Introduc)ontoVLSIDesign(DEE4539/1049)

AnOverviewofVLSISystemDesigninAutumn2018

ByChen-YiLee,Sep.142018@ED220DepartmentofElectronicsEngineering,

NaConalChiaoTungUniversity

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CourseOutline

•  TheEvoluConofElectronicProducts•  WhyVLSI–forbePerlife•  FromApplicaConstoChips•  FromTransistorstoSystem-LevelIntegraCon•  GradingRules

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EvoluConinElectronicProducts(1/3)

•  CompuCngTrend–  Main-Frame->PC->NPC/MP->Cloud(DataCenter)->Fog->Edge(Devices)

•  CommunicaCons(Internet)–  Analog->Digital(GSM)->3G->4G->5G…–  Enhancedatarate(>1Gbps)

•  ConsumerProducts–  Homeappliances->mobiledevices->Internet-of-Things(IoT)->Internet-of-Everything(IoE)…

– MedicalIoTforprevenConmedicine–  IndustrialIoTforIndustry4.0(ProducCvity)–  Self-drivingvehicles

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EvoluConinElectronicProducts(2/3)

•  ElectronicProductsmainlyconsistof3layers:– ApplicaCon– OperaConsystem(OS)– HardwaremodulesorSystem-on-Chip(SoC’s)

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EvoluConinElectronicProducts(3/3)

•  Astechnologyadvances,manyfuncConalmodulesarenowintegratedinonechip(SoC),whichmaycoverseveralapplicaConstandardswithvariousservice-drivenAPP’s.

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WhyVLSI! •  WiththeadvancesofVLSItechnology,newsystemsandapplicaCons(services)canbeinvesCgatedtoreachbePerlife.

•  MobilePhones:seamlessconnecCons•  SmartHomeAppliances:enjoyhomelife•  BiomedicalDevices:prevenConmedicine,precise(personalized)medicine

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DeepLearningSoC’s(AI)

•  De-clouding:intelligencecanbeachievedinlocaldevices,insteadofcloud(datacenter)–  SeeiLitechnology.

•  Variousdeeplearningchipshavebeenpublishedinconferences/journals

•  Performancedependsonhowmanyneuronsandmemory-bandwidthareallowed,especiallydealingwithreal-Cmetests(inference).

•  SeeiLiWearabletranslatoratCES2016.

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FromApplicaConstoChips(1/2)

•  ApplicaConstobedefinedclearlysothatend-users(orcustomers)woudliketopayformoreservices,i.e.self-definedsystemspecs.

•  EssenCalchipscanenablenewapplicaConsandservices,e.g.A#chipsfromAppleforvariousiXproductlines

•  Therestchips/modulescanbepurchasedfromothercompanies.

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iPhoneXCostAnalysis

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•  CostStructureforiPhoneX

FromApplicaConstoChips(2/2)

•  Chipstobedevelopedhavetoreachacertainvolumessothatoverallcostcanbesharedbyeachdie,especiallyforadvancedprocessnodes(e.g.tsmc28/16/10/7nm).

•  FuncConalmodulescanbere-usedasnewsystem/applicaConislaunchedtosavedesigncycle,leadingtoanIP-baseddesignapproach.

•  OnlyafewcompaniesareaffordabletouseadvancedtechnologyformassproducConbecauseofinvestment,leadingtoconsolidaConofchipdesigncompanies.

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FromTransistortoSystem(1/2)

•  TransistoristhebasicelectronicdevicewhichcanbeassembledtoachieveallkindsoffuncCons–frombasiclogicgates,arithmeCcoperators,tocomplexsystems.

•  ThesehardwaremodulescanbededicatedtocertainapplicaConrequirements(e.g.applicaCon-specificintegratedcircuitsorASIC)orcanbeprogrammedbysomware(e.g.generalprocessingunitorGPU).

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FromTransistortoSystem(2/2)

•  InaddiContomeeCngthosecomputaConalrequirementsforreal-Cmeprocessing,it’snecessarytoreducepowerconsumpConandachievebePerenergy-efficientdesignsduetotheconstraintoflimitedbaPerylife.

•  SincemanyelectronicdevicesaremainlyformobileapplicaCons,low-powerdesignbecomesakeyissueforcurrentchip’sproviders.Youneedtoknowwhereisthepower-consumingsourceandfindsomesoluConstoreducepowerconsumpConforbothoperaConandidlemodes.

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GradingRules

•  2exams(70%)– 35%formid-termexam– 35%forfinal-termexam

•  2projects(30%)– 10%forproject1on8-bitAdder– 20%forproject2on6X6MAC

•  BonusviaExercises(10%)– 2%foreachexercise

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OtherIssues

•  Referencebook(CMOSVLSIDesign,byWesteandHarris)–"CMOSVLSIDesign—AcircuitsandsystemsPerspecCve"(3rdEdiConfromAddisonWesley,ISBN:0-321-26977-2)

•  Coursewebsite– hPp://si2.ee.nctu.edu.tw/course/vlsi2018

•  Officehours– EveryWed.Morning10-12AM(reservedbyemail)

•  TA– 呂蘊文、張育銘、曾駿哲(ext.54238;ED430)

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