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Introducing ADTEK Photomask

ADTEK Photomask is the sole merchant photomask manufacturer in Canada. We have been supplying a full range of optical, e-beam andlaserwrite photomasks to the semiconductor and related industries for over 25 years.

Our clients include multinational corporations, but mainly smaller companies and leading university research centres. Our photomasks are used in various fields such as:

• Photonics / Optoelectronics• Microelectronics• Micro-Electro-Mechanical-Systems (MEMS)• Bio-medical systems• Nanotechnology

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Process Flow

CustomerService QuotationDesign

PatternGenerator

Laser/E-beamsystem

Shipping

Optical

Laser/E-beam

Plot Approval

PurchaseOrder

DataPreparation

ProductionControl

Layout + Spec

(GDSII, dxf, dwg)(Job Information Form)

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Typical mask layout

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Example of a 5x reticle

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Mask Fiducials

Please let us know:- the model number- the body number of your stepper.

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Mask Field

Digitized data = clear Digitized data = dark

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5” mask

4” write area

Digitized data

E-beam mask design (1)

Critical dimension CD:Minimum feature orminimum spacing(whichever is smaller)

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E-beam mask design (2)Design

Dark field mask Clear field mask (please define reversing border)

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‘Pizza’ mask:

Separate layer mark-ing dark field area

Separate layer mark-ing light field area

Dense pattern

Will be used asreversing border

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Using AutoCAD as a layout tool (1)

• Use a new layer for each mask (e.g. ‘mask 1’, ‘mask 2’)

• Put construction lines on a different layer

• Put mask outline, reversing borders, etc on a different layer

• Use closed polylines to draw structures (command polyline, ‘c’ to close).

The circle, rectangle,… command creates a polyline automatically.

• Do not self-intersect polylines

• You can use text and define the height (we will determine font and width)

• If possible define a hierarchy by using blocks

• Do not use the hatch command

• Avoid double-digitizing or structures covering others

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Using AutoCAD as a layout tool (2)

What you want on the final mask:

Drawn incorrectly:

Correct:

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Reading

Right Reading Chrome Down (RRCD)- A text can be read properly while looking through theglass side of the mask. This is the standard reading.

Right Reading Chrome Up (RRCU):- A text can be read properly while looking at the chromeside of the mask.

Chrome

RRCD

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Quartz or Soda Lime?

Thermal expansion: Soda Lime: α = 9.3 ⋅10-6 /°C Quartz: α = 0.5 ⋅10-6 /°C

193

nm s

tepp

ers

Gra

ph su

pplie

d by

Hoy

a

Composition: Quartz = 100% SiO2 , SoLi = 70% SiO2, 8% Na2O, 9% K2O, 13% RO

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Blanks for Optical Pattern Generators

Thickness:Resist AZ 1518: 530 nmAR Chrome Oxide: 20 nmChrome: 80 nm

Reflectivity at 436 nm:Chrome: 48 %AR Chrome: 11 %Iron Oxide: 25 %

Thickness:Resist AZ 1518: 530 nmIron Oxide: 200 nm

Resist is baked for ½ hour at 103°

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Maskshop Process Flow

NaOH & H2SO4 + H2O2

Exposure Development Etching Resist stripping

Defect inspection

?

Defect repairCD measurementRegistrationmeasurement

hν

Laser

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Optical Pattern Generator (PG)

hν

Quartz / Soda Lime blank

ChromePositive Photoresist Flash size on the mask:

Min: 3 µm Max: 1500 µm

Variable rectangularshutters

10x reduction lens

λ = 436 nm (g-line of a mercury short arc lamp)

Rotation possible in 0.1 degree increments

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Optical Pattern Generator Format

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Image Repeater (IR)

5” reticle

hν

10x reduction lens

Max. die size = 9.4 mm x 9.6 mm

λ = 436 nm

Quartz / Soda Lime blank

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1x 10x & S&RMaximum plate size 10“ x 10“ 10“ x 10“Maximum write area 6“ x 9“ 6“ x 9“Maximum die size N/A 9.4 mmMinimum feature size 10 µm 2.0 µmFeature size tolerance + 0.75 µm + 0.5 µmRegistration + 0.75 µm + 0.5 µmDefect density 2 defects/square inch > 5.0 µm (but < 10.0 µm) Coatings:Anti reflective chrome Yes YesBright chrome Yes YesIron oxide Yes YesGlass types:Soda Lime Yes YesQuartz Yes Yes

Optical Pattern Generation Specifications

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ALTA 3000 Laserwrite System

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ETEC CORE 2564, ALTA 3000 & MEBES 5500 Specifications2564 3000 5500

Placement accuracy 0.08 µm 0.04 µm 0.03 µmCD uniformity 0.04 µm 0.03 µm 0.025 µmStripe butting 0.05 µm 0.02 µm 0.018 µmMinimum address size 0.025 µm 0.0083 µm 0.00125 µm Minimum resolution 0.6 µm 0.5 µm 0.360 µmGlass types:Soda Lime Yes Yes NoQuartz Yes Yes YesPlate sizes:4” x 4” x 0.06”/0.09” Yes No No5” x 5” x 0.09” Yes Yes No6” x 6” x 0.12” Yes Yes No6” x 6” x 0.25” Quartz only Yes Yes Yes7” x 7” x 0.12” Yes Yes No

Equipment manufacturer’s specifications

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The critical dimension CD

• Please let us know where the minimum feature is

(indicate x- and y-coordinates or position on separate

layer in your data file)

• Up to 5 CD measurements per mask are included

(ideally centre + each quadrant of the mask)

• CD can be measured on features up to 20 µm

• CD cannot be measured on circles, waveguides, …

=> please place tuning forks on the mask

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LEICA IPRO Registration System

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Registration

ACTUAL MASKDESIGN

Comparing the size, distortion & rotation of the die on the mask to

the design grid

Comparing the size, distortion & rotation of

the array on the mask to the design grid

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Examples of typical defects

Created by a hole in the resist

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Auto Inspection Reference Marks

Written by the manufacturer

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Die to Die Inspection

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Image divided into pixels

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Die-to-database inspection

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Comparison of database image and real image

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How to contact us?

Peter ErhartAdtek Photomask4950 Fisher StreetMontreal, Qc, Canada H4T 1J6

Tel.: (514) 737-7030Fax: (514) 737-9893

E-mail: customerservice@adtekphotomask.comWebsite: www.adtekphotomask.com