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PREPARATION, PROPERTIES AND APPLICATIONS OF HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson University

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Page 1: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

PREPARATION, PROPERTIESAND

APPLICATIONS

OF

HIGHLY DISPERSED METALLIC

PARTICLES

Dan GoiaClarkson University

Page 2: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

PREPARATION OF METALLIC PARTICLES

• Phase ‘break down’ - Milling/grinding- Atomization

• Phase ‘transformation’ - Thermolysis/Pyrolysis- Reduction

• Phase ‘build-up’ - Condensation in gas phase (Me0)g- Condensation in liquid phase (Me0)l

Page 3: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

PHASE ‘BREAK DOWN’ / MILLING

Size reduction of coarse/agglomerated metallic powders

- Mechanical energy (shear, collision)- Dispersion media (liquid or gas)- Dispersing agents- Controlled atmosphere and temperature frequently required

• Suitable for some applications (mechanical alloying)• Rarely yields highly monodispersed, spherical particles

Page 4: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

PHASE ‘BREAK DOWN’ / ATOMIZATION

Spraying/pulverization of molten metals

• Large particles, broad size distributions

- Monodispersed particles- Sub-micrometer size

• Capable to produce a large variety of alloy powders

• Low manufacturing costs

• Inert carrier gases may be required

Page 5: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

PHASE TRANSFORMATION

AEROSOLTHERMOLYSYS

MeX2

T

MeX2

+2 e-

- 2X

Metallicparticle

AEROSOLREDUCTION

- Difficult to control the size distribution of precursor droplets- Agglomeration of droplets/particles due to collisions

Wide particle size distribution

Page 6: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

PHASE TRANSFORMATION

T, ne-

+n e-

- n X

Metallic particlesMetallic compounds

Page 7: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

SPRAY PYROLYSIS/AEROSOL THERMOLYSIS

Pd(NO3)2 droplet Pd(NO3)2 crystal Polycrystalline Highly crystallinePd particle Pd particle

Size, uniformity, and degree of agglomeration of Me particles depends on:

a) Size and size distribution of droplets- Droplet generation → pneumatic/spraying

→ ultrasonic- Size control → pressure

→ transducers’ frequency, size ~ ν- Size distribution → various approaches (momentum, gravitation force)

b) Stability of the aerosols (droplets, intermediates, and final particles)- Laminar flow during the process- Working below the critical concentration)

Decomposition of liquid precursors in gas phase

>1200C >8500C >1,0000C

Page 8: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

PHASE ‘BUILD UP’ / CONDENSATION

(Me0)g(Me0)l

(Me0)s

T

Plasma

(MeX)g

CVD (Men+)l

+ ne-

Condensation fromgas phase

T

Nucleationand

Growth

Condensation from liquids(Chemical Precipitation)

(Me0n)gas (Me0

n)liquid

- X

Page 9: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

CHEMICAL PRECIPITATION

Metal atoms generated ‘via’ redox reactions:

Me n+ + Red → Me 0 + Ox

Driving force:∆ E0 = E0

1 - E02

ln Ke = nF⋅ ∆ E0 /RT

∆ E0 → critical supersaturation→ nucleation rate

Page 10: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

0.0

1.0

2.0

-1.0

-2.0

H+ + e- → ½ H2

Au3+ + 3 e- → Au0

Pt2+ + 2 e- → Pt0

Pd2+ + 2 e- → Pd0

Ag+ + e- → Ag0

Cu+ + 2 e- → Cu0

Co2+ + 2 e- → Co0

Fe2+ + 2 e- → Fe0

Zn2+ + 2 e- → Zn0

V2+ + 2 e- → V0

Ti2+ + 2 e- → Ti0

Al3+ + 3 e- → Al0

N2H4 + 4OH- → N2 + 4 e- + H2O

R-CH2OH → R-COH + 2e- + 2H+

C6H8O6 → C6H8O6 + 2 e- + 2H+

MnO4- + 4H- + 3 e- → MnO2 + 2H2O

Page 11: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

TAILORING ∆E0

Ag+ + 1e- → Ag0 E0 = +0.799V

• Precipitation Ag+ + Cl- → AgCl Ksp = 1.82 x 10-10

AgCl + 1e- → Ag0 + Cl-

E0AgCl = E0

Ag+ - 0.059/1 log[Cl-]/Ksp = 0.799 - 0.059(log[Cl-] – logKsp) = 0.222V

AgI Ksp = 3.0 x 10-17 E0 = -0.152VAg2S Ksp = 6.3 x 10-50 E0 = -0.710V

• Complexation Ag+ + 2NH3 → Ag[NH3]2+ pKf = 10-7.4

Ag[NH3]2+ + 1e- → Ag0 + 2NH3

E0Ag[NH3]2 = E0

Ag+ - 0.059/1 log[Ag+][NH3]2/[Ag(NH3)2]+ = 0.799 - 0.059(pKf) = 0.373V

Ag(SO3)23- + 1e- → Ag+ + 2SO3

2- pKf = 8.68 E0 = 0.430VAg(S2O3)2

3- + 1e- → Ag+ + 2S2O32- pKf = 13.46 E0 = 0.010V

Ag(CN)2- + 1e- → Ag+ + 2CN- pKf = 19.85 E0 = -0.290V

• ConcentrationE = E0 - 0.059 log [Ag0]/[Ag+] = 0.799 + 0.059 log[Ag+]

[Ag+] = 103M E0 = 0.777V

Page 12: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

TAILORING ∆E0

• Effect of the pH

→ Whenever H+ or OH- species are involved in the reaction

Examples

a) C6H6O6 + 2e- + 2H+ → C6H8O6 E0 = -0.244V

E0 = E0 - 0.059/2 log[C6H8O6]/[H+]2[C6H6O6] = -0.244 - 0.059 (pH)

[H+] ↑ , pH ↓ ⇒ C6H8O6 less strong reductant

b) N2 + 4e- + 4H2O → N2H4 + 4OH- E0 = -1.160V

E0 = E0 - 0.059/4 log1/[OH-]4 = -1.160 + 0.059 (14 - pH)

[H+] ↑ , pH ↓ ⇒ Hydrazine becomes a less strong reductant

Page 13: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

REDOX DIAGRAMS

E (V)

pH

+

-

0

C6H6O6 + 2e- + 2H+ → C6H8O6

N2 + 4e- + 4H2O → N2H4 + 4OH-

Ag+ + e-→ Ag0

Ag[NH3]2+ + 1e- → Ag0 + 2NH3

Pd2+ + 2e-→ Pd0

Pd[NH3]42+ + 2e- → Pd0 + 42NH3

Page 14: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

METAL IONS/COMPLEXES

METAL ATOMS (~3Å)

CLUSTERS

NUCLEI (~8-10Å)

NANOSIZEPRIMARY PARTICLES (1-30 nm)

Diffusional growth

Reduction

LARGE PARTICLES(Crystalline / Polycrystalline)

AGGREGATEDNANOSIZE SYSTEMS

Diffusional growth/Coagulation

CONDENSATION FROM LIQUID PHASE

AggregationEffective Stabilization

TRUENANOSYSTEMS

Page 15: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

EXPERIMENTAL

Red

MeXmn +

Men+/MeXmn Red Men+/MeXm

n

Men+

‘DIRECT’ ADDITION ‘REVERSED’ ADDITION ‘DOUBLE-JET’ ADDITION

Men+

Men+Red

RedC C

Time Time

Red

Tn Tf Tn Tf

Men+

Red

C

TimeTn Tf

Disp.Disp. Disp.

Page 16: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

CRITICAL PROPERTIES

• Particle size and size distribution

• Internal structure

• Particle morphology

• Internal composition

• Surface properties

Page 17: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

PREPARATION OF NANOSIZE METALLIC PARTICLES

a) Generate a large number of nuclei

b) Involve a large fraction (f) of atoms in the nucleation step

Final size in the nanosize range Rp = rn × (100/f )1/3

→ Provide high supersaturation (large ∆ E)→ Use suitable dispersion media→ Work in dilute systems→ Use surfactants

c) Prevent the aggregation of primary particles

→ Maximize electrostatic repulsive forces (dilute systems)→ Minimize/screen attractive forces (dispersing agents)

Page 18: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

Platinum Particles (~ 2.0 nm)

Page 19: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

Nanosize Silver Particles (~90 nm)

Page 20: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

PREPARATION OF LARGE PARTICLES

A. CRYSTALLINE → diffusion growth

- Slow nucleation (small ∆E, strong metallic complexes)- Slow addition of precursors in the system- Use of seeds- Very effective stabilization

B. POLYCRYSTALLINE PARTICLES → aggregation

- Control the attractive/repulsive forces by adjusting:

- Ionic strength- pH- Activity of the dispersant/protective colloid

- More versatile in controlling the size of the particles

Page 21: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

CRYSTALLINE GOLD POWDER

Page 22: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when
Page 23: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

0.15 µm 0.30 µm

0.5 µm 1.0 µm

AgPd Spherical Alloy Particles

Page 24: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

INTERNAL PARTICLE STRUCTURE

NanosizePrimary Particles

Diffusional Growth

Coagulation/Aggregation

Crystalline Particles

Polycrystalline Particles

Effective colloid stabilizationSmall ∆ E, supersaturation

Poor colloid stabilizationLarge ∆ E, supersaturation

Page 25: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

METAL PARTICLES FORMATION

2 µm 2 µm

CrystallineMonodispersed Gold

PolycrystallineMonodispersed Gold

INTERNAL PARTICLE STRUCTURE

Page 26: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

IMPORTANCE OF PARTICLE STRUCTURE

A. Electronics/Thick filmDue to the absence of internal grain boundaries, highly crystalline particlesof PM yield dense, continuous, thinner, and more conductive ‘fired’ films.

B. Electronics/Oxidation of base metalsHighly crystalline base metals (Cu, Ni) are more resistant against oxidation when used as precursors for thick film conductors.

C. Medicine/BiologyHighly crystalline, dense gold particles are more effective as carriers of drugs/vaccines through biological tissues.

Page 27: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

PARTICLE MORPHOLOGY

Hexagonal Gold platelets

Page 28: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

Crystalline Pd Particles

PARTICLE MORPHOLOGY

Page 29: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

INTERNAL COMPOSITION

Bimetallic particles → electronics (wide range of properties attainable)→ catalysis (enhanced catalytic activity)

•Core/Shell structure

E01 ≠ E0

2 → the most electropositive element will form the core→ the most electronegative element will form the shell

⇒ Precipitation order can be tailored by appropriate complex formation

• ‘Solid solutions’/Alloys

E01 ≅ E0

2 → similar reduction rates∆E0

1 , ∆E02 >> → fast reactions

⇒ Uniformly mixed crystalline lattices

Page 30: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

SURFACE PROPERTIES

IMPACT• Dispersibility in liquids• Self assembly properties• Sintering characteristics• Catalytic activity• Adhesion properties• Corrosion

TAILORING SURFACE BEHAVIOR

• Selection of precipitation environment (reductant, dispersant, solvent)

• Subsequent surface treatment (performed on either wet or dry powders)

- Coating with organic compounds- Coating with inorganic compounds- Coating with metals

Page 31: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

ELECTROLESS PLATING

Red

Ag+

Ox

e-

Ag+

Ag+

Ag+

Ag+Ag+

Agn0

e-

e-

e-

Ag+

Ag+Ag+

Red

Ox

Nucleation Growth

Red

Ox

Red

Ox

Agn0

Agn0

Homogeneous Heterogeneous

Substrate

Metalcluster

e-

e-

e-

e-e-

Red: C6H8O6, N2H4

Page 32: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

ELECTRODISPLACEMENT

Ag+Ag+

Copper

Cu2+

Ag+Ag+

Cu2+

Ag0

Ag0Ag0 Ag0Ag0Ag0Ag0

Cu0

Cu0

e- e-

e-

e-

e-e-

Cu2+

Ag0Ag0Ag0

Ag0

Ag+

e-e-

Ag+

Page 33: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

APPLICATIONS OF MONODISPERSED METALLIC PARTICLES

• Electronics

• Catalysis

• Biology and medicine

• Pigments

• Obscurant smokes

• Nonlinear optics

• Transparent conductive coatings

• Ferromagnetic fluids

• High density magnetic storage

Page 34: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

THICK FILM TECHNOLOGY

Conductive layers

a) ‘Fired’/Sintered films

b) ‘Non-Fired’ films

Metallic layer

Metal-filled polymer film

‘Green’ layerMetalpaste

Metalpaste

Drying Sintering

Drying/Curing

substrate

substrate

Page 35: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

ULTRATHIN METALLIC LAYERS

1.0 µmDielectric Tape Electrode film

Page 36: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

Humanhair

(~ 60 µm)

metallic layers (~ 1 µm)dielectric layers (~ 6 µm)

SECTION THROUGH A MLCC(Up to 800 alternative layers)

Page 37: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

HIGH PERFORMANCE METAL POWDERS

• Spherical

• Monodispersed

• Size : 0.1 - 1.0 µm

• Non-agglomerated particles

• Easily dispersible

• Controlled composition (metals ratio, impurities)

• Highly crystalline

• Controlled sintering behavior

Page 38: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

Ag/Pd Ni Cu

2.0 µm 2.0 µm1.0 µm

Page 39: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

ULTRATHIN METALLIC FILMS

Monodispersed AgPd Particles

0 100 200 300 400 5000

20

40

60

80

100

120

140

IA = 1.1

ΦSEM = 130 nm

10% = 131 nm 50% = 153 nm 90% = 179 nm100% = 240 nm

Inte

nsity

Particle Diameter (nm )

Page 40: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

Monodispersed Co particles

Page 41: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

50 nm

Monodispersed Ag Particles

Applications

• Antimicrobial activity

- Antimicrobial coatings- Water purification

• SPR Biosensing

• Transparent conductive coatings

- Coating of CRT screens- Potential replacement for ATO

Page 42: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

Monodispersed Nanosize Gold Particles

Applications:

• Medicine and Biology

- Delivery of anti-tumor drugs- Vaccine delivery- Biosensing and bioassays (SPR)

• Pigments for functional glasses

50 nm

Page 43: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

NANOSIZE METALS IN CATALYSIS

Decreasing particle size → larger specific surface area→ larger fraction of surface atoms

Benefits : → Increased catalytic activity → Significant cost reduction

Difficulties : → Separation of reaction products→ Propensity for sintering

Supported metal catalysts

Page 44: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

SUPPORTED METALLIC CATALYSTS

• ‘Adhesion technique’

• ‘On-support’ precipitation

Metallic particle

Dispersant

Support

Page 45: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

Pt/Ru/C Catalyst

ForPEM Fuel Cells

Page 46: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

2 H+PEM

Anode

Cathode

Pt, PtRu/Carbon

PEM FUEL CELLS

H2 / H2O

2 e-

O2/Air

2 O2- 2 e-

H2O

Pt/Carbon

Electrodes: - 2.0 – 3.0 nm Pt and Pt/Ru particles supported on carbon- Up to 60% metal loading

Page 47: HIGHLY DISPERSED METALLIC PARTICLES Dan Goia Clarkson ... · B. Electronics/Oxidation of base metals Highly crystalline base metals (Cu, Ni) are more resistant against oxidation when

CONCLUSIONS

• Chemical precipitation is a versatile technique capable to yieldnon-agglomerated monodispersed metallic particles with:

- wide range of modal diameters (1 nm to several microns)- controlled internal structure and morphology- controlled composition- controlled surface characteristics

Materials for many existing and emerging fields of high technology

CHALLENGE:

Assembly of fine particles (nanoparticles) into ordered mono, bi, and three-dimensional complex structures structures