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“INTEGRAL”Holding

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Advantages :

● 50 years of experience in design and production of microelectronic components

● Complete cycle of design/development and manufacture of integrated circuits and semiconductor devices: from silicon ingots to finished products

● Vertically-integrated production structure - from integrated circuits to electronic devices

● Manufacture of ICs with minimal design rules 0.35 µm on Ø200 mm wafers

● Design/development and manufacture of microelectronic components are certified for compliance with the National and International standards ISO 9000

● Highly skilled and experienced personnel

Through the element base and display systems to finished microelectronic

products

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Structure of “INTEGRAL” Holding

Vitebsk

Mogilev

Gomel

Grodno

Pinsk

Molodechno

JSC “TSVETOTRON”Diodes, electronics, PCBs

Minsk Branch “Transistor”Discrete semiconductor devices,

ICs

Brest

Branch “KAMERTON”Silicon wafers,

electronics

Branch “Semiconductor Device FactoryBranch “Belmicrosystems” R&D CenterICs, discrete semiconductor devices,

LCD indicators, foundry services, photomasks

Branch “ELECTRONICA FACTORY”Electronics

JSC “Electromodule”Power semiconductor diodes

& rectifier modules

JSC “INTEGRAL” -“INTEGRAL” HoldingManaging Company

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Milestones

1961 Starting construction of the main administrativebuilding

1963 Launching Semiconductor Device Factory named after Dzerzhinsky F.E. (Minsk)

1963 Starting construction of “Transistor” factory (Minsk)

1963 First diodes manufactured1965 First transistors manufactured1968 “Transistor” factory was put into operation

and first transistors were manufactured (Minsk) 1969 Mass production of ICs started1971 RPC “Integral” amalgamated1972 Special Design Center of RPC “Integral” launched1973 First electronic wrist watch “Secunda-2”

manufactured 1974 Order of October Revolution is awarded for

design and manufacture of instruments for space exploration.

1977 Manufacture of first memory ICs

1978 Manufacture of first microprocessor.1978 “Electronica Factory” launched (Minsk) 1979 “Kamerton Factory” launched (Pinsk) 1981 The Order of Lenin is awarded for design and

manufacture of electronic units for reusable space system ground complex

1982 Manufacture of ALS Logic ICs1983 “Tzvetotron Factory” launched (Brest) 1986 “Zapad Design Center” launched (Brest) 1988 Manufacture of first lap-tops1990 Telephone ICs1991 “Nemiga Design Center” launched (Minsk)1992 Bank and trade electronic devices1992 First telephone set made1993 Calculator ICs

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2011 Shipped USD 4.5KK products manufactured at the new submicron production facility

2012 In frames of “BKA” program, manufactured microassemblies and IC assemblies of photosensitive CCD devices for remote sensing satellites

2013 On June 14, 2013, the Ministry of Economy entered “INTEGRAL” Holding into the Public Register of holdings #62

2013 Completion of the design of nonvolatile 1M (128Kx8) FRAM memory

2014 There has been developed and launched into mass production a 16 Mbit CMOS RAM multi-chip module. A set of the 5584-series ICs, 23 types, for space applications has been developed and put into series production. A mobile artificial lung ventilation apparatus has been developed.

2015 K1643RA014 SRAM IC with the capacity of 1 Mb (128Kx8) manufactured under "silicon on insulator" technology. Software and hardware for identification of reinforced concrete structures. LED lighting system for poultry farms with "sunrise-day-sunset" function.

1994 Logic ICs of HC/HCT, AC/ACT, 4000B series, EEPROM ICs

1995 ICs for one-PCB TV-sets of the 6 generation1995 Telephone plastic cards1999 Quality Assurance System is certified for

conformance to the requirements of National Standards and International ISO 9001 Standards

2000 Sophisticated VLSI for domestic electronicapplications

2001 Development of fast and ultra-fast diodes (FRD and UFRD)

2001 Mastering of special ICs for automotive electronics 2002 Development of ICs for ILA8842 TV processor 2003 Establishment of Integral’s Representative Offices in

China and India2005 MOSFET type power field-effect transistors mass

production start up 2005 VLSI development for “BelKa” satellite 2006 0.8 µm ICs mass production start up 2007 Starting production of sophisticated products for

medical equipment2008 Starting production of special purpose 256К memories 2009 0.35 µm IL1307/1356 LSI development2010 Starting production of special purpose 1 Mbit memories 2010 IC mass production start-up on 200mm wafers 2010 Joint Stock Company “INTEGRAL” established2011 Start commercial production of 5 products in 0.35μm

process node:IN1307, IN1356 – real-time clock ICs,

IZ1325 – high-precision RTC IC with thermocompensation, IZ8563 – CMOS timer LSI with 12C-bus RAM,IZ2009 – IC for authentication systems with 1-Wire interface

with EEPROM

Milestones

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Silicon substate

Integral product structure

IC in Package

Die in Wafer

Electronic Products

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Company profiles

SEMICONDUCTORDEVICES

ELECTRONICPRODUCTS

and CONCUMER GOODS

SPECIAL PROCESSEQUIPMENTAND TOOLING/ACCESSORIES

INTEGRATEDCIRCUITS

DESIGN/DEVELOPMENT/MANUFACTURE

FOUNDRY BUSINESS

FABLESSBUSINESS

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Integrated Circuits

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Semiconductor devices

Diodes

Pulse

Zener

Rectifier, medium frequency

Varicaps

Schottky, power

Rectifier-limiter (Zener)

Noise generators

Noise diodes generators

Arrays

Pulse diodes

Varicaps

Power diodes

Medium-power transistors

High-frequency complementary

Pulse complementary

SHF generator

MOS switches

Low power transistors

High frequency complementary

Pulse complementary

Unijunction

Low-voltage, high-frequency, low-noise

Power transistors

Field, N-channel, high voltage

Bipolar, complementary, high-voltage

Complementary, Darlington

Field, high-current, N and P-channel

Thyristors and triacs

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Foundry business

MOSFET

Foundry businessSemiconductor ICs and Discrete Devices-

Manufacturing on the base of Customer's Design(delivery on the base of on-chip testing)

Semiconductor and Discrete Devices - Manufacturing on the base of Customer's Design

(delivery on the base of wafer PCM testing)

Wafer Fab Service – execution of separate Process Flow Steps or bloks

(Metal sputtering, film deposition, EPI-growing, back grinding, wafers testing and so on)

Raw Si substrate manufacturing by Customer's Specs

Process Flows available: Integrated Circuits:

n-MOS

CMOS

BiCMOS

CDMOS

BiCDMOS, DMOS

Bipolar (TTL, TTL/ALS)

Production Capacities used for Foundry Business:

Production line for 8'' wafers with (0.5-0.35) µm Design Rule

Production line for 6'' wafers with (0.8-1.2) µm Design Rule

Production line for 4'' wafers with (1.2-3.0) µm Design Rule

Basic Process Flows available: Discrete devices:

D-MOS ( 1000V) ≤

IGBT-bipolar transistor with isolated gate ( 1500V) ≤

Multi-Epi ( 700V)≤

Bipolar

High-frequency devices ( 300V)≤

Fabless-business starting from 0.18 µm design rules («Belmicrosystems» Research

and Design Center Branch)

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Technological Capabilities

0.8µm BiCMOS technology, 3 poly, 2 Ме

0.35µm CMOS technology, 2 poly, 3 Ме

High-voltage 0.8µm CMOS technology, 2 poly, 1 Ме

Bipolar technologies, 1.5…5 μm, 1-2 Ме

0,8…2 μm BCD, DMOS technologies, 1 Ме

Microwave bipolar transistor technology

Schottky technology

Planar thyristor technology with separation by interdiffuision

Epitaxial planar and diffusion planar technologies for manufacturing silicon semiconductor devices ,

including high-voltage transistors

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Technological Capabilities

IC packaging:SO, DIP, P-SOT223-4-1, P-SOT223-4-2, P-TO-5-11, P-TO-5-12, TO-220AB/5, TO-220AB/7, P-TO-220-7-180, P-TO-220-7-230, SIL-3P, SIL-9P, SIL-9MPF, DBS-9P, DBS-9MPF, SOT523-1, SIL-13P, SIL-15P, QFP-80, QFP-100

Semiconductor device assembly:- plastic packages: TO-92, TO-126, TO-218, TO-220, DPACK,

D2PACK, IPACK, SOT-23,- metal-glass packages: TO-3, TO-18, TO-72, Case 22A-01.

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Hardware components application

Household appliances:LCD TV, monitors, microwave ovens,

fridges, washing machines.

Networking & TelecommunicationsTelephones, modems, fax machines,

electronic dial exchange.

Industrial ElectronicsAutomation, instrument engineering,energy flow meters, electric drives,

electronic start-control devices.

Access Control & IdentificationRFID-tags, smart key,

contactless cards.Space Electronics

Satellite-borne electronic equipment,optoelectronic systems, satellite launch control.

Payment SystemsPlastic bank cards, payment cards,

phone cards,prepaid cards for public transport.

AgricultureAutomated control systems and devices for

agriculture and agricultural machinery.

Automotive ElectronicsFuel injection and ignition systems,

turn-indicator systems, wiper systems, lighting equipment.

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“INTEGRAL” Holding

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“INTEGRAL” Holding

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International background

The products are exported to 34 countries of the world

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