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Jerry Blazey May 31, 2007 LCWS07 1 http://www-sid.slac.stanford.edu/ SiD Overview & Opportunities SiD Overview & Opportunities Jerry Blazey Jerry Blazey Northern Illinois University Northern Illinois University LCWS07-Hamburg LCWS07-Hamburg June 1, 2007 June 1, 2007

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Page 1: Http:// Jerry Blazey May 31, 2007 LCWS07 1 SiD Overview & Opportunities Jerry Blazey Northern Illinois University LCWS07-Hamburg

Jerry Blazey May 31, 2007 LCWS07

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http://www-sid.slac.stanford.edu/

SiD Overview & OpportunitiesSiD Overview & Opportunities

Jerry BlazeyJerry BlazeyNorthern Illinois UniversityNorthern Illinois University

LCWS07-HamburgLCWS07-HamburgJune 1, 2007June 1, 2007

Page 2: Http:// Jerry Blazey May 31, 2007 LCWS07 1 SiD Overview & Opportunities Jerry Blazey Northern Illinois University LCWS07-Hamburg

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http://www-sid.slac.stanford.edu/

The Challenge: Discovery & The Challenge: Discovery & Precision MeasurementsPrecision Measurements

• Higgs & Recoil Higgs & Recoil Mass Mass Reconstruction (ie Reconstruction (ie ZH) ZH) – excellent excellent

momentum momentum resolutionresolution

• Higgs Decays Higgs Decays – efficient b and c efficient b and c

jet tagsjet tags– precision di-jet precision di-jet

mass (PFAs) to mass (PFAs) to separate Ws and separate Ws and ZsZs

• SUSY Searches SUSY Searches – hermiticityhermiticity

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• VTX TrackerVTX Tracker at minimum at minimum possible radius with max possible radius with max solid angle:solid angle:

rr~~rzrz= 5 = 5 10/p(sin 10/p(sin3/23/2) ) mm

• Silicon strip trackerSilicon strip tracker for for excellent momentum excellent momentum resolution and robust resolution and robust performance performance pptt/p/ptt

22 ≤≤ 5 x 10 5 x 10-5-5 GeVGeV-1-1

• Dense, highly Dense, highly segmented, segmented, Si-W Ecal and Si-W Ecal and Hcal with a goal ofHcal with a goal of

mjjmjj=3-4%=3-4%

• Instrumented flux returnInstrumented flux return for muon identificationfor muon identification

The SiD ResponseThe SiD Response

Effort required to meet these ambitious goals …

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SiD Details & SiD Details & DimensionsDimensions

Vertex detector: Vertex detector: 5 barrels, 4 disks; R5 barrels, 4 disks; Rinin= 1.4 cm= 1.4 cm

Si tracking: 5 layers; RSi tracking: 5 layers; Rinin= 18 cm= 18 cm

HCAL Fe: 34 layers; RHCAL Fe: 34 layers; Rinin= 138 cm= 138 cm

Solenoid: 5 T; RSolenoid: 5 T; Rinin= 250 cm= 250 cm

EMCAL Si/W: 30 layers REMCAL Si/W: 30 layers Rinin= 125 cm= 125 cm

Flux return/muonFlux return/muonRRinin= 333 cm= 333 cmRRoutout= 645 cm= 645 cm

SiSi

PFAPFA

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Integrated Tracking: Pixel Integrated Tracking: Pixel Vertex Detector & the TrackerVertex Detector & the Tracker

• VXD: standalone trackerVXD: standalone tracker– Space-point resolution < Space-point resolution <

44mm– Superb impact parameter Superb impact parameter

resolutionresolution• Five barrel layersFive barrel layers• Four forward layersFour forward layers• Transparency (~0.1% XTransparency (~0.1% X00 per per

layer)layer)• 14 mm from beam pipe14 mm from beam pipe

• Tracker: RTracker: Rii=0.22 m, R=0.22 m, Roo=1.23 =1.23 m, L= 3.3 mm, L= 3.3 m

• Five cylinders Five cylinders – tiled with 10x10cmtiled with 10x10cm22 single single

sided microstrip sensorssided microstrip sensors

– Material budget 0.8% XMaterial budget 0.8% X00/layer/layer

• Five (x2) endcap disksFive (x2) endcap disks– tiled with R, tiled with R, microstrip microstrip

sensorssensors

– Material budget 1.3% XMaterial budget 1.3% X00/layer/layer

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Tracking Tracking PerformancePerformance

• Full simulationFull simulation• Vertex detector seeded Vertex detector seeded

pattern recognition (3 hit pattern recognition (3 hit combinations)combinations)

• Event SampleEvent Sample– ttbar-eventsttbar-events– √√s = 500 GeVs = 500 GeV– background includedbackground included

Black: VXD basedRed: VXD + tracker

)(

1

2

GeV

pp T

T

)(GeVpT

EfficiencyEfficiency

Central Central ResolutionResolution

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EM CalorimeterEM Calorimeter• StatisticsStatistics

– 20/10 layers, 2.5/5 mm W 20/10 layers, 2.5/5 mm W – ~ 1mm Si detector gaps~ 1mm Si detector gaps– Tile with hexagonal 6” Tile with hexagonal 6”

waferswafers– 5x5 mm5x5 mm22 pads pads– ~ 1300 m~ 1300 m22 of Si of Si

• Readout with KPIX chipReadout with KPIX chip– 1024 channels, bump-bonded 1024 channels, bump-bonded – 4-deep buffer (low 4-deep buffer (low

occupancy) occupancy) – Bunch crossing time stamp Bunch crossing time stamp

for each hit for each hit

CAD overview

R 1.27 m

-> +o

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HCAL ConsiderationsHCAL Considerations

• BaselineBaseline– Gap size <~10mmGap size <~10mm– Barrel: 34 20-mm SS Barrel: 34 20-mm SS

absorbers absorbers 4 4oo

– Two endcapsTwo endcaps– Resistive Plate ChambersResistive Plate Chambers– Considering alternate Considering alternate

technologiestechnologies

Resistive paint

Resistive paint

Mylar

1.2mm gas gap

Mylar

Aluminum foil

1.1mm glass

1.1mm glass

-HV

Signal pads-2100V

∆V ~400V

∆V ~400V

0V

GEMs & MicromegasScintillator/Solid StateScintillator/Solid State

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SolenoidSolenoid

• Statistics: Statistics: – IR 2.5 m, OR 3.3 mIR 2.5 m, OR 3.3 m– Length=5.4mLength=5.4m– Stored Energy: Stored Energy:

1.2GJ1.2GJ• CMS-based feasibility CMS-based feasibility

study:study:– Same conductor Same conductor – CMS (4 layer)CMS (4 layer) SiD SiD

(6 layer)(6 layer)– CMS 5 modules 2.5 CMS 5 modules 2.5

m long m long SiD 2 SiD 2 modules 2.6 m longmodules 2.6 m long

HEP Detector Superconducting Solenoids

0

2

4

6

8

10

12

14

1 10 100 1000 10000Stored Energy [MJ]

Sto

red

En

erg

y/C

old

Ma

ss

[M

J/M

T]

Operating Forseen

CMS

TeslaSiD

GEM

SDC

Aleph

SDC Proto

H1

Delphi

D0

ISR Zeus

Venus

Topaz

AMY

Babar

Atlas

Cleo II

CDF

CMS 3.5

Uniformity good,Uniformity good,stresses acceptablestresses acceptable

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Muon Muon SystemSystem • Muon System Baseline Muon System Baseline

Configuration Configuration – Octagon: 48 layers, 5 cm Octagon: 48 layers, 5 cm

thick steel absorber platesthick steel absorber plates– Six-Eight planes of x, y or u, Six-Eight planes of x, y or u,

v upstream of Fe flux return v upstream of Fe flux return for xyz and direction of for xyz and direction of charged particles that enter charged particles that enter muon system.muon system.

• Muon ID studies Muon ID studies – 12 RPC- instrumented gaps12 RPC- instrumented gaps– ~1cm spatial resolution~1cm spatial resolution

• IssuesIssues– Technology: RPC, Technology: RPC,

Scin/SiPMs, GEMS, Wire Scin/SiPMs, GEMS, Wire chamberschambers

– Is the muon system needed Is the muon system needed as a tail catcher?as a tail catcher?

– How many layers are How many layers are needed (0-23)? Use HCAL ?needed (0-23)? Use HCAL ?

– Position resolution needed?Position resolution needed?

Muon

Coil

Hcal

trackers

Ecal

Eff. & Purity vs. Interaction Lengths

0

0.2

0.4

0.6

0.8

1

0 2 4 6 8Interaction Lengths

Eff

icie

nc

y/P

uri

ty

Eff

Purity

End of HCal

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Rewind: Technical StrengthsRewind: Technical Strengths• Generally: compact, highly integrated, hermetic detectorGenerally: compact, highly integrated, hermetic detector• Tracking: Tracking:

– VTD: small radius ( 5T helps)VTD: small radius ( 5T helps)– Tracker: excellent dp/p; minimized material all cos(Tracker: excellent dp/p; minimized material all cos())– Demonstrated pattern recognitionDemonstrated pattern recognition– Solenoid: 5T (difficult but not unprecedented)Solenoid: 5T (difficult but not unprecedented)

• Calorimetry: imaging, hermeticCalorimetry: imaging, hermetic

– ECAL: excellent segmentation=4x4 mmECAL: excellent segmentation=4x4 mm22, R, RMoliereMoliere=13mm=13mm

– HCAL: excellent segmentation: ~1x1 to 3x3 cmHCAL: excellent segmentation: ~1x1 to 3x3 cm22

• Excellent Excellent ID: Instrumented flux return & imaging HCAL ID: Instrumented flux return & imaging HCAL

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OpportunitiesOpportunities• TrackingTracking

– VTD technologyVTD technology– Forward SystemForward System

• Calorimetry Calorimetry – Choice of HCAL technology Choice of HCAL technology

requires study, PFA evaluation. requires study, PFA evaluation. Overall Optimization: Overall Optimization:

• Inner RadiusInner Radius• Depth and Length?Depth and Length?• B field?B field?

– Forward systems challengingForward systems challenging• MuonMuon

– Technology?Technology?– Layers? (Boost HCAL)Layers? (Boost HCAL)

• Simulation & algorithmic toolsSimulation & algorithmic tools– Little mentionLittle mention– BUT there has been tremendous effort and many BUT there has been tremendous effort and many

tools are in place) tools are in place) • Detector studies and MC benchmarking can be pursued!Detector studies and MC benchmarking can be pursued!• Overall integration studies neededOverall integration studies needed

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Looking Back a Bit &Looking Back a Bit &The Way ForwardThe Way Forward

• Silicon Detector Design StudySilicon Detector Design StudyInitiated Victoria ALCPG Meeting 2004Initiated Victoria ALCPG Meeting 2004

• Organization Fall-Winter ’04-’05Organization Fall-Winter ’04-’05• Progress on Technology, Simulation, Progress on Technology, Simulation,

Benchmarking, Cost ‘06Benchmarking, Cost ‘06• Tools all in place for a workshop on Tools all in place for a workshop on

optimization and choices, new ideas optimization and choices, new ideas welcome – Fall ‘07.welcome – Fall ‘07.

• Final choices – Spring ’08Final choices – Spring ’08• Letter of Intent – Summer ’08Letter of Intent – Summer ’08

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Closing CommentsClosing Comments

• A silicon-centric design offeringA silicon-centric design offering– unprecedented tracking precisionunprecedented tracking precision– new potential in calorimetrynew potential in calorimetry– good muon identificationgood muon identification

• Complementary to other conceptsComplementary to other concepts• Many opportunities for new effort and expertise. Many opportunities for new effort and expertise. • Tools and organization in place to support Tools and organization in place to support

efficient development and to get started.efficient development and to get started.• Great opportunity to explore ILC detector/physics. Great opportunity to explore ILC detector/physics. • Open to new ideas, collaborators, increased Open to new ideas, collaborators, increased

internationalization internationalization

• Rich Partridge will discuss interplay between Rich Partridge will discuss interplay between physics/detector projects and avenues for physics/detector projects and avenues for involvement on SiD.involvement on SiD.

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OrganizatioOrganizationn

SiD DESIGN STUDY COORDINATORSJ.Jaros, H.Weerts,H.Aihara & J.Karyotakis

SILICON TRACKERM.DemarteauR.Partridge

Mech: W. Cooper

EXECUTIVE COMMITTEEH.Aihara, J.Brau, M.Breidenbach, M.Demarteau,

J.Jaros, J.Karyotakis, H.Weerts & A.White

SOLENOIDFLUX RET

K.Krempetz

VERY FORWARDW.Morse

SIMULATIONN.Graf

MDIP.Burrows

T.MarkiewiczT.Tauchi

VERTEXINGSu Dong

Ron LiptonMech: W. Cooper

CALORIMETERSA.White

ECAL:R.Frey/D.StromHCAL:G.Blazey/H.Weerts

PFA:N.Graf/S.Magill

MUONH.BandH.E.Fisk

BENCHMARKINGT.Barklow

A.Juste

COSTM.Breidenbach

R& D COORDINATORA. White

ADVISORY COMMITTEEAll group leaders