nessi*: the good, the bad and the ugly - early implementations and directions ifpac scottsdale, az,...
Post on 21-Dec-2015
223 views
TRANSCRIPT
NeSSI*: The Good, The Bad and the Ugly - Early Implementations and Directions
IFPACScottsdale, AZ, USA - January 22, 2003
John Cumbus Rob Dubois
CPC
“the best way to predict the future is to create it”
*New Sampling/Sensor Initiative
“And let it be noted that there is no more delicate matter to take in hand,
nor more dangerous to conduct, nor more doubtful in its success, than to set up
as the leader in the introduction of changes. For he who innovates will have for
his enemies all those who are well off under the existing order of things, and only
lukewarm supporters in those who might be better off under the new.'’
Niccolò Machiavelli (from The Prince pub. 1515)
Presentation Outline
• Recap of NeSSI Structure, Objectives & History• NeSSI Gen I, II, III Overview• Some “sacred cows”• The good, the bad, the ugly• Implementations and Directions
– POCA Projects– DoE Project
• Acknowledgements• Summary
NeSSI Structure & History
• An ad hoc global industry initiative, formed in June, 2000 to drive permanent change in the way we do Process Analytical.– NeSSI mail-out has now grown to 330+ subscribers
• Represents over 33 End Users from Oil and Petrochemical as wells as Manufacturing Companies, Academia, National Labs
• An “Open” Initiative sponsored by CPAC (Center for Process Analytical Chemistry)
• End User driven
NeSSI Objectives
• Facilitate the acceptance/implementation of...
– modular, miniature & smart process analytical technology
• Promote the concept of...
– at the pipe/field-mounted (“by-line”) analytical
• Lay the groundwork for...
– open connectivity communication architecture
• Provide a technology bridge to the process for...
– “sensor/lab-on-a-chip” microanalytical devices
NeSSI: The Vision of Success
• Reduce Engineering Time– “configurator tool”
– self-documenting
• Reduce Assembly Time– Lego Like Assembly
• Lower Maintenance Costs– diagnostics
Vision Element: To design, assemble and configure an analytical system on one’s kitchen table.
Courtesy of J. Warnowski/D. Mitchell. Swagelok/Panametrics
Courtesy of U. Bonne. Honeywell.
NeSSI Generation Segmentation
Gen III
Gen II
Gen IMechanical Components (mostly)
Electrical Transducers/IS Network
Wireless, Advanced Gas & Liq. Sensors
& Platform for microAnalytical Value
NeSSI Generation IMechanical: Miniature and
Modular• Adapted from SEMI• ANSI/ISA SP76
approved “Standard” Form Factor
• Allows Lego®-like construction
• Several SP76 substrate compliant vendors exist
Courtesy of Swagelok
NeSSI Gen. IINetworked/I.S./ miniTransducers/Wireless PDA
Programmable Substrate Heater
VP
A
F
Ethernet LAN
Analyzer
Controller or PC
SAM
CANbus
PDA
Auxiliary Heating/Cooling
SubstrateT
T
NeSSI Gen III - an enabling platform for Analytical
SAM
Fiber OpticAT
One sensor measures multiple components
Ethernet LANEnabling Technology
for Analytical
VTA
A
One sensormeasures one
componentuanlaytical
Sacred Cows........ or Opportunities?
• Size of sample passages restrictive to flow• Sample System should be located under the GC• Double block and bleed valves are needed for
stream switching• Modular assembly prone to leaks from number
of connections• Components do not meet area electrical
classification• insufficient flow to purge for stream switching • Flow path difficult to follow without tubing
The Good
• Reduction in detailed engineering effort • Ease of Construction• Saves space, allows options for location• Simple design• Competitive costs • Remote monitoring possible• Alarm on failure• Number of manufacturers increasing
The Bad
• Harder for technicians to intuitively understand / follow
• Need more components, broader ranges
• O-rings/seals in vertical configuration
• Low flow monitors / controllers
The Ugly(Softer Issues)
• Who constructs the system
• Packaging for ease of maintenance interface
• Interconnection (power, signal, control) with analyzer
• SAM interface?
• Technician education / acceptance
• Re-evaluation of maintenance effort
Field Installations
Substrate Selection
What do we like?
• 4-screw approach• o-ring grooves (gripper)• no torque requirements• flow pattern inscribed• P/N & function visible on
parts
What we don’t like!
• metal seals• tight space • what component is it?• any special tools required• inconsistencies with other
substrates
Shopping List of Downmount Components
• Pressure regulator• Flow measurement devices• Flow control devices• Quick change filters• Any temp/pressure/flow transmitters
with liquid crystal display
Activities and Directions
• Since IFPAC, 2002– May, 2002. DoE supplier/user team formed & White
Paper developed by U. Bonne/Honeywell Labs
– June, 2002. White Paper Submitted to DoE
– June, 2002. Honeywell demonstrates first IS CANbus
– July, 2002. POCA* Project conceived
– August, 2002. ISA SP76 footprint approved by ANSI
– 12 Installations in Dow & ExxonMobil Facilities
– November, 2002. POCA prototypes ordered.
*POCA = NeSSI Gen II Proof of Concept Apparatus Project
Introducing the POCA Project(s)
• Purpose: Accelerate NeSSI Gen II dev.• Seeded by Dow Chemical, ExxonMobil Chemical,
Air Products• Honeywell is the major supplier/integrator
– B. Nickels/J. Mosher (commercialization & networking)– U. Bonne (sensor R&D)
• Impact to Industry• first SP76 diagnostic physical minisensors (p, T, F)• first SP76 miniactuators (Vo, Vm)• first intrinsically safe, low cost, network IN PROGRESS
Introducing Potential DoE Project
• Purpose– Field test NeSSI Gen II– Develop/source missing components– Certification of electrical products
• ~ $2MM funding (50% “work in kind”)
• 2 year duration (1 year lab/1 year field test)
The DoE User/Supplier Team (More folks welcome!!)
• User Team– Peter van Vuuren (ExxonMobil)
– Rob Dubois (Dow Chemical)
– Joe Andrisani (DuPont)
– Steve Wright (Eastman)
– Bob Reed (Merck)
– Paul Vahey (Honeywell-SM)
– D. Young/D. Nettles (ChevronTexaco)
– Frank Scweighardt (Air Products)
– George Vickers (BP)
– Paul Barnard (EquistarChemicals)
– Steve Doherty (Pharmacia)
– Bob Maglagenta (Kraft)
– Alan Eastman (ConocoPhillips)
– UOP
• Supplier Team– Ulrich Bonne (Honeywell Labs)*
– Bob Nickels (Honeywell ACS)
– Dave Simko (Swagelok)
– Steve Doe (Parker-Hannifin)
• CPAC– Mel Koch
* Supplier Team Lead PI
DoE Project Deliverables
1. Heated/Temperature Programmed Substrate
2. mini-Sensor Transducers (p, T, F)
3. “Combi” Actuator Transducers (Vo, Vm) (on/off & modulating transducers)
4. SAM - Sensor/Actuator Manager 5. Multi-Drop Digital Intrinsically Safe Bus
6. Micro Climate Enclosure
* HMI = Human Machine Interface
Certified CSA, FM, CENELEC
Acknowledgements
• Dow Chemical
– R. Hartwig/D. Quevillon
– Craig Snook
– B. Vu /P. Williams/J.Leach
– R. O’Reilly
– W. Henslee
• Air Products
– Frank Schweighardt
• Eastman Chemical
– Steve Jacobs
• Tatera & Associates– Jim Tatera
• ExxonMobil Chemical– Dan Podkulski– Jeff Gunnell– Peter van Vuuren– Rajko Puzic– Kelley Bell
• Honeywell– John Mosher– Bob Nickels– Ulrich Bonne
• CPAC– Mel Koch– Dave Veltkamp
Summary...
• Gen I products moving into the field
• Strengths and Weaknesses Reviewed– Strengths to build on…weaknesses to overcome
• Gen II - High Level of Activity – Proof of Concept (POCA) in progress– DoE Potential Project
• Gen III Products in Sight