iti environmental leadership council...january 20, 2016 confidential –amd internal use onlydonna...

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JANUARY 20, 2016 CONFIDENTIAL – AMD INTERNAL USE ONLY DONNA SADOWY AMD OCTOBER 3, 2017 ITI ENVIRONMENTAL LEADERSHIP COUNCIL PANEL DISCUSSION: CHALLENGES & BEST PRACTICES - PRODUCT STANDARDS

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Page 1: ITI ENVIRONMENTAL LEADERSHIP COUNCIL...JANUARY 20, 2016 CONFIDENTIAL –AMD INTERNAL USE ONLYDONNA SADOWY AMD OCTOBER 3, 2017 ITI ENVIRONMENTAL LEADERSHIP COUNCIL PANEL DISCUSSION:

JANUARY 20, 2016

CONFIDENTIAL – AMD INTERNAL USE ONLY

DONNA SADOWYAMD

OCTOBER 3, 2017

ITI ENVIRONMENTAL LEADERSHIP COUNCIL

PANEL DISCUSSION: CHALLENGES & BEST PRACTICES - PRODUCT STANDARDS

Page 2: ITI ENVIRONMENTAL LEADERSHIP COUNCIL...JANUARY 20, 2016 CONFIDENTIAL –AMD INTERNAL USE ONLYDONNA SADOWY AMD OCTOBER 3, 2017 ITI ENVIRONMENTAL LEADERSHIP COUNCIL PANEL DISCUSSION:

2 | AMD CORPORATE OVERVIEW | SEPTEMBER 2017

ABOUT AMD

OUR SOLUTIONS

Accelerated Processing Units (APUs) and chipsets for consumer and commercial notebook, desktop, and embedded markets

Graphics, video, and multimedia products and technologies for desktop and notebook PCs, embedded systems, professional workstations, server, and game consoles

Microprocessors for embedded, server, and client markets

ITI ELC Meeting, October 2017

Page 3: ITI ENVIRONMENTAL LEADERSHIP COUNCIL...JANUARY 20, 2016 CONFIDENTIAL –AMD INTERNAL USE ONLYDONNA SADOWY AMD OCTOBER 3, 2017 ITI ENVIRONMENTAL LEADERSHIP COUNCIL PANEL DISCUSSION:

3 | AMD CORPORATE OVERVIEW | SEPTEMBER 2017

DEVICES WE POWER

Medical Imaging Digital Signage Gaming

Avionics Cockpit Display Systems Supercomputers Datacenters

Notebooks and Desktops Game Consoles Thin Clients

ITI ELC Meeting, October 2017

Page 4: ITI ENVIRONMENTAL LEADERSHIP COUNCIL...JANUARY 20, 2016 CONFIDENTIAL –AMD INTERNAL USE ONLYDONNA SADOWY AMD OCTOBER 3, 2017 ITI ENVIRONMENTAL LEADERSHIP COUNCIL PANEL DISCUSSION:

4 | AMD CORPORATE OVERVIEW | SEPTEMBER 2017

ENVIRONMENTAL PRODUCT STANDARDS

Standards organizations, such as IEC, ISO, IEEE, NSF, CEN, CENELEC, ETSI, ITU-T, IPC, UL, JEDEC, ECMA, country-specific (e.g. ASTM, DIN, BSI, SAC), governmental (e.g. IPCC, OECD) 1

Technical committees, management and advisory groups produce standards, technical reports and guides

IEC has 104 technical committees (99 sub-committees) and advisory committees on environmental aspects and energy efficiency (ACEA, ACEE); increased focus on environment

Challenges

Scope, including multi criteria standards

Defining “leadership” standards

Complex electrical and electronic equipment and cross-cutting issues

Harmonization of definitions and standards

Addressing new or emerging issues

1 Also, EICC and CSR standards, recycling, “green” transportation, resource utilization standards, etc.

ITI ELC Meeting, October 2017

Page 5: ITI ENVIRONMENTAL LEADERSHIP COUNCIL...JANUARY 20, 2016 CONFIDENTIAL –AMD INTERNAL USE ONLYDONNA SADOWY AMD OCTOBER 3, 2017 ITI ENVIRONMENTAL LEADERSHIP COUNCIL PANEL DISCUSSION:

5 | AMD CORPORATE OVERVIEW | SEPTEMBER 2017

ENVIRONMENTAL PRODUCT STANDARDS

Some Aspects of AMD’s Approach:

Direct engagement, when appropriate – e.g. server and computer energy efficiency standards (IEC TC 100, ISO/IEC JTC1 SC 39)

Review ongoing developments, and engage as needed - IEEE, NSF, IEC TC 100, TC 111, TC 108

Oversee emerging issues - member of IEC Advisory Committee Environmental Aspects (ACEA)

Engage in dialogue and collaborate with customers, suppliers and other stakeholders

ITI ELC Meeting, October 2017

Page 6: ITI ENVIRONMENTAL LEADERSHIP COUNCIL...JANUARY 20, 2016 CONFIDENTIAL –AMD INTERNAL USE ONLYDONNA SADOWY AMD OCTOBER 3, 2017 ITI ENVIRONMENTAL LEADERSHIP COUNCIL PANEL DISCUSSION:

6 | AMD CORPORATE OVERVIEW | SEPTEMBER 2017

DISCLAIMER & ATTRIBUTION

The information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions and typographical errors.

The information contained herein is subject to change and may be rendered inaccurate for many reasons, including but not limited to product and roadmap changes, component and motherboard version changes, new model and/or product releases, product differences between differing manufacturers, software changes, BIOS flashes, firmware upgrades, or the like. AMD assumes no obligation to update or otherwise correct or revise this information. However, AMD reserves the right to revise this information and to make changes from time to time to the content hereof without obligation of AMD to notify any person of such revisions or changes.

AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION.

AMD SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL AMD BE LIABLE TO ANY PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION CONTAINED HEREIN, EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

ATTRIBUTION

© 2017 Advanced Micro Devices, Inc. All rights reserved. AMD, Athlon, Radeon, FirePro, FreeSync, FX, LiquidVR, the AMD Arrow logo and combinations thereof are trademarks of Advanced Micro Devices, Inc. in the United States and/or other jurisdictions.

DirectX is a registered trademark of Microsoft Corporation in the US and other jurisdictions. Xbox is a registered trademark of Microsoft Corporation.

“PlayStation”, the “PS” Family logo, and “PSP” are registered trademarks of Sony Interactive Entertainment Inc.

Vulkan and the Vulkan logo are registered trademarks of Khronos Group Inc.

Other names are for informational purposes only and may be trademarks of their respective owners.

ITI ELC Meeting, October 2017