integrated photonics - general electric · packages for energy, healthcare, and aviation...
TRANSCRIPT
GE Research has over 20 years of experience developing photonic and fiber optic system solutions, packages, components and analytics for military and industrial applications. Over the last three years, GE Research has leveraged this experience in the development of photonic integrated circuits (PICs) and related heterogeneous packages for energy, healthcare, and aviation applications. With the breadth of photonic, microsystem, packaging, and thermal expertise at GE Research we are well suited to tackle your integrated photonic challenges from the system level through packaging and test.
GE Research
Integrated Photonics
GE Research Capabilities
Mode solution for Heterogeneous film stack 25x25mm PIC
Optical (top) & electrical (bottom) probing of PIC on GE’s probe station
Modeling and Design
Wafer and Chip Scale Testing
GE Research Offerings
• Photonics modeling/design software and expertise (Synopsys RSOFT, Phoenix OptoDesigner, Zemax)
• Optical packaging tools including MRSI and Lambda FineTech die bonders and Panasonic flip chip bonder
• Optical/Electrical probe station with temperature and automated XYZθ platen control for up to 300mm wafers
• 6-axis Phsyik Instrumente Fiber Alignment System with H-811 Hexapod and NanoCube Nanopositioner
• Labview test automation • SAS JMP data analysis• 28,000 sq. ft. class 100 cleanroom
• Optical mode calculations of over ten custom structures using RSOFT mode solver
• Three dedicated PIC designs with >100 different test structures on 300mm AIM-Photonics platform
• Fully integrated probe station, hexapod, nanocube, and optical test equipment for automated testing and data gathering
• Over 20,000 circuits tested and analyzed• Research services for photonic application solutions
and PIC designs and prototypes • PIC testing on automated probe station for photonic
chips and wafers up to 300mm including electrical I/O and integrated optical test equipment
• Heterogeneous packaging and thermal management• Statistical analysis and interpretation of large data sets
Elimination of fiber routing and splicing
New phonic system
applications
Reduction in Line Replaceable Units (LRUs)
Low cost at volume
Low size, weight, and power
Technology Brief
Contact: Todd Miller | E&S Commercial Leader Email: [email protected]
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GEA34345 7/2019