Perfect PCB

Warp Compensation

True 3D Inspection

Performance

A 3D Measurementbased SMT Process Control System

World-Class True 3D Automated Optical Inspection

Warp Compensation

A 3D Measurementbased SMT Process

Must-check Requirements of 3D AOI System

Inspection Task● Missing, Offset, Rotation, 3D Polarity, Upside down, OCV, Coplanarity, Solder fillet, Lifted lead, Billboarding, Tombstone, Bridging, Dimension

InspectionItems

Conveyor Width Adjustment

Conveyor Fix Type

● Automatic● Front / Rear Fixed (factory setting)

PCBHandling

● Offline SPC Pro Station● Standard Calibration Target ● Remote Monitoring System● OLD@KSMART

● Warp Compensation● Foreign Material Inspection● Review Station

Add-onSolutions

Software

Programming S/WOperating System

Operating System

Operator User-friendliness

Statistical Process Control Tool

● Gerber data (274X, 274D), ODB++, Placement file, Mounter JOB file, Allegro,● Zuken, Mentor (optional)● ePM-AOI, AOI GUI ● AOI GUI

InspectionPerformance

Camera ResolutionFOV SizeFull 3D Inspection SpeedHeight Accuracy (on KY Calibration Target)CameraIlluminationMax. Measurement Height

● ±3%● 4M Pixel High Speed Camera● IR-RGB LED Dome Styled Illumination● 4mm

RequirementsShadow Problem Solution

Specular Problem Solution

Shadowed Area between Tall Components

Small (01005 inch) Component Insepction

Wide Measurement Range + Accuracy (Measurement Range Problem)

Real time PCB Warp Compensation

Dark component & White Body Component Location

Component Body, Lead Coplanarity Inspection

Solder Joint Profile Inspection

3D Polarity Inspection

Component Crack Inspection

Solutions

● Warp Compensation (Pad Referencing + Multi-Frequency Moiré Technology)

● 3D Shadow Free Moiré Technology & 4 Way Projection

● True 3D Measurement

● Multi-Frequency Moiré Technology

● 1D & 2D Handy Barcode Reader● 1D & 2D Inline Barcode Reader● Offline Programming Station● SPC@KSMART

Supported Input Format

● SPC@KSMART● Review Station● Remote Monitoring System● Library Manager@KSMART● KYCal: Auto Camera Calibration, Auto Illumination Calibration, Auto Height Calibration ● Intel i7-3970X (6Core), 32GB, Window 7 Ultimate 64bit

Max. PCB Size330X330mm(13X13 inch)

50X50mm(1.97X1.97 inch)

50mm(1.97 inch)200~240VAC, 50/60Hz Single Phase, 5Kgf/cm2

0.4~5mm(0.015~0.20 inch)

Ring Belt : 2kg(4.4 lbs), Timing Belt : 5kg(11 lbs)550kg(1212 lbs) 700kg(1543 lbs) 850kg(1874 lbs)

820mm(32.2 inch) 1000mm(39.3 inch)

985mm(38.7 inch) 1165mm(45.8 inch)

1350mm(53.1 inch)1000mm(39.3 inch)

10kg(22 lbs)

0.5~8mm(0.02~0.31 inch)

70X70mm(2.7X2.7 inch)

510X510mm(20X20 inch)

Dual: 510X320mm(20X12.6 inch)

Single: 510X580mm(20X22.8 inch)

850X690mm(33.4X27.1 inch)

Min. PCB Size

Max. PCB WeightMachine Weight

Bottom Side ClearanceSupplies

WDHF

600kg(1322 lbs)

M L DL XL

PCB Thickness

20μm40×40mm (1.57×1.57 inch)

15μm30×30mm (1.18×1.18 inch)

22.9~33.6 cm2/sec (Inspection speed varies by PCB, and inspection condition.)

※ Above specifications are subject to change without notice.

Koh Young Technology Inc. All rights reserved.

08588

+82-2-6343-6000 +82-2-6343-6001

H F(Front-Fix)

(PC

B H

eigh

t 950

mm

)

PC

B T

rans

fer H

eigh

t

PC

B H

eigh

t 950

mm

870~

950m

m

1182

mm

167m

m

475m

m

(PC

B H

eigh

t 950

mm

Fro

m B

otto

m C

lear

ance

)

W D418mm

1627mm(64.0 inch)1265mm(49.8 inch) 1265mm(49.8 inch) 1445mm(56.8 inch) 1445mm(56.8 inch)

Template Management for Fast and Intuitive Programming

KSMART: Cutting-Edge Process Optimization Tools for Smart Factory Realization

Perfecting Inspection Performance with True 3D

ZENITH LiTE’s patented AOI system e�ectively measurestrue pro�lometric component shapes, foreign materials, patterns, and solder joints on assembled PCBs to overcome the vulnerabilities and shortcomings of 2D AOI’s

● Step1. For a Non-registered package

● Step2. Choose a Package registration- package type- component type

● Step3. Apply the selected package

● Step4. Select a relevant template registered on the server

Sync Library

(Library Manager)

LinkApprox.2 Times Faster

SPC Dashboard Inspection Analysis

Job and User Level ManagementThe KSMART Library Manager simultaneously enhances job and user level management, storing job files and inspection conditions in a centralized database and distributing the data to multiple AOIs in real-time.

3D data based SPI-AOI communication solutionMerging images, trends, charts and inspection results including detailed analysis from Koh Young’s 3D SPI and 3D AOI Systems for total line communication and process analysis, and tracing the root cause of defects by storing and communicating inspectioninformation.

Job Fine-tuning with Minimum DowntimeThe Offline Program Optimizer makes program creation, debugging and updates seamless. Allowing operators to automatically deploy modified inspection conditions and fine tune pro-cesses starting from the next PCB without stopping the production line or altering the produc-tion schedule.

Reliable 3D Data-based Statistical Process ControlThe SPC@KSMART module helps operators perform critical process analyses and accelerate root cause analysis for increased equipment uptime, all from an intuitive graphi-cal interface.

3 Point View

SPC

Library Manager

Solder Joint Rotation Bridging Lead Coplanarity Missing

Solder Fillet Billboarding Upside down OCV/OCR Offset

Measurement & Inspection of an Array of DefectsAs the true 3D AOI system, ZENITH LiTE effectively measures solder joints and components in 3D, where traditional 2D inspection and true 3D measurement are combined in perfect unison, making inspection according to IPC-A-610 attainable. ZENITH LiTE has the ability to make a clear and concise ‘go-or-no-go’ decision for a solder joint inspection, detectingan array of potential defects including Missing solder, Offset, Rotation, Polarity, Upside down, OCV/OCR, Solder filet, Billboarding, Lifted Lead, Lifted Body, Tombstone, Bridging and more.

While 3D images provide a wealth of information on quantified inspection results to judge component position and the solder fillet’s acceptability. ZENITH LiTE’s intuitive interface makes setup easy, reducing programming time in package registration and setting of inspection conditions. The evaluation benchmark can then be easily managed by an operator, simplifying and speeding up programming, while also making identification universal.

World-Class True 3D Automated Optical Inspection

LM

OPO(Offline Program Optimizer) OPO

Template Management for Fast and Intuitive Programming

KSMART: Cutting-Edge Process Optimization Tools for Smart Factory Realization

Perfecting Inspection Performance with True 3D

ZENITH LiTE’s patented AOI system e�ectively measurestrue pro�lometric component shapes, foreign materials, patterns, and solder joints on assembled PCBs to overcome the vulnerabilities and shortcomings of 2D AOI’s

● Step1. For a Non-registered package

● Step2. Choose a Package registration- package type- component type

● Step3. Apply the selected package

● Step4. Select a relevant template registered on the server

Sync Library

(Library Manager)

LinkApprox.2 Times Faster

SPC Dashboard Inspection Analysis

Job and User Level ManagementThe KSMART Library Manager simultaneously enhances job and user level management, storing job files and inspection conditions in a centralized database and distributing the data to multiple AOIs in real-time.

3D data based SPI-AOI communication solutionMerging images, trends, charts and inspection results including detailed analysis from Koh Young’s 3D SPI and 3D AOI Systems for total line communication and process analysis, and tracing the root cause of defects by storing and communicating inspectioninformation.

Job Fine-tuning with Minimum DowntimeThe Offline Program Optimizer makes program creation, debugging and updates seamless. Allowing operators to automatically deploy modified inspection conditions and fine tune pro-cesses starting from the next PCB without stopping the production line or altering the produc-tion schedule.

Reliable 3D Data-based Statistical Process ControlThe SPC@KSMART module helps operators perform critical process analyses and accelerate root cause analysis for increased equipment uptime, all from an intuitive graphi-cal interface.

3 Point View

SPC

Library Manager

Solder Joint Rotation Bridging Lead Coplanarity Missing

Solder Fillet Billboarding Upside down OCV/OCR Offset

Measurement & Inspection of an Array of DefectsAs the true 3D AOI system, ZENITH LiTE effectively measures solder joints and components in 3D, where traditional 2D inspection and true 3D measurement are combined in perfect unison, making inspection according to IPC-A-610 attainable. ZENITH LiTE has the ability to make a clear and concise ‘go-or-no-go’ decision for a solder joint inspection, detectingan array of potential defects including Missing solder, Offset, Rotation, Polarity, Upside down, OCV/OCR, Solder filet, Billboarding, Lifted Lead, Lifted Body, Tombstone, Bridging and more.

While 3D images provide a wealth of information on quantified inspection results to judge component position and the solder fillet’s acceptability. ZENITH LiTE’s intuitive interface makes setup easy, reducing programming time in package registration and setting of inspection conditions. The evaluation benchmark can then be easily managed by an operator, simplifying and speeding up programming, while also making identification universal.

World-Class True 3D Automated Optical Inspection

LM

OPO(Offline Program Optimizer) OPO

Perfect PCB

Warp Compensation

True 3D Inspection

Performance

A 3D Measurementbased SMT Process Control System

World-Class True 3D Automated Optical Inspection

Must-check Requirements of 3D AOI System

Inspection Task● Missing, Offset, Rotation, 3D Polarity, Upside down, OCV, Coplanarity, Solder fillet, Lifted lead, Billboarding, Tombstone, Bridging, Dimension

InspectionItems

Conveyor Width Adjustment

Conveyor Fix Type

● Automatic● Front / Rear Fixed (factory setting)

PCBHandling

● Offline SPC Pro Station● Standard Calibration Target ● Remote Monitoring System● OLD@KSMART

● Warp Compensation● Foreign Material Inspection● Review Station

Add-onSolutions

Software

Programming S/WOperating System

Operating System

Operator User-friendliness

Statistical Process Control Tool

● Gerber data (274X, 274D), ODB++, Placement file, Mounter JOB file, Allegro,● Zuken, Mentor (optional)● ePM-AOI, AOI GUI ● AOI GUI

InspectionPerformance

Camera ResolutionFOV SizeFull 3D Inspection SpeedHeight Accuracy (on KY Calibration Target)CameraIlluminationMax. Measurement Height

● ±3%● 4M Pixel High Speed Camera● IR-RGB LED Dome Styled Illumination● 4mm

RequirementsShadow Problem Solution

Specular Problem Solution

Shadowed Area between Tall Components

Small (01005 inch) Component Insepction

Wide Measurement Range + Accuracy (Measurement Range Problem)

Real time PCB Warp Compensation

Dark component & White Body Component Location

Component Body, Lead Coplanarity Inspection

Solder Joint Profile Inspection

3D Polarity Inspection

Component Crack Inspection

Solutions

● Warp Compensation (Pad Referencing + Multi-Frequency Moiré Technology)

● 3D Shadow Free Moiré Technology & 4 Way Projection

● True 3D Measurement

● Multi-Frequency Moiré Technology

● 1D & 2D Handy Barcode Reader● 1D & 2D Inline Barcode Reader● Offline Programming Station● SPC@KSMART

Supported Input Format

● SPC@KSMART● Review Station● Remote Monitoring System● Library Manager@KSMART● KYCal: Auto Camera Calibration, Auto Illumination Calibration, Auto Height Calibration ● Intel i7-3970X (6Core), 32GB, Window 7 Ultimate 64bit

Max. PCB Size330X330mm(13X13 inch)

50X50mm(1.97X1.97 inch)

50mm(1.97 inch)200~240VAC, 50/60Hz Single Phase, 5Kgf/cm2

0.4~5mm(0.015~0.20 inch)

Ring Belt : 2kg(4.4 lbs), Timing Belt : 5kg(11 lbs)550kg(1212 lbs) 700kg(1543 lbs) 850kg(1874 lbs)

820mm(32.2 inch) 1000mm(39.3 inch)

985mm(38.7 inch) 1165mm(45.8 inch)

1350mm(53.1 inch)1000mm(39.3 inch)

10kg(22 lbs)

0.5~8mm(0.02~0.31 inch)

70X70mm(2.7X2.7 inch)

510X510mm(20X20 inch)

Dual: 510X320mm(20X12.6 inch)

Single: 510X580mm(20X22.8 inch)

850X690mm(33.4X27.1 inch)

Min. PCB Size

Max. PCB WeightMachine Weight

Bottom Side ClearanceSupplies

WDHF

600kg(1322 lbs)

M L DL XL

PCB Thickness

20μm40×40mm (1.57×1.57 inch)

15μm30×30mm (1.18×1.18 inch)

22.9~33.6 cm2/sec (Inspection speed varies by PCB, and inspection condition.)

※ Above specifications are subject to change without notice.

Koh Young Technology Inc. All rights reserved.

08588

+82-2-6343-6000 +82-2-6343-6001

H F(Front-Fix)

(PC

B H

eigh

t 950

mm

)

PC

B T

rans

fer H

eigh

t

PC

B H

eigh

t 950

mm

870~

950m

m

1182

mm

167m

m

475m

m

(PC

B H

eigh

t 950

mm

Fro

m B

otto

m C

lear

ance

)

W D418mm

1627mm(64.0 inch)1265mm(49.8 inch) 1265mm(49.8 inch) 1445mm(56.8 inch) 1445mm(56.8 inch)