LNP™ LDS AND THERMAL CONDUCTIVE COMPOUNDED SOLUTIONS

February 2014, Andy Verheijden

LDS FOR MID

No. 2

Value proposition

LNP Thermocomp LDS compounds will help to drive productivity and design cycle

flexibility, through part consolidation and miniaturization versus conventional technologies,

such as metal stamping, potentially providing system cost out thanks to shorter value

chain and faster market introduction.

LNP™ THERMOCOMP™ LDS COMPOUNDS FOR MID

LNP Thermocomp LDS compound may provide productivity & 3D design capability

Part consolidation Design freedom

No. 3

3

VALUE PROPOSITIONS MATERIAL & PROCESS

SABIC LNP & LDS technology providing potential cost & weight savings

Key advantages of LPKF LDS process

Very flexible process, for 3D prototyping and production

Fast operating method, typical operating speed 3 seconds/part

No chemical surface activation needed

Fine line processing down to 150 μm pitch size

Multiple antennas can be integrated in one process step

Part size possible up to 200 x 200 mm

LPKF Fusion3D 6000

Key advantages of LNP™ Thermocomp™ LDS compounds

High flow with superior impact performance, UL94 V-0 @ 0.6 mm

High stiffness with excellent aesthetics

High heat, UL94 V-0 @ 0.8 mm, for lead free soldering

Patented color capability

DX 11354 compound

DX 11355 compound

Comp. 1

Comp. 2

No. 4

LNP™ THERMOCOMP™ LDS COMPOUND SUCCESS STORY

Front cover LNP Thermocomp DX10311 compound

High modulus & ductile (8 GPa, INI 20 kJ/m2), excellent flow, Lexan™ EXL based

Battery cover Lexan EXL1414 resin

Lexan copolymer providing superior ductility/flow balance

Antenna LNP Thermocomp DX11355 compound

Lexan copolymer based LDS compound

LNP Thermocomp DX11355 compound

Antenna using LPKF LDS technology

Xiaomi Inc. Smartphone “MI2 A”

Application CTQs

LDS for integrated antenna

Excellent impact for rear cover

Pass 96 hours thermal shock test 65 ºC/RH 95%

Good plating performance

Wide processing window

LNP Thermocomp LDS compounds making use of SABIC’s proprietary PC copolymer

No. 5

LNP™ THERMOCOMP™ LDS COMPOUND SUCCESS STORY

LNP Thermocomp UX08325 compound

High modulus (10 GPa, HDT 263 ºC), SMT capable

3D Circuit Ltd, Jelly Fish LED lamp

LNP Thermocomp LDS compounds providing 3D design flexibility

No. 6

LN

P T

HE

RM

OC

OM

P L

DS

C

OM

PO

UN

DS

PC/ABS compounds

NX10302

NX11302

PC compounds

DX11354

DX11355

DX11354X

DX13354

PA compounds

UX08325

UX08305

Black, easy plating

White, easy plating

Black, high flow, superior impact

Black, UL94 V0 @ 0.6mm, high flow, superior impact

White, high flow, superior impact

30GF, TM > 8 GPa, excellent surface

High T PA, 30GF, HDT 263 ºC, SMT capable

UL94 V0 @ 0.8mm, HDT 267 ºC, SMT capable

LNP™ THERMOCOMP™ LDS COMPOUNDS PRODUCT PORTFOLIO

THERMAL MANAGEMENT

No. 8

THERMAL MANAGEMENT

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

0 0.2 0.4 0.6 0.8

Voltage (V)

Cu

rren

t (A

)

25 C 45 C 60 C

Heat builds up in electronics leading to reduced lifetime, and/or efficiency

No. 9

LNP™ Konduit™ compounds High thermal conductivity

Inherent electrical isolative

Flame retardant acc. UL94

Self Colored

Valox and/or Lexan resins

Flow

White color (high reflection)

Lexan™ polycarbonate resins Transparant and diffusion grades

UL94 V0 > 1mm / 5VA @ 3mm

Higher heat grades

Improved weather-ability grades

Typical requirements

UL 94 V0 (Nafta) UL 94 HB (RoW) Break-down voltage: 4KV Dielectric strength 1.2m drop test HDT>100C High thermal conductivity: working temp <75C Thermal cycle test HWI=4 / HAI=3 CTI=4 Paintable or in-colored For external surface >65C, RTI required

LED APPLICATIONS REQUIRE THERMAL MANAGEMENT

Metal substitution, enhancing part & function integration with LNP Konduit compounds

Valox™ resins Non brominated & chlorinated FR

Valox ENH4565

Sustainable grade Valox IQNH4550

Bulb

LED module

Thermal pad

Heat sink

Base holder

Potting glue

PCB module

No. 10

THERMALLY CONDUCTIVE PLASTICS

High thermal conductivity

Good mechanical strength

Poor electrical isolative property

Heavy weight

Poor productivity

More often 2nd operation needed

Less thermal conductivity

Less mechanical strength

Good electrical isolative property

Improved design flexibility

Lower energy demand

Light weighting

Increased productivity

Potential cost saving depending on design

Metal Thermal conductive compounds

Today metal is the common material used for heat sinks in LED lighting, but

thermal conductive thermoplastic compounds are increasingly used.

Metal substitution: integrating part & function with LNP™ Konduit™ compounds

No. 11

11

Metals Plastics

TCC's Unfilled Plastics

0

100

200

300

400

500

Th

erm

al C

on

du

ctiv

ity (W

m/K

)

0

2

4

6

8

Th

erm

al C

on

du

ctiv

ity (W

m/K

)

LNP™ KONDUIT™ COMPOUNDS FOR THERMAL MANAGEMENT

TCC may work as most heat transfer applications are limited by convection

TCC’s provide 10-50 x increased

thermal conductivity compared to

unfilled, or reinforced thermoplastics

Historically plastics have not been

able to compete with metals in heat

transfer applications

THERMAL CONDUCTIVITY - MECHANISM - COMPOSITIONAL EFFECTS - PROCESSING EFFECTS

No. 13

HEAT DISSIPATION

Convection:

Mixing of hot and cold air due to

pressure difference

Radiation:

Heat transfer via electromagnetic waves

Influenced by amount of surface (=design)

Conduction:

Transfer of thermal energy due to

temperature gradient Material

property!

No. 14

MECHANISM OF THERMAL CONDUCTIVITY

Vibrating atoms interact with neighboring atoms, transferring kinetic energy

Phonon = “motion of atomic and molecular vibrations”

Phonons propagate as waves at a frequency, amplitude and phase

Heat transport is reduced by scattering and collision of phonons

Simple, rigid structures are beneficial for heat transport

Polymers are thermal insulators

Good heat conductive ceramics are e.g. BN, AlN and SiC

No. 15

THERMAL VERSUS ELECTRICAL CONDUCTIVITY

Electrical conductivity

0 10 20 30 40 50 60 70

Filler fraction (vol%)

Elec

tric

al c

ondu

ctiv

ity

Ther

mal

con

duct

ivit

y

electrical conductivitythermal conductivity

-

+

-

+

High content (30 – 50 vol.%) of thermally conductive filler required

No. 16

THERMAL CONDUCTIVITY TEST EQUIPMENT

Measures diffusivity (a) and Cp

TC is calculated by: TC = a x Cp x r

Graphite coating applied

Through-plane and in-plane can be measured using

different sample holders

Netzsch NanoFlash (LFA447) HotDisk (TPS2500)

Laser

Specimen

IR detector

Measures TC directly

Measures bulk, in-plane, through-plane on sample

Variable geometries (e.g. color plaques, real-life parts)

According ASTM E-1461 According ISO 22007-2

Laser-flash method Hot disc - Transient plane heat source

State of the art test equipment to ensure reliable and reproducible data

No. 17

THERMAL CONDUCTIVITY – CRITICAL PARAMETERS

Orientation

Filler dispersion

Polymer-Filler Interface

Polymer Filler(s)

Processing

Particle size

Filler type(s)

Particle shape

Filler content Polymer type

Crystallinity

The higher the TC of the base

polymer, the higher the TC of

the compound

TC crystalline resin >>

amorphous resins

Base resin viscosity + filler

loading determines injection

moldability

Crystalline resins allow for

higher filler levels with good

processability

Thermal conductivity is influenced by 3 main variables

Understanding all application requirements is key to success

No. 18

ip

1mm, Pinpoint-gated 12.7mm disc

3mm, Pinpoint-gated 12.7mm disc

3mm, film-gated 60*60MM plaque

Nanoflash TCtp= 2.4 W/mK TCtp=4.1 W/mK TCtp=1.1 W/mK

Hotdisk TCBulk = 3.8 W/mK

TCtp = 0.8 W/mK

Tcip = 16.4 W/mK

PROCESSING EFFECTS ON LNP™ KONDUIT™ PX08321

tp

TCBulk = SQRT(TCtp*Tcip)

TCtp = Through-plane thermal conductivity

Tcip = In-plane thermal conductivity

Part design crucial for heat dissipative performance

No. 19

LNP™ KONDUIT™ COMPOUNDS PRODUCT PORTFOLIO

UV Stabilized compounds available: LNP Konduit PX11313 and PX11311U

No. 20

LNP™ KONDUIT™ SUSTAINABILITY

HEAT SINK PERFORMANCE

No. 22

Krauss Maffei 50T IMM Prototype Tooling Data acquisition system GWINSTEK DC Power Gauge R&R OK

H eat S in k D issipation P erform an ce

45

55

65

75

85

95

105

115

2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 8

P ow er(W )

Heat

er T

emp(

Degr

ee C

)

D ie C asting A l P X 08321-insert P X 08322-insert

P X 09322-insert E X K D 0033-insert E X K D 0012-insert

N on-TC P A 6-insert P X 08321-no insert P X 08322-no insert

3.3W 6.3~6.5W 6.75W 4.6W 4.3W

LNP™ KONDUIT™ FOR HEAT SINKS

Heat sink dissipation

No. 23

LNP™ KONDUIT™ FOR HEAT SINKS

H eat S in k D issipation P erform an ce

45

55

65

75

85

95

105

115

2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 8

P ow er(W )

Heat

er T

emp(

Degr

ee C

)

D ie C asting A l P X 08321-insert P X 08322-insert

P X 09322-insert E X K D 0033-insert E X K D 0012-insert

N on-TC P A 6-insert P X 08321-no insert P X 08322-no insert

3.3W 6.3~6.5W 6.75W 4.6W 4.3W

PX08322

tp: 1 W/mK

ip: 4.6 W/mK

PX08321

tp: 1.1 W/mK

ip: 8.6 W/mK

Heat sink dissipation

Krauss Maffei 50T IMM Prototype Tooling Data acquisition system GWINSTEK DC Power Gauge R&R OK

No. 24

H eat S in k D issipation P erform an ce

45

55

65

75

85

95

105

115

2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 8

P ow er(W )

Heat

er T

emp(

Degr

ee C

)

D ie C asting A l P X 08321-insert P X 08322-insert

P X 09322-insert E X K D 0033-insert E X K D 0012-insert

N on-TC P A 6-insert P X 08321-no insert P X 08322-no insert

3.3W 6.3~6.5W 6.75W 4.6W 4.3W

PA6+stamped Al-insert

Increasing TC

LNP™ KONDUIT™ FOR HEAT SINKS

Heat sink dissipation

Krauss Maffei 50T IMM Prototype Tooling Data acquisition system GWINSTEK DC Power Gauge R&R OK

No. 25

MODELING – 100% THERMOPLASTIC HEAT SINK

Cylinder has material property

distribution as shown

Disc has material property

distribution as shown

Radial Hoop Axial

TH-PLANE IN-PLANE IN-PLANE

k1 k2 k3

Radial Hoop Axial

IN-PLANE IN-PLANE TH-PLANE

k1 k2 k3

Peak temperature

No. 26

HYBRID HEAT SINKS – ANALYTICAL MODELING

Convective

Cooling (15W/m2-k) Heat source

d

No. 27

Two times sur.area Two times sur.area

Al Konduit Konduit + Al

Small sur.area Hybrid design

concept

90.32ºC 6 rib

(16000)

0 rib

(14000)

12 rib

(18000)

24 rib

(22000)

3300

Long Al Insert

84.45ºC

92.9ºC

86.58ºC

6 rib

(16000)

0 rib

(14000)

12 rib

(18000)

24 rib

(22000)

3300

Long Al Insert(Slot)

84.37ºC

86.63ºC

93.27ºC

1300

Short Al Insert

0 rib

(14000)

6 rib

(16000)

12 rib

(18000)

24 rib

(22000) 89.32ºC

91.50ºC

94.17ºC

97.62ºC

6 rib

(16000)

0 rib

(14000)

12 rib

(18000)

24 rib

(22000)

1300

Short Al Insert(slot)

90.39ºC

92.73ºC

97.81ºC

Increase surface area very effective to improve heat dissipation

DoE & Performance Testing

HYBRID HEAT SINKS – DESIGN ASPECTS

No. 28

HEAT SHOCK PERFORMANCE

Complex phenomenon, main controlling factors

• CTE mismatch

• Elongation at break (PX11311 and PX11311U)

• Design smoothly finned

More stringent test

Complete part design critical

THERMAL CONDUCTIVE LDS COMPOUNDS

No. 30

30

POTENTIAL VALUE PROPOSITION

What is it that you need for you next MID solution?

Why combining thermal conductivity with laser direct structuring capability?

Heat dissipation often needed in miniaturized electronic applications

Helps thermal management challenges with electronic circuitry, or in higher heat environments

Enhanced design freedom with surface mount technology (SMT), or laser welding

• May eliminate need for thermally conductive interface pads, and adhesives

Initial questions:

Level of isolative thermal conductivity needed? In Plane/Through Plane?

Temperature range required? Dimensional stability as f(T)?

(Halogen free) FR needed? Only dark, or also lighter colors?

Connection technology preferred?

Thermal conductive LDS compound proposed:

TCip ~ 3 W/mK & TCtp ~ 1.2 W/mK

Peel strength > 0.7 N/mm & Target 1 N/mm

Base resin preferred?

No. 31

DISCLAIMER

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determination as to the suitability of Seller’s products, services or recommendations for the user’s particular use through

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