introducing pactech - packaging technologies corporate
TRANSCRIPT
Introducing
PacTech - Packaging Technologies
Corporate Profile
Technology & Product Overview
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PacTech Group - Corporate Profile
1995 PacTech GmbH founded in Berlin, Germany as spin-off
from Fraunhofer-IZM
1997 1st Manufacturing facility: PacTech GmbH, Nauen, Germany
2001 2nd Manufacturing facility: PacTech USA Inc., CA, USA
2005 Equipment Field Service & Support Center, Thailand
2006 NAGASE & Co., Ltd. takes 60% shares in PacTech
2008 3rd Manufacturing facility: PacTech Asia Sdn. Bhd., Malaysia
2009 NAGASE & Co., Ltd. increases shares in PacTech to 74%
2012 >800 Production Machines in the field
2013 >115 patents granted
2013 NAGASE & Co., Ltd. increases shares in PacTech to 97%
PacTech Group (Europe, USA, Asia): 240 employees
Annual sales revenue PacTech Group (2012): 35.75 Mio. €
(consolidated)
PacTech Europe (HQ)
PacTech USA
PacTech Asia
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Pac Tech Group - Worldwide Locations
PacTech / Nagase facilities
PacTech Asia Sdn. Bhd.Penang, Malaysia
Sales Agent / Distributor
NagaseTokyo, JapanNagase
Shanghai, China
PacTech GmbH Nauen, Germany
Tech
PacTech Customer Service CentreBangkok, Thailand Philippines
Taiwan
Singapore
Israel
Italy
France
Denmark
Sweden Finland
Korea
TokyoBoston
UK & IrelandRussia
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NAGASE & CO., Ltd.
Founded: June 18, 1832
Paid-in Capital: 100 million US$
Sales: 7.94 billion US$
Net Income: 154 million US$
Employees: 5,500 (Consolidated)
Stock: Listed TSE-1, OSE-1
Business Segments:
Chemicals: Petrochemicals, pigments, solvents, additives
Plastics: Resins, plastics, film or sheet products etc
Electronics: Materials for LCDs, semiconductor, consumer electronics etc
Life Science: Pharmaceuticals, food materials, cosmetics etc
25 mfg sites & 13 sales offices in Japan
17 mfg sites & 37 sales offices offshore
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Sales Revenue
0 €
10 €
20 €
30 €
40 €
1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012
1,66 1,833,65
5,74 5,934,97
7,69
14,01
16,94
21,29
18,49
15,76
21,81
24,00
35,75
Milli
on
Eu
ro
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PacTech Quality System Overview and Roadmap
PacTech GmbH has more than 18 years of quality manufacturing
experience in semiconductor industry
All PacTech sites are certified according to ISO quality system
standards
PacTech Germany – ISO 9001 & TS16949
PacTech USA – ISO 9001
PacTech Asia – ISO 9001 & ISO 14001
PacTech Asia is in progress for ISO/TS16949 certification
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Worldwide Subcontractor Services
Wafer Level Bumping & Packaging
Subcon Locations Available Processes Technology Roadmap
PacTech Asia
Penang, Malaysia
55,000 sqft
PacTech Europe
Nauen, Germany
20,000 sqft
PacTech USA
Santa Clara, CA, USA
10,000 sqft
Wafer Bumping
UBM & OPM Plating, e.g. eless NiAu
& NiPdAu, e-plate Cu & Au
NiFe Plating for MEMS
Solder Ball Attach / Solder Jetting
Wafer Level RDL (Low Volume)
CSP & BGA Ball Rework
Wafer Backside Metallization
Wafer Thinning
Single Wafer Etch
TiNiAg & TiNiAu Evaporation
Backend & Die Sort
Laser Marking, Sawing, Electrical Test,
Tape & Reel
FC-Assembly
Inspection
AOI
X-Ray Inspection
2014
Cu Pillars
Cu RDL
Die Embedding (fan out)
50µm Wafer Thinning
2015
Laser Dicing
TSV
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Advanced Packaging Equipment
PacTech Asia PacTech Europe PacTech USA
Sales & Demo Centre
Solder Jetting & BGA Rework/Repair:
SB²-M, SB²-SM, SB²-Jet
Wafer Level Solder Balling:
Ultra-SB² 200/300
Wafer Level Solder Rework/Repair:
Ultra-SB² 200/300 WLR
Flip Chip Bonder:
LAPLACE- FC, LAPLACE-Cap/-Can
Electroless Bumping Line:
PacLine 200/300 A50
Spin Coating System:
SpinPac ASC 200/300
Plasma Cleaning/Ashing:
PlasPac 200
Wafer Backside Marking:
LS² 200/300
Customized equipment for photovoltaic & solar
industry
LAPLACE-SOLTEC, LAPLACE-HT
Reflow Oven:
RFM/RFA 200/300
Sales & Demo Centre
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Business Unit A
Wafer Level Bumping & Packaging
- Subcontractor Service -
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PacTech’s WLP Services Overview
60%15%
10%
8%4% 3%
Fields of Application
Handphone/Tablet
Computer/ConsumerElectronics
Automotive
Medical
Defense/Aerospace
Others
25%
50%
10%
7%
4% 2% 2%
Device Types
Discretes
Power MOSFET
RFID
Filters
Optoelectronics
MEMS
Others
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Business Unit
Wafer Level Bumping & Packaging
- Wafer Level UBM -
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Electroless NiAu / NiPdAu Plating & Bumping Services
1. E-less Bumping RFID attach by adhesive on
antenna
LCD driver
2. E-less UBM
for solder ball
attach
Wafer Level CSP
Flip chip
3. E-less OPM
for fine pitch wire
bonding
Automotive high rel./ high
temp. wire bonding
Copper wire bonding
Wire bonding on active pad
Aluminum or Copper
4. E-less Metallization
for Power MOSFET
application
Clip attached
Wire bonding and soldering
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Process Flow – Ni/Au & Ni/Pd/Au Bumping
Al Pad
Zinkating
Cu Pad
Pd Seed
Ni Plating
Pd Barrier
Flash Au
OPM for Wire Bonding
Flash Au
UBM for FC & WLCSP
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PacTech Group Worldwide
Wafer Bumping Capacity - ENIG
0 K
400 K
800 K
PacTech Europe PacTech USA PacTech Asia
4"-8" Wafer/Year 600 600 600
12" Wafer/Year 450 450 450
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Business Unit
Wafer Level Bumping & Packaging
- Wafer Level Solder Bumping -
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Solder Bumping and Other Applications
1. Solder ball Attach Wafer Level CSP
2. Solder ball Attach Flip Chip bumps
3. Fluxless and speciality
laser assisted solder
attach
3D HDD modules
3D Camera modules
High rel. Aerospace solder
bumping
Rework and Repair
4. Customized Soldering
of components attached
on wafers, single dies and
substrates
Special capacitor resistor
and component attach on
wafer level
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Wafer Level Solder Sphere Transfer 1/4
Vacuum picking of
solder spheres from
reservoir to stencil
Removal of excess
balls by US
&
optical inspection of
balls in stencil
Bond Tool
Mask
Solder Ball
Vibration
Vacuum
Air knife
Floating Solder
Balls by US
Jumping Solder Balls
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Wafer Level Solder Sphere Transfer 2/4
Placement of solder
spheres
&
optical inspection of
balls on wafer
Per robot back to
cassette
Next step: Reflow
Mask
Wafer
Solder Ball
UBM
Flux
Bond Tool
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Wafer Level Solder Sphere Transfer 3/4
Ultra-SB² 200/300 Dual end effector & Pre-aligner
Stencil mounted on vacuum
transfer head200/300mm wafer chuck
Solder Ball Transfer by Ultra-SB²
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Solder Sphere Jetting (SB²) 1/2
Schematic diagram of Solder Ball Bumping (SB²) process:
Ball ReservoirLaser
Optical sensor
Pressure sensorN2
Optical
sensors
Capillary
Search levelN2 gas
Reflowed
solder balls
Semiconductor wafer
Singulation Disk
Bond pad
Bond level
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Solder Sphere Jetting (SB²) 2/2
Process video for solder jetting and solder stacking
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Business Unit B
Advanced Packaging Equipment
- Manufacturing & Sales -
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PacTech Equipment
BGA, CSP Solder Rework
SB²-M SB²-SM
Solder Jetting
SB²-Jet
Solder Jetting
Wafer Level Solder Balling
Ultra-SB² 300 Ultra-SB² 300 WLR
WL Solder Ball Rework
PacLine 300 A50
Electroless Plating Line
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PacTech Equipment
Wafer Level Flux Cleaning
MegaPac 200/300 SpinPac ASC 200/300
Wafer Level Spin Coater
Reflow Oven RFM 300
Wafer Level Reflow
Plasma Cleaning
PlasPac 200/300 Ultra-SB² 300 WLR
High Throughput Laser
Bonding
LAPLACE-FC
Flip Chip Bonding
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Equipment for Electroless Ni/Au UBM
Turnkey Solution
- Equipment
- Process
- Chemistry
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Turnkey Bumping Solutions
One Source!
Volume Wafer Bumping matched to Customer’s Supply Chain Requirements.
3 location worldwide:
2nd sourcing!
Development Support in customer’s R&D Center Time Zone
Turnkey Process Transfer to customer possible at Any Time
Worldwide Support and Highest Quality
through Turnkey Process Ownership!
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Business DevelopmentInstalled Equipment for ENIG & ENEPIG UBM/OPM & Technology Transfer/Licenses of PacTech
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PacLine 300 A50ENEPIG Plating Systems in the Field @ major OEM’s
300 mm
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PacLine 300 A50
Parallel processing of multiple baskets
UPH: ~150 wafer 8"/hour or ~75 wafer 12"/hour (5µm Ni/Au UBM)
Automated Ni tank maintenance while process is running
Ni bath control with ConPac 2.0 bath conditioner & control set
Siemens PLC with Profi Bus system
Additional security tanks for each module and pump system
Automatic chemical delivery & drain system
Design will be adapted to customer’s facility
Multi recipe software management & SECS GEM Interfacing
User interface for interactive failure dignostic & troubleshooting
The system fulfills the fire safety standard FM 49100
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Business Unit
SB²-Jet Equipment
- Laser assisted Solder Jetting -
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PacTech Equipment for Solder Jetting
BGA, CSP Solder Rework
SB²-M SB²-SM
Solder Jetting
SB²-Jet
Solder Jetting
Solder Jetting for Camera
Modules
SB²-SMs SB²-Jet-SG
Solder Jetting for
HGA & HSA
SB²-SM R2R
Solder Jetting on flexible
Substrates
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Advantages of SB2 Solder Jetting
Solder ball diameter capability:
- 40µm - 760µm (qualified for volume production)
- 30µm (in qualification)
Solder alloys: SnAgCu, SnAg, SnPb, AuSn, InSn, SnBi
No tooling
No flux
No mechanical stress/contact
No thermal stress
No additional reflow
No cleaning of flux residues
Fine pitch applications (< 80µm)
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SB2 - Jet Applications
BGA / cLCC Balling
Rework/ Repair of BGA-like packages
Hard Disk Drive (HGA, HSA, Hook-Up)
Camera Modules
Wafer Bumping
Wafer Level CSP Bumping
Optoelectronics/ Microoptics
Filter Devices (SAW, BAW)
MEMS & 3D-Packaging
HGA for HDD (Source: Seagate)
Solder Jetting for Microoptics
Reworked Package
Camera Module
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SB2 – Solder Jet Speed & Ball Diameter:
Roadmap
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Business Unit
Equipment for
- Wafer Level Solder Ball Transfer-
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Process Flow Ultra-SB2 300
Wafer Loading
Fluxing
Solder Ball Vacuum Pick-up (US agitation)
High Speed 2D Wafer Inspection (Stencil)
Alignment of Stencil to Wafer (Dual Camera)
Solder Ball Transfer to Wafer
High Speed 2D Inspection (Wafer)
Reflow
Wafer Unloading
Standard
Optional
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Automatic Wafer Level Solder Ball Transfer with
Ultra-SB2 300
Cassette to Cassette robot handling for wafer up to 12"
Integrated rework capability for yield Improvement
(optional)
2x optical inspection (optional)
ball sizes: 60µm - 500µm
Integrating fluxing (optional)
Integrated reflow oven (optional)
UPH 8" >40 wafer/hour *
UPH 12" >25 wafer/hour *
* depending on ball size and on I/O count
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Application for Mirco Ball Placement with
Ultra-SB2
8" wafer
Pitch 200µm
400,000 I/O’s
100µm SnAgCu
12" wafer
Pitch 225µm
740,000 I/O’s
100µm SnAgCu
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Business Unit
Equipment for
- Wafer Level Solder Ball Rework -
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Process Flow Ultra-SB2 300
Wafer Loading
Wafer Alignment
High Speed 2D Wafer Inspection
Removal of misaligned & excessive balls
Re-fluxing of repair locations (dispense)
Placement of spheres
High Speed 2D Wafer Inspection
Wafer Unloading
Standard
Optional
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Automatic Wafer Level Solder Ball Rework with
Ultra-SB2 300 WLR for yield improvement
Cassette to Cassette robot handling for wafer up to 12"
Integrated 2-D AOI
- missing ball
- double ball
- ball shape etc.
Integrated rework capability for yield improvement
- single ball placement
- single ball removal
Ball sizes: 60µm - 500µm
UPH 8" ~25 wafer/hour
UPH 12" ~25 wafer/hour
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Business Unit
LAPLACE Equipment for
- Flip Chip Bonding
- Capacitor Bonding
- Cantilever Bonding
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LAPLACE with Reel-To-Reel-System
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LAPLACE Flip Chip Bonding
Flip Chip placement
and laser reflow
Final assembled Flip
Chip
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LAPLACE Capacitor Bonding
LAPLACE Capacitor Attach on PCB
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Cantilever Assembly Line for Probe Cards
3. Cantilever Bonder1. Cantilever Sorter
Input: MEMS substrates
Inspection of cantilever
Laser cutting with the Laser
Placement of cantilever in
waffle packs
Solder Jetting on
ceramic substrate
Solder Balls sizes:
30 – 760 µm
Solder alloys capability:
PbSn, SnAgCu or AuSn
Cantilever supplied in waffle packs
Cantilever pick & rotation in vertical position
Substrate height measurement
Dual camera for x, y alignment of cantilever
to the substrate
Probe tip z alignment
Laser bonding of cantilever
Post inspection
Cantilever rework capability
2. SB2-Jet: Solder Jetting
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Cantilever Bonder Specifications
Linear axis or gantry system
Probe card sizes up to 13 inch
Full process control
Alignment control by position bonding
Placement Accuracy: down to +/- 2µm
High power laser for bond reflow
Height control: 1µm accuracy
Cantilever thickness: 20 – 100µm
Pitch: down to 60µm
High mechanical stability of probes
Process suitable for rework and complete card assembly
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Global Sales
Global Marketing
EUROPE: [email protected]
ASIA: [email protected]
USA: [email protected]
Contacts