lg attune un270 lgun270 [et]

Internal Use Only

Service ManualLGUN270

Date: June , 2011 / Issue 1.0

UN270

1 LG Electronics Inc.

CDMA Mobile Subscriber Unit UN270

TRIPLE BAND, TRIPLE MODE [PCS/GPS/CELLULAR]

CDMA MOBILE PHONE

SERVICE MANUAL

LG Electronics Inc.

Features of UN270

1. Wave Type CELLULAR : G7W PCS : G7W

2. Frequency Scope

Transmit Frequency (MHz) Receive Frequency (MHz)

CELLULAR PCS CELLULAR PCS GPS

824.82 ~ 848.19 1850~1910 869.82~893.19 1930~1990 1575.42

3. Rated Output Power : CELLULAR = 0.282W / PCS = 0.282W 4. Output Conversion Method : This is possible by correcting the key board channel. 5. Voltage and Current Value of Termination Part Amplifier (Catalogue included)

MODE Part Name Voltage Current Power

CELLULAR ACPM-7354 4.2V 600mA 0.282W

PCS ACPM-7354 4.2V 600mA 0.282W 6. Functions of Major Semi-Conductors

Classification Function

QSC6055 Terminal operation control and digital signal processing Converts RF signal to baseband signal Converts baseband signal to RF signal

MCP (H8BCS0SIBAR-46M) NAND (2Gbit) + DDR (1Gbit) Storing of terminal operation program

7. Frequency Stability CELLULAR : 0.5PPM

PCS : 0.1PPM

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Table of Contents

General Introduction ...................................... 2 Chapter 1. System Introduction ..................... 3 1. System Introduction.................................... 3

1.1 CDMA Abstract ................................... 3 2. Features and Advantages of CDMA

Mobile Phone...............................................5 2.1 Various Types of Diversities ................ 5 2.2 Power Control ...................................... 5 2.3 Voice Encoder and Variable Data

Speed ..........................................................6 2.4 Protecting Call Confidentiality ............. 6 2.5 Soft Handoff ........................................ 6 2.6 Frequency Re-Use and Sector

Segmentation ...............................................6 2.7 Soft Capacity ....................................... 7

3. Structure and Functions of tri-band CDMA Mobile Phone .......................................8

4. Specification .............................................. 9 4.1 General Specification .......................... 9

4.1.1 Transmit/Receive Frequency Interval ....................................................9

4.1.2 Number of Channels (Channel Bandwidth) ...............................................9

4.1.3 Operating Voltage.........................94.1.4 Battery Power Consumption ........9 4.1.5 Operating Temperature ................9 4.1.6 Frequency Stability .......................9 4.1.7 Antenna ........................................9 4.1.8 Size and Weight ...........................9 4.1.9 Channel Spacing ..........................9 4.1.10 Battery Type, Capacity and

Orerating Time .........................................10 4.2 Receive Specification ........................ 10

4.2.1 Frequency Range .......................10 4.2.2 Local Oscillating Frequency

Range ................................ ...................10 4.2.3 Sensitivity ........................................10 4.2.4 Selectivity ...................................10 4.2.5 Interference Rejection ................10 4.2.6 Spurious Wave Suppression ......10 4.2.7 CDMA Input Signal Range .........11

4.3 Transmit Specification ....................... 11 4.3.1 Frequency Range .......................11 4.3.2 Local Oscillating Frequency

Range ................................ ....................11 4.3.3 Intermediate Frequency ..............11 4.3.4 Output Power ..............................11 4.3.5 CDMA TX Frequency Deviation...11

4.3.6 CDMA TX Conducted Spurious Emissions ...............................................11

4.3.7 CDMA Minimum TX Power Control ................................ ...............

4.4 MS (Mobile Station) Transmitter Frequency ..........................................124.4.1 CELLULAR mode ...................... 12 4.4.2 PCS mode ................................. 12

4.5 MS (Mobile Station) Receiver Frequency ..........................................13 4.5.1 CELLULAR mode ...................... 13 4.5.2 PCS mode ................................. 13 4.5.3 GPS mode : 1575.42MHz .......... 13 4.5.4 Bluetooth mode : 2400MHz ~ 2483.5MHz ......................................... 13

4.6 AC Adaptor ........................................ 14 4.7 Cigar Lighter Charger ........................ 14 4.8 Hands-Free Kit .................................. 14

5. Installation ................................................ 14 5.1 Installing a Battery Pack .................... 14 5.2 For Adapter Use ................................ 14 5.3 For Mobile Mount .............................. 14

5.3.1 Installation Position ........................... 14 5.3.2 Cradle Installation ...................... 14 5.3.3 Interface Box .............................. 155.3.4. Microphone Installation ............. 15 5.3.5 Cable Connections .................... 15

Chapter 2. Circuit Description ...................... 16 1. RF Transmit/Receive Part ......................... 16

1.1 Overview ........................................... 16 1.2 Description of Rx Part Circuit ............ 16

1.2.1 Quadplexer (U102) .................... 16 1.2.2 LNAs (U2101) ............................ 18 1.2.3 GPS LNA (U1007) ..................... 20 1.2.4 Down-converter Mixers (U2101). 20 1.2.5 Rx RF SAW Filters

(FL1004/FL1008) ......................... 20 1.2.6 RF Receiver (U2101).................. 20

1.3 Description of Transmit Part Circuit ... 211.3.1 RF Transmitter (U2101) ............. 21 1.3.2 Dual Power Amplifier (U1000) ... 23

1.4 Description of Frequency Synthesizer Circuit ............................ 24

1.4.1 Voltage Control Temperature Compensation Crystal Oscillator .. 24

2. Digital/Voice Processing Part ................... 24 2.1 Overview ........................................... 24 2.2 Configuration ..................................... 24

2.2.1 Keypad/LED and Receptacle Part 24

...11

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2.2.2 Voice Processing Part ......................24 2.2.3 QSC6055 Part ..................................24 2.2.4 Memory Part ....................................24 2.2.5 Power Supply Part ...........................25

2.3 Circuit Description ............................. 25 2.3.1 Keypad/LCD and Receptacle Part ...25 2.3.2 Audio Processing Part .....................25 2.3.3 MODEM Part ..................................25 2.3.4 Memory Part ....................................26 2.3.5 Power Supply Part ...........................26 2.3.6 Logic Part ........................................26

Chapter 3. Trouble Shooting ................ 28

1. Rx Part Trouble ................................ 28 1.1 DCN & PCS Rx Trouble .................... 28

1.1.1 Checking DC Power Supply ................................Circuit ........... 29

1.1.2 Checking Rx Signal Path .................30 1.1.3 Checking VCTCXO Circuit .............32

2. Tx Part Trouble ................................ 34 2.1 DCN & PCS Tx Trouble ..................... 34

2.1.1 Checking DC Power Supply ................................Circuit ...........34

2.1.2 Checking VCTCXO Circuit .............35 2.1.3 Checking Tx SAW Filter IN/OUT ...38 2.1.4 Checking Tx Dual PAM ..................39 2.1.5 Checking Quadplexer and Mobile

................................Switch .......... 41 3. Bluetooth Trouble ............................. 42

4. Power ............................................... 44 4.1 Power On Trouble ............................. 44 4.2 Charging Trouble ............................... 47

5. Logic Part Trouble ............................ 49 5.1 LCD Trouble ...................................... 49 5.2. Camera Trouble ............................... 52 5.3 Audio Trouble .................................... 55

5.3.1 Speaker Trouble ..............................55 5.3.2 MIC Trouble ....................................57 5.3.3 Receiver Trouble .............................59

5.3.4 Ear-Jack Trouble ............................ 60 5.4 Vibrator & Touch Trouble .................. 63 5.5 USB Trouble ...................................... 66

Appendix ............................................... 84

1. Block Diagram .................................. 84

2. Circuit Drawing ................................. 85 2.1 Main PCB .......................................... 852.2 KEY-PCB ........................................... 85 2.3 MAIN F-PCB...................................... 85

3. BGA Pin Map .................................... 94 3.1 EUSY0336202 (QSC6055) : 424

CSP (Bottom View) ............................ 3.2 EUSY0347506

(H8BCS0SI0BAR-46M) : 149 FBGA (Top View) ........................................ 95

3.3 EUSY0418701 (BCM2070B2KUBXG) : 42-bump WLBGA (Top View) ........................... 96

3.4 EUSY0403901 (WM9093ECS-R) : 20-bump CSP (Top View) ....................... 97

4. PCB Layout ...................................... 98 4.1 Main PCB .......................................... 98

4.1.1 Top Side ......................................... 98 4.1.2 Bottom Side .................................... 99

5. Exploded Diagram ........................... 100 .......................... 100

5.2 Assy Full Exploded View5.1 Full Exploded View

.................. 101 5.3 Seviceable Part ............................... 102

5.6 Disassembly Guide for Hidden Screw .............................................. 78

6. Part Lists .......................................... 103 6.1 Main PCB Top ................................... 103 6.2 Main PCB Bottom .............................. 104 6.3 Full BOM List ..................................... 124

Safety ................................................... 68

Glossary ............................................. 71

94

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The UN270 phone has been designed to operate on the latest digital mobile communication technology, Code Division

Multiple A ccess (CDMA ). This CDMA dig ital techn ology h as g reatly enh anced voice clarity and can provide a

variety of advanced features. Currently, CDMA m obile co mmunication techn ology h as been co mmercially u sed in

Cellular and P ersonal Com munication Serv ice (P CS). T he di fference betw een them is the operating frequency

spectrum. Cellular uses 800MHz and PCS uses 1.9GHz. T he UN270 support GPS Mode, we usually call it tri -band

phone. We call it tri-mode ph one. If on e of th e Cellu lar and P CS base station s is located n earby, Call f ail rate of

triple-mode phone is less than dual-mode phone or single-mode phone.

The CDMA technology adopts DSSS (Direct Sequence Spread Spectru m). This feature of DSSS enab les the phone

to keep communication from being crossed and to u se one frequency channel by multiple users in the same specific

area, resu lting th at it in creases th e capacity 10 tim es more co mpared with th at in the analog mode currently used.

Soft/Softer Handoff, Hard Handof f, an d Dynamic RF pow er Con trol techn ologies are co mbined in to th is ph one to

reduce the call being interrupted in a middle of talking over the phone.

Cellular and PCS CDMA network consists of MSO (Mobile Switching Office), BSC (Base Station Controller), BTS

(Base station Transmission System), and MS (Mo bile Station ). The f ollowing tab le lis ts som e m ajor CDMA

Standards.

CDMA Standard Designator Description

Basic air interface TIA/EIA/IS-95-A/B/C

ANSI J-STD-008

Protocol between MS and BTS for Cellular & AMPS

Protocol between MS and BTS for PCS

Network T IA/EIA/IS-634

TIA/EIA/IS/651

TIA/EIA/IS-41-C

TIA/EIA/IS-124

MAS-BS

PCSC-RS

Intersystem operations

Nom-signaling data comm.

Service T IA/EIA/IS-96-B

TIA/EIA/IS-99

TIA/EIA/IS-637

TIA/EIA/IS-657

Speech CODEC

Assign data and fax

Short message service

Packet data

Performance T IA/EIA/IS-97

TIA/EIA/IS-98

ANSI J-STD-018

ANSI J-STD-019

TIA/EIA/IS-125

Cellular base station

Cellular mobile station

PCS personal station

PCS base station

Speech CODEC

* TSB –74: Protocol between an IS-95A system and ANSI J-STD-008

General Introduction

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1. System Introduction

1.1 CDMA Abstract The CDMA mobile communication system has a channel hand-off function that is used for collecting the information

on the locations and movements of mobile telephones from the cell site by automatically controlling several cell site

through the setup o f d ata transm ission ro utes, and then enabling one switching system to carry out the automatic

remote ad justment. T his is to maintain co ntinuously the call state thro ugh the auto matic location confirmation and

automatic radio channel conversion when the busy subscriber moves from the service area of one cell site to th at of

another by using automatic location confirmation and automatic radio channel conversion functions. The call state can

be maintained continuously by the information exchange between switching systems when the busy subscriber moves

from one cellular system area to the other cellular system area.

In the cellu lar system, the cell site is a sm all-sized low output type and utilizes a frequency allocation system that

considers mutual interference, in an ef fort to enab le the re-use of corresponding frequency from a cell site sep arated

more than a certain distance. The analog cellular systems are classified further into an AMPS system, E-AMPS System,

NMT system, ETACS system, and JTACS system depending on technologies used.

Unlike the time div ision multiple access (T DMA) or f requency div ision multiple access (FDMA ) used in the band

limited environment, the Code Division Multiple Access (CDMA) system which is one of digital cellular systems is a

multi-access techn ology u nder th e interference lim ited env ironment. It can process m ore n umber of su bscribers

compared to oth er systems (TDMA system has the processing capacity three times greater than the existing FDMA

system whereas CDMA system, about 12~15 times of that of the existing system).

CDMA system can be explained as follows; TDMA or CDMA can be used to enable each person to talk alternately or

provide a sep arate room for each person when two persons desire to talk with each oth er at th e same time, whereas

FDMA can be used to enable one person to talk in soprano, whereas the other in bass (one of the two talkers can carry

out synchronization for hearing in case there is a bandpass filter function in the area of the hearer). Another available

method is to make two persons to sing in different languages at the same time, space, and f requency when wishing to

let the audience hear the singing without being confused. This is the characteristic of CDMA.

On th e oth er h and, w hen em ploying th e CDMA technology, each signal has a different pseudo-random binary

sequence used to spread the spectrum of carrier. A great number of CDMA signals share the same frequency spectrum.

In the perspective of frequency area or time area, several CDMA signals are overlapped. Among these types of signals,

only desired signal energy is selected and received through the use of pre-determined binary sequence; desired signals

can be separated, and then received with the correlator used for recovering the spectrum into its original state. At this

Chapter 1. System Introduction

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time, the spectrums of other signals that have different codes are n ot recovered into its original state , and ap pears as

the self-interference of the system.

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2. Features and Advantages of CDMA Mobile Phone

2.1 Various Types of Diversities When employing the narrow band modulation (30kHz band ) that is th e same as th e analog FM m odulation system

used in the existing cellular system, the multi-paths of radio waves create a serious fading. However, in the CDMA

broadband modulation (1.25 MHz band), th ree ty pes of div ersities ( time, f requency, and space) are u sed to red uce

serious fading problems generated from radio channels in order to obtain high-quality calls.

Time d iversity ca n b e o btained thro ugh the use of code inter leaving and error correction code whereas frequency

diversity can be obtained by spreading signal energy to wider frequency band. The fading related to normal frequency

can affect th e n ormal 200~300k Hz among s ignal ban ds an d ac cordingly, s erious effect can be av oided. Mo reover,

space diversity (also called path diversity) can be realized with the following three types of methods.

First, it can be obtained by the d uplication of cell site rec eive antenna. Second, it can b e obtained through the use o f

multi-signal processing device that receives a transmit signal having each different transmission delay time and then,

combines them. Third, it can b e obtained through the m ultiple cell site co nnection (Soft Handoff) that connects the

mobile station with more than two cell sites at the same time.

2.2 Power Control The CDMA system utilizes the forward (from a base station to mobile stations) and backward (from the mobile station

to the base station) power control in order to increase the call processing capacity and obtain high-quality calls. In case

the originating signals of mobile stations are receiv ed by th e cell site in th e m inimum call qu ality lev el (sig nal to

interference) thro ugh the use o f transm it p ower co ntrol on all the mobile s tations, the sy stem cap acity can b e

maximized. If th e sig nal power of m obile station is receiv ed too stron g, th e perf ormance of th at m obile station is

improved. However, because of this, the interference on other mobile stations using the same channel is increased and

accordingly, the call quality of other subscribers is reduced unless the maximum accommodation capacity is reduced.

In th e CDMA sy stem, f orward power con trol, back ward open loop pow er con trol, and closed loop pow er con trol

methods are used. The forward power control is carried out in the cell site to red uce the transmit p ower on mobile

stations less affected by the multi-path fading and shadow phenomenon and the interference of other cell sites when

the mobile station is not engaged in the call or is relativ ely nearer to the corresponding cell site. This is also used to

provide additional power to mobile stations having high call error rates, located in bad recep tion areas or f ar away

from the cell site.

The backward open loop pow er control is carried ou t in a co rresponding mobile station; the mobile station measures

power receiv ed f rom th e cell site and then, reversely in creases/decreases transm it power in order to compensate

channel changes caused by the forward link path loss and terrain characteristics in relation to the mobile station in the

cell site. By doing so, all the mobile transmit signals received by the base station have same strength.

Moreover, the backward closed loop pow er control used by the mobile station is performed to control power using

the commands issued out by the cell site. T he cell site rec eives the signal of each corresponding mobile station and

compares th is w ith th e pre -set th reshold v alue and th en, issu es ou t pow er increase/decrease commands to the

corresponding mobile station every 1.25msec (800 times per second). By doing so, the gain tolerance and the different

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radio propagation loss on the forward/backward link are complemented.

2.3 Voice Encoder and Variable Data Speed The bi- directional v oice serv ice h aving v ariable data speed prov ides v oice co mmunication w hich employs voice

encoder algorithm having power variable data rate between the base station and the mobile station. On the other hand,

the transmit voice encoder performs voice sampling and then, creates enco ded v oice pack ets to be sent ou t to th e

receive voice encoder, whereas the receive voice encoder demodulates the received voice packets into voice samples.

One of the two voice encoders described in the above is selected for use depending on inputted automatic conditions

and message/data; both of them utilize four-stage frames of 9600, 4800, 2400, an d 1200 bits per second for cellular

and 14400,7200,3600,1800 bits per s econd f or P CS, s o P CS prov ide relatively better voice quality (almost twice

better than the existing cellular sy stem). In ad dition, th is type of variable voice e ncoder u tilizes ad aptive threshold

values on selecting required data rate. It is ad justed in accordance with the size of background noise and the data rate

is increased to high rate only when the voice of caller is inputted.

Therefore, back ground n oise i s su ppressed and h igh-quality v oice transmission is possible under the environment

experiencing serious noise. In addition, in case th e caller does n ot talk, data transm ission rate is red uced so th at the

transmission is carried out in low energy. This will reduce the interference on other CDMA signals and as a result,

improve system performance (capacity increased by about two times).

2.4 Protecting Call Confidentiality Voice privacy is provided in the CDMA system by means of the private long code mask used for PN spreading. Voice

privacy can be ap plied on the traf fic channels on ly. All calls are in itiated using the public long co de mask for PN

spreading. The mobile station user may request voice privacy during call setup using the origination message or page

response message, and during traffic channel operation using the long code transition request order.

The T ransition to priv ate lon g co de m ask w ill n ot be performed if authentication is not performed. To initiate a

transition to the private or pu blic lo ng co de m ask, eith er th e base station or th e m obile station sends a lon g co de

transition request order on the traffic channel.

2.5 Soft Handoff A h andoff in w hich th e m obile station co mmences co mmunications w ith a n ew base station w ithout interrupting

communications with the old base station . Soft handoff can only be used between CDMA channels having identical

freqeuncy assignments.

2.6 Frequency Re-Use and Sector Segmentation Unlike the existing analog cellular system, the CDMA system can reuse the same frequency at the adjacent cell. there

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is no need to prepare a separate frequency plan. Total interference generated on mobile station signals received from

the cell site is th e su m of in terference g enerated f rom ot her mobile stations in the same cell site and interference

generated from the mobile station of ad jacent cell site. T hat is, each m obile station signal generates in terference in

relation to the signals of all the other mobile stations.

Total in terference f rom all th e ad jacent cell sites is the ratio of in terference f rom all th e cell sites v ersus total

interference from other mobile stations in the same cell site (ab out 65%). In the case of directional cell site, one cell

normally uses a 120 sector antenna in order to div ide the sector into three. In this case, each antenna is used only for

1/3 of mobile stations in the cell site and acco rdingly, interference is red uced by 1/3 on the average and th e capacity

that can be supported by the entire system is increased by three times.

2.7 Soft Capacity The subscriber capacity of the CDMA system is flexible depending on the relation between the number of users and

service classes. For exam ple, the system operato r can increase the number of channels available for use during the

busy hour despite the drop in call quality. This type of function requires 40% of normal call channels in the standby

mode during the handoff, in an effort to avoid call disconnection resulting from the lack of channels.

In addition, in the CDMA system, services and service charges are classified further into different classes so that more

transmit power can be allocated to high class service users for easier call set -up; they can also be given higher priority

of using hand-off function than the general users.

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3. S tructure and Functions of tri-band CDMA Mobile Phone

The hardware structure of CDMA mobile phone is made up of radio frequency (RF) part and logic part. The RF part

is co mposed of Receiv er part (Rx ), T ransmitter part (T x) and L ocal part (L O). For the purpose of operating on

tri-band, It is n ecessary du al T x path , tri Rx path , du al P LL and switching system for band selection. The mobile

phone antenna is connected with quadplexer which div ides antenna input/output signals between cellu lar f requency

band (824~894 MHz) and PCS frequency band (1850~1990MHz). Quadplexer carries out separating Rx band and Tx

band. The Rx signals from the antenna are directly converted into baseband signal by the frequency synthesizer and

frequency down converter. And then, are converted into digital signals v ia A nalog-to-Digital Con verter (A DC). In

front of the ADC, switching system is required to choose which band path should be open. The digital signals send to

5 correlators in each CDMA de-modulator. Of these, one is called a searcher whereas the remaining 4 are called data

receivers (fingers). Digitalized signals include a g reat number of call sig nals that have been sent out by the adjacent

cells. T hese sig nals are detected w ith pseudo -noise seq uence (P N Sequ ence). Sig nal to in terference ratio (C/I) on

signals that match the desired PN sequence are increased through this type of correlation detection process, but other

signals obtain processing gain by not increasing the ratio. The carrier wave of pilot chann el f rom the cell site m ost

adjacently located is demodulated in order to obtain the sequence of encoded data symbols. During the operation with

one cell site, th e searcher searches ou t multi-paths in accordance with terrain and bu ilding reflections. On three data

receivers, the most powerful 3 paths are allocated f or th e parallel tracin g and re ceiving. Fadin g resis tance can be

improved a great deal by obtaining the diversity combined output for de -modulation. Moreover, the searcher can be

used to determine the most powerful path f rom the cell sites even during the soft handoff between the two cell sites.

Moreover, 3 data receiv ers are allocated in order to carry out the de-modulation of these paths. Output data th at has

been demodulated changes the data string in the combined data row as in the case of original signals(deinterleaving),

and then, are demodulated by the forward error correction decoder which uses the Viterbi algorithm.

Mobile statio n user inf ormation sen d o ut f rom the m obile statio n to the cell site pass through the digital voice

encoder via a mike. Then, they are encoded and forward errors are corrected through the use of convolution encoder.

Then, the order of code rows is changed in accordance with a certain regulation in order to rem ove any errors in the

interleaver. Symbols made through the above p rocess ar e sp read after b eing load ed o nto P N ca rrier waves. At this

time, PN sequence is selected by each address designated in each call.

Signals that have been code spread as above are digital modulated (QPSK) and then, power controlled at the automatic

gain control amplifier (AGC Amp). Then, they are converted into RF band by the frequency synthesizer synchronizing

these signals to proper output frequencies.

Transmit signals obtained pass through the quadplexer filter and then, are sent out to the cell site via the antenna.

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4. Specification

4.1 General Specification

4.1.1 Transmit/Receive Frequency Interval 1) CELLULAR : 45 MHz

2) PCS : 80 MHz

4.1.2 Number of Channels (Channel Bandwidth)

1) CELLULAR : 20 Channels

2) PCS : 48 Channels

4.1.3 Operating Voltage

DC 3.3~4.2V

4.1.4 Battery Power Consumption

DC 3.7V

SLEEP IDLE MAX POWER

CELLULAR 1.0mA 80~90mA 550 mA (24.5 dBm)

PCS 1.0 mA 80~90mA 600 mA (24.5 dBm)

4.1.5 Operating Temperature

-20 C ~ +50 C

4.1.6 Frequency Stability

1) CDMA : 0.5PPM

2) PCS : 0.1PPM

4.1.7 Antenna

Fixed Type (Internal Antenna), 50

4.1.8 Size and Weight

1) Size : W x H x D : 103 x 52 x 16.6mm

2) Weight : 120.8g

4.1.9 Channel Spacing

1) CELLULAR : 1.25MHz

2) PCS: 1.25 MHz

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4.1.10 Battery Type, Capacity and Orerating Time Unit = Hours, Minutes

Standard (1000mAh)

Stand-by Time PCS(Slot Cycle 2) About 500 Hrs (SCI=2)

Cellular (Slot Cycle 2) About 500 Hrs (SCI=2)

Talk Time PCS(Slot Cycle 2) About 360 Min.(typical Quadplexer, -92dBm Input)

Cellular (Slot Cycle 2) About 350 Min.(typical Quadplexer, -92dBm Input)

4.2 Receive Specification

4.2.1 Frequency Range 1) CELLULAR : 869.820 MHz ~ 893.190 MHz

2) PCS : 1930 MHz ~ 1990 MHz

3) GPS : 1575.42 MHz

4.2.2 Local Oscillating Frequency Range

1) CELLULAR : 1738.08MHz ~ 1787.94MHz

2) PCS : 1715.56MHz 1768.89MHz

3) GPS : 3150.84MHz

4.2.3 Sensitivity

1) CELLULAR : -104dBm (C/N 12dB or more)

2) PCS : -104dBm (C/N 12dB or more)

3) GPS : -148.5dBm

4.2.4 Selectivity

1) CELLULAR : 3dB C/N Degration (With Fch 1.25 kHz : -30dBm)

2) PCS : 3dB C/N Degration (With Fch 1.25 kHz : -30dBm)

4.2.5 Interference Rejection

1) Single Tone : -30dBm at 900 kHz (CELLULAR), -30dBm at 1.25MHz(PCS)

2) Two Tone : -43dBm at 900 kHz & 1700kHz(CELLULAR), -43dBm at 1.25 MHz & 2.05 MHz

4.2.6 Spurious Wave Suppression

M aximum of - 80dB

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4.2.7 CDMA Input Signal Range Dynamic area of more than -104~ -25 dB: 79dB at the 1.23MHz band.

4.3 Transmit Specification

4.3.1 Frequency Range 1) CELLULAR : 824.820MHz ~ 848.190MHz

2) PCS : 1850 MHz ~ 1910 MHz

4.3.2 Local Oscillating Frequency Range

1) CELLULAR : 1738.08MHz ~ 1787.94MHz

2) PCS : 1715.56MHz ~1768.89MHz

4.3.3 Intermediate Frequency

Direct Conversion

4.3.4 Output Power

1) CELLULAR : 0.282W

2) PCS: 0.282W

4.3.5 CDMA TX Frequency Deviation

1) CELLULAR: +300Hz or less

2) PCS: 150Hz

4.3.6 CDMA TX Conducted Spurious Emissions

1) CELLULAR : 900kHz : - 42 dBc/30kHz below

1.98MHz : - 54 dBc/30kHz below

2) PCS : -42 dBc / 30KHz below

4.3.7 CDMA Minimum TX Power Control

1) CELLULAR : - 50dBm below

2) PCS: - 50dBm below

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4.4 MS (Mobile Station) Transmitter Frequency

4.4.1 CELLULAR mode

Ch # Center Freq. (MHz) Ch # Center Freq. (MHz)

1011

29

70

111

152

193

234

275

316

363

824.640

825.870

827.100

828.330

829.560

830.790

832.020

833.250

834.480

835.890

404

445

486

527

568

609

650

697

738

779

837.120

838.350

839.580

840.810

842.040

843.270

844.500

845.910

847.140

848.370

4.4.2 PCS mode

Ch # Center Freq (MHz) Ch # Center Freq (MHz) Ch # Center Freq (MHz)

25 1851.25 425 1871.25 825 1891.25

50 1852.50 450 1872.50 850 1892.50

75 1853.75 475 1873.75 875 1893.75

100 1855.00 500 1875.00 900 1895.00

125 1856.25 525 1876.25 925 1896.25

150 1857.50 550 1877.50 950 1897.50

175 1858.75 575 1878.75 975 1898.75

200 1860.00 600 1880.00 1000 1900.00

225 1861.25 625 1881.25 1025 1901.25

250 1862.50 650 1882.50 1050 1902.50

275 1863.75 675 1883.75 1075 1903.75

300 1865.00 700 1885.00 1100 1905.00

325 1866.25 725 1886.25 1125 1906.25

350 1867.50 750 1887.50 1150 1907.50

375 1868.75 775 1888.75 1175 1908.75

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13

4.5 MS (Mobile Station) Receiver Frequency

4.5.1 CELLULAR mode

Ch. # Center Freq. (MHz) Ch. # Center Freq. (MHz)

1011

29

70

111

152

193

234

275

316

363

869.640

870.870

872.100

873.330

874.560

875.790

877.020

878.250

879.480

880.890

404

445

486

527

568

609

650

697

738

779

882.120

883.350

884.580

885.810

887.040

888.270

889.500

890.910

892.140

893.370

4.5.2 PCS mode

Ch # Center Freq (MHz) Ch # Center Freq (MHz) Ch # Center Freq (MHz)

25 1931.25 425 1951.25 825 1971.25

50 1932.50 450 1952.50 850 1972.50

75 1933.75 475 1953.75 875 1973.75

100 1935.00 500 1955.00 900 1975.00

125 1936.25 525 1956.25 925 1976.25

150 1937.50 550 1957.50 950 1977.50

175 1938.75 575 1958.75 975 1978.75

200 1940.00 600 1960.00 1000 1980.00

225 1941.25 625 1961.25 1025 1981.25

250 1942.50 650 1962.50 1050 1982.50

275 1943.75 675 1963.75 1075 1983.75

300 1945.00 700 1965.00 1100 1985.00

325 1946.25 725 1966.25 1125 1986.25

350 1947.50 750 1967.50 1150 1987.50

375 1948.75 775 1968.75 1175 1988.75

4.5.3 GPS mode : 1575.42MHz

4.5.4 Bluetooth mode : 2400MHz ~ 2483.5MHz

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14

4.6 AC Adaptor See Appendix

4.7 Cigar Lighter Charger

See Appendix

4.8 Hands-Free Kit

See Appendix

5. Installation

5.1 Installing a Battery Pack 1) The Battery pack is keyed so it can only fit one way. Align the groove in the battery pack with the rail

on the back of the phone until the battery pack rests flush with the back of the phone.

2) Slide the battery pack forward until you hear a “click”, which locks the battery in place.

5.2 For Adapter Use 1) Plug the adapter into a wall outlet. The adapter can be operated from a 110V source.

When AC power is connected to the adapter.

2) Insert the adapter jack into the phone with the installed battery pack.

Red light indicates battery is being charged.. Green light indicates battery is fully charged.

5.3 For Mobile Mount

5.3.1 Installation Position In order to red uce echo sound when using the Hands -Free Kit, m ake sure that the speaker and microphone are not

facing each other and keep microphone a generous distance from the speaker.

5.3.2 Cradle Installation

Choose an appropriate flat surface where the unit will not interface with driver’s movement or passenger’s co mfort.

The driver/user should be able to access th e phone with ease. Using the four self-tapping screws provided, mount the

supplied bra cket on th e selected area. T hen with th e f our m achine screws prov ided, m ount th e co unterpart on the

reverse side of the reverse side of the cradle. Secure the two brackets firmly together by using the two bracket joint

screws provide.

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15

The distance between the cradle and the interface box must not exceed the length of the main cable.

5.3.3 Interface Box

Choose an appropriate flat surface ( somewhere under the dash on the passenger side is pref erred ) and m ount the IB

bracket with the four self-tapping screws provided. Clip the IB into the IB bracket.

5.3.4. Microphone Installation

Install the microphone either by clipping I onto the sun visor (driver’s side) or by attaching it to door pos t (driver’s

side), using a Velcro adhesive tape (not included).

5.3.5 Cable Connections

5.3.5.1 Power and Ignition Cables Connect the red wire to the car battery positive terminal and the black wire to the car ground. Connect the green wire

to the car ignition sensor terminal. ( In order to operate HFK please make sure to connect green wire to ignition sensor

terminal.) Connect the kit’s power cable connector to the interface box power receptacle.

5.3.5.2 Antenna Cable Connection

Connect the antenna coupler cable co nnector f rom th e crad le to th e extern al anten na co nnector. ( A ntenna is n ot

included.)

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16

1. RF Transmit/Receive Part

1.1 Overview

The Tx and Rx part employs the Direct Conversion system. The Tx and Rx frequencies are respectively

824.04~848.97MHz and 869.04~893.97MHz for cellular and 1850~1910MHz and 1930~1990MHz for PCS. The

block diagram is shown in [Figure 1-1]. RF signals received through the antenna are seperated by quadplexer.

RF Signal fed into the low noise amplifier (in QSC6055) through the quadplexer. Then, they are combined with the

signals of local oscillator (VCO) at the down conversion mixer(in QSC6055) in order to create Base-band frequency.

Then, this signal is changed into digital signal by the analog to digital converter (ADC, A/D Converter), and the digital

circuit part of the QSC(Qualcomm Single Chip)6055 processes the data from ADC. The digital processing part is a

demodulator.

In the case of transmission, RF Transmitter(in QSC6055) receives QPSK-modulated anlog signal from the QSC6055.

In QSC6055, the baseband quadrature signals are upconverted to the Cellular or PCS frequency bands and amplified

to provide signal drive capability to the power amp.

After that, the RF signal is amplified by the Power Amp in order to have enough power for radiation.

Finally, the RF signal is sent out to the cell site via the antenna after going through the coupler and quadplexer.

[Figure 1-1] Block Diagram Of LG-UN270

1.2.1 Quadplexer (U102)

Chapter 2. Circuit Description

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17

The ACFM-7107 is a quadplexer that combines a US PCS duplexer, a cellular band duplexer and a S-GPS

band filter into a single, miniature package with a single antenna port.

The main function of quadplexer is to prohibit the other band signals from flowing into the

one band circuit and vice versa. RF designer can use common tri-band antenna regardless of frequency band

(800, 1575 and 1900 MHz).

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18

1.2.2 LNAs (U2101) The QSC6055 has cellular and PCS LNAs, respectively. The characteristics of Low Noise Amplifier (LNA) are low

noise figure, high gain, high intercept point and high reverse isolation.

The frequency selectivity characteristic of mobile phone is mostly determined by LNA.

The specification of UN270 LNAs are described below:

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19

1.2.2.1 Cellular CDMA LNA performance specifications

1.2.2.2 PCS CDMA LNA performance specifications

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20

1.2.3 GPS LNA (U1007)

The characteristics of L ow No ise A mplifier (L NA) are low n oise f igure, h igh g ain, h igh intercept point and high

reverse isolation. The frequency selectivity characteristic of mobile phone is mostly determined by LNA.

The specification of UN270 GPS LNA is described below

1.2.4 Down-converter Mixers (U2101) The QSC6055 device performs signal down-conversion for Cellular, PCS and GPS tri-band applications. It contains

all th e circu itry (w ith th e ex ception of ex ternal f ilters) needed to support conversion of received RF signals to

baseband signals. The three downconverting Mixers (Cellular, PCS and GP S), and an LO Buffer Amplifier to buffer

the RF VCO to the RF T ransmit Upco nverter. T he G PS L NA & m ixers of fer th e m ost ad vanced and in tegrated

CDMA Rx solution designed to meet cascaded Noise Figure (NF) and Third-order Intercept Point (IIP3) requirements

of IS-98C and J-STD-018 specifications for Sensitivity, Two-Tone Intermodulation, and Single-tone Desense.

Operation modes and band selection are specially controlled from the Qualcomm Single Chip QSC6055.

1.2.5 Rx RF SAW Filters (FL1004/FL1008)

The main function of Rx RF SAW filter is to attenuate mobile phone spurious frequency, attenuate direct RF

Frequency pick up, attenuate noise at the image frequency originating in or amplified by the LNA and suppress

second harmonic originating in the LNA. The Rx RF SAW filter usually called image filter.

1.2.6 RF Receiver (U2101)

The circu it functions of the RF Receiver(in QSC6055) include Rx Automatic Gain Controller (AGC) with 90 dB

dynamic range, quadrature RF mixers, down-conversion mixer from RF to base -band, low pass filters and A nalog to

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21

Digital Converters (ADC) for converting to digital base-band. The RFR includes clock generators that drive the digital

processor and a VCO which generates the LO frequency for base-band down-conversion.

Switching system is located in front of the RFR RX_IN_C_LB and RX_IN_C_HB terminal and is for band selection

between cellular and PCS. T he Rx AGC either amplifies or attenu ates the received CDMA RF sig nal to prov ide a

constant-amplitude signal to the I/Q down-converter. The RF output of the Rx AGC amplifier separate into I-channel

and Q-channel base-band components and down-converted by mixer with quadrature LO. LO signals are generated by

a Voltage Controlled Oscillator (VCO) and f requency stabilized by external varactor-tuned resonant tank circuit. The

I/Q down converter outputs the CDMA signals at baseband frequency. Low-pass filtering enables the receiver to select

the desired baseband sig nals f rom the ef fects of u nwanted n oise or ad jacent-channel in terference. I/Q base band

components are converted to digital signals by two identical 4-bit ADCs.

1.3 Description of Transmit Part Circuit

1.3.1 RF Transmitter (U2101) The RF Transmitter(in QSC6055, base-band-to-RF Transmit Processor) performs all Tx signal-processing functions

required between digital base -band and th e Power Amplifier Module (PAM). The base-band quadrature signals are

up-converted to the Cellular or PCS frequency bands and amplified to provide signal drive capability to the PAM. The

RFT in cludes an RF m ixer f or u pconverting analog baseba nd to RF, a prog rammable PLL for generating Tx LO

frequency, two cellular and two PCS driver amplifiers and Tx power control through an 85 dB VGA. As added benefit,

the single sideband upconversion eliminates the need for a band pass filter normally required between the upconverter

and driver amplifier.

I, I/, Q an d Q/ s ignals proceed from the QSC6055 are analog signal. In CDMA mode, These signals are modulated

by Quadrature Phase Shift King (QPSK). I and Q are 90 deg . out of phase, and I and I/ are 180 deg . Tx IF signal can

be obtain ed by m ixing an alog s ignal w ith 228.6 MHz(Cellular)/263.6(PCS) 1 st local osillator f requency w hich is

generated by Tx VCO. The Tx IF s ignal is amplified by AGC controlled by QSC6055. The second mixer on RFT

converts I F signals into RF signals . After p assing thr ough the upconverter , RF signal is inputted into the Power

Amplifier Module.

1.3.1.1 Cellular CDMA transmit signal path performance specifications

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22

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23

1.3.1.2 PCS CDMA transmit signal path performance specifications

1.3.2 Dual Power Amplifier (U1000)

The power amplifier that can be u sed in th e PCS and CDMA m ode h as lin ear am plification capab ility and h igh

efficiency. For higher efficiency, it is made up of one MMIC (Monolithic Microwave Integrated Circuit) for which RF

input ter minal and in ternal inter face cir cuit ar e in tegrated o nto o ne IC after going thro ugh the AlGaAs/GaAs HBT

(heterojunction bipolar transistor) process. The module of pow er am plifier is m ade u p of an ou tput end in terface

circuit including th is MMIC. T he maximum power that can be inputted t hrough the input terminal is +1 0dBm and

conversion gain is about 28dB. RF transmit signals that have been am plified through the power amplifier are sent to

the quadplexer.

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24

1.4 Description of Frequency Synthesizer Circuit

1.4.1 Voltage Control Temperature Compensation Crystal Oscillator (VCTCXO, X2201)

The temperature variation of mobile phone can be compensated by TCXO. The reference frequency of a mobile phone

is -30~+85 C. The receives frequency tuning signals called T RK_LO_ADJ from QSC6055 as 0.5V~2.5V DC via R

and C filter in order to generate the reference f requency of 19. 2MHz and in put it in to the f requency synthesizer of

UHF band. Frequency stability depending on temperature is 2.0 ppm.

2. Digital/Voice Processing Part

2.1 Overview The digital/voice processing part processes th e u ser's co mmands and processes all th e dig ital and v oice sig nal

processing in order to operate in the phone. The digital/voice processing part is made up of a keypad/LCD, receptacle

part, voice processing part, modem part, memory part, and power supply part.

2.2 Configuration

2.2.1 Keypad/LED and Receptacle Part This is used to transmit k eypad sig nals to QSC6055. It is m ade u p of a k eypad back light part th at illuminates th e

keypad, LCD part that displays the operation status onto the screen, and a receptacle that receives and sends out voice

and data with external sources.

2.2.2 Voice Processing Part

The voice processing part is m ade up of an audio co dec used to convert MIC signals into digital voice signals and

digital voice signals into analog voice signals, amplifying part for amplifying the voice signals and sending them to the

ear piece, amplifying part that amplifies ringer signals coming out from QSC6055, and amplifying part that amplifies

signals coming out from MIC and transferring them to the audio processor.

2.2.3 QSC6055 Part

QSC6055 (Qualcomm Single Chip) is the core elem ents of CDMA terminal and carries out the functions of CPU,

encoder, interleaver, deinterleaver, Viterbi decoder, Mod/Demod, and vocoder.

2.2.4 Memory Part

The memory part is made up of a DDR/NAND memory.

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25

2.2.5 Power Supply Part

The pow er su pply part is m ade u p of circuits f or g enerating v arious ty pes of power, used for the digital/voice

processing part.

2.3 Circuit Description

2.3.1 Keypad/LCD and Receptacle Part Once th e k eypad is press ed, th e k ey s ignals are s ent out to QSC6055 for proces sing. In addition , when th e k ey is

pressed, the keypad lights up through the use of 7 LEDs. The terminal status and operation are displayed on the screen

for the user with the characters and icons on the LCD.

Moreover, it exchanges aud io signals and data with external sources through the rec eptacle, and then receives power

from the battery or external batteries.

2.3.2 Audio Processing Part

MIC signals are in putted into the audio codec (included in QSC6055) and converted into digital signals. Oppositely,

digital audio signals are converted into analog signals after going through the audio codec. These signals are amplified

at the audio amplifier and transmitted to the ear-piece. The signals from QSC6055 activate the ringer by using signals

generated in the timer in QSC6055.

2.3.3 MODEM Part

QSC6055 is the core element of CDMA system terminal that includes ARM926 EJS microprocessor core. It supports

both CDMA and GPS, operating in both the cellular and PCS spectrums. The subsystems within the QSC6055 include

a CDMA processor , a m ulti-standard Voco der, an in tegrated CODEC w ith earpiece and microphone amplifiers,

general-purpose A DC f or su bsytem m onitoring, an ARM926 EJ S microprocessor, and both Universal Serial

Bus(USB) and an RS-232 serial interfaces supporting forward and reverse link data communications of 307.2 Kbps

simultaneously. And it also co ntains complete digital modulation and demodulation systems for CDMA standards, as

specified in IS-95-A/B/C.

In QSC, coded symbols are in terleaved in order to co pe with multi-path fading. Each data chann el is scrambled by

the long co de P N seq uence of the user in order to ensu re the co nfidentiality of calls. Moreover, binary quadrature

codes are used based on walsh functions in order to discern each channel. Data created thus are 4-phase modulated by

one pair of Pilot PN code and they are used to create I and Q data.

When received, I and Q data are dem odulated into symbols by the demodulator, and then de-interleaved in reverse to

the case of transmission. Then, the errors of data received from viterbi decoder are detected and corrected. They are

voice-decoded at the vocoder in order to output digital voice data..

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26

[Figure 2-2] Block Diagram of Digital/Voice Processing Part

2.3.4 Memory Part

MCP contents 1 Gbits N AND f lash m emory an d 512 M bits D DR S RAM. In th e F lash M emory part of M CP are

programs used for terminal operation. T he p rograms can be changed through down loading after the assembling of

terminals. On the SDRAM data generated during the terminal operation are stored temporarily.

2.3.5 Power Supply Part

When the battery voltage (+4.0V) is fed and the PWR key of keypad is pressed, the power-up circuitry in PM (power

management) circuit(in QSC6055) is activated by the PWR_ON_SW/ signal, and then the LDO regulators embedded

in PM circuit are operated and +1.3V_MSMC, +2.6V_MSMP, +1.8V_MSME and +2.1V_MSMA are generated.

The Rx part (+2.1V_RFRX) and Tx part voltage (+2.1V_RFTX) are regulated by QSC6055

2.3.6 Logic Part

The log ic part con sists of in ternal C PU of QSC, R AM, MCP. The QSC6055 receives TCXO (=19.2MHz) from

X2201 and controls the phone in both CDMA and GPS modes. The major components are as follows:

CPU

The ARM926 EJS microprocessor in cludes a 3 stag e pipelin ed RISC architectu re, both 32 -bit A RM and 16 -bit

THUMB instruction sets, a 32 -bit address bus, and a 32 -bit internal data bu s. It h as a h igh performance and low

power consumption.

MCP

Flash ROM is used to store the terminal’s program. Using the down-loading program, the program can be changed

even after the terminal is fully assembled.

SDRAM is used to store the internal flag information, call processing data, and timer data.

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27

External KEYPAD & Qwerty KEYPAD

For k ey recog nition, k ey matrix is setu p u sing Keycoder IC. 7 L EDs and backlight circuitry are included in the

keypad for easy operation in the dark.

TOUCH WINDOW

For key recognition, the touch controller MDR2 performs digital preprocessing of the touch-screen measuements

by u sing T OUCH_X+, T OUCH_Y+, T OUCH_X- an d T OUCH_Y-. T ouch w indows also supports vibe-touch

function when pressing is recognized.

LCD MODULE

LCD module contains a controller which will display the information onto the LCD by 16-bit data from the QSC6055.

UN270


28

1. Rx Part Trouble

1.1 DCN & PCS Rx Trouble

Chapter 3. Trouble Shooting

Rx TEST SETUP(HHP) - Test Channel : DCN 384

Test Point

Checking Flow

START

Redownload SW, CAL

[Figure 4-1-1] DCN & PCS Rx Part

Check

Check

Check

DCN or PCS?

Rx TEST SETUP(HHP) - Test Channel : PCS 600

Rx TEST SETUP(HHP) - Sector Power : -30 dBm

DCN

PCS

UN270


29

1.1.1 Checking DC Power Supply Circuit

C21392.2u

R2122

0

R2121

0

R2120

0

R2119

0

R2118

0

R2117

0

R2113

0R2114

0

R2116

0

R2115

0

C21490.1u

C21570.1u

C21560.1u

C21540.1u

C21520.1u

1u

C2155

1u

C2153

+1.8V_MSME

+2.6V_MSMP

C21500.1u

0.1u

C2151

1u

C2148

1u

C2147

+2.1V_RFRX2

1u

C2145

1u

C2146

1u

C2144

+2.8V_TCXO

+2.8V_LCD

1u

C2140

1u

C2143

1u

C2142

1u

C2141

+2.1V_RFRX1

2.2u

C2169

4.7u

C2170

1u

C2163

2.2u

C2164

2.2u

C2165

2.2u

C2166

2.2u

C2167

2.2u

C2172

4.7u

C2171

4.7u

C2168

R2123

0

R21VREG_RFRX1

+2.1V_RFRX1

+2.1V_MSMA

+2.8V_LCD

+1.8V_MSME

+2.1V_RFRX2

-1.8V_NCP

+1.3V_MPLL

+2.25V_SMPS_RF

+2.6V_MSMP

+2.1V_RFTX

+1.3V_MSMC

+2.8V_TCXO

+2.6V_BT

TP1

TP2

QSC6055

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30

1.1.2 Checking Rx Signal Path

UN270


31

1. Check TP1 of U1002If there is any major differencewith Graph 1-1-2-1

2. Check TP2(DCN Path)And TP3(PCS Path) of U1002If there is any major differencewith Graph 1-1-2-2

Waveform

Graph 1-1-2-1 Graph 1-1-2-2

Graph 1-1-2-3 (a) Graph 1-1-2-3 (b)

UN270


32

1.1.3 Checking VCTCXO Circuit

UN270


33

TP1 (+2.8V_TCXO)

TP2(VCTCXO : 19.2Mhz)

Internal Use Only

Graph 1-1-3

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34

2. Tx Part Trouble

2.1 DCN & PCS Tx Trouble

2.1.1 Checking DC Power Supply Circuit

UN270


35

2.1.2 Checking VCTCXO Circuit

222222222222222222222222222222.11..1.1...111.1..1.1.1..1111...1111111...................2 2222222222222222222222222 222 222222 ChCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCChCCCCC eecckkkiinng g gg VVVCCTTTCCXXXOO CiCirrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrcccccccccccccccccccccccccccccccccccccccccccccccccccccuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuitiiiiiiiiiiiiiiiiit

C21392.2u

R2122

0

R2121

0

R2120

0

R2119

0

R2118

0

R2117

0

R2113

0R2114

0

R2116

0

R2115

0

C21490.1u

C21570.1u

C21560.1u

C21540.1u

C21520.1u

1u

C2155

1u

C2153

+1.8V_MSME

+2.6V_MSMP

C21500.1u

0.1u

C2151

1u

C2148

1u

C2147

+2.1V_RFRX2

1u

C2145

1u

C2146

1u

C2144

121K

R2112

+2.8V_TCXO

R2111

10

+2.8V_LCD

1u

C2140

1u

C2143

1u

C2142

1u

C2141

+2.1V_RFRX1

2.2u

C2169

10u

C2174

0.1u

C2158

4.7u

C2170

1u

C2163

2.2u

C2164

2.2u

C2165

2.2u

C2166

2.2u

C2167

2.2u

C2172

4.7u

C2171

4.7u

C2168

1u

C2173

47

C2175

R2123

0

AB18

V22

V23

U22

R21

AB17

K22

K21

K18

K16

J23

J21

H22

H18

H16VDD_RFTX_1

VDD_RFTX_2

VDD_RFTX_3

VDD_RFTX_4

VDD_RFTX_5

VDD_RFTX_6

VDD_RFTX_7

VDD_RFTX_8

VDD_RFTX_9

VDD_SPKR

VREG_RFRX1

REF_BYP

REF_GND

REF_ISET

VREG

5V+2.1V_RFRX1

+2.1V_MSMA

+2.8V_LCD

+VPWR

+1.8V_MSME

+2.1V_RFRX2

-1.8V_NCP

+1.3V_MPLL

2.25V_SMPS_RF

+2.6V_MSMP

+2.1V_RFTX

+2.1V_RFTX

+2.1V_RFTX

+1.3V_MSMC

+2.8V_TCXO

+2.6V_BT

TP1

TP2

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36

UN270


37

TP1 (+2.8V_TCXO)

TP2(VCTCXO : 19.2Mhz)

Internal Use Only

UN270


38

2.1.3 Checking Tx SAW Filter IN/OUT

UN270


39

2.1.4 Checking Tx Dual PAM

UN270


40

DCN TX

PCS TX

Internal Use Only

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41

2.1.5 Checking Quadplexer and Mobile Switch

TP4

TP3TP2

TP1

Internal Use Only

TP1,TP2[Graph 2-1-5(a)]

TP3,TP4[Graph 2-1-5(b)]

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42

3. Bluetooth Trouble

TP1

TP9

TP5

TP4 TP8

TP6

TP7

TP2

TP3

1

6

2

4

5

3

Internal Use Only

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43

UN270


44

4. Power

4.1 Power On Trouble

TP8

TP4

TP6 TP3

TP5 TP7

TP1

TP2

UN270


45

Circuit Internal Use Only

UN270


46

TP3TP4TP5TP8TP6TP7

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47

4.2 Charging Trouble

Check 5.0V(R3006)

+VPWR(C3020)

[Figure 4-3-9] Charging part

[Figure 4-3-8] Charging part

Check 5.0V(D3001)

CNC3001

TP4

TP2TP3

TP5

TP2

TP5

TP3

TP4

TP1

TP1

UN270


48

TP1

TP2

TP3

TP4

TP4

UN270


49

5. Logic Part Trouble

5.1 LCD Trouble

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50

[Figure 4-4-1-4] Charge Pump for Main LCD Back Light

[Figure 4-4-1-5] Main Connector LCD part Check Circuit

TP1

CP_EN(TP2)

CPI2C data(TP3)

CPI2C clock(TP4)

2.8V_LCD(TP5)

TP6

TP7

TP8TP9

TP10

TP11

LCD_DATA[0]~[3](TP12)



LCD_DATA[12]~[15](TP15)

Internal Use Only

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52

5.2. Camera Trouble

[Figure 4-4-2-2] Charge Pump Part for CAM power

CP_EN(TP4)

CPI2C data(TP5)

CPI2C clock(TP6)

TP1

TP2

TP3

Internal Use Only

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53

CAM_DATA [0]~[3](TP15)

CAM_DATA [4]~[7](TP16)

CAM 12C data(TP7)

CAM 12C clock(TP8)

MCLK(TP9)

(TP11) (TP12)

TP14

TP13

PCLK(TP10)

Internal Use Only

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55

5.3 Audio Trouble 5.3.1 Speaker Trouble

SPK+(TP1)

HPH_OUT_L_P(TP3)

HPH_OUT_L_P(TP4)

SPK-(TP2)

1uC5016

C5017 1u

IC6501WM9093ECS-R

C3

C2

D1

D3D4

C1

D2IN2-

IN1+

SVDD

IN3-

IN2+

IN1-

IN3+

HPH_OUT_L_P

HPH_OUT_R_N

L5002 82n

L5003 82n

VA5102 VA5103

EMS1812TPB6

CN5001

2

1

SPK-

SPK+

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57

5.3.2 MIC Trouble

USB_D+VIB_DRV/GREEN_ENRED_ENMIC_BIASHPH_OUT_RHPH_OUT_L

2.2K

R8015

USB_D+

MIC_BIAS

HPH_OUT_L_PHPH_OUT_R_N

RED_ENGREEN_EN

Close to QSC

MIC_BIAS (TP1, R8015) MIC_BIAS (TP2, R104)R104

0

L100

82n

MIC100SUMY0003816

OBM-410L44-RC1882

2 1

VA100

ICVL0505101V150FR

MIC_BIAS

MIC1P

[MIC]

CLOSE TO MIC

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59

5.3.3 Receiver Trouble

VA104 VA105

CN103

2

1EAR10P

EAR10N

EAR10 (TP1)

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5.3.4 Ear-Jack Trouble

D51

00

10u

C51

02

+2.6V_MSMP+2.6V_MSMP

15K

R51

02

C51

0347

0p

R5104

1K1K

R5103

NCS2200SQ2T2GU51012

3

14

5

VCC

VIN-

OUT VIN+GND

+2.6V_MSMP

R51

0556

0KR

5106

47K

1uC

5104

U5100NLAS3158MNR2G

67

38

5

401

11

29

121A0VCC2

0B0VCC1

0B1

A1S0

1B0

GND11B1

GND2S1

EAR_MIC

EARPHONE_KEY

MIC_BIAS_EN

J5100JAM3333-F47-7F

2

3

4

5

6

1M5-MIC

ASSIST_PIN

M3-DETECT

M4-L

M1-R

M6-GND

ICVL

0505

101V

150F

RVA

5101

VA51

00IC

VL05

0510

1V15

0FR

EAR_MIC

PAD_EAR_SENSE/

HPH_L

HPH_R

EAR_MIC (TP6)MIC_BIAS (TP5)

EARPHONE_KEY (TP7)

HPH_OUT_L/R (TR4)HPH_L/R (TP3)

PAD_EAR_SENSE (TP1)EAR_SENSE (TP2)

1uC5016

C5017 1u

WM9

C3

C2

D1

D3

C1

D2 IN2-

IN1+

IN3-

IN2+

IN1-

IN3+

HPH_OUT_L_P

HPH_OUT_R_N

A4

A1A2

A5

A3B5CPVDD

CPVSS

CN

HPLHPR

CP

20R

6501

0.1u

C65

03

0.1u

C65

04R

6502

200.1u

C65

08

2.2u

C65

06

C65

072.

2u

C65

052.

2u

HPH_L

HPH_R

Internal Use Only

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63

5.4 Vibrator & Touch Trouble

TOUCH_I2C(TP4)

TOUCH_EN (TP8)

MOTOR_EN(TP6)

Motor VDP/VDN(TP0)

LIN_PWM_FREQ(TP5)

TOUCH_IRQ(TP7)

CP_EN(TP2)

CP_I2C(TP3)

+2.6V_TOUCH(TP1)

Circuit

Internal Use Only

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66

5.5 USB Trouble

CN3001

15

13

11

9

7

5

4

3

2

1

14

12

10

8

6

1uC3006

ZD3000

ZD3001

+2.6V_MSMP

C3009

DNI

C3010

DNI

D3001

200K

R3007

33n

C3011

VA3002

USB_D-USB_D+ACC_ADC

ID

D+

D-

VBUS

+5V_USB(TP2, D3006)

USB_D+/D-(TP1, C3010/C3009)

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5.4 Disassembly Guide for Hidden Screw

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IMPORTANT

Read This Information Before Using Your Hand-Held Portable Cellular Telephone

First introduction in 1984, the hand-held portable cellular telephone is one of the most exciting and innovative electronic products ever developed.

With it you can stay in contact with your office, your home, emergency service, and others. For the safe and efficient

operation of your phone, observe these guidelines.

Your cellular phone is a radio transmitter and receiver. When it is ON, it receiv es and also sends o ut radio frequency

(RF) energy. T he ph one operates in th e f requency ra nge of 824 MHz to 894 MHz an d em ploys com monly u sed

frequency modulation (FM) techniques. When you use your phone, the cellular system handling your calls controls the

power level at which your phone transmits. The power level can range from 0.006 of a watt to .6 of a watt.

Exposure to Radio Frequency Energy In 1991 the Institute of Electrical and Electron ics Engineers (IEEE), and in 1992 th e American National Standards Institute (ANSI) updates the 1982 ANSI Standard for safety levels with respect to human exposure to RF energy. Over 120 scientists, engineers, and physicians from universities, government health agencies, and industry, after reviewing the av ailable boy of research , deve loped th is u pdated S tandard. In March, 1993, the US Federal Communications Commission (FCC) proposed the adoption of this updated Standard.

The design of your ph one co mplies with th is u pdated S tandard. Of co urse, if you want to lim it RF exposu re even further than the updated ANSI Standard, you may choose to control the duration of your calls and opration your phone in the most power efficient manner.

Efficient Phone Operation

For your phone to operate at th e low est pow er lev el, co nsistent w ith satisf actory call qu ality, please observ e th e following guidelines:

If your phone has an exten dable antenna, extend it fully. Some models allow you to place a call w ith th e anten na

retracted. However, your phone operates more efficiently with the antenna fully extended.

Hold the phone as you would any other telephone. While speaking directly into the mouthpiece, position the antenna

up and over your shoulder.

Do not hold the antenna when the phone is “IN USE ” . Holding the antenna a ffects call qu ality and m ay cause the

phone to operated at a higher power level than needed.

Antenna Care and Replacement

Safety

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Do not use the phone with a damaged antenna. If a damaged antenna comes into contact with skin, a minor bum may

result. Replace a damaged antenna immediately. Consult your manual to see if you may change your antenna yourself.

If so, use only a manufacture approves antenna. Otherwise, take your phone to a qualifies service center for repair.

Use only the supplied or approved antenna. Non-approved antennas, modifications, or attachments, could impair call

quality, damage the phone, and violate FCC egulations.

Driving

Check the laws and regulations on the use of cellular telephones in the areas where you drive. Always obey them. Also,

when using your phone while driving, please:

Give full attention to the driving. Use hands-free operation, if available, and pull off the road and park before making

or answering a call if driving conditions require.

Electronic Devices Most modem electronic equipment is shielded f rom RF en ergy. However, RF ener gy f rom cellu lar telep hones may affect inadequately shielded electronic equipment.

RF energy may effect improperly installed or inadequately shielded electronic operating and entertainment system in

motor vehicles. Check with the manufacturer or its representative to determine if these systems are adequately shielded

from external RF energ y. You sh ould check with th e m anufacturer of any eq uipment th at h as been ad ded to y our

vehicle.

Consult the manufacturer of any personal medical devices (such as pacemakers, hearing aids, etc.) to determine if they

are adequately shielded from external RF energy.

Turn y our ph one OFF in h ealth care f acilities. W hen any regu lations posted in the areas instruct y ou to do so.

Hospitals or health care facilities may be using equipment that could be sensitive to external RF energy.

Aircraft

Turn your phone OFF before boarding any aircraft.

Use it on the ground only with crew permission. Do not use it in the air.

To prevent possible interference with aircraft systems, US Federal Aviation Administration (FAA) regulations require

you to h ave permission from a crew member to u se your phone while the plane is on the ground. Using your phone

while the plane is in the air.

Children

Do not allow children to play with your phone. It is n ot a toy. Children could hurt themselves or oth ers (by poking themselves or others in the eye with the antenna, for example). Children also co uld damage the phone, or make calls that increase your telephone bills.

Blasting Areas

To avoid interfering with blasting operations, turn you unit OFF when in a “blasting area” or in areas posted “Turn off

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two-way radio” . Construction crews often use remote control RF devices to set off explosives.

Potentially Explosive Atmospheres

Turn y our ph one OFF w hen in any area w ith a potentially explosiv e atm osphere. It is rare, bu t your phone or accessories could generate sparks. Sparks in such area cou ld cause an ex plosion or fire resulting in bodily injury or even death.

Areas with a potentially explosive atmosphere are often, but n ot always, clearly marked. They include fueling areas

such as g as station; below deck on boats; f uel or chem ical tr ansfer or storage f acilities; areas w here the air co ntains

chemical or particles, such as grain, dust, or metal powders; and any other area where you would normally be advised

to turn off your vehicle engine.

Do not transport or store flammable gas, liquid, or explosives in the compartment of your vehicle which contains your

phone or accessories.

Vehicles using liquefied petroleum gas (such as propane or butane) must compl7y with the National Fire Protection

Standard (NFPA-58). For a copy of this standard, contact the National Fire Protection Association, One Battery march

Park, Quincy, MA 02269, Attn: Publication Sales Division.

Rule of Thumb: Using common sense at all times when handling, installing or using the phone. Any questions should be directed to you nearest Service Center or authorized service technician or electrician.

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General Terms Abbreviated Alert. An abbreviated alert is u sed to remind the mobile station user that previously selected alternative

routing features are still active.

AC. See Authentication Center.

Access Attempt. A sequence of o ne or m ore access probe seq uences on th e A ccess Ch annel co ntaining th e sam e

message. See also Access Probe and Access Probe Sequence.

Access Channel. A Reserv e CDMA Ch annel u sed by m obile station s f or communicating to the base station. The

Access Ch annel is u sed f or sh ort sig naling m essage exchang es su ch as call origination’s, responses to p ages, and

registrations. The Access Channel is a slotted random access channel.

Access Channel Message. The information part of an access probe con sisting of the message body, length field, and

CRC.

Access Channel Message Capsule. An Access Channel message plus the padding.

Access Channel Preamble. The preamble of an access probe consisting of a sequence of all-zero frames that is sent at

the 4800bps rate.

Access Channel Request Message. An Access Channel message that is autonomously generated by the mobile station.

See also Access Channel Response Message.

Access Channel Response Message. A message on th e Access Ch annel g enerated to rep ly to a m essage receiv ed

from the base station.

Access Channel Slot. The assigned time interval for an access probe. An Access Channel slot co nsists of an in teger

number of frames. The transmission of an access probe is performed within the boundaries of an Access Channel slot.

Access Probe. On e A ccess Ch annel transm ission co nsisting of a preamble and a m essage. T he transmission is an

integer number of frames in length and transmits one Access Channel message. See also Access Probe Sequence and

Access Attempt.

Access Probe Sequence. A sequence of one or more access probes on the Access Channel. The same Access Channel

message is transmitted in every access probe of an access attempt. See also Access Probe and Access Attempt.

Acknowledgement. A Layer 2 response by the mobile station or the base station confirming that a signaling message

was received correctly.

Action Time. The time at which the action implied by a message should take effect.

Active Set. The set of pilots associated with the CDMA Channels containing Forward Traffic Channels assigned to a

particular mobile station.

Aging. A mechanism through which the mobile station maintains in its Neighbor Set the pilots that have been recently

sent to it from the base station and the pilots whose handoff drop timers have recently expired.

A-key. A secret, 64 -bit pattern stored in the mobile station. It is u sed to generate update the mobile station ’ s Shared

Secret Data. The A-key is used in the mobile station authentication process.

Glossary

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Analog Access Channel. An analog control channel used by a mobile station to access a system to obtain service.

Analog Color-Code. An analog signal (see Supervisory Audio Tone) transmitted by a base station on an analog voice

channel and used to detect capture of a mobile station by an interfering base station or the capture of a base station by

an interfering mobile station.

Analog Control Channel. An analog channel used for the transmission of dig ital co ntrol information from a base

station to a mobile station or from a mobile station to a base station.

Analog Paging Channel. A forward analog control channel that is used to page mobile stations and send orders.

Analog Voice Channel. An analog channel on which a voice conversation occurs and on which brief digital messages

may be sent from a base station to a mobile station or from a mobile station to a base station.

Authentication. A procedure used by a base station to validate a mobile station’ s identity.

Authentication Center (AC). An entity that manages the authentication information related to the mobile station.

Authentication Response (AUTHR). An 18-bit ou tput of th e auth entication alg orithm. It is u sed, f or example, to

validate mobile station registrations, origination and terminations. A method of registration in which the mobile station

registers without an explicit command from the base station.

AWGN. Additive White Gaussian Noise.

Bad Frames. Frames classified as erasures (frame category 10) or9600bps frames, primary traffic only with bit errors

(frame category 9). See also Good Frames.

Base Station. A station in th e Do mestic P ublic Cellu lar Rad io T elecommunications Serv ice, oth er th an a m obile

station, used for communicating with mobile stations. Depending upon the context, the term base station may refer to a

cell, a sector within a cell, an MSC, or other part of the cellular system. See also MSC.

Base Station Authentication Response (AUTHBS). A n 18 -bit pattern g enerated by t he auth entication alg orithm.

AUTHBS is used to confirm the validity of base station orders to update the Shared Secret Data.

Base Station Random Variable (RANDBS). A 32-bit random number g enerated by th e m obile station f or

authenticating base station orders to update the Shared Secret Data.

BCH Code. See Bose-Chaudhuri-Hocquenghem Code.

Busy-Idle Bits. The portion of the data stream transmitted by a base station on a forward analog control channel that

is used to indicate the current busy-idle status of the corresponding reverse analog control channel.

Call Disconnect. T he process that releases the resources handling a particu lar call. The disconnect process bein gs

either when th e m obile station u ser in dicates th e end of th e call by g enerating an on -hook con dition or other call

release mechanism, or when the base station initiates a release.

Call History Parameter(COUNT). A modulo-64 event counter maintained by the mobile station and Authentication

Center that us used for clone detection.

Candidate Set. The set of pilots th at h ave been receiv ed w ith su fficient streng th by th e m obile station to be

successfully dem odulated, bu t h ave n ot been pl aced in th e A ctive Set by the base station. See also Active Set.

Neighbor Set, and Remaining Set.

. See Code Division Multiple Access

CDMA Channel. The set of channels transmitted betw een th e base station w ithin a g iven CDMA f requency s

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assignment. See also Forward CDMA Channel and Reverse CDMA Channel.

CDMA Channel Number. An 11-bit number corresponding to the center of the CDMA frequency assignment.

CDMA Frequency Assignment. A 1.23MHz segment of spectrum centered on one of the 30KHz channels of the

existing analog system.

Code Channel. A subchannel of a Forward CDMA Channels. A Forward CDMA Channel contains 64 code channels.

Code channel zero is assigned to the P ilot Channel. Code channels 1 through 7 may be assigned to the either P aging

Channels or the Traffic Channels. Code Ch annel 32 m ay be assigned to eith er a Sy nc Channel or a T raffic Channel.

The remaining code channels may be assigned to Traffic Channels.

Code Division Multiple Access (CDMA). A technique for spread-spectrum multiple-access digital communications

that creates channels through the use of unique code sequences.

Code Symbol. The ou tput of an error -correcting enco der. In formation bits are in put to th e enco der and code

symbols are output from the encoder. See Convolutional Code.

Continuous Transmission. A mode of operation in which Discontinuous Transmission is not permitted.

Control Mobile Attenuation Code(CMAC). A 3 -bit f ield in th e Con trol-Filler Message th at speci fies th e

maximum authorized power level for a mobile transmitting on an analog reverse control channels.

Convolution Code. A type of error -correcting co de. A code sy mbol can be con sidered as th e convolution of the

input data sequence with the impulse response of a generator function.

CRC. See Cyclic Redundancy Code.

Cyclic Redundancy Code (CRC). A class of lin ear error detectin g co des which g enerate parity check bits by

finding the remainder of a polynomial division.

Data Burst Randomizer. The function that determines which power control groups within a f rame are transmitted

on the Reverse Traffic Channel when the data rate is lower than 9600 bps. The data burst randomizer determines, for

each m obile station , th e pseudo ran dom position of th e transm itted pow er co ntrol g roups in th e f rame while

guaranteeing that every modulation symbol is transmitted exactly once.

DBc. The ratio(in dB) of the sideband power of a signal, measured in a g iven bandwidth at a g iven frequency offset

from the center f requency of the same signal, to th e to tal inband power of the signal. For CDMA, the total inband

power of the signal is measured in a 1.23MHz bandwidth around the center frequency of the CDMA signal.

DBm. A measure of power expressed in terms of its ration (in dB) to one milliwatt.

DBm/Hz. A measure of power spectral density . DBm/Hz is the pow er in one Hertz of bandwidth. Where power is

expressed in units of dBm.

DBW. A measure of power expressed in terns of its ration (in dB) to one Watt.

Dedicated Control Channel. An analog conrtol channel used for the transmisson of digital control information from

either a base station or a mobile station.

Deinterleaving. The process of unpermuting the symbols that were permuted by the interleaver..

Deinterleavering is performed on reveived symbols prior to decoding.

Digital Color Code(DCC). A digital signal transmitted by a base station on a forward analog control channel that is

used to detect capture of a base station by an interfering mobile station.

Dim-and-Burst. A frame in which primary traffic is multiplexed with either secondary traffic or signaling traffic.

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Discontinuous Transmission (DTX). A m ode of operation in w hich a m obile station transm itter auton omously

switches between two transmitter power levels while the mobile station is in the conversation state on an analog voice

channel.

Distance-Based Registration. An autonomous registration method in which the mobile station registers whenever it

enters a cell whose distance from the cell in which the mobile station last registered exceeds a given threshold.

DTMF. See Dual Tone Multifrequency.

Dual-Tone Multifrequency(DTMF). Signaling by the simultaneous transmission of two tones, one from a group of

low frequencies and another from a group of high frequencies. Each group of frequecies consists of four frequencies.

Eb. The energy of an information bit.

Ec/I0. The ratio in (dB) between the pilot energy accumulated over one PN chip period(Ec) to th e power spectral

density in the received bandwidth(Io).

Effective Radiated Power (ERP). The transmitted power multiplied by the antenna gain referenced to a h alf wave

dipole.

Electronic Serial Number(ESN). A 32-bit number ass igned by th e m obile station m anufacturer, u niquely

identifying the mobile station equipment.

Encoder Tail Bits. A fixed sequence of bits added to the end of a block of data to reset the convolutional encoder to

a known state.

ERP. See Effective Radiated Power.

ESN. See Electronic Serial Number.

Extended Protocol. An optional expansion of the signaling message between the base station and mobile station to

allow for the addition of new system features and operational capabilities.

Fade Timer. A timer kept by the mobile station as a measure of Forward Traffic Channel continuity. If the Fade timer

expires, the mobile station drops the call.

Flash. An indication sent on an analog voice channel or CDMA Traffic Channel indicating that the user Directed the

mobile station to invoke special processing.

Foreign NID Roamer. A mobile station operating in the same system (SID) but a dif ferent network (NID)Form the

one in which service was subscribed. See also Foreign SID Roamer and Roamer.

Foreign SID Roamer. A m obile station operatin g in a sy stem (SID) other th an th e on e f rom w hich serv ice was

subscribed. See also Foreign NID Roamer and Roamer.

Forward Analog Control Channel (FOCC). An analog voice channel used from a base station to a mobile station.

Forward Analog Voice Channel (FVC). An analog voice channel used from a base station to a mobile station.

Forward CDMA Channel. A CDMA Channel form a base station to mobile stations. The Forward CDMA Channel

contains one or more code channels that are transmitted on a CDMA frequency assignment using a Particular pilot PN

offset. The code channels are associated with the Pilot Channel, Sync Channel, Paging Channels, and Traffic Channels.

The Forward CDMA Channel always carries a P ilot Ch annel and may carry u p to on e Sync Ch annel, u p to seven

Paging Channels, and up to 63 Traffic Channels, as long as the total number of channels, including the Pilot Channel,

is no greater than 64.

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Forward Traffic Channel. A code chann el used to transport u ser and sig naling traffic from the base station to th e

mobile station.

A basic timing interval in the system. For th e Access Channel, Paging Channel, and T raffic Channel, a f rame is 20

ms long. For the Sync Channel, a frame is 26.666…ms long.

Frame Category. A classification of a received Traffic Channel frame based upon transmission data rate, th e Frame

contents (primary traffic, secondary traffic, or signaling traffic), and whether there are detected error in the frame.

Frame Offset. A time skewing of T raffic Channel f rames f rom System T ime in in teger multiples of 1.25 ms. The

maximum frame offset is 18..75 ms..

Frame Quality Indicator. The CRC check applied to 9600 bps and 4800 bps Traffic Channel frames.

Global Positioning System (GPS). A US government satellite system that provides location and time Information to

users. See Navstar GPS Space segment / Navigation User interfaces ICD-GPS-200 for Specifications.

Half Frame. A 10 ms interval on the paging Channel. Two half frames comprise a frame, the first half frame begins at

the same time as the frame.

Handoff. The of transferring communication whth a station mobile station from one base station to another.

Hard Handoff. A handoff characterized by a tem porary disconnection of the Traffic Channel. Hard handoffs Occur

when the mobile station is transf erred between disj oint Active Sets, th e CDMA f requency ass ignment changes, the

frame offset changes, or the mobile station is directed from a CDMA Traffic Channel to an analog voice channel, See

also Soft Handoff.

Hash Function. A function used by the mobile station to select on e out of N available resource. The hash function

distributes the available resources uniformly among a random sample of mobile stations.

HLR. See Home Location Register.

Home Location Register (HLR). T he location register to w hich a MIN is assigned f or record pu rposes su ch as

subscriber information.

Home System. The cellular system in which the mobile station subscribes for service.

Idle Handoff. The act of transferring recep tion of th e P aging Channel f rom on e bass station to anoth er, when th e

mobile station is in the Mobile Station Idle State.

Implicit Registration. A registrationachieved by a successful transmission of an orig ination or page respon se on the

Access Channel.

Interleaving. The process of permuting a sequence of symbols.

kHz. Kilohertz (103 Hertz).

ksps. Kilo-symbols per second (103 symbols per second).

Layer 1. See Physical Layer.

Layer 2. Layer 2 provides for the correct transmission and reception of signaling messages, including partial duplicate

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detection. See also Layering and Layer 3.

Layer 3. Layer 3 provides the control of the cellular telephone systems. Signaling messages originate and terminate at

layer 3. See also Layering and Layer 2.

Local Control. An optional mobile station feature used to perform manufacturer-specific functions.

A PN sequence with period 242-1 that is used for scrambling on the Forward CDMA Channel and spreading on the

Reverse CDMA Channel. The long code uniquely identifies a mobile station on both the Reverse Traffic Channel and

the Forward Traffic Channel. The long code provides limited privacy. The long code also separates multiple Access

Channels on the same CDMA channel. See also Public Long Code and Private Long Code.

Long Code Mask. A 42-bit binary number that creates th e unique identity of the long code. See also P ublic Long

Code, Private Long Code, Public Long Code Mask, and Private Long Code Mask.

LSB. Least significant bit.

Maximal Length Sequence (m-Sequence). A binary sequence of period 2n-1, n a positiv e integer, with no internal

periodicities. A maximal length sequence can be generated by a tapped n-bit shift register with linear feedback.

Mcps. Megachips per second (106 chips per second).

Mean Input Power. T he total receiv ed calorim etric pow er m easured in a specif ied bandw idth at th e anten na

connector, including all internal and external signal and noise sources.

Mean Output Power. The total transm itted calorim etric power m easured in a specif ied bandwidth at th e anten na

connector when the transmitter is active.

Message. A data structure that conveys control information or application information. A message consists of a length

field (MSG_LENGTH), a message body (the part conveying the information), and a CRC.

Message Body. The part of the message contained between the length field (MSG_LENGTH) and the CRC field.

Message Capsule. A sequence of bits co mprising a sin gle m essage and pad ding. T he pad ding alw ays f ollows th e

message and may be of zero length.

Message CRC. The CRC associated with a message. See also Cyclic Redundancy Check.

Message Field. A basic named element in a message. A message field may consist of zero or more bits.

Message Record. An entry in a message consisting of one or more field that repeats in the message.

MHz. Megahertz.(106 Herz)

MIN. See Mobile Station Identification Number.

Mobile Protocol Capability Indicator (MPCI). A 2-bit field used to indicate m obile station’ s capabilities.

Mobile Station. A station in the Domestic Public Cellu lar Rad io T elecommunications Serv ice in tended to be u sed

while in motion or du ring halts at u nspecified points. Mobile station include portable units (e.g., handheld personal

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units) and units installed in vehicles.

Mobile Station Class. Mo bile station classes def ine m obile station ch aracteristics su ch as slotted operation and

transmission power.

Mobile Station Identification Number (MIN). The 34 -bit n umber th at is a dig ital rep resentation of th e 10 -digit

directory telephone number assigned to a mobile station.

Mobile Station Originated Call. A call originating from a mobile station.

Mobile Station Terminated Call. A call received by a mobile station (not to be co nfused with a discon nect or call

release).

Mobile Switching Center (MSC). A configuration of equipment that provides cellular radiotelephone service. Also

called the Mobile Telephone Switching Office (MTSO)

Modulation Symbol. T he ou tput of th e data m odulator bef ore spread ing. On the Reverse Traffic Channel, 64-ary

orthogonal modulation is used and s ix code s ymbol (when the data rate is 9600bps) or each repeated code symbol

(when the data rate is less than 9600bps) is one modulation symbol.

Ms. Millisecond.

MSB. Most significant bit.

MSC. See Mobile Switching Center.

Multiplex Option. The ability of the multiplex sublayer and lower layer to be tailored to prov ide special capabilities.

A multiplex option def ines such charac teristics as th e f rame format and th e rate decision rules. See also Multiplex

Sublayer.

Multiplex Sublayer. One of the conceptual layers of the system that multiplexes and demultiplexes primary traffic,

secondary traffic, and signaling traffic.

NAM. See Number Assignment Module.

Narrow Analog. A type of voice channel that uses 10kHz channel spacing and subaudible signaling.

Neighbor Set. The set of pilots ass ociated w ith th e CDMA Ch annel th at are probab le can didates f or h andoff.

Normally, the Neighbor Set co nsists of the pilots associated with CDMA Channel that cover geographical areas near

the mobile station. See also Active Set, Candidate Set, and Remaining Set.

- A network is a subset of a cellular system, such as an area-wide cellular network, a private group of base stations,

or a group of base stations set up to handle a special requirement. A network can be as small or as large as needed,

as long as it is fully contained within a system. See also System.

Network Identification (NID). A number that uniquely identifies a network within a cellular system. See also System

Identification.

NID. See Network Identification.

Non-Autonomous Registration. A registration method in w hich th e base station in itiates registration . See also

Autonomous Registration.

Non-Slotted Mode. An operation mode of the mobile station in which the mobile station continuously monitors the

Paging Channel when in the Mobile Station Idle State.

Ns. Nanosecond.

NULL. Not having any value.

Null Traffic Channel Data. One or m ore f rames of 16 ‘1’ s f ollowed by eig ht ‘0’ s s ent at th e 1200bps rate. Nu ll \

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Traffic Channel data is sent when no service option is activ e and n o sig naling message is bein g sent. Null T raffic

Channel data serves to maintain the connectivity between the mobile station and the base station.

Number Assignment Module (NAM). A set of MIN-related parameters stored in the mobile station.

Numeric Information. Numeric information consists of param eters th at ap pear as n umeric f ields in m essage

exchanged by the base station and the mobile station and in formation used to describe th e operation of the mobile

station.

OLC. See Overload Class (CDMA) or Overload Control (analog).

Optional Field. A field defined within a message structure that is optionally to the message recipient.

Order. A type of message that contains control codes for either the mobile station or the base station.

Ordered Registration. A registration method in which the base station orders the mobile station to send registration

related parameters.

Overhead Message. A message sent by the base station on the Paging Channel to communicate base-station-specific

and system-wide information to mobile station.

Overload Class. The means used to co ntrol sy stem access by mobile station s, ty pically in em ergency or oth er

overload con ditions. Mo bile station are as signed on e (or m ore) of six teen ov erload classed, A ccess to th e CDM A

system can then be controlled on a per class basis by persistence values transmitted by the base station. Overload Control (OLC). A means reverse analog control channel accesses by mobile stations. Mobile station are

assigned one(or more) of sixteen control levels. Access is selectively restricted by a base station setting one or m ore

OLC bits in the Overload Control Global Action Message.

Packet. The unit of information exchanged between the service option applications of the base station and the mobile

station.

Padding. A sequence of bits used to fill from the end of a message to the end of a message capsule, typically to the

end of the frame or half frame. All bits in the padding are '0'.

Paging. The act of seeking a mobile station when a call has been placed to that mobile station.

Paging Channel (Analog). See Analog Paging Channel.

Paging Channel (CDMA). A code channel in a Forward CDMA Channel used for transmission of control

information and pages from a base station to a mobile station.

Paging Channel Slot. An 80ms interval on the Paging Channel. Mobile station operating in the slotted mode are

assigned specific slots in which day monitor messages from the base station.

Parameter-Change Registration. A registration method in which the mobile station registers when certain of its

stored parameters change.

Parity Check Bits. Bits added to a sequence of information bits to provide error detection, correction, or both.

Persistence. A probability measure used by the mobile station to determine if it should transmit in a given Access

Channel Slot.

Physical Layer. The part of the communication protocol between the mobile station and the base station that is

responsible for the transmission and reception of data. The physical layer in the transmitting station is presented a

frame by the multiplex sublayer and transforms it into an over-the-air waveform. The physical layer in the receiving

station transforms the waveform back into a frame and presents it to the multiplex sublayer above it.

Pilot Channel. An unmodulated, direct-sequence spread spectrum signal transmitted continuously by each CDMA

78

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base station. The Pilot Channel allows a mobile station to acquire the timing of the Forward CDMA Channel, provides

a phase reference for coherent demodulation, and provides a means for signal strength comparisons between base

station for determining when to handoff.

Pilot PN Sequence. A pair of modified maximal length PN sequences with period 215 used to spread the Foward

CDMA Channel and the Reserve CDMA Channel. Different base station are identified by different pilot PN sequence

offsets.

Pilot PN Sequence Offset Index. The PN offset in units of 64 PN chips of a pilot, relative to the zero offset pilot PN

sequence.

PN Chip. One bit in the PN sequence.

PN Sequence. Pseudonoise sequence. A periodic binary sequence.

Power Control Bit. A bit sent in every 1.25ms interval on the Forward Traffic Channel to signal the mobile station to

increase or decrease its transmit power. Power Control Group. A 1.25ms interval on the Forward Traffic Channel and the Reverse Traffic Channel.

See also Power Control Bit.

Power-Down Registration. Au autonomous registration method in which the mobile station registers on power up.

PPM. Parts per million.

Preamble. See Access Channel Preamble and Traffic Channel Preamble.

Primary CDMA Channel. A CDMA Channel at a pre-assigned frequency assignment used by the mobile station for

initial acquisition. See also Secondary CDMA Channel.

Primary Paging Channel (CDMA). The default code channel (code channel 1) assigned for paging on a CDMA

Channel.

Primary Traffic. The main traffic stream carried between the mobile station and the base station, supporting the

active promaty service option, on the Traffic Channel. See also Secondary Traffic, Signaling Traffic, and Servic3e

Option.

Private Long Code. The long code characterized by the private long code mask. See also Long Code.

Private Long Code Mask. The long code mask used to form the private long code. See also Public Long Code Mask

and Long Code.

Public Long Code. The long code characterized by the public long code mask.

Public Long Code Mask. The long code mask used to form the private long code. The mask contains the ESN of the

mobile station. See also Private Long Code Mask and Long Code.

Punctured Code. An error-correcting code generated from another error-correcting code by deleting (i.e., puncturing)

code symbols from the code output.

Quick Rep eats. A dditional transm issions of identical copies of a m essage w ithin a sh ort in terval to in crease th e

probability that the message is received correctly.

Receive Objective Loudness Rating (ROLR). A perceptually weighted transducer gain of telephone receivers

relating electrical excitation from a reference generator to sound pressure at the earphone. The receive objective

loudness tating is normally specified in dB relative to one Pascal per millivolt. See IEEE Standard 269-1992, IEEE

Standard 661-1979, CCITT Recommendation P.76, and CCITT Recommendation P.79.

Registration. The process by which a mobile station identifies its location and parameters to a base station.

79

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Registration Zone. A collection of one or m ore base station s treated as a u nit when determining whether a mobile

station should perform zone-based registration.

Release. A process that the mobile station and base station use to inform each other of call disconnect.

The set of all allowable pilot offsets as determined by PILOT_INC, excluding the pilot offsets of the pilots in the

Active Set, Candidate Set, and Neighbor Set. See also Active Set, Candidate Set, and Neighbor Set.

Request. A layer 3 message generated by either the mobile station or the base station to retrieve information, ask for

service, or command an action. Response. A layer 3 message generated as a result of another message, typically a request.

Reverse Analog Control (RECC). The analog control channel used from a mobile station to a base station.

Reverse Analog Voice Channel (RVC). The analog voice channel used from a mobile station to a base station.

Reverse CDMA Channel. The CDMA Channel from the mobile station to the base station. From the base station’ s

perspective, the Reverse CDMA Channel is the sum of all mobile station transmissions on a CDMA frequency

assignment.

Reverse Traffic Channel. A Reverse CDMA Channel used to transport user and signaling traffic from a single

mobile station to one or more base stations.

Roamer. A mobile station operating in a cellular system (or network) other than the one from which service was

subscribed. See also Foreign NID Roamer and Foreign SID Roamer.

ROLR. See Receive Objective Loudness Rating.

SAT. See Supervisory Audio Tone.

Scan of Channels. The procedure by which a mobile station examines the signal strength of each forward analog

control channel.

SCI. Synchronized Capsule Indicator bit.

Search Window. The range of PN sequence offsets that a mobile station searches for a pilot.

Secondary CDMA Channel. A CDMA Channel at a preassigned frequency assignment used by the mobile station for

initial acquisition. See also Primary CDMA Channel.

Secondary Traffic. An additional traffic stream that can be carried between the mobile station and the base station on

the Traffic Channel. See also Primary Traffic and Signaling Traffic.

Seizure Precursor. The initial digital sequence transmitted by a mobile station to a base station on a reverse analog

control channel.

Seizure Option. A service capability of the system. Service options may be applications such as voice, data, or

facsimile.

Shard Secret Data (SSD). A 128-bit pattern stored in the mobile station (in semi-permanent memory) and known by

the base station. SSD is a concatenation of two 64-bit subsets: SSD_A, which is used to support the authentication

procedures and SSD_B, which serves as one of the inputs to the process generating the encryption mask and private

long code.

Short Message Services (SMS). A suite of services which include SMS Text Delivery, Digital Paging (i.e., Call Back

Number – CBN), and Voice Mail Notification (VMN).

SID. See System Identification.

Signaling Tone. A 10kHz tone transmitted by a mobile station on an analog voice channel to: 1) confirm orders,

80

UN270


2)signal flash requests, and 3) signal release requests.

Signal Traffic. Control message that are carried between the mobile station and base station on the Traffic Channel.

See also Primary Traffic and Secondary Traffic. Slot Cycle. A periodic interval at which a mobile station operating in the slotted monitors the Paging Channel.

Slotted Mode. An operation mode of the mobile station in which the mobile station monitors only selected slots on

the Paging Channel when in the Mobile Station Idle State.

Soft Handoff. A handoff occurring while the mobile station is in the Mobile Station Control on the Traffic Channel

State. This handoff is characterized by commencing communications with a new base station on the same CDMA

frequency assignment before terminating communications with the old base station. See also Hard Handoff.

SOM. Start-of-Message Bit.

SPS. Symbols per second.

- An identification of certain characteristics of a mobile station. Classes are defined in Table 2.3.3-1.

Status Information. The following status information is used to describe mobile station operation when using the

analog system.

Serving-System Status. Indicates whether a mobile station is turned to channels associated with System A or

System B.

First Registration ID Status. A status variable used by the mobile station in association with its processing of

received Registration ID messages.

First Location Area ID Status. A status variable used by the mobile station in association with its processing of

received Location Area ID messages.

Location Registration ID Status. A status variable used by the mobile station in association with its processing of

power-up registration and location-based registration.

First Idle ID Status. A status variable used by the mobile station in association with its processing of the Idle

Task.

Local Control Status. Indicates whether a mobile station must respond to local control messages.

Roam Status. Indicates whether a mobile station is in its home system.

Termination Status. Indicates whether a mobile station must terminate the call when it is on an analog voice

channel.

Supervisory Audio Tone (SAT). One of three tones in the 6 kHz region that is transmitted on the forward analog

voice channel by a base station and transponder on the reverse analog voice channel by as mobile station.

Supplementary Digital Color Code (SDCC1, SDCC2). Additional bits assigned to increase the number of color

codes from four to sixty four, transmitted on the forward analog control channel.

Symbol. See Code Symbol and Modulation Symbol.

Sync Channel. Code channel 32 in the Forward CDMA Channel which transports the synchronization message to the

mobile station.

Sync Channel Superframe. An 80ms interval consisting of three Sync Channel frames (each 26.666…ms in length).

System. A system is a cellu lar telephone service that covers a geographic area su ch as a city . Metropolitan region,

81

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country, or group of countries. See also Network.

System Time. The time reference used by the system. System Time is sy nchronous to UT C time(except for leap

seconds) and u sed the same time orig in as GP S time. Of fset by the propagation delay f rom the base station to the

mobile station. See also Universal coordinated Time.

Timer-Based Registration. A registration method in which the mobile station registers whenever a counter reaches

a predetermined value. The counter is incremented an average of once per 80 ms period.

Time Reference. A reference established by th e m obile station that i s sy nchronous w ith th e earliest arriv ing

multipath component used for demodulation.

TOLR. See Transmit Objective Loudness Rating.

Traffic Channel. A communication path between a m obile statio n and base station u sed f or u ser and sig naling

traffic. T he ter m T raffic Ch annel im plies a Forw ard T raffic Ch annel and Reverse T raffic Ch annel pair. See also

Forward Traffic Channel and Reverse Traffic Channel.

Traffic Channel Preamble. A sequence of all-zero frames that is sent at the 9600 bps rate by the mobile station on

the Reverse Traffic Channel. The Traffic Channel preamble is sent during initialization of the Traffic Channel.

Transmit Objective Loudness Rating(TOLR). A perceptually weighted transducer gain of telephone transmitters

relation sound pressure at the microphone to voltage at a reference electrical termination. It is normally specified in dB

relative to on e m illivolt per P ascal. See IEEE Standard 269 -1992, IEEE Standard 661-1979, CCITT

Recommendation P.76 , and CCITT Recommendation. P.79

Unique Challenge-Response Procedure. An exchange of information between a mobile station and a base station

for th e pu rpose of con firming th e m obile station ’ s identity . T he procedu re is in itiated by th e base station and is

characterized by th e u se of a challeng e-specific random n umber(i.e., RA NDU) in stead of th e rando m v ariable

broadcast globally(RAND).

Unique Random Variable(RANDU). A 24-bit random number generated by th e base s tation in s upport of th e

Unique Challenge-Response procedure.

Universal Coordinated Time(UTC). A n in ternationally agreed -upon tim e scale m aintained by th e B ureau

International de l ’Heure(BIH) u sed as th e tim e ref erence by n early all co mmonly available tim e and f requency

distribution systems i.e., WWW, WWVH, LORAN-C, Transit, Omega, and GPS.

UTC. Universal Temps Coordine. See Universal Coordinated Time.

Voice Channel. See Analog Voice Channel.

Voice Mobile Attenuation Code(VMAC). A 3- bit f ield in th e Ex tended A ddress W ord co mmanding th e initial

mobile power level when assigning a mobile station to an analog voice channel.

Voice Privacy. The process by which user voice transmitted over a CDMA Traffic Channel is a af forded a modest

degree of protection against eavesdropping over the air.

Walsh Chip. The shortest identifiable component of a Walsh function. There are 2N Walsh chips in one Walsh

function w here N is th e order of th e W alsh f unction. On the Forward CDMA channel one Walsh chip equals

1/1.2288MHz, or 813.802…ns. On the Reverse CDMA Channel, one Walsh chip equals 4/1.2288MHz, or 3.255… .

Walsh Function. One of 2N time orthogonal binary functions (note that the functions are orthogonal after mapping ‘0’

82

UN270


to 1 and ‘1’ to –1).

Zone-Based Registration. An autonomous registration method in which the mobile station registers whenever it

enters a zone that is not in the mobile station’ s zone list.

. Microsecond

83

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84

1. Block Diagram

Appendix 1.

Internal Use Only

UN270


85

2. Circuit Drawing

2.1 Main PCB

2.2 KEY-PCB

2.3 MAIN F-PCB

0SAFP0000501

R1017

100pC1096

L10633.9n

L1060

2.2n

L1061

2.2n

0

SAFP0000501R1019

L1051

6.8n

100pC1086

100pC1088

100p

C1100

FL1006

DNI_SFSY0028201SAFEB2G14FB0F00

2140MHz4 5

1

3 2G1 O1

ING2 O2

AN

T100

7

C-C

LIP_

GR

700

FEED

DNIL1036

FL1011B9444

1575.42 MHz5 2

4 1

3G3

INOUTG1G2

L1052

DNI

DNIC1099

R1001

18

L1057

2.2n

C1104

100p

L10643.9n

R10

03

300

AN

T100

2

HJ-

ICT-

03Y

FEED

AN

T100

0

HJ-

ICT-

03Y

FEED

0SAFP0000501

R1015

0SAFP0000501

R1016

0

SAFP

0000

501

R1018

0

SAFP0000501R1020

C10

03 0

L1013DNI

C1024DNI

C10

26D

NI

C10

29

DN

I

FL1002 DNI_SDMY0003301

1732.5 MHz,2132.5 MHz

958472

3

16 RXANT

TX

GND1 GND4GND2 GND5GND3 GND6

C1061DNI

C10

57D

NI

C10

63D

NI

C1089

DNI

C10

90D

NI

C1046DNI

L103

7D

NI

C10

74

DN

IC

1085

DN

I

C10

79D

NI

U1003

DNI_SFAC0002301 XM0830SM-BL0912

1

9

8

3

7

5

2

4

6GND3

POR

T2

PORT1

CTL

VDD

GND2

POR

T3

SLUG_GND

GND1

C10

39D

NI

DNIL1033

C1027DNI

2.2uC1000

C1103

100pDNIL1004

ACPM-7354 U1000

15

78

6

501

4

12

2

141RFIN_CELLCPL

VMODE

RFOUT_CELL

VCC1

VEN_CELLVCC2

VEN_PCS

RFIN_PCSRFOUT_PCS GN

D

C10012.2u

C10161n 1n

C1013

+VPWR

C10511p

DNIL1003

C1033

200p

C1015100p

C1014100p

DN

IC

1002

DNIL1001

C1017

100pC11021.2p

C1005

100p

C1030DNIR

1002

300

R1004DNI

DNIL1014

ACFM-7107 U1002

5

4

6

3

2

1CELL_RX

PCS_RX

CELL_TX

G_SLUG

PCS_TX

ANT

L1019DNI

C1081DNI

FL1005DNI_SFAC0002001

24

6

3

15OUT1IN

OUT2

VC1

GNDVC2

C10

58D

NI

C10

59D

NI

L103

4D

NI

FL1009 DNI_SFAC0002701

240MHz

4 3

5 2

6 1P2GND3

GND1P3

P1GND2

C10

40D

NI

1.8n

L1044

C10

78D

NI

FL1007DNI_SFAY0012701XM0860SR-DL0801

1GHz,2GHz

4

35

26

17

8PO

RT2

+

PORT1+PORT2-

CTL1CTL2

PORT1-PORT3+

POR

T3-

C10

75D

NI

C1082

DNI

C10

42D

NI

AN

T100

6

DN

I_M

CIZ

0002

701

C-C

LIP_

GR

700

FEED

+2.1V_RFRX2

L1038DNI

12

R1008

10pC1066

0.1uC1067

R1007

10K

R1000100K

C10

49

DN

I

100p

C1098

C1073

100p

C11

051.

8p

DNIL1022

C1041DNI

FL1003

DNI_SFAC0002001

42

6

3

51OUT1 IN

OUT2

VC1

GND VC2

C10

70

DN

I

L1041

1.8n

L1042DNI

C1064

33p

C105633p

DNI

R1006

C10622.7p

C10

87

DN

I

C10971.8p

+2.1V_RFRX1

C1095DNI

C1025DNI

DNIL1031

DNIL1035

C10

28

DN

I

L102

1

DN

I

DNIL1015

C1038DNI

FL1001DNI_SFSY0034401

SAFEA1G73AA0F00

1732.5MHz5 3 2

4 1INOUT

G1G2G3

L1018DNI

+2.6V_MSMP+VPWR

C1031 DN

I

U1006DNI_SMPY0019401AWT6309R

45

36

27

18

9PGND

VBATTVCC

RFINRFOUT

VMODEGND2

VENGND1

C10

32D

NI

C1036DNI

L1017DNI

C10931p

L105

3D

NI

C1037

DNI

U1004

DNI_EUSY0186502

4 3

5 2

6 1SB1

VCCGND

AB0

100pC1071

L104

5D

NI

L1062

1.8n

100pC1080

R10110

L1048DNI

L1043

DNI

C1092DNI

U1005

DN

I_SC

DY0

0043

01

LDC

151G

8620

Q-3

59

23

14

OU

TTE

R

INC

OU

FL1010DNI_SFSY0035002B9433

5 3 2

41IN OUT

G1 G2 G3

DNIL1049

DNIC1106

L1046100n

L10303.3n

C1035DNI

L1020DNI

C1034DNI

+2.8V_TCXO

C1018

15p

R1009

SAFP00005010

DNIC1019 DNI

L1011

SW1002 NMS-180

4

2

1

3G1

A

C

G2

L10001n

R1010DNI

L1010

15n

L1056

2.7n

L1012

3.3n

C1045DNI

ANT1005

C10656.8p

R1013 SAFP0000501

0

+2.1V_RFRX1

FL1004

881.5MHz45

1

32G1 O1

ING2 O2

L1055

3.3n

L1032

2.2n

ANT1003

SW1001 NMS-180

4

2

1

3G1

A

C

G2

FL1000SAWEP836MFH2F00

836.5MHz

10 5

38

27

46

9 1IN1OUT1

IN2OUT2

GND1GND2

GND3GND4

GND5GND6

FL1008SAFEB1G96FL0F00

1960MHz 4 5

1

3 2G1 O1

ING2 O2

C1022DNI

L10505.6n

C105339p

L1009100n

C1060DNI

U1007ALM-2412

3

2

5

4

1R

F_IN

FIL_OUT

VDD

S_D

GND

C1050

100p

C10540.5p

L1029

33n

L1026

15n

L1023

4.7n

L1028

4.7n

C1044

82p

C1052

82p

C10481.5p

R1005

1K

L100710n

C1101100p

GND

GND

GND

CDMA_PA_ON0

CDMA_HB_LNA_OUT

CDMA_HB_MIX_INP

CDMA_HB_MIX_INM

CDMA_GPS_MODE

CDMA_HB_MRDRTR_IN

CDMA_HB_RTR_IN

CDMA_PA_ON1

CDMA_GPS_RTR_IN

CDMA_LB_LNA_OUT

CDMA_LB_MIX_INP

CDMA_LB_MIX_INM

CDMA_LB_RTR_OUT

CDMA_HB_RTR_OUT

PCS_TX

PCS_TX

DCN_TX

DCN_TX

PCS_RX

PCS_RX

AWS_TX

AWS_TX

AWS_RX

AWS_RX

PA_RANGE_0

PA_RANGE_0

PAM_IN_LB

PAM_IN_LB

PAM_IN_AWS

PAM_IN_AWS

PAM_OUT_AWS

PAM_OUT_AWS

RXSAW_OUTP_HB

RXSAW_OUTP_HB

RXSAW_OUTM_HB RXSAW_OUTM_HB

RXSAW_IN_HB

RXSAW_IN_HB

RXSAW_OUTM_AWSRXSAW_OUTM_AWS

RXSAW_OUTP_AWSRXSAW_OUTP_AWS

RXSAW_IN_AWS

RXSAW_IN_AWS

PAM_IN_PCS

PAM_IN_PCS

MRD_ANT

PA_ON_PCS

PA_ON_PCS

CDMA_LB_RTR_IN

PAM_CPL_OUT

PAM_CPL_OUT

CDMA_PWR_DET_IN

CDMA_PCS_MODE

CDMA_PCS_MODE

CDMA_PCS_MODE

CDMA_PCS_MODECDMA_PCS_MODE

CDMA_AWS_MODE

CDMA_AWS_MODE

CDMA_AWS_MODE

CDMA_AWS_RTR_OUT

GPS_IN

GPS_IN

DNI

DNI

DNIDNI

DNI

DNI

DNIDNI

DNI

DNI

DNIDNI

[TX-DCN/PCS]

[GPS LNA]

[HINGE_CONTACT C- CLIP]

TX SAW

[FRONT END]

[LNA_OUTPUT]

[GPS/AWS_MRD]

[TX-AWS]

[LNA_INPUT-PCS/AWS]

[MIXER INPUT]

DNI

Appendix 2. Circuit diagram

MAIN PCB CIRCUIT DIAGRAMInternal Use Only

86


R80

21

1M

R80

20

1MR80

19

DN

I

R8013

DNI+2.6V_MSMP

R800175K

JTAG8000

10

9

8

7

6

5

4

3

2

1TCK

RTCK

TDO

TDI

TMS

TRST

VCC

RESIN

PS_HOLD

GND

+2.6V_MSMP

R80

14

47K

UART8000

12

11

10

9

8

7

6

5

4

3

2

1GND

RX

TX

NC1

ON_SW

VBAT

NC2

NC3

NC4

DSR

RTS

CTS

GND

RX

TX

VCHAR

ON_SW

VBAT

PWR

URXD

UTXD

3G2.5G

+VCHAR

TP8000

+VPWR

OJ8000 OJ8001

TP8001

CORE_QSC6055_2G1G_STG_03

BT_PCM_DINBATT_ID

GPIO[24]GPIO[22]GPIO[20]GPIO[18]GPIO[15]GPIO[14]

LCD_IDGPIO[11]

EAR_SENSE/GPIO[8]

GPIO[32]GPIO[33]GPIO[34]GPIO[35]GPIO[36]

FOLDER_CLOSE/GPIO[38]GPIO[39]GPIO[40]GPIO[41]GPIO[42]GPIO[43]GPIO[44]GPIO[45]GPIO[47]GPIO[51]GPIO[54]GPIO[6]GPIO[5]GPIO[4]GPIO[3]

RESIN/

GPIO[48]GPIO[23]GPIO[19]GPIO[17]GPIO[16]BATT_FET/CHG_CNT/

ISNS_MISNS_P+5.0V_USB+VBATT+VCHAR+VPWR

GPIO[21]

CDMA_HB_MRDRTR_INCDMA_LB_MRDRTR_IN

CDMA_LB_RTR_OUTCDMA_HB_RTR_OUT

CDMA_LB_MIX_INMCDMA_LB_MIX_INP

CDMA_LB_LNA_OUT

CDMA_LB_RTR_INCDMA_HB_RTR_IN

EBI2_WE/EBI2_OE/

EBI2_D[15]EBI2_D[14]EBI2_D[13]EBI2_D[12]EBI2_D[11]EBI2_D[10]EBI2_D[9]EBI2_D[8]EBI2_D[7]EBI2_D[6]EBI2_D[5]EBI2_D[4]EBI2_D[3]EBI2_D[2]EBI2_D[1]EBI2_D[0]

LINE_OUT_L_PLINE_OUT_R_NSPKR_OUT_PSPKR_OUT_N+2.1V_RFRX1+2.8V_LCD+2.8V_TCXO+2.1V_RFRX2

TDI

+2.6V_MSMP+1.8V_MSME+2.6V_BT

+VDD_P6TEMP_ADCCDMA_GPS_RTR_INCDMA_PWR_DET_INCDMA_HB_MIX_INMCDMA_HB_MIX_INP

CDMA_HB_LNA_OUT

PWR_ON_SW/

PS_HOLDUSB_D-USB_D+VIB_DRV/

PCB_REV_ADCACC_ADC

GREEN_ENRED_EN

EAR_MICMIC1P

MIC_BIASHPH_OUT_RHPH_OUT_L

TMS

EAR10PEAR10N

TRST/

CDMA_PA_ON0

BATT_THM_ADC

TDO

LINE_IN_L_PTCK

RTCK

LINE_IN_R_N

CDMA_GPS_MODEAUDIO_AMP_ENGPIO[52]GPIO[50]GPIO[49]GPIO[46]GPIO[31]BT_PCM_CLKBT_PCM_DOUTBT_PCM_SYNCPA_RANGE_0MLCD_VSYNCGPIO[9]GPIO[7]GPIO[2]CDMA_PA_ON1MLCD_RESET/BT_UART_TXD

BT_UART_RXD

LCD_RSMLCD_CS/CDMA_AWS_RTR_OUT

TP8002

2.2K

R8015

U8000

65

7

8

4

2

1

3OUT1

IN

OUT2

EN_SET

OUT3

OUT4

GND OUT5

+2.6V_MSMP

100K

R80

18

R80

17

100K

100K

R80

16

1uC8001

+2.1V_RFRX1+2.8V_LCD+2.8V_TCXO+2.1V_RFRX2+2.6V_MSMP+1.8V_MSME+2.6V_BT

100K

R8000

C800033n

+2.8V_TCXO

+5.0V_USB+VBATT+VCHAR+VPWR

+2.6V_MSMP

CDMA_PA_ON0

CDMA_HB_LNA_OUT

CDMA_HB_MIX_INPCDMA_HB_MIX_INM

CDMA_GPS_MODE

CDMA_HB_MRDRTR_IN

CDMA_HB_RTR_IN

CDMA_PA_ON1

CDMA_GPS_RTR_IN

CDMA_LB_LNA_OUT

CDMA_LB_MIX_INPCDMA_LB_MIX_INM

CDMA_LB_RTR_OUTCDMA_HB_RTR_OUT

PA_RANGE_0

CDMA_LB_RTR_IN

EBI2_D[0]

EBI2_D[2]

EBI2_D[4]EBI2_D[5]EBI2_D[6]EBI2_D[7]EBI2_D[8]EBI2_D[9]EBI2_D[10]EBI2_D[11]

EBI2_D[3]

EBI2_D[14]EBI2_D[15]


EBI2_OE/EBI2_WE/

USB_D-

USB_D-

USB_D-

USB_D+

USB_D+

USB_D+

PS_HOLD

PS_HOLD

TCK

TCK

RTCK

RTCK

TDO

TDO

TDI

TDI

TMS

TMS

TRST/

TRST/

SD_CMD

SD_DATA[0]SD_DATA[1]SD_DATA[2]SD_DATA[3]

SD_CLK

SD_DET/

RESIN/

RESIN/

EBI2_D[1]

CHG_CNT/

CP_EN

ACC_ADC

ISNS_PISNS_M

BATT_THM_ADC

I2C_SDA

BATT_ID

+VCHAR

BATT_ID_PU

BATT_FET/

I2C_SCL

CAM_RESET/

CAM_DATA[0]

CAM_DATA[4]CAM_DATA[5]

CAM_I2C_SDA

CAM_PCLK

CAM_I2C_SCL

PWR_ON_SW/

MLCD_RESET/

LCD_ID

MLCD_VSYNC

CAM_HSYNCCAM_VSYNC

CAM_DATA[1]CAM_DATA[2]CAM_DATA[3]


CAM_MCLK

EAR10PEAR10N

LCD_RS/MLCD_CS/

MIC_BIAS

TOUCH_I2C_SCL

LIN_PWM_FREQ

MOTOR_EN

TOUCH_EN

FOLDER_CLOSE/

HPH_OUT_L_P

EAR_MIC

HPH_OUT_R_N

TOUCH_IRQ

TOUCH_I2C_SDA

SPKR_OUT_P

QKEY_RESET/

QKEY_I2C_SDA

QKEY_I2C_SCL

QKEY_INT/

BT_PCM_SYNC

BT_PCM_CLK

BT_PCM_DIN

BT_PCM_DOUT

BT_UART_RXD

BT_UART_TXD

PCB_REV_ADC

PCB_REV_ADC

CDMA_PWR_DET_IN

CDMA_PCS_MODE

CDMA_AWS_MODE

CAM_PWR_DOWN

SD_LDO_EN

SKPD_LED_EN

CDMA_AWS_RTR_OUT

MIC1P

RED_ENGREEN_EN

SPKR_OUT_N

TEMP_ADC

EAR_SENSE

EARPHONE_KEY

PROXI_3D_SCL

PROXI_3D_SDAGPIO_EXP_CONT

GPIO_EXP_CONT

MIC_BIAS_EN

PROXI_OUT/

PROXI_LDO_EN

<BOSS HOLE>

REVISION R8000 R8001

[JTAG]

[GPIO EXPENDER]

[ARRAY TP]

[QSC6055 MODULE]

[PRODUCTION TP_2pie]

[ PCB Revision ]

ADC_range(HEX)_8bit

A

B

C

D

E

F

G

1.0

1.1

1.2

1.3

1.4

100K 5.6K

100K

100K

100K

100K

100K

100K

100K

100K

100K

100K

100K

12K

19.1K

27K

36K

47K

56K

100K

130K

130K

130K

75K

07-1A

1B-2C

2D-3E

3F-50

51-62

63-72

73-84

85-9C

9D-B4

B5-CC

CD-E4

E5-FC

Close to QSC

87

C220310n

C22080.1u

R2202

100

C220233n

C22040.1u

C2201

1n

C2205

47p

X2201DSA321SCA

21

34VDD OUT

VCONT GND

C22101n

R2203

51

2.2u

C2206

2.2u

C2207

R2201

2K

EBI2_D[0]EBI2_D[1]EBI2_D[2]EBI2_D[3]EBI2_D[4]EBI2_D[5]EBI2_D[6]EBI2_D[7]EBI2_D[8]EBI2_D[9]

U2201H8BCS0SI0BAR-46M

T12

T11

T10T3T2T1

Q12

Q11

Q10Q

3Q

2Q

1P1

2P1

1P3P2P1N2

M2L2K10K9K8K5K4K2J11

J10J9J8J7J6J5J4J3

P8D5P4D6

E6P6F6C8F5C4E5

D7P5C7

C6P9L7P7L6H10K7G2K6C9N9C5M9

L9H2N8

M8N3L8E3N7K3M7L3N6F3M6M3N5G3M5

L5D11N4E11M4F11L4G11E9K11E7L11F7M11G5N11G7C10D9D10D8E10E8F10F8L10G8M10G4N10F4P10E4

D4

J2H9

H8

H7

H6

H5

H4

H3

G10

G9

G6

F9F2H11

E2D3

D2

D1

C12

C11

C3

C2

C1

B12

B11

B10

B3B2B1A12

A11

A10

A3A2A1N

C1

NC

2N

C3

NC

4N

C5

NC

6N

C7

NC

8N

C9

NC

10N

C11

NC

12N

C13

NC

14N

C15

NC

16N

C17

NC

18N

C19

NC

20N

C21

NC

22N

C23

NC

24N

C25

NC

26N

C27

NC

28N

C29

NC

30N

C31

NC

32N

C33

NC

34N

C35

A0A1 I_O0A2 I_O1A3 I_O2A4 I_O3A5 I_O4A6 I_O5A7 I_O6A8 I_O7A9 I_O8A10 I_O9A11 I_O10A12 I_O11A13 I_O12DQ0 I_O13DQ1 I_O14DQ2 I_O15DQ3DQ4 _CEDQ5 _WENDQ6 _REDQ7 ALEDQ8 CLEDQ9 R__BDQ10 _WPDQ11DQ12 VCCN1DQ13DQ14 VSS1DQ15 VSS2LDQM VSS3UDQM VSS4LDQS VSS5UDQS VSS6_CLKCLK VSSQCKEBA0 VDD1BA1 VDD2_RAS VDD3_CAS_WED VDDQ1_CS VDDQ2

NC

36N

C37

NC

38N

C39

NC

40N

C41

NC

42N

C43

NC

44N

C45

NC

46N

C47

NC

48N

C49

NC

50N

C51

NC

52N

C53

NC

54N

C55

NC

56N

C57

NC

58N

C59

NC

60N

C61

NC

62N

C63

NC

64N

C65

NC

66N

C67

NC

68N

C69

NC

70

EBI2_D[10]EBI2_D[11]EBI2_D[12]EBI2_D[13]EBI2_D[14]EBI2_D[15]

EBI2_OE/EBI2_WE/

R2204

10K

TP2201

C22090.1u

TP2202

TRK_LO_ADJ

TCXO

EBI1_CS0/

EBI1_DQM[1]EBI1_DQM[0]

EBI1_DQS[0]EBI1_DQS[1]

EBI1_M_CLK

EBI1_OE/EBI1_WE/

EBI1_A[1]EBI1_A[2]EBI1_A[3]EBI1_A[4]EBI1_A[5]EBI1_A[6]EBI1_A[7]EBI1_A[8]EBI1_A[9]EBI1_A[10]EBI1_A[11]EBI1_A[12]

EBI1_M_CLK/

EBI2_UB/

NAND_WP/

+1.8V_MSME

+1.8V_MSME

+1.8V_MSME

EBI2_CS1/


EBI1_A[0]

EBI1_BA[0]EBI1_BA[1]


EBI2_OE/EBI2_WE/

EBI2_BSY/

EBI1_ADV/

EBI1_DQM[2]

EBI2_LB/

EBI1_A[13]

+2.8V_TCXO

TCXO

2G NAND 1G DDR SDRAM


88

X2101

FC-1352 1

C2160

100p

4.7n

C2112

R210710K

+VPWR

4.7K

R2108

R2106

DNI

C21392.2u

R2122

0

R2121

0

R2120

0

R2119

0

R2118

0

R2117

0

R2113

0R2114

0

U2101QSC6055-CD

P8

U21N12

AC17N11

T18N10

AB15N6

T12M12

R12M11

P12M10

AC16L12

T16L11

T15L9

T14L6

T11K12

T10K11

T9K10

T8K9

R16K6

R15J12

R14J11

R11J10

R10J9

R9J8

R8J6

P15H12

P14H11

P13H10

P11H9

P10F12

P9E12GND_DIG_1 GND_DIG_30

GND_DIG_2 GND_DIG_31




















GND_DIG_22 GND_MPLL_1



GND_DIG_25 GND_MSMC

GND_DIG_26 GND_NCP

GND_DIG_27 GND_SPKR

GND_DIG_28 GND_TCXO

GND_DIG_29

TP21

01

R2116

0

R2115

0

C2159

100p

LGE Internal Use Only

C21380.1u

0.1u

C2136

C2137DNI

C21350.1u

C21340.1u

0.1u

C2133

C21320.1u

12p

C2161

12p

C2162

5.1K

R2104

12K

R2105

2.2u

C2117

C21144.7n

C2116220p

510

R2102

C21153.3n

R2110

4.7

R2103

5.1K

C21100.1u

C210933p

8012C

u10.1u

C2102

C21030.1u

0.1u

C2101

C21050.1u

6012C

u1

7012C

u1

C210433p

C21490.1u

+VDD_P6

C21570.1u

4.7u

C2125

4.7u

C2127

0.1u

C2128

0.1u

C2129

C21241n

6212C

n1

68n

C2113

C21210.1u

C21200.1u

0.1u

C2122

0.1u

C2123

0.1u

C2118

C21190.1u

C21560.1u

C21540.1u

C21520.1u

5512C

u1

3512C

u1

+1.8V_MSME

+2.6V_MSMP

C21500.1u

0.1u

C2151

2.2u

C2131

8412C

u1

7412C

u1

+2.1V_RFRX2

5412C

u1

6412C

u1

4412C

u1

121K

R2112

+2.8V_TCXO

R2111

10

+2.8V_LCD

0412C

u1

3412C

u1

2412C

u1

1412C

u1

+2.1V_RFRX1

2.2u

C2169

10u

C2174

0.1u

C2130

0.1u

C2158

R2109

2.2

4.7u

C2170 7

712C

u1

6712C

u1

3612C

u1 2.2u

C2164

2.2u

C2165

2.2u

C2166

2.2u

C2167

2.2u

C2172

4.7u

C2171

4.7u

C2168 3

712C

u1

560

R2101

4.7u

C2175

R2123

0

AB21

N19

N16

N15

N14

N13

M15

M14

M13L2

2

L15

L14

L13

K19

K15

K14

QSC6055-CDU2101

K13

J22

J18

J15

J14

J13

H19

H15

H14

H13F2

2

F19

F15

E22

E19

E14

D22

C19B2

2

B20

B19

B18

B17

B16

B15

B14

A23

A17

A16

A14

AC19

AA21

AC20V18

V17

AB19

AA22

W22

AB16

AB23

AA23

W21Y2

2

V14

AA17

AA15

AA16

AA18

AA19V1

2

V13

W16V1

5

Y23

W23

U23T2

3

R23P2

3

R22V1

1

AC22

AC15

AC18T2

1

W18V2

1

AA20T19

T22

AC21P1

8

W17

AB14V16

W13Y2

1

AB18V2

2

V23

U22

R21

AB17

K22

K21

K18

G21K16

H21J23

G22J21

G23H22

M22H18

L21H16

F18F14

G18E15

R19E13

M19C17

L16C16

M21C15

P22C14

P21B13

L18A13

L19F21

F23F13

A8E21

F10C22

B5C21

A6C20

F6C18

B6B21

A5C8

A7C6

C9AA10

B4AA8

A12AA5

B12C11

F11V10

W5E11

F8V3

W12T3

AB13P3

AC13N3

H6M3

H5L3

AC5K3

V5J3

AA9H3

V8F3

AB6T13

AC9R13

W8W15

AB9W14

V7U19

AB8P19

AC8AC14

V6AB22

AA7AB20

W7W19

AC7V19

AC6U18

W6W11

AA6AC1

AB7AB2

AB5AA13

C10AA3

F9N9

B11N8

E10M9

E7M8

A9C12

AC10C3

AB10B2

W9A1

V9N22

W10N21

AB11M18

AA11M16

AA12G19

AB12N18

AC11R18

T2P16

P5J19

AA4C13

AB4D21

AA14K23

E9L23

A11N23

E6M23

C7A15

B7A18

B9A19

B8J16

E8A20

F7H23

A4E23

B10D23

A10C23

B23

A21

A22

AC23

AC12

L10

L8K8F17

F16

E18

E17

E16

T1U2

P6V2W3

Y3Y1R3

U1

AB3

AC4

R5

W2

V1R6

W1

T5Y2U3

AA2

AA1

T6AC2

AB1

U5

AC3

U6

G3

R1

K5J5E2K2L5A2E1K1B3A3B1R2

N5

P1P2N2

M5

N1

M6

F5E5C5

C4

G6

D3

E3G5

C2

C1

D2

D1

F2F1G2

G1

H2

H1

J2J1M1

L1M2

L2EB

I1_A

_D_0

EBI1

_A_D

_1

EBI1

_A_D

_2

EBI1

_A_D

_3

EBI1

_A_D

_4

EBI1

_A_D

_5

EBI1

_A_D

_6

EBI1

_A_D

_7

EBI1

_A_D

_8

EBI1

_A_D

_9

EBI1

_A_D

_10

EBI1

_A_D

_11

EBI1

_A_D

_12

EBI1

_A_D

_13

EBI1

_A_D

_14

EBI1

_A_D

_15

EBI1

_A_D

_16

EBI1

_A_D

_17

EBI1

_A_D

_18

EBI1

_A_D

_19

EBI1

_A_D

_20

EBI1

_A_D

_21

EBI1

_A_D

_22

EBI1

_A_D

_23

EBI1

_A_D

_24

EBI1

_A_D

_25

EBI1

_A_D

_26

EBI1

_A_D

_27

EBI1

_A_D

_28

EBI1

_A_D

_29

EBI1

_A_D

_30

EBI1

_A_D

_31

EBI1

_AD

V_N

EBI1

_CS0

_N

EBI1

_CS1

_N

EBI1

_DQ

M_0

EBI1

_DQ

M_1

EBI1

_DQ

M_2

EBI1

_DQ

M_3

EBI1

_DQ

S_0

EBI1

_DQ

S_1

EBI1

_M_C

LK

EBI1

_M_C

LK_N

EBI1

_OE_

N

EBI1

_WE_

N

EBI2

_A_D

_0

EBI2

_A_D

_1

EBI2

_A_D

_2

EBI2

_A_D

_3

EBI2

_A_D

_4

EBI2

_A_D

_5

EBI2

_A_D

_6

EBI2

_A_D

_7

EBI2

_A_D

_8

EBI2

_A_D

_9

EBI2

_A_D

_10

EBI2

_A_D

_11

EBI2

_A_D

_12

EBI2

_A_D

_13

EBI2

_A_D

_14

EBI2

_A_D

_15

EBI2

_BSY

_N

EBI2

_CS0

_N

EBI2

_CS1

_N

EBI2

_LB_

N

EBI2

_M_C

LK

EBI2

_OE_

N

EBI2

_UB_

N

EBI2

_WE_

N

LCD

_CS_

N

LCD

_EN

LCD

_RS

DN

C_1

DN

C_2

DN

C_3

DN

C_4

DN

C_5

DN

C_6

DN

C_7

DN

C_8

DN

C_9

DN

C_1

0

LNA_OUT_C_HB

LNA_OUT_C_LB

MIX_INP_C_LB

MIX_INM_C_LB UART1_RX_D

MIX_INP_C_HB UART1_TX_D

MIX_INM_C_HB GP_PDM_0_ETM_MODE_INT_GPIO_0

PWR_DET_IN PA_ON1_GPIO_1

RBIAS_RX SDCC_CMD_GPIO_2

RBIAS_TX SDCC_DATA0_GPIO_3

RX_IN_C_HB SDCC_DATA1_GPIO_4

RX_IN_C_LB SDCC_DATA2_GPIO_5

RX_IN_GPS SDCC_DATA3_GPIO_6

TX_OUT_HB_A SDCC_CLK_GPIO_7

TX_OUT_HB_B UART1_CTS_N_GPIO_8

TX_OUT_LB_A UART1_RFR_N_GPIO_9

TX_OUT_LB_B UART2_RX_D_UIM_PWR_DIS_GPIO_10

VCO_TUN_CRX EBI2_CS2_N_ETM_MODE_CS_N_WLAN_PWR_EN_GPIO_11

VCO_TUN_GRX EBI2_CS3_N_GPIO_12

VCO_TUN_TX MDP_VSYNC_PRI_GPIO_13

NCP_CTC1 MDP_VSYNC_SEC_ETM_KSENSE_INT_BT_WAKEUP_GPIO_14

NCP_CTC2 KYPD_11_ETM_TPKT_A_2_GPIO_15

NCP_FB KYPD_9_ETM_PSTAT_A_0_GPIO_16

VDD_A_1 KYPD_15_ETM_TPKT_A_0_GPIO_17

VDD_A_2 KYPD_17_ETM_TPKT_A_1_GPIO_18

VDD_A_3 KYPD_MEMO_ETM_PSTAT_A_1_GPIO_19

VDD_A_4 KEYSENSE_4N_ETM_TPKT_A_3_GPIO_20

VDD_A_5 KEYSENSE_3N_ETM_TPKT_A_4_GPIO_21

VDD_CORE_1 KEYSENSE_2N_ETM_TPKT_A_5_GPIO_22



VDD_CORE_4 GP_PDM_2_ETM_PSTAT_A_2_WLAN_MUX_EN_GPIO_25

VDD_CORE_5 PA_R0_GP_PDM_1_FAILED_BOOT_GPIO_26

VDD_CORE_6 AUX_PCM_SYNC_SDAC_L_R_BT_PCM_SYNC_GPIO_27

VDD_CORE_7 AUX_PCM_DIN_SDAC_MCLK_BT_PCM_DIN_GPIO_28

VDD_CORE_8 AUX_PCM_DOUT_SDAC_DOUT_BT_PCM_DOUT_GPIO_29

VDD_CORE_9 AUX_PCM_CLK_SDAC_CLK_BT_PCM_CLK_GPIO_30

VDD_CORE_10 RINGER_CAM_FLASH_ETM_TCLK_GPIO_31

VDD_CORE_11 CAM_PCLK_GPIO_32

VDD_CORE_12 CAM_HSYNC_ETM_PSTAT_B_2_GPIO_33

VDD_EFUSE CAM_VSYNC_ETM_TSYNC_B_GPIO_34

VDD_IN1_1 CAM_DIS_GPIO_35

VDD_IN1_2 CAM_DATA_0_ETM_PSTAT_B_1_GPIO_36

VDD_IN1_3 CAM_DATA_1_ETM_PSTAT_B_0_GPIO_37

VDD_IN1_4 CAM_DATA_2_ETM_TPKT_B_0_GPIO_38







VDD_MPLL_1 CAM_DATA_9_ETM_TPKT_B_7_GPIO_45

VDD_MPLL_2 CAM_CLK_GPIO_46

VDD_P1_1 I2C_SDA_GPIO_47

VDD_P1_2 I2C_SCL_GPIO_48

VDD_P1_3 HEADSET_DET_N_ETM_TSYNC_A_GPIO_49

VDD_P1_4 GP_CLK_GPIO_50

VDD_P1_5 EBI1_CS2_N_BT_PWR_EN_GPIO_51

VDD_P1_6 EBI1_CS3_N_GPIO_52

VDD_P1_7 UIM_RESET_UART2_CTS_N_GPIO_53

VDD_P2_1 UIM_CLK_UART2_RFR_N_GPIO_54

VDD_P2_2 UIM_DATA_UART2_TX_D_GPIO_55

VDD_P2_3 TRK_LO_ADJ_GPIO_56

VDD_P4_1 TRUSTED_BOOT_GPIO_57

VDD_P4_2 MODE_0

VDD_P5_1 MODE_1

VDD_P6_1 MODE_2

VDD_P6_2 RESOUT_18V_N

VDD_P6_3 RESOUT_26V_N

VDD_P7_1 RTCK

VDD_P7_2 TCK

VDD_RFRX1_1 TDI

VDD_RFRX1_2 TDO

VDD_RFRX1_3 TMS

VDD_RFRX1_4 TRST_N

VDD_RFRX1_5 WDOG_EN

VDD_RFRX1_6 PA_ON0

VDD_RFRX1_7 CCOMP

VDD_RFRX1_8 EAR1ON

VDD_RFRX2_1 EAR1OP

VDD_RFRX2_2 HKAIN0

VDD_RFRX2_3 HKAIN1

VDD_RFRX2_4 HPH_OUT_L_P

VDD_RFRX2_5 HPH_OUT_R_N

VDD_RFRX2_6 HPH_VNEG

VDD_RFRX2_7 HSET_BIAS

VDD_RFRX2_8 LINE_IN_L_P

VDD_RFRX2_9 LINE_IN_R_N

VDD_RFTX_1 LINE_OUT_L_P

VDD_RFTX_2 LINE_OUT_R_N

VDD_RFTX_3 MIC1N

VDD_RFTX_4 MIC1P

VDD_RFTX_5 MIC2N

VDD_RFTX_6 MIC2P

VDD_RFTX_7

VDD_RFTX_8

VDD_RFTX_9

VDD_SPKR

VREG_RFRX1

REF

_BYP

REF

_GN

D

REF

_ISE

T

VREG

_5V

VREG

_MM

C

VREG

_MPL

L

VREG

_MSM

A

VREG

_MSM

E1

VREG

_MSM

P

VREG

_NC

P

VREG

_RF

VREG

_RFR

X2

VREG

_RFT

X

VREG

_RU

IM

VREG

_TC

XO

VREG

_USB

VREG

_XO

VSW

_5V

VSW

_MSM

C

VSW

_RF

TCXO

_OU

T

XO_A

DC

_IN

XO_A

DC

_REF

XO_T

H_G

ND

XTAL

_19M

_IN

XTAL

_19M

_OU

T

XTAL

_32K

_IN

XTAL

_32K

_OU

T

CBL

_PW

R_N

KPD

_PW

R_N

PON

_RES

ET_N

PS_H

OLD

SPKR

_OU

T_M

SPKR

_OU

T_P

USB

_DM

USB

_DP

USB

_ID

VIB_

DR

V_N

BAT_

FET_

N_B

AT_

CH

G_C

NT_

N

ISN

S_M

ISN

S_P

USB

_VBU

S

VBAT

VCH

G

VCO

IN

MPP

1

MPP

2

MPP

3

MPP

4

GN

D_5

V

GN

D_A

_RF_

1

DIV

_RX_

IN_L

B

DIV

_RX_

IN_H

B

GN

D_A

_RF_

4

GN

D_A

_RF_

5

GN

D_A

_RF_

6

GN

D_A

_RF_

7

GN

D_A

_RF_

8

GN

D_A

_RF_

9

GN

D_A

_RF_

10

GN

D_A

_RF_

11

GN

D_A

_RF_

12

GN

D_A

_RF_

13

GN

D_A

_RF_

14

GN

D_A

_RF_

15

GN

D_A

_RF_

16

GN

D_A

_RF_

17

GN

D_A

_RF_

18

GN

D_A

_RF_

19

GN

D_A

_RF_

20

GN

D_A

_RF_

21

GN

D_A

_RF_

22

GN

D_A

_RF_

23

GN

D_A

_RF_

24

GN

D_A

_RF_

25

GN

D_A

_RF_

26

GN

D_A

_RF_

27

GN

D_A

_RF_

28

GN

D_A

_RF_

29

GN

D_A

_RF_

30

GN

D_A

_RF_

31

GN

D_A

_RF_

32

GN

D_A

_RF_

33

GN

D_A

_RF_

34

GN

D_A

_RF_

35

GN

D_A

_RF_

36

GN

D_A

_RF_

37

GN

D_A

_RF_

38

GN

D_A

_RF_

39

GN

D_A

_RF_

40

GN

D_A

_RF_

41

GN

D_A

_RF_

42

GN

D_A

_RF_

43

GN

D_A

_RF_

44

GN

D_A

_RF_

45

GN

D_B

UC

KRF

82n

C2111

C21782.2u

L2101

4.7uL2102

4.7u

TRK_LO_ADJ

TCXO

+2.1V_RFRX1

+2.1V_RFRX1

CDMA_LB_MIX_INPCDMA_LB_MIX_INM

CDMA_HB_RTR_OUT

CDMA_LB_RTR_OUT

CDMA_HB_RTR_IN

CDMA_LB_LNA_OUT

CDMA_LB_RTR_IN

EBI1_CS0/

EBI1_DQM[1]

EBI1_DQM[0]

EBI1_DQS[0]

EBI1_DQS[1]

EBI1_M_CLK

EBI1_OE/

EBI1_WE/

MLCD_RESET/

USB_D+USB_D-

+2.1V_MSMA

+2.1V_MSMA

EBI1_A[1]

EBI1_A[2]

EBI1_A[3]

EBI1_A[4]

EBI1_A[5]

EBI1_A[6]

EBI1_A[7]

EBI1_A[8]

EBI1_A[9]

EBI1_A[10]

EBI1_A[11]

EBI1_A[12]

EBI1_M_CLK/

EBI2_UB/

NAND_WP/

+2.8V_LCD

+2.8V_LCD

+VPWR

+VPWR

+1.8V_MSME

+1.8V_MSME

+1.8V_MSME+1.8V_MSME

+2.1V_RFRX2

+2.1V_RFRX2

CDMA_HB_MIX_INMCDMA_HB_MIX_INP

CDMA_HB_LNA_OUT

CDMA_PWR_DET_IN

CDMA_GPS_RTR_IN

SPKR_OUT_NSPKR_OUT_P

LINE_IN_L_PLINE_IN_R_NLINE_OUT_L_PLINE_OUT_R_N

GPIO[24]

BT_PCM_DIN

EBI2_CS1/

TEMP_ADC

PCB_REV_ADC

GPIO[54]

RESIN/PWR_ON_SW/

TCK

ISNS_P

EBI1_D[0]

EBI1_D[1]

EBI1_D[2]

EBI1_D[3]

EBI1_D[4]

EBI1_D[5]

EBI1_D[6]

EBI1_D[7]

EBI1_D[8]

EBI1_D[9]

EBI1_D[10]

EBI1_D[11]

EBI1_D[12]

EBI1_D[13]

EBI1_D[14]

EBI1_D[15]

EBI1_A[0]

EBI1_BA[0]

EBI1_BA[1]

EBI2_D[0]

EBI2_D[1]

EBI2_D[2]

EBI2_D[3]

EBI2_D[4]

EBI2_D[5]

EBI2_D[6]

EBI2_D[7]

EBI2_D[8]

EBI2_D[9]

EBI2_D[10]

EBI2_D[11]

EBI2_D[12]

EBI2_D[13]

EBI2_D[14]

EBI2_D[15]

EBI2_OE/

EBI2_WE/

BT_UART_RXDBT_UART_TXD

EAR_SENSE/

LCD_ID

TRST/

-1.8V_NCP

-1.8V_NCP

-1.8V_NCPMIC_BIAS

MIC1P

GREEN_ENRED_EN

VIB_DRV/

+1.3V_MPLL

+1.3V_MPLL

+2.25V_SMPS_RF

+2.25V_SMPS_RF

+2.6V_MSMP

+2.6V_MSMP

+2.6V_MSMP

+VDD_P6

+VDD_P6

CDMA_AWS_RTR_OUT

EBI2_BSY/

+5.0V_USB

HPH_OUT_R

ISNS_M

EBI1_ADV/

HPH_OUT_L

CHG_CNT/BATT_FET/

ACC_ADC

EAR10NEAR10P

+VCHAR

CDMA_PA_ON0

TDO

RTCK

PS_HOLD

+2.1V_RFTX

+2.1V_RFTX

+2.1V_RFTX

EBI1_DQM[2]

AUDIO_AMP_EN

GPIO[2]GPIO[3]

GPIO[6]GPIO[7]GPIO[8]GPIO[9]

GPIO[11]MLCD_VSYNC

GPIO[15]

GPIO[18]GPIO[19]GPIO[20]

GPIO[22]

BATT_ID

BT_PCM_SYNC

BT_PCM_DOUT

BATT_THM_ADC

GPIO[31]GPIO[32]GPIO[33]GPIO[34]GPIO[35]

FOLDER_CLOSE/

GPIO[39]GPIO[40]GPIO[41]GPIO[42]GPIO[43]GPIO[44]GPIO[45]GPIO[46]

GPIO[48]

+1.3V_MSMC

+1.3V_MSMC

GPIO[5]

GPIO[49]GPIO[50]

GPIO[14]

GPIO[52]

TMS

TDI

LCD_RS

MLCD_CS/

EBI2_LB/

GPIO[47]

+VBATT

EBI1_A[13]

+2.8V_TCXO

EAR_MIC

BT_PCM_CLK

+2.6V_BT

GPIO[51]

CDMA_PA_ON1

GPIO[4]

GPIO[16]

GPIO[21]

PA_RANGE_0

GPIO[36]

GPIO[38]

CDMA_GPS_MODE

GPIO[23]

GPIO[17]

CDMA_HB_MRDRTR_IN

CDMA_LB_MRDRTR_IN

QSC6055


89

C6011

1.2p

C6017

15p

VA60

05

VA6018

VA6019

VA6020

VA6021

VA6000

VA6001

LD6000 LD6001 LD6002 LD6003

C60

25

15p

C60

19

20p

C60

20

20p

VA6022

10

R60

41

R6027 470

KB6037

U6002PP2106M3

14

13

12

11

10

9

8

157

166

175

184

193

202

211

22

23

24

25

26

27

28

29PGND

GND2

RESETB

XI

XO

CLK_SEL

VDD

P10

TEST

P40

SEL_

28P

P41

P57

P42

P56

P43

P55

P44

P17

P45

P15

P46

GND1

P54

P53

P52

P51

P50

P47

C6013

DNI DNI

C6014

10p

C60

12

+2.6V_MSMP

+2.6V_MSMP

R60

29

3.3K

0R6014

C6002

10n

10n

C6005

10n

C6003

10p

C6001

C6004

1u

C6021

10n

C6022

DNI

0

R6015

R6019

0

R6020

0

R6028

470

R6030

470

R6031

470

470

R6032

470

R6035

R6036

470

R6037

470

R6038

470

470R6025

R6023 470

R6016 470

R6021 470

470R6022

R6018 470

KB6038

KB6026

R60

39 0+2.6V_MSMP

FL6000

2450MHz

4231 IN OUT

GND1 GND2

C6018

12p

C6026

10p

R6024

750K

R6033120K+2.6V_MSMP

+2.6V_MSMPR6034

3.3K

TP6000

0.1u

C60

23

C60

240.

1u

R60

42

10

SW60

02

32-

12

1-1

1

GN

D

VA60

03

VA60

08

VA60

06

SW60

01

32-

12

1-1

1

GN

D

C6008

10n

U6000BCM2070B2KUBXG

F4

D5

A1B6D7E6F3F6

A2

A3

B3

E3C3F2D2E5C2F5

A4B4C4E4E2D4C1

C6D1

B2

E1B5C5C7

D6

A6B7B1E7F7A7F1D3

A5VB

AT

VDD

O

VDD

C2

VREG

VDD

PXVD

DR

F

VDD

_USB

VDD

TF

VREG

HV

RES

RFP RST_NREG_EN

SCL

HUSB_DN

SDA TM2

SPIM_CLK PCM_INSPIM_CS_N PCM_OUT

PCM_CLKLPO_IN PCM_SYNC

XIN UART_TXDXOUT UART_RXD

UART_RTS_NGPIO_0 UART_CTS_N

GPIO_1

VDD

C1

HUSB_DP

VSS6

VSS5

VSS4

VSS3

VSS2

VSS1

GPIO_6

GPIO_5

VA60

07

10

R60

43

SW60

03

32-

12

1-1

1

GN

D

SW60

00

32-

12

1-1

1

GN

D

TP6001

VA60

15

R6044 0

0R6013

X6000TSX-3225_26MHZ

26MHz

21

34

C6007

10p

VA60

02

C6015

DNI

R6009 15K

C60

16

100p

+2.6V_MSMP

+2.6V_BT

2.2u

C60

00

FB60

0060

0

C60

062.

2u

SDBTPTR3015

ANT6000

2

31

4DUMMY3

FEED DUMMY2

DUMMY1

32.768KHz

SSP-T7-F_12.5PF_20PPMX6001

21

34

10M

R6017

U6001

3

4 25

VCC

GND

+2.6V_MSMP

LED_BL_OUT

KB6036

KB6047

R6026 470

VA60

05

VA60

10

VA60

09

VA60

14

VA60

16

VA60

13

VA60

12

VA60

11

VA60

17

KB6001

KB6045 KB6046

KB6041 KB6042

KB6039KB6035KB6033 KB6034

KB6031KB6029 KB6030KB6027 KB6028KB6025

KB6023KB6021 KB6022KB6019 KB6020KB6017 KB6018

KB6015KB6013 KB6014KB6011 KB6012KB6009 KB6010

KB6005 KB6006KB6003 KB6004KB6002KB6000

KB6008

KB6016

KB6024

KB6032

KB6040

KB6044

KB6007

R60

40

10

QKEY_RESET/

QKEY_I2C_SDA

UP

UP

CAM

CAM

QKEY_I2C_SCL

DOWN

DOWN

QKEY_INT/

BT_LPO

BT_LPO BT_PCM_SYNCBT_PCM_CLKBT_PCM_DINBT_PCM_DOUT

BT_UART_RXDBT_UART_TXD LOCK

LOCK

SUB_COL5

COM

COM

MAIN_LED8

MAIN_LED7

SUB_COL4

SUB_ROW1

[BlueTooth_BCM2070BOKUBG(EXT_LPO)][KEYPAD BACKLIGHT]

External LPO

5

Z

SPACE

.,

FN

9

U

2 3 4

HF

WQCLR

DS

POIY

SHIFTOKLEFT

6

MN

B

8 E R

DOWN

T UP

A

V

J K

RIGHT

1

L

G

[Qwerty with PP2106M3]

X

[SIDE KEY_TACT S/W]

C

ENTER

7

0

each CH. 30mA under check


90

2

3

1Q5100

GD

S

R5009 0

L5002 82n

L5003 82n

2.2uC5001C5000

2.2u

C65

092.

2u

U5001

19

5

15

14

13

7

6

17

4

3

2

18

9

8

16

10

11

1

12VDN

YP

GN

D

PWM/CLK

HEN

SCL

VDDP

XP

XN

YN

VDD

LEN

SADD

SDA

GAIN

VDP

VBAT

INTB

PGND

R5013

200K

R51

01

47K

D51

00

0R5008

10u

C51

02

+2.6V_MSMP+2.6V_MSMP

15K

R51

02

C51

0347

0p

R5104

1K1K

R5103

27p

C51

01

VA5102

C65

102.

2u

NCS2200SQ2T2GU51012

3

14

5

VCC

VIN-

OUT VIN+GND

+2.6V_MSMP

100n

C51

00

R51

0556

0K

+2.6V_MSMP

200K

R51

00

R51

0647

K

3.9n

C5006

82nL5000

82nL5001

4015C

u1

+VPWR

+1.8V_MSME

VA5103

4.7K

R50

03

R50

01

4.7K

EMS1812TPB6

CN5001

2

1

1M

R50

11

1M

R50

12

+2.6V_TOUCH

CN5000

2

1

+2.6V_TOUCH

R50024.7K

DNIR5000

+2.6V_TOUCH+VPWR

C50

051u

U5100NLAS3158MNR2G

67

38

5

401

11

29

121A0VCC2

0B0VCC1

0B1

A1S0

1B0

GND11B1

GND2S1

J5100JAM3333-F47-7F

2

3

4

5

6

1M5-MIC

ASSIST_PIN

M3-DETECT

M4-L

M1-R

M6-GND

6105C u1

ICVL

0505

101V

150F

RVA

5101

VA51

00IC

VL05

0510

1V15

0FR C5017 1u

IC6501WM9093ECS-R

B3

A4

C3

C2

B2

D1

D3

D4

C1

A1D2

B1

D5

A2

A5

A3B5

B4

C5

C4

GN

D

OUT+

HPV

DD

CPVDDCPVSS

CN

HPL

OUT-

BIAS

IN2- HPR

IN1+SV

DD

IN3-

IN2+

SDA

IN1-

IN3+

CP

SCL 1056

R02

0.1u

C65

03

0.1u

C65

04R

6502

200.1u

C65

08

2.2u

C65

06

C65

072.

2u

C65

052.

2u

R5005 0

I2C_SDAI2C_SCL

TOUCH_Y-

TOUCH_Y+TOUCH_X-

TOUCH_I2C_SCL

LIN_PWM_FREQ

MOTOR_EN

TOUCH_EN

HPH_OUT_L_P

EAR_MIC

EAR_MIC

HPH_OUT_R_N

TOUCH_IRQ

TOUCH_I2C_SDA

SPK- SPK-

SPK+SPK+

TOUCH_X+

EAR_SENSE

EARPHONE_KEY

PAD_EAR_SENSE/

PAD_EAR_SENSE/

MIC_BIAS_EN

HPH_L

HPH_L

HPH_R

HPH_R

Close to Motor(eliminate Motor noise)

[EARJACK CIRCUIT]

CLOSE TO EARJACK

CLOSE TO EARJACK

[AUDIO_SUB SYSTEM]

[Touch & Haptic Driver]

[SPK_OUT]

ACTIVE HIGH


91

TP4011

ZD4000

R4018

4.7K

R4019

4.7K

+2.6V_MSMP

+2.6V_MSMP

C4663

4.7u

TP4012R4007 0

R4008 0

R4009 0

R40

14

56K

56K

R40

13

R40

12

56K

56K

R40

11

R40

10

56K

+3.0V_SD

+3.0V_SD

1uC

4015

+1.8V_MSME47K

R3201

S40018

7

6

5

4

3

2

1

G5 G3 G1 SW

C1

C2

C3

C4

C5

C6

C7

C8

G6 G4 G2 COM

ZD40

01

ZD40

02

ZD40

03

ZD40

04

ZD40

05

ZD40

06

C40131u

TP4010

+VPWR +3.0V_PROXI

U4631DNI_EUSY0365101

5

2314

VOUTVDDGNDCE

PGN

D

C4661DNI

C4662

1u

U4000

5

2314

VOUTVDDGNDCE

PGN

DC40141u

+3.0V_SD+VPWR

+2.8V_TCXO

33n

C40

12

150K

R40

17

51K

R4016

CN4000

31 30

32 29

33 28

34 27

35 26

36 25

37 24

38 23

39 22

40 21

41 20

42 19

43 18

44 17

45 16

46 15

47 14

48 13

49 12

50 11

51 10

52 9

53 8

54 7

55 6

56 5

57 4

58 3

59 2

60 1

15pF

FL4008

10 5

46

37

28

19INOUT_A1INOUT_B1

INOUT_A2INOUT_B2

INOUT_A3INOUT_B3

INOUT_A4INOUT_B4

G1

G2

30

R4006

LED_BL_OUT

TP4003TP4002

TP4006

TP4009

+2.6V_MSMP

C400715p

C400615p

R4004

100

+VPWR

TP4000

TP4007

TP4005

TP4008R4005

100

+2.6V_CAM_IOVDD

+2.8V_CAM_AVDD

+2.6V_CAM_IOVDD

+1.8V_CAM_DVDD

0.1uC4010

0.1uC4009

15pC4002 C4003

15p

0.1uC4008

TP4001

TP4004

+2.8V_LCD

15pF

FL4000

10 5

46

37

28

19INOUT_A1INOUT_B1

INOUT_A2INOUT_B2

INOUT_A3INOUT_B3

INOUT_A4INOUT_B4

G1

G2

15pF

FL4003

105

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

G1

G2

15pF

FL4007

105

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

G1

G2

C400033p

C40010.1u

+1.8V_MSME

FL4002

15pF10 5

46

37

28

19INOUT_A1INOUT_B1

INOUT_A2INOUT_B2

INOUT_A3INOUT_B3

INOUT_A4INOUT_B4

G1

G2

15pF

FL4005

10 5

46

37

28

19INOUT_A1INOUT_B1

INOUT_A2INOUT_B2

INOUT_A3INOUT_B3

INOUT_A4INOUT_B4

G1

G2

100pC4004 +3.0V_PROXI

FL4001

7.5pF

105

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

G1

G2

FL4006

7.5pF

105

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

G1

G2

FL4004

7.5pF

105

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

G1

G2 R4002

2.2KR4003

2.2K

C4005100p

30

R4001

S400016141317621158

7594103112121182419232022

2526272829303132PG

ND

1PG

ND

2PG

ND

3PG

ND

4PG

ND

5PG

ND

6PG

ND

7PG

ND

8

D0 PCLKD1 VSYNCD2 HSYNCD3 STANDBYD4 SCKD5 SDAD6 RESETBD7 MCLK

DG

ND

1D

GN

D2

DG

ND

3AG

ND

1AG

ND

2D

VDD

VDD

IOAV

DD

PT40

00

68K

EBI2_D[0]

EBI2_D[2]

EBI2_D[4]EBI2_D[5]EBI2_D[6]EBI2_D[7]

EBI2_D[8]EBI2_D[9]

EBI2_D[10]

EBI2_D[11]

EBI2_D[3]



EBI2_OE/

EBI2_WE/

SD_CMD

SD_DATA[0]SD_DATA[1]

SD_DATA[2]SD_DATA[3]

SD_CLK

SD_DET/

EBI2_D[1]

MAIN_LED4MAIN_LED3MAIN_LED2

MAIN_LED5MAIN_LED6

CAM_RESET/

CAM_DATA[0]


CAM_I2C_SDA

CAM_PCLK

CAM_I2C_SCL

PWR_ON_SW/

MLCD_RESET/

LCD_ID

TOUCH_Y-TOUCH_Y+

TOUCH_X-

MLCD_VSYNC

CAM_HSYNC

CAM_VSYNC

CAM_DATA[1]CAM_DATA[2]CAM_DATA[3]


CAM_MCLK

EAR10PEAR10N

LCD_RS/

MLCD_CS/

MIC_BIAS

FOLDER_CLOSE/

TOUCH_X+

CAM_PWR_DOWN

SD_LDO_EN

SKPD_LED_EN

MIC1P

RED_ENGREEN_ENSUB_COL5

TEMP_ADC

PROXI_3D_SCL

PROXI_3D_SDA

PROXI_OUT/

SUB_COL4

SUB_ROW1

MAIN_LED1

PROXI_LDO_EN

Card Insert : Switch ON

[PROXI LDO(300mA)]

DNISD_DET/ : GPIO Pull-up

[SD LDO(300mA)]

[TEMP CHECK]

[SD Socket(1.62T)_ALPS]

[CAM_SOCKET_MITSUMI] [MAIN_B TO B CONN_60PIN 1.0T_LSM]


92

C30182.2u

C30172.2u

C30162.2u

C30152.2u

C30042.2u

+VCHAR

C30

081u

C301310u

+5.0V_USBU3000

9 6

35

4

28

17IN1OUT1

IN2OUT2

IC1

OVLOIC2

GN

D

PGN

D

R3016

0

100uC3020

04-5151-005-103-883ENRY0011401

CN3001

15

13

11

9

7

5

4

3

2

1

14

12

10

8

6

R3002 4.7K

ZD30

02

FL3000

INOUT

GND1GND2

56p

C30

191u

C30

06

ZD30

00

ZD30

01

SC300

1

C30002.2u

+2.6V_MSMPR3001 80.6K

VA30

00

VA30

01

Q3000

5

64

73

82

91

10DRAIN_B

NC1 COLLECTOR_B

COLLECTOR EMITTER

SOURCE BASE

DRAIN NC2

GATE

2.2K

R3015+2.6V_MSMP

2.2K

R3014

U3001

25206

114

8

3

9

105

16

17

18

19

15

14

13

1223

17

2122242C

2+

C1+ C1-

C2-

IN1 OUT

IN2 BL1

BL2

BL3

BL4

BL5

BL6

BL7_AUX1

BL8_AUX2

EN LDOA

LDOB

SDA

LDOC

SCL LDOD

AGN

D

PGN

D

EP

+2.6V_TOUCH

1uC3007

R3008 0

C3005 1u

+VPWR LED_BL_OUT

+2.6V_CAM_IOVDD

+2.8V_CAM_AVDD

+1.8V_CAM_DVDD

100KR3013

+2.6V_MSMP

C30

09D

NI

C30

10D

NI

D30

01

200K

R3007

33n

C30

11

VA30

02

R30

0530

0K

C30142.2u

CN3002

3

2

1

C30

0133

n

R30

04

0.1

C30

0210

0u

+VBATT

+VCHAR

TP3001TP3000

R30

00

51K

+VPWR

CN3000

4

3

2

1

D1

D2

C3003

47p

R3006

0

USB_D-USB_D+

+VBATTCHG_CNT/

MAIN_LED4MAIN_LED3MAIN_LED2

MAIN_LED5

CP_EN

ACC_ADC

ISNS_P

ISNS_M

BATT_THM_ADC

I2C_SDA

BATT_ID

BATT_ID_PU

BATT_FET/

I2C_SCL

MAIN_LED6

MAIN_LED8MAIN_LED7

MAIN_LED1

[SHIELD CAN_CLIP] [MICRO USB IO CAN]

Protect Power off Tunning Cap_QWERTY CASE

[ Battery Connector][Charging Circuit_QSC]

200mA

[Charging Pump AAT2862]

200mA

200mA

200mA

ID

D+

D-

VBUS

[ Micro USB]

AUX : Must use under 30mA/Ch.


93

UN270


94

3. BGA Pin Map 3.1 EUSY0336202 (QSC6055) : 424 CSP (Bottom View)

UN270


95

3.2 EUSY0347506 (H8BCS0SI0BAR-46M) : 149 FBGA (Top View)

All pins are used

UN270


96

3.3 EUSY0418701 (BCM2070B2KUBXG) : 42-bump WLBGA (Top View)

UN270


97

3.4 EUSY0403901 (WM9093ECS-R) : 20-bump CSP (Top View)

UN270


98

4. PCB Layout 4.1 Main PCB

4.1.1 Top Side

��

LD6002

LD6003

R6040

VA6000

LD6000

LD6001

KB6039KB6040

KB6041KB6045

KB6037

KB6038

KB6042KB6044

ANT1006

ANT1007

VA6001

R6041

R6042

R6043

KB6002KB6003

KB6006KB6007

KB6009KB6010

KB6000KB6001

KB6004KB6005

KB6008KB6011

KB6012KB6014

KB6015KB6018

KB6019KB6021

KB6022KB6013

KB6016KB6017

KB6020KB6023

KB6024KB6026

KB6027KB6030

KB6031KB6033

KB6034KB6025

KB6028KB6029

KB6032KB6035

KB6036KB6046

KB6047

D

D

A

V J

15

31 30

60

B CA

7

FEDCBA1

7

E F G

121

B C D E F

AB

AC AA Y W

G H J K L M

NP M L KRU T

N P Q T

ABCDH G F E

123

ANT1000

ANT6000

FL4000

CN

5001

FL6000

U6001

CN5000

R6017

C6507

R8016

R8020 R8021R8019

C4663

R6038

TP4012

FL4003

L5003

ZD4004

R4007

TP6001

D5100

R5102

U5101

C4010

R5105

R4008

C6001

R4009

C4008

C4009

VA

3000

R3001

ZD3002

CN3000

VA6013

U6002

R5013

C5006

R5005

C4005

FL1009

C2168B

C2129B

R2112B

C1032

R5103

R5104

R4001

C1090

C2157B

R2115B

R2117B

C2170B

C2171B

C2174B

C2158B

C2163B

C2124B

C2177B

C1074

C1086

R2121B

C1088

R2106B

C1000

C1005

C1037

R1004

C1038

R3008

L1051

C1059

R3004

C3008

L1036

C1065

C1056

R1006

L1032

L1030

FL1005

C1039U1005

ANT1002

U1002

R3016

U3001

C3011

CN

3002

VA6018

L1022

C1041

L1012

C1022

L5000

C6020

C6019

R6020

SW6002

ZD4001

VA

6020SW

6001

C6025

C6013

C6506

R8017

CN

4000C

4000

C4001

S4001

C6026

C6014

C6011

L5001

R6015

C6000

R6039

R6019FB6000

C6021C6004

C6006

X6001

C6505

C6022

R6501

R6024

C6016

C6003

C5017

C6503

R6502

C6509

C6504

IC6501

U8000

R6031

TP4010

R6032

C8001

R8018

R6030C4662

U4631

R4019R4018

R6036

R6035C4661

TP4001

TP4004

VA5103

ZD4005

R4014

C4015

R4013

ZD4006

C6510

VA

6012

VA

6011

VA

6010R5011

FL4002

JTAG

8000

J5100

R5101

C6015

R6009

R6044

C6012

C6005

C6002

U6000

C6007

C6008

R6014

C3019

R6013

C6508

C5016

R6023

R6027

R6025

VA6021R6026

VA6002

VA6009 R6028

VA6008

VA6007

VA6003

VA6006

VA6005

VA6004

R6037

FL4008

TP4005

C6023

TP4009

TP4008

TP4006

FL4007

R6034

FL4005

R5012

C5000

R8014

R8013

R4012

ZD4003

R4010

R4011

L5002 VA5102

ZD4002

VA5101

R5100C6017

R8000

TP6000

R5001

PT4000

VA5100

Q5100 C5101

C5100

R5106

X6000

C6018 R3005

VA3001

C3001

R8001

C8000

R6029

R6022

VA6014

R6018

VA6016

VA6015

R6021

R6016

R5009

R5003

VA6017

C6024

R6033

C5001

U5001

R5000

R5002

R5008C5005

TP8002

TP4011

TP8001

C4014

U4000

TP8000

C4013

R4017

R4016

C4012

ZD4000R3201

C4004

B2

01

2C

B7

02

2C

TP2201B

B2

21

2C

B2

51

2C

C2119B

C2118B L2101B

C2176B

R2107B

C2127B

L2102B

L1018

U5100 C5103

C5104

R4004

C4002R3002

TP2101B

C2206B

B05

12

CB

01

22

CC

2153B

R2108B

C2172B

C2175B C

2101B

C2105B

C2121B

C2120B

C2123B

C2178B

C2139B

C2125B

C2130B

C1075

C1081

L1063L1064 C1079

C1082

R2114B

L1061

C1104

L1015FL1001

C1028

R1013

U1004

FL4004

C2164B

C2161B

R2119B

C2128B

C2162B

C2131B

C5102

R4003

TP4002

TP4003

R4002

S4000

C4003FL4001

TP4000

L1049

C2126B

C2173B

X2101B

R8015

C1085

C1070

FL1007

C1078

R2122B R2116B

FL1000

L1060 L1001

C1025

L1007

C1036

C1015C1103

U1006

R4005

TP4007

C1089

C1100

FL1010U

2201B

U2101B

C2167B

C2169B

C2138B

C2140B

C2134B

U1000

R1009

R1003 R1002

ANT1003

R1011

C4007

C4006

R4006

FL4006

C1087

FL1011

L1048C1092

L1045

C2165B

C2136B

C2166B

C2117B

C2137B

C2133B

C2142B

C2135B

C2141B

L1042

FL1008

L1035

FL1006

L1041

C2132BR2113B

L1044

L1034

L1037

C1014

C1017

R1001

C1016

R1000

C1033

L1017

L1053

C1030

SC300

C1031

C3003FL3000

C1071

L1046 C3006

C1050

FL1002

L1019

ANT1005

L1043

C1080

C1105

C3002

C3020

C3004

C3000

TP3001

TP3000

R3006

R3000

R1010

SW1002

L1050

R1007

U1007

TP2202B

C1048

C1053

L1026

L1023

L1029

C1044

C1054

R1005

L1028C

1052

L1033

R1020

FL1004

C1063

C1064

C1058

C1057L1031

L1056

C1013

L1003

L1004C

1102

C1001

C1093

L1057

L1052

L1000C

1101

C1002

C3015

C3014

C3005

C3007

ZD3000

Q3000

D3001

R2203BR2201B

C2209B

C2208B

X2201BC

2155B

C2154B

L1011

C1018

C2114B

C2113B

R1019

C2116B

C2147B R2109B

R2103B

L1020

U1003

C1034

C1106

C3013

R3014

VA

3002

R3007

R3015

C3009

ZD3001

C3010

U3000

C1067

R1008

C1066

R2123B

L1038

C1073

C2202B

C1099

L1055

C2204BC2203B

C2205BR2202B

C2106B

C2107B

R2204B

C2201B

C2103B

C2156B

R2118B

C2149B

C2146B

C2104B C2144B

C2151B

R2120B

R2102B

R2110B

C2160B

R2105B

C2159B

C2145B

R2101BC2112B

C2111B

R2104B

C2109B

R2111BC

1062

C2115B

C2143B

C2108B

C2110B

C2148B

C1061

C1060

L1014

C1027

C1035

SW1001

C1003C

3017

C3018

VA

6022

VA

6019

L1010

FL1003

C1098

C1026

R1015

C3016

R3013

30

06

WS

00

06

WS

C1019

C1095

C1042

C1046

C1045

R1018

L1062

C1040

R1017

L1021

C1097

C1051

C1049

R1016

L1013

C1096

L1009

C1029

C1024

UN270


99

4.1.2 Bottom Side

No Loccation NoPART NAME

4746454443424140393837363534333231302928272625242322212019181716151413121110987654321

MCJA00

SBPL00

MDAY00

GMZZ00

MWAE00

MTAB00

MTAA00

MCCZ01

MJN061101

MJN061103

MBJZ02

MHK000000

MPBZ00

MEZ062200

MPBZ02

MPBZ03

MCCZ00

MJN061102

MBJZ00

MJN000000

MBFZ00

MDS000000

MCCZ02

MJN061104

MBJZ01

MCJN00

MFBZ00

MCQ000004

MCQ074200

SUSY00

SNMF01

MEZ000900

ACKA00

MTAZ00

EAU00

SNMF00

SAFF02

ADCA00

GMEY00

MICE00

RAB150000

MCQ000001

MTAZ00

MCQ000000

MCJK00

AKAC00

MTAB00

COVER,BATTERY

BATTERY CELL

DECO, (CAMERA)

SCREW MACHINE, BIND

WINDOW, CAMERA

TAPE, PROTECTION REAR(1)

TAPE, DECO CAMERA

CAP, MS

TAPE, PROTECTION REAR(2)

TAPE, PROTECTION KEY(LOCK)

BUTTON, (LOCK)

SHEET, EAR-JACK

PAD, SUB INTENNA

Label Qualcomm

PAD, (MOTOR)

PAD, (CAMERA)

CAP, (USB)

TAPE, PROTECTION KEY(VOLUME)

BUTTON, (VOLUME)

TAPE, BRACKET CONNECTOR

BRACKET, CONNECTOR

GASKET, CONNECTOR

CAP, (MULTIMEDIA)

TAPE, PROTECTION KEY(CAMERA)

BUTTON, (CAMERA)

COVER, REAR

FILTER, SPEAKER(2)

PAD, SPEAKER

PAD, SPEAKER(2)

SPEAKER

INTENNA, MAIN

Label A/S

CAN ASSY, SHIELD

TAPE, ABSORBER

MOTOR

ANTENNA, SUB

PCB Assembly, Main, SMT

DOME, SHEET ASSY

SCREW, HINGE

INSERT

MAGNET

SHEET, FRONT

TAPE, MAIN CONNECTOR

SHEET, FRONT(2)

COVER FRONT

KEYPAD ASSY MAIN

TAPE, PROTECTION FRONT

No PART NUMBERPART NAME

78

77

76

75

74

73

72

71

70

69

68

67

66

65

64

63

62

61

60

59

58

57

56

55

54

53

52

51

50

49

48

SCREW MACHINE,BIND

HINGE,ASSY

CAP,SCREW

PAD, LOWER PROXIMITY

TAPE PROTECTION

PAD, (T/W CONNECTOR)

PAD, LCD CONN

PAD, (MIC) 2.

DOME SHEET, SUB

PAD, (FPCB SENSOR)

FILTER, (MIC)

DECO, UPPER COVER L, R

INSERT

DECO, UPPER COVER R

DECO, UPPER COVER L

MIC PAD

LCD BOTTOM INSULATOR

INSULATOR, LCD CONN

TAPE, LCD CONN

FPCB ASSY

SUB PCB ASSY

LCD, ASSY

FILTER, (RECEIVER)(3)

KEYPAD ASSY SUB

COVER UPPER

WINDOW, ASSY LCD

TAPE, PROTECTION WINDOW

COVER, LOWER

TAPE, WINDOW MAIN(1)

TAPE, WINDOW MAIN(2)

TAPE, PROTECTION SLIDE

GMEY00

AEH000000

MBL00

MPBZ03

MJN061100

MPBZ02

MCQ015700

MCQ000004

ADB00

MCQ000000

MDJ000000

MJN020802

MET099500

MCR000001

MCR000000

MCQ000001

MEV000001

MIDZ00

MTAZ00

SACY00

SAJY00

SVLM00

MFBZ00

AEX00

MCK084400

EBD00

MJN089300

MCJY00

MJN089300

MJN089301

MJN061102

UN270


100

5. Exploded View

5.1 Full Exploded View

48

52

53

6467

54 69 56

57

59

7374 75

76

7877

76

5172

474644

42454340

413635

3433

32

30

31

2916151312

10

87

6

1 2 34

5

9

11

14

17

1819

20

2122 23

25

2439

40

3837

2826

27

7162

6160

5870

5563

68

6665

5049

UN270


101

Part Name

COVER, BATTERY

BATTERY CELL

SCREW MACHINE, BIND

COVER ASSY, REAR

CAN ASSY, SHIELD

PCB ASSY MAIN

KEYPAD ASSY MAIN

SCREW, HINGE

COVER ASSY, FRONT


CAP, SCREW

SCREW MACHINE, BIND

COVER ASSY, LOWER

FPCB ASSY

LCD BOTTOM LNSULATOR

INSULATOR, LCD CONN

LCD, ASSY

TAPE, LCD CONN

SUB PCB ASSY

PAD, MIC SLIDE

KEYPAD ASSY SUB

PAD, RCV TOP

FILTER, (RECEIVER)

COVER ASSY, UPPER

TAPE, WINDOW MAIN (1)

WINDOW ASSY LCD

TAPE, PROTECTION WINDOW

TAPE, PROTECTION SLIDE

MCJA00

SBPL00

GMZZ00

ACGM01

ACKA00

SAFY00

AKAC00

GMEY00

ACGK00

MTAB00

MBL00

GMEY00

ACGU00

SACY00

MEV000001

MIDZ00

SVLM00

MTAZ00

SAJY00

MCQ66

AEX00

MCQ000001

MFBZ00

ACQ00

MJN089300

EDB00

MJN089300

MJN061102

Location No

5.2 Assy Exploded View

MJN061102

MJN0089300

EDB00

MJN089300

ACQ00MFBZ00

MPBZ00SVLM00

SAJB00

SACY00

ACGU00MTAB00

ACGK00

GMEY00

AKAC00

MBL00

GMEY00

ME000001

MIDZ00

MTAZ00

MCQ000001AEX00

SAFY00

ACKA00

ACGM01

GMZZ00

SBPL00

MCJA00

UN270


102

Part NameCOVER, BATTERY

BATTERY CELL

CAP, MS

SCREW MACHINE, BIND

COVER ASSY, REAR

INTENNA, MAIN

MOTOR

CAN ASSY, SHIELD

PCB ASSY MAIN

DOME, SHEET ASSY

KEYPAD ASSY MAIN

SCREW, HINGE

COVER ASSY, FRONT


CAP, SCREW

SCREW MACHINE, BIND

COVER ASSY, LOWER

RECEIVER

PAD, RCV TOP

FPCB ASSY

FILTER, (RECEIVER)

INSULATOR, LCD CONN

LCD, ASSY

TAPE, LCD CONN

SUB PCB ASSY

ADB73619101

KEYPAD ASSY SUB

COVER ASSY, UPPER

WINDOW, ASSY LCD

MCJA00

SBPL00

MCCZ01

GMZZ00

ACGM01

SNMF01

EAU00

ACKA00

SAFY00

ADCA00

AKAC00

GMEY00

ACGK00

MTAB00

MBL00

GMEY00

ACGU00

SURY00

MPBZ00

SACY00

MFBZ00

MIDZ00

SVLM00

MTAZ00

SAJY00

ADB00

AEX00

ACQ00

EDB00

Location No

5.3 Serviceable Parts

EDB00

ACQ00

AEX00

ADB00

SVLM00 MFBZ00

SACY00

MPBZ00

SURY00

ACGK00

AKAC00

GMEY00

MTAB00

MBL00

GMEY00ACHU00

MIDZ00

MTAZ00

SAJY00

EAU00

MCJA00SBPL00

MCCZ01

GMZZ00

ACGM01

SNMF01

ACKA00

SAFY00

ADCA00

UN270


6. Part Lists

6.1 Main PCB Top No Part No Designator Qty Description Part Site Specification

1 SAFD0150803

PCB Assembly,Main,SMT

Top LGUN270.AUCLRD 1.0 MAIN

2 EDLH0015107 LD6000 1 LED,Chip

99-218UMC/2229397/TR8 WHITE 2.95~3.25 30mA 1200~1600mcd x, y

110mW - R/TP 2P - EVERLIGHT ELECTRONICS CO., LTD.










6 ERHZ0000206 R6040 1 Resistor,Chip MCR01MZP5F10R0 10OHM 1% 1/16W 1005 R/TP - ROHM.




10 MCIZ0008201 ANT1007 1 Contact COMPLEX LG-VN530 VRZ DW:DARK BROWN PRESS, BeCu, , 3.0, 1.5, 1.5,

11 SEVY0003901 VA6000 1 Varistor EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD R/TP

AMOTECH CO., LTD.

12 SEVY0003901 VA6001 1 Varistor EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD R/TP

AMOTECH CO., LTD.

13 SPFY0234001 SPFY02 1 PCB,Main

SPFY0234001 LG-UN270 VRZTG D FR-4 Staggered via STAGGERED-8 0.75 MAIN UNITECH PRINTED

CIRCUIT BOARD CORP.

103

UN270


6.2 Main PCB Bottom No Part No Designa

tor Qty Description Part Site Specification

1 SAFC0152903

PCB Assembly,Main,SMT

Bottom LGUN270.AUCLRD 1.0 MAIN

2 ECCH0000110 C1066 1 Capacitor,Ceramic,Chip MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA CORPORATION









7 ECCH0000112 C1018 1 Capacitor,Ceramic,Chip MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005 R/TP - ROHM Semiconductor KOREA CORPORATION







14 ECCH0000117 C5101 1 Capacitor,Ceramic,Chip CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C

1005 R/TP 0.5 SAMSUNG ELECTRO-MECHANICS CO., LTD.

15 ECCH0000120 C1053 1 Capacitor,Ceramic,Chip MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005 R/TP - ROHM Semiconductor KOREA CORPORATION

16 ECCH0000122 C2205B 1 Capacitor,Ceramic,Chip MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005 R/TP - ROHM Semiconductor KOREA CORPORATION

17 ECCH0000122 C3003 1 Capacitor,Ceramic,Chip MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005 R/TP - ROHM Semiconductor KOREA CORPORATION



104

UN270


20 ECCH0000133 C2116B 1 Capacitor,Ceramic,Chip C1005X7R1H221KT000F 0.22nF 10% 50V X7R

-55TO+125C 1005 R/TP - TDK KOREA COOPERATION

21 ECCH0000143 C1013 1 Capacitor,Ceramic,Chip MCH155CN102KK 1nF 10% 50V X7R -55TO+125C




23 ECCH0000143 C2124B 1 Capacitor,Ceramic,Chip MCH155CN102KK 1nF 10% 50V X7R -55TO+125C








27 ECCH0000149 C2115B 1 Capacitor,Ceramic,Chip MCH155CN332KK 3.3nF 10% 50V X7R -55TO+125C


28 ECCH0000151 C2112B 1 Capacitor,Ceramic,Chip CL05B472KB5NNNC 4.7nF 10% 25V X7R -55TO+125C 1005 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,

LTD.

29 ECCH0000151 C2114B 1 Capacitor,Ceramic,Chip CL05B472KB5NNNC 4.7nF 10% 25V X7R -55TO+125C 1005 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,

LTD.























105

UN270


41 ECCH0000175 C1062 1 Capacitor,Ceramic,Chip GRM1555C1H2R7B 2.7pF 0.1PF 50V NP0 -55TO+125C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

42 ECCH0000182 C2101B 1 Capacitor,Ceramic,Chip GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C 1005 R/TP - MURATA MANUFACTURING CO.,LTD.




















106

UN270













73 ECCH0000183 C1097 1 Capacitor,Ceramic,Chip GRM1555C1H1R8C 1.8pF 0.25PF 50V NP0

-55TO+125C 1005 R/TP - MURATA MANUFACTURING CO.,LTD.

74 ECCH0000183 C1105 1 Capacitor,Ceramic,Chip GRM1555C1H1R8C 1.8pF 0.25PF 50V NP0


75 ECCH0000198 C2117B 1 Capacitor,Ceramic,Chip CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,

LTD.


LTD.


LTD.


LTD.


LTD.


LTD.

81 ECCH0000198 C3015 1 Capacitor,Ceramic,Chip CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,

LTD.


LTD.

107

UN270



LTD.


LTD.


LTD.


LTD.


LTD.


LTD.


LTD.


LTD.


LTD.

92 ECCH0000701 C1102 1 Capacitor,Ceramic,Chip C1005C0G1H1R2CT000F 1.2pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - TDK CORPORATION

93 ECCH0000701 C6011 1 Capacitor,Ceramic,Chip C1005C0G1H1R2CT000F 1.2pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - TDK CORPORATION

94 ECCH0001001 C1065 1 Capacitor,Ceramic,Chip C1005C0G1H6R8CT000F 6.8pF 0.5PF 50V NP0


95 ECCH0002001 C4008 1 Capacitor,Ceramic,Chip C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P

-30TO+85C 1005 R/TP - TDK CORPORATION













102 ECCH0004904 C2106B 1 Capacitor,Ceramic,Chip GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP - MURATA MANUFACTURING CO.,LTD.


108

UN270
















118 ECCH0004904 C4014 1 Capacitor,Ceramic,Chip GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP - MURATA MANUFACTURING CO.,LTD.



121 ECCH0005602 C2169B 1 Capacitor,Ceramic,Chip GRM188R61C225K 2.2uF 10% 16V X5R -55TO+85C 1608 R/TP - MURATA MANUFACTURING CO.,LTD.

122 ECCH0005603 C1000 1 Capacitor,Ceramic,Chip GRM188R61A225K 2.2uF 10% 10V X5R -55TO+85C 1608 R/TP - MURATA MANUFACTURING CO.,LTD.



109

UN270



126 ECCH0005604 C2174B 1 Capacitor,Ceramic,Chip GRM188R60J106M 10000000

pF,6.3V,M,X5R,TC,1608,R/TP,0.8 mm MURATA MANUFACTURING CO.,LTD.

127 ECCH0006201 C2168B 1 Capacitor,Ceramic,Chip C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R -55TO+85C 1608 R/TP - TDK CORPORATION




131 ECCH0007802 C2125B 1 Capacitor,Ceramic,Chip CL10A475KP8NNNC 4.7uF 10% 10V X5R -55TO+85C 1608 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,

LTD.

132 ECCH0007802 C2127B 1 Capacitor,Ceramic,Chip CL10A475KP8NNNC 4.7uF 10% 10V X5R -55TO+85C 1608 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,

LTD.

133 ECCH0007803 C3013 1 Capacitor,Ceramic,Chip CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C 1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS

CO., LTD.

134 ECCH0007803 C5102 1 Capacitor,Ceramic,Chip CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C 1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS

CO., LTD.

135 ECCH0007804 C2131B 1 Capacitor,Ceramic,Chip CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C 1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS

CO., LTD.


CO., LTD.


CO., LTD.


CO., LTD.

139 ECCH0007804 C3000 1 Capacitor,Ceramic,Chip CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C 1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS

CO., LTD.


CO., LTD.


CO., LTD.


CO., LTD.

143 ECCH0017601 C4663 1 Capacitor,Ceramic,Chip CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C 1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS

CO., LTD.

144 ECTH0002703 C3002 1 Capacitor,TA,Conformal TCTAL1A107M8R 0.0001F 20% 10V 50UA

-55TO+125C 0OHM 3.2x1.6x1.1 NONE SMD R/TP ROHM CO.,LTD.

145 ECZH0000802 C1051 1 Capacitor,Ceramic,Chip C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

110

UN270


146 ECZH0000802 C1093 1 Capacitor,Ceramic,Chip C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C


147 ECZH0000813 C1005 1 Capacitor,Ceramic,Chip C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C






































166 ECZH0000816 C2161B 1 Capacitor,Ceramic,Chip C1005C0G1H120JT000F 12pF 5% 50V NP0


111

UN270




168 ECZH0000816 C6018 1 Capacitor,Ceramic,Chip C1005C0G1H120JT000F 12pF 5% 50V NP0


169 ECZH0000822 C1048 1 Capacitor,Ceramic,Chip C1005C0G1H1R5CT000F 1.5pF 0.25PF 50V NP0




















179 ECZH0001002 C1054 1 Capacitor,Ceramic,Chip C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0


180 ECZH0001120 C5006 1 Capacitor,Ceramic,Chip CC1005X7R1H392KT000F 3.9nF 10% 50V X7R


181 ECZH0001121 C5103 1 Capacitor,Ceramic,Chip C1005X7R1H471KT000F 470pF 10% 50V X7R


182 ECZH0001215 C2153B 1 Capacitor,Ceramic,Chip C1005X5R1A105KT000F 1uF 10% 10V X5R


183 ECZH0001215 C2155B 1 Capacitor,Ceramic,Chip C1005X5R1A105KT000F 1uF 10% 10V X5R


184 ECZH0001215 C4013 1 Capacitor,Ceramic,Chip C1005X5R1A105KT000F 1uF 10% 10V X5R








112

UN270






190 ECZH0001420 C3005 1 Capacitor,Ceramic,Chip C1608X5R1A105KT000E 1uF 10% 10V X5R


191 ECZH0001420 C3007 1 Capacitor,Ceramic,Chip C1608X5R1A105KT000E 1uF 10% 10V X5R


192 ECZH0003103 C1067 1 Capacitor,Ceramic,Chip GRM36X7R104K10PT 100nF 10% 10V X7R






195 ECZH0003124 C2113B 1 Capacitor,Ceramic,Chip GRM155R71C683K 68nF 10% 16V X7R -55TO+125C 1005 R/TP - MURATA MANUFACTURING CO.,LTD.

196 ECZH0003125 C2111B 1 Capacitor,Ceramic,Chip GRM155R71C823K 82nF 10% 16V X7R -55TO+125C 1005 R/TP - MURATA MANUFACTURING CO.,LTD.

197 ECZH0003503 C3006 1 Capacitor,Ceramic,Chip GRM188R61E105K 1uF 10% 25V X5R -55TO+85C 1608 R/TP - MURATA MANUFACTURING CO.,LTD.

198 ECZH0003503 C3008 1 Capacitor,Ceramic,Chip GRM188R61E105K 1uF 10% 25V X5R -55TO+85C 1608 R/TP - MURATA MANUFACTURING CO.,LTD.

199 ECZH0004402 C5100 1 Capacitor,Ceramic,Chip CL05F104ZO5NNNC 0.1uF -20TO+80% 16V Y5V

-30TO+85C 1005 R/TP - SAMSUNG ELECTRO-MECHANICS CO., LTD.

200 EDSY0017701 D3001 1 Diode,Switching SDB1040 - - - - - - - - 2P 1 AUK CORP

201 EDTY0008601 ZD3002 1 Diode,TVS PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1

PROTEK DEVICES INC.

202 EDTY0009101 D5100 1 Diode,TVS ESD9X5.0ST5G 5V 6.2 12.3V 8.7A 107W SOD528 R/TP

2P 1 ON SEMICONDUCTOR

203 EDTY0009401 ZD4000 1 Diode,TVS VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70 R/TP 6P

5 ROHM.


5 ROHM.


5 ROHM.


5 ROHM.


5 ROHM.


5 ROHM.


5 ROHM.

210 EDTY0009601 ZD3000 1 Diode,TVS Rclamp0521P.TCT 5V 6 5V 4A 100W - R/TP 2P 1

SEMTECH CORPORATION


SEMTECH CORPORATION

212 ELCH0001035 L1023 1 Inductor,Multilayer,Chip HK1005 4N7S-T 4.7NH 0.3NH - 300mA 0.21OHM 4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDEN

CO.,LTD

113

UN270


213 ELCH0001035 L1028 1 Inductor,Multilayer,Chip HK1005 4N7S-T 4.7NH 0.3NH - 300mA 0.21OHM 4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDEN

CO.,LTD

214 ELCH0001048 L1007 1 Inductor,Multilayer,Chip 1005GC2T10NJLF 10NH 5% - 250mA 0.42OHM 2.5GHZ

8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.

215 ELCH0001054 L1050 1 Inductor,Multilayer,Chip 1005GC2T5N6SLF 5.6NH 0.3NH - 300mA 0.27OHM

3.2GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.




4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.



219 ELCH0001401 L1026 1 Inductor,Multilayer,Chip LL1005-FHL15NJ 15NH 5% - 300mA 0.5OHM 2.8GHZ 9

SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.

220 ELCH0001405 L1012 1 Inductor,Multilayer,Chip LL1005-FHL3N3S 3.3NH 0.3NH - 400mA 0.16OHM

9.1GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.


15GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.





224 ELCH0001417 L1029 1 Inductor,Multilayer,Chip LL1005-FHL33NJ_ 33NH 5% - 200mA 1OHM 2.1GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.

225 ELCH0001425 L5000 1 Inductor,Multilayer,Chip LL1005-FHL82NJ 82NH 5% - 150mA 1.9OHM 1.15GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.




229 ELCH0001430 L1009 1 Inductor,Multilayer,Chip LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM


230 ELCH0001430 L1046 1 Inductor,Multilayer,Chip LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM


231 ELCH0004703 L1000 1 Inductor,Multilayer,Chip 1005GC2T1N0SLF 1NH 0.3NH - 300mA 0.12OHM


114

UN270






234 ELCH0004710 L1010 1 Inductor,Multilayer,Chip 1005GC2T15NJLF 15NH 5% - 250mA 0.53OHM 2GHZ


235 ELCH0004713 L1051 1 Inductor,Multilayer,Chip 1005GC2T6N8JLF 6.8NH 5% - 250mA 0.32OHM 3GHZ










240 ELCP0008004 L2101B 1 Inductor,Wire Wound,Chip

MIP2016D4R7M 4.7UH 30% 0V 900mA 0.16OHM 0HZ 0 SHIELD 2.0X1.6X1.0MM NONE R/TP FDK

CORPORATION.



CORPORATION.

242 ENBY0036801 CN4000 1 Connector,BtoB GB042-60S-H10-E3000 60P 0.40MM STRAIGHT

SOCKET SMD R/TP 1M - LS Mtron Ltd.

243 ENEY0003801 CN5000 1 Connector,I/O 24-8000-002-000-829 2P 1.00MM ANGLE SOCKET TYPE SMD R/TP - KYOCERA ELCO KOREA SALES

CO.,LTD.

244 ENJE0007901 J5100 1 Jack,Phone JAM3333-F30-7F 1P 4P ANGLE R/TP 4mM BLACK 6P -

HON HAI PRECISION INDUSTRY CO.,LTD.

245 ENRY0011401 CN3001 1 Connector,I/O 04-5151-005-103-883 5,0.65

mm,ETC,0.64MM,RECEPTACLE,DIP,R/TP,8.0x5.6x3.0t KYOCERA ELCO KOREA SALES CO.,LTD.

246 ENSY0022202 S4000 1 Socket,Camera CAM-H88(R41-A360A) 80m ohm 9x9x3.95t 24P SMD

R/TP Embo, Contact pin 0.70mm MITSUMI ELECTRIC CO.,LTD.

247 ENSY0023302 S4001 1 Card Socket SCHA5B0501 8,ETC,0.7 mm,15.0x15.0x1.62t,Reverse

ALPS ELECTRIC CO.,LTD.

248 ENWY0008101 SW1001 1 Connector,RF NMS-180 NONE STRAIGHT SOCKET SMD T/REEL AU

50OHM 650mDB NAMAE ELECTRONICS INC



115

UN270


250 ENZY0029301 CN3000 1 Connector,Terminal

Block KQ03LT-4R 4,mm,ETC,VER,P=2.5,H=5.4 HIROSE

KOREA CO.,LTD

251 EQFP0000101 Q5100 1 FET 2SJ347 P-CHANNEL MOSFET -20V -7 -0.05A 40OHM

100mW SSM R/TP 3P TOSHIBA

252 EQFP0008601 Q3000 1 FET NUS5530MN P-CHANNEL MOSFET -20V 20 -3.9A

0.07OHM 1.3W TSOP6 R/TP 8P ON SEMICONDUCTOR

253 ERHY0000105 R2203B 1 Resistor,Chip MCR01MZP5F51R0 51OHM 1% 1/16W 1005 R/TP -

ROHM.

254 ERHY0000128 R5102 1 Resistor,Chip MCR01MZP5F1502 15KOHM 1% 1/16W 1005 R/TP -

ROHM.

255 ERHY0000150 R8001 1 Resistor,Chip RC1005F753CS 75KOHM 1% 1/16W 1005 R/TP -

SAMSUNG ELECTRO-MECHANICS CO., LTD.

256 ERHY0000254 R5001 1 Resistor,Chip MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP -

ROHM.


ROHM.


ROHM.

259 ERHY0000275 R4010 1 Resistor,Chip MCR01MZP5J563 56KOHM 5% 1/16W 1005 R/TP -

ROHM.


ROHM.


ROHM.


ROHM.


ROHM.

264 ERHY0000512 R6017 1 Resistor,Chip RC1608J106CS 10MOHM 5% 1/10W 1608 R/TP -



ROHM.


ROHM.


ROHM.

268 ERHY0003301 R4004 1 Resistor,Chip MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP -

ROHM.


ROHM.

270 ERHZ0000201 R2202B 1 Resistor,Chip MCR01MZP5F1000 100OHM 1% 1/16W 1005 R/TP -

ROHM.

271 ERHZ0000203 R1007 1 Resistor,Chip MCR01MZP5F1002 10KOHM 1% 1/16W 1005 R/TP -

ROHM.

272 ERHZ0000203 R2107B 1 Resistor,Chip MCR01MZP5F1002 10KOHM 1% 1/16W 1005 R/TP -

ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.

278 ERHZ0000205 R5011 1 Resistor,Chip MCR01MZP5F1004 1MOHM 1% 1/16W 1005 R/TP -

ROHM.

116

UN270



ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.

288 ERHZ0000240 R6501 1 Resistor,Chip MCR01MZP5F20R0 20OHM 1% 1/16W 1005 R/TP -

ROHM.


ROHM.

290 ERHZ0000243 R3014 1 Resistor,Chip MCR01MZP5F2201 2.2KOHM 1% 1/16W 1005 R/TP -

ROHM.


ROHM.

292 ERHZ0000263 R1002 1 Resistor,Chip MCR01MZP5F3000 300OHM 1% 1/16W 1005 R/TP -

ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.

117

UN270



ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.

318 ERHZ0000294 R2103B 1 Resistor,Chip MCR01MZP5F5101 5.1KOHM 1% 1/16W 1005 R/TP -

ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.

326 ERHZ0000401 C1003 1 Resistor,Chip MCR01MZSJ000 0OHM 5% 1/16W 1005 R/TP -

ROHM.

327 ERHZ0000402 R2111B 1 Resistor,Chip MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP -

ROHM.

328 ERHZ0000406 R1000 1 Resistor,Chip MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP -

ROHM.


ROHM.

330 ERHZ0000410 R1008 1 Resistor,Chip MCR01MZP5J120 12OHM 5% 1/16W 1005 R/TP -

ROHM.


ROHM.

332 ERHZ0000437 R2201B 1 Resistor,Chip MCR01MZP5J202 2KOHM 5% 1/16W 1005 R/TP -

ROHM.


ROHM.

334 ERHZ0000443 R4002 1 Resistor,Chip MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP -

ROHM.


ROHM.


ROHM.

337 ERHZ0000456 R2109B 1 Resistor,Chip MCR01MZP5J2R2 2.2OHM 5% 1/16W 1005 R/TP -

ROHM.


ROHM.


ROHM.


ROHM.

118

UN270



ROHM.

342 ERHZ0000485 R2108B 1 Resistor,Chip MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP -

ROHM.


ROHM.


ROHM.

345 ERHZ0003901 R3004 1 Resistor,Chip RC2012FR100CS 0.1OHM 1% 1/8W 2012 R/TP -


346 ERHZ0004201 R2112B 1 Resistor,Chip RC1005F1213CS 121KOHM 1% 1/16W 1005 R/TP -


347 ESCY0008301 SW6000 1 Switch,Tact EVQP3M01K 12 V,0.05

A,HORIZONTAL,G,10C2P,12VDC, PANASONIC INDUSTRIAL KOREA CO., LTD







351 EUSY0073401 U6001 1 IC,Inverter TC7SH04FU TC7SH04FU,SSOP5-P-0.65A,5

PIN,R/TP,INVERTER,Pb Free TOSHIBA

352 EUSY0173801 U8000 1 IC,Load Switch AAT4290IJS AAT4290IJS,SC70JW ,8 PIN,R/TP ,5

Individual Load Switch INSPUR LG DIGITAL MOBILE COMMUNICATIONS

353 EUSY0250501 U5101 1 IC,Comparator NCS2200SQ2T2G NCS2200SQ2T2G,SC70,5

PIN,R/TP,Comparator,pin compatible to EUSY0077701 - - SC70 R/TP 5P - ON SEMICONDUCTOR

354 EUSY0254201 U5100 1 IC,Analog Switch NLAS3158MNR2G 1.65~5.5 13SEC 7SEC 0W DFN R/TP


355 EUSY0300008 U6002 1 IC,Bus Controller PP2106M3 1.8/2.6V 1mA - MLF R/TP 28P - G5

CORPORATION

356 EUSY0336202 U2101B 1 IC,Digital Baseband Processor,CDMA

QSC6055-CD ,424,CDMA 1x Onechip BB,AMSS3.3,IC,Digital Baseband Processor CSP R/TP

424P QUALCOMM INCORPORATED.

357 EUSY0347506 U2201B 1 IC,MCP,NAND H8BCS0SI0BAR-46M NAND/2G SDRAM/1G 1.7VTO1.9V

14.0x10.0x1.2 TR 149P - - - HYNIX SEMICONDUCTOR INC.

358 EUSY0365101 U4000 1 IC,LDO Voltage

Regulator RP101K302D RP101K302D,PLP1612-4B,4,R/TP,LDO

RICOH COMPANY, LTD.

359 EUSY0374601 U3000 1 IC,Over Voltage

Protection MAX14528 MAX14528,TDFN,8,R/TP,Programmable

OVP MAXIM INTEGRATED PRODUCTS INC.

360 EUSY0378001 U3001 1 IC,Sub PMIC AAT2862 AAT2862,TQFN34,24,R/TP,3x4x0.8 Advanced Analogic Technologies HK Limited

119

UN270


361 EUSY0403901 IC6501 1 IC,Audio Sub System WM9093ECS/R 1.71~5.5V 0W WLCSP R/TP 20P -

WOLFSON MICROELECTRONICS PLC

362 EUSY0418701 U6000 1 IC,Bluetooth BCM2070B2KUBXG 2.3VTO5.5V 158.4mW 42P -

WLBGA R/TP 42P BROADCOM ASIA DISTRIBUTION PTE LTD

363 EUSY0429101 U5001 1 IC,Resistive Touch Screen Controller

MDR2 uQFN,18,R/TP,Haptic Driver Embedded TSC,IC,A/D Converter - UQFN R/TP 18P -

MTEKVISION CO., LTD.

364 EXSK0005704 X2201B 1 Oscillator,VCTCXO DSA321SCA 19.2mHZ 1.5PPM 2.8V 32.0x25.0x0.9MM

NA SMD R/TP DAISHINKU CORPORATION.

365 EXXY0016002 X6001 1 Crystal SSP-T7-F(12.5PF,+/-20PPM) 32.768mHZ 20PPM

12.5pF NA SMD R/TP SEIKO INSTRUMENTS INC.

366 EXXY0018701 X2101B 1 Crystal FC-135(12.5PF, +-20PPM) 32.768KHZ 20PPM 12.5PF

32*15 SMD R/TP SEIKO EPSON CORP

367 EXXY0024401 X6000 1 Crystal TSX-3225 26MHZ 26MHZ 10PPM 10pF NA SMD R/TP

SEIKO EPSON CORP

368 MBFZ0060301 CN3002 1 Bracket COMPLEX LG-UN270 VRZTG ZZ:Without Color PRESS,

STS, , , , ,

369 MCGY0004401 SC300 1 Clip COMPLEX LG-VN530 VRZ ZZ:Without Color -

370 MCIZ0008201 ANT100

0 1 Contact COMPLEX LG-VN530 VRZ DW:DARK BROWN PRESS,

BeCu, , 3.0, 1.5, 1.5,

371 MCIZ0008201 ANT100

2 1 Contact COMPLEX LG-VN530 VRZ DW:DARK BROWN PRESS,

BeCu, , 3.0, 1.5, 1.5,

372 SAFO0000401 R2106B 1 Wire Pad,Open AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM DNI

373 SAFO0000501 R1010 1 Wire Pad,Open AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM_1005_DNI

374 SAFP0000401 R3016 1 Wire Pad,Short AX3100 ATL SV_SHIPBACK,MAIN,A 375 SAFP0000501 R1009 1 Wire Pad,Short LG-VS760 VRZ 376 SAFP0000501 R1011 1 Wire Pad,Short LG-VS760 VRZ 377 SAFP0000501 R1013 1 Wire Pad,Short LG-VS760 VRZ 378 SAFP0000501 R1015 1 Wire Pad,Short LG-VS760 VRZ 379 SAFP0000501 R1016 1 Wire Pad,Short LG-VS760 VRZ 380 SAFP0000501 R1017 1 Wire Pad,Short LG-VS760 VRZ 381 SAFP0000501 R1018 1 Wire Pad,Short LG-VS760 VRZ 382 SAFP0000501 R1019 1 Wire Pad,Short LG-VS760 VRZ 383 SAFP0000501 R1020 1 Wire Pad,Short LG-VS760 VRZ 384 SAFP0000501 R2113B 1 Wire Pad,Short LG-VS760 VRZ 385 SAFP0000501 R2114B 1 Wire Pad,Short LG-VS760 VRZ 386 SAFP0000501 R2115B 1 Wire Pad,Short LG-VS760 VRZ 387 SAFP0000501 R2116B 1 Wire Pad,Short LG-VS760 VRZ 388 SAFP0000501 R2117B 1 Wire Pad,Short LG-VS760 VRZ 389 SAFP0000501 R2118B 1 Wire Pad,Short LG-VS760 VRZ 390 SAFP0000501 R2119B 1 Wire Pad,Short LG-VS760 VRZ 391 SAFP0000501 R2120B 1 Wire Pad,Short LG-VS760 VRZ 392 SAFP0000501 R2121B 1 Wire Pad,Short LG-VS760 VRZ 393 SAFP0000501 R2122B 1 Wire Pad,Short LG-VS760 VRZ 394 SAFP0000501 R2123B 1 Wire Pad,Short LG-VS760 VRZ 395 SAFP0000501 R3006 1 Wire Pad,Short LG-VS760 VRZ 396 SAFP0000501 R3008 1 Wire Pad,Short LG-VS760 VRZ 397 SAFP0000501 R4007 1 Wire Pad,Short LG-VS760 VRZ 398 SAFP0000501 R4008 1 Wire Pad,Short LG-VS760 VRZ 399 SAFP0000501 R4009 1 Wire Pad,Short LG-VS760 VRZ 400 SAFP0000501 R5005 1 Wire Pad,Short LG-VS760 VRZ 401 SAFP0000501 R5008 1 Wire Pad,Short LG-VS760 VRZ 402 SAFP0000501 R5009 1 Wire Pad,Short LG-VS760 VRZ 403 SAFP0000501 R6013 1 Wire Pad,Short LG-VS760 VRZ

120

UN270


404 SAFP0000501 R6014 1 Wire Pad,Short LG-VS760 VRZ 405 SAFP0000501 R6015 1 Wire Pad,Short LG-VS760 VRZ 406 SAFP0000501 R6019 1 Wire Pad,Short LG-VS760 VRZ 407 SAFP0000501 R6020 1 Wire Pad,Short LG-VS760 VRZ 408 SAFP0000501 R6039 1 Wire Pad,Short LG-VS760 VRZ 409 SAFP0000501 R6044 1 Wire Pad,Short LG-VS760 VRZ

410 SETY0007001 PT4000 1 Thermistor,NTC NCP15WD683J03RC 68KOHM 5% 0V 0A 4.15KK SMD P/TP 1005size MURATA MANUFACTURING CO.,LTD.

411 SEVY0003601 VA3000 1 Varistor ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY



































121

UN270






431 SEVY0003901 VA6005 1 Varistor EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD

R/TP AMOTECH CO., LTD.













438 SEVY0004301 VA3002 1 Varistor ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55 NONE


439 SFBH0006806 FB6000 1 Filter,Bead CIM05J601NC 600 ohm 1.0X0.5X0.5 25% 0.6 ohm

0.3A SMD R/TP 2P 0 SAMSUNG ELECTRO-MECHANICS CO., LTD.

440 SFDY0003001 FL6000 1 Filter,Dielectric DEA202450BT-1275A1 DEA202450BT-1275A1,2450

MHz,2.0*1.25*1.05,SMD,2400M~2500M,IL 1.6,4pin,U-U,50-50,BT BPF TDK CORPORATION

441 SFEY0010501 FL4000 1 Filter,EMI/Power ICVE10184E150R101FR ESD/EMI 0HZ 15pF 0H SMD

R/TP INNOCHIPS TECHNOLOGY











447 SFEY0011401 FL4001 1 Filter,EMI/Power ICVE10184E070R101FR ESD/EMI 0HZ 7.5pF 0H SMD






450 SFEY0015301 FL3000 1 Filter,EMI/Power NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD R/TP

MURATA MANUFACTURING CO.,LTD.

451 SFSB0002201 FL1000 1 Filter,Saw,Dual SAWEP836MFH2F00 836.5MHz, 1880MHz 2.0*1.6*0.6 SMD R/TP 10P MURATA MANUFACTURING CO.,LTD.

122

UN270


452 SFSY0030001 FL1004 1 Filter,Saw SAFEB881MFM0F00 881.5 1.4X1.1X0.6 SMD R/TP 5P


453 SFSY0033404 FL1011 1 Filter,Saw B9444 1575.42MHz 1.4*1.1*0.45 SMD R/TP 5P

EPCOS PTE LTD.

454 SFSY0034601 FL1008 1 Filter,Saw SAFEB1G96FL0F00 1960 1.4*1.1*0.6 SMD R/TP 5P


455 SMPY0023501 U1000 1 IC,Power Amplifier

ACPM-7354-TR1 dBm,%,A,dBc,dB,5.0*3.0*1.05,SMD,DCN+USPCS,CPL,2 MODE,1DCNIN,14CPLOUT,3.2V~4.2V,2,SMD,R/TP,14 AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE.

LIMITED

456 SMZY0021701 U1007 1 Module,GPS ALM-2412 ALM-2412,GPS LNA Module integrated

Filter,3.3x2.1x1.1 AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED

457 SMZY0022401 U1002 1 Module,Assembly ACFM-7107 Duplexer module Quadplexer, DCN/US-PCS

duplexer module AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED

458 SNMF0051501 ANT600

0 1 Antenna,Helical SDBTPTR3015 SINGLE -5DB 50OHM 5 PARTRON

COMPANY LIMITED

123

UN270


6.3 Full BOM List No Part No Designator Qty Description Part Site Specification 1 AGQ86410701 Phone Assembly LGUN270.AUCLZY BK:Black - 2 ACQ85468101 ACQ100400 1 Cover Assembly,EMS LGUN270.AUCLZY ZZ:Without Color - 3 ACGM0172205 ACQ063302 1 Cover Assembly,Rear LGUN270.AUCLRD ZZ:Without Color -

4 MBFZ0060401 MBFZ00 1 Bracket COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

5 MBJZ0046705 MBJZ01 1 Button COMPLEX LGUN270.AUCLRD ZZ:Without Color






8 MCCZ0047705 MCCZ02 1 Cap COMPLEX LGUN270.AUCLRD ZZ:Without Color


9 MCCZ0047805 MCCZ00 1 Cap COMPLEX LGUN270.AUCLRD ZZ:Without Color


10 MCCZ0047901 MBL000003 2 Cap COMPLEX LG-UN270 VRZTG ZZ:Without Color


11 MCJN0130105 MCJN00 1 Cover,Rear COMPLEX LGUN270.AUCLRD ZZ:Without Color


12 MCQ66474101 MCQ074200 1 Damper,Speaker COMPLEX LGUN270.AVRZTG ZZ:Without Color -

13 MCQ66499501 MCQ000004 1 Damper COMPLEX LGUN270.AVRZTG ZZ:Without Color -

14 MDAY0091501 MDAY00 1 Decor COMPLEX LG-UN270 VRZTG ZZ:Without Color MOLD,

ABS MP-211, , , , , 15 MDS63551701 MDS000000 1 Gasket COMPLEX LGUN270.AVRZTG GD:Gold -

16 MFBZ0033401 MFBZ00 1 Filter COMPLEX LG-UN270 VRZTG ZZ:Without Color


17 MHK63287705 MHK000000 1 Sheet COMPLEX LGUN270.AUCLRD ZY:Color Unfixed -

18 MJN67667001 MJN000000 1 Tape COMPLEX LGUN270.AVRZTG ZZ:Without Color -

19 MJN67680401 MJN061101 1 Tape,Protect COMPLEX LGUN270.AVRZTG ZZ:Without Color -




23 MLAN0000604 MEZ062200 1 Label,Qualcomm TR,White,95B

24 MPBZ0338601 MPBZ03 1 Damper COMPLEX LG-UN270 VRZTG ZZ:Without Color






27 MTAA0233601 MTAA00 1 Tape,Decor COMPLEX LG-UN270 VRZTG ZZ:Without Color


28 MTAB0444601 MTAB00 1 Tape,Protect COMPLEX LG-UN270 VRZTG ZZ:Without Color


29 MWAE0067201 MWAE00 1 Window,Camera COMPLEX LG-UN270 VRZTG ZZ:Without Color


30 SNMF0070301 SNMF00 1 Antenna,Helical HIR-02A40-0000AA 3.0,-2.0 dB,DCN/USPCS,SPK

ass'y,DUAL,-2.0,50,3.0 E.M.W CO., LTD.

31 SUSY0028910 SUSY00 1 Speaker,Dual Mode EMS1812TPB6P Nd-Fe-B 700mW 8OHM 91DB 710HZ

1812*3.0T PIN EM-TECH

124

UN270


32 ACQ85467701 ACQ072500 1 Cover Assembly,Slide LGUN270.AUCLZY BL:Blue -

33 ACGK0174405 ACQ032700 1 Cover Assembly,Front

LGUN270.AUCLRD ZZ:Without Color -

34 MCJK0137905 MCJK00 1 Cover,Front COMPLEX LGUN270.AUCLRD ZZ:Without Color


35 MICE0016902 MICE00 6 Insert,Nut COMPLEX MECH_COMMON ZZ:Without Color -

36 MPBZ0338201 MCQ000000 1 Damper COMPLEX LG-UN270 VRZTG ZZ:Without Color




38 MTAZ0372101 MTAZ00 1 Tape COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , , 39 RAB32795201 RAB150000 1 Magnet,Switch ND 12.2TO12.6 -

40 ACGU0007505 ACQ046001 1 Cover Assembly,Lower


41 MCK66701001 MCJY00 1 Cover,Lower COMPLEX LGUN270.AUCLZY BK:Black - 42 AHFY0004505 AEH000000 1 Hinge Assembly LGUN270.AUCLRD ZZ:Without Color - 43 MJN67696801 MJN061100 1 Tape,Protect COMPLEX LGUN270.AVRZTG BK:Black -

44 MPBU0114201 MCQ015700 1 Damper,Connector COMPLEX LG-UN270 VRZTG ZZ:Without Color







COMPLEX,(empty),

48 ACQ85443501 ACQ084401 1 Cover Assembly,Upper

LGUN270.AUCLZY BK:Black -

49 MCK66677801 MCK084400 1 Cover,Upper COMPLEX LGUN270.AUCLZY BK:Black -

50 MDQ62899401 MDQ000000 1 Frame COMPLEX LGUN270.AUCLZY ZZ:Without Color UPPER

COVER FRAME

51 MICE0016901 MET099500 1 Insert,Nut COMPLEX MECH_COMMON ZZ:Without Color -

52 MCQ66704501 MCQ000000 1 Damper COMPLEX LGUN270.AUCLZY ZZ:Without Color PAD

FPCB SENSOR

53 MCR64412501 MCR000000 1 Decor COMPLEX LGUN270.AUCLZY BK:Black (UPPER COVER

DECO L)

54 MCR64412601 MCR000001 1 Decor COMPLEX LGUN270.AUCLZY BK:Black (UPPER COVER

DECO R)

55 MFBZ0028701 MDJ000000 1 Filter COMPLEX LG-UN270 VRZTG ZZ:Without Color


56 MJN67757101 MJN089300 1 Tape,Window COMPLEX LGUN270.AUCLZY ZZ:Without Color

WINDOW TAPE BIG

57 MJN67757201 MJN089301 1 Tape,Window COMPLEX LGUN270.AUCLZY ZZ:Without Color

(WINDOW TAPE SMALL)

58 MJN67906001 MJN020802 1 Tape,Decor COMPLEX LGUN270.AUCLRD ZZ:Without Color cover

upper deco L, R

59 AEX73718501 AEX076900 1 Keypad Assembly,Sub

LGUN270.AUCLZY ZZ:Without Color -

60 AKAC0020605 AEX046800 1 Keypad Assembly,Main


61 EBD61045501 EBD030100 1 Touch Window

Assembly RESISTIVE TOUCH FFP None 2.8 B to B connector

type -

62 GMEY0010601 FAB010001 4 Screw,Machine GMEY0010601 BH + 1.4mM 2.5mM MSWR FZB N -

KUMGANG SCREW CO., LTD

63 GMEY0018101 FAB010000 4 Screw,Machine GMEY0018101 FH + 1.4mM 1.5mM SWCH FZB N -

KUMGANG SCREW CO., LTD

64 MBL64922405 MBL067400 2 Cap,Screw COMPLEX LGUN270.AUCLRD ZZ:Without Color -

65 MCQ66825401 MCQ000001 1 Damper COMPLEX LGUN270.AUCLRD ZZ:Without Color MIC

PAD COVER UPPER

66 MEV63951301 MEV000001 1 Insulator COMPLEX LGUN270T.AVRZTGH BL:Blue LCD BOTTOM

INSULATOR

125

UN270


67 MFBZ0028805 MDJ000001 1 Filter COMPLEX LGUN270.AUCLRD ZZ:Without Color


68 MIDZ0280101 MEV000000 1 Insulator COMPLEX LG-UN270 VRZTG ZZ:Without Color


69 MJN67680506 MJN061102 1 Tape,Protect COMPLEX LGUN270.AUCLRD ZZ:Without Color -

70 MJN67757301 MJN089300 1 Tape,Window COMPLEX LGUN270.AUCLZY ZZ:Without Color TAPE

PROTECTION WINDOW



72 MTAB0433301 MJN061101 1 Tape,Protect COMPLEX LG-UN270 VRZTG ZZ:Without Color


73 MTAZ0373801 MJN000000 1 Tape COMPLEX LG-UN270 VRZTG ZZ:Without Color


74 SACY0118004 EBR070501 1 PCB Assembly,Flexible

LGUN270.AUCLRD 1.0 FLEXIBLE

75 SACB0065801 SACB00 1 PCB

Assembly,Flexible,Insert

LG-UN270 VRZTG A FLEXIBLE

76 SACE0105804 SACE01 1 PCB

Assembly,Flexible,SMT


77 EAX64118401 SPCY02 1 PCB,Flexible LGUN270.AUCLRD 1.0 POLYI Double 2 0.11 Flexible

78 SACC0079604 SACC00 1 PCB

Assembly,Flexible,SMT Bottom


79 ECCH0002001 C106 1 Capacitor,Ceramic,C

hip C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P





81 ENBY0052001 CN102 1 Connector,BtoB 24-5804-010-000-829+ 10P 0.40MM STRAIGHT

FEMALE SMD R/TP 900mM - KYOCERA ELCO KOREA SALES CO.,LTD.

82 EUSY0362601 U101 1 IC,Hall Effect Switch BU52031NVX SSON004,4,R/TP,Hall

IC,IC,CMOSIC,CMOS - SSON R/TP 4P - ROHM.





85 SEVY0005202 VA100 1 Varistor EVLC5S02100 5.5V 0% 100F 1.0*0.5*0.6 UL SMD








89 SACD0093304 SACD00 1 PCB

Assembly,Flexible,SMT Top


90 ENBY0036701 CN100 1 Connector,BtoB GB042-60P-H10-E3000 60P 0.40MM STRAIGHT PLUG

SMD R/TP 1M - LS Mtron Ltd.

91 ENBY0040401 CN101 1 Connector,BtoB GB042-50P-H10-E3000 50P 0.4MM STRAIGHT PLUG


92 SAJY0051403 EBR072901 1 PCB Assembly,Sub LGUN270.AUCLRD 1.0 SUB

93 SAJB0024003 SAJB00 1 PCB Assembly,Sub,Insert

LGUN270.AUCLRD 1.0 SUB

94 ADB73619101 ADB048601 1 Dome

Assembly,Metal LGUN270.AUCLZY ZZ:Without Color SUB PCB DOME

ASS'Y

126

UN270


95 SUMY0003816 SUMY00 1 Microphone,Condens

er OBM-410L44-RC1882 -44DB 2.2KOHM OMNI 1TO10V

4x1.0t FPCB BSE CO., LTD.

96 SAJE0041903 SAJE00 1 PCB Assembly,Sub,SMT


97 EAX64141001 SPEY00 1 PCB,Keypad LGUN270.AUCLRD 1.0 FR-4 SBL 4 0.6 Keypad

98 SAJC0040704 SAJC00 1 PCB

Assembly,Sub,SMT Bottom


99 ECZH0000813 C105 1 Capacitor,Ceramic,C

hip C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C



hip

C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C 1005 R/TP - TDK KOREA

COOPERATION


hip


COOPERATION


hip


COOPERATION


hip


COOPERATION

104 ELCH0001425 L100 1 Inductor,Multilayer,C

hip LL1005-FHL82NJ 82NH 5% - 150mA 1.9OHM 1.15GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.

105 ENBY0040501 CN100 1 Connector,BtoB GB042-50S-H10-E3000 50P 0.4MM STRAIGHT SOCKET


106 ENQY0014301 CN101 1 Connector,FFC/FPC/PIC

04-6293-637-005-829+ 37P 0.30MM FFC/FPC STRAIGHT BOTH SMD R/TP LOCKING - KYOCERA

ELCO KOREA SALES CO.,LTD.

107 EQBN0019901 Q100 1 TR,Bipolar 2PC4617R NPN 7V 60V 50V 150mA 100NA 390 150mW SC75 R/TP 3P NXP Semiconductors


ROHM. 109 SAFP0000501 R104 1 Wire Pad,Short LG-VS760 VRZ

110 SEVY0003601 VA100 1 Varistor ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY



112 SAJD0043403 SAJD00 1 PCB

Assembly,Sub,SMT Top


113 EDLH0012504 LD100 1 LED,Chip TWH104-HS WHITE 2.7~3.1 20mA 100~220mcd

X(0.226~0.321)Y(0.22~0.31) 66mW 1005 R/TP 2P - SEOUL SEMICONDUCTOR CO.,LTD





127

UN270



ROHM.


ROHM.


ROHM.

119 SURY0010122 EAB010400 1 Receiver EMR1207SPT3P FPCB,103 dB,32

ohm,1207,2.7T,HAC,FPC, EM-TECH

120 SVLM0039902 EAJ020200 1 LCD,Module-TFT LM275PN2A WQVGA 2.8INCH 240X400 500CD COLOR 70% 15/9 500:1 60Hz Inverter N UN270 2.8" WQVGA

TOVIS TOVIS

121 GMZZ0017701 FAB010000 8 Screw,Machine GMZZ0017701 BH + 1.4mM 3mM MSWR NI PLT N -

ASIA BOLT

122 SAFY0383104 EBR071900 1 PCB Assembly,Main LGUN270.AUCLRD 1.0 MAIN

123 SAFB0120303 SAFB01 1 PCB

Assembly,Main,Insert

LGUN270.AUCLRD 1.0 MAIN

124 ACKA0034701 ACKA00 1 Can Assembly,Shield LG-UN270 VRZTG ZZ:Without Color -

125 MLAB0004801 MEZ000900 1 Label,After Service COMPLEX LG-LB3300 LGT ZZ:Without Color -

126 MTAZ0373901 MTAZ00 1 Tape COMPLEX LG-UN270 VRZTG ZZ:Without Color


127 ADCA0120605 ADB048601 1 Dome Assembly,Metal


128 BRAH0001301 RRAH00 0.00015

0601-FU CP,niseR

129 BRAH0002601 RAA050101 0.0003 Resin

UNIQUE4000HFW ; , , , ,[empty] , , ,[empty] SERVEONE CO., LTD.

130 EAU61425901 EAU614 1 Motor,DC MVMU-A362G 2V 90mA 0A 0RPM 0RPM 60mSEC

0GF.CM 26OHM LG INNOTEK CO., LTD

131 SNMF0070401 SNMF00 1 Antenna,Helical HIR-02A41-0000AA 3.0,-2.0

dB,DCN_Rx/GPS/PCS_Rx,Carrier,TRIPLE,-2.0,50,3.0 E.M.W CO., LTD.

132 SVCY0028001 SVCY00 1 Camera Module CW1333-ABDBS CMOS,MEGA,hynix 1/6",Socket type,7x7x4.1t COWELL ELECTRONICS CO.,LTD

133 SAFF0285104 SAFF02 1 PCB Assembly,Main,SMT


134 MLAZ0038301 MEZ000000 1 Label COMPLEX LG-VX6000 ZZ:Without Color PID Label 4

Array PRINTING, 135 SAD32888401 SAD010000 1 Software,Mobile Base UN270ZV2 - NORTH AMERICA QCT -

136 SAFC0152903 SAFC01 1 PCB

Assembly,Main,SMT Bottom



hip

MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C 1005 R/TP - ROHM Semiconductor KOREA

CORPORATION


hip


CORPORATION


hip


CORPORATION


hip


CORPORATION


hip


CORPORATION


hip MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005 R/TP - ROHM Semiconductor KOREA CORPORATION

128

UN270















hip

CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C 1005 R/TP 0.5 SAMSUNG ELECTRO-MECHANICS CO.,

LTD.


hip MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005 R/TP - ROHM Semiconductor KOREA CORPORATION

151 ECCH0000122 C2205B 1 Capacitor,Ceramic,C

hip MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005 R/TP - ROHM Semiconductor KOREA CORPORATION


hip MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005 R/TP - ROHM Semiconductor KOREA CORPORATION






hip

C1005X7R1H221KT000F 0.22nF 10% 50V X7R -55TO+125C 1005 R/TP - TDK KOREA

COOPERATION


hip

MCH155CN102KK 1nF 10% 50V X7R -55TO+125C 1005 R/TP - ROHM Semiconductor KOREA

CORPORATION


hip


CORPORATION


hip


CORPORATION


hip


CORPORATION


hip


CORPORATION


hip


CORPORATION


hip

MCH155CN332KK 3.3nF 10% 50V X7R -55TO+125C 1005 R/TP - ROHM Semiconductor KOREA

CORPORATION


hip

CL05B472KB5NNNC 4.7nF 10% 25V X7R -55TO+125C 1005 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,

LTD.

129

UN270



hip

CL05B472KB5NNNC 4.7nF 10% 25V X7R -55TO+125C 1005 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,

LTD.


hip


CORPORATION


hip


CORPORATION


hip


CORPORATION


hip


CORPORATION


hip


CORPORATION


hip


CORPORATION


hip


CORPORATION


hip


CORPORATION


hip


CORPORATION


hip


CORPORATION


hip


CORPORATION


hip GRM1555C1H2R7B 2.7pF 0.1PF 50V NP0 -55TO+125C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.


hip GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C 1005 R/TP - MURATA MANUFACTURING CO.,LTD.















130

UN270












































131

UN270







hip

GRM1555C1H1R8C 1.8pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - MURATA

MANUFACTURING CO.,LTD.


hip

GRM1555C1H1R8C 1.8pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - MURATA



hip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,

LTD.


hip


LTD.


hip


LTD.


hip


LTD.


hip


LTD.


hip


LTD.


hip


LTD.


hip


LTD.


hip


LTD.


hip


LTD.


hip


LTD.


hip


LTD.


hip


LTD.


hip


LTD.


hip


LTD.


hip


LTD.


hip


LTD.

132

UN270



hip C1005C0G1H1R2CT000F 1.2pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - TDK CORPORATION


hip C1005C0G1H1R2CT000F 1.2pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - TDK CORPORATION


hip

C1005C0G1H6R8CT000F 6.8pF 0.5PF 50V NP0 -55TO+125C 1005 R/TP - TDK KOREA

COOPERATION























hip GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP - MURATA MANUFACTURING CO.,LTD.





















133

UN270



















hip GRM188R61C225K 2.2uF 10% 16V X5R -55TO+85C 1608 R/TP - MURATA MANUFACTURING CO.,LTD.










hip

GRM188R60J106M 10000000 pF,6.3V,M,X5R,TC,1608,R/TP,0.8 mm MURATA



hip C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R -55TO+85C 1608 R/TP - TDK CORPORATION








hip

CL10A475KP8NNNC 4.7uF 10% 10V X5R -55TO+85C 1608 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,

LTD.


hip

CL10A475KP8NNNC 4.7uF 10% 10V X5R -55TO+85C 1608 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,

LTD.


hip

CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C 1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS

CO., LTD.

134

UN270



hip

CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C 1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS

CO., LTD.


hip

CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C 1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS

CO., LTD.


hip


CO., LTD.


hip


CO., LTD.


hip


CO., LTD.


hip


CO., LTD.


hip


CO., LTD.


hip


CO., LTD.


hip


CO., LTD.


hip

CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C 1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS

CO., LTD.

279 ECTH0002703 C3002 1 Capacitor,TA,Confor

mal

TCTAL1A107M8R 0.0001F 20% 10V 50UA -55TO+125C 0OHM 3.2x1.6x1.1 NONE SMD R/TP

ROHM CO.,LTD.


hip C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C



hip C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C


























135

UN270



































301 ECZH0000816 C2161B 1 Capacitor,Ceramic,C

hip


COOPERATION


hip


COOPERATION


hip


COOPERATION


hip

C1005C0G1H1R5CT000F 1.5pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - TDK KOREA

COOPERATION








hip


COOPERATION


hip


COOPERATION


hip


COOPERATION


hip


COOPERATION

136

UN270



hip


COOPERATION


hip


COOPERATION


hip


COOPERATION


hip

C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -55TO+125C 1005 R/TP - TDK KOREA

COOPERATION


hip

CC1005X7R1H392KT000F 3.9nF 10% 50V X7R -55TO+125C 1005 R/TP - TDK KOREA

COOPERATION


hip

C1005X7R1H471KT000F 470pF 10% 50V X7R -55TO+125C 1005 R/TP - TDK KOREA

COOPERATION


hip C1005X5R1A105KT000F 1uF 10% 10V X5R
























hip C1608X5R1A105KT000E 1uF 10% 10V X5R



hip C1608X5R1A105KT000E 1uF 10% 10V X5R



hip

GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C 1005 R/TP - MURATA



hip




hip




hip GRM155R71C683K 68nF 10% 16V X7R -55TO+125C 1005 R/TP - MURATA MANUFACTURING CO.,LTD.


hip GRM155R71C823K 82nF 10% 16V X7R -55TO+125C 1005 R/TP - MURATA MANUFACTURING CO.,LTD.

137

UN270



hip GRM188R61E105K 1uF 10% 25V X5R -55TO+85C 1608 R/TP - MURATA MANUFACTURING CO.,LTD.


hip GRM188R61E105K 1uF 10% 25V X5R -55TO+85C 1608 R/TP - MURATA MANUFACTURING CO.,LTD.

334 ECZH0004402 C5100 1 Capacitor,Ceramic,Chip

CL05F104ZO5NNNC 0.1uF -20TO+80% 16V Y5V -30TO+85C 1005 R/TP - SAMSUNG

ELECTRO-MECHANICS CO., LTD.

335 EDSY0017701 D3001 1 Diode,Switching SDB1040 - - - - - - - - 2P 1 AUK CORP

336 EDTY0008601 ZD3002 1 Diode,TVS PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1

PROTEK DEVICES INC.

337 EDTY0009101 D5100 1 Diode,TVS ESD9X5.0ST5G 5V 6.2 12.3V 8.7A 107W SOD528 R/TP



5 ROHM.


5 ROHM.


5 ROHM.


5 ROHM.


5 ROHM.


5 ROHM.


5 ROHM.


SEMTECH CORPORATION


SEMTECH CORPORATION

347 ELCH0001035 L1023 1 Inductor,Multilayer,Chip

HK1005 4N7S-T 4.7NH 0.3NH - 300mA 0.21OHM 4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO

YUDEN CO.,LTD


HK1005 4N7S-T 4.7NH 0.3NH - 300mA 0.21OHM 4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO

YUDEN CO.,LTD


1005GC2T10NJLF 10NH 5% - 250mA 0.42OHM 2.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP

PILKOR ELECTRONICS LTD.


1005GC2T5N6SLF 5.6NH 0.3NH - 300mA 0.27OHM 3.2GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP






1005GC2T3N9SLF 3.9NH 0.3NH - 300mA 0.22OHM 4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR

ELECTRONICS LTD.



ELECTRONICS LTD.



138

UN270



hip

LL1005-FHL3N3S 3.3NH 0.3NH - 400mA 0.16OHM 9.1GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,

INC.


hip

LL1005-FHL1N8S 1.8NH 0.3NH - 400mA 0.14OHM 15GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,

INC.


hip


INC.


hip


INC.


hip LL1005-FHL33NJ_ 33NH 5% - 200mA 1OHM 2.1GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.










hip

LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM 1.03GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP

TOKO, INC.


hip

LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM 1.03GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP

TOKO, INC.


1005GC2T1N0SLF 1NH 0.3NH - 300mA 0.12OHM 10GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP









1005GC2T15NJLF 15NH 5% - 250mA 0.53OHM 2GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR

ELECTRONICS LTD.


1005GC2T6N8JLF 6.8NH 5% - 250mA 0.32OHM 3GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR

ELECTRONICS LTD.



ELECTRONICS LTD.



ELECTRONICS LTD.

139

UN270




ELECTRONICS LTD.



ELECTRONICS LTD.



CORPORATION.



CORPORATION.

377 ENBY0036801 CN4000 1 Connector,BtoB GB042-60S-H10-E3000 60P 0.40MM STRAIGHT

SOCKET SMD R/TP 1M - LS Mtron Ltd.

378 ENEY0003801 CN5000 1 Connector,I/O 24-8000-002-000-829 2P 1.00MM ANGLE SOCKET TYPE SMD R/TP - KYOCERA ELCO KOREA SALES

CO.,LTD.

379 ENJE0007901 J5100 1 Jack,Phone JAM3333-F30-7F 1P 4P ANGLE R/TP 4mM BLACK 6P -

HON HAI PRECISION INDUSTRY CO.,LTD.

380 ENRY0011401 CN3001 1 Connector,I/O 04-5151-005-103-883 5,0.65

mm,ETC,0.64MM,RECEPTACLE,DIP,R/TP,8.0x5.6x3.0t KYOCERA ELCO KOREA SALES CO.,LTD.

381 ENSY0022202 S4000 1 Socket,Camera CAM-H88(R41-A360A) 80m ohm 9x9x3.95t 24P SMD

R/TP Embo, Contact pin 0.70mm MITSUMI ELECTRIC CO.,LTD.

382 ENSY0023302 S4001 1 Card Socket SCHA5B0501 8,ETC,0.7 mm,15.0x15.0x1.62t,Reverse

ALPS ELECTRIC CO.,LTD.





385 ENZY0029301 CN3000 1 Connector,Terminal

Block KQ03LT-4R 4,mm,ETC,VER,P=2.5,H=5.4 HIROSE

KOREA CO.,LTD

386 EQFP0000101 Q5100 1 FET 2SJ347 P-CHANNEL MOSFET -20V -7 -0.05A 40OHM

100mW SSM R/TP 3P TOSHIBA

387 EQFP0008601 Q3000 1 FET NUS5530MN P-CHANNEL MOSFET -20V 20 -3.9A

0.07OHM 1.3W TSOP6 R/TP 8P ON SEMICONDUCTOR

388 ERHY0000105 R2203B 1 Resistor,Chip MCR01MZP5F51R0 51OHM 1% 1/16W 1005 R/TP -

ROHM.


ROHM.

390 ERHY0000150 R8001 1 Resistor,Chip RC1005F753CS 75KOHM 1% 1/16W 1005 R/TP -



ROHM.


ROHM.


ROHM.


ROHM.


ROHM.

140

UN270



ROHM.


ROHM.


ROHM.

399 ERHY0000512 R6017 1 Resistor,Chip RC1608J106CS 10MOHM 5% 1/10W 1608 R/TP -



ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.

141

UN270



ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.

142

UN270



ROHM.


ROHM.


ROHM.

461 ERHZ0000401 C1003 1 Resistor,Chip MCR01MZSJ000 0OHM 5% 1/16W 1005 R/TP -

ROHM.

462 ERHZ0000402 R2111B 1 Resistor,Chip MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP -

ROHM.


ROHM.


ROHM.


ROHM.


ROHM.

467 ERHZ0000437 R2201B 1 Resistor,Chip MCR01MZP5J202 2KOHM 5% 1/16W 1005 R/TP -

ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.


ROHM.

477 ERHZ0000485 R2108B 1 Resistor,Chip MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP -

ROHM.


ROHM.


ROHM.

480 ERHZ0003901 R3004 1 Resistor,Chip RC2012FR100CS 0.1OHM 1% 1/8W 2012 R/TP -


481 ERHZ0004201 R2112B 1 Resistor,Chip RC1005F1213CS 121KOHM 1% 1/16W 1005 R/TP -








143

UN270




486 EUSY0073401 U6001 1 IC,Inverter TC7SH04FU TC7SH04FU,SSOP5-P-0.65A,5

PIN,R/TP,INVERTER,Pb Free TOSHIBA

487 EUSY0173801 U8000 1 IC,Load Switch AAT4290IJS AAT4290IJS,SC70JW ,8 PIN,R/TP ,5

Individual Load Switch INSPUR LG DIGITAL MOBILE COMMUNICATIONS

488 EUSY0250501 U5101 1 IC,Comparator NCS2200SQ2T2G NCS2200SQ2T2G,SC70,5

PIN,R/TP,Comparator,pin compatible to EUSY0077701 - - SC70 R/TP 5P - ON SEMICONDUCTOR

489 EUSY0254201 U5100 1 IC,Analog Switch NLAS3158MNR2G 1.65~5.5 13SEC 7SEC 0W DFN

R/TP 6P 1 ON SEMICONDUCTOR

490 EUSY0300008 U6002 1 IC,Bus Controller PP2106M3 1.8/2.6V 1mA - MLF R/TP 28P - G5

CORPORATION

491 EUSY0336202 U2101B 1 IC,Digital Baseband Processor,CDMA

QSC6055-CD ,424,CDMA 1x Onechip BB,AMSS3.3,IC,Digital Baseband Processor CSP R/TP

424P QUALCOMM INCORPORATED.

492 EUSY0347506 U2201B 1 IC,MCP,NAND H8BCS0SI0BAR-46M NAND/2G SDRAM/1G 1.7VTO1.9V

14.0x10.0x1.2 TR 149P - - - HYNIX SEMICONDUCTOR INC.

493 EUSY0365101 U4000 1 IC,LDO Voltage

Regulator RP101K302D RP101K302D,PLP1612-4B,4,R/TP,LDO

RICOH COMPANY, LTD.

494 EUSY0374601 U3000 1 IC,Over Voltage

Protection MAX14528 MAX14528,TDFN,8,R/TP,Programmable

OVP MAXIM INTEGRATED PRODUCTS INC.

495 EUSY0378001 U3001 1 IC,Sub PMIC AAT2862 AAT2862,TQFN34,24,R/TP,3x4x0.8 Advanced Analogic Technologies HK Limited

496 EUSY0403901 IC6501 1 IC,Audio Sub System WM9093ECS/R 1.71~5.5V 0W WLCSP R/TP 20P -

WOLFSON MICROELECTRONICS PLC

497 EUSY0418701 U6000 1 IC,Bluetooth BCM2070B2KUBXG 2.3VTO5.5V 158.4mW 42P -

WLBGA R/TP 42P BROADCOM ASIA DISTRIBUTION PTE LTD

498 EUSY0429101 U5001 1 IC,Resistive Touch Screen Controller

MDR2 uQFN,18,R/TP,Haptic Driver Embedded TSC,IC,A/D Converter - UQFN R/TP 18P -

MTEKVISION CO., LTD.

499 EXSK0005704 X2201B 1 Oscillator,VCTCXO DSA321SCA 19.2mHZ 1.5PPM 2.8V 32.0x25.0x0.9MM

NA SMD R/TP DAISHINKU CORPORATION.

500 EXXY0016002 X6001 1 Crystal SSP-T7-F(12.5PF,+/-20PPM) 32.768mHZ 20PPM

12.5pF NA SMD R/TP SEIKO INSTRUMENTS INC.

501 EXXY0018701 X2101B 1 Crystal FC-135(12.5PF, +-20PPM) 32.768KHZ 20PPM 12.5PF

32*15 SMD R/TP SEIKO EPSON CORP

502 EXXY0024401 X6000 1 Crystal TSX-3225 26MHZ 26MHZ 10PPM 10pF NA SMD R/TP

SEIKO EPSON CORP

503 MBFZ0060301 CN3002 1 Bracket COMPLEX LG-UN270 VRZTG ZZ:Without Color PRESS,

STS, , , , ,

504 MCGY0004401 SC300 1 Clip COMPLEX LG-VN530 VRZ ZZ:Without Color -

505 MCIZ0008201 ANT1000 1 Contact COMPLEX LG-VN530 VRZ DW:DARK BROWN PRESS,

BeCu, , 3.0, 1.5, 1.5,


BeCu, , 3.0, 1.5, 1.5,

144

UN270


507 SAFO0000401 R2106B 1 Wire Pad,Open AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM DNI

508 SAFO0000501 R1010 1 Wire Pad,Open AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM_1005_DNI

509 SAFP0000401 R3016 1 Wire Pad,Short AX3100 ATL SV_SHIPBACK,MAIN,A 510 SAFP0000501 R1009 1 Wire Pad,Short LG-VS760 VRZ 511 SAFP0000501 R1011 1 Wire Pad,Short LG-VS760 VRZ 512 SAFP0000501 R1013 1 Wire Pad,Short LG-VS760 VRZ 513 SAFP0000501 R1015 1 Wire Pad,Short LG-VS760 VRZ 514 SAFP0000501 R1016 1 Wire Pad,Short LG-VS760 VRZ 515 SAFP0000501 R1017 1 Wire Pad,Short LG-VS760 VRZ 516 SAFP0000501 R1018 1 Wire Pad,Short LG-VS760 VRZ 517 SAFP0000501 R1019 1 Wire Pad,Short LG-VS760 VRZ 518 SAFP0000501 R1020 1 Wire Pad,Short LG-VS760 VRZ 519 SAFP0000501 R2113B 1 Wire Pad,Short LG-VS760 VRZ 520 SAFP0000501 R2114B 1 Wire Pad,Short LG-VS760 VRZ 521 SAFP0000501 R2115B 1 Wire Pad,Short LG-VS760 VRZ 522 SAFP0000501 R2116B 1 Wire Pad,Short LG-VS760 VRZ 523 SAFP0000501 R2117B 1 Wire Pad,Short LG-VS760 VRZ 524 SAFP0000501 R2118B 1 Wire Pad,Short LG-VS760 VRZ 525 SAFP0000501 R2119B 1 Wire Pad,Short LG-VS760 VRZ 526 SAFP0000501 R2120B 1 Wire Pad,Short LG-VS760 VRZ 527 SAFP0000501 R2121B 1 Wire Pad,Short LG-VS760 VRZ 528 SAFP0000501 R2122B 1 Wire Pad,Short LG-VS760 VRZ 529 SAFP0000501 R2123B 1 Wire Pad,Short LG-VS760 VRZ 530 SAFP0000501 R3006 1 Wire Pad,Short LG-VS760 VRZ 531 SAFP0000501 R3008 1 Wire Pad,Short LG-VS760 VRZ 532 SAFP0000501 R4007 1 Wire Pad,Short LG-VS760 VRZ 533 SAFP0000501 R4008 1 Wire Pad,Short LG-VS760 VRZ 534 SAFP0000501 R4009 1 Wire Pad,Short LG-VS760 VRZ 535 SAFP0000501 R5005 1 Wire Pad,Short LG-VS760 VRZ 536 SAFP0000501 R5008 1 Wire Pad,Short LG-VS760 VRZ 537 SAFP0000501 R5009 1 Wire Pad,Short LG-VS760 VRZ 538 SAFP0000501 R6013 1 Wire Pad,Short LG-VS760 VRZ 539 SAFP0000501 R6014 1 Wire Pad,Short LG-VS760 VRZ 540 SAFP0000501 R6015 1 Wire Pad,Short LG-VS760 VRZ 541 SAFP0000501 R6019 1 Wire Pad,Short LG-VS760 VRZ 542 SAFP0000501 R6020 1 Wire Pad,Short LG-VS760 VRZ 543 SAFP0000501 R6039 1 Wire Pad,Short LG-VS760 VRZ 544 SAFP0000501 R6044 1 Wire Pad,Short LG-VS760 VRZ

545 SETY0007001 PT4000 1 Thermistor,NTC NCP15WD683J03RC 68KOHM 5% 0V 0A 4.15KK SMD P/TP 1005size MURATA MANUFACTURING CO.,LTD.













145

UN270












































573 SEVY0004301 VA3002 1 Varistor ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55 NONE


574 SFBH0006806 FB6000 1 Filter,Bead CIM05J601NC 600 ohm 1.0X0.5X0.5 25% 0.6 ohm

0.3A SMD R/TP 2P 0 SAMSUNG ELECTRO-MECHANICS CO., LTD.

146

UN270


575 SFDY0003001 FL6000 1 Filter,Dielectric DEA202450BT-1275A1 DEA202450BT-1275A1,2450

MHz,2.0*1.25*1.05,SMD,2400M~2500M,IL 1.6,4pin,U-U,50-50,BT BPF TDK CORPORATION



















585 SFEY0015301 FL3000 1 Filter,EMI/Power NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD R/TP


586 SFSB0002201 FL1000 1 Filter,Saw,Dual SAWEP836MFH2F00 836.5MHz, 1880MHz 2.0*1.6*0.6 SMD R/TP 10P MURATA MANUFACTURING CO.,LTD.

587 SFSY0030001 FL1004 1 Filter,Saw SAFEB881MFM0F00 881.5 1.4X1.1X0.6 SMD R/TP 5P


588 SFSY0033404 FL1011 1 Filter,Saw B9444 1575.42MHz 1.4*1.1*0.45 SMD R/TP 5P

EPCOS PTE LTD.

589 SFSY0034601 FL1008 1 Filter,Saw SAFEB1G96FL0F00 1960 1.4*1.1*0.6 SMD R/TP 5P


590 SMPY0023501 U1000 1 IC,Power Amplifier

ACPM-7354-TR1 dBm,%,A,dBc,dB,5.0*3.0*1.05,SMD,DCN+USPCS,CPL,

2 MODE,1DCNIN,14CPLOUT,3.2V~4.2V,2,SMD,R/TP,14 AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE.

LIMITED

591 SMZY0021701 U1007 1 Module,GPS ALM-2412 ALM-2412,GPS LNA Module integrated

Filter,3.3x2.1x1.1 AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED

592 SMZY0022401 U1002 1 Module,Assembly ACFM-7107 Duplexer module Quadplexer, DCN/US-PCS

duplexer module AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED

593 SNMF0051501 ANT6000 1 Antenna,Helical SDBTPTR3015 SINGLE -5DB 50OHM 5 PARTRON

COMPANY LIMITED

594 SAFD0150803 SAFD01 1 PCB

Assembly,Main,SMT Top


147

UN270


595 EDLH0015107 LD6000 1 LED,Chip 99-218UMC/2229397/TR8 WHITE 2.95~3.25 30mA

1200~1600mcd x, y 110mW - R/TP 2P - EVERLIGHT ELECTRONICS CO., LTD.








ROHM.


ROHM.


ROHM.


ROHM.


BeCu, , 3.0, 1.5, 1.5,





606 SPFY0234001 SPFY02 1 PCB,Main SPFY0234001 LG-UN270 VRZTG D FR-4 Staggered via

STAGGERED-8 0.75 MAIN UNITECH PRINTED CIRCUIT BOARD CORP.

607 MLAA0057303 MEZ002100 1 Label,Approval COMPLEX LG-SH240 SKTMS ZZ:Without Color -

148

lg attune un270 lgun270 [et]

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