Microsoft Word - IPC-A-600G--.doc ======================================================================
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IPC-A-600 2.0 (Externally Obsevable Characteristics) 2.1 (Board Edges)
2.1.1 (Burrs) : 2.1.1.1 (Nonmetallic Burrs) Acceptable : 2.1.1.2 (Metallic Burrs) Acceptable : , (loose burrs) 2.1.2 (Nicks) Acceptable : a. b. 2.5mm 50% 2.1.3 / (Haloing) Acceptable : (penetration) 2.5mm 50%
2.2 (Base Material Surface) 2.2.1 (Weave Exposure) : Acceptable : ,
2.2.2 (Weave Texture) Acceptable : ,
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2.2.3 / (Exposed / Disrupted Fibers) Acceptable : ,
2.2.4 (Pits and Voids) Acceptable : 1. 0.8mm 2. 5% () 3.
2.3 (Base material Subsurface) 2.3.1 (Measling) : Acceptable : , ,
2.3.2 (Crazing) : Measling Acceptable : a.
b. 50% c. d. , 2.5mm
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2.3.3 / () (Delamination / Blister) : Acceptable : a. , 1% b. c. 25%
d. e. , 2.5mm
2.3.4 (Foreign Inclusions) Acceptable : a. , b. , ( IPC-6010) c. 2.4 Solder Coatings and Fused Tin Lead
2.4.1 () (Nonwetting) : Acceptable : ,
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2.4.2 (Dewetting) : Acceptable : Class 1, 2, 3 a. , , b. 5% Class 1
a. 15%
2.5 Holes – Plated-Through – General 2.5.1 / (Nodules / Burrs) Acceptable :
2.5.2 (Pink Ring) : , 2.5.3 (Voids – Copper Plating) : Acceptable : Class 3 : Class 2 : a. 5%
b. 5% (hole length ??) c. 90
Class 1 : a. 10% d. 10% (hole length ??) e. 90
2.5.4 (Void - Finished Coating)
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Acceptable : Class 3 : a. 1 b. 5%
c. 5% (hole length ??) d. 90 Class 2 : a. 3 b. 5%
c. 5% (hole length ??) d. 90 Class 1 : a. 5 b. 15%
c. 10% (hole length ??) d. 90 2.5.5 (Lifted Lands- Visual) : Acceptable : Class 1, 2, 3 : 2.6 NPTH (Holes – Unsupported) 2.6.1 (Haloing) : Acceptable : 50%, 2.5mm
2.7 (Printed Contacts) 2.7.1 – (Surface plating – Critical Contact Area) Acceptable : Class 1, 2, 3 a. . . b. Pit and Dent 0.15mm, 3 , 30% Class 3 (Gap /Overlap Area) a. , 0.8mm Class 2 (Gap /Overlap Area) a. , 1.25mm Class 1 (Gap /Overlap Area)
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a. , 2.5mm : Critical Contact Area : 0.15mm : 2.7.1.1 Pad (Surface Plating –Wire bond Pads) : Acceptable : (Pristine Area) . . . 0.8um RMS (root-mean-square) : Pristine Area : pad 80% 2.7.2 - (Burrs on Edge-board contacts) => Acceptable : . . (). . 2.7.3 (Adhesive of Overplate) Acceptable : (Overhang) , ( tape ) 2.8 (Marking) :
2.8.1 Etching Marking () Acceptable : Class 3
a. b. c.
Class 2 a. b. c. 50%
2.8.2 (Screened or Ink Stamped Markiing) Acceptable : Class 1, 2, 3
a. , ring b. , c. d. 25pitch SMD, , 0.002” e. 25pitch SMD, , 0.001”
2.9 (Solder Resist / Solder Mask) 2.9.1 (Coverage Over Conductors – Skip Coverage) Acceptable : Class 2, 3
a.
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Class 1 a. , 50%
2.9.2 (Registration to Hole –All Finished) Acceptable : a. , Ring
b. , c.
2.9.3 (Registration to Other Conductive Pattern) Acceptable : a.
b. c. 25pitch SMD, , 0.002” d. 25pitch SMD, , 0.001”
2.9.3.1 BGA - S/M opening BGA Pad (Ball Grid Array – Solder Resist–defined Lands) Acceptable : 90
2.9.3.2 BGA- S/M opening BGA Pad (Ball Grid Array - Copper-Defined Lands) Acceptable :
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2.9.3.3 BGA – (Ball Grid Array – Solder Dam) : Acceptable : 2.9.4 / (Blisters / Delamination) Acceptable : Class 2, 3
a. 2 , 0.25mm b. 25%,
Class 1 a.
2.9.5 (Adhesion – Flaking or Peeling) Acceptable : 6010 2.9.6 / (Waves / Wrinkles / Ripples) Acceptable : a.
2.9.7 (Tenting – Via Holes) : Acceptable : , 2.9.8 (Soda Strawing) : Acceptable : a. ,
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b.
2.10 -- (Pattern Definition -- Dimension) 2.10.1 / (Conductor Width and Spacing) : 2.10.1.1 (Conductor Width) : Acceptable : Class 2, 3
a. , 20% b. 10% 13mm (?)
Class 1 a. , 30% b. 10% 25mm (?)
2.10.1.2 (Conductor Spacing) : Acceptable : Class 3 a. . , 20% Class 1, 2
a. . , 30%
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2.10.2 – (External Annular Ring – Measurement)
2.10.3 – PTH (External Annular ring – Supported Holes) Acceptable : Class 3 ,
a. ring 0.0020” b. Pad , ring Ring 20%
Class 2 a. 90 b. , 80%, 0.0020”
Class 1 a. 180 b. , 70%
2.10.4
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(External Annular ring – Unsupported Holes) Acceptable : Class 3
a. ring 0.00591”, Pad , ring Ring 20%
Class 2 a. 90 b. , 20%
Class 1 a. 90 b. , 30%
2.11 (Flatness) : Acceptable : Class 1, 2, 3
a. SMD , 0.75% b. SMD , 1.50%
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3.0 (Internally Observable Characteristics)
3.1 (Dielectric Materials) Thermal stress 3.1.1 (Laminate Voids – Outside thermal Zone)
Notes: 1. (Zone A) : 0.08mm 2. (anomalies, imperfactions) , 3. Zone A , B
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Acceptable : Class 2, 3 a. 0.08mm, b. 2 PTH , 0.08mm
Class 1 a. 0.15mm, b. 2 PTH , 0.08mm
3.1.2 (Registration – conductors to Holes) : 3.1.3 -NPTH /(Clearance Hole,Unsupported,to Power/Ground Planes) Acceptable : a. / b. ()
3.1.4 / (Delamination / Blister) : Acceptable : Class 2, 3
a. Class 1
a. 2.3.3
3.1.5 (Etchback) / (Negative Etchback) 3.1.5.1 (Etchback) Target : Class 1, 2, 3 : : 0.013mm Acceptable : Class 1, 2, 3
a. 0.005mm ~ 0.08mm b. Shadowiing is permitted on one side of each land.
3.1.5.2 (Negative Etchback) Target : Class 1, 2, 3 : 0.0025mm Acceptable : Class 3 : 0.013mm Class 1, 2 : 0.025mm 3.1.6 (Smear Removal) : Accdeptable : Class 1, 2, 3
a. 0.001” b. 0.001” ,
( 3.1.5.1 ) <?> c. 3.3.13
3.1.7 PTH ,,(Dielectric Material,Clearance, Metal Plane for Support Holes) Acceptable : a. 0.1mm
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3.1.8 ( – ) (Layer-to-Layer Spacing) : : () Acceptable : 0.09mm Note : 90.0um, 25.0um 3.1.9 (Resin Recession) : Acceptable : Class 1,2,3
3.2 (Conductive Patterns – General)
3.2.1 (Etching Characteristics) (Etching Factor) (Overhanh) (Outgrowth) (Undercut) : , Overhang Outgrowth ( IPC-600g.321i)
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3.2.2 (Print and Etch) : Target : Acceptable : 3.2.3 (Surface conductor Thickness – Foil Plus Plating) Acceptable : 3-1 : a. : Class 1, 2 : 787u”, Class 3 : 984u” ** 1/2 oz , 1/2 oz ()
3.2.4 (Foil Thickness – Internal layers) Acceptable : 3-2 : a. : Class 1, 2 : 787u”, Class 3 : 984u” ** ,
3.3 (Plated-Through Holes – Gereral) a. : 3 b. IPC-6010
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3.3.1 (Annular Ring – Internal Layers) Acceptable : Class 3
a. 0.025mm Class 1, 2
a. 2.10.1.1
3.3.2 (Lifted Lands – Cross-Sections) Acceptable : a. , 3.3.3 (foil Crack –Internal Foil) “C” Crack Acceptable : Class 2, 3 : Class 1 : ,
3.3.4 (foil Crack –External Foil) Acceptable : Class 1, 2, 3 : Class 1 : ,
3.3.5 (Plating Crack – Barrel) “E” Crack Acceptable : 3.3.6 (Plating Crack – Corner) “F” Crack Acceptable :
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3.3.7 (Plating Nodules) Acceptable : 3.3.8 (Copper Plating thickness – Hole Wall) Acceptable : IPC-6010 3.3.9 (Plating Voids) Acceptable : Class 2, 3
a. () b. 5% c. d. 90
Class 1 a. 3 () b. 5% c. d. 90
3.3.10 (Solder Coating Thickness – Only When Specified) Acceptable : a. , , 3.3.11 (Solder Resist Thickness) : Acceptable : 3.3.12 (Wicking) : , Acceptable : Class 3 : 80 um (3.150 u”) Class 2 : 100 um (3.937 u”) Class 1 : 125 um (4.291 u”)
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3.3.12.1 , (Wicking, Clearance Holes) Acceptable : Class 3 : 80 um (3.150 u”) Class 2 : 100 um (3.937 u”) Class 1 : 125 um (4.291 u”) 3.3.13 - (Innerlayer Separation – Vertical [Axial] Microsection) Acceptable : Class 2, 3 : Class 1 : , 20% 3.3.14 – (Innerlayer Separation – Horizontal [transverse] Microsection) Acceptable : Class 2, 3 : Class 1 : , , 3.3.15 (Material Fill of Blind and Buried Vias) : Acceptable : Class 2, 3 : 60% Class 1 : Buried vias completely void of fill material.
3.4 – (Plating Through Holes – Drilled)
3.4.1 (Burrs) Acceptable : Class 1, 2, 3 :
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3.4.2 (Nailheading) : Acceptable : ,
3.5 – (Plated-Through Holes – Punched)
3.5.1 (Roughness and Nodules) : Acceptable : Class 1, 2, 3 : 3.5.2 (Flare) : Acceptable : Class 1, 2, 3 : Ring
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4.0 (Miscellaneous) 4.1 (Flexible and rigid-Flex Printed Wiring) Type 1. , , Type 2. , 2 , Type 3. , 3 , Type 4. -, 3 , Type 5. -, 2 , 4.1.1 (Coverlayer Coverage – Conerfilm Separation) Acceptable : Class 1,2,3
a. , 0.80mm * 0.80mm, 1.0mm b. 3 , 25mm* 25mm c. 25% d. coverlayer ,
4.1.2 (Coverlayer / Cover Coat coverage – Adhesives) 4.1.2.1 (Adhesive Squeeze-out – Land Area) Acceptable :Class 3 : 0.05mm (360 ) Class 2 : 0.05mm (270 ) Class 1 : (240 )
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a. 1oz , 0.2mm b. 1oz , 0.4mm
Class 1, 2 : c. 1oz , 0.3mm d. 1oz , 0.5mm
4.1.3 /(Access Hole Registration for Coverlayer and Stiffeners) Acceptable : Class 3 : a. PTH , 0.05mm (360 ) b. PTH , 0.05mm Class 2 : 0.05mm (270 ) Class 1 : (180 )
4.1.4 (Plating Defects) Acceptable : Class 1, 2, 3
a. b. , c. , d. , e. . . , f.
4.1.5 (Stiffener Bonding) Acceptable : a. ,
b. 0.055kg/mm (page 104)
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4.1.6 (Transition Zone, Rigid Area to flexible Area) 1.5mm Acceptable : Class 1, 2, 3
a. b. (Dielectric) c. d.
4.1.7 , / (Solder Wicking / Plating Migration Under Coverlayer) Acceptable : Class 3
a. 0.3mm b. c.
Class 2 a. 0.5mm b. c.
Class 1 a. b.
c.
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4.1.8 (Laminate Integrity)
4.1.8.1 — (Laminate Integrity – Flexible Print Wiring ) Acceptable : Class 1, 2, 3
a. A b. B , 0.020” : a. (A ) : Pad 0.0031” b. ,
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4.1.8.2 – / (Laminate Integrity – Rigid-Flex Print Wiring )
Acceptable : Class 2, 3 a. A
c. B , 0.0031” d. B , 0.020”
Class 1 a. A b. B -, 0.0059”
: a. (A ) : Pad 0.0031”
b. ,
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4.1.9 – 3. 4 (Etchback (Type 3 and Type 4 Only)
Acceptable : Class 1, 2, 3
a. 0.0031” b. (Shadowing)
4.1.10 - 3 4 (Smear Romoval (Type 3 and 4 Only) )
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Acceptable : Class 1, 2, 3
a. 0.001” b. Random tear or gouges that produce small areas where the
3.3.13 0.025 mm [0.001 in] depth is exceeded provided dielectric spacing is maintained.
4.1.11 / (Trimmed Edges / Edge Delamination)
Acceptable : Class 1, 2, 3 a. b. , c. d. NPTH ,
50%, 2.5mm () 4.2 (Metal Core Printed Boards)
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4.2.1 Type Classifications ------------------------------------------------------------------------ 4.2.2 Spacing laminated Type -------------------------------------------------------------------------- 4.2.3 Insulation Thickness, Insulated Metal Substrate --------------------------------------- 4.2.4 Insulation material Fill, Laminated Type Metal Cord ---------------------------------------- 4.2.5 Crack in Insulation Fill, Laminated Type --------------------------------------------------- 4.2.6 Core bond to Plated-through Hole Wall -------------------------------------------------------
4.3 (Flush Printed Boards) 4.3.1 Flushness of Surface Conductor ---------------------------------------------------------------- 5.0 (Clearliness Testing)
, 1. 2. . , 3. , ,
4. 5. , ,
6. ,
5.1 (Solderability Testing) , ANSI/J-STD-003
a. Test A : Edge dip Test (for surface conductors abd atachment lands only) b. Test B : Rotary Dip Test (for plated-through Holes, surface conductors and attachment lands, solder source side) c. Test C : Solder float Test (for plated-through holes, surface conductors and attachment lands, solder source side) d. Test D : Wave Solder Test (for plated-through holes, surface conductors and attachment lands, solder source side) e. Test E :
5.1.1 (Plated-Through Holes) Acceptable : class 1, 2, 3
a. b. There are serval plugged holes less than 1.5 mm [0.0591 in] diameter.
5.2 Electrical Integrity ----------------------------------------------------------------------------------------