nessi*: activities update cpac - seattle, wa - may 5, 2003 nessi end-users group “the best way to...
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NeSSI*: Activities Update
CPAC - Seattle, WA - May 5, 2003
NeSSI End-Users Group
CPC
“the best way to predict the future is to create it”
*New Sampling/Sensor Initiative
Agenda
• NeSSI Activities Update– Focus Group - 15
• NeSSI II Commercialization - 10– John Mosher
• DoE Update - 10– Ulrich Bonne
• Open Device Vendor Association and Intrinsically Safe Special Interest Group (ODVA + IS + SIG)– Rick Ales – 20 to 30
• Rest of the Week - 5
“Everyone needs a vision of success…”
NeSSI Vision of Success
• We are able to…– Design...
– Assemble...
– Configure...
...an analytical system on our workbench.
• Lego Like Assembly– No special skills to assemble
– plug and play/self-documenting
• Fully Automated
Time (years)
03 04
NeSSI Roadmap
02
Mechanical Component Availability e.g. filters, valves, etc.
Mechanical Field Installations
ANSI/ISA SP76 Standard Approved
NeSSI/CPAC Vision & Roadmap
2000
Design /Prototype - Gen II Smart/Heating/SAM
Smart Field Installations
MechanicalGen. I
Smart/”Electrified”Gen. II
Analytical & WirelessGen. III
01 0605
Dow Rev. 2, July 2002
uAnalytical Field Installations
Simple Analyzers (H2O, O2, pH, UV/VIS, etc.)
NeSSI Generation Segmentation
Gen III
Gen II
Gen IMechanical Components (mostly)
Electrical Transducers/IS CANbus
Wireless, Advanced Gas & Liq. Sensors
& Platform for microAnalytical Value
Source: PAI Report 7
1999 Projected Useage of Process Analyzers
Petroleaum
ChemicalsPlastics
Electric & Gas Utilities
Other: Food, Pharma, etc.
Industry Segmentation & Market
- Worldwide, it is almost a $5-6 B/yr enterprise.
- Approx. $2.5B/yr is spend on care and maintenance of an installed base valued at $20-25B.
Programmable Substrate Heater
NeSSI “Sandwich” concept
Ethernet LAN
Analyzer
ControllerV
A
P F
SAM
CANbus
PDA
Auxiliary Heating/Cooling
SubstrateT
T
Standard Sampling Interface
dcs
o&muser
Standard Connectivity
Interface
DevelopmentFocus can beon Sensors !
Recent Presentations
• IFPAC 2003
• ISA Analytical Division (Calgary)– Bac Vu (Dow) submitted a paper – Jim Tatera (Tatera & Assoc.) brief update
IFPAC 2003: Wed PM-II Session
"NeSSI: A Sampling Platform for
Micro Physical and
Micro Analytical Sensors"
Session Chair: Peter van Vuuren
ExxonMobil Chemical Company
Engineering
Baytown, Texas
January 22, 2003Scottsdale, AZ
1:101:10 NeSSI: The Good, the Bad and the Ugly -Early Implementations and DirectionsRob Dubois - Dow Chemical Canada Inc., Fort Rob Dubois - Dow Chemical Canada Inc., Fort Saskatchewan, AB, Canada;Saskatchewan, AB, Canada;John Cumbus, ExxonMobil ChemicalJohn Cumbus, ExxonMobil Chemical
1:351:35 NeSSI Generation I - A Solid Foundation Douglas A. Nordstrom, David M. Simko, John J. Douglas A. Nordstrom, David M. Simko, John J.
Wawrowski, Wawrowski, Swagelok Co., Solon, OhioSwagelok Co., Solon, Ohio
2:002:00 Between SAM and the Substrate - A Smart Valve for NeSSI
Richard A. Ales, David M. Simko, Swagelok Co., OhioRichard A. Ales, David M. Simko, Swagelok Co., Ohio
2:252:25Networked Sampling System (NeSSI-Generation II) Developmentand Field Test
J.Mosher, R.Nickels and U.Bonne, Honeywell J.Mosher, R.Nickels and U.Bonne, Honeywell International - ACSInternational - ACS
2:50 - 4:00 :2:50 - 4:00 : Break - Allow attendees to participate in the
Grand Opening of the Exhibition
IFPAC 2003 January 22, 2003Scottsdale, AZ
AGENDAAGENDA"NeSSI: A Sampling Platform for Micro Physical and Micro
Analytical Sensors”Announcement: NeSSI Special Session
4:004:00 Microelectromechanical Systems for Process Analytics Berthold Andres, ABB Automation Products, GermanyBerthold Andres, ABB Automation Products, Germany
4: 254: 25 PHASED, a Faster, Smarter and More Affordable GasAnalysis Device - Update U.Bonne, J.Detry, R.Higashi, K.Newstrom-Peitso, H.Pham, T.Rezacheck U.Bonne, J.Detry, R.Higashi, K.Newstrom-Peitso, H.Pham, T.Rezacheck and S.Swanson Honeywell Labs, Plymouth, MNand S.Swanson Honeywell Labs, Plymouth, MN
4:504:50 Low Water levels in various solvents: on-line monitoring bya Miniature MIR Spectrometer Joseph P Sung and Jim Tatum, Rohm & Haas, Houston, TX, Yael Joseph P Sung and Jim Tatum, Rohm & Haas, Houston, TX, Yael
Barshad and Yoav Barshad, Applied Analytics, Inc., Chestnut Hill, MABarshad and Yoav Barshad, Applied Analytics, Inc., Chestnut Hill, MA
5:155:15 Computational Fluid Dynamic(CFD) Analysis of Gas and Liquid Flow Through a Modular Sample System Tanios Y. Bougebrayel, John J. Wawrowski, Swagelok Co., Solon, OhioTanios Y. Bougebrayel, John J. Wawrowski, Swagelok Co., Solon, Ohio
5:405:40 Surface Mount Technology Update - 2003 Steve Doe, Parker Hannifin Corp., Jacksonville, ALSteve Doe, Parker Hannifin Corp., Jacksonville, AL
6:056:05 AdjournAdjourn
IFPAC 2003 January 22, 2003Scottsdale, AZ
AGENDA (cnt’d)AGENDA (cnt’d)"NeSSI: A Sampling Platform for Micro Physical and Micro
Analytical Sensors”
Some Activities
• Modular Substrate Orientation– 4 systems being evaluated– Substrate Attribute List Generated
• Surface Mount Component Evaluation/Gap– (Plan is to identify and secure missing comp.)
• The NeSSI-box
• Gen III activities in Europe
Substrate Attributes (Gen I)Spec, Function, Cost, Design
• Config. Flexibility
• Parts count
• Unit price
• Materials of const.
• Weight
• Heating capability
• Configurator tool
• Integration capability
• Passivation
• Internet ordering
• Size constraints
• P, T specifications
• ANSI/ISA SP76
• Orientation
• Backplate mounting
• Assembly tools
• Flow path marking
• Tagging/traceability
• Supplier attributes
Surface Mount Component Evaluation (Gen I)
• List of surface mount components tabulated
• Gaps identified & plan to fill
• Experimental test plan developed– Certain lab tests required– NeSSI-box platform for field tests
• Dow has a platform to evaluate components
SP76 Component Wish List (Gen I)
• Permeation drier• Swirling filter• Cartridge filter• Membrane Filter• Atmospheric Ref.• Double Block & Bleed• Aspirator & Pump• Pump (D1&2)• Gauge
• On-substrate cal– function of T, F
• Mass flow (D1&2)• Coriollis flow (D1&2)• Sample Loop valve• 3-way valve
– purge & switch
• Chiller (vortex)• Rotameter
Gen II Specification
• Copyright transfer of the spec from ExxonMobil and Dow to CPAC
• Draft Revision “6” will be mounted on the CPAC/NeSSI web site (by June 1)
• Evergreen vehicle to collect specs for SAM, microClimate enclosure, sensor transducers, valve transducers, applets for SAM
• Eventually segue into Gen III
Programmable Substrate Heater
Honeywell POCA Project- Dow, EMCC
VP
A
F
Ethernet LAN
Analyzer
Controller
SAM
CANbus
PDA
Auxiliary Heating/Cooling
SubstrateT
T
dcs
o&muser
POCA*1 (complete)First interpretation of NeSSI Gen II (alpha)
• Technical Hi-Lites & Possibilities– First “binary” Mini-Sensors (P/T; F/T)– Introducing Absolute Pressure Transmitter
• GC sample loop compensation, BP control
– First “combi-valves” (Enabler for PID control)– Enclosure and Substrate Heater– Early SAM hardware & SAM software– First IS CANbus communication
* On display
Introducing POCA2
• An extension of POCA1 (still alpha)• Collect the weaknesses of POCA1 - correct
• Add the remaining Gen II features
• Minisensors– Miniaturize, make more robust, lower power
• Industrial X-proof SAM, add heat control
• Add PDA, node count
Gen II Commercialization and POCA
• John Mosher
DOE
• Submitted April 16 by Honeywell/U. Bonne on behalf of a user/supplier team assembled at CPAC
• If contract is awarded this will infuse considerable capital into the purchase of modular, miniature systems
• An omnibus “design” has been generated• Covers NeSSI Gen II/III products• Ulrich Bonne
Who in the *#! is ODVA??
• ODVA = Open Devicenet Vendors Assoc.
• A means to provide an “open” platform for connecting transducers– analagous to SP76 on the mechanical side
• It is hugely important to get this Intrinsically Safe (IS) SIG to provide entry to 3rd party entries
Focus and topics this week
• Plan for ODVA for DeviceNet IS SIG (AM)– Rick Ales Swagelok
• SAM hardware and software (this PM)– John Mosher Honeywell
Focus and topics this week
• NeSSI Focus Groups – combiValve
• <2 mA/unit
• Vm = modulating & Vo = on/off
– X-proof substrate heating techniques– intrinsic safety issues– surface mount (GenI) component list– generation III analytical product wish list– Gen II specification feedback