market, technology, collaboration: ems...

ELECTRONICS MANUFACTURING SERVICES

© 2009 Sanmina-SCI Corporation. Sanmina-SCI is a trademark of Sanmina-SCI Corporation. All trademarks and registered trademarks are the property of their respective owners.

Market, Technology, Collaboration: EMS Perspective

Dr. Michael StephanVP Account [email protected]

Sanmina-SCI Confidential

Agenda

� iNEMI Mission and Sanmina-SCI Business� Sanmina-SCI Today� Medical Division� Technology & Capabilities

� PCB� Assembly� Optical

� Technology Roadmap� Development Projects� Summary


3

Software Solutions

Marketing Design Manufacturing OrderFulfillment

Supply Chain ManagementInformation Technology

LogisticsCommunications

Business Practices

Build toOrder

Materials

Components

Customer

Equipment

MaterialsTransformation

Collaborative Design Lifecycle

SolutionsSoftware Solutions

Identify and close technology gaps, which includes the development and integration of the electronics industry supply infr astructure.

iNEMI Mission and Sanmina-SCI Business


Meeting Background� iNEMI is sponsoring this workshop to identify areas of potential collaborative

R&D that will reduce risk and speed up synchronized technology adoptionacross the supply chain. The workshop will:� Feature speakers from OEMS, suppliers, regulatory and research institutions� Identify challenges and gaps that benefit from a collaborative approach

Meeting Objectives� Evaluate opportunities that would benefit from industry collaboration� Form action groups to define and execute the required industrial

collaborative programs



Medical – What does it mean?� Our customers (OEMs) are very conservative� Most products have long life cycle (active & service)� Subject to strict regulations� People‘s life often depends on devices

Medical Operations Objectives� Traceability – Key� Quality – Must



Delivering the highest-level quality, technology and services to our customers.

� 30 years of operation

� $5.2 billion in annualized revenue (2009)

� 70+ plants in 18 countries

� 13M ft of manufacturing capacity

� 38,000 employees

� Total EMS solution

Sanmina-SCI Today


Repair & LogisticsDesign and Engineering

World-class Infrastructure Support Services: Supply Chain Management

Systems Design and Manufacturing

Dedicated End MarketsComponent Manufacturing

PCB Fabrication Plastic Injection Molding

Backplanes Cables

Memory Module Solutions Optical Solutions

Enclosures

Communications Industrial & Semiconductor

Enterprise Computing & Storage Defense & Aerospace Systems

Multimedia Medical Systems

Automotive Emerging MarketsPrecision Machining

End-to-End Manufacturing Services


San Jose, CA

Guadalajara, Mexico

Huntsville, AL

Örnsköldsvik, Sweden

Fermoy, Ireland

Ma’alot, Israel

Shenzhen, China

Singapore/Batam

Medical Division – Strategy & Footprint

� Medical Electronic Product Manufacturing: 18 Years

� Focused, Separate Medical Division – 8 Years

� Dedicated Medical Facilities – Complete Global Footp rint

� Largest Medical Electronic Product Revenues: $800M + / year

� Separate, Medical Quality System

� One I.T. System for All Sanmina-SCI & Medical Facil ities

� Greatest Number of Finished Medical Systems in Prod uction

Kunshan, China

Chennai, India

Penang, Malaysia

Tatabanya, Hungary

Lod, Israel


Ultrasound

Blood Glucose Meters

Anesthesia Metering

DermatologicalLaser Systems

Blood SeparatorsCT & Nuclear Medicine

Catheter Guidance

Middle EarInfections

In HomeMonitoring

Blood PressureTesting

RespirationSystems

CancerTreatment

Mobile / Portable “Core” Medical Large Systems Medical Devices

Orthopedics

Catheters

Pacemakers, Neuromodulation

Sanmina-SCI Medical – 4 Product Segments


We have a lot of high speed interconnect capabilities & technology…� Advanced PCB technology� Cable� Advanced high speed backplanes� Multi chip modules

… but usually don‘t apply these in medical products� Medical PCBs often have 4 - 8 layers only� Medical backplanes usually do not include our high speed technolgy� Sanmina-SCI‘s multichip technology is more often applied in telecom,

computer and storage products than in medical

Current Reality


Medical Appliance Technology Drivers

� High density component packages

� Form factor reduction

� Faster signal speed

� Improved Signal Integrity noise margins

� Weight reduction

� Cost/Performance


PCB Technologies for Medical Electronics

� Embedded Passives� HDI and Microvias� Flex and Rigid Flex� Form to Fit Flex� Embedded ESD Protection


ZBC Capacitor/Embedded resistor

ASIC / Processor

Embedded DiscreteCapacitor/ ABR

SMT DiscreteCapacitor/ Resistor

SMT DiscreteCapacitor/ Resistor

As Densities and Frequencies Increase Embedded Component Solutions will continue to offer Improved Cost/Performance Ratios over Conventional Designs and Solutions

Embedded Passive Design Strategies


� Decreased Plane Inductances & PDS

Impedance at High Frequencies� Reduced EMI

� Lower Inductance

� Reduced Size or IncreasedFunctionality at Same Size

� Replace or Supplement Discrete Caps

� Lower Assembly Costs & HigherReliability� Fewer Components = Less Solder Joints

� Telcordia GR78 Approved Thin Dielectrics� 500V Breakdown

� Lead Free Compatible

� Market Proven Technology

Active Component

Gnd

PwrI & Z C

No BC®

Active Device

Decoupling Capacitors

Active Device

Decoupling Capacitors

With BC®

Buried Capacitance™ Drivers


Plane C

apac

itance

pf/i

n2

(pf/c

m2 )

BC12, BC16, BC8, BC16T, BC12T are all trademarks of Oak Mitsui TechnologiesHK-04 is a trademark of DuPont Electronic Materials

1000 (155) BC24™ & ZBC1000™1.0 mil (25µ)

1600 (233) BC16™0.6 mil (16 µ)

1900 (310) BC12™0.5 mil (12 µ)

3100 (481) BC8™0.3 mil (8 µ)

11,000 (1,705) BC16T™0.6 mil (16 µ)

500 (78) ZBC2000®2.0 mil (50µ)

4500 (698) BC12TM™0.5 mil (12 µ)

800 (124) HK-04™1.0 mil (25µ)

Buried Capacitance Licensed Materials


FaradFlex™ BC-16T andFaradFlex™ BC-12TM� Ceramic filled/ modified FR-4

epoxy dielectric

FaradFlex™ BC-24, BC-16, BC-12 and BC-8� Modified FR-4 epoxy

dielectric

HK-4� Polyimide dielectric

ZBC-2000® and ZBC-1000™� FR-4 epoxy dielectric

with fiberglass reinforcement

BC® Material Cross Sections


Buried Capacitance™ (ZBC®)

Product Highlights� License patent to PCB fabricator & laminator

� Improved EMI

� Improved reliability

� Improved manufacturability

� Improved power distribution

� Reduction of high-frequency discrete bypass capacitors

� Reduction of undesired discrete capacitor resonance

� Low-plane inductance at high frequencies

� Worldwide network of licensed laminators and fabricators

� Guaranteed quality and consistency of material through common standard

Non-ZBC® ZBC2000®

BC24TM BC12TMTM

Noisy

Quiet

TechDream Simulation of Plane Resonance

77%10BC848

75%11BC1248

74%12BC1648

72%13BC24/HK0448

64%17ZBC2000®48

0%484 mil core48

%Eliminated

# CapsAfter

Product# Caps Before

Buried Capacitance® - Laminate Impedance

Eliminate Costly Bypass Capacitors Using ZBC® Products


Embedded Resistors


Embedded Resistor Applications

� Tight surface areas

� BGA terminations

� Thevenin terminations� Pull-up or Pull-down resistors� Discrete

� Network

� Series� Weight sensitive� Embedded resistors are lighter weight than chip resistors

� RF and microwave� Power splitters


Embedded Resistor Technologies

� Multiple available technologies & configurations� Tailored to specific design requirements� Over 10 years of PTF manufacturing experience� Improved PTF Materials� Cost Effective Laser Trimming

TICER Ohmega-Ply ® Thin Film

Sanmina-SCI Polymer Thick Film (PTF)


ABR™ Annular Buried Resistor

� Three generic physical configurations� Space Saving� No routing required

Via to Plane

Via to Signal

Via to Via


Sanmina-SCI’s Patented Planar Trimming Can Be Adapted to Any PCB Fabricator At Minimum Capital Cost FAST….2000 resistors 2 minutes

Standard J Cut Laser Trim SSCI Patented Planar Laser Trim

� Specialized Laser Trim Tool� Point-to-Point Test & Trim – very slow� Large Reduction to Current Cross-section� Localized Current Crowding� Very Precise Resistor Values DC and� Low Frequencies� Poor High Frequency Response

� Leverage Existing Laser Drill Tools� and Test Equipment� Predictive Trim Formulation – very fast� Uniform Reduction to Current Cross-section� Uniform Current Densities� Maintain 1 – 5% Resistance Tolerance� Uniform Frequency Response DC to VHF

Predictive Laser Trimming Process PLT™


0.002”

1st Test A D Tool# 47 46 36 35 25 24 14 13 12 11 10 Over Flow

Image 1 1 2 36 63 50 20 15 4 5 3 1 1

Image 2 1 8 61 55 37 14 11 8 3 1 1 1

Image 3 1 7 31 48 67 37 6 2 2

Image 4 1 1 1 18 39 65 53 15 5 3

Image 5 7 52 39 19 17 17 14 16 9 4 4 1 1

Image 6 1 1 22 42 62 37 22 9 2 2 1

Image 7

Image 8

Image 9

Pass >> Bin .15 .20 .25 .30 .35 .40 .45 .50 .55 .60 .65 .70 .75 .80 .85 .90 .95 1.0 1.05 1.10 1.15 >Sum 1 26 220 286 300 178 86 42 29 17 6 7 1 1

Sum Total Tool Set Trim Sum

XFactor

Tool Dispersion

Mean: Stdev: Small: Large: 3*CV:

AQ320_05a.csv AQ320_05b.csv Tool#

10

Images Per Core: 6 Resistors Per Image:

57%

200

0.28 0.920.47 0.09

0.111200 1168

2 nd TestSave

RecordsDrill

Format

0.0

0.2

0.4

0.6

0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00 1.05 1.10 1.15

ClearSort B 1st TestTool

Dispersion

LoadLoad

2nd Test A D Tool# 47 46 36 35 25 24 14 13 12 11 10 Over Flow

Image 1 1 1 1 3 1 13 67 82 25 4 1 2 1

Image 2 1 1 2 23 78 59 26 10 1 1

Image 3 1 1 2 1 33 95 51 11 5 2

Image 4 1 1 1 8 49 88 49 4 1

Image 5 1 1 1 14 72 61 32 10 3 5 1 1

Image 6 1 1 1 12 38 52 56 27 8 5 1

Image 7

Image 8

Image 9

Pass >> Bin .15 .20 .25 .30 .35 .40 .45 .50 .55 .60 .65 .70 .75 .80 .85 .90 .95 1.0 1.05 1.10 1.15 >Sum 1 1 21 85 297 426 267 68 19 10 3 2

Sum Total Tool Set Trim Sum

XFactor

Tool Dispersion

Mean: Stdev: Small: Large: 3*CV:

AQ320_05a.csv AQ320_05b.csv Tool#

10

Images Per Core: 6 Resistors Per Image:

27%

200

0.41 1.020.67 0.06

6

0.111200 831

2 nd TestSave

RecordsDrill

Format

0.0

0.2

0.4

0.6

0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00 1.05 1.10 1.15

ClearSort B 1st TestTool

Dispersion

LoadLoad

1st Electrical Core Test 2nd Electrical Core Test

Licensing Available� Predictive Trim Algorithm� 2000 resistors in 2 minutes� Uses existing flying probe and laser drill

Patented ABR and Planar Laser Trimming

ABR™ and Planar Laser Trimming


HDI and MicroVia


Thermal Shock500x: -65°C > 125°C

Thermal Cycling5x: -65°C > 125°C +288°C 10 sec

Thermal Stress5x: 288°C 10 sec

RELIABILITY TEST

VIA STRUCTURE

3+3, 4+4, 5+5, 7+7, 9+92+2+2, 2+6+21+2+1, 1+4+1, 1+6+1, 1+10+1, 1+12+1

SequentialHDI Type IIIHDI Type I & IIHDI TYPE

Mechanical Drill

Controlled Depth Drill

Laser Drill(Conformal

Mask)Sequential

Prepreg 1x10802x10802x106

Resin Coated Copper (RCC)

HOLE FORMATIONBUILD-UP

TECHNOLOGY

DETAILITEM

1-Deep Via Stacked Via

Staggered Via

Controlled Depth Via

Blind ViaBuried Via

HDI and MicroVia


Flex and Rigid Flex


� Rigid-flex PCB’s� Polyimide/Kapton� FR-4 based HVRFlex� LCP Liquid Crystal Polymer� Up to 12 flex layers

� Very high density� Flexible PCB’s� High speed materials� Line/space < 3/3 mils

HDI Flex and Rigid Flex

Advantages� Size reduction� Weight reduction� Thickness reduction� Bend � Fold to fit � Ultra Fine Line and Density


� Reduce space and weight of the overall assembly.

� Simplify internal assembly configuration and improve its overall packaging.

� Improve reliability as compared to conventional wiring.

� Improve complexity of PCB.

� Facilitates easy installation as well as maintenance.

� Flex arms can be fanned out to connect different platform under same or different orientation.

� With the absence of connector, the signal output across rigid sections is not interrupted from one rigid section (point A) to the other rigid section (point B).

A B A B

DESIGN WITH RIBBON CABLE.

DESIGN WITH RIGID FLEX BOARD.



core

pre-pregCu foil

pre-pregCu

Cu

Cu

Flexible mask

Flexible mask

pre-pregCu

pre-pregCu foil

Flexible mask

Flexible maskcore

coreCu

Cu

Rigid (laminates) C-stage laminate or Film for flex R igid (laminates)

Rigid Flex 8 layer, 2 flexible cores construction

� Rigid Flex Example Cross Section



Palletized for automated component placement

Separated and configured

During Assembly

Fold to Fit

� Fold to Fit Applications



HVRFlex Technology

� HVRFlexTM (High Volume Rigid Flex) is a technology that incorporates the flexibility for

bend to fit applications� Utilizes advanced design concepts that incorporates all the performance characteristics

of conventional multilayer PCB’s with the flexibility of rigid-flex interconnects

� Utilizes FR-4 or other reinforced materials for transition layers instead of expensive

Kapton Polyimide� Limited to 50 – 80 bend cycles

� Lower Cost



eESD ™Embedded ESD Protection


eESD™: Embedded ESD Technology

Product Highlights

� Eliminates discrete surge suppressors

� Provides 100% protection of all components providing superior reliability

� Cost effective

� Low Capacitance, Low Leakage

� Adjustable Trigger & Clamp Voltages

� No routing to discrete products

� Reduces Board Size

� Reduces design respins

� Easy to implement

� Protects other embedded devices

Applications

� Cellular phones, PDAs and hand held equipments

� Memory cards and modules

� Semiconductor substrates

� USB devices

Active Device

Power Plane

Ground Plane

Active Device

Path of Normal Current

Path of ESD Event

Signal Layer

Patented / Patent Pending


Figure 1� Very low leakage current picoamps

at 6 volts� Very high off-state resistance

XStatic Across 5 mil gap

1.0E-12

1.0E-11

1.0E-10

1.0E-09

1.0E-08

1.0E-07

1.0E-06

1.0E-05

1.0E-04

1.0E-03

1.0E-02

1.0E-01

1.0E+00

0 20 40 60 80 100

Applied Voltage

Leakag

e Current (am

ps)

eESDTM: Embedded ESD Technology-Low “turn on” voltage -Excellent Durability over

- 100 V/mil multiple high voltage pulses-Very fast trigger (<1 ns) -Passes >8kV contact ESD

Transmission Line Pulse (TLP) Test DataFigure 2: 200 to 1600 Volt Step Figure 3: 1495-1500 Volt input, 200 ns pulse width

eESD™: Embedded ESD Technology


F

G

SMD

connectors

E

D

C

B

A

Em

bedded ICs

Em

bedded Passives

Com

pliant Pins

Ribbon D

irect Attach / H

ot Bar

Flex on B

oard

Wire B

ond Ball

Wire B

ond Wedge

Direct D

IE A

ttach

DIE

Stack

Chip on F

lex with under-fill

Chip on B

oard with under-fill

BG

A S

ockets

Micro B

GA

with under-fill

Micro B

GA

SM

D S

witch

QF

N H

igh Pin count

QF

N

SO

IC/ S

SO

P

TS

OP

QF

P/T

QF

P

Passives 0201 / 0402

Passives 01005 Product

�Technology supports known product designs for next 3 to 5 years.

Yellow = Capable Green = Current

PCBA Technology Example Medical products


Trends in product technology 2005 – 2015 as share of production volume

Share of production valueCurrent & Emerging technologies

� System integration or SiP (System in Package) / Sub-modules

� PoP (Package on Package)

� Direct Chip Attach (active Semiconductors)

� FC (Flip Chip)

� COB (Chip on Board)

� Embedded Components

� Chip in Polymer (placed on inner layers)

� Requires increased accuracy

� Optical modules� Standard P&P with increased accuracy

� Polymer electronics

Value of Electronics Production

Source: A&D EA Team Restructuring / Sales / EA and Gartner studies, 2006

SMT Assembly Trends


Quality: “Mistake Proofing” SMT

Start

Laser Marking

“Pick & Place” of SMT Components

Reflow

A.O.I.

X-Ray

Screen Print

3D Paste Inspection

Laser Marking� 2D Matrix� Unique PCB Label� Duplication Protection

3D Solder Paste Insp.� 100% Pad Inspection� Individual Pad Volumes

Optical Inspection (AOI)� 100% Inspection� Presence / Absence� Orientation� Solder Joint Quality

X-Ray InspectionBGA and die-void measurements � Real-time digital X-ray inspection � Enhanced resolution 1.3M pixels � Rotating live oblique views 360°

IQC

PTSdatabase

SMT loading

ORACLE•BOM•Receipts•Work orders•Item data

FujiCam/FujiFlexa•picklists

•Lot code•Date code•MSD cat.•Unit qty

PTS

Parts Traceability System


� Standard 2D provides pad coverage� 2D does not provide volume

� 3D provides coverage and volume� Valuable for product’s Micro BGA’s� Rework is not cost effective

� process indicating tool� provide real time feedback to the manufacturing team.

3-D Paste Inspection


New Technology� In-line X-Ray� Verification of solder joints� Hidden joints (BGA)

Result� allows complex process without visibility of leads� allows us to build high volume products� high confidence level in quality

In-Line X-Ray


� There are many technologies available today, which can be easily applied in medical products.

� With an increasing number of medical devices adding wireless data transmission capabilities, internal and external signal transmission speed is getting more and more important as is signal integrity.

� There is no need for medical OEMs to reinvent the wheel. By partnering with companies like Sanmina-SCI, which have the relevant technologies ready to use due to their involvement in other market segments (consumer, computer, telco etc.), medical OEMs can benefit from these technologies and expertise.

� Sanmina-SCI (Contract Manufacturer) can be the single source for different technologies used in one product.

Summary


Thank You

“ Supporting the Need for Speed ” TM

market, technology, collaboration: ems...

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