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Intel ® SC5100 5U Server Chassis Technical Product Specification Order Number: A85099-001 Revision 1.0 November, 2001 Enterprise Products and Services Division

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Page 1: Intel SC5100 5U Server Chassisusers.cis.fiu.edu/~mullerk/tech/documents/sc5100_tps.pdf · KHD2BASE300 is the base SC5100 chassis, designed to address the entry market. It includes

Intel® SC5100 5U Server Chassis

Technical Product Specification

Order Number: A85099-001

Revision 1.0

November, 2001

Enterprise Products and Services Division

Page 2: Intel SC5100 5U Server Chassisusers.cis.fiu.edu/~mullerk/tech/documents/sc5100_tps.pdf · KHD2BASE300 is the base SC5100 chassis, designed to address the entry market. It includes

Revision History SC5100 5U Server Chassis TPS

Revision 1.0 Order Number: A85099-001 ii

Revision History Date Revision

Number Modifications

07/24/2001 0.5 Initial draft for review. 08/20/2001 0.8 Initial version 11/9/2001 1.0 Review changes incorporated

Disclaimers Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

This document contains information on products in the design phase of development. Do not finalize a design with this information. Revised information will be published when the product is available. Verify with your local sales office that you have the latest datasheet before finalizing a design.

The Intel® SC5100 Server Chassis may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are available on request.

Intel® Pentium® III are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States or other countries.

Copyright © Intel Corporation 2001. *Other names and brands may be claimed as the property of others.

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SC5100 5U Server Chassis TPS Table of Contents

Revision 1.0 Order Number: A85099-001

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Table of Contents

1. Introduction........................................................................................................................ 1

2. Chassis............................................................................................................................... 3

2.1 Chassis Dimensions...................................................................................................... 3

2.2 System Color................................................................................................................. 3

2.3 Front Bezel Features..................................................................................................... 3

2.4 Chassis Security............................................................................................................ 3

2.5 I/O Panel ....................................................................................................................... 4

2.6 Chassis Views............................................................................................................... 4

3. SC5100 Chassis Power Subsystem.................................................................................. 7

3.1 300 W EPS 2.0 Power Supply....................................................................................... 8

3.1.1 300 W Power Supply Mechanical Outline ................................................................ 8

3.1.2 300 W Power Supply Fan Requirements ................................................................. 8

3.2 350 W 1+1 Redundant Power Supply ........................................................................... 9

3.2.1 350 W Power Supply Mechanical Outline ................................................................ 9

3.2.2 350 W Power Supply Fan Requirements ................................................................. 9

3.3 350 W TPS Module ....................................................................................................... 9

3.4 AC Power Line ............................................................................................................ 10

4. System Cooling................................................................................................................ 11

4.1 Fan Configuration........................................................................................................ 11

4.2 Fan Control ................................................................................................................. 11

5. Chassis Peripheral Bays ................................................................................................. 13

5.1 3.5-inch Floppy Drive Bay ........................................................................................... 13

5.2 5.25-inch Drive Bays ................................................................................................... 13

5.3 3.5-inch Low Voltage Differential Hot-Swap Hard Drive Bays...................................... 14

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Table of Contents SC5100 5U Server Chassis TPS

Revision 1.0 Order Number: A85099-001 iv

5.3.1 SCSI Y-Adapter Cable Accessory.......................................................................... 17

5.3.2 External SCSI Adapter Cable................................................................................. 17

6. Front Panel....................................................................................................................... 18

7. Chassis Electronics......................................................................................................... 20

7.1 Board Layout............................................................................................................... 20

7.2 SAF-TE Specifications ................................................................................................ 21

7.3 Product Abstract.......................................................................................................... 21

8. System Interconnection .................................................................................................. 23

8.1 Signal Definitions......................................................................................................... 23

8.2 Interconnect Diagram.................................................................................................. 23

8.3 System Internal Cables ............................................................................................... 24

8.4 I/O Panel Connectors .................................................................................................. 25

9. System Server Boards..................................................................................................... 26

9.1 Intel® SDS2 DP Server Board...................................................................................... 26

9.2 Intel® SAI2 DP Server Board ....................................................................................... 27

9.3 Additional Server Boards............................................................................................. 27

10. Regulatory and Integration Information......................................................................... 28

10.1 Product Regulatory Compliance............................................................................... 28

10.1.1 Product Safety Compliance.................................................................................. 28

10.1.2 Product EMC Compliance .................................................................................... 28

10.1.3 Product Regulatory Compliance Markings ........................................................... 28

10.2 Electromagnetic Compatibility Notices ..................................................................... 29

10.2.1 USA ..................................................................................................................... 29

10.2.2 FCC Verification Statement.................................................................................. 30

10.2.3 ICES-003 (Canada).............................................................................................. 30

10.2.4 Europe (CE Declaration of Conformity) ................................................................ 30

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SC5100 5U Server Chassis TPS Table of Contents

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10.2.5 Japan EMC Compatibility ..................................................................................... 30

10.2.6 BSMI (Taiwan) ..................................................................................................... 31

10.3 Replacing the Back up Battery ................................................................................. 31

11. Environmental Limits ...................................................................................................... 32

11.1 System Office Environment...................................................................................... 32

11.2 System Environmental Testing................................................................................. 32

12. Reliability, Serviceability And Availability...................................................................... 33

12.1 Mean Time Between Failures (MTBF)...................................................................... 33

12.2 Serviceability............................................................................................................ 33

Appendix A: System Upgrade Information.............................................................................. I

Appendix B: Glossary.............................................................................................................. II

Appendix C: Reference Documents....................................................................................... IV

Appendix D: Index....................................................................................................................V

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List of Figures SC5100 5U Server Chassis TPS

Revision 1.0 Order Number: A85099-001 vi

List of Figures Figure 1. ATX 2.03 I/O Aperture.....................................................................................4

Figure 2. Rack Configuration View .................................................................................4

Figure 3. Pedestal Configuration - Front Isometric View ................................................5

Figure 4. Pedestal Configuration - Rear Isometric View.................................................5

Figure 5. Front Isometric View, Open Access Cover and Bezels Removed...................6

Figure 6. Rear Isometric View, Open Access Cover and Bezels Removed ...................6

Figure 7. 300 W EPS 2.0 Power Supply.........................................................................8

Figure 8. 350 W 1+1 Redundant Power Supply .............................................................9

Figure 9. Replaceable 350 W Thin Power Supply Module ...........................................10

Figure 10. SC5100 Fan Mounting Feature ....................................................................11

Figure 11. Drive Bay Locations .....................................................................................13

Figure 12. DLT Tape Drive and Slim line CDROM Mounting Brackets .........................14

Figure 13. Hot-Swap Drive Bay, Front Isometric View...................................................15

Figure 14. Hot-Swap Drive Bay, Rear Isometric View ...................................................16

Figure 15. Drive Carrier with Air Baffle Installed............................................................16

Figure 16. SCSI Y-Adapter Cable .................................................................................17

Figure 17. External SCSI Adapter Cable Detail.............................................................17

Figure 18. Front Panel Controls and Indicators.............................................................18

Figure 19. SC5100 SCSI Backplane .............................................................................20

Figure 20. SC5100 SAF-TE Board ................................................................................21

Figure 21. SC5100 Interconnect Diagram .....................................................................23

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SC5100 5U Server Chassis TPS List of Tables

Revision 1.0 Order Number: A85099-001

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List of Tables Table 1. SC5100 Product Matrix ....................................................................................2

Table 2. Compatible Server Board Features ..................................................................2

Table 3. Chassis Dimensions (approximate)..................................................................3

Table 4. SC5100 Power Supply Input/Output Summary ................................................7

Table 5. 350 W TPS Module LED Indicator .................................................................10

Table 6. SC5100 Front Panel LED Functions ..............................................................19

Table 7. System Office Environment Summary............................................................32

Table 8. MTBF Calculations .........................................................................................33

Table 9. Maximum Maintenance Procedure Times ......................................................33

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List of Tables SC5100 5U Server Chassis TPS

Revision 1.0 Order Number: A85099-001 viii

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SC5100 5U Server Chassis TPS Introduction

Revision 1.0 1 Order Number: A85099-001

1. Introduction This specification details the feature set of the Intel® SC5100 Server Chassis, an entry-level server chassis offering designed for Intel server board products.

The SC5100 Chassis is designed to support the Intel® SDS2 and SAI2 Server Boards. Product codes and configurations of the SC5100 are:

KHD2BASE300 is the base SC5100 chassis, designed to address the entry market. It includes a single Power Factor Correction (PFC) power supply, and supports up to five non hot-swap hard drives. Two tachometer output fans mounted in front of the server board and two fans mounted at the rear of the chassis provide main chassis cooling. An optional hot-swap drive bay kit, product code (AXX2HSDRVUG), provides an upgrade path to allow the SC5100 base chassis to support five hot-swap drives.

KHD2HSRP350 contains a 1+1 and AC redundant power supply that features replaceable hot-swap 350-W thin power supply (TPS) modules and dual AC power cords for increased reliability and availability. The 350-W modules can be replaced without disrupting the operation of the server system. A single hot-swap drive bay is pre-installed in this version of the chassis. (SDS2 server board only)

KHD2HSRP350R is the rack mountable version of the KHD2HSRP350 chassis. It is configured with a five drive hot-swap Small Computer Systems Interface (SCSI) hard drive bay and a redundant power supply. This version provides unpainted covers, black rack bezels, peripheral bay reorientation bracket, and slide mounting rails. The unit is re-positioned in a horizontal orientation. The reorientation bracket is provided to maintain a horizontal position for CD-ROM and tape drives. (SDS2 server board only)

Three 5.25-inch half-height drive bays are available for other peripherals, such as CD-ROM and tape drives. However, only two of the three spaces can be occupied by devices. The third location must remain open with a vented panel installed to provide an inlet for cooling air. See Section 5.2 for more detail.

An optional hot-swap hard disk drive bay, AXX2HSDRVUG, is available for all of the SC5100 chassis configurations. It supports up to five 1-inch single connector attachment (SCA) low-voltage differential SCSI (LVDS) hard drives to enhance serviceability, availability, and upgradability of the system. Adapter brackets allow mounting of hard drives at the lower six 5.25-inch half-height peripheral bays at the front of the chassis. When the hot-swap drive bay is installed, it utilizes three of the six available bay positions. For the chassis configured with a hot-swap redundant power supply, this optional hot-swap hard disk drive bay is added to the pre-installed drive bay for a total support of ten hot-swap SCSI drives.

A removable access cover provides entry to the interior of the chassis. The rear I/O panel conforms to Advanced Technology Extended (ATX) Specification, Revision 2.03, and supports seven full-length expansion cards. The chassis is provided with a front panel board designed for Server Standards Infrastructure (SSI) compliant server boards.

This specification details the key features of the product. Reference documents listed in Appendix C provide additional product specification detail for the server boards, backplane, and power supplies validated for use with this chassis.

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Introduction SC5100 5U Server Chassis TPS

Revision 1.0 Order Number: A85099-001 2

Table 1. SC5100 Product Matrix

Product Code Intel Server Board

Hot-swap SCSI Drives Power Supply Configuration Pedestal/ Rack

SAI2 None KHD2BASE300 Base 300W SDS2 None – (upgradeable to 5)

Fixed 300 W PFC Pedestal

KHD2HSRP350 HSRP 350W

SDS2 Yes – 5 (upgradeable to 10) 350 W PFC 1+1 Dual Line Cord with two 350 W modules

Pedestal

KHD2HSRP350R HSRP 350W-Rack

SDS2 Yes – 5 (upgradeable to 10) 350 W PFC 1+1 Dual Line Cord with two 350 W modules

Rack

The Intel® SAI2 Server Board has limited support for all of the SC5100 features. Table 2 shows the supported features:

Table 2. Compatible Server Board Features

Intel® SAI2 Server Board Intel® SDS2 Server Board

Dual Processor Support Yes Yes

Hard Disk Drive (HDD) Support Up to four IDE (on two ATA/100) Up to ten hot-swap SCSI, or five IDE (on 1 ATA/66)

Power Supply Options 300 watt only 300 watt or 350 watt 1+1

Network Adapter Support One connector Two connectors

USB Connector Support Two rear One front and three rear

COM2/Emergency Management Port (EMP)

Not supported One front (Rack only) Rear knock out for optional port

External SCSI or Intelligent Chassis Management Bus (Rear knock out)

Not supported Rear knock out for optional port

Server Management Instrumentation Entry-level, local server monitoring feature set

Intel® Server Control (ISC) 3.5 remote monitoring full featured set

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SC5100 5U Server Chassis TPS Chassis

Revision 1.0 Order Number: A85099-001

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2. Chassis

2.1 Chassis Dimensions

Table 3. Chassis Dimensions (approximate)

Configuration Pedestal Rack Height 17.5 inches 8.6 inches Width 8.6 inches (chassis), 12.7 inches (with feet) 16.9 inches Depth 26 inches 25 inches Clearance Front 10 inches N/A Clearance Rear 5 inches N/A Clearance Side 3 inches (additional side clearance needed for service) N/A

2.2 System Color The SC5100 chassis will be offered in two color configurations. The primary exterior system color (bezels and covers) of the pedestal version will match Intel Color Standard 513505 (Dusty Beige). The rack version of the chassis will have covers without paint and the bezel will match GE Cycoloy®-701 (Raven Black).

2.3 Front Bezel Features The standard pedestal front bezel is a molded plastic door covering all drive bays. A key-lock is provided to prevent unauthorized access to the peripheral bays. Each peripheral bay is covered with a removable electromagnetic interference (EMI) shield. A molded plastic sub-bezel is located on the face of the chassis under the front bezel. The sub-bezel houses the front panel buttons and light pipes for the front panel indicators.

Opening the exterior plastic door accesses the hot-swap hard drives, if so equipped. An EMI shield is incorporated into the drive carrier design, eliminating the need for a separate shield or door. This adds flexibility to the bezel design by making EMI performance independent of the cosmetic plastic parts.

Customized bezels for OEM customers can be designed from the standard bezel design.

2.4 Chassis Security A variety of chassis security options are provided at the system level.

• A removable padlock loop on the rear of the system access cover can be used to prevent access to the microprocessors, memory, and add-in cards. A variety of lock sizes can be accommodated by the 0.270-inch diameter loop.

• A two position key lock/switch will unlock the access cover.

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Chassis SC5100 5U Server Chassis TPS

Revision 1.0 Order Number: A85099-001 4

• Intrusion switches are provided allowing server management software, such Intel Server Control (ISC), to detect unauthorized access to the system cover and pedestal bezel door.

Note: See the appropriate Server Board External Product Specification for a description of BIOS and Intel Server Control security features.

2.5 I/O Panel All input/output connectors are accessible on the rear of the chassis. The SSI chassis provides an ATX 2.03 compatible cutout for I/O shield installation. Boxed server boards provide the required I/O shield for installation in the cutout. The I/O cutout dimensions are shown in Figure 1, following, for reference.

I/O Aperture Baseboard Datum 0,0

5.196 ± 0.0106.250 ± 0.008

1.750 ± 0.008

(0.650)(0.150)

0.100 Min keepout around openingR 0.039 MAX, TYP

unit of measure is inches

Figure 1. ATX 2.03 I/O Aperture

2.6 Chassis Views

Figure 2. Rack Configuration View (KHD2HSRP350 model shown)

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Figure 3. Pedestal Configuration - Front Isometric View

Figure 4. Pedestal Configuration - Rear Isometric View (KHD2BASE300 model shown)

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Figure 5. Front Isometric View, Open Access Cover and Bezels Removed (KHD2HSRP350 model shown)

Figure 6. Rear Isometric View, Open Access Cover and Bezels Removed (KHD2BASE300 model shown)

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SC5100 5U Server Chassis TPS SC5100 Chassis Power Subsystem

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3. SC5100 Chassis Power Subsystem The Intel® SC5100 Server Chassis supports two different PFC power supply solutions. Additional variations may be chosen for future board sets to satisfy the system power, power distribution, thermal performance, acoustic noise and cost requirements.

The typical PS/2 form factor power supply with a remote enable feature can be used. The remote enable feature permits the system power to be activated from a variety of sources, allowing the implementation of Wake-on-LAN (WOL) or other remote management features. The 300-W Entry Power Supply (EPS) features Entry SSI (Rev. 2.0) compliant server board connectors and is positioned as the entry power supply solution for the Intel® SDS2 or SAI2 server boards. Refer to the SC5100 300W EPS 2.0 Power Supply Specification for details.

The SDS2/SC5100 system can also be configured with a 350 W 1+1 redundant power supply. The 350 W power supply features two removable modules inserted into a main housing (or cage). The main housing contains dual AC input circuits and power distribution boards. Both removable modules and both power cords must be installed for redundant operation. The removable hot-swap DC power modules can be replaced in the event of a failure. The system will remain in operation during a failed voltage condition and remain online during a single module replacement for maximum up time. Refer to the SC5100 350W 1+1 Redundant Power Supply Cage Specification for details.

The following table is a brief overview:

Table 4. SC5100 Power Supply Input/Output Summary

300 Watt EPS 350 Watt 1+1 RPS Intel Part Number A54037-XXX A53590-XXX +3.3 VDC Output 28 Amp Maximum 20 Amp Maximum +5 VDC Output 30 Amp Maximum 20 Amp Maximum +12 VDC Output

15 Amp Sustained 18 Amp - 12 Sec. Peak Current

25 Amp Maximum 30 Amp - 10 Sec. Peak Current

-5 VDC Output 0.3 Amp Maximum -12 VDC Output 0.8 Amp Maximum 0.5 Amp Maximum +5 VDC Standby 2.0 Amp Maximum 2.0 Amp Maximum Multiple +12-V 240-VA Protection Circuits

No Yes

Output balancing

Total combined output power of +3.3 V and +5 V shall not exceed 210W.

Total combined output power of +3.3 V and +5 V shall not exceed 150 W.

DC Power Connections 24-pin, 8-pin SSI 24-pin, 8-pin, 5-pin SSI AC Line Voltage

Auto ranging for either 100-120 VAC or 200-240 VAC

Auto ranging for either 100-120 VAC or 200-240 VAC

AC Line Frequency 50/60 Hz 50/60 Hz

AC Input Current 6.0 Amp at 115 VAC 2.5 Amp at 220 VAC

6.0 Amp at 115 VAC 2.5 Amp at 220 VAC

Redundant Power No Yes Hot-swap Power Modules N/A Two replaceable 350-W TPS

Modules Dual Line Cords No Yes Intended Serverboard SDS2/SAI2 SDS2

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Revision 1.0 Order Number: A85099-001 8

3.1 300 W EPS 2.0 Power Supply

3.1.1 300 W Power Supply Mechanical Outline The mechanical outline and dimensions for the 300 W supply are the standard PS/2 form factor. The approximate dimensions are 140-mm high by 86-mm wide by 150-mm deep.

Figure 7. 300 W EPS 2.0 Power Supply

3.1.2 300 W Power Supply Fan Requirements The 300 W EPS power supply incorporates an 80-mm low acoustic noise fan to exhaust air. The sound pressure level is measured at a distance of 1.0 meter from each side of the power supply in a free field. The worst-case peak value of the measurements shall not exceed 43 dBA at 25°C ±2 °C inlet temperature under normal operating conditions.

Due to the increased output power requirements of the 5 V standby circuit, power supply thermal margins are difficult to maintain while the system is in the “off” state. For this reason, the power supply fan(s) in some power supplies will run at a reduced revolutions per minute (RPM) when the system is off.

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3.2 350 W 1+1 Redundant Power Supply

3.2.1 350 W Power Supply Mechanical Outline The approximate 350 W 1+1 supply dimensions are 82-mm high by 106-mm wide by 330-mm deep.

Figure 8. 350 W 1+1 Redundant Power Supply

3.2.2 350 W Power Supply Fan Requirements The 350 W 1+1 RPS power supply incorporates a 80-mm fan to exhaust air. The worst-case peak value of the measurements shall not exceed 60 dBA at 25 °C ±2 °C inlet temperature under normal operating conditions. If a module failure is detected, the fans will enter a faster boost mode to provide additional cooling until the failing module is replaced. During this failure modethe acoustic limit may be exceeded.

Due to the increased output power requirements of the 5 V standby circuit, power supply thermal margins are difficult to maintain while the system is in the “off” state. For this reason, the power supply fan(s) in the some power supplies will run at a reduced revolutions per minute (RPM) when the system is off.

3.3 350 W TPS Module The 350 W TPS (Thin Power Supply) module is redundant and hot swappable. The module accepts AC input from an external EMI filter. The power supply docks into a power supply enclosure or cage, which contains the AC EMI filter and power distribution to the system. The supply is intended to operate with up to 4 modules in parallel. Refer to the 350W TPS Power Supply Module Specification for details.

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Revision 1.0 Order Number: A85099-001 10

Figure 9. Replaceable 350 W Thin Power Supply Module

There is a single bi-color LED to indicate power supply status of each module. When AC is applied to the power supply module and standby voltages are available the LED will BLINK GREEN. The LED turns ON GREEN to indicate that all the power outputs are available. The LED turns ON AMBER to indicate that the power supply has failed, shutdown due to over current, shutdown due to over temperature, or is indicating a predictive failure. Refer to Table 5 LED Indicators for conditions of the 350 W TPS module LEDs.

Table 5. 350 W TPS Module LED Indicator

Power Supply Condition Power Supply LED

No AC power to either PS modules OFF No AC power to this PS module only AMBER AC present / Only Standby Outputs On BLINK GREEN Power supply DC outputs ON and OK GREEN Power supply failure (includes over voltage, over temperature) AMBER Current limit AMBER

3.4 AC Power Line The system is specified to operate from 100-120 VAC, 200-240 VAC, at 50 or 60 Hz. The specified PFC power supplies are auto ranging. The system is tested to meet these line voltages, and has been tested (but not specified) at ±10 % of the voltage ranges, and similarly ±3 Hz on the line input frequency.

The system is specified to operate without error at full power supply output load, nominal input voltage, with line source interruptions not to exceed one period of the AC input power frequency (i.e., 20 milliseconds at 50 Hz).

The system is not damaged by AC surge ring wave up to 2.0 kV/500 A. This ring wave is a 100 kHz damped oscillatory wave with a specified rise-time for the linear portion of the initial half-cycle of 0.5 µsec. Additionally, the system will not be damaged by a unidirectional surge waveform of up to 2.0 kV /3000 A, with a 1.2 µsec rise time and 50 µsec duration. Further details on these waveforms can be obtained in ANSI/IEEE STD C62.45-1992.

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4. System Cooling The SC5100 cololing solution benefits from a lower cost three-fan solution to cool the lower power Intel® Pentium® III processor based serverboards (300 W and 350 W of power).

4.1 Fan Configuration Two 92 x 25 mm, two 80 x 25 mm system fans, and the power supply fan will provide cooling for the Intel® Pentium® III processors, hard drives, and add-in cards. When the hot-swap drive bays are installed, one of the 92-mm system fans draws air through the rear of each bay to provide drive cooling. The 80-mm fan at the rear of the chassis assists in evacuating hot air from the system and draws air from the upper, vented 5.25-inch peripheral bay filler panels. All system fans provide a signal for RPM detection that the server board can make available for server management functions. Removal of the access cover gives entry to the fans, which then can be easily changed with the system shut down. To ensure proper cooling, only processors with active heatsinks should be used unless otherwise indicated in the server board manuals. Active heatsinks incorporate a fan to provide cooling. Such a heatsink is typically installed on Intel® boxed processors.

Figure 10. SC5100 Fan Mounting Feature

4.2 Fan Control The chassis fans in the SC5100 server is designed to be used with a server board that supports fan control, such as the Intel® SDS2 Server Board. The front panel of the chassis has an active

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Revision 1.0 Order Number: A85099-001 12

temperature sensor (Dallas 1621) connected to the front panel’s I2C bus. Based on the inlet temperature measured, the server board’s firmware will adjust the fan voltage. This will maintain proper system cooling of all components and peripherals, while minimizing the acoustic noise level.

Some server boards may only utilize on onboard sensor to regulate fan speed between a nominal speed and high speed.

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5. Chassis Peripheral Bays

5.1 3.5-inch Floppy Drive Bay The Intel® SC5100 Server Chassis kit provides for the installation of a 3.5-inch floppy drive (Figure 11, Item C) positioned to the left of the 5.25-inch peripheral bays. Removal of the access cover provides entry for placement of the floppy drive. When a floppy drive is not installed, the snap-in EMI shield must remain in place to ensure regulatory compliance. A cosmetic plastic filler is also provided to snap into the bezel.

Figure 11. Drive Bay Locations

5.2 5.25-inch Drive Bays The SC5100 chassis supports two half-height or one full height 5.25-inch removable media peripheral device (i.e., Magnetic/Optical disk, CD-ROM, or tape drive). These peripherals can be up to 9-inches deep and placed in the upper drive bays (Figure 11, Item A). Note that only two of the three locations can be populated in the SC5100 chassis. The third location and the one-inch vented panel (Figure 11, Item B) must be unpopulated and the vented panels should be retained as an air inlet for processor and memory cooling. Without this air inlet the processors may overheat. As a guideline, the maximum recommended power per device is 17W. Thermal performance of specific devices must be verified to ensure compliance to the manufacturer’s specifications.

For the pedestal chassis, an optional Digital Linear Tape (DLT)/CD-ROM Bracket is available as an accessory (FHD2DLTBRK). This includes a bracket to properly mount a DLT type tape drive and a bracket for a slim line CD-ROM drive to be mounted beneath the tape drive. On lightly loaded system, the slim lime CD-ROM bracket from the kit can be used in conjunction with the standard rails and the devices (two half-height or one full-height) described above. However, this combination has not been validated and the user should be aware that it is highly configuation dependant.

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Figure 12. DLT Tape Drive and Slim line CDROM Mounting Brackets

For the rack chassis, the upper three bay locations are rotated 90 degrees via an pre-installed adapter bracket. This allows devices (such as CD-ROMs) to remain in their normal operating position when the chassis is rotated to the horizontal rack position. This configuration supports two half-height devices or one full-height device. A DLT device will mount in this reorientation bracket without the need for the optional accessory kit .

Six additional half-height 5.25-inch drive bays are provided to support installation of up to five hard drive disk devices. Five 3.5-inch to 5.25-inch hard drive adapter trays are provided in the base configurations and must be used to ensure proper cooling and Electromagnetic Compatibility (EMC) compliance. The lowest 5.25-inch bay is covered with a ventilated EMI shield panel and should not be utilized for drives to ensure proper system cooling operation.

The 5.25-inch peripherals are removable directly from the front of the chassis after removal of the access cover (to disconnect cables) and opening front bezel (pedestal config only). EMI shield panels or drive trays should be retained in unused 5.25-inch bays.

Note: Caution must be observed when approaching the maximum level of integration for these 5.25-inch drive bays. Power consumption of the devices integrated needs to be carefully considered to ensure that the power supply maximum power levels are not exceeded. Typical configurations can supply enough power for a floppy drive, a tape drive, a CD-ROM and five SCSI hard drives. The redundant power supplies (350 W 1+1) provide enough power for up to ten hot-swap SCSI drives.

5.3 3.5-inch Low Voltage Differential Hot-Swap Hard Drive Bays The Intel® SC5100 Server Chassis supports up to two hot-swap drive bays, each supporting five drives, for a total capacity of ten 3.5-inch SCA LVDS hard drives. The redundant power supply solution is required to be installed for full drive support. The non-redundant powered systems are designed to provide power for five hard drives. Drives are accessible by opening the front access door on the pedestal configuration or directly from the front of the rack mount chassis configuration. Five metal carriers are provided with each hot-swap bay to mount the hard drives. Each carrier features a plastic handle and bezel with an activity/fault indicator. When no drive is installed in a carrier, the air baffle should remain to ensure proper cooling of the hard drives.

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The hot-swap drive bay is designed to accept one-inch peripherals that consume up to 18 W of power. This wattage number is intended as a guideline. Thermal performance of specific hard drives must be verified to ensure compliance to the drive manufacturer’s specifications.

Further technical details of the SCSI backplane can be obtained from the SC5100 Low Voltage Differential (LVD)/Single Ended (SE) SCSI Backplane External Product Specification (EPS).

An optional hot-swap drive bay assembly (AXX2HSDRVUG) is available for the SC5100 chassis. It should be mounted in place of the middle three 5.25-inch drive trays of the base, non-redundant chassis models. For the redundant power models, the upgrade accessory should be installed in the lower three 5.25-inch drive trays to bring the total number of available hot-swap SCSI drives to ten.

Refer to the Intel® SC5100 Server Chassis Hot Swap Bay Upgrade Kit for installation instructions.

Figure 13. Hot-Swap Drive Bay, Front Isometric View

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Figure 14. Hot-Swap Drive Bay, Rear Isometric View

Figure 15. Drive Carrier with Air Baffle Installed (Actual drive carrier may appear slightly different)

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5.3.1 SCSI Y-Adapter Cable Accessory The SCSI Y-Cable, AXXHSBPYCBL, splits a single SCSI channel from a server board or add-in card, for connection to two 5-drive SCSI Backplanes (see AXX2HSDRVUG).

Figure 16. SCSI Y-Adapter Cable

5.3.2 External SCSI Adapter Cable This 68-pin LVD SCSI cable, AXXEXTSCSICBL, allows an internal SCSI connection from the baseboard to be routed to the ICMB/SCSI knock-out at the rear of the chassis.

Figure 17. External SCSI Adapter Cable Detail

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6. Front Panel The front panel is located in the front corner of the chassis. For the pedestal configuration, an exterior door allows full access to the front panel features. The front panel features the control buttons and LED indicators listed in Figure 18. Not shown is a tool- activated Nonmaskable Interrupt (NMI) switch located below the Status LED. The LEDs are visible with the pedestal exterior access door closed. The blue ID LED and ID toggle switch featured in the rack mount SC5100 chassis is used to indicate which particuliar chassis among several in a rack configuration is being serviced. The Intel® SDS2 Base Board also has a blue ID LED visible from the rear of the chassis which mimics the front panel ID LED.

A 34-pin Entry Ebay SSI (rev 2.0) front panel header is located on the back of the front panel. This allows for a 34-pin ribbon cable connection for use with SSI rev 2.0 compliant sever boards, or a 24-pin ribbon connection for use with first generation SSI server boards.

When the hot-swap drive bay is installed, a bi-color hard drive LED is located on each drive carrier (five total) to indicate specific drive failure or activity. For pedestal systems these LEDs are visible upon opening the front bezel door.

OM11954

AB

C

E

D

G

F

H

A. Hard drive activity LED (bi-color) B. Power button C. Sleep button D. LAN #1 activity LED (green) E. Reset button F. LAN #2 activity LED (green) G. Status LED (bi-color) H. Power/Sleep LED (green)

GOM12035

A

I H

BC

D FE

J

A. Hard drive activity LED (bi-color) B. Power button C. Sleep button D. LAN #1activity LED (green) E. Reset button F. ID toggle switch G. ID LED (blue) H. LAN #2 activity LED (green) I. Status LED (bi-color) J. Power/ Sleep LED (green)

Figure 18-1. Pedestal Controls and Indicators Figure 18-2. Rack Controls and Indicators

Figure 18. Front Panel Controls and Indicators

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Table 6. SC5100 Front Panel LED Functions

LED Name Color Condition Description Power/Sleep LED Green ON Power on Green BLINK Standby/Sleep (ACPI State S1) OFF Power off or Sleep (ACPI State S4) Status LED Green ON System ready Green BLINK Processor or memory disabled Amber ON Critical temperature or voltage fault; CPU/Terminator missing Amber BLINK Power fault; Fan fault; Non-critical temperature or voltage

fault OFF Fatal error during POST Hard drive activity Green BLINK Hard drive activity Amber ON Fault OFF No activity LAN #1 activity Green ON Local area Network (LAN) Linked Green BLINK LAN activity OFF Disconnected LAN #2 activity Green ON Local area Network (LAN) Linked Green BLINK LAN activity OFF Disconnected ID LED (SDS2 Rack) Blue ON Server identification; Toggled by ID button or software OFF Server identification; Toggled by ID button or software

Further details of the front panel functions supported, refer to the individual server board specifications.

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7. Chassis Electronics The hot-swap SCSI backplane board set supports the following features:

• Hot-swapping of SCSI drives, that allows connection of SCSI devices while the system power is on.

• Enclosure management and monitoring functions conforming to the SCSI-Accessed Fault-Tolerant Enclosures Specification (SAF-TE), Revision 1.00.

7.1 Board Layout The following diagram shows the layout of components and connectors on the hot-swap SCSI backplane printed circuit board set. This solution consists of two separate boards. The first board provides power distribution and SCSI interfacing of the drives. The second board provides the SAF-TE features and drive failure indicators.

Figure 19. SC5100 SCSI Backplane

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Figure 20. SC5100 SAF-TE Board

7.2 SAF-TE Specifications The SC5100 hot-swap SCSI backplane board set performs the tasks associated with hot-swappable SCSI drives, enclosure (chassis) monitoring and management, as specified in the SCSI-Accessed Fault-Tolerant Enclosures Specification (SAF-TE), Revision 1.0. The SAF-TE specified features supported by the hot-swap SCSI backplane include, but are not limited to, the following:

• Monitoring the SCSI bus for enclosure services messages, and acting on them appropriately. Examples of such messages include: activate a drive fault indicator, power down a drive that has failed, and report backplane temperature.

• SAF-TE intelligent agent, which acts as proxy for “dumb” I2C devices (that have no bus mastering capability) during intra-chassis communications.

7.3 Product Abstract The SC5100 hot-swap SCSI backplane is an embedded application subsystem, which during normal operation does the following:

1. Responds to SAF-TE messages (transmitted to the backplane via the SCSI bus).

2. Monitors the temperature on the backplane, and reports a warning or critical error if outside programmed limits.

3. Monitors the speed of the fans (if present), and reports a warning or critical error if outside programmed limits.

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The SC5100 hot-swap SCSI backplane board set is made up of the following functional blocks:

• SCSI Bus with SCA drive connectors, and active LVDS terminators • Microcontroller with program Flash and RAM • SCSI interface that allows the microcontroller to respond as a SCSI target • I2C interface to server board • SCSI drive power control • Fault indicator support • Support for two cooling fans (fan-tach inputs and power control) • Temperature sensor

The hot-swap SCSI backplane board set resides in the hot-swap drive bay which is included with the SC5100 350W chassis and/or is available as an upgrade.

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8. System Interconnection

8.1 Signal Definitions The standard cable construction is briefly described following. The pin out on the connectors referred to in this section is defined in the respective server board External Product Specification.

8.2 Interconnect Diagram The following figure depicts cables that may be found in a fully integrated SC5100 system. Not all the cables shown are provided with the system chassis or server board products.

Hotswap Drive Bay

Fan

SCSI Tape

IDE drive

IDE drive

Floppy Drive

Fan

Fan

Fan

Serverboard

3 pin fan

3 pin fan

IDE CDROM

Fron

t Pan

el

COM2

3 pin fan

34 pin SSI FP

10 pin USB

68 pin LVD SCSI34 pin Floppy

68 pin LVD SCSI

10 pin Serial

40 pin ATA

ChassisIntrusion

ChassisIntrusion

24 pin SSI Power8 pin SSI Power5 pin SSI Power

2 pin Chassis Intrusion

2nd HS Drive Bay(Not shown)

4 pin 2nd HSBP I2C

40 pin ATA

4 pin Primary HSBP I2C

ICMB

Board

OEM Board OEM Board

4 pin RAID HD Activity3 pin OEM IPMB5 pin ICMB

Power Supply

3 pin fan3 pin fan

Figure 21. SC5100 Interconnect Diagram Notes: Actual server board connections will vary by product. Consult server board EPS for details. Cabled COM2 is normally routed to rear of chassis with front mounting as an option for rack version. Two Hot Swap Drive bays can be installed on redundant power supply chassis only. No Hot Swap drive bays are shipped with the non-redundant power supply chassis. Install Hot Swap drive upgrade kit (AXX2HSDRVUG). ICMB board kit is a separate option (AXX2ICMBKIT). All power supplies have the 24-pin SSI and 8-pin power connectors, but the 5-pin connector is optional. Consult the power supply EPS for details.

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8.3 System Internal Cables The following cables are provided as part of the chassis kit:

Intrusion Alarm Switch cable

The Intrusion Alarm cable is two normally open momentary switches in series that are depressed by the access cover and front bezel. It is cabled to the server board by 22-AWG twisted pair wire terminated at a 2-pin connector.

Server Board to Front Panel

Front Panel: A 34-conductor ribbon cable with 34-pin IDC* connectors links the front panel and SSI Revision 2.0 compliant Server Board (IE and SDS2).

USB: A 4-conductor shielded USB cable (per USB specification) with 10-pin connectors is used for connecting the front panel mounted USB connector to the server board.

SCSI, Server Board to SCSI Hot-Swap Backplane (When hot-swap drive bay is installed)

A 68-conductor U160 SCSI cable is provided to interface from the server board to the hot-swap backplane (HSBP).

I2C, Server Board to SCSI Hot-Swap Backplane (When hot-swap drive bay is installed)

A 4-pin cable connects the server board to the hot-swap backplane to communicate server management information, such as drive and fan status to the server board.

Fan Connectors

The installed system fans provide three-pin connectors designed to mate with SSI (ATX) compatible fan headers.

Depending on the Server Board support of these features, some or all of the following cables are provided as part of the boxed board kit:

• IDE: One 40-pin, 80-conductor DMA66 IDE cable. • SCSI: One 68-pin, 68-conductor twisted pair wide SCSI cable with terminator. Cable

supports connection of up to four single ended SCSI drives to the server board. • Floppy: One 34-conductor cable, featuring two 34-pin IDC connectors (2x17) floppy

cable. • Serial: One 8-conductor cable terminated in a 2x5 header at one end and a 9-pin panel

mount Dsub connector on the other.

The following cable is provided as part of the ICMB interface card board kit (AXX2ICMBKIT ):

• One 5-pin ICMB Cable. Connects serverboard to ICMB interface card mounted on the chassis rear panel or add-in card slot.

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The following cable is provided as part of the External SCSI Cable Kit (AXXEXTSCSICBL):

• One 68-pin SCSI Cable. One end connects to the server board or add-in SCSI card, and the other end panel mounts to the back of the chassis.

8.4 I/O Panel Connectors The chassis provides an ATX 2.03 compliant I/O aperture for backside I/O. The specific panel used will be provided in the boxed server board kit. The following are typical panel connections:

• PS/2 keyboard connector • PS/2 mouse connector • 9-pin serial port(s) • 25-pin parallel port • USB port(s) • 15-pin video port • Ethernet RJ-45 connector

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9. System Server Boards

9.1 Intel® SDS2 DP Server Board Major features of the SDS2 Server Board:

• Dual Intel® Pentium® III processors (over 1 GHz, L2-Cache: 512 KB) • ServerWorks* Enterprise ServerSetTM III HE-SL Chipset • Support 133 MHz Host Bus Interface • Integrated main memory sub-system • Dual peer PCI busses. Six PCI slots – 4 x 64/66 and 2 x 32/33 • LPC bus bridge • Six memory slots supporting up to 6 GB of PC133 Registered ECC SDRAM DIMMs • Support ECC-protected main memory • SCSI: Integrated Adaptec* AIC-7899W dual channel ULTRA 160 SCSI controller • IDE: One integrated Ultra ATA/66 • Network: Dual Integrated Intel® 82550-PM Ethernet controllers (IP Security, WfM

compliance) • Video: ATI* Rage XLTM with 4 MB of VRAM • PCI Bridge: CSB5 for conventional 32-bit PCI and CIOB20 for conventional 64-bit PCI

(ServerWorks*) • LPC Bridge: Super I/O (PC87417) Floppy disk controller / Serial port / Parallel port /

Keyboard, Mouse controller/Real Time Clock • CSB5 (ServerWorks*) IDE/USB/ XIOAPIC • 8 Mbit Flash ROM (AM29LV800B) • 8 KB EEPROM within ADM1026 • IPMI 1.5 compliant Intel® Server Control v3.5 intelligent hardware and firmware • ICMB support via paddle card accesory • Support SMBus • SAHALEE, ADM1026 for RAS controller • SDS2 has following connectors and switches: Serial x 3, Parallel, USB x 4, Keyboard,

Mouse, Buzzer, Video, IPMB x 2, ICMB x 1,Ultra 160 Wide SCSI x 2, LAN (100/10Base-T) x 2, Dump (NMI) switch, DC on/off switch, Sleep switch, Reset switch, and ID switch (Rack)

See the Intel® SDS2 DP Server Board Technical Product Specification for more detail.

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9.2 Intel® SAI2 DP Server Board Major features of the SAI2 Server Board:

• Dual Intel® Pentium® III processors (over 1 GHz, L2-Cache: 512 KB) • ServerWorks* ServerSetTM III LE-T Chipset • Support 133 MHz Host Bus Interface • Integrated main memory sub-system • Dual peer PCI busses. Six PCI slots – 2 x 64/66 and 4 x 32/33 • LPC bus bridge • Four memory slots supporting up to 4 GB of PC133 Buffered DIMM • Support ECC-protected main memory • Dual UltraATA/100 IDE controllers • Network: Integrated Intel 82559 Ethernet controller (WfM compliance) • Video: ATI Rage XL with 8 MB of VRAM • PCI Bridge: CSB5 for conventional 32-bit PCI and CIOB20 for conventional 64-bit PCI

(ServerWorks*) • LPC Bridge: Super I/O (PC87417) Floppy disk controller / Serial port / Parallel port /

Keyboard, Mouse controller/Real Time Clock • CSB5 (ServerWorks*) IDE/USB/ XIOAPIC • 8 Mbit Flash ROM (AM29LV800B) • 8 KB EEPROM within ADM1026 • SAHALEE, ADM1026 for RAS controller • SAI2 has following connectors and switches: Serial x 2, Parallel, USB x 2, Keyboard,

Mouse, Buzzer, Video, LAN (100/10Base-T), Dump (NMI) switch, DC on/off switch, Sleep switch, and Reset switch

See the Intel® SAI2 DP Server Board Technical Product Specification for more detail.

9.3 Additional Server Boards Future Intel® server boards may also be targeted for the SC5100 chassis family.

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10. Regulatory and Integration Information 10.1 Product Regulatory Compliance

10.1.1 Product Safety Compliance The product complies with the following safety requirements:

• UL 1950 - CSA 950 (US/Canada) • EN 60 950 (European Union) • IEC60 950 (International) • CE – Low Voltage Directive (73/23/EEC) (European Union) • EMKO-TSE (74-SEC) 207/94 (Nordics)

10.1.2 Product EMC Compliance This product has been has been tested and verified to comply with the following electromagnetic compatibility (EMC) regulations when installed a compatible Intel host system. For information on compatible host system(s) refer to Intel’s Server Builder website or contact your local Intel representative.

• FCC (Class A Verification) – Radiated & Conducted Emissions (USA) • ICES-003 (Class A) – Radiated & Conducted Emissions (Canada) • CISPR 22 (Class A) – Radiated & Conducted Emissions (International) • EN55022 (Class A) – Radiated & Conducted Emissions (European Union) • EN55024 (Immunity) (European Union) • EN61000-3-2 & -3 (Power Harmonics & Fluctuation and Flicker) • CE – EMC Directive (89/336/EEC) (European Union) • VCCI (Class A) – Radiated & Conducted Emissions (Japan) • AS/NZS 3548 (Class A) – Radiated & Conducted Emissions (Australia / New Zealand) • RRL (Class A) Radiated & Conducted Emissions (Korea) • BSMI (Class A) Radiated & Conducted Emissions (Taiwan)

10.1.3 Product Regulatory Compliance Markings This product is provided with the following Product Certification Markings.

• UL / cUL Listing Mark • CE Mark • German GS Mark • Russian GOST Mark • FCC, Class A Verification Marking • ICES-003 (Canada EMC Compliance Marking) • VCCI, Class A Mark • Australian C-Tick Mark • Taiwan BSMI Certification Number and Class A Warning

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10.2 Electromagnetic Compatibility Notices

10.2.1 USA This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

For questions related to the EMC performance of this product, contact:

Intel Corporation 5200 N.E. Elam Young Parkway Hillsboro, OR 97124 1-800-628-8686

This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna. • Increase the separation between the equipment and the receiver. • Connect the equipment to an outlet on a circuit other than the one to which the receiver

is connected. • Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications not expressly approved by the grantee of this device could void the user’s authority to operate the equipment. The customer is responsible for ensuring compliance of the modified product.

Only peripherals (computer input/output devices, terminals, printers, etc.) that comply with FCC Class B limits may be attached to this computer product. Operation with noncompliant peripherals is likely to result in interference to radio and TV reception.

All cables used to connect to peripherals must be shielded and grounded. Operation with cables, connected to peripherals, that are not shielded and grounded may result in interference to radio and TV reception.

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10.2.2 FCC Verification Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

For questions related to the EMC performance of this product, contact:

Intel Corporation 5200 N.E. Elam Young Parkway Hillsboro, OR 97124-6497

Phone: 1 (800)-INTEL4U or 1 (800) 628-8686

10.2.3 ICES-003 (Canada) Cet appareil numérique respecte les limites bruits radioélectriques applicables aux appareils numériques de Classe A prescrites dans la norme sur le matériel brouilleur: “Appareils Numériques”, NMB-003 édictée par le Ministre Canadian des Communications.

English translation of the notice above: This digital apparatus does not exceed the Class A limits for radio noise emissions from digital apparatus set out in the interference-causing equipment standard entitled “Digital Apparatus,” ICES-003 of the Canadian Department of Communications.

10.2.4 Europe (CE Declaration of Conformity) This product has been tested in accordance too, and complies with the Low Voltage Directive (73/23/EEC) and EMC Directive (89/336/EEC). The product has been marked with the CE Mark to illustrate its compliance.

10.2.5 Japan EMC Compatibility Electromagnetic Compatibility Notices (International)

English translation of the notice above: This is a Class A product based on the standard of the Voluntary Control Council For Interference (VCCI) from Information Technology Equipment. If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.

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10.2.6 BSMI (Taiwan) The BSMI Certification number and the following warning is located on the product safety label which is located on the bottom side (pedestal orientation) or side (rack mount configuration).

10.3 Replacing the Back up Battery The lithium battery on the server board powers the real time clock (RTC) for up to 10 years in the absence of power. When the battery starts to weaken, it loses voltage, and the server settings stored in CMOS RAM in the RTC (for example, the date and time) may be wrong. Contact your customer service representative or dealer for a list of approved devices.

WARNING Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the equipment manufacturer. Discard used batteries according to manufacturer’s instructions.

ADVARSEL! Lithiumbatteri - Eksplosionsfare ved fejlagtig håndtering. Udskiftning må kun ske med batteri af samme fabrikat og type. Levér det brugte batteri tilbage til leverandøren.

ADVARSEL Lithiumbatteri - Eksplosjonsfare. Ved utskifting benyttes kun batteri som anbefalt av apparatfabrikanten. Brukt batteri returneres apparatleverandøren.

VARNING Explosionsfara vid felaktigt batteribyte. Använd samma batterityp eller en ekvivalent typ som rekommenderas av apparattillverkaren. Kassera använt batteri enligt fabrikantens instruktion.

VAROITUS Paristo voi räjähtää, jos se on virheellisesti asennettu. Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin. Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.

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Environmental Limits SC5100 5U Server Chassis TPS

Revision 1.0 Order Number: A85099-001 32

11. Environmental Limits

11.1 System Office Environment

Table 7. System Office Environment Summary

Parameter Limits Operating Temperature +5 °C to +35 °C with the maximum rate of change not to exceed 10 °C per

hour. Non-Operating Temperature -40 °C to +70 °C Non-Operating Humidity 95 %, non-condensing @ 30 °C Acoustic noise 55 dBA in a typical office ambient temperature (65-75 °F) Operating Shock No errors with a half sine wave shock of 2 G (with 11-millisecond duration). Package Shock Operational after a 24-inch free fall, although cosmetic damage may be

present ESD 15 kV per Intel Environmental test specification

11.2 System Environmental Testing The system will be tested per the Environmental Standards Handbook, Intel Doc.#662394-03. These tests shall include:

• Temperature Operating and Non-Operating • Humidity Non-Operating • Packaged Shock • Packaged and Unpackaged Vibration • AC Voltage, Frequency and Source Interrupt • AC Surge • Acoustics • ESD • EMC Radiated Investigation

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SC5100 5U Server Chassis TPS Reliability, Serviceability And Availability

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12. Reliability, Serviceability And Availability

12.1 Mean Time Between Failures (MTBF) Calculated MTBF for a typical SDS2/SC5100 configuration has been calculated at 25,239 hours at 35 °C.

Table 8. MTBF Calculations

Item Percentage usage

MTBF HRs Failure Rate (FITs)

Intel® SDS2 Server Board 100 103,996 9,616 Front Panel Board 100 3,566,515 280 Processor 100 1,250,000 800 Processor terminator (typical) 100 13,819,790 72 SCSI Backplane 100 314,618 3,178 Hard Drive 100 NA NA IDE CD-ROM (typical) 5 500,000 2,000 Intel® 82559 NIC 15 1,680,930 595 Power Supply 100 150,000 6,667 1.44 MB 3.5-inch Floppy Drive Unit 1 405,000 2,469 32MB DIMM 100 283,051 3,533 Fan (typical) 100 96,062 10,410 Total Failure Rate (FITs) 39,621 MTBF (in hours) 25,239

12.2 Serviceability The system is designed for service by qualified technical personnel only.

The desired MTTR of the system is 30 minutes including diagnosis of the system problem. To meet this goal, the system enclosure and hardware have been designed to minimize the MTTR.

Following are the maximum times that a trained field service technician should take to perform the listed system maintenance procedures, after diagnosis of the system.

Table 9. Maximum Maintenance Procedure Times

Remove cover 1 minute Remove and replace hard disk drive 1 minute Remove and replace 5 ¼ peripheral device 5 minutes Remove and replace power supply 5 minutes Remove and replace drive cage fan 2 minutes Remove and replace expansion board 5 minutes Remove and replace front panel board 5 minutes Remove and replace server board (with no expansion boards) 15 minutes Overall MTTR 20 minutes

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Reliability, Serviceability And Availability SC5100 5U Server Chassis TPS

Revision 1.0 Order Number: A85099-001 34

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SC5100 5U Server Chassis TPS Appendix A: System Upgrade Information

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Appendix A: System Upgrade Information • Hot-Swap Drive Bay Upgrade – Product Code AXX2HSDRVUG

• DLT Tape Drive and Slim Line CD-ROM Mounting Brackets – Product Code FHD2DLTBRK

• ICMB Interface Card with Brackets and Cable – Product Code AXX2ICMBKIT

• External SCSI Adapter Cable – Product Code AXXEXTSCSICBL

• SCSI Y-Adapter Cable – Product Code AXXHSBPYCBL

• 350 W TPS Power Module – Product Code AXX2PSMODL350

• 350 W 1+1 DLC Redundant Power Supply cage – Product Code FHD2PSCAGE1PI

• Rack Conversion Kit – AHD2RACK

Replacement parts:

• 300 W EPS 2.0 12 V Power Supply – Product Code FHD2PS300W

• EPAC Set – Product Code FHD2EPAC

• Fans – FHD2FANS

• Front Panel Board and Cables – Product Code FHD2FPBRD

• Hot Swap Drive Carrier, 1 inch, Black – Product Code FXX2DRVCARBLK

• I/O Shield and Gasket – Product Code AJP2IO

• Hot Swap Backplane – Product Code FXX2HSBRD

• SAF-TE Board – FXX2SAFTE

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Appendix B: Glossary SC5100 5U Server Chassis TPS

Revision 1.0 Order Number: A85099-001 II

Appendix B: Glossary Term Definition

AC Alternating Current ACPI Advanced Configuration and Power Interface ATX Advanced technology extended (motherboard type). DC Direct Current DDR Double Data Rate DIMM Dual inline memory module DLT Digital Linear Tape ECC Error Correcting Code EEPROM Electrically Erasable Programmable Read-Only Memory EMC Electromagnetic compatibility EMP Emergency Management Port EPS Entry Power Supply HSBP Hot-Swap Backplane Hz Hertz (1 cycle/second)

I2C Inter-integrated circuit bus

ICMB Intelligent Chassis Management Bus IDE Integrated Drive Electronics I/O Input / Output IP Internet protocol IPMI Intelligent Platform Management Interface ISC Intel Server Control LAN Local Area Network LED Light Emmitting Diode LPC Low Pin Count LVDS Low-voltage differential SCSI NMI Nonmaskable Interrupt OEM Original Equipment Manufacturer PCI Peripheral Component Interconnect PFC Power Factor Correction RPM Revolutions Per Minute RPS Redundant Power Supply SCA Single connector attachment. SCSI Small Computer Systems Interface. SMBus A subset of the I2C bus/protocol, developed by Intel. SSI Server Standards Infrastructure TBD To Be Determined TPS Thin power supply USB Universal Serial Bus VRAM Video Random Access Memory WfM Wired for Management WOL Wake-on-LAN

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SC5100 5U Server Chassis TPS Appendix B: Glossary

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Appendix C: Reference Documents SC5100 5U Server Chassis TPS

Revision 1.0 Order Number: A85099-001 IV

Appendix C: Reference Documents Refer to the following documents for additional information:

• 300-W Entry Power Supply (EPS) 2.0 Power Supply Specification, # A54037

• 350-W 1+1 Redundant Power Supply Specification, # A53590

• 350-W Thin Power Supply (TPS) Power Supply Module Specification, # A45295

• Advanced Technology Extended (ATX) Specification, Revision 2.03

• SC5100 LVD/SE SCSI Backplane External Product Specification (EPS), #A10655

• SCSI-Accessed Fault-Tolerant Enclosures Specification (SAF-TE), Revision 1.0.

• Intel® SC5100 Server Chassis Hot Swap Bay Upgrade Kit, #A58844

• Intel® SC5100 Server Chassis Subassembly Product Guide, #A55454

• Intel® SDS2 DP Server Board Technical Product Specification (TPS)

• Intel® SAI2 DP Server Board Technical Product Specification (TPS)

• SSI Entry-Level Electronics-Bay Specification, Version 2.0

• USB Specification, Revision 2.0

• ANSI/IEEE STD C62.45-1992

• Environmental Standards Handbook, Intel Doc.#662394-03

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SC5100 5U Server Chassis TPS Appendix D: Index

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Appendix D: Index ACPI, II agency certification, 30 ANSI, 10, IV ATI Rage XL, 26, 27 battery

disposing of safely, 31 removing, 31

Bridge, 26, 27 certifications, 30 CIOB20, 26, 27 Configuration, 3, II Connector, Fan, 24 Connector, I/O Panel, 25 Dimensions, Chassis, 3 DIMM, 26, 27, 33, II ECC, 26, 27, II EEPROM, 26, 27, II electromagnetic compatibility. See EMC EMC

notice of test and compliance, international, 30 Emergency Management Port, See also EMP, 2 EMP, 2 Environmental Limits, 32 Error, 19, II Ethernet, 25, 26, 27 Fan, 24, 33 Flash ROM, 26, 27 Front Bezel, 3 Front Panel, 18, 24, 33 Front Panel reset, 26, 27 I2C, 21, 22, 24, II ICMB, See also Inter-chassis Management Bus, 24, 26, I, II Intel Server Control, See also ISC v2.x, See also ISC v3.x, 4, II L2 cache controller, 26, 27

LED, 18, II lithium backup battery

disposing of safely, 31 removing, 31

LPC, 26, 27, II Mean Time Between Failures, 33 Memory, 19, II MTBF, 33 National Semiconductor PC87417, 26, 27 NMI, 18, 26, 27, II POST, 19 Power-on Self-Test

See POST, 19 Processor, 19 RAS, See also Remote Access Sensor, 26, 27 Real Time Clock

See RTC, 26, 27 Reset, 26, 27 SAF-TE, 20, 21, IV SCSI, 1, 14, 15, 20, 21, 22, 24, 25, 26, 33, I, II, IV SDS2, 1, 7, 24, 26, 27, IV Security, 3, 26, 27 Serial, 24, 26, 27 ServerWorks*, 26, 27 Signal Definitions, 23 SJP2, 1, 24, IV Specification, SAF-TE, 21 Temperature, 19, 22, 32 Universal Serial Bus, See also USB, II USB, See also Universal Serial Bus, 24, 25, 26, 27, II, IV VCCI notice, 30 Voltage, 7, 15, 19, 32 Warning

dispose of lithium battery safely, 31 Wired for Management, II

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Appendix D: Index SC5100 5U Server Chassis TPS

Revision 1.0 Order Number: A85099-001 II