ipc industry mapping

7/25/2019 IPC Industry Mapping

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IPC/JEDEC

INDUSTRY MAPPING

Agenda Item 6.2

4th JIC meeting Regens!"g# Ge"man$ J!ne % 2''(


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Minimum IPC Standards Tool Kit

Materials

SM-840 Solder mask

FD-2231 Flex material

FD-2232 Coated material

MF-150 Copper foilCF-148 Coated copper foil

CC-830 Conformal coating

SM-81 !d"esi#e

4101 $igid materials

4104 %D& materials

Workmanship

!-'00 (rinted )oard

!-'10 (rinted )oard assem)l*

$-00 Modification and repair

Quality Assessment

+M-'50 +est met"ods

SPC,1,0

,1,1 eneric

,1,2 .ase materials

,1,3.oard

,1,4 !ssem)l*

Design2221 eneric

2222 $igid

2223 Flex

2224 (CMC&!

2225 MCM-/

222' %D&

222 Discrete iring

Performance

'011 eneric

'012 $igid

'013 Flex

'014 (CMC&!

'015 MCM-/

'01' %D&

'01 Discrete iring

Component Mounting

01 eneric

02 +"rog"-"ole03 Standard SM+

04 Fine pitc"

05 !rra* prodct

0' C"ip scale

0 C"ip ire )onding

08 Flip c"ip

Attachment

-S+D-001Soldering reirements

-S+D-002 Soldera)ilit* testing of parts

-S+D-003 Soldera)ilit* of )oards

-S+D-004 Solder Flx

-S+D-005 Solder paste

-S+D-00' Solid solder

Minimum Tool Kit


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IPC STANDARDS MAP


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IPC STANDARDS MAP (cont.)


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ASSEMBLY

J)STD)''%Soldering Electrical and Electronic Assemblies

IPC)*D+,)''%

Handbook & Guide to Supplement J-STD-001

IPC)-26%n-!rocess D!"# and Estimated $ield %or !As

IPC)&-%2

'alculation o% D!"# & "anu%acturing ndices %or !rinted

(oard Assemblies


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ACCEPTANCE

IPC)DRM)4'T)roug)-Hole Solder Joint E*aluation Desk +e%erence "anual

IPC)A)6%'

Acceptabilit, o% Electronic Assemblies

IPC)-%-%

General Guidelines %or mplementation o% Statistical !rocess'ontrol S!'.

IPC)DRM)SMT

Sur%ace "ount Solder Joint E*aluation Desk +e%erence "anual


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SLDERABILITY

IPC)P)''%

Soldering 'apabilit, )ite !aper +eport

J)STD)''2

Solderabilit, Tests %or 'omponent /eads Terminations /ugsTerminals and ires

J)STD)''(Solderabilit, Tests %or !rinted (oards

IPC)P)''

!( Sur%ace inis)es

IPC)TR)46%

Solderabilit, E*aluation o% T)ick & T)in used 'oatings IPC)TR)462

Solderabilit, E*aluation o% !rinted (oards 2it) !rotecti*e'oatings #*er /ong-Term Storage


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SLDERABILITY (cont.)

IPC)TR)464

Accelerated Aging %or Solderabilit, E*aluations

IPC)TR)46)%

+ound +obin Test on Steam Ager Temperature 'ontrol Stabilit,

IPC)TR)46)2

T)e E%%ect o% Steam Aging Time and Temperature on Solderabilit,Test +esults

IPC)TR)46)(

E*aluation o% Steam Aging on Alternati*e inis)es !)ase 11A

IPC)TR)466

etting (alance Standard eig)t 'omparison Test


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AD!ANCED

IPC)TR)''%

An ntroduction to Tape Automated (onding ine !itc) Tec)nolog,

IPC)P)''(

')ip "ounting Tec)nolog,

J)STD)'%2

mplementation o% lip ')ip and ')ip Scale Tec)nolog,

J)STD)'%(

mplementation o% (all Grid Arra, & #t)er Hig) Densit, Tec)nolog,

J)STD)'26

Semiconductor Design Standard %or lip ')ip Applications

J)STD)'20

!er%ormance Standard %or 'onstruction o% lip ')ip and ')ip Scale

(umps IPC)SM)&04

Guidelines %or ')ip-on-(oard Tec)nolog, mplementation

IPC)MC)&-'

Guidelines %or "ultic)ip "odule Tec)nolog, 3tili4ation


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"IRE #ARNESS

IPC)*MA)A)62'+e5uirements & Acceptance %or 'able & ire

Harness Assemblies


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ASSEMBLY S$PPRT SMC)P)''2

Solderabilit, Tests %or 'omponent /eads Terminations /ugs

Terminals and ires

IPC)DRM)%0

'omponent denti%ication Desk +e%erence "anual

IPC)D)426

Speci%ication %or Assembl, o% Discrete iring IPC)TR)0%

!' !)ase 'ontrolled Atmosp)ere Soldering Stud,

IPC)TA)&22

Tec)nolog, Assessment Handbook on Soldering

IPC)TA)&2(

Tec)nolog, Assessment Handbook on Sur%ace "ounting

IPC)CM)&&'

'omponent "ounting Guidelines %or !rinted (oards


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ASSEMBLY S$PPRT(cont.) IPC)SM)&0'

'omponent !ackaging and nterconnecting 2it) Emp)asis on

Sur%ace "ounting

IPC)SM)&0

Guidelines %or Accelerated +eliabilit, Testing o% Sur%ace "ount

Attac)ments

IPC)S)0%6S"T !rocess Guideline & ')ecklist

IPC)AJ)02'

Assembl, & Joining Handbook

IPC)TP)%%%Selection and mplementation Strateg, %or A /o2-+esidue 6o-

'lean !rocess

IPC)%&2'

Assembl, 7uali%ication !ro%ile


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ASSEMBLY S$PPRT(cont.)

IPC)&'-

Design and Assembl, !rocess mplementation %or (GA8s

IPC)&2

Stencil Design Guidelines

IPC)&('

Guidelines %or Temperature !ro%iling %or "ass Soldering +e%lo2 &

a*e. !rocesses

IPC)&&%%

+e2ork o% Electronic Assemblies

IPC)&&2%

+epair and "odi%ication o% !rinted (oards and Electronic Assemblies

IPC)-&'%!er%ormance Test "et)ods and 7uali%ication +e5uirements %or Sur%ace "ountSolder Attac)ments

IPC)-0%E5uipment nter%ace Speci%ication


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ASSEMBLY MATERIALS

J)STD)''4

+e5uirements %or Soldering lu9es

J)STD)''

+e5uirements %or Soldering !astes

J)STD)''6

+e5uirements %or Electronic Grade Solder Allo,s and lu9edand 6on-lu9ed Solid Solders

IPC)TP)%'4(

!' 'leaning and 'leanliness Test !rogram !)ase : aterSoluble lu9es !art 1

IPC)TP)%'44

!' 'leaning and 'leanliness Test !rogram !)ase : aterSoluble lu9es !art ;

1U3/SDER


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ASSEMBLY MATERIALS (cont.)

AD*ESI5ES

IPC)SM)0%&General +e5uirements %or Dielectric Sur%ace "ountingAd)esi*es

IPC)CA)02%General +e5uirements %or T)ermall, 'onducti*e Ad)esi*es

IPC)(4'6Guidelines %or Electricall, 'onducti*e Sur%ace "ountAd)esi*es

IPC)(4'0General +e5uirements %or Anisotropicall, 'onducti*eAd)esi*es ilms


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ASSEMBLY MATERIALS (cont.)

IPC)CC)0('

7uali%ication and !er%ormance o% Electrical nsulating

'ompound %or !rinted iring Assemblies

IPC)*D+,)0('Guidelines %or Design Selection and Application o%

'on%ormal 'oatings

IPC)SM)04'

7uali%ication and !er%ormance o% !ermanent Solder"ask

CAT/MAS,


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PCB % ACCEPTANCE

IPC)D)42A

Design and End !roduct +e5uirements %or Discrete iring(oards

IPC)E)6'

!rinted (oard 7ualit, E*aluation Handbook

IPC)T1)0&'7uali%ication and !er%ormance o% !ol,mer T)ick ilm !rinted

(oards

IPC)MC)-6'

7uali%ication and !er%ormance Speci%ication %or "ass

/amination !anels %or "ultila,er !rinted (oards

IPC)%&%'

#E" Standard %or !rinted (oard "anu%acturers87uali%ication!ro%ile "7!.


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PCB % ACCEPTANCE (cont.)

IPC)6'%%

Generic !er%ormance Speci%ication %or !rinted (oards

IPC)6'%2

7uali%ication and !er%ormance Speci%ication %or +igid !rinted(oards

IPC)6'%(

7uali%ication & !er%ormance Speci%ication %or le9ible !rinted(oards

IPC)6'%

7uali%ication & !er%ormance Speci%ication %or #rganic "ultic)ip"odule "ounting and nterconnecting Structures

IPC)6'%6

7uali%ication & !er%ormance Speci%ication %or Hig) Densit,nterconnect HD. /a,ers or (oards

IPC)6'%0

"icro2a*e End !roduct (oard nspection and Test


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PCB % ACCEPTANCE (cont.)

IPC/JPCA)62'2!er%ormance Guide "anual %or Single- and Double-Sidedle9ible !rinted iring (oards

IPC/JPCA)60'%Terms & De%initions Test "et)ods and Design E9amples %or(uild-3p


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CMPNENTS

J)STD)'2'"oisture


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CMPNENTS (cont.)

IPC)-'%

!( Assembl, !rocess Simulation %or E*aluation o% Electronic'omponents

IPC)-'2!( Assembl, Soldering !rocess Guideline %or Electronic'omponents

IPC)-'("oisture Sensiti*it, 'lassi%ication %or 6on-' 'omponents

IPC)-'4Assembl, !rocess Simulation %or E*aluation o% 6on-'

'omponents !reconditioning 6on-' 'omponents.


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CLEANIN&% CLEANLINESS

IPC)SC)6'!ost Solder Sol*ent 'leaning Handbook

IPC)SA)6%!ost Solder Semi-A5ueous 'leaning Handbook

IPC)AC)62

A5ueous !ost Solder 'leaning Handbook

IPC)C*)6Guidelines %or 'leaning o% !rinted (oards & Assemblies

IPC)TR)460

actors A%%ecting nsulation +esistance !er%ormance o% !rinted(oards

IPC)TR)4&6Electroc)emical "igration= Electricall, nduced ailures in!rinted iring Assemblies


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CLEANIN&% CLEANLINESS (cont.)

IPC)TR)0'

'leaning and 'leanliness Test !rogram !)ase 1 Test +esults

IPC)TR)0%

!' !)ase 'ontrolled Atmosp)ere Soldering Stud,

IPC)TR)02

'leaning & 'leanliness Test !rogram %or= !)ase :-/o2 Solids

lu9es & !astes !rocessed in Ambient Air

IPC)TR)0(

An n-Dept) /ook At onic 'leanliness Testing

IPC)SM)0(-!re & !ost Solder "ask Application 'leaning Guidelines

IPC)-2'%

Sur%ace nsulation +esistance Handbook


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LAMINATE

IPC)1C)2(4!SA Assembl, Guidelines %or Single- & Double-Sided le9ible !rinted'ircuits

IPC)42'2le9ible (ase Dielectrics %or 3se in le9ible !rinted 'ircuitr,

IPC)42'(Ad)esi*e 'oated Dielectric ilms %or 3se as 'o*er S)eets %or le9ible!rinted 'ircuitr, and le9ible Ad)esi*e (onding ilms

IPC)42'4le9ible "etal-'lad Dielectrics %or 3se in abrication o% le9ible

!rinted 'ircuitr,

IPC)42Speci%ication %or Electroless 6ickel


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LAMINATE (cont.)

RIGID

IPC)4%'%Speci%ications %or (ase "aterials %or +igid and "ultila,er !rinted (oards

IPC)4%'(

Speci%ication %or (ase "aterials %or Hig) Speed


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LAMINATE (cont.)

IPC)C1)%40

+esin 'oated "etal %or !rinted (oards

IPC)C1)%2IPC)C1)%2

'omposite "etallic "aterials Speci%ication %or !rinted iring

(oards

IPC)%&(%

Strategic +a2 "aterials Supplier 7uali%ication !ro%ile

IPC)462"etal oil %or !rinted iring Applications

1I


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'ABRICATIN

IPC)DR)&'

General Speci%ication %or 1 inc) Diameter S)ank 'arbide

Drills %or !rinted (oards

IPC)DR)&2

Drilling Guidelines %or !rinted (oards

IPC)I)64Standard %or ?isual #ptical nspection Aids

IPC)TA)&24

Tec)nolog, Assessment Series on 'lean +ooms

IPC)PE)&4'Troubles)ooting %or !rinted (oard "anu%acture and Assembl,


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REIN'RCEMENT

IPC)44%2

Speci%ication %or inis)ed abric o*en %rom @E@ Glass %or!rinted (oards

IPC)SG)%4%

Speci%ication %or inis)ed abric o*en %rom @S@ Glass %or

!rinted (oards IPC)A)%42

Speci%ication %or inis)ed abric o*en %rom Aramid %or !rinted

(oards

IPC)1)%4(

Speci%ication %or inis)ed abric o*en %rom 7uart4 !ure used

Silica. %or !rinted (oards

IPC)%&(%

Strategic +a2 "aterials Supplier 7uali%ication !ro%ile


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REIN'RCEMENT (cont.)

IPC)4%%'Speci%ication and ')aracteri4ation "et)ods %or 6on2o*en

'ellulose (ased !aper %or !rinted (oards

IPC)4%2%

Guidelines %or Selecting 'ore 'onstruction %or "ultila,er !rinted

iring (oard Applications

IPC)4%('

Speci%ication & ')aracteri4ation "et)ods %or 6on2o*en @E@ Glass

"at

IPC)44%%Speci%ication and ')aracteri4ation "et)ods %or 6on-o*en !ara-

Aramid +ein%orcement


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ASSEMBLY

IPC)D)2&-Design Guidelines %or +eliable Sur%ace "ount Tec)nolog,!rinted (oard Assemblies

IPC)D)(26n%ormation +e5uirements %or "anu%acturing Electronic

Assemblies IPC)C)4'6

Design & Application Guidelines %or Sur%ace "ount Applications'onnectors

IPC)C)4'0

Design & Application Guidelines %or t)e 3se o% SolderlessSur%ace "ount 'onnectors

IPC)SM)&02Sur%ace "ount Design & /and !attern Standard


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INTER'ACES

IPC)D)(%'Guidelines %or !)ototool Generation and "easurement Tec)ni5ues

IPC)A)(%%!rocess 'ontrols %or !)ototool Generation and 3se

IPC)D)('!rinted (oard Description in Digital orm

IPC)D)(%!rinted (oard Dra2ings in Digital orm

IPC)D)(6(are Substrate Electrical Test Data ormat

IPC)D)(-'Automated Design Guidelines


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INTER'ACES

IPC)2%%Generic +e5uirements %or mplementation o% !roduct "%gDescription Data & Trans%er "et)odolog,

IPC)2(%Standard +ecipe ile ormat Speci%ication

IPC)24%Generic +e5uirements %or Electronics "anu%acturing S)op loorE5uipment 'ommunication 'A"B.

IPC)2&%Generic +e5uirements %or Electronics "%g Suppl, ')ain'ommunication - !roduct Data eBc)ange !DB.


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PCB

SMC)P)''4

Design %or Success IPC)222

Design Guide %or +


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PCB (cont.)

IPC)222%

Generic Standard on !rinted (oard Design IPC)2222

Sectional Standard on +igid #rganic !rinted (oards

IPC)222(

Sectional Design Standard %or le9ible !rinted (oards

IPC)2224

Sectional Standard o% Design o% !( %or !' 'ards

IPC)222

Sectional Design Standard %or #rganic "ultic)ip "odules "'"-/. and

"'"-/ Assemblies

IPC)2(%

Design Guide %or Hig) Densit, nterconnects & "icro*ias

IPC)26%

!rinted (oard Dimensions and Tolerances


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EDEC IEC PAS ACTI!ITY

EIA/JESD22)+%'2CC

C ire bond s)ear test met)od

C ;A


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JESD22)A%%'+)+C

C Electrostatic disc)arge ESD. sensiti*it, testing )uman bod, model H(".

EIA/JESD22)A%%)AC


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JESD&0C

JESD22)A%%()+C


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JESD22)A%'6)AC


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JESD22)C%'%

C

')arged de*ice model 'D".

JESD22)+%'%C

C Guidelines %or GaAs ""' and ET li%e testing

JEP%%'C

C Guidelines %or user noti%ication o% product


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EIA/JESD40

C Ed 1=

C S,mbols and labels %or moisture-sensiti*e de*ices

IPC/JEDEC J)STD)'((C

C (ond 2ire modeling standard JEP%%4

C


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JESD22)A%'2)+C

Amendment ; Ed ; ;001-10. and E' F0 Ed ;; ;001-1;.

J)STD)'(C


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JEP%%-C

EIA/JEP%20C

C "easuring and using t)e temperature coe%%icient o% resistance to determine t)etemperature o% a metalli4ation line

JESD)A%'()AC


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EIA/JESD22)A%')+C

JESD22)A%2'C

JESD22)A%%0C


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IPC IEC PAS ACTI!ITY

IPC)EIA/J)STD)'%2C E'C lip c)ip and c)ip scale tec)nolog, implementation

IPC)EIA/J)STD)'%(C E'C mplementation o% ball grid arra, and ot)er )ig) densit, tec)nolog,

IPC)2%%C E'

data and trans%er met)odolog,

IPC)62'2C E'

C !er%ormance guide "anual %or single- and double-sided %le9ible printed 2iringboards

IPC)4%('C E'


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IPC)44%%C E'

C Speci%ication and c)aracteri4ation met)ods %or non2o*en para-

aramid rein%orcement

IPC)6'%%C E'

C Generic per%ormance speci%ication %or printed boards

IPC)%&%'C E' Ed 10

C "anu%acturers 5uali%ication pro%ile "7!.

IPC)%&2'C E'

C Assembl, 5uali%ication pro%ile A7!.


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IPC)%&('C E'

C /aminator 5uali%ication pro%ile

IPC)6'%( 79ith amendment8C E'

C 7uali%ication and per%ormance speci%ication %or %le9ible printed boards

IPC)6'%2 79ith amendment8C E'

C 7uali%ication and per%ormance speci%ication %or rigid printed boards

ipc industry mapping

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