new sala expo plaza 3 mattino new cinterion m2 m forum 2009

© Cinterion Wireless Modules GmbH 2008, All rights reserved

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Cinterion Wireless Modules:stabilità e continuità

Cinterion Wireless Modules March-2009

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Third-Party Projections of Industry Growth(1) – Gartner Research(2)

602

730

890

1.095

0

200

400

600

800

1000

1200

2006A 2007E 2008E 2009E

0

5

10

15

20

25

30

35

40

Revenue UnitsEUR MM

MM Units

0

500

1.000

1.500

2.000

2.500

2005 2006 2007 2008 2009 2010

+30% p.a.

Wireless Machine-to-Machine (M2M) Global Modules Market

0

200

400

600

800

1 000

1 200

1 400

Stand 2005 Aggresive moderate

Stand 2005 510 490 510 570 660 770 990

Aggresive 510 490 510 600 700 830 1000 1200

moderate 510 490 510 570 650 750 880 1000

2004 2005 2006 2007 2008 2009 2010 2011

Cinterion Wireless Modules March-2009

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Wireless Modules Italian Market

Number of modules sold 805.000

2008*

Source: politecnico di Milano

The scenario in Italy

* Forecast for 2008: overall market shrinkage due to the fall of the main vertical industries leading M2M in Italy

2009

?

Cinterion Wireless Modules March 2009

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Cinterion Wireless Modules Launch on June 1st 2008

Launch

Profile

Success Factors

Summary

Intelligent M2M Communication

The highly successful team which made

SIEMENS Wireless Modules

#1 in the world market will continue to innovate the M2M market

as CINTERION Wireless Modules

Cinterion WM: stabilità e continuità


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Cinterion Wireless Modules Why ???

Communication not any more in focus of Siemens

To gain more speed and flexibility

Organization of a global mid-market company

Less overhead

Launch

Profile

Success Factors

Summary



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Cinterion Wireless Modules ProfileFinancial Strength

Launch

Profile

Success Factors

Summary

D&B rating proofs that Cinterion Wireless Modules is a reliable and stable business partner Cinterion Wireless Modules has a score of 95 out of 100

D&B Credit Recommondation: EUR 15.000.000,-Extract of the D&B Analysis:

Report issued June 27th 2008



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Unique Global Footprint with Global Reach and Local SupportGlobal Network of 425 Employees

MEA

South Africa Israel

Americas

USA Canada Brazil

Europe

Present in 11 countries

Asia

China India Japan Korea Singapore Taiwan AustraliaManufacturing

Contract manufacturer in Leipzig (GER) and Curitiba (BRA)

Headquarter

Munich (GER)

Technology Center

Berlin (GER) Wroclaw (POL)



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First Class Production at Contract Manufacturer

Quality manufacturing plants support Cinterion’s positioning

Output of over 7 mio units per year

Long-term supply guarantee

Fully Automotive TS16949 certified (Leipzig) or in progress (Curitiba)

Leipzig Facility (Germany) Curitiba Facility (Brazil)



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Cinterion Wireless Modules ProfileMarket Position

Cinterion Wireless Modules is the #1

With a 33% market share* Cinterion is the global leader in M2M modules.

Launch

Profile

Success Factors

Summary

* Source: Gartner M2M Market Overview 06/2008

Competitor 1

27%

Cinterion33%

Competitor 2

11%

Competitor 5

5%

Competitor 3

7%

Other14%

Competitor 4

3%



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Cinterion Wireless Modules Success FactorsQuality Management

Quality Management

Certified according to ISO9001:2000 and ISO/TS16949:2002

Lowest DoA and field returns rates

Advanced Product Quality Planning (APQP) within product development right from the start

Integrated Suppliers Quality Management with implemented Production Part Approval Plan (PPAP)

Full automated manufacturing with high process capability and 100% traceability

Productive Quality Gate Culture including accelerated lifecycle testing and high product reliability

Launch

Profile

Success Factors

Summary



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Cinterion offers the most comprehensive Support

Certification

Hardware

SMS-API TAPI

RIL

Radio stack

RIL-DRV

...

SMS-App. Dialer DialUp...

TCP/

IP

Stack

SMS-API TAPI

RIL

Radio stack

RIL-DRV

...

SMS-App. Dialer DialUp...

TCP/

IP

Stack

Software Training

StandardSupport Products

Predefined / fixed Support Products (SSP 1/SSP/ …)

New: Java Support Product

„Take it as it is“ (no modifications)

Customized Support Products

CPP worked out by RAE / TS Customized support

Launch

Profile

Success Factors

Summary

Regional based highly trained and experienced Cinterion engineers

support customers in all phases of the integration process.



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Substantial Investment in New Products

Future Proof Portfolio

Cinterion‘s annual R&D budget is larger than many competitors revenue.

13% of revenue spent for R&D.

More than 60% of R&D budget will be invested in new products and innovation.

15% of R&D budget will be spent on dedicated automotive products.



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Broad range of features that can be equaled by no other!

Temperature Management Optimal Thermal Design

RLS Monitoring(Jamming Detection)

High Speed Serial Interfaces921.6 kbps

Windows Mobile™Support

Lowest Power Consumption

Class 12 EDGEClass 12 GPRS

Embedded ProcessingJAVA™

Industrial Interfaces

Flexible MountingBoard 2 Board ConnectorIndustry Grade Soldering

ARM 9 NGModern Platform

Small Size

Save of investment through evolution path

Evolution Platform



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High investments in Pre-Development

Cinterion investigated different technologies to find the best solution (in total 18 variants 720 test objects)

Based on extensive investigations of different SMD technologies We decided to go with the best: LGA!

Castellation

Land Grid Array I

Land Grid Array II

Ball Grid Array-BGA

Bigger pads = better joints ?

Pads: 3x1.8 / 4x1.8 mm Stencil height:120 – 250µm

Typical design of competition

Module Pad: Ǿ 1.2 mmPCB Pad:Ǿ 1.4 mmStencil height:120 – 250µm

Small Pads – more signals

Module Pad: Ǿ 1.2 mmPCB Pad:Ǿ 1.4 mmStencil height:120 – 250µm

Visual inspection of surrounding solderings

Pads: 3x1.8 / 4x1.8 mm Stencil height:120 – 250µm



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LGA is the best suited SMD technology!

Yield Electrical Test electrical test after

200 h TCT

Remarks

Stencil thickness 120 µm 180 µm 250 µm

Castellation 4 x 1.6 75 % 97 % 100 % OK Stencil height of 250 µm not suitable due to components with small size (0201) Rework required Due to the surrounding single line pads ►results in a large module

Castellation 4 x 1.8 87 % 97 % 100 % OK

LGA I 4 x 1.6 90 % 100 % 100 % OK

LGA I 4 x 1.8 100 % 100 % 100 % OK

LGA II 19 % 53 % 70 % OK not suitable

BGA 83 % 93 % 97 % OK Passivation of the balls due to residues of flux ► very critical during storing



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Optimized foot print design to minimize warpage effects

NiAu-surface to eliminate passivation problems during storing and soldering

Optimized ground performance concerning excellent RF ground low thermal resistance low connection resistance

Minimized size of the module possible

50 Ohm optimized RF pad

Reasons for designing the final LGA module

No pads at corners and in the middle for minimizing of warpage effects connections would be critical here



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Tape and reel for best performance in production!

„Tape & Reel“ packaging with 300 modules per reel



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Scalability via technologies: From EDGE, Java to GPRS

EDGE module

JAVA module

GPRS Advanced module

GPRS Standard module


Cinterion Wireless ModulesPage 20 March 2009

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Summary

….and protect our customer‘s investments by providing flexibility through simple migration paths

Our Portfolio covers already all M2M requirements and we intensively continue to innovate our portfolio…..

….with focus on relevant aspects of new technology trends

Cinterion WM:stabilità e continuità

new sala expo plaza 3 mattino new cinterion m2 m forum 2009

Technology

cinterion wireless moduleswhy

m2m modules

madesiemens wireless

wireless machine

market share

world market

gartner m2m market overview

global midmarket company