its fpc : inner module flex (imf)
DESCRIPTION
ITS FPC : INNER MODULE FLEX (IMF). CONTENTS. - CHIP floorplan IMF layout Etching profile Differential impedance S-Parameter. CHIP floorplan. Layout version 1 – Baseline at date From ITS WP6&7&8 03.04.2014, Gianluca Aglieri Rinella. IMF_V12 layout. 366.8 mm. 15.750 mm. IMF_V12. - PowerPoint PPT PresentationTRANSCRIPT
Antoine JUNIQUE 122/04/2014
ITS FPC : INNER MODULE FLEX (IMF)
Antoine JUNIQUE 222/04/2014
CONTENTS
- CHIP floorplan- IMF layout- Etching profile- Differential impedance- S-Parameter
Antoine JUNIQUE 322/04/2014
CHIP floorplan
Layout version 1 – Baseline at dateFrom ITS WP6&7&8 03.04.2014, Gianluca Aglieri Rinella
Antoine JUNIQUE 422/04/2014
366.8 mm
76 mm IMF_V12
IMF_V12 layout
UCC8-010-1.05-X-X-XXSAMTEC
UEC5-019-X-D-RA-ASAMTEC
15.
750
mm
Antoine JUNIQUE 522/04/2014
IMF_V12 to Coax-cable connexion
Antoine JUNIQUE 622/04/2014
366.8 mm
IMF_V1276 mm
IMF_V12 layout
AVDD
DVDD
High speed linesM-LVDS lines
Antoine JUNIQUE 722/04/2014
Chip1 Chip2
1 mm
0.4 mm
Chip1 Chip2
1 mm
0.4 mm
IMF_V12 layout
0.5 mm
0.4 mm
Antoine JUNIQUE 822/04/2014
IMF_V12 layout 3D view (Extension part)
UCC8-010-1.05-X-X-XXSAMTEC
UEC5-019-X-D-RA-ASAMTEC
Power connexion area
Chip1 detail
Antoine JUNIQUE 922/04/2014
ETCHING PROFILES
100 µm 100 µm 100 µm
Cu or Al 25 µm
Polyimide 50 µm or 75 µm
Cu or Al 25 µm
Profile 1 (Ideal world)
100 µm 100 µm 100 µm
70 µm70 µm
Cu or Al 25 µm
Polyimide 50 µm or 75 µm
Cu or Al 25 µm
Profile 2 (Chemical etching)
Cu or Al 25 µm
Polyimide 50 µm or 75 µm
Cu or Al 25 µm
120 µm 82 µm 120 µm
88 µm88 µm
Profile 3 (Laser etching)
Solder-mask 25 µm
Solder-mask 25 µm
Profile 4 (Ideal world)
Solder-mask 25 µm
Solder-mask 25 µm
Profile 5 (Chemical etching)
Solder-mask 25 µm
Solder-mask 25 µm
Profile 6 (Laser etching)
Antoine JUNIQUE 1022/04/2014
Differential impedance
No solder- mask With solder-mask
Profile 1(ideal world)
Profile 2(Chemical etch)
Profile 3(Laser etch)
Profile 4(Ideal world)
Profile 5(Chemical etch)
Profile 6(Laser etch)
Polyimide 50 µm
Copper 89 Ω 94 Ω 83 Ω 79 Ω 84 Ω 75 Ω
Aluminum_EC 90 Ω 94 Ω 83 Ω 79 Ω 85 Ω 75 Ω
Aluminum_LERMPS1 91 Ω 95 Ω 86 Ω 81 Ω 86 Ω 76 Ω
Polyimide 75 µm
Copper 106 Ω 111 Ω 98 Ω 92 Ω 99 Ω 88 Ω
Aluminum_EC 105 Ω 111 Ω 99 Ω 92 Ω 99 Ω 89 Ω
Aluminum_LERMPS1 107 Ω 113 Ω 100 Ω 93 Ω 100 Ω 90 Ω
Antoine JUNIQUE 1122/04/2014
S-PARAMETERS (Setting)
Profile 5 (Chemical etching)
100 µm 100 µm 100 µm
70 µm70 µm
Cu or Al 25 µm
Polyimide 75 µm
Cu or Al 25 µm
Solder-mask 25 µm
Solder-mask 25 µm
Length (cm)
HS_DATA_O_P1 6.3575
HS_DATA_O_N1 6.3889
HS_DATA_O_P2 9.3755
HS_DATA_O_N2 9.407
HS_DATA_O_P3 12.4001
HS_DATA_O_N3 12.4315
HS_DATA_O_P4 15.4238
HS_DATA_O_N4 15.4552
HS_DATA_O_P5 18.4473
HS_DATA_O_N5 18.4787
HS_DATA_O_P6 21.4701
HS_DATA_O_N6 21.5015
HS_DATA_O_P7 24.4909
HS_DATA_O_N7 24.5223
HS_DATA_O_P8 27.5131
HS_DATA_O_N8 27.5445
HS_DATA_O_P9 30.5296
HS_DATA_O_N9 30.5611
IMF_V12 high speed differential lines length
Polyimide : - Dielectric constant = 3.5- Dissipation factor = 0.002
Solder-Mask:- Dielectric constant = 3.7- Dissipation factor = 0.029
Antoine JUNIQUE 1222/04/2014
S-PARAMETERS
-8 dB Limit to no equalisation
Copper Aluminum_EC Aluminum_LERMPS1
-3 dB -8 dB -3 dB -8 dB -3 dB -8 dB
HS_DATA_O_1 12.8282 GHz 20 GHz < Freq 12.1590GHz 20 GHz < Freq 8.9655 GHz 20 GHz < Freq
HS_DATA_O_5 3.6171 GHz 13.9206 GHz 2.8160 GHz 11.5960 GHz 1.9132 GHz 8.9355 GHz
HS_DATA_O_9 1.7979 GHz 7.0179 GHz 1.3795 GHz 5.8016 GHz 0.9117 GHz 4.4085 GHz
Antoine JUNIQUE 1322/04/2014
Conclusion
- Developed first design of an extended FPC for an inner layer module and set up simulation tools for studying differential impedance and S-Parameters.
Next steps:
- Complete drop voltage, current flow and PWR impedance.- Compare simulation result with Aluminium prototype.- New layout with ALPIDE layout version 2.- Extension length and mechanical improvements.