infineon rasic: rrn7740 & rtn7750 77ghz radar dies new integrated radar and camera (racam) 77ghz...
TRANSCRIPT
The new integrated Radar and Camera
(RACam) 77GHz automotive radar from
Delphi integrates receiver and transmitter
components from Infineon. These
components use the latest SiGe:C HBT
technology.
Infineon RASIC: RRN7740 & RTN775077GHz Radar Dies
New Receiver & Transmitter components with a SiGe:C HBT technology from Infineon
The two bare dies RF component are developed and manufactured by
Infineon. The two chips are integrated in the RF board with specific
thermal management. The dies have wire bonding and are directly
connected to microstrip line transmission which lead the signal to antenna
via a specific way through the PCB.
The RF transistors are the newest generation SiGe:C HBT dies from
Infineon. The circuits use advanced insulation structure and modern
copper metal layers.
The report includes a complete physical analysis of the dies, with details
on technical choices regarding the design and the manufacturing process.
The SiGe HBT are equally analyzed.
Infineon offer several RASIC with different package (bare die, eWLB). in
order to understand the choice made by Delphi, the RF function and design
are compared with the Infineon RRN7745P and RTN7735P (eWLB
packaging) found in the Bosch MRR1Plus automotive radar.
Title: Infineon RRN7740 &
RTN7750 77GHz Radar
Receiver & Transmitter SiGe:C
HBT
Pages: 87
Date: January 2016
Format: pdf + xls
PRICE:
Full report: 1,990 EUR
COMPLETE TEARDOWN WITH:
• Detailed Photos
• Detailed Functions
• Precise Measurements
• Material Analysis
• Manufacturing Process
• Manufacturing Cost Analysis
• Selling Price Estimation
• Comparison with Infineon
RRN7745 & RTN7735 eWLB
Performed by
Yvon is the laboratory manager.He has deep knowledge inchemical & physical technicalanalyses. He previously workedfor 25 years in Atmel NantesLaboratory and performs MEMSanalyses for more than 8 years.
Author (Lab):YvonLe Goff
Author:StéphaneELISABETH
Stéphane has a deep knowledgeof Materials characterizationsand Electronics systems. Heholds an Engineering Degree inElectronics and NumericalTechnology, and a PhD inMaterials for Microelectronics.
TABLE OF CONTENTS
Overview / Introduction
Infineon Company Profile
Physical Analysis
•Radar system
Integration of the die
System Comparison
•Die
Die View & Dimensions
Main Blocks Identification
Die Marking
Die Process
Die Comparison
Die Integration
Die Cross-Section
Cost Analysis
•Hypotheses
Component Summary
Front-End Summary
Wafer Fabrication Unit
Back-End: Probe Test,
Backgrinding & Dicing
Back-End: Final Test
•Cost Analysis
Yields Synthesis
Unprobed Wafer Cost
Die Cost
Final Test Cost
Component Cost
Estimated Price Analysis
• Infineon Financial Results
• Component Selling Price
ANALYSIS PERFORMED WITH OUR COSTING TOOL
IC Price+System Plus Consulting has developed a powerful costing tool to evaluate the production cost & selling price of any Integrated Circuit:- ASICs, - microcontrollers, - DSP, memories, - smartpower…
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IC Price+
Bosch Mid Range Radar MRR Sensor
Infineon 77GHz eWLBRRN7745P & RTN7735P
Delphi RaCamIntegrated Radar and Camera
module
A compact, cost-effective and high-performance driving assistance system
Receiver & Transmitter components with a SiGe:C HBT technology
A compact, cost-effective and high-performance Advanced Driving Assistance System (ADAS)
Pages: 80Date: October 2015
Full report: EUR 2,490*
Pages: 104Date: October 2015
Full report: EUR 2,990*
Pages: 103Date: January 2016
Full report: EUR 3,490*
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