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NVM Solutions Group
June 2017
Alexey Sergeev
Application Engineer, Intel NVM Solutions Group
NVM Solutions Group
Legal Disclaimer
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions
marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The information here is subject to change without notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized
errata are available on request.
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system
configuration. No computer system can be absolutely secure. Check with your system manufacturer or retailer or learn more at intel.com.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any
warranty arising from course of performance, course of dealing, or usage in trade.
Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. Consult other sources
of information to evaluate performance as you consider your purchase.
Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the
referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of
systems available for purchase.
Intel, the Intel logo, and Optane are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2017 Intel Corporation. All rights reserved.
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The Growth Cycle Opportunity
Memory and storage are at the
center of Intel’s strategy
Strategic position drives an
absolute commitment to
continued innovation
Deep understanding of full data
path means best positioned for
innovation
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Cost Delay MORELESSHIGHERLOWER
Intel Technology Innovations Fill the Memory and Storage Gap Performance and Capacity for Every Need
Intel® Optane™
Technology
Higher
performance
Intel 3D NANDTechnology
Lower cost & higher
density
68NVM SOLUTIONS GROUP
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Cost Delay MORELESSHIGHERLOWER
Intel® SSDs for the Spectrum of Data Center Needs
69NVM SOLUTIONS GROUP
Intel® 3D NANDSSDs
Optimize Storage – Transition to
a scalable, built-for SSDs
interface (PCIe*/NVMe*) to
optimize both application
performance and TCO
Modernize Storage - Utilize
legacy infrastructure with SATA-
based SSDs that accelerate
applications and reduce TCO
Intel® Optane™
SSDs
Extend Memory – Gain new
insights from data by
augmenting DRAM to increase
memory pool size or reduce cost
by replacing some of the DRAM
set
Fast Storage and Cache – Break
through storage bottlenecks to
significantly increase scale per
server
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Intel Leadership in Flash Cell Technology
1.5µm
1985-1989
1.0µm
0.8µm
0.6µm
1990-1994
0.4µm
0.25µm
1995-1999 2000-2004
0.13µm
0.18µm 90nm 65nm
50nm
45nm
34nm
2005-2009
25nm
20nm
16nm
3D
2010-2014 2016
NOR Flash Memory NAND Flash Memory
30+ years of flash cell scaling experience
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Intel 3D NAND Delivers Highest Areal Density
1) Source – Intel. Measured data. Comparing Intel 32 tier TLC NAND die (Pleasant Star) to Samsung 32 tier TLC NAND die.
2) Source: Intel data based on internal analysis. Data regarding representative competitors based on 2017 IEEE International Solid-State Circuits Conference papers citing Samsung Electronics and Western Digital/Toshiba die sizes for 64-stacked 3D
NAND component.
Scale to bigger capacities
Intel 32T/TLC1
2.86Gb/mm
Other 32T/TLC1
2.57Gb/mm
Manufacturing efficiency
>11%Higher areal
density2
More
GBper wafer
AdvantagesR
epla
ce
ment
Gate
Arr
ay
Arr
ay
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Intel 3D NAND is Built on a Proven Cell Technology
Discrete chargestorage node
Vertical Floating Gate Flash Cell
Word lines
Isolationbetween cells
Floating gate (cutaway view)
High reliability and strong protection from charge loss
73NVM SOLUTIONS GROUP 73NVM SOLUTIONS GROUP
Intel 3D NAND Solutions Reach Across Multiple Segments
*Other names and brands may be claimed as the property of others.
Data Center
High Performance
Intel® SSD DC
P3520 Series
Intel® SSD DC
P3100 Series
Mainstream
Intel® SSD DC
S3520 Series
Embedded
Commercial
Intel® SSD
E 6000p Series
Intel® SSD
E 7000s Series
Clients
Business
Intel® SSD Pro
6000p Series
Consumer
Intel® SSD 600p
Series
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Pairing a new Intel developed controller, unique firmware innovations and disruptive
capacities with Intel 3D NAND, the cloud inspired DC P4500 and DC P4600 have been
designed from the ground up to deliver an all-PCIe* solution enabling highly efficient
storage and caching to help data centers do more per server, minimize service
disruptions and efficiently manage at scale.
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MEMOR
YLatency: 1X
Size of Data: 1X
SRAMLatency: ~10X
Size of Data: ~100X
DRAM
Storage
Latency: ~10 Million X
Size of Data: ~10,000X
HDD
Technology claims are based on comparisons of latency, density and write cycling metrics amongst memory technologies recorded on published specifications of in-market memory products against internal Intel specifications.
Latency: ~100,000X
Size of Data: ~1,000X
NAND SSD3D XPoint™
Latency: ~100X
Size of Data: ~1,000X
3D Xpoint™ MEMORY MEDIABreaks the memory/storage barrier
+
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5-8x faster at low Queue
Depths1
Vast majority of applications
generate low QD storage
workloads
1. Common Configuration - Intel 2U PCSD Server (“Wildcat Pass”), OS CentOS 7.2, kernel 3.10.0-327.el7.x86_64, CPU 2 x Intel® Xeon® E5-2699 v4 @ 2.20GHz (22 cores), RAM 396GB DDR @ 2133MHz. Configuration
– Intel® Optane™ SSD DC P4800X 375GB and Intel® SSD DC P3700 1600GB. Performance – measured under 4K 70-30 workload at QD1-16 using fio-2.15.
Breakthrough Performance
Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance.
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up to 60X better at 99% QoS1
Ideal for critical applications with
aggressive latency requirements
1. Common Configuration - Intel 2U PCSD Server (“Wildcat Pass”), OS CentOS 7.2, kernel 3.10.0-327.el7.x86_64, CPU 2 x Intel® Xeon® E5-2699 v4 @ 2.20GHz (22 cores), RAM 396GB DDR @ 2133MHz. Configuration
– Intel® Optane™ SSD DC P4800X 375GB and Intel® SSD DC P3700 1600GB. QoS – measures 99% QoS under 4K 70-30 workload at QD1 using fio-2.15.
Predictably Fast Service
Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance.
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Responsive Under Load
up to 40X faster
response time
under workload1
Consistently
amazing response
time under load
1. Responsiveness defined as average read latency measured at queue depth 1 during 4k random write workload. Measured using FIO 2.15. Common Configuration - Intel 2U PCSD Server (“Wildcat Pass”), OS CentOS
7.2, kernel 3.10.0-327.el7.x86_64, CPU 2 x Intel® Xeon® E5-2699 v4 @ 2.20GHz (22 cores), RAM 396GB DDR @ 2133MHz. Configuration – Intel® Optane™ SSD DC P4800X 375GB and Intel® SSD DC P3700
1600GB. Latency – Average read latency measured at QD1 during 4K Random Write operations using fio-2.15.
Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance.
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Moving towards a Persistence
Hierarchy
The three different Performance/Capacity Solutionswill work together in future platforms
Sources: “Storage as Fast as the rest of the system” 2016 IEEE 8th International Memory Workshop and measurement, Intel® Optane™ SSD measurements and Intel P3700 measurements, and technology projections
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Intel is a Proven and Trusted Supplier
Validated on a massive scale1
1,000s of drives
>5,000 workloads
1,000s of configurations
>1M power cycles
1) Source – Intel Quality and Validation group. Validated beyond JEDED standards.
2) Source – Intel. Actual measurement of percent shipments for all Intel® SSD products that arrive on committed delivery date.
3) Source – Intel. Intel 2015 Customer Excellence Program survey.
Deliveredon time
92% delivery to commit2
Expert post-sales support
Customers rate Intel post-sales
support as world-class3
Worldwide phone, chat, email,
online community support in 11
languages
Platform-wide expertise
NVM Solutions Group