The MHRD is the high-speed routing board and can be used in the SSM-32 frame and theSSM-256 frame. The MHRD can be inserted in the universal back slot. When the MHRD isinserted in the SSM-256 frame, the MHRD needs to work with the UG02MNET board.

The MHRD provides the following functions:

l The MHRD processes the IP routes, and it converges, and distributes the IP services.

l The MHRD provides the service access function if the D8FT or D1GO interface subboardis inserted.

The MHRD falls into two types: UG01MHRD1 and UG01MHRD2.

l The D8FT subboard is inserted in the UG01MHRD1, which provides eight fast Ethernet(FE) interfaces.

l The D1GO subboard is inserted in the UG01MHRD2, which provides one optical gigabitEthernet (GE) interface or one electrical GE interface.

CAUTIONl The front and back boards in pairs in the SSM-32 frame cannot use the GE bus of the

backplane at the same time. The board opposite to the MHRD cannot be the boards such asthe MVPD that uses the GE bus.

l In the SSM-256 frame, the MHRD must be used with the UG02NET rather than theUG01NET.

7.2.1 Panel of the MHRD

7.2.2 Indicators on the MHRD

7.2.3 Interfaces on the MHRD

7.2.4 Fuses on the MHRD

7.2.5 Technical specifications of the MHRD

7.2.6 MHRD Subboards

7.2.1 Panel of the MHRD

Figure 7-3 shows the panel of the MHRD.



7-7

Figure 7-3 Panel of the MHRD

ACT

RUNALM

CO

M0

OFFLINE

MHRD

MHRD

Interfa-ces of

thesub-

boardSubboard

MBUS

CPU

F1F2 F4

F3

7.2.2 Indicators on the MHRD

Table 7-6 lists the meaning of the indicators on the MHRD.

Table 7-6 Indicator meaning of the MHRD



Runningindicator







Issue 05 (2009-01-09)







Alarmindicator




Workingindicator






7.2.3 Interfaces on the MHRD

Table 7-7 lists the interfaces on the MHRD.

Table 7-7 Interfaces on the MHRD




RS232 serialport

7.2.4 Fuses on the MHRD

For details on fuse positions of the MHRD, see 7.2.1 Panel of the MHRD. Table 7-8 lists thespecifications.

Table 7-8 Fuses on the MHRD





7-9





7.2.5 Technical specifications of the MHRD

Table 7-9 and Table 7-10 list the technical specifications of the MHRD.

Table 7-9 Technical specifications of the MHRD




Power consumption N/A 45 W UG01MHRD1

41.5 W UG01MHRD2

Heat dissipation N/A 45 W UG01MHRD1

41.5 W UG01MHRD2

Table 7-10 Service processing capability of the MHRD

Performance Item Requirement Remarks

Interface communicationrate of the packet service

1.25 Gbit/s Service channel of the GEswitching net of the serviceplane

Interface communicationrate of the managementplane

125 Mbit/s Management channel of the FEswitching net of the controlplane

Communication rate of theCAN bus

1 Mbit/s Out-band maintenance channelof the control plane

7.2.6 MHRD Subboards

D1GO SubboardsThe D1GO subboard provides one optical gigabit Ethernet (GE) interface or one electrical GEinterface for the MHRD.

The D1GO subboard is equipped with the pluggable interface module and provides one GEinterface or electrical interface in conformity with the IEEE8002.3z standard.



Issue 05 (2009-01-09)

If the D1GO subboards are inserted in two MHRDs working in master/slave mode, by default,the D1GO subboards work in load-sharing mode. That is, one MHRD can manage two D1GOsubboards at the same time. The interface of the D1GO subboard supports the non-APS 1+1backup mode.

Table 7-11 lists the meaning of the indicators on the D1GO.

Table 7-11 Indicator meaning of the D1GO



Working indicator ACT Yellow Flashing Data receiving andtransmitting on theoptical interface

Optical fiberconnection stateindicator


Always off Connection notestablished

Table 7-12 lists the technical specifications of the D1GO.

Table 7-12 Technical specifications of the D1GO


Opticalmodule


Mode Multi-mode


0.5 km

Wavelength 850 nm

Output opticalpower



–17.0 dBm

Saturation opticalpower

0 dBm

Specification IEEE802.3 and IEEE802.3z

Electricalmodule

Physical type RJ45 electrical interface –


100 m [0.06 mi.]

Powerconsumption

N/A 8.5 W –



7-11


Heatdissipation

N/A 8.5 W

D8FT SubboardsThe D8FT subboard provides eight fast Ethernet (FE) interfaces for the MHRD.

If the D8FT subboards are inserted in the MHRDs working in master/slave mode, by default,the D8FT subboards work in load-sharing mode. That is, one MHRD can manage two D8FTsubboards at the same time. The interface of the D8FT subboard supports non-APS 1+1 backupmode.

Table 7-13 lists the meaning of the indicators on the D8FT.

Table 7-13 Indicator meaning of the D8FT



Networkinterface speedindicator

- Green Always on The interface works atthe rate of 100 Mbit/s.

Always off The interface works atthe rate of 10 Mbit/s.

Networkinterfaceconnectionindicator

- Yellow Always on The link is through.

Always off The link is not through.

Flashing Some data is beingreceived or transmittedthrough the link.

Table 7-14 lists the technical specifications of the D8FT.

Table 7-14 Technical specifications of the D8FT


Interface Physical type RJ45 –

Quantity 8

Specification IEEE802.3 and IEEE802.3u

Powerconsumption

N/A 8.5 W –

Heatdissipation

N/A 8.5 W



Issue 05 (2009-01-09)

7.3 MRPUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MRPU.

CAUTIONThe MRPU can be configured only in frames 0 to 15.

As the high-speed routing unit, the MRPU can be inserted in front slots 2 to 5 and slots 10 to 15in the main control frame, and front slots 0 to 5 and slots 10 to 15 in the service frame. Thecorresponding back boards of the MRPU include the IP interface boards such as the MG1O,MP1H, MP4L and ME8T. The MRPU can be inserted in both SSM-256 frames and SSM-32frames.

The MRPU provides the following functions:

l Processing IP routes, and converging and distributing IP services


l Resolving the RTP/Real-time Transport Control Protocol (RTCP) protocols

l Realizing Jitter-buffering of the RTP service

l Supporting 1+1 backup function

7.3.1 Panel of the MRPU

7.3.2 Indicators on the MRPU

7.3.3 Interfaces on the MRPU

7.3.4 Fuses on the MRPU

7.3.5 Technical Specifications of the MRPU

7.3.1 Panel of the MRPU

Figure 7-4 shows the panel of the MRPU.



7-13

Figure 7-4 Panel of the MRPU

ACT

RUNALM

CO

M0

OFFLINE

RESET

MRPU

MRPU

J10J4

F2F1 J3

J2

U31

S1

U1

CPU

EPLD

MBUS

POWER

7.3.2 Indicators on the MRPU

Table 7-15 lists the indicator meaning of the MRPU.

Table 7-15 Indicator meaning of the MRPU



Runningindicator







Issue 05 (2009-01-09)







Alarmindicator




Workingindicator







7.3.3 Interfaces on the MRPU

Table 7-16 lists the interfaces on the MRPU.

Table 7-16 Interfaces on the MRPU




RS232 serial port

7.3.4 Fuses on the MRPU

For details on fuse positions of the MRPU, see 7.3.1 Panel of the MRPU. Table 7-17 lists thespecifications.

Table 7-17 Fuses on the MRPU





7-15



7.3.5 Technical Specifications of the MRPU

Table 7-18 lists the technical specifications of the MRPU.

Table 7-18 Technical specifications of the MRPU

Category Parameter






7.4 MASUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MASU.

As the ATM AAL2/AAL5 SAR processing unit, the MASU are inserted in front slots 2 to 5, 10to 15 in the main control frame and front slots 0 to 5, 10 to 15 in the service frame. Thecorresponding back boards of the MASU can be the interface boards such as the MA4L, MEACand MTAC. The MASU can be inserted in both SSM-256 frames and SSM-32 frames.

The MASU provides the following functions:

l Processing ATM services

l Providing standard AAL2 segmentation and reassembly (SAR), and service specificsegmentation and reassembly (SSSAR) functions, and supporting the stream shaping ofreal time variable bit rate (rt-VBR) and user parameter control (UPC)

l Providing the AAL5 SAR function

l Supporting direct forwarding over PVC, OAM cell extraction and luUP interfaceprocessing functions


l Supporting 1+1 backup function

The MASU falls into two types: the UG01MASU and UG02MASU. The difference betweenthem is as follows:

l The UG01MASU is used with UG01HPMB.

l The UG02MASU is used with UG02HPMB.

l The UG01ASU can be inserted only in frames 0 to 15, whereas the UG02MASU can beinserted in any frame.



Issue 05 (2009-01-09)

l In appearance, the name silkscreen of the front panel of the UG02MASU is MASUb, andthat of the UG01MASU is MASU.

The UG01MASU and UG02MASU are both categorized as VER A and VER C. Both versionprovide the same functions.

The description of the UG01MASU is not included.

7.4.1 Panel of the MASU

7.4.2 Indicators on the MASU

7.4.3 Interfaces on the MASU

7.4.4 Fuses on the MASU

7.4.5 Technical Specifications of the MASU

7.4.6 MASU Subboard

7.4.1 Panel of the MASU

Figure 7-5 shows the panel of the UG02MASU.A.

Figure 7-5 Panel of the UG02MASU.A

ACT

RUNALM

CO

M0

OFFLINE

MASUb

MASUb

J10J4

F2F1 J3

J2

U31

S1

U1

CPU

EPLD

MBUS

POWER



7-17

Figure 7-6 shows the panel of the UG02MASU.C.

Figure 7-6 Panel of the UG02MASU.C

ACT

RUNALM

CO

M0

OFFLINE

MASUb

MASUb

S1

J10J4

F2

F10

J3

J2

U108

U101

CPU

CPLD

MBUS

POWER

1002Logic

U110

F11 F12

7.4.2 Indicators on the MASU

Table 7-19 lists the indicator meaning of the MASU.

Table 7-19 Indicator meaning of the MASU



Runningindicator







Issue 05 (2009-01-09)







Alarmindicator




Workingindicator






7.4.3 Interfaces on the MASU

Table 7-20 lists the interfaces on the MASU.

Table 7-20 Interfaces on the MASU




RS232 serialport

7.4.4 Fuses on the MASU

For details on fuse positions of the UG02MASU.A, see 7.4.1 Panel of the MASU. Table7-21 lists the specifications.

Table 7-21 Fuses on the UG02MASU.A





7-19



For details on fuse positions of the UG02MASU.C, see 7.4.1 Panel of the MASU. Table7-22 lists the specifications.

Table 7-22 Fuses on the UG02MASU.C






7.4.5 Technical Specifications of the MASU

Table 7-23 lists the technical specifications of the MASU.

Table 7-23 Technical specifications of the MASU


Powerconsumption

N/A 36.2 W UG01MASU

38 W UG02MASU.A

31 W UG02MASU.C

Heat dissipation N/A 36.2 W UG01MASU

38 W UG02MASU

31 W UG02MASU.C

7.4.6 MASU Subboard

The subboard of the host process module broad (HPMB) is the main processor module subboard.The MASU subboard processes the upper-layer protocol, initiates the backplane and implementsthe configuration and management through the HPMB subboard.

The MHRU falls into two types: the UG01HPMB and UG02HPMB. They are similar in function.The UG01HPMB is used with UG01MASU, whereas the UG02HPMB is used withUG02MASU.

The technical specifications of the HPMB correspond to the MASU, see 7.4.5 TechnicalSpecifications of the MASU.



Issue 05 (2009-01-09)

7.5 MIOEThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MIOE.

As the high-speed routing unit, the MIOE can be inserted in front slots 0 to 6 and slots 9 to 15in the main control frame or the service frame when SSM-256 frame is used, and can be insertedin front slots 0 to 5 and slots 10 to 15 in the main control frame or service frame when SSM-32frame is used. The MIOE needs to work with the E32 board, but the opposite board is notmandatory. The MIOE can be inserted in both SSM-256 frames and SSM-32 frames. When theMIOE is inserted in the SSM-256 frame, the MTNB must be inserted, but the MTNU cannot beinserted in the SSM-256 frame.

The MIOE provides the following functions:

l Processing IP routes, and converging and distributing IP services.

l Monitoring and managing the board state.

l Supporting the Internet Protocols over ATM (IPoA) function. After the adaptation of theIP data packets to the E1 is completed, the TDM interface board forwards the IP data packetsout.

7.5.1 Panel of the MIOE

7.5.2 Indicators on the MIOE

7.5.3 Interfaces on the MIOE

7.5.4 Fuses on the MIOE

7.5.5 Technical Specifications of the MIOE

7.5.1 Panel of the MIOE

Figure 7-7 shows the panel of the MIOE.



7-21

Figure 7-7 Panel of the MIOE

Logicchip

MBUS

TC subboard-C/EC subboard

TC subboard-B

TC subboard-A

CPUprocessor

Power module +3.3V

J10

S1

BOOTROM/

CPLD

J6

J8J91208/CPLDS

TC/EC

F1/4A

F2/1A+5V

-48V

RUNALMACT

OFFLINE

MIOE

FE0

CO

M0

MIOE

NOTE

The subboard slot is reserved on the MIOE. At present, the configuration application with the subboard isunavailable. See the dotted lines in Figure 7-7.

7.5.2 Indicators on the MIOE

Table 7-24 lists the meaning of the indicators on the MIOE.

Table 7-24 Indicator meaning of the MIOE



Runningindicator




Issue 05 (2009-01-09)










Alarmindicator




Workingindicator






7.5.3 Interfaces on the MIOE

Table 7-25 lists the interfaces on the MIOE.

Table 7-25 Interfaces on the MIOE




RS232 serialport

FE0 1 RJ45 Used as a debugserial port

FE networkinterface



7-23

7.5.4 Fuses on the MIOE

For details on fuse positions of the MIOE, see 7.5.1 Panel of the MIOE. Table 7-26 lists thespecifications.

Table 7-26 Fuses on the MIOE




7.5.5 Technical Specifications of the MIOE

Table 7-27 lists the technical specifications of the MIOE.

Table 7-27 Technical specifications of the MIOE


Powerconsumption

N/A 20.8 W –



Number of users Supporting up to 4400 onlineusers

-

7.6 MSPFThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MSPF.

As the signaling processing unit of the UMG8900, the MSPFs are inserted in front slots 0 to 6and slots 9 to 15 in the main control frame or the service frame. They work in load-sharing mode.

The MSPF falls into two types: the UG01MSPF and UG02MSPF. The difference is that theUG01MSPF can be inserted only in SSM-256 frames, and the UG02MSPF can be inserted inboth. The MOMB or MMPB is inserted in slot 6 or 9 in the SSM-32 frame. Therefore, theUG02MSPF cannot be inserted in slot 6 or 9. In appearance, the name silkscreen of the frontpanel of the UG01MSPF is MSPF, and that of the UG02MSPF is MSPFb.

The MSPF provides the following functions:

l Implementing the adaptation of the TDM narrowband signaling to the IP packet based onthe SIGTRAN protocol. Receiving signaling from TDM switching units through thesubboard, and processing the TDM signaling.

l Implementing the core function of the signaling gateway by supporting the M3UA//M2UA/V5UA/IUA adaptation on signaling, and forwarding adapted messages to the mediagateway controller (MGC).



Issue 05 (2009-01-09)

7.6.1 Panel of the MSPF

7.6.2 Indicators on the MSPF

7.6.3 Interfaces on the MSPF

7.6.4 Fuses on the MSPF

7.6.5 Technical Specifications of the MSPF

7.6.6 Subboards of the MSPF

7.6.1 Panel of the MSPF

Figure 7-8 shows the panel of the MSPF.

Figure 7-8 Panel of the MSPF

J5

J9

F61

F15

Subboard

POWER

Subboard

J12

J8

J15

J13

J14

U2

U3

CPU

BridgeUnit

MBUS

1

2

9

10

1

2

9

10

1

2

9

10

1

2

9

10

1

2

9

10

1

2

9

10

1

2

9

10

1

2

9

10

1

2

9

10

CO

M0

OFFLINE

RESET

RUNALM

MSPF

MSPF


7.6.2 Indicators on the MSPF

Table 7-28 lists the meaning of the indicators on the MSPF.



7-25

Table 7-28 Indicator meaning of the MSPF



Runningindicator







Alarmindicator







7.6.3 Interfaces on the MSPF

Table 7-29 lists the interface on the MSPF.

Table 7-29 Interface on the MSPF




RS232 serialport

7.6.4 Fuses on the MSPF

For details on fuse positions of the MSPF, see 7.6.1 Panel of the MSPF. Table 7-30 lists thespecifications.

Table 7-30 Fuses on the MSPF





Issue 05 (2009-01-09)



7.6.5 Technical Specifications of the MSPF

Table 7-31 lists the technical specifications of the MSPF.

Table 7-31 Technical specifications of the MSPF


Powerconsumption

N/A 33.9 W –



Number of theMTP2 links

64 kbit/s: 46 links for each board. Upto 2576 links

–

2 Mbit/s: two links for each board. Upto 112 links



2 Mbit/s: two links for each board. Upto 112 links

Number of theQ.921 links


Number of theLAPV5 links


7.6.6 Subboards of the MSPF

The SHPU subboard is the signaling high-level processing subboard. The MSPF processes layer2 signaling protocol through the SHPU subboard. Based on the configured work modes, thesubboards can support different layer 2 protocols. Up to two subboards can be configured oneach MSPF.

Table 7-32 lists the technical specifications of the SHPU subboard.

Table 7-32 Technical specifications of the SHPU subboard


Powerconsumption

N/A 8.5 W –




7-27




Up to twenty-three 64kbit/s MTP2 links

PRO_64K_PRA orPRO_BT_64K_PRAmode

Up to one 2 Mbit/s MTP2link

PRO_2M orPRO_BT_2M mode

Number of the Q.921 links

Up to 64 links PRO_PRA mode

Number of theLAPRSA links


Up to 32 links



Issue 05 (2009-01-09)

8 Cascading Units

About This Chapter

The cascading units consist of MFLU, MBLU, and MNLU.

8.1 MFLUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MFLU.

8.2 MBLUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MBLU.

8.3 MNLUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MNLU.

HUAWEI UMG8900Hardware Description 8 Cascading Units


8-1

8.1 MFLUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MFLU.

As the front cascading board in multi-frame cascading application, the MFLUs are inserted infront slots 0 to 5 and 10 to 15 in the central switching frame. The MFLU can be inserted onlyin SSM-256 frames.

The MFLU provides the following functions:

l The UG01MFLU forwards 1 x 8K TDM cascading data sent by the MTNU to theUG01MBLU in the back slot and the UG01MFLU forwards 2 x 8K TDM cascading datathrough the backplane. Therefore, the total TDM cascading capacity is 3 x 8K.

l The UG02MFLU forwards 2 x 8K TDM cascading data sent by the MTNB to theUG02MBLU in the back slot and the UG02MFLU forwards 2 x 8K TDM cascading datathrough the backplane. Therefore, the total TDM cascading capacity is 4 x 8K.

l Two MFLU provide 2 x 1.25 G GE data cascading channels for the MBLU in the back slot.

The MFLU falls into two types: the UG01MFLU and UG02MFLU.

The major differences between the UG01MFLU and the UG02MFLU are as follows:

l The UG01MFLU can work with only the UG01MBLU and the UG01MTNU.

l Functions of the G02MFLU are the same as those of the UG01MFLU; however, theUG02MFLU can work with only the UG02MBLU.

l The UG02MFLU provide one more ACT indicator than the UG01MFLU. The namesilkscreen of the front panel on the UG02MFLU is MFLUb, while that on theUG01MFLU is MFLU.

The UG01MFLU is not described.

8.1.1 Panel of the MFLU

8.1.2 Indicators on the MFLU

8.1.3 Interfaces on the MFLU

8.1.4 Fuses on the MFLU

8.1.5 Technical specifications of the MFLU

8.1.1 Panel of the MFLU

Figure 8-1 shows the panel of the MFLU.

8 Cascading UnitsHUAWEI UMG8900Hardware Description


Issue 05 (2009-01-09)

Figure 8-1 Panel of the MFLU

J6

J5

J9

J7

J8

POWER

POWER

EPLDMBUS

J4J2

LoadingSocket

F2

F1

F4

F3

J3

OFFLINE

MFLUb

ACT

RUNALM

MFLUb

8.1.2 Indicators on the MFLU

Table 8-1 lists the meaning of the indicators on the MFLU.

Table 8-1 Indicator meaning of the MFLU



Runningindicator









8-3



Alarmindicator




Workingindicator






8.1.3 Interfaces on the MFLU

None

8.1.4 Fuses on the MFLU

For details on fuse positions of the MFLU, see 8.1.1 Panel of the MFLU. Table 8-2 lists thespecifications.

Table 8-2 Fuses on the MFLU






8.1.5 Technical specifications of the MFLU

Table 8-3 lists the technical specifications of the MFLU.



Issue 05 (2009-01-09)

Table 8-3 Technical specifications of the MFLU


Powerconsumption

N/A 3.4 W –


8.2 MBLUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MBLU.

As the back cascading board in the multi-frame cascading application, the MBLUs are insertedin back slots 0 to 5 and 10 to 15 in the central switching frame. The boards in slots 0 and 1, 2and 3, 4 and 5, 10 and 11, 12 and 13, 14 and 15 are in master and slave mode. The MBLU canbe inserted only in SSM-256 frames.

The MBLU provides the following functions:

l Providing 4 x 8 K TDM narrowband data channels to directly connect frames through multi-mode optical fibers

l Providing 2 x 1.25 G broadband packet data channels to directly connect frames throughmulti-mode optical fibers

l Providing the 100 M IP control data channels to directly connect frames through category-5twisted pair or super category-5 twisted pair

The MBLU includes the UG01MBLU, UG02MBLU_VAand UG02MBLU_VC.

The difference is as follows:

l The UG01MBLU works with the UG01MFLU to providing 3 x 8 K timeslot cascadingcapacity in conjunction with the MTNU.

l The UG02MBLU_VA and UG01MBLU are similar in functions. In appearance, thedifference is that the UG02MBLU_VA provide one more TDM cascading optical interfacethan the UG01MBLU. The name silkscreen of the front panel on the UG02MBLU_VA isMBLUb, while that on the UG01MBLU is MBLU.

l The UG02MBLU_VA provides cascading network interfaces including FE0 interface. TheUG02MBLU_VC provides FE1&FE2, and FE3&FE4 interfaces. Each UG02MBLU_VCcan provide four FE cascading network interfaces through extended network cables.

The UG01MBLU is not described.

8.2.1 Panel of the MBLU

8.2.2 Indicators on the MBLU

8.2.3 Interfaces on the MBLU

8.2.4 Fuses on the MBLU

8.2.5 Technical specifications of the MBLU

8.2.1 Panel of the MBLU



8-5

Figure 8-2 shows the panel of the UG02MBLU_VA.

Figure 8-2 Panel of the UG02MBLU_VA

POWER

MBUS

FPGA

CPLD

CPU

FrequencyDoubler

Switching

Module

J3 F1 J7F2

J6

J10H3

J4

H1

H2

J8

J9

S1

OFFLINE

ACT LINK

TX0

RX0

ACT LINK

TX1

RX1

ACTLIN

K

TX3

RX3

ACT LINK

TX4

RX4

ACT LINK

TX5

RX5

MBLUb

ACT

RUNALM

CO

M0

FE0

ACT LINK

TX2

RX2

GE

TDM

MBLUb

Figure 8-3 shows the panel of the UG02MBLU_VC.



Issue 05 (2009-01-09)

Figure 8-3 Panel of the UG02MBLU_VC

MBUS

OFFLINE

ACT LINK

TX0

RX0

ACT LINK

TX1

RX1

ACTLIN

K

TX3

RX3

ACT LINK

TX4

RX4

ACTLIN

K

TX5

RX5

CO

M0

ACTLIN

K

TX2

RX2

GE

TDM

FE3&

FE4

FE1&

FE2

ACT

RUNALM

MBLUb

FE2

FE4

1

2

MBLUb

1. FE1&FE2 2. FE3&FE4

NOTE

The new indicators on the UG02MBLU_VC panel are used to indicate the ACT and LINK states of theFE2 and FE4 interfaces.

8.2.2 Indicators on the MBLU

Table 8-4 lists the meaning of the indicators on the MBLU.

Table 8-4 Indicator meaning of the MBLU



Runningindicator




8-7








Alarmindicator




Workingindicator




LINK Green Always on Optical fiber connectionis normal.

Always off Optical fiber connectionis abnormal.



The optical channel thatcorresponds to theoptical module is in themaster state.





8.2.3 Interfaces on the MBLU

Table 8-5 lists the interfaces on the MBLU.



Issue 05 (2009-01-09)

Table 8-5 Interfaces on the MBLU

Category Quantity

PhysicalInterface



TDM cascading 4 LC Providing 4 x 8 K cascadingcapacity

-

Broadbandpacketcascadingopticalinterface

2 LC Providing 2 x 1.25Gcascading capacity

-

FE0 1 RJ45 Providing 1 x FE cascadingcapacity

FE networkinterface

FE1&FE2 1 RJ45 Providing 1 x FE cascadingcapacity, and expanding to 2x FE cascading capacitythrough extended cascadingnetwork cables

FE networkinterface

FE3&FE4 1 RJ45 Providing 1 x FE cascadingcapacity, and expanding to 2x FE cascading capacitythrough extended cascadingnetwork cables

FE networkinterface

NOTE

FE1&FE2 and FE3&FE4 are the new interfaces of the UG02MBLU_VC which can provide two cascadingnetwork interfaces through extended network cables.

8.2.4 Fuses on the MBLU

For details on fuse positions of the MBLU, see 8.2.1 Panel of the MBLU. Table 8-6 lists thespecifications.

Table 8-6 Fuses on the MBLU




8.2.5 Technical specifications of the MBLU

Table 8-7 lists the technical specifications of the MBLU.



8-9

Table 8-7 Technical specifications of the MBLU


Optical module Transmissiondistance

500 m [0.3 mi.] UG02MBLU_VC

Mode multi-mode

Wavelength 850 nm

Output opticalpower



–17.0 dBm


0 dBm


2.125 Gbit/s series

TDM cascadingoptical interface


960 Mbit/s –

FE cascading Speed of thenetwork interface

125 Mbit/s

Powerconsumption

N/A 19.4 W


NOTE


8.3 MNLUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MNLU.

CAUTIONIn the SSM-32 frame, two boards inserted in two opposite slots cannot use the GE bus on thebackplane at the same time. The MNLU cannot be inserted opposite to the boards that use thegigabit Ethernet (GE) bus, such as the MVPD.

As the back cascading board in the multi-frame cascading networking, the MNLUa are insertedin back slots 4, 5, 10, and 11 in the main control frame and service frame. They work in load-sharing mode. The MNLU can only be used in the SSM-32 frame.



Issue 05 (2009-01-09)

The MNLU provides the following functions:

l Providing direct cascading data channel of 1 × 1.25G capacity for broadband packetservices. A pair of MNLUs provides direct cascading data channel of 2 x1.25G capacityfor broadband packet services.

l Self-cascading the SSM-32 frames through optical port 0 and multimode optical fiber.

l Mixed-cascading SSM-32 frames and SSM-256 frames through optical ports 0 and 1 andmultimode optical fiber.

8.3.1 Panel of the MNLU

8.3.2 Indicators on the MNLU

8.3.3 Interfaces on the MNLU

8.3.4 Fuses on the MNLU

8.3.5 Technical specifications of the MNLU

8.3.1 Panel of the MNLU

Figure 8-4 shows the panel of the MNLU.

Figure 8-4 Panel of the MNLU

POWER

CPU

J10

J7

F2

F1

F1195

CPLD

SFP

SFP

S1

F1196

BIOS

FLAS

H

1

2

9

10

1

2

9

10

MBUS

MNLU

MNLU

ACT LINK

TX1

RX1

RUNALM

OFFLINE

CO

M0

ACT LINK

TX0

RX0



8-11

8.3.2 Indicators on the MNLU

Table 8-8 lists the meaning of the indicators on the MNLU.

Table 8-8 Indicator meaning of the MNLU



Runningindicator






The board is beingloaded or it does notwork.

Alarmindicator














8.3.3 Interfaces on the MNLU

Table 8-9 lists the interfaces on the MNLU.



Issue 05 (2009-01-09)

Table 8-9 Interfaces on the MNLU




RS232 serialport

Broadband packetcascading opticalinterface

2 LC Providing 2 x 1.25Gcascading capacity

-

8.3.4 Fuses on the MNLU

For details on fuse positions of the MNLU, see 8.3.1 Panel of the MNLU. Table 8-10 lists thespecifications.

Table 8-10 Fuses on the MNLU


F1 MBus 5 V power fuse Direction


8.3.5 Technical specifications of the MNLU

Table 8-11 lists the technical specifications of the MNLU.

Table 8-11 Technical specifications of the MNLU


Opticalmodule


500 m [0.3 mi.] –

Mode multi-mode

Wavelength 850 nm

Output opticalpower



–17.0 dBm

Saturationoptical power

0 dBm


2.125 Gbit/s series



8-13


Powerconsumption

N/A 7.2 W

Heatdissipation

N/A 7.2 W

NOTE




Issue 05 (2009-01-09)

9 Media Resource Processing Units

About This Chapter

The media resource processing units consist of MVPB, MVPD, MTCB, MTCD, MECU.

9.1 MVPBThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MVPB.

9.2 MVPDThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MVPD.

9.3 MTCBThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MTCB.

9.4 MTCDThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MTCD.

9.5 MECUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MECU.

HUAWEI UMG8900Hardware Description 9 Media Resource Processing Units


9-1

9.1 MVPBThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MVPB.

As the voice processing unit, the MVPBs are inserted in front slots 0 to 6 and slots 9 to 15 inthe main control frame and the service frame. The MVPB can be inserted only in SSM-256frames.

The MVPB falls into two types: UG01MVPB and UG02MVPB. The difference between twotypes is as follows:

l The UG01MVPB is MVPB on the panel.

l The UG02MVPB is MVPBb on the panel.

l The UG02MVPB provides the FE0 interface as the debug network interface.

l The UG02MVPB supports the UG01MVDD subboard.

l The UG02MVPB supports voice codec modes including GSM AMR and UMTS AMR.

The MVPB provides the following functions:

l Supporting functions such as announcement playing, number collecting, audio mixing, andmultiple frequency control (MFC)

l Implementing IP packet adaptation of voice services based on UDP, RTP and IP.Supporting varied voice codec modes including G.711A, G.711μ, G.723, G.726, G.729,AMR, EVRC,QCELP8K, and QCELP13K

l The UG02MVPB supports the GSM AMR codec and the HR, FR, and EFR codecs in theGSM network. Thus, the interworking with the GSM network can be realized.

l The UG02MVPB supports the UMTS AMR codec for interworking with the UMTSnetwork.

l Accepting resource control and management of the CMU

9.1.1 Panel of the MVPB

9.1.2 Indicators on the MVPB

9.1.3 Interfaces on the MVPB

9.1.4 Fuses on the MVPB

9.1.5 Technical Specifications of the MVPB

9.1.6 MVPB Subboards

9.1.1 Panel of the MVPB

Figure 9-1 shows the panel of the UG01MVPB.

9 Media Resource Processing UnitsHUAWEI UMG8900Hardware Description


Issue 05 (2009-01-09)

Figure 9-1 Panel of the UG01MVPB

-48V

GND

PGND

U24

U2

U9 TC Subboard 0

TC Subboard 1

TC Subboard 2/ECSubboardU54

RJ1 J20

F1

F2 POWER

MBUS

CO

M0

OFFLINE

RUNALM

MVPB

MVPB

Figure 9-2 shows the panel of the UG02MVPB.



9-3

Figure 9-2 Panel of the UG02MVPB

Logicchip

MBUS

TC subboard 2/EC subboard

TC subboard 1

TC subboard 0

CPUprocessor

Power module+3.3V

J10

S1

BOOTROM/

CPLD

J6

J8J91208/CPLDS

TC/EC

F1/4A

F2/1A+5V

-48V

RUNALM

OFFLINE

MVPBb

FE0

CO

M0

MVPBb

ACT

9.1.2 Indicators on the MVPB

Table 9-1 lists the meaning of the indicators on the MVPB.

Table 9-1 Indicator meaning of the MVPB



Runningindicator







Issue 05 (2009-01-09)




Software is being loaded tothe board, or the board doesnot run.

Flashing slowly (onfor 2 seconds, offfor another 2seconds)


Alarmindicator




Workingindicator






NOTE

The working indicator ACT is unavailable on the panel of the UG01MVPB.The working indicator ACT is available on the panel of the UG02MVPB. The UG02MVPB is in load-sharing mode. Therefore, the indicator is always off.

9.1.3 Interfaces on the MVPB

Table 9-2 lists the interfaces on the MVPB.

Table 9-2 Interfaces on the MVPB




RS232 serialport

FE0 1 RJ45 Used as a debugnetwork interface

FE networkinterface

NOTE

Interface FE0 is located on the UG02MVPB.

9.1.4 Fuses on the MVPB



9-5

For details on fuse positions of the MVPB, see 9.1.1 Panel of the MVPB. Table 9-3 lists thespecifications.

Table 9-3 Fuses on the MVPB




9.1.5 Technical Specifications of the MVPB

Table 9-4 and Table 9-5 list the technical specifications of the MVPB.

Table 9-4 Power consumption and heat dissipation of theMVPB

Category Parameter Remarks

Powerconsumption

24 W UG02MVPB without thesubboard

Heat dissipation 24 W

Table 9-5 Service processing capability of the MVPB

Parameter Specification Remarks

Number of theTC channels

1024 channels (G.711 voice codec mode)512 channels (G.723/G.726/G.729/AMRvoice codec mode)

Use the MVDB subboard.


1024 channels (G.711 voice codec mode)672 channels (G.729a/b voice codecmode)

Use the MVDD subboard(only for the UG02MVPB).

Number of theCC channels

1024 Use the MVDB subboard insubboard slot 0/1.

2048 Use the MVDB subboard insubboard slot 2.

Number of theEC channels

1024 (tail length: 16 ms or 32 ms)1024 (tail length: 48 ms or 64 ms)512 (tail length: 80 ms, 96 ms, 110 ms, or128 ms)

Use the MECC subboard.

2048 (tail length: 16 ms or 32 ms)2048 (tail length: 48 ms or 64 ms)1024 (tail length: 80 ms, 96 ms, 110 ms,or 128 ms)

Use the MECE subboard.



Issue 05 (2009-01-09)


1024 (tail length: 64 ms) Use the MECF subboard

1024 (tail length: 128 ms) Use the MECG subboard.

2048 (tail length: 64 ms) Use the MECH subboard.

2048 (tail length: 128 ms) Use the MECI subboard.

1024 (tail length: 64 ms) Use the MECJ subboard.

2048 (tail length: 64 ms) Use the MECK subboard.

NOTE

l The tail length is the parameter for the echo cancellation. If the tail length is longer, the echo cancellationis more effective, and more EC resource is occupied.

l The TC resource channel supports functions such as code conversion, announcement playing, and digitcollecting. Each channel can support only one function at one time. For example, an MVDB subboardprovides 512 TC channels. If 100 channels support announcement playing and 100 channels supportdigit collecting, up to 312 channels can support codec.

l The subboard slots are numbered 0, 1 and 2 from the top to the bottom.

9.1.6 MVPB Subboards

MVDB SubboardsThe MVDB subboard works as the TC subboard and provides the following functions:

l Providing the voice codec conversion function and supporting the voice codec modesincluding AMR, AMR-WB, QCELP, EVRC, SMV, G.711, G.726, G.723, and G.729

l Providing 512 AMR channels

l Providing the FAX function, and supporting the T.30 and T.38 protocols

l Providing the DTMF detection and DTMF number sending functions

l Working with the MVPB to play simple announcements

Table 9-6 lists the technical specifications of the MVDB subboard.

Table 9-6 Technical specifications of the MVDB subboard

Category Parameter Specification

Remarks

Powerconsumption

N/A 10 W –




1024 G.711 voice codec mode

512 G.723/G.726/G.729/AMR voicecodec modes



9-7


Remarks


1024 Use the MVDB subboard in subboardslot 0/1.

2048 Use the MVDB subboard in subboardslot 2.

MECC/MECE/MECF/MECG/MECH/MECI/MECJ/MECK SubboardsThe MECC/MECE/MECF/MECG/MECH/MECI/MECJ/MECK subboards work as the echocancellation (EC) subboard and provide the following functions:

l The MECC/MECE/MECF/MECG/MECH/MECI subboards provide the acoustic echocancellation (AEC) and electric EC (EEC) functions.

l The MECJ/MECK subboards provide the electric EC functions.

l Supporting various tail delays.

Table 9-7 lists the technical specifications of the MECC/MECE/MECF/MECG/MECH/MECI/MECJ/MECK subboards.

Table 9-7 Technical specifications of the MECC/MECE/MECF/MECG/MECH/MECI/MECJ/MECK subboards

Subboard Tail Delay Number ofthe ECChannels

PowerConsumption

HeatDissipation

MECC 16 ms/32 ms 1024 3.8 W 3.8 W

48 ms/64 ms 1024

80 ms/96 ms/110 ms/128ms

512

MECE 16 ms/32 ms 2048 9 W 9 W

48 ms/64 ms 2048

80 ms/96 ms/110 ms/128ms

1024

MECF 64 ms 1024 2 W 2 W

MECG 128 ms 1024 5.3 W 5.3 W

MECH 64 ms 2048 6.4 W 6.4 W

MECI 128 ms 2048 2.3 W 2.3 W

MECJ 64 ms 1024 5.4 W 5.4 W

MECK 64 ms 2048 12.2 W 12.2 W



Issue 05 (2009-01-09)

UG01MECL Subboards

The UG01MECL subboard can be inserted only in the UG02MVPB.

The UG01MECL serves as the EC subboard and provides the following functions:

l Providing electric echo cancellation

l Providing a maximum of 1500 EC channels of 64 ms tail delay

l Detecting the individual tone

l Supporting simultaneous recording of four timeslots, and subboard buffering voice data offour timeslots with 384 ms tail delay

l Providing the loopback test of the subboard EC ASIC and boasting the capability of locatingthe noise

l Providing independent production information

l Providing the JTAG interface to communicate with the CAN bus module, and supportingthe system online test and logic online upgrade

Table 9-8 lists the technical specifications of the UG01MECL subboard.

Table 9-8 Technical specifications of the UG01MECL subboard


Power consumption N/A 4.3 W Fully loaded

Heat dissipation N/A 4.3 W –

Service processingcapability

Number of the ECchannels

1536 Tail length: 64 ms

UG01MVDD Subboards

The UG01MVDD subboard, only for the UG02MVPB, works as the integrated subboard of theEC and TC, and provides the following functions:

l Providing the voice codec conversion function and supporting the voice codec modes suchas AMR, AMR-WB, QCELP, EVRC, SMV, G.711, G.726, G.723, and G.729.

l Providing the echo cancellation (EC) function



l Working with the UG02MVPB to play simple announcements


Table 9-9 Technical specifications of the MVDD subboard


Powerconsumption

N/A 12 W Fully loaded



9-9


Heat dissipation N/A 12 W –




672 G.729a/b voice codecmode

Board Positions

Figure 9-3 shows the position of the MVPB subboard.

Figure 9-3 Position of the MVPB subboard

TC subboard 0

TC subboard 1


MBUSsubboard

The position of the EC subboard is the same as that of TC subboard 2, but the EC subboard andTC subboard 2 do not share the subboard connector. In addition, the EC subboard and TCsubboard cannot be configured in this position at same time.

9.2 MVPDThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MVPD.

The MVPDs, as voice processing units, are inserted in both the SSM-256 frame and SSM-32frame. In the SSM-256 frame, the MVPDs are inserted in front slots 0 to 6 and slots 9 to 15 inthe main control frame and the service frame. In the SSM-32 frame, they are inserted in frontslots 0 to 5 and slots 10 to 15 in the main control frame and the service frame. When theMVPD is inserted in the SSM-256 frame, the MTNB must be inserted in the SSM-256 frame;however, the MTNU cannot be inserted in the SSM-256 frame.



Issue 05 (2009-01-09)

The MVPD falls into three types: UG01MVPD, UG02MVPD_VB and UG02MVPD_VC. Thedifference between three types is as follows:

l The UG01MVPD is MVPD on the panel.

l The UG02MVPD is MVPDb on the panel with new ACT indicators. In addition, theUG02MVPD supports the UG01MVDD subboard.

l The UG02MVPD_VC is compatible with the UG02MVPD_VB. In addition, theUG02MVPD_VC supports the UG01MVDF subboard and the UG01MECL subboard.

The MVPD provides the following functions:

l Supporting functions such as announcement playing, digit collecting, audio mixing andMFC

l Implementing IP packet adaptation of voice services based on UDP, RTP and IP.Supporting varied voice codec modes including G.711A, G.711μ, G.723, G.726, G.729,AMR, EVRC,QCELP8K, and QCELP13K

l Processing the IuUP and NbUP at the same time and complying with the 3GPP TS 25.415TS 29.415 protocol

l Accepting resource control and management of the main control board

NOTE

In the SSM-32 frame, two boards inserted in two opposite slots cannot use the GE bus on the backplane atthe same time. The slot opposite to the front MVPD cannot be inserted with the board using the GE bus.

9.2.1 Panel of the MVPD

9.2.2 Indicators on the MVPD

9.2.3 Interfaces on the MVPD

9.2.4 Fuses on the MVPD

9.2.5 Technical Specifications of the MVPD

9.2.6 MVPD Subboards

9.2.1 Panel of the MVPD

Figure 9-4 shows the panel of the UG01MVPD.



9-11

Figure 9-4 Panel of the UG01MVPD

RUNALM

OFFLINE

MVPD

FE0

CO

M0

MVPD

MBUS


TC subboard 1

TC subboard 0

Powermodule+3.3V

J10

S1

BOOTROM/CPLD

J6F1/4A

F2/1A+5V

-48VPowermodule+1.4V

J8

Figure 9-5 shows the panel of the UG02MVPD.



Issue 05 (2009-01-09)

Figure 9-5 Panel of the UG02MVPD

RUNALM

OFFLINE

MVPDb

FE0

CO

M0

MVPDb

ACT

Logicchip

MBUS


TC subboard 1

TC subboard 0

CPUprocessor

Power module+3.3V

J10

S1

BOOTROM/

CPLD

J6

J8J91208/CPLDS

TC/EC

F1/4A

F2/1A+5V

-48V

9.2.2 Indicators on the MVPD

Table 9-10 lists the meaning of the indicators on the MVPD.

Table 9-10 Indicator meaning of the MVPD



Runningindicator







9-13







Alarmindicator




Workingindicator






NOTE

The working indicator ACT is unavailable on the panel of the UG01MVPD.

The working indicator ACT is available on the panel of the UG02MVPD. The UG02MVPD is in load-sharing mode. Therefore, the indicator is always off.

9.2.3 Interfaces on the MVPD

Table 9-11 lists the interfaces on the MVPD.

Table 9-11 Interfaces on the MVPD




RS232 serialport


FE networkinterface

9.2.4 Fuses on the MVPD



Issue 05 (2009-01-09)

For details on fuse positions of the MVPD, see 9.2.1 Panel of the MVPD. Table 9-12 lists thespecifications.

Table 9-12 Fuses on the MVPD




9.2.5 Technical Specifications of the MVPD

Table 9-13 and Table 9-14 list the technical specifications of the MVPD.

Table 9-13 Power consumption and heat dissipation of the MVPD


Power consumption 21.5 W MVPD without the subboard

Heat dissipation 21.5 W MVPD without the subboard

Table 9-14 Technical specifications of the MVPD


Number of the TCchannels

1024 channels (G.711 voice codecmode)512 channels (G.723/G.726/G.729/AMR voice codec mode)



1024 channels (G.711 voice codecmode)672 channels (G.729a/b codecmode)

Use the UG01MVDD subboard(only for the UG02MVPD_VB).



Use the UG01MVDF subboard(only for the UG02MVPD_VC).

Number of the CCchannels

1024 Use the MVDB or UG01MVDFsubboard in subboard slot 0/1.

2048 Use the MVDB orUG01MVDF subboard insubboard slot 2.



9-15



1024 (tail length: 16 ms or 32 ms)1024 (tail length: 48 ms or 64 ms)512 (tail length: 80 ms, 96 ms, 110ms, or 128 ms)


2048 (tail length: 16 ms or 32 ms)2048 (tail length: 48 ms or 64 ms)1024 (tail length: 80 ms, 96 ms, 110ms, or 128 ms)


1024 (tail length: 64 ms) Use the MECF subboard.


2048 (tail length: 64 ms) Use the MECH subboard

2048 (tail length can be 128 ms) Use the MECI sub board.



1024 (tail length: 64 ms) Use the MVQE subboard.

1536 (tail length: 64 ms) Use the UG01MECL subboard.

NOTE

l The tail length is the parameter for the echo cancellation. If the tail length is longer, the echo cancellationis more effective, and more EC resource is occupied.

l The TC resource channel supports functions such as code conversion, announcement playing and digitcollecting. Each channel can only support one function at one time. For example, an MVDB subboardprovides 512 TC channels. If 100 channels support announcement playing and 100 channels supportdigit collecting, up to 312 channels can support codec.

l The subboard slots are numbered 0, 1 and 2 from the top to the bottom.

9.2.6 MVPD Subboards

MVQE SubboardsThe MVQE subboard functions as the transcoder (TC) subboard and provides the followingfunctions:

l Providing the acoustic echo cancellation (AEC) electric EC functions.


Table 9-15 lists the technical specifications of the MVQE subboard.



Issue 05 (2009-01-09)

Table 9-15 Technical specifications of the MVQE subboard

Subboard Tail Delay Number of theEC Channels

PowerConsumption

HeatDissipation

MVQE 64 ms 1024 10 W 10 W

UG01MVDD SubboardsThe UG01MVDD subboard, only for the UG02MVPD, works as the integrated subboard of theEC and TC, and provides the following functions:





l Working with the UG02MVPD to play simple announcements


Table 9-16 Technical specifications of the MVDD subboard


Powerconsumption


Heat dissipation N/A 12 W -





UG01MVDF SubboardsThe UG01MVDF subboard can be inserted only in the UG02MVPD_VC.

The UG01MVDF subboard serves as the TC subboard and provides the following functions:

l Supporting the codec of 768 channels, G.729a/b codec, and AMR codec

l Supporting the G.711 voice codec service of 1500 channels

l Supporting the multiparty service of 2000 channels

l Detecting the clock status of the subboards by adding the subboard logic

Table 9-17 lists the technical specifications of the UG01MVDF subboard.



9-17

Table 9-17 Technical specifications of the UG01MVDF subboard







768 G.723/G.726/G.729/AMRvoice codec mode


1024 Use the MVDF subboard insubboard slot 0/1.

2048 Use the MVDF subboard insubboard slot 2.

UG01MECL Subboards

The UG01MECL subboard can be inserted only in the UG02MVPD_VC.









Table 9-18 lists the technical specifications of the UG01MECL subboard.

Table 9-18 Technical specifications of the UG01MECL subboard







Board Positions

Figure 9-6 shows the position of the MVPD subboard.



Issue 05 (2009-01-09)

Figure 9-6 Position of the MVPD subboard

TC subboard 0

TC subboard 1


MBUSsubboard

The position of the EC subboard is the same as that of TC subboard 2, but the EC subboard andTC subboard 2 do not share the subboard connector. In addition, the EC subboard and TCsubboard cannot be configured in the same position at the same time.

The subboards used by the MVPD are the same as those of the MVPB. See 9.1.6 MVPBSubboards.

9.3 MTCBThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MTCB.

As the voice processing unit, the MTCBs are inserted in front slots 0 to 6 and slots 9 to 15 inthe main control frame and the service frame. The MTCB can be inserted only in the SSM-256frame.

The MTCB falls into two types: UG01MTCB and UG02MTCB. The difference between twotypes is as follows:

l The UG01MTCB is MTCB on the panel.

l The UG02MTCB is MTCBb on the panel.

l The UG02MTCB provides the FE0 interface as the debug network interface.

l The UG02MTCB supports the UG01MVDD subboard.

l The UG02MTCB supports voice codec modes including GSM AMR and UMTS AMR.

The MTCB provides the following functions:




9-19

l Implementing IP packet adaptation of voice services based on UDP, RTP and IP.Supporting varied voice codec modes including G.711, AMR, EVRC, QCELP8K, andQCELP13K


l Providing echo cancellation, supporting tail delay of 32ms, 64ms, 128ms, and supportingG.164/165 single tone detection

l The UG02MTCB supports the GSM AMR codec and the HR, FR, and EFR codecs in theGSM network. Thus, the interworking with the GSM network can be realized.

l The UG02MTCB supports the UMTS AMR codec for interworking with the UMTSnetwork.

l Accepting resource control and management of the CMU9.3.1 Panel of the MTCB9.3.2 Indicators on the MTCB9.3.3 Interfaces on the MTCB9.3.4 Fuses on the MTCB9.3.5 Technical Specifications of the MTCB9.3.6 MTCB Subboards

9.3.1 Panel of the MTCBFigure 9-7 shows the panel of the UG01MTCB.

Figure 9-7 Panel of the UG01MTCB

POWER

U24

U2

U9 TC Subboard 0

TC Subboard 1


F1

F2

J20RJ1

MBUS

CO

M0

OFFLINE

RUNALM

MTCB

MTCB



Issue 05 (2009-01-09)

Figure 9-8 shows the panel of the UG021MTCB.

Figure 9-8 Panel of the UG02MTCB

Logicchip

MBUS


TC subboard 1

TC subboard 0

CPUprocessor

Power module+3.3V

J10

S1

BOOTROM/

CPLD

J6

J8J91208/CPLDS

TC/EC

F1/4A

F2/1A+5V

-48V

RUNALM

OFFLINE

MTCBb

FE0

CO

M0MTCBb

ACT

9.3.2 Indicators on the MTCB

Table 9-19 lists the indicator meaning of the MTCB.

Table 9-19 Indicator meaning of the MTCB



Runningindicator





9-21









Alarmindicator







9.3.3 Interfaces on the MTCB

Table 9-20 lists the interfaces on the MTCB.

Table 9-20 Interfaces on the MTCB




RS232 serial port


FE networkinterface

NOTE

Interface FE0 is located on the UG02MTCB.

9.3.4 Fuses on the MTCB

For details on fuse positions of the MTCB, see 9.3.1 Panel of the MTCB. Table 9-21 lists thespecifications.



Issue 05 (2009-01-09)

Table 9-21 Fuses on the MTCB




9.3.5 Technical Specifications of the MTCB

Table 9-22 and Table 9-23 list the technical specifications of the MTCB.

Table 9-22 Power consumption and heat dissipation of the MTCB


Powerconsumption

24 W UG02MTCB without thesubboard

Heat dissipation 24 W

Table 9-23 Service processing capability of the MTCB






1024 channels (G.711 voice codecmode)672 channels (G.729a/b voice codecmode)

Use the MVDD subboard(only for the UG02MTCB).


1024 Use the MVDB subboard insubboard slot 0/1.

2048 Use the MVDB subboard insubboard slot 2.






1024 (tail length: 64 ms) Use the MECF subboard.



9-23



2048 (tail length: 64 ms) Use the MECH subboard.

2048 (tail length: 128 ms) Use the MECI subboard.



9.3.6 MTCB Subboards

For details on the description of the MTCB subboard, see 9.1.6 MVPB Subboards.

9.4 MTCDThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MTCD.

CAUTIONIn the SSM-32 frame, two boards inserted in two opposite slots cannot use the GE bus on thebackplane at the same time. The slot opposite to the front MTCD cannot be inserted with theboard using the GE bus.

As the voice processing unit, the MTCDs are inserted in front slots 0 to 5 and slots 10 to 15 inthe main control frame and the service frame. The MTCD can be inserted in both SSM-256frames and SSM-32 frames. When the MTCD is inserted in the SSM-256 frame, the MTNBmust be inserted in the SSM-256 frame; however, the MTNU cannot be inserted in the SSM-256frame.

The MTCD provides the following functions:


l Implementing IP packet adaptation of voice services based on UDP, RTP and IP; supportingvaried voice codec modes including G.711A, G.711μ, G.723, G.726, G.729, AMR,EVRC,QCELP8K, and QCELP13K


l Accepting resource control and management of the main control board

9.4.1 Panel of the MTCD

9.4.2 Indicators on the MTCD

9.4.3 Interfaces on the MTCD

9.4.4 Fuses on the MTCD



Issue 05 (2009-01-09)

9.4.5 Technical Specifications of the MTCD

9.4.6 MTCD Subboards

9.4.1 Panel of the MTCD

Figure 9-9 shows the panel of the MTCD.

Figure 9-9 Panel of the MTCD

POWER

U24

U2

U9 TC Subboard 0

TC Subboard 1


F1

F2

J20RJ1

MBUS

CO

M0

OFFLINE

RUNALM

MTCD

MTCD

9.4.2 Indicators on the MTCD

Table 9-24 lists the indicator meaning of the MTCD.

Table 9-24 Indicator meaning of the MTCD



Runningindicator




9-25










Alarmindicator







9.4.3 Interfaces on the MTCD

Table 9-25 lists the interfaces on the MTCD.

Table 9-25 Interfaces of the MTCD




RS232 serial port

FE0 1 RJ45 Used as a debugserial port

FE networkinterface

9.4.4 Fuses on the MTCD

For details on fuse positions of the MTCD, see 9.4.1 Panel of the MTCD. Table 9-26 lists thespecifications.



Issue 05 (2009-01-09)

Table 9-26 Fuses on the MTCD




9.4.5 Technical Specifications of the MTCD

Table 9-27 lists the technical specifications of the MTCD.

Table 9-27 Technical specifications of the MTCD


Powerconsumption

N/A 24 W MTCD without thesubboard




1024 channels (G.711voice codec mode)512 channels (G.723/G.726/ G.729/ AMRvoice codec mode)

Use the MVDBsubboard.


1024 Use the MVDBsubboard in subboardslot 0/1.

2048 Use the MVDBsubboard in subboardslot 2.


1024 (tail length: 16ms or 32 ms)1024 (tail length: 48ms or 64 ms)512 (tail length: 80ms, 96 ms, 110 ms, or128 ms)

Use the MECCsubboard.

2048 (tail length: 16ms or 32 ms)2048 (tail length: 48ms or 64 ms)1024 (tail length: 80ms, 96 ms, 110 ms, or128 ms)

Use the MECEsubboard.

1024 (tail length: 64ms)

Use the MECFsubboard.



9-27



Use the MECGsubboard.


Use the MECHsubboard.


Use the MECIsubboard.


Use the MECJsubboard.


Use the MECKsubboard.


Use the MVQEsubboard.

9.4.6 MTCD Subboards

For details on the description of the MTCD subboard, see 9.2.6 MVPD Subboards.

9.5 MECUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MECU.

As the echo cancellation unit, the MECUs are inserted in front slots 0 to 6 and slots 9 to 15 inthe main control frame and the service frame.

The MECU provides the following functions:

l Implementing the echo cancellation

l Accepting resource control and management of the CMU

The MECU falls into two types: UG01MECU and UG02MECU. The difference between twotypes is as follows:

l The UG01MECU can be used only in the SSM-256 frame.

l The UG02MECU can be used in the SSM-256 frame and the SSM-32 frame. The silkscreenon the ejector level of the UG02MECU is MECUb.

9.5.1 Panel of the MECU

9.5.2 Indicators on the MECU

9.5.3 Interfaces on the MECU

9.5.4 Fuses on the MECU

9.5.5 Technical Specifications of the MECU

9.5.6 MECU Subboards



Issue 05 (2009-01-09)

9.5.1 Panel of the MECU

Figure 9-10 shows the panel of the MECU.

Figure 9-10 Panel of the MECU

CO

M0

OFFLINE

RUNALM

MECU

MECU

EC MODULE

EC MODULE

POWER

RJ1

MBUSU58

U24

U33

U29

U55

F1F2

9.5.2 Indicators on the MECU

Table 9-28 lists the meaning of the indicators on the MECU.

Table 9-28 Indicator meaning of the MECU



Runningindicator





9-29









Alarmindicator







9.5.3 Interfaces on the MECU

Table 9-29 lists the interfaces on the MECU.

Table 9-29 Interface on the MECU




RS232 serialport

9.5.4 Fuses on the MECU

For details on fuse positions of the MECU, see 9.5.1 Panel of the MECU. Table 9-30 lists thespecifications.

Table 9-30 Fuses on the MECU






Issue 05 (2009-01-09)

9.5.5 Technical Specifications of the MECU

Table 9-31 and Table 9-32 list the technical specifications of the MECU.

Table 9-31 Technical specifications of the UG01MECU


Powerconsumption

N/A 16.4 W –



Number ofthe ECchannels

2048 –

Table 9-32 Technical specifications of the UG02MECU


Powerconsumption

N/A 21.5 W –




4 K Used in the SSM-32 frame

2048 Used in the SSM-256 frame

9.5.6 MECU Subboards

MECC/MECF/MECG/MECJ/MECK SubboardsThe MECC/MECF/MECG/MECJ/MECK subboards work as the EC subboards and provide thefollowing functions:

l The MECC/MECF/MECG subboards provide the acoustic echo cancellation (AEC) andelectric EC functions.


l The MECC/MECF/MECG/MECJ/MECK subboards support various tail delays.

Table 9-33 lists the technical specifications of the MECC/MECF/MECG/MECJ/MECKsubboards.



9-31

Table 9-33 Technical specifications of the MECC/MECF/MECG/MECJ/MECK subboards

Subboard Tail Delay Number of ECChannels

PowerConsumption

HeatDissipation

MECC 16 ms/32 ms 1024 3.8 W 3.8 W

48 ms/64 ms 1024

80 ms/96 ms/110 ms/128ms

512

MECF 64 ms 1024 2 W 2 W

MECG 128 ms 1024 5.3 W 5.3 W

MECJ 64 ms 1024 5.4 W 5.4 W

MECK 64 ms 2048 12.2 W 12.2 W



Issue 05 (2009-01-09)

10 E1/T1 and E3/T3 Interface Units

About This Chapter

The E1/T1 and E3/T3 interface units consist of ME32, MESU, MT32, MTSU, MPIE, MEAC,MTAC.

10.1 ME32This describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the ME32.

10.2 MESUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MESU.

10.3 MT32This describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MT32.

10.4 MTSUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MTSU.

10.5 MPIEThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MPIE.

10.6 MEACThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MEAC.

10.7 MTACThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MTAC.

HUAWEI UMG8900Hardware Description 10 E1/T1 and E3/T3 Interface Units


10-1

10.1 ME32This describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the ME32.

As the time division multiplex (TDM) service interface board, the ME32s are inserted in backslots 2 to 5 and slots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15in the service frame.

The ME32 falls into two types: UG01ME32 and UG02ME32. They are similar in function andappearance. They differ in that the UG01ME32 can be inserted only in SSM-256 frames insteadof SSM-32 frames, while the UG02ME32 can be inserted in both. The name silkscreen of thefront panel on the UG01ME32 is ME32, while that on the UG02ME32 is ME32b.

The ME32 provides the following functions:

l Providing 32 E1 interfaces

l Providing 32 E1 frames

l Providing the function of drawing the line signaling of the R2 signaling or inserting thesignaling

l Providing internal FE interfaces to enable operation, maintenance, and management of themain control board

l Interacting with the main control board through maintenance bus (MBus) modules tomonitor board temperature, voltage and control the operations of power-on/off

l Providing the 8 kHz line clock source for the master/slave clock board from the board panelthrough clock distribution cables

l Receiving SSM information from the E1 interface and sending it to the clock system

l Providing service link loopback at all levels and service channel detection within the board

10.1.1 Panel of the ME32

10.1.2 Indicators on the ME32

10.1.3 Interfaces on the ME32

10.1.4 DIP Switches and Jumpers of the ME32

10.1.5 Fuses on the ME32

10.1.6 Technical specifications of the ME32

10.1.1 Panel of the ME32

Figure 10-1 shows the panel of the ME32.

10 E1/T1 and E3/T3 Interface UnitsHUAWEI UMG8900Hardware Description


Issue 05 (2009-01-09)

Figure 10-1 Panel of the ME32

ME32

OFFLINE

8K_O

UT

E1/T

1_0-

15E1

/T1_

16-3

1RUNALM

ME32

MBUS

POWERJ6F131(3)

F132(4)

J16

S14

S5S12

S11

S10

S9

S8

S6

S7

S13S15

J11

J12

S1J15

J14

J13

J10

J20 J21

J7

10.1.2 Indicators on the ME32

Table 10-1 lists the meaning of the indicators on the ME32.

Table 10-1 Indicator meaning of the ME32



Runningindicator









10-3





Alarm indicator ALM Red Always on orflashing fast






10.1.3 Interfaces on the ME32

Table 10-2 lists the interfaces on the ME32.

Table 10-2 Interfaces on the ME32

Category Quantity

PhysicalInterface


8K_OUT 1 RJ48 Providing the resource of8 kHz clock signal

RS422

E1/T1_0-15 1 DB100 The 2 M E1 interface ingroup 0, connecting the E1cables 0 to 15

-

E1/T1_16-31 1 DB100 The 2 M E1 interface ingroup 1, connecting the E1cables 16 to 31

-

10.1.4 DIP Switches and Jumpers of the ME32

CAUTIONThe 32 E1 cables connected with the ME32 must be of the same characteristic impedance value.That is, one ME32 cannot be connected with both 75-ohm E1 cables and 120-ohm E1 cables.

The methods for setting DIP switches for the UG01ME32 and UG02ME32 are slightly different.The following describes how to set the DIP switches.



Issue 05 (2009-01-09)

DIP Switches of the UG01ME32

Table 10-3 lists DIP switches of the UG01ME32.

Table 10-3 DIP switches of the UG01ME32

Function Switch Bit Range of E1Interfaces

Setting the grounding modesfor the E1 cables

S2 1 to 8 16 to 23

S3 1 to 8 24 to 31

S4 1 to 8 0 to 7

S5 1 to 8 8 to 15

Setting the impedance valuesthat match the E1 cables

S6 1 to 8 24 to 27

S7 1 to 8 20 to 23

S8 1 to 8 28 to 31

S9 1 to 8 0 to 3

S10 1 to 8 4 to 7

S11 1 to 8 8 to 11

S12 1 to 8 12 to 15

S13 1 to 8 16 to 19

Reporting attribute of the E1links

S14 1 to 2 0 to 31

The method for setting DIP switches of the UG01ME32 is as follows:

l Method for setting DIP switches for 75-ohm E1 cables

Table 10-4 Setting DIP switches of the UG01ME32 (75-ohm E1 coaxial cable)

Switch Bit Status

S2 to S13 1 to 8 ON

S14 1 to 2 ON


Table 10-5 Setting DIP switches of the UG01ME32 (120-ohm E1 twisted pair)

Switch Bit Status

S2 to S5 1 to 8 OFF



10-5

Switch Bit Status

S6 to S13 1 to 4 OFF

5 to 8 ON

S14 1 OFF

2 ON


Table 10-6 lists DIP switches of the UG02ME32.

Table 10-6 DIP switches of the UG02ME32

Function Switch Bit Range of E1 Interfaces

Setting the impedancevalues that match the E1cables

S2 1 to 8 20 to 23

S3 1 to 8 24 to 27

S4 1 to 8 28 to 31

S5 1 to 8 0 to 3

S6 1 to 8 4 to 7

S7 1 to 8 8 to 11

S8 1 to 8 12 to 15

S9 1 to 8 16 to 19

Setting the groundingmodes for the E1 cables

S10 1 to 8 16 to 23

S11 1 to 8 8 to 15

S12 1 to 8 0 to 7

S13 1 to 8 24 to 31


S14 1 to 2 0 to 31



Table 10-7 Setting DIP switches of the UG02ME32 (75-ohm E1 coaxial cable)

Switch Bit Status

S2 to S13 1 to 8 ON

S14 1 to 2 ON



Issue 05 (2009-01-09)


Table 10-8 Setting DIP switches of the UG02ME32 (120-ohm E1 twisted pair)

Switch Bit Status

S2 to S9 1 to 4 OFF

5 to 8 ON


S14 1 OFF

2 ON

10.1.5 Fuses on the ME32

For details on fuse positions of the UG01ME32, see 10.1.1 Panel of the ME32. Table 10-9 liststhe specifications.

Table 10-9 Fuses on the ME32




The fuses on the UG02ME32 are the same as those on the UG01ME32, and the numbers areF133 and F134. For fuse positions, see 10.1.1 Panel of the ME32. Table 10-10 lists thespecifications.

Table 10-10 Fuses on the ME32




10.1.6 Technical specifications of the ME32

Table 10-11 lists the technical specifications of the ME32.

Table 10-11 Technical specifications of the ME32


Powerconsumption

N/A 19.2 W –



10-7



10.2 MESUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MESU.

As the TDM service interface board, the MESUs are inserted in back slots 2 to 5 and slots 10 to15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. TheMESU can be inserted in both SSM-256 frames and SSM-32 frames.

The MESU provides the following functions:






l Receiving SSM information from the E1 interface and sending it to the clock system

l Providing the receiving and transmitting of the No.5 signaling and the register signaling


10.2.1 Panel of the MESU

10.2.2 Indicators on the MESU

10.2.3 Interfaces on the MESU

10.2.4 DIP Switches and Jumpers of the MESU

10.2.5 Fuses on the MESU

10.2.6 Technical specifications of the MESU

10.2.1 Panel of the MESU

Figure 10-2 shows the panel of the MESU.



Issue 05 (2009-01-09)

Figure 10-2 Panel of the MESU

MESU

OFFLINE

8K_O

UT

E1/T

1_0-

15E1

/T1_

16-3

1RUNALM

MESU

MBUS

POWERJ6 F131

F132

J16

S14

S5S12

S11

S10

S9

S8

S6

S7

S13S15

J11

J12

S1J15

J14

J13

J10

J20 J21

J7

S4

S3

S2

J9J22

10.2.2 Indicators on the MESU

Table 10-12 lists the meaning of the indicators on the MESU.

Table 10-12 Indicator meaning of the MESU



Runningindicator









10-9





Alarmindicator







10.2.3 Interfaces on the MESU

Table 10-13 lists the interfaces on the MESU.

Table 10-13 Interfaces on the MESU

Category Quantity

PhysicalInterface



RS422

E1/T1_0-15 1 DB100 The 2 M E1 interface ingroup 0, connecting theE1 cables 0 to 15

-


-

10.2.4 DIP Switches and Jumpers of the MESU

CAUTIONThe 32 E1 cables connected with the MESU must be of the same characteristic impedance value.That is, one MESU cannot be connected with both 75-ohm E1 cables and 120-ohm E1 cables.

Table 10-14 lists DIP switches of the MESU.



Issue 05 (2009-01-09)

Table 10-14 DIP switches of the MESU



S2 1 to 8 20 to 23

S3 1 to 8 24 to 27

S4 1 to 8 28 to 31

S5 1 to 8 0 to 3

S6 1 to 8 4 to 7

S7 1 to 8 8 to 11

S8 1 to 8 12 to 15

S9 1 to 8 16 to 19


S10 1 to 8 16 to 23

S11 1 to 8 8 to 15

S12 1 to 8 0 to 7

S13 1 to 8 24 to 31


S14 1 to 2 0 to 31

The method for setting DIP switches of the MESU is as follows:


Table 10-15 Setting DIP switches of the MESU (75-ohm E1 coaxial cable)

Switch Bit Status

S2 to S13 1 to 8 ON

S14 1 to 2 ON


Table 10-16 Setting DIP switches of the MESU (120-ohm E1 twisted pair)

Switch Bit Status

S2 to S9 1 to 4 OFF

5 to 8 ON


S14 1 OFF



10-11

Switch Bit Status

2 ON

10.2.5 Fuses on the MESU

For details on fuse positions of the MESU, see 10.2.1 Panel of the MESU. Table 10-17 liststhe specifications.

Table 10-17 Fuses on the MESU




10.2.6 Technical specifications of the MESU

Table 10-18 lists the technical specifications of the MESU.

Table 10-18 Technical specifications of the MESU


Powerconsumption

N/A 24 W –


10.3 MT32This describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MT32.

As the TDM service interface board, the MT32s are inserted in back slots 2 to 5 and slots 10 to15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame.

The MT32 falls into two types: UG01MT32 and UG02MT32. They are similar in function andappearance. The difference is that the UG01MT32 can be inserted only in the SSM-256 frame,while the UG02MT32 can be inserted in both the SSM-256 frame and the SSM-32 frame. Inappearance, the name silkscreen on the front panel of the UG01MT32 is marked with MT32,and that of the UG02MT32 is marked with MT32b.

The MT32 provides the following functions:

l Providing 32 T1 interfaces

l Providing 32 T1 frames

l Providing the function of extracting or inserting the line signaling of the R2 channelassociated signaling (CAS)



Issue 05 (2009-01-09)




l Receiving SSM information from the T1 interface and sending it to the clock system


10.3.1 Panel of the MT32

10.3.2 Indicators on the MT32

10.3.3 Interfaces on the MT32

10.3.4 DIP Switches and Jumpers of the MT32

10.3.5 Fuses on the MT32

10.3.6 Technical specifications of the MT32

10.3.1 Panel of the MT32

Figure 10-3 shows the panel of the MT32.

Figure 10-3 Panel of the MT32

MT32

OFFLINE

8K_O

UT

E1/T

1_0-

15E1

/T1_

16-3

1

RUNALM

MT32

MBUS

POWERJ6F131(3)

F132(4)

J16

S14

S5S12

S11

S10

S9

S8

S6

S7

S13S15

J11

J12

S1J15

J14

J13

J10

J20 J21

J7

S4

S3

S2

J9

J4

J3



10-13

10.3.2 Indicators on the MT32

Table 10-19 lists the meaning of the indicators on the MT32.

Table 10-19 Indicator meaning of the MT32



Runningindicator















10.3.3 Interfaces on the MT32

Table 10-20 lists the interfaces on the MT32.

Table 10-20 Interfaces on the MT32




RS422



Issue 05 (2009-01-09)



E1/T1_0-15 1 DB100 The T1 interface ingroup 0, connecting theT1 cables 0 to 15

-


-

10.3.4 DIP Switches and Jumpers of the MT32

DIP Switches and Jumpers of the UG01MT32Table 10-21 lists DIP switches of the UG01MT32.

Table 10-21 DIP switches of the UG01MT32



S2 1 to 8 16 to 23

S3 1 to 8 24 to 31

S4 1 to 8 0 to 7

S5 1 to 8 8 to 15


S6 1 to 8 24 to 27

S7 1 to 8 20 to 23

S8 1 to 8 28 to 31

S9 1 to 8 0 to 3

S10 1 to 8 4 to 7

S11 1 to 8 8 to 11

S12 1 to 8 12 to 15

S13 1 to 8 16 to 19


S14 1 to 2 0 to 31

Table 10-22 lists the method for setting DIP switches of the UG01MT32.



10-15

Table 10-22 Setting DIP switches of the UG01MT32 (100-ohm T1 cable)

Switch Bit Status

S2 to S5 1 to 8 OFF

S6 to S13 1 to 4 ON

5 to 8 OFF

S14 1 ON

2 OFF

DIP Switches of the UG02MT32

Table 10-23 lists DIP switches of the UG02MT32.

Table 10-23 DIP switches of the UG02MT32



S2 1 to 8 20 to 23

S3 1 to 8 24 to 27

S4 1 to 8 28 to 31

S5 1 to 8 0 to 3

S6 1 to 8 4 to 7

S7 1 to 8 8 to 11

S8 1 to 8 12 to 15

S9 1 to 8 16 to 19


S10 1 to 8 16 to 23

S11 1 to 8 8 to 15

S12 1 to 8 0 to 7

S13 1 to 8 24 to 31


S14 1 to 2 0 to 31

Table 10-24 lists the method for setting DIP switches of the UG02MT32.

Table 10-24 Setting DIP switches of the UG02MT32 (100-ohm T1 cable)

Switch Bit Status

S2 to S9 1 to 4 ON



Issue 05 (2009-01-09)

Switch Bit Status

5 to 8 OFF


S14 1 ON

2 OFF

10.3.5 Fuses on the MT32

For details on fuse positions of the UG01MT32, see 10.3.1 Panel of the MT32. Table 10-25lists the specifications.

Table 10-25 Fuses on the UG01MT32




The fuses on the UG02MT32 are the same as those on the UG01MT32, and the numbers areF133 and F134. For fuse positions, see 10.3.1 Panel of the MT32. Table 10-26 lists thespecifications.

Table 10-26 Fuses on the MT32




10.3.6 Technical specifications of the MT32

Table 10-27 lists the technical specifications of the MT32.

Table 10-27 Technical specifications of the MT32




10.4 MTSUThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MTSU.



10-17

As the TDM service interface board, the MTSUs are inserted in back slots 2 to 5 and slots 10 to15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. TheMTSU can be inserted in both SSM-256 frames and SSM-32 frames.

The MTSU provides the following functions:






l Receiving SSM information from the T1 interface and sending it to the clock system

l Providing the receiving and transmitting of the No.5 signaling and the register signaling


10.4.1 Panel of the MTSU

10.4.2 Indicators on the MTSU

10.4.3 Interfaces on the MTSU

10.4.4 DIP Switches and Jumpers of the MTSU

10.4.5 Fuses on the MTSU

10.4.6 Technical specifications of the MTSU

10.4.1 Panel of the MTSU

Figure 10-4 shows the panel of the MTSU.



Issue 05 (2009-01-09)

Figure 10-4 Panel of the MTSU

MBUS

POWERJ6F131(3)

F132(4)

J16

S14

S5S12

S11

S10

S9

S8

S6

S7

S13S15

J11

J12

S1J15

J14

J13

J10

J20 J21

J7

S4

S3

S2

J4

J3

J22 J9

J8

MTSU

OFFLINE

8K_O

UT

E1/T

1_0-

15E1

/T1_

16-3

1RUNALM

MTSU

10.4.2 Indicators on the MTSU

Table 10-28 lists the meaning of the indicators on the MTSU.

Table 10-28 Indicator meaning of the MTSU



Runningindicator









10-19





Alarmindicator







10.4.3 Interfaces on the MTSU

Table 10-29 lists the interfaces on the MTSU.

Table 10-29 Interfaces on the MTSU



8K_OUT 1 RJ48 Providing the resourceof 8 kHz clock signal

RS422


-


-

10.4.4 DIP Switches and Jumpers of the MTSU

Table 10-30 lists DIP switches of the MTSU.

Table 10-30 DIP switches of the MTSU


Setting the impedance valuesthat match the T1 cables

S2 1 to 8 20 to 23

S3 1 to 8 24 to 27

S4 1 to 8 28 to 31



Issue 05 (2009-01-09)


S5 1 to 8 0 to 3

S6 1 to 8 4 to 7

S7 1 to 8 8 to 11

S8 1 to 8 12 to 15

S9 1 to 8 16 to 19

Setting the grounding modesfor the T1 links

S10 1 to 8 16 to 23

S11 1 to 8 8 to 15

S12 1 to 8 0 to 7

S13 1 to 8 24 to 31

Reporting attribute of the T1links

S14 1 to 2 0 to 31

Table 10-31 lists the method for setting DIP switches of the MTSU.

Table 10-31 Setting DIP switches of the MTSU (100-ohm T1 cable)

Switch Bit Status

S2 to S9 1 to 4 ON

5 to 8 OFF


S14 1 ON

2 OFF

10.4.5 Fuses on the MTSU

For details on fuse positions of the MTSU, see 10.4.1 Panel of the MTSU. Table 10-32 liststhe specifications.

Table 10-32 Fuses on the MTSU




10.4.6 Technical specifications of the MTSU



10-21

Table 10-33 lists the technical specifications of the MTSU.

Table 10-33 Technical specifications of the MTSU




10.5 MPIEThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MPIE.

As the TDM service interface board, the MPIEs are inserted in back slots 2 to 5 and slots 10 to15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. Youcan set the work mode to either master/slave mode or load-sharing mode; however, you can onlychoose one work mode at one time. The MPIE can be inserted in both SSM-256 frames andSSM-32 frames.

The MPIE provides the following functions:

l Providing three PDH electrical interfaces of E3/T3 that carry TDM services

l Providing the HDB3/B3ZS codec through each E3/T3.

l Multiplexing 16 E1s/28 T1s/21 E1s to one E3/T3/G.747 and demultiplexing one E3/T3/G.747 to 16 E1s/28 T1s/21 E1s respectively

l Providing the function of extracting and inserting channel associated signaling (CAS)


l Supporting the extraction of the SSM information and sending it to the clock system

l Supporting receiving the SSM message from the clock system, and connecting to theinterface


NOTE

When the interface type of the MPIE is set to T3 or G.747, and the transmission distance is required to belonger than 68.5 m [75 yd.], the communication distance is set to long.

10.5.1 Panel of the MPIE

10.5.2 Indicators on the MPIE

10.5.3 Interfaces on the MPIE

10.5.4 Fuses on the MPIE

10.5.5 Technical specifications of the MPIE

10.5.6 MPIE Subboards

10.5.1 Panel of the MPIE

Figure 10-5 shows the panel of the MPIE.



Issue 05 (2009-01-09)

Figure 10-5 Panel of the MPIE

POWER

MBUS

CPUJ5

U70

J4F4

F3F1

F2

J6

J11

s1

J10

OFFLINE

CO

M0

ACT

RUNALM

MPIE

RX0

TX0ACTACT

LINK

RX1

TX1ACTACT

LINK

RX2

TX2ACTACT

LINK

8K_O

UT

MPIE

10.5.2 Indicators on the MPIE

Table 10-34 lists the meaning of the indicators on the MPIE.

Table 10-34 Indicator meaning of the MPIE



Runningindicator






The board is being loadedor it does not work.



10-23





Alarmindicator




Workingindicator



Serviceinterface linkconnectionindicator

LINK Green Always on The line is in thesynchronous state and theline specifications meetthe requirements.

Always off The line is in theasynchronous state andthe line specifications donot meet therequirements.

Serviceinterfacemasterindicator


The interface is in masterstate.

Always off The interface is in slavestate.




10.5.3 Interfaces on the MPIE

Table 10-35 lists the interfaces on the MPIE.



Issue 05 (2009-01-09)

Table 10-35 Interfaces on the MPIE




RS232 serial port

8K_OUT 1 RJ48 Providing the outputinterface of 8 kHzclock signal

RS422

Serviceinterface

3 BNCelectricalinterface

Providing three PDHservice interfaces ofE3/T3, that is,electrical interfaces

E3, T3 and G.747

10.5.4 Fuses on the MPIE

For details on fuse positions of the MPIE, see 10.5.1 Panel of the MPIE. Table 10-36 lists thespecifications.

Table 10-36 Fuses on the MPIE






10.5.5 Technical specifications of the MPIE

Table 10-37 lists the technical specifications of the MPIE.

Table 10-37 Technical specifications of the MPIE




10.5.6 MPIE Subboards

Up to three ME3A subboards can be configured on the MPIE.

The ME3A subboard is mainly used to multiplex and demultiplex an E3/T3 interface.

Table 10-38 lists the technical specifications of the ME3A subboard.



10-25

Table 10-38 Technical specifications of the ME3A subboard




10.6 MEACThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MEAC.

As the 32-port E1 interface board, the MEAC is inserted in back slots 2 to 5 and slots 10 to 15in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. TheMEAC is inserted with the MASU in front-and-back mode. The MEAC can be inserted in bothSSM-256 frames and SSM-32 frames.

The MEAC provides the following functions:



l Supporting 32 IMA groups, each of which supports up to 32 links

l Providing 8 kHz clock reference source for the master and slave CLKs

l Conducting all-level loopback on service links

l Supporting self-recovering software and locating faults

NOTE

The MASU provides a dedicated maintenance bus (MBus) module, but no internal FE interface. Therefore,the main control board operates and maintains the back interface board through the front MASU

10.6.1 Panel of the MEAC

10.6.2 Indicators on the MEAC

10.6.3 Interfaces on the MEAC

10.6.4 DIP Switches on the MEAC

10.6.5 Fuses on the MEAC

10.6.6 Technical specifications of the MEAC

10.6.1 Panel of the MEAC

Figure 10-6 shows the panel of the MEAC.



Issue 05 (2009-01-09)

Figure 10-6 Panel of the MEAC

MEAC

OFFLINE

8K_O

UT

E1/T

1_0-

15E1

/T1_

16-3

1RUNALM

MEAC

MBUS

POWERJ6F131(3)

F132(4)

J16

S14

S5S12

S11

S10

S9

S8

S6

S7

S13S15

J11

J12

S1J15

J14

J13

J10

J20 J21

J7

S4

S3

S2

J9

10.6.2 Indicators on the MEAC

Table 10-39 lists the meaning of the indicators on the MEAC.

Table 10-39 Indicator meaning of the MEAC



Board runningindicator









10-27



Board alarmindicator




Board masterindicator






10.6.3 Interfaces on the MEAC

Table 10-40 lists the interfaces on the MEAC.

Table 10-40 Interfaces on the MEAC




RS422


-


-

10.6.4 DIP Switches on the MEAC

Table 10-41 lists DIP switches on the MEAC.

Table 10-41 DIP switches of the MEAC


Resetting the switch manually S1 1 Resetting the board



Issue 05 (2009-01-09)



S5 1 to 8 0 to 7

S6 1 to 8 8 to 15

S7 1 to 8 16 to 23

S8 1 to 8 24 to 31


S9 1 to 8 0 to 3

S10 1 to 8 4 to 7

S11 1 to 8 8 to 11

S12 1 to 8 12 to 15

S13 1 to 8 16 to 19

S14 1 to 8 20 to 23

S15 1 to 8 24 to 27

S16 1 to 8 28 to 31

The method for setting DIP switches of the MEAC is as follows:


Table 10-42 Setting DIP switches of the MEAC (75-ohm E1 coaxial cable)

Switch Bit Status

S5 to S8 1 to 8 ON

S9 to S16 1 to 8 ON


Table 10-43 Setting DIP switches of the MEAC (120-ohm E1 twisted pair)

Switch Bit Status

S5 to S8 1 to 8 OFF


5 to 8 ON

10.6.5 Fuses on the MEAC

For details on fuse positions of the MEAC, see 10.6.1 Panel of the MEAC. Table 10-44 liststhe specifications.



10-29

Table 10-44 Fuses on the MEAC




10.6.6 Technical specifications of the MEAC

Table 10-45 lists the technical specifications of the MEAC.

Table 10-45 Technical specifications of the MEAC


Powerconsumption

N/A 12.8 W –

Heatdissipation

N/A 12.8 W

Interfaces Transmissiondistance

Supporting long and shorttransmission. Long cable: 1500 m[4921 ft.]; Short cable: 400 m [1312ft.]

–

Transmission cable E1: 120-ohm twisted pair and 75-ohm coaxial cable

IMA IMA1.1 protocol, compatible with1.0, supporting 32 IMA groups

Interface capability 32 E1 interfaces

Transmission code HDB3, AMI


–43 dB/1024 kHz

Electromagneticcharacteristics

CLASS B

10.7 MTACThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MTAC.

As the 32-port IMA T1 service interface card, the MEACs are inserted in back slots 2 to 5 andslots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the serviceframe. The MTACs can be inserted in both SSM-256 frames and SSM-32 frames.

The MTAC provides the following functions:




Issue 05 (2009-01-09)


l Supporting 32 IMA groups, each of which supports up to 32 links

l Providing 8 kHz clock reference source for the master and slave CLKs

l Conducting all-level loopback on service links

l Supporting self-recovering software and locating faults

NOTE

The MASU provides a dedicated maintenance bus (MBus) module on the back interface board, but internalFE interface is unavailable. Therefore, the main control board operates and maintains the back interfaceboard through the front MASU.

10.7.1 Panel of the MTAC

10.7.2 Indicators on the MTAC

10.7.3 Interfaces on the MTAC

10.7.4 DIP Switches and Jumpers of the MTAC

10.7.5 Fuses on the MTAC

10.7.6 Technical specifications of the MTAC

10.7.1 Panel of the MTAC

Figure 10-7 shows the panel of the MTAC.

Figure 10-7 Panel of the MTAC

MBUS

POWERJ6F131(3)

F132(4)

J16

S14

S5S12

S11

S10

S9

S8

S6

S7

S13S15

J11

J12

S1J15

J14

J13

J10

J20 J21

J7

S4

S3

S2

J9

MTAC

OFFLINE

8K_O

UT

E1/T

1_0-

15E1

/T1_

16-3

1

RUNALM

MTAC



10-31

10.7.2 Indicators on the MTAC

Table 10-46 lists the indicator meaning of the MTAC.

Table 10-46 Indicator meaning of the MTAC





















10.7.3 Interfaces on the MTAC

Table 10-47 lists the interfaces on the MTAC.



Issue 05 (2009-01-09)

Table 10-47 Interfaces on the MTAC




RS422


-


-

10.7.4 DIP Switches and Jumpers of the MTAC

Table 10-48 lists DIP switches of the MTAC.

Table 10-48 DIP switches of the MTAC


Resetting the switchmanually

S1 1 Resetting the board

Setting the grounding modesfor the T1 cables

S5 1 to 8 0 to 7

S6 1 to 8 8 to 15

S7 1 to 8 16 to 23

S8 1 to 8 24 to 31


S9 1 to 8 0 to 3

S10 1 to 8 4 to 7

S11 1 to 8 8 to 11

S12 1 to 8 12 to 15

S13 1 to 8 16 to 19

S14 1 to 8 20 to 23

S15 1 to 8 24 to 27

S16 1 to 8 28 to 31

Table 10-49 lists the method for setting DIP switches of the MTAC.



10-33

Table 10-49 Setting DIP switches of the MTAC (100-ohm T1 cable)

Switch Bit Status

S5 to S8 1 to 8 OFF

S9 to S16 1 to 4 ON

5 to 8 OFF

10.7.5 Fuses on the MTAC

For details on fuse positions of the MTAC, see 10.7.1 Panel of the MTAC. Table 10-50 liststhe specifications.

Table 10-50 Fuses on the MTAC




10.7.6 Technical specifications of the MTAC

Table 10-51 lists the technical specifications of the MTAC.

Table 10-51 Technical specifications of the MTAC


Powerconsumption

N/A 12.8 W –

Heatdissipation

N/A 12.8 W

Interfaces Transmissiondistance

Supporting long and shorttransmission. Long cable: 1500 m[4921 ft.]; Short cable: 400 m [1312ft.]

–

Transmission cable T1: 120-ohm twisted pair

IMA IMA1.1 protocol, compatible with1.0, supporting 32 IMA groups

Interface capability 32 T1 interfaces

Transmission code HDB3, AMI


–43 dB/1024 kHz



Issue 05 (2009-01-09)



CLASS B



10-35

11 SDH Interface Units

About This Chapter

The SDH interface units consist of MS2L, MS2E, MS1L, and MS1E.

11.1 MS2LThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MS2L.

11.2 MS2EThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MS2E.



HUAWEI UMG8900Hardware Description 11 SDH Interface Units


11-1


As the TDM service interface board, the MS2Ls are inserted in back slots 2 to 5 and slots 10 to15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. In theSSM-32 frame, if the clock subboard of the MTNC provides the system clock, then the MS2Lcan be inserted in any slot of back slots 0 to 5 in the main control frame. The MS2L can workin master and slave backup mode or load-sharing mode.

The MS2L provides the following functions:

l Extracting clock signals and forming frames at the two 155 Mbit/s SDH optical interfaces;providing interfaces with pluggable optical modules enabling different transmissiondistances

l Processing overheads of regenerator section and multiplex section of optical signals andchecking communication over optical channels

l Implementing SDH mapping, de-mapping and processing overheads of high-order pathand low-order path

l Forming 2 x 63 E1 or 2 x 84 T1 frames and performing DS0 switch

The MS2L falls into two types: the UG01MS2L and UG02MS2L. The difference between twotypes is as follows:

l The UG01MS2L can be used only in the SSM-256 frame.

l The UG02MS2L can be used in the SSM-256 frame and the SSM-32 frame. The silkscreenon the ejector level of the UG02MS2L is MS2Lb.

11.1.1 Panel of the MS2L

11.1.2 Indicators on the MS2L

11.1.3 Interfaces on the MS2L

11.1.4 Fuses on the MS2L

11.1.5 Technical Specifications of the MS2L

11.1.1 Panel of the MS2L

Figure 11-1 shows the panel of the MS2L.

11 SDH Interface UnitsHUAWEI UMG8900Hardware Description


Issue 05 (2009-01-09)

Figure 11-1 Panel of the MS2L

CPU

J5

J7

J10

S1

F1

F2

CPLD

FPGA

Power

MBUS

FramerU22

FramerU23

U34

U31 MAC

MAC

MAC

Flash

U57

J17

J18Switch

J12

J16

OFFLINE

ACT

RUNALM

CO

M0

8K_O

UT

ACTLIN

K

TX0

RX0

ACTLIN

K

TX1

RX1

MS2L

MS2L


Table 11-1 lists the meaning of the indicators on the MS2L.

Table 11-1 Indicator meaning of the MS2L










11-3














Always off The board is out ofservice such as in theslave state or in load-sharing mode.


LINK Green Always on The line is in thesynchronous state andthe line specificationsand optical power meetthe requirements.

Always off The line is in theasynchronous state andthe line specificationsand optical power do notmeet the requirements.









Table 11-2 lists the interfaces on the MS2L.



Issue 05 (2009-01-09)

Table 11-2 Interfaces on the MS2L




RS232 serial port

8K_OUT 1 RJ48 Providing the outputinterface of 8 kHz clocksignal

RS422

Serviceinterface

2 - Providing two 155 Mbit/s SDH service interfaces

STM-1


For details on fuse positions of the MS2L, see 11.1.1 Panel of the MS2L. Table 11-3 lists thespecifications.

Table 11-3 Fuses on the MS2L




11.1.5 Technical Specifications of the MS2L

Table 11-4 to Table 11-6 list the technical specifications of the MS2L.

Table 11-4 Technical specifications of the MS2L

Category


Interfaces

Transmission distance

2 km [1.2mi.]

15 km [9.3mi.]

40 km[24.9 mi.]

80 km [49.7mi.]

-

Mode Multi-mode

Single-mode

Single-mode

Single-mode

Wavelength 1310 nm 1310 nm 1310 nm 1550 nm

Outputopticalpower

–19 dBmto –14dBm

–15 dBmto –8 dBm

–5 dBm to0 dBm

–5 dBm to 0dBm


–30 dBm –28 dBm –34 dBm –34 dBm



11-5

Category


Saturationopticalpower

–14.0dBm

–7.0 dBm –9.0 dBm –10.0 dBm

Table 11-5 Power consumption and heat dissipation of the UG01MS2L


Power consumption N/A 25 W -


Table 11-6 Power consumption and heat dissipation of the UG02MS2L


Power consumption N/A 21.5 W -


NOTE

l All optical fiber interface boards are identical in appearance. They use different optical modules. Youcan query the optical module type of a board with LST OPTINFO.

l The receiving power of the optical module must be greater than the maximum receive sensitivity andless than the saturation optical power. Excessively low receiving power may cause bit errors, whichdestabilizes the service. Excessive receiving power may cause damage to optical modules.


As the time division multiplex (TDM) service interface board, the MS2Es are inserted in backslots 2 to 5 and slots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15in the service frame. In the SSM-32 frame, if the clock subboard of the MTNC provides thesystem clock, then the MS2E can be inserted in any slot of back slots 0 to 5 in the main controlframe. The MS2E can work in the master and slave backup mode or the load-sharing mode.

The MS2E provides the following functions:

l Extracting clock signals and forming frames at the two 155 Mbit/s SDH electrical interfaces



l Forming 2 x 63 E1 or 2 x 84 T1 frames and performing DS0 switch

The MS2E falls into two types: UG01MS2E and UG02MS2E. The difference between two typesis as follows:



Issue 05 (2009-01-09)

l The UG01MS2E can be used only in the SSM-256 frame.

l The UG02MS2E can be used in the SSM-256 frame and the SSM-32 frame. The silkscreenon the ejector level of the UG02MS2E is MS2Eb.

11.2.1 Panel of the MS2E

11.2.2 Indicators on the MS2E

11.2.3 Interfaces on the MS2E

11.2.4 Fuses on the MS2E

11.2.5 Technical Specifications of the MS2E


Figure 11-2 shows the panel of the MS2E.

Figure 11-2 Panel of the MS2E

CPU

J5

J7

J10

S1

F1

F2

CPLD

FPGA

Power

MBUS

FramerU22

FramerU23

U34

U31 MAC

MAC

MAC

Flash

U57

J17

J18

T8

T9

Switch

OFFLINE

CO

M0

8K_O

UT

ACT

ACT

LINK

LINK

RX0

RX1

TX0

TX1

ACT

LINK

LINK

RX0

RX1

TX0

TX1

ACT

RUNALM

MS2E

MS2E


Table 11-7 lists the meaning of the indicators on the MS2E.



11-7

Table 11-7 Indicator meaning of the MS2E































Issue 05 (2009-01-09)





Table 11-8 lists the interfaces on the MS2E.

Table 11-8 Interfaces on the MS2E




RS232 serial port


RS422

Serviceinterface

2 SMB maleconnector

Providing two 155 Mbit/s SDH service interfaces

STM-1


For details on fuse positions of the MS2E, see 11.2.1 Panel of the MS2E. Table 11-9 lists thespecifications.

Table 11-9 Fuses on the MS2E




11.2.5 Technical Specifications of the MS2E

Table 11-10 to Table 11-12 list the technical specifications of the MS2E.

Table 11-10 Technical specifications of the MS2E


Interfaces Bit rate of output signals 155520 kbit/s +/- 20 ppm –



11-9


Waveform andparameter of outputsignals

In conformity with the TABLE 11/G.703 requirements

Allowable frequencydeviation of inputinterface

155520 kbit/s +/- 20 ppm

Allowable attenuationof input interface

Attenuation range (0 to 12.7DB) @78 MHz

Over-voltage protectionfor interface

In conformity with the ITU-T K.41recommendation

Reflection attenuationof input/output interface

Not less than 15 dB, with thefrequency range 8000 kHz to 240000kHz

Input jitter tolerance In conformity with the ITU-T G.703recommendation

Output jitter tolerance In conformity with the ITU-T G.703recommendation

Interface capability STM-1 × 2

Framer capacity E1: 63 x 2, T1: 84 x 2

Switching capacity 4 K DS0 switching


CLASS B

Table 11-11 Power consumption and heat dissipation of the UG01MS2E


Power consumption N/A 25.7 W -


Table 11-12 Power consumption and heat dissipation of the UG02MS2E







Issue 05 (2009-01-09)

As the TDM service interface board, the MS1Ls are inserted in back slots 2 to 5 and slots 10 to15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. TheMS1L can be inserted only in the SSM-32 frame. The MS1L can work in master and slavebackup mode or load-sharing mode.

The MS1L provides the following functions:

l Extracting clock signals and forming frames at the one 155 Mbit/s optical interface;providing interfaces with pluggable optical modules enabling different transmissiondistances



l Forming 1 x 63 E1 or 1 x 84 T1 frames and performing DS0 switch11.3.1 Panel of the MS1L11.3.2 Indicators on the MS1L11.3.3 Interfaces on the MS1L11.3.4 Fuses on the MS1L11.3.5 Technical specifications of the MS1L

11.3.1 Panel of the MS1LFigure 11-3 shows the panel of the MS1L.

Figure 11-3 Panel of the MS1L

CPU

J5

J7

J10

J17

J18

S1

F1

F2

CPLD

FPGA

Power

MBUS

FramerU22

FramerU23

U34

U31 MAC

MAC

MAC

Flash

U57

J12

OFFLINE

ACT

RUNALM

CO

M0

8K_O

UT

ACT LINK

TX0

RX0

MS1L

MS1L



11-11


Table 11-13 lists the meaning of the indicators on the MS1L.

Table 11-13 Indicator meaning of the MS1L




















LINK Green Always on The line is in thesynchronous state and theline specifications andoptical power meet therequirements.




Issue 05 (2009-01-09)











Table 11-14 lists the interfaces on the MS1L.

Table 11-14 Interfaces on the MS1L

Category Quantity

PhysicalInterface




RS422

Serviceinterface

1 - Providing one 155 Mbit/sSDH service interface

STM-1


For details on fuse positions of the MS1L, see 11.3.1 Panel of the MS1L. Table 11-15 lists thespecifications.

Table 11-15 Fuses on the MS1L




11.3.5 Technical specifications of the MS1L

Table 11-16 lists the technical specifications of the MS1L.



11-13

Table 11-16 Technical specifications of the MS1L

Category


Interfaces


2 km [1.2mi.]

15 km [9.3mi.]

40 km[24.9 mi.]

80 km [49.7mi.]

-

Mode multi-mode

Single-mode

Single-mode

Single-mode

Wavelength

1310 nm 1310 nm 1310 nm 1550 nm

Outputopticalpower



–5 dBm to0 dBm

–5 dBm to 0dBm


–30 dBm –28 dBm –34 dBm –34 dBm


–14.0 dBm –7.0 dBm –9.0 dBm –10.0 dBm

Powerconsumption

N/A 17.1 W –

Heatdissipation

N/A 17.1 W

NOTE


l The receiving power of the optical module must be larger than the maximum receive sensitivity andless than the saturation optical power. Insufficient receiving power may cause bit errors, whichdestabilizes the service. Excessive receiving power may cause damage to optical modules.


As the TDM service interface board, the MS1Es are inserted in back slots 2 to 5 and slots 10 to15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. TheMS1E can be inserted only in the SSM-32 frame. The MS1E can work in master and slavebackup mode or load-sharing mode.

The MS1E provides the following functions:

l Extracting clock signals and forming frames at one 155 Mbit/s electrical interface



Issue 05 (2009-01-09)



l Forming 1 x 63 E1/ or 1 x 84 T1 frames and performing DS0 switch





11.4.5 Technical specifications of the MS1E


Figure 11-4 shows the panel of the MS1E.

Figure 11-4 Panel of the MS1E

CPU

J5

J7

J10

J17

J18

T8

S1

F1

F2

CPLD

FPGA

Power

MBUS

FramerU22

FramerU23

U34

U31 MAC

MAC

MAC

Flash

U57OFFLINE

CO

M0

8K_O

UT

ACT LINK

RX0

TX0

ACT LINK

RX0

TX0ACT

RUNALM

MS1E

MS1E




11-15

Table 11-17 lists the meaning of the indicators on the MS1E.

Table 11-17 Indicator meaning of the MS1E




















LINK Green Always on The line is in thesynchronous state andthe line specificationsmeet the requirements.








Issue 05 (2009-01-09)







Table 11-18 lists the interfaces on the MS1E.

Table 11-18 Interfaces on the MS1E





RS422

Serviceinterface

1 SMB maleconnector

Providing one 155 Mbit/sSDH service interface

STM-1


For details on fuse positions of the MS1E, see 11.4.1 Panel of the MS1E. Table 11-19 lists thespecifications.

Table 11-19 Fuses on the MS1E




11.4.5 Technical specifications of the MS1E

Table 11-20 lists the technical specifications of the MS1E.

Table 11-20 Technical specifications of the MS1E


Interfaces Bit rate of output signals 155520 kbit/s +/- 20 ppm –



11-17


Waveform andparameter of outputsignals

In conformity with the TABLE 11/G.703 requirements

Allowable frequencydeviation of inputinterface

155520 kbit/s +/- 20 ppm

Allowable attenuation ofinput interface

Attenuation range (0 to 12.7DB) @ 78MHz

Over-voltage protectionfor interface

In conformity with the ITU-T K.41recommendation

Reflection attenuation ofinput/output interface

Not less than 15 dB, with the frequencyrange 8000 kHz to 240000 kHz

Input jitter tolerance In conformity with the ITU-T G.703recommendation

Output jitter tolerance In conformity with the ITU-T G.703recommendation

Interface capability STM-1 × 1

Framer capacity E1: 63 x 1, T1: 84 x 1

Switching capacity 2 K DS0 switching


CLASS B

Powerconsumption

N/A 16.3 W -

Heatdissipation

N/A 16.3 W



Issue 05 (2009-01-09)

12 Packet Interface Units

About This Chapter

The packet interface units consist of ME8T, MG1O, MA4L, MP4L, and MP1H.

12.1 ME8TThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the ME8T.

12.2 MG1OThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MG1O.

12.3 MA4LThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MA4L.

HUAWEI UMG8900Hardware Description 12 Packet Interface Units


12-1

12.1 ME8TThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the ME8T.

As the back IP interface board, the ME8Ts are inserted in back slots 2 to 5 and slots 10 to 15 inthe main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. TheME8T corresponds to the MHRU in the front slot. The ME8T can be inserted in both SSM-256frames and SSM-32 frames.

The ME8T provides the following functions:

l Providing eight 10/100Base-TX Ethernet interfaces in conformity with the IEEE8002.3zand IEEE802.3u standards.

l Providing the 1+1 backup function by collaborating with the service processing boardMHRU/MRPU.

NOTE

l The MHRU/MRPU provides a dedicated maintenance bus (MBus) module on the back interface board,but no internal FE interface. Therefore, the main control board operates and maintains the back interfaceboard through the front MHRU/MRPU.

l The transmission distance of the twisted pair connected to the ME8T cannot be longer than 100 m [0.06mi.].

12.1.1 Panel of the ME8T

12.1.2 Indicators on the ME8T

12.1.3 Interfaces on the ME8T

12.1.4 Fuses on the ME8T

12.1.5 Technical specifications of the ME8T

12.1.1 Panel of the ME8T

Figure 12-1 shows the panel of the ME8T.

12 Packet Interface UnitsHUAWEI UMG8900Hardware Description


Issue 05 (2009-01-09)

Figure 12-1 Panel of the ME8T

POWERU6

MBUS

CPUU20

Control Module

J2 F2

F1

U22S1

FE0

FE1

FE2

FE3

OFFLINE

FE4

FE5

FE6

FE7

ME8T

ACT

RUNALM

ME8T

12.1.2 Indicators on the ME8T

Table 12-1 lists the meaning of the indicators on the ME8T.

Table 12-1 Indicator meaning of the ME8T





Always off There is no power supply, orthe board is faulty.

Flashing (on for1 second, off foranother second)








12-3



Board workingindicator

ACT Green Flashing The board is in service suchas in the master state.



- Green Always on The interface works at therate of 100 Mbit/s.

Always off The interface works at therate of 10 Mbit/s.


- Orange Always on The link is through.


Always on orflashing

Some data is being receivedor transmitted through thelink.




12.1.3 Interfaces on the ME8T

Table 12-2 lists the interface on the ME8T.

Table 12-2 Interface on the ME8T



10/100BASE-TX Ethernetinterface

8 RJ45 Providing eight10/100BASE-TXEthernet serviceaccess interfaces

In conformity withthe IEEE802.3 andIEEE802.3ustandards

12.1.4 Fuses on the ME8T

For details on fuse positions of the ME8T, see 12.1.1 Panel of the ME8T. Table 12-3 lists thespecifications.

Table 12-3 Fuses on the ME8T





Issue 05 (2009-01-09)



12.1.5 Technical specifications of the ME8T

Table 12-4 lists the technical specifications of the ME8T.

Table 12-4 Technical specifications of the ME8T






12.2 MG1OThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MG1O.

As the back IP interface board, the MG1Os are inserted in back slots 2 to 5 and slots 10 to 15in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. TheMG1O corresponds to the MHRU in the front slot. The MG1O can be inserted in both SSM-256frames and SSM-32 frames.

The MG1O provides the following functions:

l Being equipped with the pluggable interface module and providing one GE interface orelectrical interface in conformity with the IEEE8002.3z standard

l Providing the 1+1 backup function by collaborating with the service processing boardMHRU/MRPU.

NOTE

The MHRU/MRPU provides a dedicated maintenance bus (MBus) module on the back interface board,but no internal FE interface. Therefore, the main control board operates and maintains the back interfaceboard through the front MHRU/MRPU.

The MG1Os are categorized as MG1O.A and MG1O.B. The MG1O.A and the MG1O.B arecalled MG1O and provide the same functions.

12.2.1 Panel of the MG1O

12.2.2 Indicators on the MG1O

12.2.3 Interfaces on the MG1O

12.2.4 Fuses on the MG1O

12.2.5 Technical specifications of the MG1O



12-5

12.2.1 Panel of the MG1O

Figure 12-2 shows the panel of the UG02MG1O.A.

Figure 12-2 Panel of the MG1O.A

POWERU6

MBUS

CPUU10

Control Module

J2F2

F1

U22S1

OFFLINE

MG10

ACT

RUNALM

MG10

ACTLIN

K

TX0

RX0

Figure 12-3 shows the panel of the UG02MG1O.B.



Issue 05 (2009-01-09)

Figure 12-3 Panel of the UG02MG1O.B

OFFLINE

MG10

ACT

RUNALM

MG10

ACTLIN

K

TX0

RX0

POWERU32

MBUS

1002LogicU33

Control Module

J1000

F1001

F1

U22S1

J1001

F1000

F1002

12.2.2 Indicators on the MG1O

Table 12-5 lists the meaning of the indicators on the MG1O.

Table 12-5 Indicator meaning of the MG1O



Runningindicator









12-7




Workingindicator


Always off The board is out of servicesuch as in the slave ordisconnected state.

Gigabit opticalinterface linkindicator

LINK Green Always on The link is through.

Always off No data is received andtransmitted or the link is notthrough.

Gigabit opticalinterfaceworkingindicator

ACT Orange Flashing Some data is received ortransmitted through the link.





12.2.3 Interfaces on the MG1O

Table 12-6 lists the interface on the MG1O.

Table 12-6 Interface on the MG1O



GE interface 1 LC/PC interface orRJ-45 interface

Providing GigabitEthernet (GE)service access

1000Base-TEthernet interfacein conformity withthe IEEE802.3zstandard.

12.2.4 Fuses on the MG1O

For details on fuse positions of the MG1O.A, see 12.2.1 Panel of the MG1O. Table 12-7 liststhe specifications.



Issue 05 (2009-01-09)

Table 12-7 Fuses on the MG1O.A




For details on fuse positions of the MG1O.B, see 12.2.1 Panel of the MG1O. Table 12-8 liststhe specifications.

Table 12-8 Fuses on the MG1O.B






12.2.5 Technical specifications of the MG1O

Table 12-9 lists the technical specifications of the MG1O.

Table 12-9 Technical specifications of the MG1O

Category

Parameter


Opticalmodule


500 m[0.3 mi.]

10 km[6.2 mi.]

40 km[24.9mi.]

40 km[24.9mi.]

70 km[43.5mi.]

–

Mode multi-mode

Single-mode

Single-mode

Single-mode

Single-mode

Wavelength

850 nm 1310 nm 1550 nm 1310 nm 1550 nm

Outputopticalpower

–9.5dBm to –2.5 dBm

-9.0 dBmto -3dBm

-4 dBmto 1 dBm

-2 dBmto 5 dBm

-4 dBmto 2 dBm


-17.0dBm

-20.0dBm

-21.0dBm

-23.0dBm

-22.0dBm



12-9

Category

Parameter



0 dBm –3.0dBm

–3.0dBm

–3.0dBm

–3.0dBm

Powerconsumption

7.6 W –

Heatdissipation

7.6 W

Electrical module


100 m [0.06 mi.] -

Powerconsumption

1 W –

Heatdissipation

1 W

Time ofswitchoverbetweenmasterand slaveboards

N/A < 1 s Time ofhardwareswitchover

NOTE



12.3 MA4LThis describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MA4L.

As the back service interface board, the MA4Ls are inserted in back slots 2 to 5 and slots 10 to15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. TheMA4L corresponds to the MASU in the front slot. The MA4L can be inserted in both SSM-256frames and SSM-32 frames.

The MA4L provides the following functions:



Issue 05 (2009-01-09)

l Providing four 155 Mbit/s single-mode/multi-mode ATM optical interfaces for the frontboard

l Providing the 1+1 backup function by collaborating with the service processing boardMASU

NOTE

The MASU provides a dedicated maintenance bus (MBus) module on the back interface board, but nointernal FE interface. Therefore, the main control board operates and maintains the back interface boardthrough the front MASU.

12.3.1 Panel of the MA4L

12.3.2 Indicators on the MA4L

12.3.3 Interfaces on the MA4L

12.3.4 Fuses on the MA4L

12.3.5 Technical specifications of the MA4L

12.3.1 Panel of the MA4L

Figure 12-4 shows the panel of the MA4L.

Figure 12-4 Panel of the MA4L

POWER

MBUS

SFP

SFP

SFP

SFP

F2

F1

OFFLINE

8K_O

UT

ACT LINK

TX0

RX0

ACT LINK

TX1

RX1

ACT LINK

TX2

RX2

ACT LINK

TX3

RX3

MA4L

ACT

RUNALM

MA4L



12-11

12.3.2 Indicators on the MA4L

Table 12-10 lists the meaning of the indicators on the MA4L.

Table 12-10 Indicator meaning of the MA4L













ACT Green Flashing The board is in service suchas in the master or connectedstate.


Opticalinterface linkindicator

LINK Green Always on The link is normal.

Always off The link is faulty.

Opticalinterfaceworkingindicator


Some data is received ortransmitted through the link.

Always off No data is received ortransmitted through the link.




12.3.3 Interfaces on the MA4L

Table 12-11 lists the interfaces on the MA4L.



Issue 05 (2009-01-09)

Table 12-11 Interfaces on the MA4L

Category Quantity

PhysicalInterface


155 Mbit/sATM opticalinterface

4 LC Providing four 155Mbit/s ATM opticalinterfaces

OC-3 SDH/SONET

8K_OUT 1 RJ48 Providing the outputinterface of 8 kHzclock signal

RS422

12.3.4 Fuses on the MA4L

For details on fuse positions of the MA4L, see 12.3.1 Panel of the MA4L. Table 12-12 liststhe specifications.

Table 12-12 Fuses on the MA4L




12.3.5 Technical specifications of the MA4L

Table 12-13 lists the technical specifications of the MA4L.

Table 12-13 Technical specifications of the MA4L

Category

Parameter


Interfaces


2 km [1.2mi.]

15 km [9.3mi.]

40 km[24.9 mi.]

80 km [49.7mi.]

-

Mode multi-mode

Single-mode

Single-mode

Single-mode

Wavelength

1310 nm 1310 nm 1310 nm 1550 nm

Outputopticalpower



–5 dBm to0 dBm

–5 dBm to 0dBm


–30 dBm –28 dBm –34 dBm –34 dBm



12-13

Category

Parameter



–14.0 dBm –7.0 dBm –9.0 dBm –10.0 dBm

Powerconsumption

N/A 10.7 W –

Heatdissipation

N/A 10.7 W

NOTE





Issue 05 (2009-01-09)

13 Clock Units

About This Chapter

This describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MCLK.

As the clock board, the master and slave MCLKs are inserted in back slots 0 and 1 in the maincontrol frame. The MCLK can be inserted in both SSM-256 frames and SSM-32 frames.

The MCLK provides the following functions:

l Clock input

– Receiving one 2048 kbit/s or 2048 kHz signal input from the external synchronizationinterface.

– Receiving two line clock inputs from the TDM interface board.

– Receiving one satellite positioning signal input from the GPS/GLONASS system.

– Receiving 1544 kbit/s, 64 kHz+8 kHz, or 64 kHz+8 kHz+400 Hz signals of one channelfrom the external clock source.

l Clock output

– Sending 18 RS-422 level differential 16 kHz clock signals to the MNET or MTNCthrough backplane bus in the main control frame and through cable distributing in otherframes.

– Sending the 2048 kbit/s or 2048 kHz external synchronization signal of one channel.

– Providing 1544 kbit/s external signals of one channel

l Providing the output clock signal of one channel for the master and slave MNETs in thesame frame.

l Supporting the work mode that the master and slave clock boards only access to one externalsynchronization reference source.

The MCLK falls into two types: UG03MCLK_VB and UG03MCLK_VD. TheUG03MCLK_VD provides all the functions of the UG03MCLK_VB. The new functions of theUG03MCLK_VD are as follows:

HUAWEI UMG8900Hardware Description 13 Clock Units


13-1

l The UG03MCLK_VD can receive the 1544 kbit/s, 64 kHz+8 kHz, or 64 kHz+8 kHz+400Hz signal of one channel from the external clock source. The UG03MCLK_VD can sendthe 1544 kbit/s external signal of one channel.

l The 1.5 Mbit/s and 64 kbit/s interfaces are added on the ejector level of theUG03MCLK_VD.

13.1 Panel of the MCLK

13.2 Indicators on the MCLK

13.3 Interfaces on the MCLK

13.4 Fuses on the MCLK

13.5 Technical specifications of the MCLK

13 Clock UnitsHUAWEI UMG8900Hardware Description


Issue 05 (2009-01-09)

13.1 Panel of the MCLK

Figure 13-1 shows the panel of the UG03MCLK_VB.

Figure 13-1 Panel of the MCLK

Powermodule Power

module

MBSUsubboard

U7FLASH

U15EPLD

U16EPLD

U49BIOSU17

CPU U44Constant-

temperature crystJ12BIOS/EPLD JTAG

J15

F1

F2

Satellite card

ALMACT

RUN

CLK

_OU

T1C

LK_O

UT0

AN

T8K

_IN

28K

_IN

1C

LK_O

UT2

OFFLINE

2M_O

UT

2M_I

N

FCLK

MCLK

MCLK

Figure 13-2 shows the panel of the UG03MCLK_VD.



13-3

Figure 13-2 Panel of the UG03MCLK_VD

ALMACT

RUNC

LK_O

UT1

CLK

_OU

T0AN

T8K

_IN

28K

_IN

1C

LK_O

UT2

MCLK

OFFLINE

2M_O

UT

2M_I

N

MCLK

1.5M

/64K

Powermodule Power

module

MBSUsubboard

U7FLASH

U15EPLD

U16EPLD

U49BIOSU17

CPU U44Constant-

temperature crystJ12BIOS/EPLD JTAG

J15

F1

F2

Satellite card

13.2 Indicators on the MCLK

Table 13-1 lists the meaning of the indicators on the MCLK.

Table 13-1 Indicator meaning of the MCLK



Runningindicator





Issue 05 (2009-01-09)










Workingindicator






13.3 Interfaces on the MCLK

Table 13-2 lists the interfaces on the MCLK.

Table 13-2 Interfaces on the MCLK



CLK_OUT0 1 DB26PIN 16 kHz clock signaloutput interface 1

-



ANT 1 SMA socket Satellite antennainterface (if satellitecard is configured)



13-5



1.5 Mbit/s or 64kbit/s

1 RJ45 Input interface of1.544 Mbit/s and 64kbit/s CC clocksignals, and outputinterface of 1.544Mbit/s clock signals

G.703

2M_OUT 1 SMB plug 2 M BITS clockoutput interface

2 MHz or 2 Mbit/s

2M_IN 1 SMB plug 2 M BITS clockoutput interface

2 MHz or 2 Mbit/s

8K_IN1 1 RJ45 Input interface for 8 Kline synchronousmaster clock

RS422

8K_IN2 1 RJ45 Input interface for 8 Kline synchronousslave clock

RS422

NOTE

l One CLK_OUT interface outputs three channels of clock signal to the MNETs in three frames. Themaster and slave MCLKs correspond to master and slave MNETs in the same frame. In the main controlframe, clock signals are transmitted through the backplane.

l The 2M_IN interface supports 2 MHz or 2 Mbit/s BITS clock signals. If the two clock signals areavailable at the same time, the 2 Mbit/s clock signal is used.

l The interface of 1.544 Mbit/s and 64 kbit/s signals is the new interface on the UG03MCLK_VD. Thepin assignment of the RJ45 connector is as follows: 1 represents R+; 2 represents R-; 4 represents T+;5 represents T-.

13.4 Fuses on the MCLK

For details on fuse positions of the MCLK, see 13.1 Panel of the MCLK. Table 13-3 lists thespecifications.

Table 13-3 Fuses on the MCLK




13.5 Technical specifications of the MCLK

Table 13-4 lists the technical specifications of the MCLK.



Issue 05 (2009-01-09)

Table 13-4 Technical specifications of the MCLK


Output clock Regulation ofstratum 2 A clockoutput

BELLCORE GR-1244-CORE Stratum 2clock

–

ITU-T G.812 Type I clock

Regulation of theSSM function

ITU-T G0.781

Regulation thatthe interface ofthe externalsynchronizationclock complieswith

ITU-T G0.703

ITU-T G.704

Powerconsumption

N/A 13 W –

Heatdissipation

N/A 13 W



13-7

14 Lightning Protection Units

About This Chapter

This describes the functions, panels and structures, indicators, interfaces, DIP switches andjumpers, fuses, and technical specifications of the MLPB.

As the E1 lightning protection board, the MLPBs are inserted in back slots 2 to 5 or 10 to 15 inthe main control frame, or back slots 0 to 5 or 10 to 15 in the central switching frame and theservice frame. The MLPB can be inserted in both SSM-256 frames and SSM-32 frames.

The MLPB provides the following functions:

l Providing the lightning protection to E1 trunk cables when they are connected to theUMG8900.

NOTE

l One MLPB can provide lightning protection to 16 E1 trunk cables. One ME32 can provide lightningprotection to 32 E1 trunk cables in conjunction with two MLPB.

l Given the cable length between the MLPB and the ME32,the following slot-matching relationship isrecommended, that is ME32/MLPB.

l The MLPB and the components have no power.

14.1 Panel of the MLPB

14.2 Indicators on the MLPB

14.3 Interfaces on the MLPB

14.4 Technical specifications of the MLPB

HUAWEI UMG8900Hardware Description 14 Lightning Protection Units


14-1

14.1 Panel of the MLPB

Figure 14-1 shows the panel of the MLPB.

Figure 14-1 Panel of the MLPB

Insi

de

E1/

T1_8

-15

E1/

T1_0

-7

Insi

deO

utsi

de

E1/

T1_0

-15

MLPB

MLPB

14.2 Indicators on the MLPB

None

14.3 Interfaces on the MLPB

Table 14-1 lists the interfaces on the MLPB.

14 Lightning Protection UnitsHUAWEI UMG8900Hardware Description


Issue 05 (2009-01-09)

Table 14-1 Interfaces on the MLPB



Inside 2 DB25 Interface that the outdoor E1trunk cable connects to theUMG8900 and 8 E1 input

–

Outside 1 DB44 16 E1 output after the processingof lightening protection and canbe connected to the E32 board

–

14.4 Technical specifications of the MLPB

Table 14-2 lists the technical specifications of the MLPB.

Table 14-2 Technical specifications of the MLPB

Category Specification Remarks

Power consumption N/A The MLPB has no power.

Heat dissipation N/A The MLPB has no power.


Providing processing oflightening protection for 16 E1

–

HUAWEI UMG8900Hardware Description 14 Lightning Protection Units


14-3

15 Cables

About This Chapter

This describes the appearance and structure, signals, and technical specifications of cables ofthe UMG8900.

NOTE

All network cables mentioned in this document refer to shielded twisted pairs.

15.1 Monitoring CablesThis describes monitoring cables in terms of the application scenario, appearance, pinassignments, and technical specifications.

15.2 Alarm Box Connection CablesThis describes alarm box connection cables in terms of the application scenario, appearance, pinassignments, and technical specifications.

15.3 Cascading CablesThis describes cascading cables in terms of the application scenario, appearance, pinassignments, and technical specifications.

15.4 Clock CablesThis describes clock cables in terms of the application scenario, appearance, pin assignments,and technical specifications.

15.5 Trunk Cables of SSM FramesThis describes trunk cables in terms of the application scenario, appearance, pin assignments,and technical specifications.

15.6 Internal Trunk Cables from SSM Frames to SIWF FramesThis describes internal trunk cables between the SSM frame and the SIWF frame in terms of theapplication scenario, appearance, pin assignments, and technical specifications.

15.7 Straight Through Cables and Crossover CablesThis describes straight through cables and crossover cables in terms of the application scenario,appearance, pin assignments, and technical specifications.

15.8 Optical FibersThis describes optical fibers in terms of the application scenario, appearance, pin assignments,and technical specifications.

HUAWEI UMG8900Hardware Description 15 Cables


15-1

15.9 Power Cables and PGND CablesThis describes power cables and PGND cables in terms of the application scenario, appearance,pin assignments, and technical specifications.

15 CablesHUAWEI UMG8900Hardware Description


Issue 05 (2009-01-09)

15.1 Monitoring CablesThis describes monitoring cables in terms of the application scenario, appearance, pinassignments, and technical specifications.

CAUTIONThe monitoring cables are used between the power distribution frame (PDF) or the fan box andthe SSM frame of the earlier version. In the SSM frame of the new version, the monitoring cablesare not used.

15.1.1 Monitoring Cables from SSM Frames to Fan BoxesThis describes the monitoring cable from the SSM frame to the fan box in terms of the applicationscenario, appearance, pin assignments, and technical specifications.

15.1.2 Monitoring Cables from SSM Frames to Power Distribution Frames and Fan BoxesThis describes the monitoring cable from the SSM frame to the power distribution frame (PDF)and fan box in terms of the application scenario, appearance, pin assignments, and technicalspecifications.

15.1.1 Monitoring Cables from SSM Frames to Fan BoxesThis describes the monitoring cable from the SSM frame to the fan box in terms of the applicationscenario, appearance, pin assignments, and technical specifications.

Application Scenario

CAUTIONThe SSM frames are of two versions. In the SSM frame of the new version, the fan box is notequipped with the power input interface and monitoring interface.

The monitoring cables from the SSM frame to the fan box only used in the SSM frame of theearlier version.

The monitoring cables from the SSM frame to the fan box is used to connect with the monitoringinterface of a fan box.

This cable is used to transmit RS485 differential signals.

Each pair of signals received or transmitted must use a twisted pair. The cable material is shieldedcable with shielding layer connected to the metal shells of the two connectors.

Table 15-1 lists the connections of this cable.



15-3

Table 15-1 Connections of monitoring cables from the SSM frame to the fan box

Connector Position

DB9 male connector Connected to the Monitor interface at the back of an SSMframe

DB15 male connector Connected to the RS485 serial port at the back of thecorresponding fan box

Appearance

Figure 15-1 shows its appearance.

Figure 15-1 Appearance of the monitoring cables from the SSM frame to the fan box

Pos.1A

Pos.9

A

Pos.15B

Pos.1

B

X1 X2

W

Pin Assignment

Table 15-2 lists the pin assignment of this cable, where RX indicates receiving and TX indicatestransmitting.

Table 15-2 Pin assignment of monitoring cables from the SSM frame to the fan box

DB9 Pin Definition DB15 Pin Definition Relation

1 TX1+ 7 RX1+ Twisted pair

2 TX1- 6 RX1-

3 RX1+ 3 TX1+ Twisted pair

4 RX1- 2 TX1-

5 GND 5 GND –

Metal shell PGND Metal shell PGND Shielding layer


Table 15-3 lists the technical specifications of the cable.



Issue 05 (2009-01-09)

Table 15-3 Technical specifications of the monitoring cables from the SSM frame to the fanbox

Parameter Description

Connector X1 Cable Connector, D Connector, 9PIN, Male Connector, CableWelding Type


Cable Twisted-Pair Cable, 100 ohm, SEYYP, 0.48 mm, 26 AWG, 4Pairs, Black, Low Smoke Zero Halogen Cable

15.1.2 Monitoring Cables from SSM Frames to Power DistributionFrames and Fan Boxes

This describes the monitoring cable from the SSM frame to the power distribution frame (PDF)and fan box in terms of the application scenario, appearance, pin assignments, and technicalspecifications.

Application ScenarioThe monitoring cables from the SSM frame to the PDF and fan box is used to connect with themonitoring interface of a fan box and PDF.

In each cabinet, one SSM frame is required to provide a monitoring interface to the PDF of thecabinet. In the main control cabinet, main control frame provides the monitoring interface, andin service cabinet, the middle service frame provides the monitoring interface. For such SSMframes, to monitor the PDF and auxiliary fan box at the same time, the monitoring cable withtwo branches is required.

This cable is used to transmit RS485 differential signals.

Each pair of signals received or transmitted must use a twisted pair. The cable material is shieldedcable with shielding layer connected to the metal shells of the three connectors.

Table 15-4 lists the connections of the cables.

Table 15-4 Connections of monitoring cables from the SSM frame to the PDF and fan box

Connector Position

X1 : DB9 male connector Connected to the Monitor interface at the back of an SSMframe

X2 : DB15 male connector Connected to the RS485 serial port at the back of thecorresponding fan box

X3 : DB15 female connector Connected to the RS485 serial port marked COM4 at theback of the power distribution frame

Appearance and StructureFigure 15-2 shows the appearance and structure of this monitoring cable.



15-5

Figure 15-2 Monitoring cable from the SSM frame to the PDF and fan box

Pos.15B

Pos.1

BPos.1

A

Pos.9

A

DB9 maleconnector

DB15 femaleconnector

DB15 maleconnector

Pos.15

Pos.1

C

C

X1

W1

W2

X3

X2

Pin Assignment

Table 15-5 and Table 15-6 list the pin assignment of this cable, where RX indicates receivingand TX indicates transmitting.

Table 15-5 Pin assignment of monitoring cables from the SSM frame to the PDF and fan box(1)

DB9 Male Pin Definition DB15 MalePin

Definition Relation


2 TX1- 6 RX1-


4 RX1- 2 TX1-

5 GND 5 GND –


Table 15-6 Pin assignment of monitoring cables from the SSM frame to the PDF and fan box(2)

DB9 Male Pin Definition DB15 FemalePin

Definition Relation


7 TX2- 6 RX1-


9 RX2- 2 TX1-



Issue 05 (2009-01-09)

DB9 Male Pin Definition DB15 FemalePin

Definition Relation

5 GND 5 GND –



Table 15-7 lists the technical specifications of the cable.

Table 15-7 Technical specifications of the monitoring cables from the SSM frame to the fanbox




Connector X3 Cable Connector, D Connector, 15PIN, Female Connector,Cable Welding Type

Cable Twisted-Pair Cable, 100 ohm, SEYVP, 0.48 mm, 26 AWG, 2Pairs, Black

15.2 Alarm Box Connection CablesThis describes alarm box connection cables in terms of the application scenario, appearance, pinassignments, and technical specifications.

Alarm Box RS422 Serial Port Cablesl Application Scenario

This cable is used to connect with an SSM-256 or SSM-32 main control frame and theuniversal alarm box, for transmitting RS422 differential signals.Table 15-8 lists the connections of the cables.

Table 15-8 Connections of alarm box RS422 serial port cables

Connector Position

DB9 male connector Connected to the interface marked with "ALM" at the backof an main control frame

6PIN connector Connected to the universal alarm box

l AppearanceFigure 15-3 shows the appearance and structure of the alarm box RS422 serial port cable.



15-7

Figure 15-3 Alarm box RS422 serial port cables

A

A

A-A

Pos.1

Pos.9B

B

X1

M015

W

X2

l Pin assignment

Table 15-9 lists pin assignment of the alarm box RS422 serial port cable, where RXindicates receiving and TX indicates transmitting.

Table 15-9 Pin assignment of alarm box RS422 serial port cables

6PINConnector

PinAssignment

DB9 MaleConnector

PinAssignment

Relation

1 GND 5 GND Single line

2 GND Single line

3 RX+ 1 TX+ Twisted pair

4 RX- 2 TX-

5 TX+ 3 RX+ Twisted pair

6 TX- 4 RX-

– – Metal shell PGND Shielding layer

l Technical specificationsTable 15-10 lists the technical specifications of the alarm box RS422 serial port cable.

Table 15-10 Technical specifications of the alarm box RS422 serial port cable


Connector X1 Ordinary plug, 6PIN, single row, 2.5 mm

Connector X2 Cable Connector, D Connector, 9PIN, Male Connector,Cable Welding Type

Cable Twisted-Pair Cable, 100 ohm, UL2464, 0.4 mm, 26 AWG,3P, PANTONE WARM GRAY 1U

Alarm Box RS232 Serial Port Cablesl Application Scenario

This cable is used to connect with an local maintenance terminal (LMT) and the universalalarm box, for transmitting RS232 differential signals.Table 15-11 lists the connections of the cables.



Issue 05 (2009-01-09)

Table 15-11 Connections of alarm box RS232 serial port cables

Connector Position

DB9 male connector Connected to the LMT

Network connector-8PIN Connected to the universal alarm box

l Appearance and StructureFigure 15-4 shows the appearance and structure of the alarm box RS232 serial port cable.

Figure 15-4 Alarm box RS232 serial port cables

AA 8

631

M016 BPos.9

Pos.1

B

X2

X1

l Pin assignment

Table 15-12 lists pin assignment of the alarm box RS232 serial port cable, where RXindicates receiving and TX indicates transmitting.

Table 15-12 Pin assignment of alarm box RS232 serial port cables

Network Connector-8PIN DB9 Male Connector

3 5

5 2

6 3

l Technical specificationsTable 15-13 lists the technical specifications of the alarm box RS232 serial port cables.

Table 15-13 Technical specifications of the alarm box RS232 serial port cables


Connector X1 Network Interface Connector, 8Bit 8Pin, Crystal Plug

Connector X2 Cable connector, D model, 9PIN, female, welding modelused for cable connection

Cable Twisted-Pair Cable, 100 ohm, Category 5e UTP, 0.51 mm,24 AWG, 8Cores, PANTONE 430U



15-9

15.3 Cascading CablesThis describes cascading cables in terms of the application scenario, appearance, pinassignments, and technical specifications.

15.3.1 FE Cascading CablesThis describes FE cascading cables in terms of the application scenario, appearance, pinassignments, and technical specifications.

15.3.2 GE Cascading CablesThis describes GE cascading cables in terms of the application scenario, appearance, pinassignments, and technical specifications.

15.3.3 TDM Cascading CablesThis describes TDM cascading cables in terms of the application scenario, appearance, pinassignments, and technical specifications.

15.3.1 FE Cascading CablesThis describes FE cascading cables in terms of the application scenario, appearance, pinassignments, and technical specifications.

Common FE Cascading Cablesl Application Scenario

The common FE cascading cable is used for cascading of the FE planes between SSMframes.

l Appearance

The common FE cascading cable is the crossover cable. Figure 15-5 shows its appearanceand structure.

Figure 15-5 Common FE cascading cables

X2

8

1

X1

8

1

l Pin assignment

Figure 15-6 shows the pin assignment of the cable.



Issue 05 (2009-01-09)

Figure 15-6 Connections of crossover cables

SIDE 1

SIDE 2

SIDE11--White/Orange2--Orange3--White/Green

4--Blue5--White/Blue6--Green7--White/Brown8--Brown

SIDE21--White/Green2--Green3--White/Orange4--Blue

5--White/Blue6--Orange7--White/Brown8--Brown

1 2 3 4 5 6 7 8

1 2 3 4 5 6 7 8

l Technical specifications

Table 15-14 lists the technical specifications of the FE cascading network cable.

Table 15-14 Technical specifications of the FE cascading network cable

Item Specification

ConnectorX1/X2

Network Interface Connector, 8-Bit 8PIN, Shielded, Crystal ModelConnector

Cable Twisted-Pair Cable, 100 ohm, CAT5E SFTP, 0.51 mm, 24 AWG, 8Cores, PANTONE430U

Number ofcores

8 Cores

FE Cascading Network Cable with Two Terminals at One Endl Application Scenario

The FE cascading network cable with two terminals at one end is used for cascading of theFE planes between SSM frames. When the UG02MNET or UG02MBLU_VC is used, theFE cascading network cable with two terminals at one end is required.Table 15-15 lists the connections of the FE cascading network cables with two terminalsat one end.

Table 15-15 Connections of the FE cascading network cables with two terminals at oneend

Connector Position

X1: Crystal model connector Connected to FE1&FE2 interface or FE3&FE4interface on the UG02MNET/UG02MBLU_VC.

X2, X3: Model socket/Topplugging type

Connected to FE3 cascading network ports on theMTNCs in two frames respectively.



15-11

CAUTIONWhen two frames are connected to the FE cascading network port on the UG02MNET orthe UG02MBLU_VC through the FE cascading network cables with two terminals at oneend, the branch cable with the identification FE1/FE3 is connected to the MTNC in theframe with the small frame number and the branch cable with the identification FE2/FE4is connected to the MTNC in the frame with the large frame number.

l AppearanceFigure 15-7 shows the appearance of the FE cascading network cable with two terminalsat one end.

Figure 15-7 Appearance of the FE cascading network cable with two terminals at one end

Figure 15-8 shows the structure of the FE cascading network cable with two terminals atone end.



Issue 05 (2009-01-09)

Figure 15-8 Structure of the FE cascading network cable with two terminals at one end

AA

X1B

B1

81

8

Label1

Label2 X2

X3

X1: crystal model connector X2 and X3: model socket/top plugging type

Label1: FE1/FE3 Label1: FE2/FE4

l Pin assignment

Table 15-16 lists the pin assignment of the FE cascading network cable with two terminalsat one end.

Table 15-16 Pin assignment of the FE cascading network cable with two terminals at oneend

Start End Color Relation

X1.1 X2.1 Blue Twisted pair

X1.2 X2.2 White/Blue

X1.3 X2.3 Orange Twisted pair

X1.6 X2.6 White/Orange

X1.SHELL X2.SHELL – Drain Wire

X1.4 X3.1 Green Twisted pair

X1.5 X3.2 White/Green

X1.7 X3.3 Brown Twisted pair

X1.8 X3.6 White/Brown

X1.SHELL X3.SHELL – Drain Wire

l Technical specificationsTable 15-17 lists the technical specifications of the FE cascading network cable with twoterminals at one end.

Table 15-17 Technical specifications of the FE cascading network cable with two terminalsat one end

Item Specification

Connector X1 Network Interface Connector, 8-Bit 8PIN, Shielded,Crystal Model Connector



15-13

Item Specification

Connector X2 and X3 Network Interface Connector, 8-Bit 8PIN, Shielded,Model Socket/Top Plugging Type

Cable Twisted-Pair Cable, FTP

Inner conductor core diameter 0.530 mm

Characteristic impedance 100.0 ohms

15.3.2 GE Cascading CablesThis describes GE cascading cables in terms of the application scenario, appearance, pinassignments, and technical specifications.

Application ScenarioThe GE cascading cable is used for cascading between the GE planes of SSM frames.

AppearanceThe gigabit Ethernet (GE) cascading cable is made of multi-mode optical fiber, and the opticalconnector is of LC/PC type.


Figure 15-9 Appearance of the GE cascading cable

Both ends of the GE cascading cable are LC/PC connectors. Figure 15-10 shows the appearanceof the LC/PC connector.



Issue 05 (2009-01-09)

Figure 15-10 Appearance of the LC/PC connector

Cable Connections

The GE cascading cable is used to connect to GE cascading optical ports on the MNET,MNLU, or MBLU, including the following two cases:

l One end is connected to the MBLU in the central switching frame, and the other end isconnected to the MNET in the service frame.

l The two ends are respectively connected to the MNETs in the main control frame and inthe central switching frame.

l One end is connected to the MBLU/MNET in the central switching frame, and the otherend is connected to the MNLU in the service frame.

l The two ends are respectively connected to the MNLUs in the main control frame and theservice frame.

Each MNET, MNLU, or MBLU has two pairs of GE optical ports (an RX port and a TX portcomprise a pair), and GE cascading cables are used in pairs.


Table 15-18 lists the technical specifications of the GE cascading cable.

Table 15-18 Technical specifications of the GE cascading cable

Item Specification

Bending radius Dynamic bending: 20D, no less than 50 mm [115/16 in.]

Static bending: 10D, no less than 30 mm [1 3/16in.]

Maximum transmission distance 50 m [164 ft.]

Working temperature –40℃ to +75℃ [–40℉ to 167℉]

NOTE

The minimum bending radius allowed by the optical fiber is indicated by the multiple of the cable diameterD.



15-15

15.3.3 TDM Cascading CablesThis describes TDM cascading cables in terms of the application scenario, appearance, pinassignments, and technical specifications.

Application ScenarioThe TDM cascading cable is used for cascading between the TDM planes of SSM frames.

The TDM cascading cable is made of multi-mode optical fiber and the connectors are of the LC/PC type.


Figure 15-11 Appearance of the TDM cascading cable

Both ends of the TDM cascading cable are LC/PC connectors. Figure 15-12 shows theappearance of the LC/PC connector.




Issue 05 (2009-01-09)

Cable ConnectionsTDM cascading cables are used in pairs on the all ports.

For SSM-256 frames, there are four ports on each MTNB or MBLU. The cascading includesthe following two cases:

l When three or more frames are cascaded, one end of the TDM cascading cable is connectedto the MBLU in the central switching frame, and the other end to the MTNB in a serviceframe. In addition, the MTNB in the main control frame is connected to the MTNB in thecentral switching frame through the TDM cascading cable.

l When two frames are cascaded, the TDM cascading cable connects the MTNB in the maincontrol frame and the MTNB in a service frame.

For SSM-32 cascading, the MTNCs in the main control frame connect with the MTNCs in twoservice frames respectively through TDM cascading optical fibers.

For the hybrid cascading between SSM-256 and SSM-32 frames, the MBLUs or MTNBs in theSSM-256 frame connect with the MTNCs in four SSM-32 frames respectively through fourTDM cascading optical fibers.

Technical SpecificationsTable 15-19 lists the technical specifications of the TDM cascading cable.

Table 15-19 Technical specifications of the TDM cascading cable

Item Specification

Bending radius Dynamic bending: 20D, no less than 50 mm [115/16 in.]

Static bending: 10D, no less than 30 mm [1 3/16in.]

Insertion loss (1310 nm) ≤ 0.3 dB

Return loss (1310 nm) > 35 dB


NOTE


15.4 Clock CablesThis describes clock cables in terms of the application scenario, appearance, pin assignments,and technical specifications.

15.4.1 Clock Distribution CableThis describes the clock distribution cable in terms of the application scenario, appearance, pinassignments, and technical specifications.

15.4.2 8 kHz Clock Cables



15-17

This describes 8 kHz clock cables in terms of the application scenario, appearance, pinassignments, and technical specifications.

15.4.3 BITS Clock CablesThis describes BITS clock cables in terms of the application scenario, appearance, pinassignments, and technical specifications.

15.4.4 GPS Clock CablesThis describes GPS clock cables in terms of the application scenario, appearance, pinassignments, and technical specifications.

15.4.1 Clock Distribution CableThis describes the clock distribution cable in terms of the application scenario, appearance, pinassignments, and technical specifications.

Application ScenarioThe clock distribution cable provides clock signals for various SSM-256 subracks.

It uses a DB-26 connector at one end to connect to the CLK in the main controlling subrack anduses six RJ-45 connectors at the other end to connect to the NET in the SSM-256 servicesubrack.

AppearanceFigure 15-13 shows the appearance of the clock distribution cable.

Figure 15-13 Appearance of the clock distribution cable

Figure 15-14 shows the structure of the clock distribution cable.



Issue 05 (2009-01-09)

Figure 15-14 Structure of the clock distribution cable

X1

X281

X3

X4

X5

X6

X7

W1

W2

W3

W4

W5

W6

Pos.26

Pos.1

Pin Assignments

Table 15-20 lists the pin assignments of the clock distribution cable.

NOTE

l CLK denotes the differential 8 kHz output.

l UTC denotes the signal type of the clock board (signal with high level: active signal; signal with lowlevel: standby signal).

l +/- denotes the positive or the negative end of the differential twisted-pair cable.

Table 15-20 Pin assignments of the clock distribution cable

Cable From To Relation Remark

W1 X1.1 X2.3 1 pair CLK01+

X1.2 X2.6 CLK01-

X1.3 X2.1 One pair UTC01+

X1.4 X2.2 UTC01-

W2 X1.5 X3.3 1 pair CLK02+

X1.6 X3.6 CLK02-

X1.7 X3.1 1 pair UTC02+

X1.8 X3.2 UTC02-

W3 X1.9 X4.3 1 pair CLK03+

X1.10 X4.6 CLK03-

X1.11 X4.1 1 pair UTC03+

X1.12 X4.2 UTC03-

W4 X1.14 X5.3 1 pair CLK04+



15-19

Cable From To Relation Remark

X1.15 X5.6 CLK04-

X1.16 X5.1 1 pair UTC04+

X1.17 X5.2 UTC04-

W5 X1.18 X6.3 1 pair CLK05+

X1.19 X6.6 CLK05-

X1.20 X6.1 1 pair UTC05+

X1.21 X6.2 UTC05-

W6 X1.22 X7.3 1 pair CLK06+

X1.23 X7.6 CLK06-

X1.24 X7.1 1 pair UTC06+

X1.25 X7.2 UTC06-

Technical SpecificationsTable 15-21 lists the technical specifications of the clock distribution cable.

Table 15-21 Technical specifications of the clock distribution cable


Cable connector X1: D type–26 pin–male dual edgeX2 to X7: RJ-45 connector–8 pin

Cable type Symmetrical twisted-pair cable

Characteristic impedance 100 ohms

Inner conductor diameter 0.48 mm

Wire gauge of the innerconductor

26 AWG

Color Black

Number of cores 2 pairs

Fire resistance of the outerjacket

CM

15.4.2 8 kHz Clock CablesThis describes 8 kHz clock cables in terms of the application scenario, appearance, pinassignments, and technical specifications.



Issue 05 (2009-01-09)

Application ScenarioThe 8 kHz clock cable connects the 8K_OUT port of the E32, T32, A4L, P4L, S1L, S2L, or PIEboard with the 8K_IN port of the MCLK or the MTNC, to provide 8 kHz clock signals for theMCLK or the MTNC in the main control frame.

Two 8 kHz clock cables are configured in the system. Table 15-22 shows the cable connections.

Table 15-22 Connections of the 8 kHz clock cable

Connector Position

RJ48 connector Connected to the 8K_OUT port of the E32, T32, A4L, P4L,S1L, S2L, or PIE board

Two RJ45 connectors Connected to the 8K_IN1 port or 8K_IN2 port of the masterand slave MCLK or MTNC boards

Appearance and StructureFigure 15-15 shows the appearance of this cable.

Figure 15-15 Appearance of the 8 kHz clock cable

Figure 15-16 shows the structure of this cable.

Figure 15-16 Structure of the 8 kHz clock cable

AA

X1 X2

X3



15-21

Pin AssignmentTable 15-23 and Table 15-24 list the pin assignment of this cable.

Table 15-23 Pin assignment of the 8 kHz clock cable (1)

X1 (RJ48) X2 (RJ45) Definition Relation

1 1 8K0+ Twisted pair

2 2 8K0-

Metal shell Metal shell PGND Shielding layer

Table 15-24 Pin assignment of the 8 kHz clock cable (2)

X1 (RJ48) X3 (RJ45) Definition Relation

3 1 8K1+ Twisted pair

6 2 8K1-

Metal shell Metal shell PGND Shielding layer

Technical SpecificationsTable 15-25 lists the technical specifications of the 8 kHz clock cable.

Table 15-25 Technical specifications of the 8 kHz clock cable

Item Specifications

Connectors Network Interface Connector, Single Row, Single Port, 8Bit,8PIN, Shielded, Crystal Model Connector, Matching AWG 26to AWG 28, Leads Twisted Inside Cable

Cable Twisted-Pair Cable, 100 ohm, SEYVP, 0.48 mm, 26 AWG, 2Pairs, Black

15.4.3 BITS Clock CablesThis describes BITS clock cables in terms of the application scenario, appearance, pinassignments, and technical specifications.

Application ScenarioThe BITS clock cable is used to connect with the CLK and external clock device to transmit 2MHz clock signals. The BITS clock cables can be of 75 ohms or 120 ohms. Choose proper BITSclock cables based on the impedances of site surveys.




Issue 05 (2009-01-09)

Table 15-26 Connections of the BITS clock cable

Connector Position

SMB female connector Connected to the 2M_IN port of a CLK

Idle Equipped with corresponding connector based on the model ofthe cable distribution rack in the equipment room andconnected to the BITS device

75-ohm BITS Clock Cablesl Appearance and structure

Figure 15-17 shows the appearance of the 75-ohm BITS clock cable.

Figure 15-17 Appearance of the 75-ohm BITS clock cable

Figure 15-18 shows the structure of the 75-ohm BITS clock cable.

Figure 15-18 Structure of the 75-ohm BITS clock cable

This cable is equipped with an SMB female connector at one end and no connector at theother end.

l Pin AssignmentNone



15-23

l Technical specificationsTable 15-27 lists the technical specifications of the 75-ohm BITS clock cable.

Table 15-27 Technical specifications of the 75-ohm BITS clock cable

Item Specification

Connector Coaxial Connector, SMB Connector, 75ohm/Straight/Female, Matching SYV-75-2-2Cable

Cable Coaxial Cable, SYV-75-2-2(4.0Z)-1/0.34mm, OD3.9mm, Double-LayerCopper Braid Shielded

120-ohm BITS Clock Cablesl Appearance and structure

Figure 15-19 shows the appearance of the 120-ohm BITS clock cable.

Figure 15-19 Appearance of the 120-ohm BITS clock cable

Figure 15-20 shows the structure of the 120-ohm BITS clock cable.



Issue 05 (2009-01-09)

Figure 15-20 Structure of the 120-ohm BITS clock cable

Label 1 Main label

Label 2

W1

W2

1

X1

X2

2

W3

W4

Label 3

Label 4

1. Coaxial Connector, SMB Connector, 75ohm/Straight/Female

2. 75 ohm/120 ohm transfer PCB

W1 and W2. Coaxial Cable, SYV-75-2-2 W3 and W4. Communication cable - 120ohm shieldedtwisted pair lines

This cable is equipped with two SMB female connectors at one end and no connector atthe other end.

l Pin AssignmentNone

l Technical specificationsTable 15-28 lists the technical specifications of the 120-ohm BITS clock cable.

Table 15-28 Technical specifications of the 120-ohm BITS clock cable

Item Specification

Connector Coaxial Connector, SMB Connector, 75ohm/Straight/Female, Matching SYV-75-2-2 Cable

Cable W1 and W2 Coaxial Cable, SYV-75-2-2(4.0Z)-1/0.34mm,OD3.9mm, Double-Layer Copper Braid Shielded

Cable W3 and W4 Communication cable - 120ohm shielded twisted pairlines - 1/0.5 - 2-core, round - outer diameter is 3.8 mm

15.4.4 GPS Clock CablesThis describes GPS clock cables in terms of the application scenario, appearance, pinassignments, and technical specifications.

Application ScenarioThe GPS clock cable is used to transmit GPS clock signals.

This cable is equipped with an SMA male plug at one end and an N50 female connector at theother end.


Table 15-29 Connections of the GPS clock cable

Connector Position

SMA male plug Connected to the GPS clock input port ANT of a CLK



15-25

Connector Position

N50 female connector Connected to the feeder or jumper


Figure 15-21 shows the appearance and structure of the GPS clock cable.

Figure 15-21 GPS clock cable

Pin Assignment

None


Table 15-30 lists the technical specifications of the GPS clock cable.

Table 15-30 Technical specifications of the GPS clock cable

Item Specification

Connector 1 Coaxial Connector, SMA Connector, 50 ohm, Right Angle, MaleType, Matching SFF-50-1.5-1

Connector 2 Coaxial Connector, N Type Connector, 50 ohm, Straight, FemaleType, Bulkhead Mounting, Matching SFF50-1.5-1 Cable



Issue 05 (2009-01-09)

Item Specification

Cable Coaxial Cable, Stranded Silver-plated Copper-clad Steel 7/0.17mm, 50 ohm, 2.5 mm, 1.55 mm, 0.54 mm

15.5 Trunk Cables of SSM FramesThis describes trunk cables in terms of the application scenario, appearance, pin assignments,and technical specifications.

15.5.1 75-ohm E1 Trunk CableThis describes the 75-ohm E1 trunk cable in terms of the application scenario, appearance, pinassignments, and technical specifications.


15.5.3 100-ohm T1 CablesThis describes 100-ohm T1 cables in terms of the application scenario, appearance, pinassignments, and technical specifications.

15.5.4 75-ohm E3/T3 CablesThis describes 75-ohm E3/T3 trunk cables in terms of the application scenario, appearance, pinassignments, and technical specifications.

15.5.5 SDH Trunk CablesThis describes SDH trunk cables in terms of the application scenario, appearance, pinassignments, and technical specifications.


Application ScenarioA 75-ohm E1 trunk cable provides 16 E1 interfaces.

The 75-ohm E1 trunk cable uses a DB-100 connector at one end to connect to the E32/ESU anduses an SMB connector at the other end to connect to the DDF. The DB-100 connector shipswith the trunk cable, whereas the SMB connector is prepared on site.

AppearanceFigure 15-22 shows the appearance of the 75-ohm E1 trunk cable.



15-27

Figure 15-22 Appearance of the 75-ohm E1 trunk cable

Pos.1

Pos.100

Pin Assignments

CAUTIONA pin assignment table is provided in the packaging bag of the cable connector. You must keepthe table carefully.If the table is lost, record the information printed on the cable label and contact Huawei for thespecific pin assignments.

Table 15-31 lists the pin assignments of the 75-ohm E1 trunk cable.

NOTE

l STARTPT denotes the position of the pin on the DB-100 connector.

l COAXIAL denotes the type of signals on each twisted pair.

l Print denotes cable number printed on the cable.

l Remark denotes the Rx/Tx relation, which applies to only the E32/ESU. For example:

l R1: receive end of the E1 signals from line 1

l T1: transmit end of the E1 signals from line 1

l TIP denotes the inner conductor of the coaxial cable and RING the outer conductor of the coaxial cable.R denotes the receive direction and T the transmit direction.



Issue 05 (2009-01-09)

Table 15-31 Pin assignments of the 75-ohm E1 trunk cable

STARTPT

COAXIAL

REMARK

PRINT STARTPT

COAXIAL

REMARK

PRINT

8 TIP R0 W1.1 33 TIP R8 W2.1

9 RING 34 RING

11 RING T0 W1.2 36 RING T8 W2.2

12 TIP 37 TIP

5 RING R1 W1.3 30 RING R9 W2.3

6 TIP 31 TIP

2 TIP T1 W1.4 27 TIP T9 W2.4

3 RING 28 RING

58 TIP R2 W1.5 83 TIP R10 W2.5

59 RING 84 RING

61 RING T2 W1.6 86 RING T10 W2.6

62 TIP 87 TIP

55 RING R3 W1.7 80 RING R11 W2.7

56 TIP 81 TIP

52 TIP T3 W1.8 77 TIP T11 W2.8

53 RING 78 RING

20 TIP R4 W1.9 45 TIP R12 W2.9

21 RING 46 RING

23 RING T4 W1.10 48 RING T12 W2.10

24 TIP 49 TIP

17 RING R5 W1.11 42 RING R13 W2.11

18 TIP 43 TIP

14 TIP T5 W1.12 39 TIP T13 W2.12

15 RING 40 RING

70 TIP R6 W1.13 95 TIP R14 W2.13

71 RING 96 RING

73 RING T6 W1.14 98 RING T14 W2.14

74 TIP 99 TIP

67 RING R7 W1.15 92 RING R15 W2.15



15-29

STARTPT

COAXIAL

REMARK

PRINT STARTPT

COAXIAL

REMARK

PRINT

68 TIP 93 TIP

64 TIP T7 W1.16 89 TIP T15 W2.16

65 RING 90 RING


Table 15-32 lists the technical specifications of the 75-ohm E1 trunk cable.

Table 15-32 Technical specifications of the 75-ohm E1 trunk cable


Cable connector D type–100 pin–straight male

Cable type Coaxial cable


Shielding layer diameter of asingle cable

2.2 mm

Inner insulation layerdiameter of a single cable

1.2 mm

Inner conductor diameter 0.254 mm

Color Huawei white

E1(T1) number 16 E1s



A 120-ohm E1 trunk cable provides 16 E1 interfaces.

The 120-ohm E1 trunk cable uses a DB-100 connector at one end to connect to the E32/ESU/T32/TSU and uses bare wires at the other end to connect to the DDF.

CAUTIONTwo types of 120-ohm E1 trunk cables are available to fulfill different demands. The two typesof cables differ in only the outer diameter. Pay attention to the cable type during installation.



Issue 05 (2009-01-09)

AppearanceFigure 15-23 shows the appearance of the 120-ohm E1 trunk cable.

Figure 15-23 Appearance of the 120-ohm E1 trunk cable

Pos.100

Pos.1

Pin Assignments

CAUTIONTwo types of 120-ohm trunk cables are available. You must pay attention to the pin assignmentwhen connecting the cable.A pin assignment table is provided in the packaging bag of the cable connector. You must keepthe table carefully.If the table is lost, record the information printed on the cable label and contact Huawei for thespecific pin assignments.

Table 15-33 and Table 15-34 list the pin assignments of the 120-ohm E1 trunk cable.

NOTE

Remark denotes the Rx/Tx relation, which applies to only the E32/ESU/T32/TSU. For example:

l R1: receive end of the E1 signals from line 1

l T1: transmit end of the E1 signals from line 1



15-31

Table 15-33 Pin assignments of the new 120-ohm E1 trunk cable

STARTPT

WIRECOLOR

TWISTDEF.

TAPECOLOR

STARTPT

WIRECOLOR

TWISTDEF.

TAPECOLOR

11 White T0 Blue 23 Red T4 Blue

12 Blue 24 Brown

8 White R0 20 Red R4

9 Orange 21 Gray

2 White T1 14 Black T5

3 Green 15 Blue

5 White R1 17 Black R5

6 Brown 18 Orange


62 Gray 74 Green

58 Red R2 70 Black R6

59 Blue 71 Brown

52 Red T3 64 Black T7

53 Orange 65 Gray

55 Red R3 67 Yellow R7

56 Green 68 Blue

36 White T8 Orange 48 Red T12 Orange

37 Blue 49 Brown


34 Orange 46 Gray


28 Green 40 Blue


31 Brown 43 Orange


87 Gray 99 Green


84 Blue 96 Brown



Issue 05 (2009-01-09)

STARTPT

WIRECOLOR

TWISTDEF.

TAPECOLOR

STARTPT

WIRECOLOR

TWISTDEF.

TAPECOLOR

77 Red T11 89 Black T15

78 Orange 90 Gray

80 Red R11 92 Yellow R15

81 Green 93 Blue

Table 15-34 Pin assignments of the old 120-ohm E1 trunk cable

STARTPT

WIRECOLOR

COAXIAL

TAPECOLOR

STARTPT

WIRECOLOR

COAXIAL

TAPECOLOR

2 White T1 Blue 27 Red T9 Blue

3 Blue 28 Brown


6 Orange 31 Gray


9 Green 34 Blue


12 Brown 37 Orange


15 Gray 40 Green


18 Blue 43 Brown


21 Orange 46 Gray

23 Red T4 48 Yellow T12

24 Green 49 Blue

52 White T3 Orange 77 Red T11 Orange

53 Blue 78 Brown


56 Orange 81 Gray




15-33

STARTPT

WIRECOLOR

COAXIAL

TAPECOLOR

STARTPT

WIRECOLOR

COAXIAL

TAPECOLOR

59 Green 84 Blue


62 Brown 87 Orange


65 Gray 90 Green


68 Blue 93 Brown


71 Orange 96 Gray

73 Red T6 98 Yellow T14

74 Green 99 Blue

Technical SpecificationsTable 15-35 lists the technical specifications of the 120-ohm E1 trunk cable.

Table 15-35 Technical specifications of the 120-ohm E1 trunk cable


Cable connector D type–100 pin–straight male

Cable type Symmetrical twisted-pair cable


Inner conductor diameter 0.4 mm/0.5 mm

Wire gauge 26 AWG

Color PANTONE 430U

E1(T1) number 16 E1s

15.5.3 100-ohm T1 CablesThis describes 100-ohm T1 cables in terms of the application scenario, appearance, pinassignments, and technical specifications.

Application ScenarioThe 100-ohm T1 cable is the same as the 120-ohm E1 cable in terms of appearance, structureand pin definition. They are different in impedance. See 15.5.2 120-ohm E1 Trunk Cable.



Issue 05 (2009-01-09)

This cable is used to transmit 1.544 Mbit/s T1 signals.

15.5.4 75-ohm E3/T3 CablesThis describes 75-ohm E3/T3 trunk cables in terms of the application scenario, appearance, pinassignments, and technical specifications.


The 75-ohm E3/T3 trunk cable is used to transmit E3/T3 signal.

The UMG8900 adopts two types of E3/T3 trunk cable. Both of the two types are the coaxialcable with the impedance of 75 ohms and adopt the BNC connector. However, the number ofconnectors of the two types of trunk cables are different. For the first type, one end has the BNCconnector and the other end has no connector. For the second type, both ends have the BNCconnectors and T-shaped conversion connectors.

When the PIE works in load-sharing mode, the E3/T3 trunk cable with one BNC connector isadopted. When the PIE works in master and slave mode, the E3/T3 trunk cable with two BNCconnectors are used to collect the signals on the mater and slave boards. Then the E3/T3 trunkcable with one BNC connector is used to transmit the signals.

Appearance

Figure 15-24 shows the appearance of the E3/T3 trunk cables with two BNC connectors.

Figure 15-24 Appearance of the E3/T3 trunk cables with two BNC connectors

Figure 15-25 shows the appearance of the E3/T3 trunk cables with one BNC connector.



15-35

Figure 15-25 Appearance of the E3/T3 trunk cables with one BNC connector

Cable ConnectionsTable 15-36 lists the connections of this cable.

Table 15-36 Connections of 75-ohm E3/T3 trunk cables

Connector Position

BNC male connector Receiving and transmitting interfaces 0 to 2 onthe PIE

Idle Corresponding connector that is made on sitefor the digital distribution frame (DDF)

Technical SpecificationsTable 15-37 and Table 15-38 list the technical specifications of the two types of trunk cables.

Table 15-37 Technical specifications of the E3/T3 trunk cable with two BNC connectors

Item Specification

Connector 1 Coaxial Connector, BNC, 75 ohm, Straight Plug, Male,Matching 735A

Connector 2 RF Coaxial Connector, BNC, 75ohm, KKK, T Type,Adapter

Cable Coaxial Cable, 735A1, 75 ohms, 3.3 mm, 1.98 mm, 0.45mm, PANTONE WARM GRAY 1U



Issue 05 (2009-01-09)

Table 15-38 Technical specifications of the E3/T3 trunk cable with one BNC connector

Item Specification

Connector Coaxial Connector, BNC, 75 ohm, Straight Plug, Male,Matching 735A

Outer diameter Coaxial Cable, 735A1, 75 ohms, 3.3 mm, 1.98 mm, 0.45mm, PANTONE WARM GRAY 1U

15.5.5 SDH Trunk CablesThis describes SDH trunk cables in terms of the application scenario, appearance, pinassignments, and technical specifications.


The SDH trunk cable is used to connect the MS2E or MS1E board and synchronous digitalhierarchy (SDH) transmission equipment to transmit 155 Mbit/s trunk signals.

This cable is equipped with an SMB female connector at one end and no connector at the otherend.

Appearance

Figure 15-26 shows the appearance of the SDH trunk cable.

Figure 15-26 Appearance of the SDH trunk cables

Cable Connections


Table 15-39 Connections of SDH trunk cables

Connector Position

SMB female connector Connected to theMS2E or MS1E

Idle Equipped with corresponding connector based on the modelof the cable distribution rack in the equipment room


Table 15-40 lists the technical specifications of the 155 Mbit/s trunk cable.



15-37

Table 15-40 Technical specifications of the SDH trunk cable

Item Specification

Connector Coaxial Connector, SMB, 75 ohm, Straight/Plug, Female

Cable Coaxial Cable, Single Bare Copper, 75 ohm, 7.5 mm, 3.8 mm,0.61 mm, PANTONE WARM GRAY 1U

Cable diameter 6.70 mm [1/4 in.]

Impedance 75 ohms

15.6 Internal Trunk Cables from SSM Frames to SIWFFrames

This describes internal trunk cables between the SSM frame and the SIWF frame in terms of theapplication scenario, appearance, pin assignments, and technical specifications.

Application ScenarioOne end of the cable is the DB100 plug and the other end of the cable is eight 8-pin connectorsfor the network port. Each cable can be used by two SIWUs.

CAUTIONSet the DIP switches of the E32 board to ensure that the characteristic impedance matching ofthe E32 board is 75 ohms.


Table 15-41 Connections of the internal trunk cable between the SSM frame and the SIWFframe

Connector Position

DB100 connector DB100 E1/T1 interfaces on the E32/T32

Network interface connector SIWU board in the SIWF frame

Appearance and StructureFigure 15-27 shows the appearance of the internal trunk cable between the SSM frame and theSIWF frame.



Issue 05 (2009-01-09)

Figure 15-27 Appearance of the internal trunk cable between the SSM frame and the SIWFframe

Figure 15-28 shows the structure of the internal trunk cable between the SSM frame and theSIWF frame.

Figure 15-28 Structure of the internal trunk cable between the SSM frame and the SIWF frame

APos.100 M067

Pos.1

A

X1

W1

W1.1

W1.2

W1.3W1.4

W1.5W1.6

W1.7W1.8

W1.9W1.10

W1.11W1.12

W1.13W1.14

W1.15W1.16

W2

W3

W4

W5

W6

W7

W8

W9

X2

X3

X4

X5

X6

X7

X8

X9

B B

M052

18



15-39

Pin AssignmentTable 15-42 lists the pin assignment of the DB100PIN connector of this cable.

Table 15-42 pin assignment of the DB100PIN connector of the internal trunk cable between theSSM frame and the SIWF frame

Pin Coaxial

Wire Remark

Print Pin Coaxial

Wire Remark

Print

X1.2 TIP W1.1 T1 CHANNEL1

X1.52 TIP W1.9 T3 CHANNEL3X1.3 RING X1.53 RING

X1.5 RING W1.2 R1 X1.55 RING W1.10 R3

X1.6 TIP X1.56 TIP

X1.8 TIP W1.3 R0 CHANNEL0

X1.58 TIP W1.11 R2 CHANNEL2X1.9 RING X1.59 RING

X1.11 RING W1.4 T0 X1.61 RING W1.12 T2

X1.12 TIP X1.62 TIP

X1.14 TIP W1.5 T5 CHANNEL5

X1.64 TIP W1.13 T7 CHANNEL7X1.15 RING X1.65 RING

X1.17 RING W1.6 R5 X1.67 RING W1.14 R7

X1.18 TIP X1.68 TIP

X1.20 TIP W1.7 R4 CHANNEL4

X1.70 TIP W1.15 R6 CHANNEL6X1.21 RING X1.71 RING

X1.23 RING W1.8 T4 X1.73 RING W1.16 T6

X1.24 TIP X1.74 TIP

NOTE

In Table 15-42, TIP indicates the internal conductor of coaxial cable, RING indicates the external conductorof coaxial cable, R indicates receiving and T indicates transmitting. For example, RING R4 indicates theexternal conductor that is connected with E1 4 and is used to receive signals.

Technical SpecificationsTable 15-43 lists the technical specifications of this cable.



Issue 05 (2009-01-09)

Table 15-43 Technical specifications of the internal trunk cable between the SSM frame andthe SIWF frame

Item Specification

Connector X1 Cable Connector, D Type, 100 PIN, Straight Male, CableSolder Type, SCSI Type

Connector X2 to X9 Network port connector, 8-bit 8 PIN, shielded, crystalmodel connector

Cable W1 Coaxial cable, 16 single coreCharacteristic impedance: 75 ohmDiameter of the protection layer: 2.2 mm [0.09 in.]Diameter of the inner insulation layer: 1.2 mm [0.05 in.]Diameter of the inner conductor: 0.254 mm [0.01 in.]Color: white

Cable W2 to W9 Twisted-pair cableCharacteristic impedance: 120 ohmCore diameter of the inner conductor: 0.4 mm [0.02 in.]Wire gauge of the inner conductor: 26 AWGTips: 2 pairsColor: pantone 430U

15.7 Straight Through Cables and Crossover CablesThis describes straight through cables and crossover cables in terms of the application scenario,appearance, pin assignments, and technical specifications.

Application ScenarioThe UMG8900 provides the interface to operate on, maintain, and manage the local maintenanceterminal (LMT). The FE interface is designed with network card interface. The UMG8900 usesthe straight through cable to connect to the media gateway controller (MGC) through the HUBor LAN Switch. The UM8900 uses the crossover cable to directly connect to the MGC.

When the debug network port provided by the MOMU/MOMB is directly connected to the PC,the crossover cable is used. When the debug network port is connected to the PC through a HUBor a LAN Switch, the straight through cable is used.

Straight Through Cablesl Appearance

Figure 15-29 shows the appearance of the straight through cable.



15-41

Figure 15-29 Appearance of straight through cable

1

8

l Pin assignments

Figure 15-30 shows the pin assignments of straight through cables.

Figure 15-30 Pin assignments of straight through cables

SIDE 1

SIDE 2

1--White/Orange2--Orange3--White/Green4--Blue5--White/Blue6--Green7--White/Brown8--Brown

1 2 3 4 5 6 7 8

1 2 3 4 5 6 7 8


Table 15-44 lists the technical specifications of the straight through cable.

Table 15-44 Technical specifications of the straight through cable

Item Specification

ConnectorX1/X2



Number ofcores

8 Cores



Issue 05 (2009-01-09)

Crossover Cablesl Appearance

Figure 15-31 shows the appearance of the crossover cable.

Figure 15-31 Appearance of crossover cable

X2

8

1

X1

8

1

l Pin assignments

Figure 15-32 shows the pin assignments of crossover cables.

Figure 15-32 Pin assignments of crossover cables

SIDE 1

SIDE 2

SIDE11--White/Orange2--Orange3--White/Green

4--Blue5--White/Blue6--Green7--White/Brown8--Brown

SIDE21--White/Green2--Green3--White/Orange4--Blue

5--White/Blue6--Orange7--White/Brown8--Brown

1 2 3 4 5 6 7 8

1 2 3 4 5 6 7 8


Table 15-45 lists the technical specifications of the crossover cable.

Table 15-45 Technical specifications of the crossover cable

Item Specification

ConnectorX1/X2



Number ofcores

8 Cores



15-43

15.8 Optical FibersThis describes optical fibers in terms of the application scenario, appearance, pin assignments,and technical specifications.


The optical connector connected to the UMG8900 is of LC/PC type.

You need to select the proper optical connector according to the optical port of the peer deviceconnected to the network interface module of the UMG8900. The single-mode optical port canonly be connected to the single-mode optical fiber and the multi-mode optical port can only beconnected to the multi-mode optical fiber.

Before connecting the optical fiber, ensure the optical connector and optical fiber match the usedoptical port. The category of the optical fiber can be distinguished by fiber colors: The orangefiber is the multi-mode optical fiber and the yellow fiber is single-mode optical fiber.


Figure 15-33 shows the appearance of the multi-mode optical fiber.

Figure 15-33 Appearance of the multi-mode optical fiber

Figure 15-34 shows the appearance of the single-mode optical fiber.



Issue 05 (2009-01-09)

Figure 15-34 Appearance of the single-mode optical fiber

Both ends of the multi-mode optical fiber and single-mode optical fiber are LC/PC connectors.Figure 15-35 shows the appearance of the LC/PC connector.


Pin AssignmentNone

Technical SpecificationsTable 15-46 lists the technical specifications of the external optical fiber.

Table 15-46 Technical specifications of the external optical fiber

Item Specification

Bending radius Dynamic bending: 20D, no less than 50 mm [2.0in.]



15-45

Item Specification

Static bending: 10D, no less than 30 mm [1.2 in.]

Maximum transmission distance 50 m [0.03 mi.]


NOTE


15.9 Power Cables and PGND CablesThis describes power cables and PGND cables in terms of the application scenario, appearance,pin assignments, and technical specifications.

15.9.1 Power Cables and PGND Cables for CabinetsThis describes power cables and PGND cables for cabinets in terms of the application scenario,appearance, pin assignments, and technical specifications.

15.9.2 Power Cables and PGND Cables of Service FramesThis describes power cables and PGND cables for service frames in terms of the applicationscenario, appearance, pin assignments, and technical specifications.

15.9.1 Power Cables and PGND Cables for CabinetsThis describes power cables and PGND cables for cabinets in terms of the application scenario,appearance, pin assignments, and technical specifications.

–48 V Power Cablesl Application Scenario

The –48 V power cable is used as the leadin of the –48 V power outside the cabinet.One end of the power cable is an OT terminal used for attaching the power cable to thewire post of the external power distribution cabinet. The other end is a cord end terminalused for attaching the power cable to the –48 V terminal block of the DC power distributionframe (PDF) in the cabinet.

l AppearanceFigure 15-36 shows the appearance of –48 V power cables.



Issue 05 (2009-01-09)

Figure 15-36 Appearance of the –48 V power cables

l Cable connections

None

l Technical Specifications

Table 15-47 lists the technical specifications of –48 V power cables.

Table 15-47 Technical specifications of –48 V power cables

Item Specification

Color Blue

Conductor section 25 mm2 [0.04 in.2]

Maximum current 110 A

Working temperature –10℃ to 70℃ [14℉ to 158℉]

Inner conductor impedance 0.78 ohm

RTN Power Cablesl Application Scenario

The RTN power cable is used as the leadin of the –48 V power outside the cabinet.

One end of the power cable is an OT terminal used for attaching the power cable to theGND wire post of the external power distribution cabinet. The other end is a cord endterminal used for attaching the power cable to the RTN terminal block of the DC PDF inthe cabinet.

l Appearance

Figure 15-37 shows the appearance of the RTN power cable.



15-47

Figure 15-37 Appearance of the RTN power cables

l Cable connections

None


Table 15-48 lists the technical specifications of RTN power cables.

Table 15-48 Technical specifications of RTN power cables

Item Specification

Color Black





PGND Cablesl Application Scenario

The protection ground (PGND) cable is used as the PGND leadin outside the cabinet.

Both the ends of the PGND cable are OT terminals. One end of the cable is connected tothe protection grounding bar of the power distribution cabinet. The other end is connectedto the grounding bolt at the top of the cabinet.

l Appearance

Figure 15-38 shows the appearance of the PGND cable.



Issue 05 (2009-01-09)

Figure 15-38 Appearance of the PGND cables

l Cable connections

None


Table 15-49 lists the technical specifications of PGND cables.

Table 15-49 Technical specifications of PGND cables

Item Specification

Color Yellow and green





PGND Feeder Cablel Application Scenario

The PGND feeder cable is used for grounding of chained cabinets.

The PGND feeder cable is also used for connecting the grounding terminal of the lowerenclosure frame of the cabinet to the grounding terminal of the cabinet door. This ensuresthat each part of the cabinet is grounded properly.

l Appearance

Figure 15-39 shows the appearance of the PGND feeder cable.



15-49

Figure 15-39 Appearance of the PGND feeder cable

l Cable connections

None

l Technical Specifications

Table 15-50 lists the technical specifications of the PGND feeder cable.

Table 15-50 Technical specifications of the PGND feeder cable


Cable connector (X1/X2) OT6-6/OT6-6


Conductor section 0 mm2

Maximum current 50.0 A

Working temperature 0℃ to 40℃ [32℉ to 104℉]


15.9.2 Power Cables and PGND Cables of Service FramesThis describes power cables and PGND cables for service frames in terms of the applicationscenario, appearance, pin assignments, and technical specifications.

Power Cables from Power Distribution Frames to SSM Framesl Application Scenario

This cable is used to supply power for the SSM frame.

The power cables are used in pairs. The blue one is –48 V power cable and the black oneis RTN cable. The left end is cord end terminal, connected to the power distribution frame,and the right end is OT terminal, connected to the feed-through filter of the SSM frame.

l Appearance




Issue 05 (2009-01-09)

Figure 15-40 Power cables from power distribution frames to SSM frames

-48V

RTN

l Pin assignment

Nonel Technical Specifications

The cable is made of UL1015 10AWG wire materials, and its maximum current capacityis 50 A.

Power Cables from SSM Frames to Fan Boxes

CAUTIONl It is forbidden to pull out or insert the power cable of the fan box with power on.

l The SSM frames are of two versions. In the SSM frame of the new version, the fan box isnot equipped with the power input interface and monitoring interface.The power cables from SSM frames to fan boxes only used in the SSM frame of the earlierversion.

l Application ScenarioThis cable is used to supply power for the fan box.One end of this cable is a 3V3 connector, connected to the 3V3 socket at the back of theUMG8900 frame, and the other end has two 3V3 connectors, connected to the 3V3 socketsof the master/slave power input at the back of the corresponding fan box respectively.

l AppearanceFigure 15-41 shows its appearance.

Figure 15-41 Power cables from SSM frames to fan boxes

A

A1A2A3

X2

X3

X1

A

l Pin assignment



15-51


The maximum current capacity of this cable is 18 A.

PGND Feeder Cables of SSM Framesl Application Scenario

The PGND feeder cable of SSM frame is used to connect with the protection ground of aframe and grounding bar of the cabinet.This cable is yellow and green, with OT terminals at both ends. Each SSM frame has twogrounding cables. One end of the cable is connected to the grounding point (one point ateach of left and right sides) at the back of the SSM frame, and the other end to the groundingbar of the cabinet. The terminals are fastened with M6 screws.

l AppearanceFigure 15-42 shows the appearance of the PGND feeder cable of SSM frame.

Figure 15-42 Appearance of the PGND feeder cable of SSM frame

l Pin assignment


Table 15-51 lists the technical specifications of the PGND feeder cable of SSM frame.

Table 15-51 Technical specifications of the PGND feeder cable of SSM frame


Cable connector (X1/X2) OT6-6/OT6-6


Conductor section 0 mm2

Maximum current 50.0 A

Working temperature 0℃ to 40℃ [32℉ to 104℉]




Issue 05 (2009-01-09)

A Impedance Transfer Boxes

There are two types of impedance transfer boxes, namely, 120 ohm-75 ohm transfer box withthe BNC socket and 120 ohm-75 ohm transfer box with the SMB socket. The dimensions (L xW x H) are 488 mm x 40 mm x 28 mm, that is 19.2 in. x 1.6 in. x 1.1 in. The two transfer boxesdiffer only in the 75-ohm coaxial connector. One is the SMB and the other is BNC, which canbe adopted based on actual conditions.

Figure A-1 shows the method for using the impedance transfer box.

Figure A-1 Method for using the impedance transfer box

TX

RX

1 32 4

1. 75-ohm coaxial cable 2. Coaxial cable connector

3. RJ45 connector 4. 120-ohm twisted pair

The impedance transfer box connects with the 75-ohm cable through the SMB or BNC coaxialconnector at one end, and connects with the 120-ohm cable through the connector at the otherend.

The 75-ohm cable connects with the SMB female connector or the BNC male connector at oneend, and connects with the cabling rack or directly with the equipment at the other end. The 120-ohm cable connects with the 8-pin connector at one end, and connects with the cabling rack ordirectly with the equipment at the other end.

The method for crimping the 75-ohm cable into the coaxial connector is not described here. Thespecial crimping pliers are needed to crimp the 120-ohm cable into the RJ45 connector.

Figure A-2 shows the appearance of the RJ45 connector.

HUAWEI UMG8900Hardware Description A Impedance Transfer Boxes


A-1

Figure A-2 Appearance of the RJ45 connector

8

1

Table A-1 lists the pin assignment of the RJ45 connector connecting with the 120-ohm twistedpair.

Table A-1 Pin assignment of the RJ45 connector of the 120-ohm twisted pair

Pin No. Definition

1 RX-

2 RX+

3 PGND

4 TX-

5 TX+

6 PGND

A Impedance Transfer BoxesHUAWEI UMG8900Hardware Description

A-2 Huawei Proprietary and ConfidentialCopyright © Huawei Technologies Co., Ltd.

Issue 05 (2009-01-09)

B Board Indicators of All SSM Frames

B.1 Indicators on the MA4L

B.2 Indicators on the MASU

B.3 Indicators on the MBLU

B.4 Indicators on the MCMB

B.5 Indicators on the MCMF

B.6 Indicators on the ME32

B.7 Indicators on the ME8T

B.8 Indicators on the MEAC

B.9 Indicators on the MECU

B.10 Indicators on the MESU

B.11 Indicators on the MFLU

B.12 Indicators on the MG1O

B.13 Indicators on the MHRU

B.14 Indicators on the MHRD

B.15 Indicators on the MIOE

B.16 Indicators on the MMPB

B.17 Indicators on the MMPU

B.18 Indicators on the MNET

B.19 Indicators on the MNLU

HUAWEI UMG8900Hardware Description B Board Indicators of All SSM Frames


B-1

B.20 Indicators on the MOMB

B.21 Indicators on the MOMU

B.22 Indicators on the MPIE

B.23 Indicators on the MPPB

B.24 Indicators on the MRPU

B.25 Indicators on the MS1E

B.26 Indicators on the MS1L



B.29 Indicators on the MSPF

B.30 Indicators on the MT32

B.31 Indicators on the MTAC

B.32 Indicators on the MTCB

B.33 Indicators on the MTCD

B.34 Indicators on the MTNB

B.35 Indicators on the MTNC

B.36 Indicators on the MTNU

B.37 Indicators on the MTSU

B.38 Indicators on the MVPB

B.39 Indicators on the MVPD

B.40 Indicators on the TCLU

B.41 Indicators on the SCMU

B Board Indicators of All SSM FramesHUAWEI UMG8900Hardware Description

B-2 Huawei Proprietary and ConfidentialCopyright © Huawei Technologies Co., Ltd.

Issue 05 (2009-01-09)

B.1 Indicators on the MA4L

Table B-1 lists the meaning of the indicators on the MA4L.

Table B-1 Indicator meaning of the MA4L













ACT Green Flashing The board is in service suchas in the master or connectedstate.


Opticalinterface linkindicator

LINK Green Always on The link is normal.

Always off The link is faulty.

Opticalinterfaceworkingindicator


Some data is received ortransmitted through the link.

Always off No data is received ortransmitted through the link.




B.2 Indicators on the MASU

Table B-2 lists the indicator meaning of the MASU.



B-3

Table B-2 Indicator meaning of the MASU



Runningindicator









Alarmindicator




Workingindicator






B.3 Indicators on the MBLU

Table B-3 lists the meaning of the indicators on the MBLU.

Table B-3 Indicator meaning of the MBLU



Runningindicator




Issue 05 (2009-01-09)








Alarmindicator




Workingindicator













B.4 Indicators on the MCMB

Table B-4 lists the meaning of the indicators on the MCMB.



B-5

Table B-4 Indicator meaning of the MCMB



Runningindicator







Alarmindicator




Workingindicator







B.5 Indicators on the MCMF

Table B-5 lists the meaning of the indicators on the MCMF.

Table B-5 Indicator meaning of the MCMF



Runningindicator







Issue 05 (2009-01-09)





Alarmindicator




Workingindicator






B.6 Indicators on the ME32

Table B-6 lists the meaning of the indicators on the ME32.

Table B-6 Indicator meaning of the ME32



Runningindicator











B-7









B.7 Indicators on the ME8T

Table B-7 lists the meaning of the indicators on the ME8T.

Table B-7 Indicator meaning of the ME8T
















- Green Always on The interface works at therate of 100 Mbit/s.

Always off The interface works at therate of 10 Mbit/s.


- Orange Always on The link is through.




Issue 05 (2009-01-09)



Always on orflashing

Some data is being receivedor transmitted through thelink.




B.8 Indicators on the MEACTable B-8 lists the meaning of the indicators on the MEAC.

Table B-8 Indicator meaning of the MEAC




















B.9 Indicators on the MECU



B-9

Table B-9 lists the meaning of the indicators on the MECU.

Table B-9 Indicator meaning of the MECU



Runningindicator









Alarmindicator







B.10 Indicators on the MESU

Table B-10 lists the meaning of the indicators on the MESU.

Table B-10 Indicator meaning of the MESU



Runningindicator







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Alarmindicator







B.11 Indicators on the MFLU

Table B-11 lists the meaning of the indicators on the MFLU.

Table B-11 Indicator meaning of the MFLU



Runningindicator







Alarmindicator




Workingindicator




B-11







B.12 Indicators on the MG1O

Table B-12 lists the meaning of the indicators on the MG1O.

Table B-12 Indicator meaning of the MG1O



Runningindicator








Workingindicator



Gigabit opticalinterface linkindicator

LINK Green Always on The link is through.


Gigabit opticalinterfaceworkingindicator

ACT Orange Flashing Some data is received ortransmitted through the link.



Issue 05 (2009-01-09)







B.13 Indicators on the MHRU

Table B-13 lists the meaning of the indicators on the MHRU.

Table B-13 Indicator meaning of the MHRU



Runningindicator









Alarmindicator




Workingindicator








B-13




B.14 Indicators on the MHRDTable B-14 lists the meaning of the indicators on the MHRD.

Table B-14 Indicator meaning of the MHRD



Runningindicator









Alarmindicator




Workingindicator






B.15 Indicators on the MIOE



Issue 05 (2009-01-09)

Table B-15 lists the meaning of the indicators on the MIOE.

Table B-15 Indicator meaning of the MIOE



Runningindicator









Alarmindicator




Workingindicator






B.16 Indicators on the MMPB

Table B-16 lists the meaning of the indicators on the MMPB.



B-15

Table B-16 Indicator meaning of the MMPB



Runningindicator






Software is being loaded tothe board, or the boarddoes not run.

Alarmindicator




Workingindicator






B.17 Indicators on the MMPU

Table B-17 lists the meaning of the indicators on the MMPU.

Table B-17 Indicator meaning of the MMPU



Runningindicator







Issue 05 (2009-01-09)





Alarmindicator




Workingindicator







B.18 Indicators on the MNET

Table B-18 lists the meaning of the indicators on the MNET.

Table B-18 Indicator meaning of the MNET



Runningindicator







Alarmindicator






B-17



Workingindicator




LINK Green Always on The received opticalpower meets therequirement.

Always off The received opticalpower does not meet therequirement.



The optical channel thatcorresponds to the opticalmodule is in the masterstate.

Always off The optical channel thatcorresponds to the opticalmodule is in the slavestate.




The indicators of CLK0_IN and CLK1_IN interfaces on the panel of the MNET have nosilkscreen. Table B-19 lists the meaning.

Table B-19 Indicator meaning of clock interfaces on the MNET


CLK0_IN Orange Always on The MNET provides master clock for theframe where it is located.

Always off The MNET does not provide clock forany frame, but it is in hot backup mode.





Issue 05 (2009-01-09)


CLK1_IN Orange Always on The interface on the panel of the MNETextracts clock signals from clockdistribution cable normally.

Always off The MNET extracts clock signals fromthe backplane.



B.19 Indicators on the MNLU

Table B-20 lists the meaning of the indicators on the MNLU.

Table B-20 Indicator meaning of the MNLU



Runningindicator






The board is beingloaded or it does notwork.

Alarmindicator









B-19










B.20 Indicators on the MOMB

Table B-21 lists the meaning of indicators on the MOMB.

Table B-21 Indicator meaning of the MOMB



Runningindicator







Alarmindicator




Workingindicator






Issue 05 (2009-01-09)






B.21 Indicators on the MOMUTable B-22 lists the meaning of the indicators on the MOMU.

Table B-22 Indicator meaning of the MOMU



Runningindicator







Alarmindicator




Workingindicator






B.22 Indicators on the MPIETable B-23 lists the meaning of the indicators on the MPIE.



B-21

Table B-23 Indicator meaning of the MPIE



Runningindicator






The board is being loadedor it does not work.



Alarmindicator




Workingindicator














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B.23 Indicators on the MPPB

Table B-24 lists the meaning of the indicators on the MPPB.

Table B-24 Indicator meaning of the MPPB



Runningindicator







Alarmindicator







B.24 Indicators on the MRPU

Table B-25 lists the indicator meaning of the MRPU.



B-23

Table B-25 Indicator meaning of the MRPU



Runningindicator









Alarmindicator




Workingindicator








Table B-26 lists the meaning of the indicators on the MS1E.

Table B-26 Indicator meaning of the MS1E







Issue 05 (2009-01-09)


















LINK Green Always on The line is in thesynchronous state andthe line specificationsmeet the requirements.











B-25


Table B-27 lists the meaning of the indicators on the MS1L.

Table B-27 Indicator meaning of the MS1L




















LINK Green Always on The line is in thesynchronous state and theline specifications andoptical power meet therequirements.




Issue 05 (2009-01-09)











Table B-28 lists the meaning of the indicators on the MS2E.

Table B-28 Indicator meaning of the MS2E





















B-27















Table B-29 lists the meaning of the indicators on the MS2L.

Table B-29 Indicator meaning of the MS2L












Issue 05 (2009-01-09)














LINK Green Always on The line is in thesynchronous state andthe line specificationsand optical power meetthe requirements.









B.29 Indicators on the MSPF

Table B-30 lists the meaning of the indicators on the MSPF.



B-29

Table B-30 Indicator meaning of the MSPF



Runningindicator







Alarmindicator







B.30 Indicators on the MT32

Table B-31 lists the meaning of the indicators on the MT32.

Table B-31 Indicator meaning of the MT32



Runningindicator









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B.31 Indicators on the MTAC

Table B-32 lists the indicator meaning of the MTAC.

Table B-32 Indicator meaning of the MTAC




















B-31






B.32 Indicators on the MTCB

Table B-33 lists the indicator meaning of the MTCB.

Table B-33 Indicator meaning of the MTCB



Runningindicator









Alarmindicator







B.33 Indicators on the MTCD

Table B-34 lists the indicator meaning of the MTCD.



Issue 05 (2009-01-09)

Table B-34 Indicator meaning of the MTCD



Runningindicator









Alarmindicator







B.34 Indicators on the MTNB

Table B-35 lists the meaning of the indicators on the MTNB.

Table B-35 Indicator meaning of the MTNB



Runningindicator







B-33





Alarmindicator




Workingindicator












B.35 Indicators on the MTNC

Table B-36 lists the meaning of the indicators on the MTNC.



Issue 05 (2009-01-09)

Table B-36 Indicator meaning of the MTNC



Runningindicator







Alarmindicator




Workingindicator







LINK Green Always on Optical fiberconnection is normal.

Always off Optical fiberconnection isabnormal.


ACT Orange Always on or flashing The optical channelthat corresponds to theoptical module is in themaster state.




B-35

B.36 Indicators on the MTNU

Table B-37 lists the meaning of the indicators on the MTNU.

Table B-37 Indicator meaning of the MTNU



Runningindicator




The board runsnormally inaccordance withconfiguration.



Alarmindicator




Workingindicator




LINK Green Always on The line is in thesynchronous state andthe optical powermeets the requirement.




The optical channelthat corresponds to theoptical module is in themaster state.



Issue 05 (2009-01-09)







B.37 Indicators on the MTSU

Table B-38 lists the meaning of the indicators on the MTSU.

Table B-38 Indicator meaning of the MTSU



Runningindicator









Alarmindicator









B-37

B.38 Indicators on the MVPBTable B-39 lists the meaning of the indicators on the MVPB.

Table B-39 Indicator meaning of the MVPB



Runningindicator






Software is being loaded tothe board, or the board doesnot run.



Alarmindicator




Workingindicator






NOTE

The working indicator ACT is unavailable on the panel of the UG01MVPB.The working indicator ACT is available on the panel of the UG02MVPB. The UG02MVPB is in load-sharing mode. Therefore, the indicator is always off.

B.39 Indicators on the MVPDTable B-40 lists the meaning of the indicators on the MVPD.



Issue 05 (2009-01-09)

Table B-40 Indicator meaning of the MVPD



Runningindicator









Alarmindicator




Workingindicator






NOTE

The working indicator ACT is unavailable on the panel of the UG01MVPD.

The working indicator ACT is available on the panel of the UG02MVPD. The UG02MVPD is in load-sharing mode. Therefore, the indicator is always off.

B.40 Indicators on the TCLU

Table B-41 lists the indicator meaning of the TCLU.



B-39

Table B-41 Indicator meaning of the TCLU



Runningindicator







Alarmindicator




Workingindicator













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B.41 Indicators on the SCMU

Table B-42 lists the meaning of the indicators on the SCMU.

Table B-42 Indicator meaning of the SCMU



Runningindicator







Alarmindicator




Workingindicator








B-41

C Board DIP Switches and Jumpers of allSSM Frames

C.1 DIP Switches and Jumpers of the ME32

C.2 DIP Switches on the MEAC

C.3 DIP Switches and Jumpers of the MESU

C.4 Jumpers on the MMPU

C.5 Jumpers on the MOMU

C.6 DIP Switches and Jumpers of the MT32

C.7 DIP Switches and Jumpers of the MTAC

C.8 DIP Switches and Jumpers of the MTSU

HUAWEI UMG8900Hardware Description C Board DIP Switches and Jumpers of all SSM Frames


C-1

C.1 DIP Switches and Jumpers of the ME32

CAUTIONThe 32 E1 cables connected with the ME32 must be of the same characteristic impedance value.That is, one ME32 cannot be connected with both 75-ohm E1 cables and 120-ohm E1 cables.

The methods for setting DIP switches for the UG01ME32 and UG02ME32 are slightly different.The following describes how to set the DIP switches.


Table C-1 lists DIP switches of the UG01ME32.

Table C-1 DIP switches of the UG01ME32



S2 1 to 8 16 to 23

S3 1 to 8 24 to 31

S4 1 to 8 0 to 7

S5 1 to 8 8 to 15


S6 1 to 8 24 to 27

S7 1 to 8 20 to 23

S8 1 to 8 28 to 31

S9 1 to 8 0 to 3

S10 1 to 8 4 to 7

S11 1 to 8 8 to 11

S12 1 to 8 12 to 15

S13 1 to 8 16 to 19


S14 1 to 2 0 to 31



C Board DIP Switches and Jumpers of all SSM FramesHUAWEI UMG8900Hardware Description

C-2 Huawei Proprietary and ConfidentialCopyright © Huawei Technologies Co., Ltd.

Issue 05 (2009-01-09)

Table C-2 Setting DIP switches of the UG01ME32 (75-ohm E1 coaxial cable)

Switch Bit Status

S2 to S13 1 to 8 ON

S14 1 to 2 ON


Table C-3 Setting DIP switches of the UG01ME32 (120-ohm E1 twisted pair)

Switch Bit Status

S2 to S5 1 to 8 OFF


5 to 8 ON

S14 1 OFF

2 ON

DIP Switches of the UG02ME32Table C-4 lists DIP switches of the UG02ME32.

Table C-4 DIP switches of the UG02ME32



S2 1 to 8 20 to 23

S3 1 to 8 24 to 27

S4 1 to 8 28 to 31

S5 1 to 8 0 to 3

S6 1 to 8 4 to 7

S7 1 to 8 8 to 11

S8 1 to 8 12 to 15

S9 1 to 8 16 to 19


S10 1 to 8 16 to 23

S11 1 to 8 8 to 15

S12 1 to 8 0 to 7

S13 1 to 8 24 to 31



C-3



S14 1 to 2 0 to 31



Table C-5 Setting DIP switches of the UG02ME32 (75-ohm E1 coaxial cable)

Switch Bit Status

S2 to S13 1 to 8 ON

S14 1 to 2 ON


Table C-6 Setting DIP switches of the UG02ME32 (120-ohm E1 twisted pair)

Switch Bit Status

S2 to S9 1 to 4 OFF

5 to 8 ON


S14 1 OFF

2 ON

C.2 DIP Switches on the MEAC

Table C-7 lists DIP switches on the MEAC.

Table C-7 DIP switches of the MEAC


Resetting the switch manually S1 1 Resetting the board


S5 1 to 8 0 to 7

S6 1 to 8 8 to 15

S7 1 to 8 16 to 23

S8 1 to 8 24 to 31



Issue 05 (2009-01-09)



S9 1 to 8 0 to 3

S10 1 to 8 4 to 7

S11 1 to 8 8 to 11

S12 1 to 8 12 to 15

S13 1 to 8 16 to 19

S14 1 to 8 20 to 23

S15 1 to 8 24 to 27

S16 1 to 8 28 to 31

The method for setting DIP switches of the MEAC is as follows:


Table C-8 Setting DIP switches of the MEAC (75-ohm E1 coaxial cable)

Switch Bit Status

S5 to S8 1 to 8 ON

S9 to S16 1 to 8 ON


Table C-9 Setting DIP switches of the MEAC (120-ohm E1 twisted pair)

Switch Bit Status

S5 to S8 1 to 8 OFF


5 to 8 ON

C.3 DIP Switches and Jumpers of the MESU

CAUTIONThe 32 E1 cables connected with the MESU must be of the same characteristic impedance value.That is, one MESU cannot be connected with both 75-ohm E1 cables and 120-ohm E1 cables.

Table C-10 lists DIP switches of the MESU.



C-5

Table C-10 DIP switches of the MESU



S2 1 to 8 20 to 23

S3 1 to 8 24 to 27

S4 1 to 8 28 to 31

S5 1 to 8 0 to 3

S6 1 to 8 4 to 7

S7 1 to 8 8 to 11

S8 1 to 8 12 to 15

S9 1 to 8 16 to 19


S10 1 to 8 16 to 23

S11 1 to 8 8 to 15

S12 1 to 8 0 to 7

S13 1 to 8 24 to 31


S14 1 to 2 0 to 31

The method for setting DIP switches of the MESU is as follows:


Table C-11 Setting DIP switches of the MESU (75-ohm E1 coaxial cable)

Switch Bit Status

S2 to S13 1 to 8 ON

S14 1 to 2 ON


Table C-12 Setting DIP switches of the MESU (120-ohm E1 twisted pair)

Switch Bit Status

S2 to S9 1 to 4 OFF

5 to 8 ON


S14 1 OFF



Issue 05 (2009-01-09)

Switch Bit Status

2 ON

C.4 Jumpers on the MMPU

The jumper JP13 is available on the MMPU to choose packet switching modules to load. TableC-13 lists the setting.

Table C-13 Jumper description of the MMPU


State Function






C.5 Jumpers on the MOMU

The jumper JP13 is available on the MOMU to choose packet switching modules to load. TableC-14 lists the setting.

Table C-14 Jumper description of the MOMU


State Function






C.6 DIP Switches and Jumpers of the MT32

DIP Switches and Jumpers of the UG01MT32Table C-15 lists DIP switches of the UG01MT32.

Table C-15 DIP switches of the UG01MT32



S2 1 to 8 16 to 23



C-7


S3 1 to 8 24 to 31

S4 1 to 8 0 to 7

S5 1 to 8 8 to 15


S6 1 to 8 24 to 27

S7 1 to 8 20 to 23

S8 1 to 8 28 to 31

S9 1 to 8 0 to 3

S10 1 to 8 4 to 7

S11 1 to 8 8 to 11

S12 1 to 8 12 to 15

S13 1 to 8 16 to 19


S14 1 to 2 0 to 31

Table C-16 lists the method for setting DIP switches of the UG01MT32.

Table C-16 Setting DIP switches of the UG01MT32 (100-ohm T1 cable)

Switch Bit Status

S2 to S5 1 to 8 OFF

S6 to S13 1 to 4 ON

5 to 8 OFF

S14 1 ON

2 OFF

DIP Switches of the UG02MT32

Table C-17 lists DIP switches of the UG02MT32.

Table C-17 DIP switches of the UG02MT32



S2 1 to 8 20 to 23

S3 1 to 8 24 to 27

S4 1 to 8 28 to 31



Issue 05 (2009-01-09)


S5 1 to 8 0 to 3

S6 1 to 8 4 to 7

S7 1 to 8 8 to 11

S8 1 to 8 12 to 15

S9 1 to 8 16 to 19


S10 1 to 8 16 to 23

S11 1 to 8 8 to 15

S12 1 to 8 0 to 7

S13 1 to 8 24 to 31


S14 1 to 2 0 to 31

Table C-18 lists the method for setting DIP switches of the UG02MT32.

Table C-18 Setting DIP switches of the UG02MT32 (100-ohm T1 cable)

Switch Bit Status

S2 to S9 1 to 4 ON

5 to 8 OFF


S14 1 ON

2 OFF

C.7 DIP Switches and Jumpers of the MTAC

Table C-19 lists DIP switches of the MTAC.

Table C-19 DIP switches of the MTAC


Resetting the switchmanually

S1 1 Resetting the board

Setting the grounding modesfor the T1 cables

S5 1 to 8 0 to 7

S6 1 to 8 8 to 15

S7 1 to 8 16 to 23



C-9


S8 1 to 8 24 to 31


S9 1 to 8 0 to 3

S10 1 to 8 4 to 7

S11 1 to 8 8 to 11

S12 1 to 8 12 to 15

S13 1 to 8 16 to 19

S14 1 to 8 20 to 23

S15 1 to 8 24 to 27

S16 1 to 8 28 to 31

Table C-20 lists the method for setting DIP switches of the MTAC.

Table C-20 Setting DIP switches of the MTAC (100-ohm T1 cable)

Switch Bit Status

S5 to S8 1 to 8 OFF

S9 to S16 1 to 4 ON

5 to 8 OFF

C.8 DIP Switches and Jumpers of the MTSU

Table C-21 lists DIP switches of the MTSU.

Table C-21 DIP switches of the MTSU



S2 1 to 8 20 to 23

S3 1 to 8 24 to 27

S4 1 to 8 28 to 31

S5 1 to 8 0 to 3

S6 1 to 8 4 to 7

S7 1 to 8 8 to 11

S8 1 to 8 12 to 15

S9 1 to 8 16 to 19



Issue 05 (2009-01-09)


Setting the grounding modesfor the T1 links

S10 1 to 8 16 to 23

S11 1 to 8 8 to 15

S12 1 to 8 0 to 7

S13 1 to 8 24 to 31

Reporting attribute of the T1links

S14 1 to 2 0 to 31

Table C-22 lists the method for setting DIP switches of the MTSU.

Table C-22 Setting DIP switches of the MTSU (100-ohm T1 cable)

Switch Bit Status

S2 to S9 1 to 4 ON

5 to 8 OFF


S14 1 ON

2 OFF



C-11

D Boards of All SSM Frames

Table D-1 Equipment and resource management units



LogicalBoard

PhysicalBoard

OperationMaintenanceUnit (OMU)

Media gatewayOperationMaintenanceUnit (MOMU)

Master/slave It is inserted in frontslot 7 or 8 of theSSM-256 maincontrol frame.A correspondingNET back board isrequired.

The OMUmanages all theframes of theUMG8900when multipleframes areconfigured.The MOMB canconvert thebroadbandservice data.The boardprovides theexternalinterfacesincluding theConsoleinterface.

Media gatewayOperationMaintenanceUnit B(MOMB)

Master/slave It is inserted in frontslots 6, 7, 8 and 9 ofthe SSM-32 maincontrol frame.Each board occupiestwo slots.A correspondingTNC back board isrequired.

Mainprocessingunit (MPU)

Media gatewayMainProcessing Unit(MMPU)

Master/slave It is inserted in frontslot 7 or 8 of theSSM-256 frameexcept the maincontrol frame.A correspondingNET back board isrequired.

The MPUmanages theboards in theframe where theMPU is located.The MMPB canconvert thebroadbandservice data.

HUAWEI UMG8900Hardware Description D Boards of All SSM Frames


D-1



LogicalBoard

PhysicalBoard

Media gatewayMainProcessing UnitB (MMPB)

Master/slave It is inserted in frontslots 6, 7, 8 and 9 of aSSM-32 serviceframe.Each board occupiestwo slots.A correspondingTNC back board isrequired.



Master/slave It is inserted in acommon front slot ofthe SSM-256 frameor the SSM-32 frame.No correspondingback board isrequired.



Master/slave It is inserted in acommon back slot ofthe SSM-256 frameor SSM-32 frame.No correspondingfront board isrequired.


Sub-card ofConnection &ManagementUnit (SCMU)

Load sharingor master/slave

It is inserted in thesubboard slot of theUG02MOMB or theUG02MMPB of theSSM-32 frame.


ProtocolProcessingUnit (PPU)

Media gatewayBack ProtocolProcessing Unit(MPPB)

Load sharing It is inserted in acommon back slot ofthe SSM-256 frame.No correspondingfront board isrequired.

The PPUprocesses the H.248/SCTP/UDP/TCP/IPprotocols.The externalinterfacesinclude the FEinterface.

D Boards of All SSM FramesHUAWEI UMG8900Hardware Description

D-2 Huawei Proprietary and ConfidentialCopyright © Huawei Technologies Co., Ltd.

Issue 05 (2009-01-09)



LogicalBoard

PhysicalBoard




Load sharing It is inserted in acommon back slot ofthe SSM-256 frameor the SSM-32 frame.No correspondingfront board isrequired.

Table D-2 Service and protocol processing units



LogicalBoard

Physical Board


Media gatewayHigh-speedRouting Unit(MHRU)


The MHRUtransfers theRTP/RTCP andIP bearerservices.


Media gatewayRTP ProcessingUnit (MRPU)


The MRPUprocesses theIP routes,converges anddistributes IPservices.



D-3



LogicalBoard

Physical Board


Media gatewayHigh-speedRouting Unit D(MHRD)

Master/slave It is inserted in acommon back slot ofthe SSM-256 frameor the SSM-32 frame.A correspondingD8FT/D1GOsubboard is required.

The MHRDprocessed theIP routes, and itconverges, anddistributes theIP services.The MHRDprovides theservice accessfunction.


Media gateway IPover E1 Unit(MIOE)

Master/slave It is inserted in acommon front slot ofthe SSM-256 frameor the SSM-32 frame.

The MIOEimplement IPover E1.When the boardis used in theSSM-256frame, theframe must beconfiguredwith theMTNB.

ATM AAL2/AAL5 SARProcessingUnit (ASU)

Media gatewayATM AAL2/AAL5 SARProcessing Unit(MASU)

Master/slave In the SSM-256frame or the SSM-32frame, it is inserted ina common front slotof the main controlframe and the serviceframe.A correspondingA4L/EAC/TAC backboard is required.

The ASUprocesses ATMservices.

FrontSignallingProcessingunit (SPF)

Media gatewayFront SignallingProcessing unit(MSPF)


The SPFperformssignalingadaptation andtransfers thesignaling.



Issue 05 (2009-01-09)

Table D-3 Switching and cascading units



LogicalBoard

Physical Board

Packetswitch Unit(NET)

Media gatewayPacket switchUnit (MNET)

Master/slave It is inserted in backslot 7 or 8 of theSSM-256 frame.A correspondingMPU or OMU frontboard is required.

The NETimplementsswitching ofpacket servicesand datacascadingbetween frames.The externalinterfacesincludes the2xGE, 4xFE,Clock, MIR,OMCinterfaces.

Front LinkUnit (FLU)

Media gatewayFront Link Unit(MFLU)

Nullbackup It is inserted in a frontslot of the SSM-256central switchingframe except slots 6,7, 8 and 9.A correspondingBLU back board isrequired.

The FLU andBLU provide 32K or 24 Ksubscribercascadingcapacity,interfacing andswitchingfunctions ontime divisionmultiplexing(TDM)narrowbanddata plane, and 2x 1.25 Gbit/scascadingcapacity andinterfacingfunction on thebroadband dataplane.Providing FEcontrol datachannels todirectly connectframesThe BLUprovides thecascadinginterface.

Back LinkUnit (BLU)

Media gatewayBack Link Unit(MBLU)

Master/slave It is inserted in a backslot of the SSM-256central switchingframe except slots 6,7, 8 and 9.A correspondingFLU front board isrequired.



D-5



LogicalBoard

Physical Board

Net LinkUnit (NLU)

Media gatewayNet Link Unit(MNLU)

Load sharing It is in back slots 4, 5,10 and 11 of theSSM-32 frame.

The NLUprovides 2 x1.25G/1 x1.25Gcascadingcapacity andinterfacingfunction on thebroadband dataplane.

TDM centralswitchingNet Unit(TNU)

Media gatewayTDM switchingNet Unit(MTNU)


The TNUimplementsTDM serviceswitching.The MTNUprovides 24 Kcascadingcapacity.The TCLUprovides 24 Kcascadingcapacity.The MTNBprovides 32 Kcascadingcapacity.The MTNCprovidesmaximum 4 x8K cascadingcapacity.The MTNCprovides the FEswitchingfunction for thecontrol plane.The MTNCprovides multi-frame cascadingchannels for theFE plane and theTDM plane.The MTNCmanages theboards in the

TDMConvergence &Link Unit(TCLU)

Master/slave It is inserted in backslot 6 or 9 of theSSM-256 maincontrol frame or theservice frame.No correspondingfront board isrequired.

Media gatewayTDM switchingNet Unit B(MTNB)




Issue 05 (2009-01-09)



LogicalBoard

Physical Board

Media gatewayTDM switchingNet Unit C(MTNC)

Master/slave It is in back slots 6, 7,8 and 9 of the SSM-32frame.Each board occupiestwo slots.A correspondingMOMB/MMPB frontboard is required.

frame where theMTNC islocated.The MTNCprovides level 3clock signal forthe systemthrough theclock subboard.

Table D-4 Interface units



LogicalBoard

Physical Board

1-port GEOpticalinterface card(E1G)

Media gatewayone-port GEOptical interfacecard (MG1O)


The E1Gprovides oneGE interface.




The UG01MS2L andUG01MS2E can beonly inserted in acommon back slot ofthe SSM-256 frame.The UG02MS2L andUG02MS2E can be

The MS2Lprovides two155 Mbit/sSDH opticalinterfaces.The MS2Eprovides two



D-7



LogicalBoard

Physical Board


inserted in a commonback slot of theSSM-256 frame orthe SSM-32 frame.No correspondingfront board isrequired.

155 Mbit/sSDH electricalinterfaces.





It is inserted in acommon back slot ofthe SSM-32 frame.No correspondingfront board isrequired.

The MS1Lprovides one155 Mbit/sSDH opticalinterface.The MS1Eprovides one155 Mbit/sSDH electricalinterface.



4 PortsSTM-1 ATMOpticalInterfaceBoard (A4L)

Media gateway 4Ports STM-1 ATMOptical InterfaceBoard (MA4L)


The A4Lprovides four155 M ATMopticalinterfaces.

8-port10/100MEthernetinterfaceboard (E8T)

Media gateway 8-port 10/100MEthernet InterfaceBoard (ME8T)


The E8Tprovides eightFE interfaces.

32*E1 portTDMinterfaceboard (E32)

Media gateway32*E1 ports TDMinterface board(ME32)

Loadsharing


The ME32provides 32 E1interfaces toextract linesignaling fromCAS such asR2 and CNo.1or insert line



Issue 05 (2009-01-09)



LogicalBoard

Physical Board

Media gateway32*E1 interfacecard with Signalingfunction Unit(MESU)

Loadsharing

signaling intothem.The MESUprovides 32 E1interfaces toreceive andsend NO.5 linesignaling andregistersignaling.


Media gateway32*T1 ports TDMinterface board(MT32)

Loadsharing


The MT32provides 32 T1interfaces toextract linesignaling fromCAS such asR2 and CNo.1or insert linesignaling intothem.


Media gateway32*T1 interfacecard with Signalingfunction Unit(MTSU)

Loadsharing


The MTSUprovides 32 T1interfaces toreceive andsend NO.5 linesignaling andregistersignaling.

PDHInterfaceElectronicalUnit (PIE)

Media gatewayPDH InterfaceElectronical Unit(MPIE)



The PIEprovides threeE3/T3 PDHelectricalinterfaces.



D-9



LogicalBoard

Physical Board

32-port E1ATMInterfaceCard (EAC)

Media gateway 32-port E1/T1 ATMInterface Card(MEAC)


The EACprovides 32IMA E1interfaces.

32-port T1ATMInterfaceCard (TAC)

Media gateway 32-port T1 ATMInterface Card(MTAC)

Nullbackup In the SSM-256frame or the SSM-32frame, it is inserted ina common back slotof the main controlframe or the serviceframe.A correspondingASU front board isrequired.

The TACprovides 32IMA T1interfaces.

Table D-5 Media resource processing units



LogicalBoard

Physical Board

VoiceProcessingUnit (VPU)

Media gatewayVoice ProcessingUnit B (MVPB)

Loadsharing


The VPU workswith the voicesubboards.The VPUprovides thetranscoding andEC functionsfor voiceservice streams.The VPUprovidesannouncementplayingresources toimplement thedigit-collectingandannouncement-playingservices.

Media gatewayVoice ProcessingUnit D (MVPD)

Loadsharing




Issue 05 (2009-01-09)



LogicalBoard

Physical Board

Media gatewayTransCode Unit B(MTCB)

Loadsharing


When theMVPD is usedin the SSM-256frame, theframe must beconfigured withthe MTNB.

Media gatewayTransCode Unit D(MTCD)

Loadsharing


EchoCancellationUnit (ECU)

Media gatewayEcho CancellationUnit (MECU)

Loadsharing

The UG01MECU canbe inserted in acommon front slot ofthe SSM-256 frame.The UG02MECU canbe inserted in acommon front slot ofthe SSM-256 frame orthe SSM-32 frame.No correspondingfront board isrequired.

The ECU workswith the voicesubboards.The ECUimplements theEC function forvoice signals.

Table D-6 Clock units



LogicalBoard

Physical Board

Clock Unit(CLK)

Media gatewayClock Unit (MCLK)

Master/slave

It is inserted in backslot 0 or 1 of theSSM-256 frame or theSSM-32 frame.No correspondingfront board isrequired.

The CLKprovides clocksignals forservices.The externalinterfacesincludes theclock input/outputinterfaces.



D-11

Table D-7 Lightning protection units



LogicalBoard

Physical Board

LightingProtectedBoard (LPB)

Media gateway E1Lightning ProtectedBoard (MLPB)

Nullbackup

It is inserted in acommon back slot ofthe SSM-256 frame orthe SSM-32 frame.No correspondingfront board isrequired.

The LPBprovides thelightningprotection forthe outdoor E1trunk cable.



Issue 05 (2009-01-09)

E Subboards of all SSM Frames

E.1 MECU Subboards

E.2 MHRU Subboards

E.3 MHRD Subboards

E.4 MASU Subboard

E.5 MPIE Subboards

E.6 Subboards of the MSPF

E.7 MTCB Subboards

E.8 MTCD Subboards

E.9 MTNC Subboards

E.10 MVPB Subboards

E.11 MVPD Subboards

HUAWEI UMG8900Hardware Description E Subboards of all SSM Frames


E-1

E.1 MECU Subboards

MECC/MECF/MECG/MECJ/MECK Subboards

The MECC/MECF/MECG/MECJ/MECK subboards work as the EC subboards and provide thefollowing functions:

l The MECC/MECF/MECG subboards provide the acoustic echo cancellation (AEC) andelectric EC functions.


l The MECC/MECF/MECG/MECJ/MECK subboards support various tail delays.

Table E-1 lists the technical specifications of the MECC/MECF/MECG/MECJ/MECKsubboards.

Table E-1 Technical specifications of the MECC/MECF/MECG/MECJ/MECK subboards

Subboard Tail Delay Number of ECChannels

PowerConsumption

HeatDissipation

MECC 16 ms/32 ms 1024 3.8 W 3.8 W

48 ms/64 ms 1024

80 ms/96 ms/110 ms/128ms

512

MECF 64 ms 1024 2 W 2 W

MECG 128 ms 1024 5.3 W 5.3 W

MECJ 64 ms 1024 5.4 W 5.4 W

MECK 64 ms 2048 12.2 W 12.2 W

E.2 MHRU Subboards

The subboard of the host process module broad (HPMB) is the main processor module subboard.The MHRU subboard processes the upper-layer protocol, initiates the backplane and implementsthe configuration and management through the HPMB subboard.

The MHRU falls into two types: the UG01HPMB and UG02HPMB. They are similar in function.The UG01HPMB is used with UG01MHRU, whereas the UG02HPMB is used withUG02MHRU.

The technical specifications of the HPMB correspond to the MHRU, see 7.1.5 TechnicalSpecifications of the MHRU.

E Subboards of all SSM FramesHUAWEI UMG8900Hardware Description

E-2 Huawei Proprietary and ConfidentialCopyright © Huawei Technologies Co., Ltd.

Issue 05 (2009-01-09)

E.3 MHRD Subboards

D1GO Subboards

The D1GO subboard provides one optical gigabit Ethernet (GE) interface or one electrical GEinterface for the MHRD.

The D1GO subboard is equipped with the pluggable interface module and provides one GEinterface or electrical interface in conformity with the IEEE8002.3z standard.

If the D1GO subboards are inserted in two MHRDs working in master/slave mode, by default,the D1GO subboards work in load-sharing mode. That is, one MHRD can manage two D1GOsubboards at the same time. The interface of the D1GO subboard supports the non-APS 1+1backup mode.

Table E-2 lists the meaning of the indicators on the D1GO.

Table E-2 Indicator meaning of the D1GO



Working indicator ACT Yellow Flashing Data receiving andtransmitting on theoptical interface

Optical fiberconnection stateindicator


Always off Connection notestablished

Table E-3 lists the technical specifications of the D1GO.

Table E-3 Technical specifications of the D1GO


Opticalmodule


Mode Multi-mode


0.5 km

Wavelength 850 nm

Output opticalpower



–17.0 dBm



E-3



0 dBm

Specification IEEE802.3 and IEEE802.3z

Electricalmodule

Physical type RJ45 electrical interface –


100 m [0.06 mi.]

Powerconsumption

N/A 8.5 W –

Heatdissipation

N/A 8.5 W

D8FT Subboards

The D8FT subboard provides eight fast Ethernet (FE) interfaces for the MHRD.

If the D8FT subboards are inserted in the MHRDs working in master/slave mode, by default,the D8FT subboards work in load-sharing mode. That is, one MHRD can manage two D8FTsubboards at the same time. The interface of the D8FT subboard supports non-APS 1+1 backupmode.

Table E-4 lists the meaning of the indicators on the D8FT.

Table E-4 Indicator meaning of the D8FT




- Green Always on The interface works atthe rate of 100 Mbit/s.

Always off The interface works atthe rate of 10 Mbit/s.


- Yellow Always on The link is through.


Flashing Some data is beingreceived or transmittedthrough the link.

Table E-5 lists the technical specifications of the D8FT.

Table E-5 Technical specifications of the D8FT


Interface Physical type RJ45 –



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Quantity 8

Specification IEEE802.3 and IEEE802.3u

Powerconsumption

N/A 8.5 W –

Heatdissipation

N/A 8.5 W

E.4 MASU Subboard

The subboard of the host process module broad (HPMB) is the main processor module subboard.The MASU subboard processes the upper-layer protocol, initiates the backplane and implementsthe configuration and management through the HPMB subboard.

The MHRU falls into two types: the UG01HPMB and UG02HPMB. They are similar in function.The UG01HPMB is used with UG01MASU, whereas the UG02HPMB is used withUG02MASU.

The technical specifications of the HPMB correspond to the MASU, see 7.4.5 TechnicalSpecifications of the MASU.

E.5 MPIE Subboards

Up to three ME3A subboards can be configured on the MPIE.

The ME3A subboard is mainly used to multiplex and demultiplex an E3/T3 interface.

Table E-6 lists the technical specifications of the ME3A subboard.

Table E-6 Technical specifications of the ME3A subboard




E.6 Subboards of the MSPF

The SHPU subboard is the signaling high-level processing subboard. The MSPF processes layer2 signaling protocol through the SHPU subboard. Based on the configured work modes, thesubboards can support different layer 2 protocols. Up to two subboards can be configured oneach MSPF.

Table E-7 lists the technical specifications of the SHPU subboard.



E-5

Table E-7 Technical specifications of the SHPU subboard


Powerconsumption

N/A 8.5 W –




Up to twenty-three 64kbit/s MTP2 links

PRO_64K_PRA orPRO_BT_64K_PRAmode

Up to one 2 Mbit/s MTP2link

PRO_2M orPRO_BT_2M mode

Number of the Q.921 links

Up to 64 links PRO_PRA mode

Number of theLAPRSA links


Up to 32 links

E.7 MTCB Subboards

For details on the description of the MTCB subboard, see E.10 MVPB Subboards.

E.8 MTCD Subboards

For details on the description of the MTCD subboard, see E.11 MVPD Subboards.

E.9 MTNC Subboards

UG01MTNC SubboardsThe TLDA subboard provides one TDM cascading channel for the UG01MTNC2. The TLDBsubboard provides two TDM cascading channels for the UG01MTNC5. The cascading capacityfor each channel is 8 K timeslots. The interfaces are connected with the corresponding framesthrough optical fibers.

Table E-8 lists the indicator meaning of the TLDA/TLDB subboards.



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Table E-8 Indicator meaning of the TLDA/TLDB



Workingindicator

ACT Orange Always onor flashing

The optical interface is in themaster state.

Always off The optical interface is in theslave state.



Always off Connection not established

Table E-9 lists the technical specifications of the TLDA/TLDB subboards.

Table E-9 Technical specifications of the TLDA/TLDB subboards


Opticalmodule


Wavelength 850 nm –

Output opticalpower

–9.5 dBm to –4.0 dBm –


–17.0 dBm –


550 m [0.3 mi.] 50 um optical fiber

275 m [0.2 mi.] 62.5 um optical fiber

Powerconsumption

N/A 6.4 W –

Heatdissipation

N/A 6.4 W

UG02MTNC Subboards

The UG02MTNC provides a maximum of 4 x 8 K time division multiplex (TDM) cascadingcapability. The TS1C subboard provides 1 x 8 K TDM cascading capability. The TS2C subboardprovides 2 x 8 K TDM cascading capability. The TS4C subboard provides 4 x 8 K TDMcascading capability.

The meaning of the indicators of the TS1C/TS2C/TS4C subboards is the same as that of theTLDA/TLDB subboards. Refer to Table E-8.

The technical specifications of the optical interfaces of the TS1C/TS2C/TS4C subboards are thesame as those of the TLDA/TLDB subboards. Refer to Table E-9.

Table E-10 lists the power consumption of the TS1C/TS2C/TS4C subboards.



E-7

Table E-10 Power consumption of the TS1C/TS2C/TS4C subboards

Subboard Power Consumption Heat Dissipation

TS1C 22.9 W 22.9 W

TS2C 24.3 W 24.3 W

TS4C 27 W 27 W

E.10 MVPB Subboards

MVDB Subboards

The MVDB subboard works as the TC subboard and provides the following functions:

l Providing the voice codec conversion function and supporting the voice codec modesincluding AMR, AMR-WB, QCELP, EVRC, SMV, G.711, G.726, G.723, and G.729

l Providing 512 AMR channels



l Working with the MVPB to play simple announcements

Table E-11 lists the technical specifications of the MVDB subboard.

Table E-11 Technical specifications of the MVDB subboard


Remarks

Powerconsumption

N/A 10 W –





512 G.723/G.726/G.729/AMR voicecodec modes


1024 Use the MVDB subboard in subboardslot 0/1.

2048 Use the MVDB subboard in subboardslot 2.

MECC/MECE/MECF/MECG/MECH/MECI/MECJ/MECK Subboards

The MECC/MECE/MECF/MECG/MECH/MECI/MECJ/MECK subboards work as the echocancellation (EC) subboard and provide the following functions:



Issue 05 (2009-01-09)

l The MECC/MECE/MECF/MECG/MECH/MECI subboards provide the acoustic echocancellation (AEC) and electric EC (EEC) functions.



Table E-12 lists the technical specifications of the MECC/MECE/MECF/MECG/MECH/MECI/MECJ/MECK subboards.

Table E-12 Technical specifications of the MECC/MECE/MECF/MECG/MECH/MECI/MECJ/MECK subboards

Subboard Tail Delay Number ofthe ECChannels

PowerConsumption

HeatDissipation

MECC 16 ms/32 ms 1024 3.8 W 3.8 W

48 ms/64 ms 1024

80 ms/96 ms/110 ms/128ms

512

MECE 16 ms/32 ms 2048 9 W 9 W

48 ms/64 ms 2048

80 ms/96 ms/110 ms/128ms

1024

MECF 64 ms 1024 2 W 2 W

MECG 128 ms 1024 5.3 W 5.3 W

MECH 64 ms 2048 6.4 W 6.4 W

MECI 128 ms 2048 2.3 W 2.3 W

MECJ 64 ms 1024 5.4 W 5.4 W

MECK 64 ms 2048 12.2 W 12.2 W

UG01MECL Subboards

The UG01MECL subboard can be inserted only in the UG02MVPB.









E-9



Table E-13 lists the technical specifications of the UG01MECL subboard.

Table E-13 Technical specifications of the UG01MECL subboard







UG01MVDD SubboardsThe UG01MVDD subboard, only for the UG02MVPB, works as the integrated subboard of theEC and TC, and provides the following functions:





l Working with the UG02MVPB to play simple announcements


Table E-14 Technical specifications of the MVDD subboard


Powerconsumption


Heat dissipation N/A 12 W –





Board PositionsFigure E-1 shows the position of the MVPB subboard.



Issue 05 (2009-01-09)

Figure E-1 Position of the MVPB subboard

TC subboard 0

TC subboard 1


MBUSsubboard

The position of the EC subboard is the same as that of TC subboard 2, but the EC subboard andTC subboard 2 do not share the subboard connector. In addition, the EC subboard and TCsubboard cannot be configured in this position at same time.

E.11 MVPD Subboards

MVQE Subboards

The MVQE subboard functions as the transcoder (TC) subboard and provides the followingfunctions:

l Providing the acoustic echo cancellation (AEC) electric EC functions.


Table E-15 lists the technical specifications of the MVQE subboard.

Table E-15 Technical specifications of the MVQE subboard

Subboard Tail Delay Number of theEC Channels

PowerConsumption

HeatDissipation

MVQE 64 ms 1024 10 W 10 W

UG01MVDD Subboards

The UG01MVDD subboard, only for the UG02MVPD, works as the integrated subboard of theEC and TC, and provides the following functions:



E-11





l Working with the UG02MVPD to play simple announcements


Table E-16 Technical specifications of the MVDD subboard


Powerconsumption


Heat dissipation N/A 12 W -





UG01MVDF Subboards

The UG01MVDF subboard can be inserted only in the UG02MVPD_VC.

The UG01MVDF subboard serves as the TC subboard and provides the following functions:

l Supporting the codec of 768 channels, G.729a/b codec, and AMR codec

l Supporting the G.711 voice codec service of 1500 channels

l Supporting the multiparty service of 2000 channels

l Detecting the clock status of the subboards by adding the subboard logic

Table E-17 lists the technical specifications of the UG01MVDF subboard.

Table E-17 Technical specifications of the UG01MVDF subboard







768 G.723/G.726/G.729/AMRvoice codec mode


1024 Use the MVDF subboard insubboard slot 0/1.



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2048 Use the MVDF subboard insubboard slot 2.

UG01MECL SubboardsThe UG01MECL subboard can be inserted only in the UG02MVPD_VC.









Table E-18 lists the technical specifications of the UG01MECL subboard.

Table E-18 Technical specifications of the UG01MECL subboard







Board PositionsFigure E-2 shows the position of the MVPD subboard.



E-13

Figure E-2 Position of the MVPD subboard

TC subboard 0

TC subboard 1


MBUSsubboard

The position of the EC subboard is the same as that of TC subboard 2, but the EC subboard andTC subboard 2 do not share the subboard connector. In addition, the EC subboard and TCsubboard cannot be configured in the same position at the same time.

The subboards used by the MVPD are the same as those of the MVPB. See E.10 MVPBSubboards.



Issue 05 (2009-01-09)

hardware description v200r007_umts

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