Report of In-plant Training

In

Videocon industries LtdBy

Master. Saurabh Nandakiumar

(University no.: 101090010)

Of

VJTI,

Mumbai.

Department Of Electronics and Telecommunication Engineering,

VJTI,

Mumbai.

Acknowledgment

I am deeply thankful to our respected Head of Department Prof.

Mangalvedekar for his permission to allow me to do my training in

Videocon industries Ltd. I thank all the staff of electronics and

telecommunication Department who helped me to establish myself at this

position.

I express my sincere gratitude to my guide Mrs. Anita Saraf from

HR department of VIDEOCON Industries Ltd, for her valuable

suggestions making this training a successful one.

I also show my gratitude towards the HR department of Videocon

Industries Ltd, especially Mr.Satyaprakash and Mr.Amit Shinde for

helping me out generously during the training.

Last but not the least, I would sincerely like to thank all the

organizational guides, HODs’ and employs of Videocon Industries Ltd

which directly or indirectly helped me to bring up the training in the

present form.

Saurabh Nandakumar

Index

No. Title

1 Acknowledgement

2 R &D3. ME4. AID5. MI6. FA7. IGQA8. CQA9. OQA10. Diff between CTV, LCD,

LED.11. Conclusion

FLOW CHART CHECKED BEFORE MASS PRODUCTION

Pilot Production

Line Observation , OQC NC closer & Model

Release For MP

END

Research & Development(R&D)In this department all new ideas are invented as

per the market requirement and re-develop the old product if needed.

R&D department is the HEART of the ORGANISATION, because all products are designed and develop by the R&D department.The flow chart of new product is as follows, where working role of all department is describe in brief.

-R&D section designs the new models as proposed by company.-After designing, R&D creates 1 model and does it’s checking in all ways regarding quality and performance.

-After finalizing the design and quality checking, further responsibility is send to ME dept.

ME (Manufacturing Engineering)

-One of the most important departments in ITV, which stands next to R&D, playing a vital role in pre-production process.

-In this section various testing are performed of new product before the mass production. -The TTR is stands for Trail Test and Run. -ME section finds out various testing like picture quality, physical structure, and various other tests.-Physical testing consists of checking of fittings, screws, nuts etc.-TTR-1 consists of production of less than 10 sets manually by ME.-TTR-2 consists of production of less than 50 sets.-Pilot production consists of more than 50 sets but less than 100.-Each stage of TTR checks the quality in deep levels considering working, quality, durability etc.-Pilot production (PP) checks the production process possibility, and problems after and during mass production.-All type of jigs and required modifications in machines in production line are made and manufactured here.-Even signal testing using various instruments like CRO etc. are also done here.

.

Responsibilities of ME: -

• KPI•• √ New Model Status•• √ Bill Of material Release•• √ Engineering Change Note Implementation•• √ RMC Vs. PO•• √ Line Trials•• √ New Jigs & Fixtures•• √ Line/OQC Analysis•• √ Process/Product/Q-Improvement•• √ Cost innovation Summary•• √ Best Practice

PREPARATION OF BILL OF MATERIAL

BOM stands for bill of material It is a starting phase of manufacturing It contains total components, parts, material required in the final

assembly BOM is the guideline for the production process M.E. department makes changes according to the production

process and availability of parts.

BOM contains part code, required per Assembly, Name of Material, Form, specification, Quantity Purchase, Unit Cost, Vendor Code, and Total Cost.

A bill of materials (sometimes bill of material or BOM) is a list of the raw materials, sub-assemblies, intermediate assemblies, sub-components, components, parts and the quantities of each needed to manufacture an end product.

A BOM can define products as they are designed (engineering bill of materials), as they are ordered (sales bill of materials), as they are built (manufacturing bill of materials), or as they are maintained (service bill of materials).

A BOM can be displayed in the following formats:

A single-level BOM that displays the assembly or sub-assembly with only one level of children. Thus it displays the components directly needed to make the assembly or sub-assembly.[5]

An indented BOM that displays the highest-level item closest to the left margin and the components used in that item indented more to the right.

PROCESS PLANNING

M.E. department decides the actual method of assembly of the product.

In which assembly point checkpoints are decided. Preparation of work manual plays important role in process

planning at each stage there is a one work manual is present On which detail information of assembly point and check point is

given, it is also a guide line for worker at that point. Continuous improvement in cycle time is done with the help of

process planning unit. As per the daily schedule of production required work annual are

prepared, work manual consists of the model no, task at that stage, instruction’s for the workers.

Without process planning we can’t achieve the decided target, it is the responsibility of the process planner.

The production process flow chart: -

P.T.O

AID: AUTO INSERTION DEPT.

Significance:All possible ways of insertion of electronic components by machines is undertaken in this department.

These are following machines installed in AID:

1) Sequencer 6 machines2) Jumper Wire 3 machines3) Eyelet & GT Pin insertion 2 machines4) Axial Inserter 3 machines5) Radial inserter Panasonic & TDA6) ICT: - (In Circuit Tester)- 2 machines7) ACM: - (Auto chip Mounting) 1 machine8) SMT: - (Surface mounting Technology) 1 machine

Sequencer machine -This machine creates the sequence of the axial components to be given to other machines. -The machine is programmed with the slot number where different components are present. - In sequential there are 120 slots. Each slot is connected to a stepper motor, where every slot has a constant component sequence, which contains same component throughout the strip. -

Significance - This machine helps creating a new strip of different

components according to our requirement. - After dropping the components into the chain, entire chain

passes through a detector for finding missing components. This sequence of components is very important for proceeding major processes regarding quality and production time.

- PROGRAMMING- The operating system of this machine is MS DOS.The

program for control is written in C.- Initial length of component = 52mm.- After sequencing it is = 42mm.

Jumper Wire Insertion or Mounting-In this section, jumpers are mounted on the PCB by using the conducting wire. Location of the jumper is to be given with the location on PCB with respect to X and Y- axis and length. A small camera and sensor detect the location and size and empty hole and place the jumper. Whole assembly works on principle of image processing and PID (proportional integrative derivative) algorithm. *Axial inserter can also insert jumpers by creating a sequence of jumpers of constant lengths. This is usually done if jumper inserters are faulty or require maintenance

Use of jumpers in circuits

-Usually during design, we encounter jump paths. This can be solved by using jumper wires between the 2 terminals, which have to be shorted according to the design given by R&D. This method is preferred if the chip is single sided and not having many layers of internal connection

- Copper/Aluminum wire is used for connection on PCB.

- We cant cross the path. Hence to cross the path we are using

Jumper wire -Jumper is made up of high conductive & low cost material. Aluminum-Used as jumper wire.Axial inserter: -

- Axial m/c mounts horizontal components on PCB e.g.

Resistances, inductors, Diodes, jumpers.-Sequence of components, which is used for axial m/c

mounting.-Axial m/c is programed as per requirement.

- PROGRAMMING- The operating system of this machine is MS DOS. The

program for control is written in C.About 250 axial components are inserter in each PCB.

Radial m/c: --Radial m/c mount vertical component on PCB E.g.-Capacitor, Transistor.

a] Panasonic m/c: -As per requirement sequencer is not used.More than 50 slots (62) are available.

b] TDK Radial: -- Components are arranged in sequence(not stuck in strip like axial) and then mounted on PCB.About 90 slots are available.

Separate radial component sequencer isn’t used due to variable sizes of radial components especially capacitors.

Eye let & GT connectors insertion:’ It is used for fixing eyelets. It is also used to connect the jet pin. These pins are used as terminals for high voltage nodes

where copper track is usually burned due to high current causing high terminal temperature.

ICT: - (In Circuit Testing): - It is the final stage of AID.

Reference jigs are used for respective PCBs & PCB is directly placed on it.

-If any error like missing components, glitch etc. Are defected with location & code.

- Test passed PCBs’ are send to MI.- PCBS’ with problem is sent for

debugging.

ACM (Auto chips mounting): -

- It is used for mounting the chips.- First glue is applied at a place, where IC is to be mounted.- Sensor is used while chip is being.-Micron chips i.e. on surface chip mounting is done here for

CTV PCBs’.Machine is manufactured by SAMSUNG (South Korea)

Surface Mount Technology (SMT) A way of attaching electronic components to a printed

circuit board

The solder joint forms the mechanical and electricalConnection.

Bonding of the solder joint is to the surface of a conductive land pattern

Connection does not use through holes or terminals.

SMD stands for Surface Mount Device. These are electronic components with no leads like through-hole components.

These devices have tiny metallic legs very close to the surface of the components.

These metallic legs are soldered on the copper tracing on the PCB using solder paste.

CHIPs: Chips have been given a four-digit number code, which indicates their approximate size in hundredths of an inch.

The main feature of chips is their tendency to get smaller and smaller.

BGA or Ball Grid Array is also a kind of SMD with no leads or legs at all.

These special electronic components have tiny metallic spots underneath the components. They are soldered on the PCB using solder balls.

QFP Quad flat pack: a plastic body containing an IC, with gull-wing legs on all four sides

MI (Manual Insertion) Department

In Manual Insertion line the component having large size or which may not placed by machines in AID is to be placed.

Sockets, fly back transformer, power transistors, heat sinks. Etc. are placed on PCB.

Parts inserted in MI LINE: FBT USB port High voltage capacitor Horizontal capacitor Fuse Pin header Memory IC Thermistor Power transistor Heat sinks VGA, RGB connectors etc.

The final circuit is passed through an oven where firstly PCB’s base is passed through molten flux so that all copper terminals are free from impurity and rest plastic remains sticky.

-After that the base of the circuit is passed through molten solder material, which keeps flowing.

Soldering

After inserting all component PCB is sent to the oven where the track side is cleaned by using liquid hot flux and pass to the soldering point where the liquid boiling solder is pest on free copper point.

-Thus the copper point gets soldered and remaining part of the board is solder free.

-A double circuit tester is used to check the PCBs’ 2 at a time because there are 2 lines connected to it.

-The next step is to check the working of audio and video output of the PCBs’ by connecting it to free panels and DVD players. As there is no impedance matching between PCB and the panel, image and sound does not have good quality always, but it allowed passing along the line termed as a good piece.

-If the circuit isn’t working it is passed to expert debuggers for re working on it.

-After all of this an anti-oxidant coating is sprayed on the back of PCBs’ and it is then send to Final assembly line. *Same is the process for and LCD/LED PCB manufacturing.

Reflow soldering

With reflow soldering the possible sequences are:

1. A mixture of solder and flux (solder paste) is applied to every joint beforeassembly.

2. Heat is applied by radiation, convection or conduction.Or

3. Solder is preplaced in solid form on one of the surfaces of every joint.

4. Flux is applied to the preplaced solder.

5. Heat is applied by radiation, convection or conduction.

FINAL ASSEMBLY/LCD ASSEMBLY LINE

Checking of -Front cover for scratches, paint problems etc.-Speaker grill hole to open - Printings (name of company)- Rear edges for proper painting

Paste clear (pass) tape on all corners of cover.

Fix switches (keys). Block holes with proper polymer. Fix speakers with screw. *Both speakers have different colored wired

for differentiation.

Panel with cover assembly:- Earthing wire (spring) connection. Connection of ties to avoid jumbling. Connection of degaussing coil. Mounting the whole set with screws. Charge removal. PCB loading Power cap, yoke connector, audio,

video, CRT fixing. Vif-Vco alignment. Screen and focus adjustment.

Removing colour patches by applying magnetic fields in vertical and horizontal directions.

White balance.Samsung patented technology.Used to set the white and colour balance lock.-Low light and high light colours of RGB

Chassis and back cover fitting. HV testing by giving 3kV for 1 sec and 7A

current. Sound testing, hammering is used to find

any loose contact. Seal, serial no. Pasting Final packaging and dispatch.

LCD line assembly:Almost the same steps like CRT assembly.Only an extra height temperature testing room (SLT-Short life testing) is included where assembled TV is passed through 50 Deg C for 15 mins. The line is 90 m long.

IGQA (Inward Good Quality Assurance)

IGQA/IQA is the department in which quality of raw material is tested. - As per the requirement of product. - Vender provides raw material.

Purpose: - - To check the quality of raw material using sampling plan with various testing.

- Sampling plan used - IS2500/2000.- General inspection level - GIII.

Process: - There are three sampling plans, we are using in IQA.

- S1/4.0: - Used for checking Electrical & Mechanical parameters. - S2/2.5: - Solder ability & fitment.- G III: - For visual inspection.

Sampling plan gives us idea about how many samples to be checked from a given lot of size.

For e.g.:-In the lot size of 9-15 for S1/4.0, we can pick 5 samples for G III /0.15 can pick 5 samples.

Actual Testing for IGQA: - 1] Loud Speaker Test: - a) Visual Observation: - Marking condition. b) Electrical Parameter Test: - Polarity. - DC resistance (R=7.4K, 10% tolerance) - Power ratings. c) Sweep Test: - Input to speaker is 20-22KHz. - Speaker output is checked.

2] Solder ability Test: -To check if soldering does not cause any design problems, like for e.g. heat sink usually causes shorts in paths. 3] L-C-R Test: -

- Resistor, Capacitor & Inductor is tested. - Q Factor.

4] Curve Tracer: - - Checking of Transistors & Diodes.

5] Remote Tester: - 12m at 90 degree. 8m at 30 degree.

6] Tuner Testing

7] Inspection of FBT (Fly back Transformer)

CQA: - (Central Quality Assurance):-Def.: - It is the department where the initially quality of the product is checked set wise.

Purpose: - Purpose of the CQA is doing following main tests. These test are undertaken to check reliability of the product & working of the product as per the specification.1] Packing2] Aesthetics3] Receiving4] Workmanship5] Parametric6] Reliability

Process: -1] Design from R&D with specification & along with 5 sets & product specification, audio report, parametric report, marketing applications.2] If there is any fault, raise NCR.3] If no faults, then Design Release issue.4] Checking of 5 sets for TTR1 from ME.5] If any fault, raise NCR.6] If no faults, TTR 1 release issue.7] 20 set for TTR2 from ME.8] If any fault, raise NCR.9] If no faults, TTR2 release report.

A] Tests: -1] Mechanical tests:

a] Drop Test: -According to wt. of set dropping height is decided.

- Set is dropped on all edges, faces & corners, to check the Strength of TV set.

b] Vibration Test:

-Vibration Machine is used to create vibrations. -TV set is placed on vibration plane to check

sustainability. -Time duration = 1->2 hrs. c] Bump Test:

-Sudden shocks are artificially applied to TV, to check whether TV can sustain while transportation or Not.

2] Electrical Tests: a] Stability Test: -Set is continuously ON-OFF at 88 V supply with 5 min.

time period. b] Fluctuation Test: -TV is operated on variable voltage fluctuation so as to

meet Home uses, with other appliances. c] Inverter Test: -Set is ON for 1 hr. with inverter supply. -Switching between mains & inverter supply checked

for 5min. 3] Environmental Tests:

a] Dry Heat Test: -Keep the sets in 45->55 * C for X hours.

(X is depend on from where sets are coming) TTR1: X= 48 Hrs.

TTR2: X= 24 Hrs. New Chassis: X= 12 Hrs.

b] Cold Test: -Set is tested at 10*C for 24 hrs. c] Humidity Test: -Set is tested at 45*C & 95% humidity for 24 hrs.

4] Live Test: -Set is ON for 48 hrs.

5] Software Test: -All parameters on various patterns are checked.

6] Hardware Test:-All hardware components are checked.

B] SRT (Signal Ranging Technique):-All problems are detected about TV set & major/bulky problems are solved initially.

-*OQA is a smaller version of CQA which has lesser no of tests done, but done on randomly picked pieces from mass production to check problems on outgoing pieces unlike the pp pieces in CQA.

Difference between LCD and CTV

Sr No.

PARAMETER CTV LCD LED

1. Power Consumption High Moderate Low2. Mercury Used Used Not Used3. Display Technology Cathode Ray Tube Liquid Crystal

DisplayLight Emitting Display (Diodes)

4. Size Big Compact More Compact5. Chassis Components Bulky Chip component Chip

component6. Cost Less Moderate High7. Chassis Capacity Only processes AC

Signal, Peripherals are required for DC processing

Both AC & DC are processes

Both AC & DC are processes

8. FBT Used Not Used Not Used9. CPT Types -Conventional

-Slim-Ultra slim-Flat-Pin Free

-HD-Full HD

-HD-Full HD

10. Panel Provider JCTSamtel

AUOLGSamsung

AUOLGSamsung