mechanical specifications, pad layout, and mounting
TRANSCRIPT
378091416
MECHANICAL SPECIFICATIONS
Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed
Multilayer Organic (MLO®) Filters
Footprint A
Mechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
379091416
SUGGESTED PCB LAYOUT
Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.
Multilayer Organic (MLO®) Filters
Footprint A
Mechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
380091416
PAD CONNECTIONS
Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]
3
3 3 3 3
33333
3 3 3 3
22
Multilayer Organic (MLO®) Filters
Footprint A
Mechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
381091416
MECHANICAL SPECIFICATIONS
Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed
Multilayer Organic (MLO®) Filters
Footprint B
Mechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
382
SUGGESTED PCB LAYOUT
Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.
Multilayer Organic (MLO®) Filters
Footprint B
Mechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
383
PAD CONNECTIONS
Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]
Multilayer Organic (MLO®) Filters
Footprint B
Mechanical Specifications, Pad Layout, and Mounting Recommendations
3
3 3 3 33
3 33333
3 3 3 3 3
22
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
384
MECHANICAL SPECIFICATIONS
Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed
Multilayer Organic (MLO®) Filters
Footprint C
Mechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
385
SUGGESTED PCB LAYOUT
Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.
Footprint C
Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
386
PAD CONNECTIONS
Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]
Footprint C
3
3
3
3
31 2
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
387
MECHANICAL SPECIFICATIONS
Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed
Footprint D
Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
388
SUGGESTED PCB LAYOUT
Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.
Footprint D
Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
389
PAD CONNECTIONS
Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]
Footprint D
3
3
3 3 3 3 3 3 3
3 3 3 3 3 3 3
3 3 3 3 3 3 3
1 2
Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
390
MECHANICAL SPECIFICATIONS
Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed
Footprint E
Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
391
SUGGESTED PCB LAYOUT
Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.
Footprint E
Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
392
PAD CONNECTIONS
Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]
Footprint E
3
3 3 3 3 3 3 3 3 3 3
3 3 3 3 3 3 3 3 3
3 3 3 3 3 3 3 31 2
Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
393
MECHANICAL SPECIFICATIONS
Input / output pads shown in Blue. Grounding pads shown in black.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed
Footprint E1
Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
394
SUGGESTED PCB LAYOUT
Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.
Footprint E1
Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
395
PAD CONNECTIONS
Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in black.Dimensions in inches [mm]
Footprint E1
3
3 3 3 3 3 3 3 3 3 3
3 3 3 3 3 3 3 3 3
3 3 3 3 3 3 3 31 2
Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
396
MECHANICAL SPECIFICATIONS
Input / output pads shown in Blue. Grounding pads shown in black.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed
Footprint E2
Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
397
SUGGESTED PCB LAYOUT
Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.
Footprint E2
Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
398
PAD CONNECTIONS
Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in Black.Dimensions in inches [mm]
Footprint E2
3
3 3 3 3 3 3 3 3 3 3
3 3 3 3 3 3 3 3 3
3 3 3 3 3 3 3 31 2
Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
399
MECHANICAL SPECIFICATIONS
Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed
Footprint F
Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
400
SUGGESTED PCB LAYOUT
Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.
Footprint F
Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
401
PAD CONNECTIONS
Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]
Footprint F
3 3 3 3 3 3 3 3 3 3
3 3 3 3 3 3 3 3 3
3 33 3 3 3 3 3 3
3
1 2
Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
402
MOUNTING RECOMMENDATIONS
AUTOMATED SMT ASSEMBLYThe following section describes the guidelines for automated SMT assembly of MLO® RF devices which are typically Land Grid Array (LGA) packages or side termination SMT pacages.Control of solder and solder paste volume is critical for surface mount assembly of MLO® RF devices onto the PCB.
Stencil thickness and aperture openings should be adjusted according to the optimal solder volume. The following are general recommendations for SMT mounting of MLO® devices onto the PCB.
SMT REFLOW PROFILECommon IR or convection reflow SMT processes shall be used for the assembly. Standard SMT reflow profiles, for eutectic and Pb free solders, can be used to surface mount the MLO® devices onto the PCB. In all cases, a temperature gradient of 3°C/sec, or less, should be maintained to prevent warpage of the package and to ensure that all joints reflow properly. Additional soak time and slower preheating time may be required
to improve the out-gassing of solder paste. In addition, the reflow profile depends on the PCB density and the type of solder paste used. Standard no-clean solder paste is generally recommended. If another type of flux is used, complete removal of flux residual may be necessary. Example of a typical lead free reflow profile is shown below.
Critical ZoneTL to Tp
Ramp-down
Ramp-up
Ts max
25t 25ºC to Peak
Ts min
tsPreheat
Tptp
TL tL
Time
Temperature
Figure A. Typical Lead Free Profile and Parameters
Profile Parameter Pb free, Convection, IR/ConvectionRamp-up rate (Tsmax to Tp 3ºC/second max.
Preheat temperature (Ts min to Ts max) 150ºC to 200ºCPreheat time (ts) 60 – 180 seconds
Time above TL, 217ºC (tL) 60 – 120 secondsPeak temperature (Tp) 260°C
Time within 5ºC of peak temperature (tp) 10 – 20 secondsRamp-down rate 4ºC/second max.
Time 25ºC to peak temperature 6 minutes max.
Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations
– rf microwave products –
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.