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March 4 - 7, 2018

Hilton Phoenix / Mesa Hotel

Mesa, Arizona

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Alphabet Soup - High Frequency (HF), 5G, and millimeter-wave BiTS 2018 Session 1A Presentation 1

March 4-7, 2018 Burn-in & Test Strategies Workshop www.bitsworkshop.org

Improved contact solutions for

WLCSP RF applications

Yoinjun Shi

Twinsolution & GTransi

BiTS Workshop

March 4 - 7, 2018

Conference Ready

mm/dd/2014



Contents

• Background

• 5G Vision

• Filter Introduction

• 1st Generation Socket Structure Introduction

• Production Data Verification

• Contact Evaluation

• 2nd Generation Introduction

• Summary

Improved contact solutions for WLCSP RF applications 2



Background

Improved contact solutions for WLCSP RF applications 3

• Short spring pin

• Elastomer

• S-Contactor

• Membrane Pin

• In order to get a lower

inductance, we need the

contactor as short as possible.

• Different technology using

different material as the spring,

but with a lower compress

height.

• A longer compress travel is

needed for RF testing.

RF Test Contactor Type



5G Vision

4 Improved contact solutions for WLCSP RF applications

Total Capacity= B X ƞ X N

Bandwidth

spectrum effectiveness

No of stations

5G NR Standard

Catergeory Frequency Range

Consideration TDD Band(3.3GHz -4.6GHz)

(Time Division Duplexing)

Researching 24.25-27.5

31.8-33.4

37-43.5

45.4-50.2

50.4-52.6

66-76

81-86

North America 27.5-28.35

37-38.6

38.6-40

64-71

To boldly go where

no man has gone

before.

Quote from Star Trek:



An Typical Diagram of Mobile Phone

http://eecatalog.com/bindra/wp-content/uploads/2012/03/RF-Microwave-Tracker-March-3-Fujitsu-MB86L11A_block-diagram.jpg


• 5 Mode/ 13 Band

• 2G – GSM：850/900/1800/1900

• 3G (WCDMA /TD) – WCDMA：2100MHz/1900MHz/850MHz

– TD-SCDMA:1880-1920MHz/2010-2025MHz

– CDMA2000：1920-1935MHz/2110-2125MHz

• 4G – TDD-LTE：1900MHz/2300MHz/2600MHz

– FDD-LTE：1800MHz/2600MHz



1st Generation Socket Structure


Device Contactor

Upper

Guide plate

PCB Board

Microstrip

Line

Patent Pending



Helius Pin Socket Vs. Traditional Socket


Helius Pin Socket

Material: BeCu/Gold plating

Crown Diameter: Ø0.14mm

Plunger Diameter: Ø0.29mm

Flange Diameter: Ø0.33mm

Flange to Crown: 0.97mm

Material: BeCu /Gold Plating

Length: 0.45mm

Plunger Diameter: Ø0.14mm

Tip Radius: Full Radius

1.72mm

Traditional Socket

Guide

plate

Pin

PCB Board

Support Plate

Back Stiffener

Guide

plate

Socket

Body

Retainer



Study of S-Parameter


-0.7 dB

-0.6 dB

-0.5 dB

-0.4 dB

-0.3 dB

-0.2 dB

-0.1 dB

0.0 dB

0.0 G 5.0 G 10.0 G 15.0 G 20.0 G 25.0 G 30.0 G 35.0 G 40.0 G

1.72mm Spring Pin Helius Pin

Insertion Loss

-120.0 dB

-100.0 dB

-80.0 dB

-60.0 dB

-40.0 dB

-20.0 dB

0.0 dB

0.0 G 5.0 G 10.0 G 15.0 G 20.0 G 25.0 G 30.0 G 35.0 G 40.0 G

1.72 mm Spring Pin Helius Pin

Return Loss

1. Both using GSG Structure

2. Data by simulation



Production Test Data


1.72mm Pin Vs Helius Pin

-80

-70

-60

-50

-40

-30

-20

-10

0

1.5

0E+

09

1.5

4E+

09

1.5

7E+

09

1.6

1E+

09

1.6

4E+

09

1.6

8E+

09

1.7

2E+

09

1.7

5E+

09

1.7

9E+

09

1.8

2E+

09

1.8

6E+

09

1.9

0E+

09

1.9

3E+

09

1.9

7E+

09

2.0

0E+

09

2.0

4E+

09

2.0

8E+

09

2.1

1E+

09

2.1

5E+

09

2.1

8E+

09

2.2

2E+

09

2.2

6E+

09

2.2

9E+

09

2.3

3E+

09

2.3

6E+

09

2.4

0E+

09

2.4

4E+

09

2.4

7E+

09

B1 RX Test Data B1 RX Test Data

-7.00E+01

-6.00E+01

-5.00E+01

-4.00E+01

-3.00E+01

-2.00E+01

-1.00E+01

0.00E+00

1.5

0E+

09

1.5

4E+

09

1.5

8E+

09

1.6

2E+

09

1.6

6E+

09

1.7

1E+

09

1.7

5E+

09

1.7

9E+

09

1.8

3E+

09

1.8

7E+

09

1.9

1E+

09

1.9

5E+

09

1.9

9E+

09

2.0

3E+

09

2.0

7E+

09

2.1

2E+

09

2.1

6E+

09

2.2

0E+

09

2.2

4E+

09

2.2

8E+

09

2.3

2E+

09

2.3

6E+

09

2.4

0E+

09

2.4

4E+

09

2.4

8E+

09

B1 TX Test Data B1 TX Test Data

By using same device

different socket structure

to measure.



Further Discussion


Soldering on Evaluation Board

Socket Performance

1. Out-band suppression

2. Gain loss

By using same device one solder

on the PCB board, the other

measure by Helius pin. In order to study the impact of contactors to

the device, we create a pi type low pass filter,

and insert the pin into the filter to compare.

2

1



Further Discussion


1.72mm Pin Helius Pin

Self

Inductance 0.31nH 0.11nH

Mutual

Inductance 0.124nH 0.042nH

-25.0 dB

-20.0 dB

-15.0 dB

-10.0 dB

-5.0 dB

0.0 dB

0.0 G 2.5 G 5.0 G

Original_Filter Helius Pin 1.72mm Pin

1. The lower grounding

inductance, the lower

Out-band suppression

2. High contact resistance

significantly related to gain

loss.



Contact Tip Study


Radius

Crown

By using same device

repeat 10 times to

compare the crown

and radius tip design.



Contact Current Density Analysis


1. Crown has a better

current path compare

with radius point, the

four constriction point,

utilize the space

optimized.

2. Radius contact has 3

times current density

when we look at the

constriction area.

Insulation Base

1 μm gold pad

Pad

Str

uctu

re



n Spot Constriction Discussion


R: Constriction Resistance

n: 4

L: Distance between different

constriction point

a: Constriction radius

𝑅 𝑛, 𝑙, 𝑎 =ϼ

2𝛱𝑛𝑎𝑎𝑟𝑐𝑡𝑎𝑛

𝑙2 − 𝑎2

𝑎

100a 1.34a



Contactor Performance Test


1pcs Loop test (TX)

10pcs X 3Cycles contact test (TX)

10pcs X 3Cycles contact test (RX)

1pcs Loop test (RX)



2nd Generation Proto Type


Grounding or logic pin

Signal Pin Micro Strip

PCB Board

Bottom Guide Plate

Top Guide Plate Test Board

Normal Trace

Second generation structure, using the backside

trace of PCB board for logic signal path, RF

signal still go with the top layer trace.

Patent Pending



S-Parameter Simulation and Measurement


-2.5 dB

-2.0 dB

-1.5 dB

-1.0 dB

-0.5 dB

0.0 dB

0.0 G 5.0 G 10.0 G 15.0 G 20.0 G 25.0 G 30.0 G 35.0 G 40.0 G

Simulation Measument

-100.0 dB

-90.0 dB

-80.0 dB

-70.0 dB

-60.0 dB

-50.0 dB

-40.0 dB

-30.0 dB

-20.0 dB

-10.0 dB

0.0 dB

0.0 G 5.0 G 10.0 G 15.0 G 20.0 G 25.0 G 30.0 G 35.0 G 40.0 G

Simulation Measurement



Summary & Discussion


• Introduce a new design concept for integrated with PCB

board in order to reduce contactor inductance, and signal

to signal isolation

• Discuss the pin contact performance and inductance

impact to filter application.

• Introduce 2nd generation of the design in order to improve

the socket pin count to around 100 pieces.

march 4 - 7, 2018 hilton phoenix / mesa hotel mesa, arizona … · 2018. 4. 9. · bits 2018...

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